US20100065875A1 - Optical lens and light emitting device using the same - Google Patents
Optical lens and light emitting device using the same Download PDFInfo
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- US20100065875A1 US20100065875A1 US12/620,606 US62060609A US2010065875A1 US 20100065875 A1 US20100065875 A1 US 20100065875A1 US 62060609 A US62060609 A US 62060609A US 2010065875 A1 US2010065875 A1 US 2010065875A1
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- Prior art keywords
- refractive
- optical lens
- emitting device
- light
- light emitting
- Prior art date
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- 230000003287 optical effect Effects 0.000 title claims abstract description 75
- 239000004065 semiconductor Substances 0.000 claims abstract description 34
- 230000002093 peripheral effect Effects 0.000 claims abstract description 10
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 4
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 4
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 3
- 239000004713 Cyclic olefin copolymer Substances 0.000 claims description 3
- 239000004697 Polyetherimide Substances 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 229920001601 polyetherimide Polymers 0.000 claims description 3
- 229920002313 fluoropolymer Polymers 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 239000012780 transparent material Substances 0.000 claims description 2
- 238000009826 distribution Methods 0.000 description 3
- 238000005266 casting Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007516 diamond turning Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/02—Simple or compound lenses with non-spherical faces
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/0091—Reflectors for light sources using total internal reflection
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Definitions
- the disclosure generally relates to optical lenses for light emitting devices and, particularly, to an optical lens typically used for a side emitting light-emitting diode (LED).
- LED light-emitting diode
- LEDs are widely applied in electronic display devices and illuminating devices, offering advantages of high illumination efficiency and a long lifetime.
- An LED generally includes a semiconductor chip emitting light. LEDs can be classified, according to the location of the semiconductor chip therein, as bottom emitting LEDs and side emitting LEDs.
- a semiconductor chip 11 is disposed below a display screen 12 .
- the semiconductor chip 11 is configured for emitting multiple colors of light, such as red, green, and blue (RGB).
- RGB red, green, and blue
- a distance D 1 between the semiconductor chip 11 and the display screen 12 must be sufficient to provide a predetermined threshold angle from which the RGB light is emitted from the semiconductor chip 11 .
- the emitted RGB light can thus be adequately mixed to yield white light illuminating the display screen 12 .
- the distance D 1 is apt to increase a thickness of the bottom emitting LED, thereby increasing the overall size of the device.
- a display screen 22 is stacked on a light guide plate 24 , and a semiconductor chip 21 is disposed on at one side of the combined display screen 22 and light guide plate 24 .
- Light emitted from the semiconductor chip 21 travels along light paths including light paths 23 (only one of many is shown).
- the light paths 23 are located within the light guide plate 24 , so that the light can be reflected continuously until exiting a top of the light guide plate 24 and illuminating the display screen 22 .
- the side emitting LED provides improved uniformity of light illuminating the display screen 22 . However, light energy can be lost with each reflection, thus the side emitting LED is limited in light utilization efficiency. In addition, in the case of a large display screen 22 , some areas of the display screen 22 may not be sufficiently illuminated.
- FIG. 3 shows an optical lens 31 in another bottom emitting LED.
- the optical lens 31 is configured to improve the efficiency of light utilization.
- the optical lens 31 includes a base portion 32 , a top reflecting surface 34 , a peripheral first refracting surface 36 obliquely angled with respect to a central axis 35 of the optical lens 31 , and a peripheral, curved second refracting surface 38 extending from a bottom of the base portion 32 to the first refracting surface 36 .
- the base portion 32 defines a bottom cavity (not labeled) therein.
- a bottom surface of the base portion 32 is shaped like a flat-topped dome.
- a semiconductor chip (not shown) can be disposed in or below the bottom cavity.
- the semiconductor chip emits light from a point “F” as shown.
- Light entering the optical lens 31 through a central flat portion of the bottom surface of the base portion 32 in the cavity propagates to the reflecting surface 34 .
- the light is reflected by the reflecting surface 34 to the first refracting surface 36 .
- the light is refracted by the first refracting surface 36 , and exits the optical lens 31 in a direction substantially perpendicular to the central axis 35 .
- Light entering the optical lens 31 through a peripheral curved portion of the bottom surface of the base portion 32 in the cavity propagates to the second refracting surface 38 .
- the light is refracted by the second refracting surface 38 , and exits the optical lens 31 in a direction substantially perpendicular to the central axis 35 .
- the optical lens 31 may be employed in side light-emitting devices, so that the side light-emitting devices may be advantageously used with light guides and reflectors that have very thin profiles and/or large illuminated areas.
- each of the first refracting surface 36 and the second refracting surface 38 is a single smooth peripheral surface. Thus it is difficult to manufacture the optical lens 31 to achieve desired light distribution characteristics and optimum light emitting angles.
- the light incidence angle at the central flat portion of the bottom surface of the base portion 32 is not within a predetermined range, the light may escape from the optical lens 31 through the reflecting surface 34 rather than reflecting to the first refracting surface 36 . When this happens, the efficiency of light utilization is reduced.
- FIG. 1 is an isometric view of parts of a frequently used bottom emitting LED.
- FIG. 2 is a side view of the LED of FIG. 1 , showing an essential optical path thereof.
- FIG. 3 is a cross-section of an optical lens in another kind of frequently used bottom emitting LED.
- FIG. 4 is a plan view of a light emitting device in accordance with a first embodiment of the disclosure.
- FIG. 5 is a cross-section of the light emitting device shown in FIG. 4 .
- FIG. 6 is similar to FIG. 5 , but shows essential optical paths of the light emitting device.
- FIG. 7 is a cross-section of an optical lens in accordance with a second embodiment of the disclosure.
- FIG. 8 is a cross-section of an optical lens in accordance with a third embodiment of the disclosure.
- FIG. 9 is a cross-section of an optical lens in accordance with a fourth embodiment of the disclosure.
- FIG. 10 is a cross-section of an optical lens in accordance with a fifth embodiment of the disclosure.
- the light-emitting device 100 includes a light-emitting semiconductor unit 200 , and an optical lens 300 coupled to the light-emitting semiconductor unit 200 .
- the light-emitting device 100 is a symmetrical body having a central axis 101 passing through centers of the light-emitting semiconductor unit 200 and the optical lens 300 .
- the light-emitting semiconductor unit 200 includes a package body 201 , and a semiconductor chip 202 fixed on the package body 201 .
- the package body 201 includes a protruding portion 2011 at a top end thereof, and a connecting portion 2012 at an opposite bottom end thereof.
- the semiconductor chip 202 is disposed on a middle of the protruding portion 2011 .
- the connecting portion 2012 is configured for electrically connecting the semiconductor chip 202 to an external circuit (not shown).
- the semiconductor chip 202 has a light emitting PN (positive negative) junction, and is configured for emitting light.
- the semiconductor chip 202 may be of any of various shapes, including a cube, a rectangular block, a hemisphere, or other.
- the optical lens 300 is symmetrical about the central axis 101 .
- the optical lens 300 can be cylindrically symmetrical about the central axis 101 .
- the optical lens 300 includes a top surface 301 , a base portion 304 opposite to the top surface 301 , and a peripheral side surface (not labeled).
- the peripheral side surface has a corrugated refractive portion 302 and a smooth refractive portion 303 thereat.
- the base portion 304 has an inverted U-shaped cross-section taken along a plane passing through the central axis 101 , and defines a cavity (not labeled) receiving the protruding portion 2011 therein.
- the optical lens 300 may be radially symmetrical about the central axis 101 . That is, the optical lens 300 may be generally polyhedral, with the peripheral side surface thereof being generally polygonal.
- the optical lens 300 is made of transparent material, such as (but not limited to) cyclic olefin copolymer (COC), polymethyl methacrylate (PMMA), polycarbonate (PC), PC/PMMA, silicone, fluorocarbon polymer, or polyetherimide (PEI).
- COC cyclic olefin copolymer
- PMMA polymethyl methacrylate
- PC polycarbonate
- PC/PMMA silicone
- fluorocarbon polymer or polyetherimide
- PEI polyetherimide
- the optical lens 300 may be manufactured independently using any of various well-known techniques, such as diamond turning (i.e., the optical lens 300 is shaped by a lathe with a diamond bit), injection molding, or casting.
- the optical lens 300 may be integrally formed on the package body 201 having the semiconductor chip 202 by any of various techniques such as (but not limited to) injection molding (e.g., insert molding), or casting.
- the top surface 301 is substantially funnel-shaped or cone-shaped. If the optical lens 300 is cylindrically symmetrical about the central axis 101 , the top surface 301 has the same symmetrical double-curved cross-section taken along any plane passing through the central axis 101 .
- the two curves of the symmetrical double-arc shape are convex, with the top surface 301 being generally convex. That is, the top surface 301 has a uniform curvature through 360° measured around the central axis 101 .
- the top surface 301 provides a total internal reflective surface. This means the top surface 301 can effectively reflect light so that the light exits the optical lens 300 through the corrugated refractive portion 302 .
- the top surface 301 may have a symmetrical double-curved cross-section for a cross-section taken along a plane passing through the central axis 101 , and may have two or more different double-curved cross-sections taken along a plane passing through the central axis 101 , depending on where the plane of the cross-section passes through the central axis 101 is located, and depending on the particular radially symmetrical configuration of the optical lens 300 . That is, the top surface 301 includes a plurality of curved portions connected to each other. The curved portions cooperatively provide the top surface 301 with a total internal reflective surface. Thereby, the top surface 301 can effectively reflect light so that the light exits the optical lens 300 through the corrugated refractive portion 302 .
- the corrugated refractive portion 302 includes a top end (not labeled) connecting to the top surface 301 , and a bottom end (not labeled) connecting to the smooth refractive portion 303 .
- the bottom end of the corrugated refractive portion 302 is configured to be lower than a bottommost extremity of the top surface 301 .
- the corrugated refractive portion 302 includes a plurality of protruding ridge structures that encircle or surround the optical lens 300 thereat.
- the ridge structures are parallel to each other.
- Each of the ridge structures has a triangular cross-section taken along a plane passing through the central axis 101 .
- the triangular cross-sections of the ridge structures have the same orientation.
- Each of the ridge structures includes an angled refractive surface 3021 .
- the angled refractive surfaces 3021 of the ridge structures are angled at the same angle relative to the central axis 101 .
- a desired light emitting angle of each ridge structure can be obtained by configuring the angle of the refractive surface 3021 accordingly.
- the refractive surfaces 3021 may have different angles.
- the light distribution characteristics of the corrugated refractive portion 302 can be configured as needed.
- the smooth refractive portion 303 has a cylindrical surface.
- the smooth refractive portion 303 is configured for refracting light that is directly received from the semiconductor chip 202 , that is, light that is not reflected by the top surface 301 .
- the light refracted at the smooth refractive portion 303 then exits the optical lens 300 .
- a major portion of light emitted from the semiconductor chip 202 transmits upwardly to the top surface 301 .
- the light is then totally reflected by the top surface 301 , and exits the optical lens 300 through the corrugated refractive portion 302 .
- a minor portion of the light emitted from the semiconductor chip 202 transmits directly to the smooth refractive portion 303 .
- the light is then refracted by the smooth refractive portion 303 and exits the optical lens 300 .
- an optical lens 400 in accordance with a second embodiment is similar to the optical lens 300 of the first embodiment.
- the optical lens 400 includes a top surface 401 , a corrugated refractive portion 402 , and a smooth refractive portion 403 .
- a bottom end of the corrugated refractive portion 402 is configured to be higher than a bottommost extremity of the top surface 401 .
- the corrugated refractive portion 402 includes a first refractive section 4022 and a second refractive section 4023 .
- the first refractive section 4022 and the second refractive section 4023 each include a plurality of ridge structures.
- Each of the ridge structures has a triangular cross-section taken along a plane passing through a central axis of the optical lens 400 .
- the first refractive section 4022 includes a plurality of first refractive surfaces (not labeled) having the same first angle relative to the central axis.
- the second refractive section 4023 includes a plurality of second refractive surfaces (not labeled) having the same second angle relative to the central axis.
- the first angle of the first refractive surfaces is different from the second angle of the second refractive surfaces. Desired light emitting angles of the first refractive section 4022 and the second refractive section 4023 can be obtained by configuring the respective angles accordingly.
- a desired light distribution characteristic of the corrugated refractive portion 402 can be achieved.
- an optical lens 500 in accordance with a third embodiment is similar to the optical lens 300 of the first embodiment.
- the optical lens 500 includes a top surface 501 , a first corrugated refractive portion 502 , a second corrugated refractive portion 503 , and a cylindrical side surface (not labeled).
- a bottom end of the second corrugated refractive portion 503 is configured to be lower than a bottommost extremity of the top surface 501 .
- the first corrugated refractive portion 502 includes a plurality of ridge structures, each including a first refractive surface 5021 .
- the second corrugated refractive portion 503 includes a plurality of ridge structures, each including a second refractive surface 5032 .
- the first refractive surfaces 5021 have the same first angle relative to a central axis of the optical lens 500 .
- the second refractive surfaces 5032 have the same second angle relative to the central axis of the optical lens 500 . In the illustrated embodiment, the first angle is equal to the second angle. However, the first refractive surfaces 5021 and the second refractive surfaces 5032 are oriented symmetrically relative to each other.
- the first corrugated refractive portion 502 is configured for refracting light that is received from a semiconductor chip (not shown) via the top surface 501 , whereupon the refracted light exits the optical lens 500 .
- the second corrugated refractive portion 503 is configured for refracting light that is directly received from the semiconductor chip, whereupon the refracted light exits the optical lens 500 .
- an optical lens 600 in accordance with a fourth embodiment is similar to the optical lens 300 of the first embodiment.
- the optical lens 600 includes a top surface 601 , a corrugated refractive portion 602 , a smooth refractive portion 603 , and a reflecting sheet 604 .
- the reflecting sheet 604 is disposed above the top surface 601 .
- the reflecting sheet 604 is configured for reflecting any light that escapes out of the top surface 601 back into the optical lens 600 . Thereby, the efficiency of light utilization provided by the optical lens 600 can be improved.
- the reflecting sheet 604 is a reflecting plate.
- an optical lens 700 in accordance with a fifth embodiment is similar to the optical lens 300 of the first embodiment.
- the optical lens 700 includes a top surface 701 , a corrugated refractive portion 702 , a smooth refractive portion 703 , and a reflecting film 704 .
- the reflecting film 704 is located on the top surface 701 .
- the reflecting film 704 is configured for preventing any light from escaping from the top surface 701 . Thereby, the efficiency of light utilization provided by the optical lens 700 can be improved, and the uniformity of light output from the optical lens 700 enhanced.
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Abstract
A light emitting device includes a light-emitting semiconductor unit and an optical lens coupled to the light-emitting semiconductor unit. The optical lens includes a top surface, a base portion opposite to the top surface, and a peripheral side surface defining a first refractive portion. The top surface is generally funnel-shaped. The first refractive portion is corrugated with a plurality of protruding ridge structures, each including a refractive surface.
Description
- The present application is a divisional application of U.S. patent application Ser. No. 11/697,304, filed on Apr. 6, 2007, which claims foreign priority based on Chinese Patent Application No. 200610200892.2, filed in China on Sep. 22, 2006.
- 1. Field of the Invention
- The disclosure generally relates to optical lenses for light emitting devices and, particularly, to an optical lens typically used for a side emitting light-emitting diode (LED).
- 2. Discussion of the Related Art
- LEDs are widely applied in electronic display devices and illuminating devices, offering advantages of high illumination efficiency and a long lifetime. An LED generally includes a semiconductor chip emitting light. LEDs can be classified, according to the location of the semiconductor chip therein, as bottom emitting LEDs and side emitting LEDs.
- Referring to
FIG. 1 , in a typical bottom emitting LED, asemiconductor chip 11 is disposed below adisplay screen 12. Thesemiconductor chip 11 is configured for emitting multiple colors of light, such as red, green, and blue (RGB). A distance D1 between thesemiconductor chip 11 and thedisplay screen 12 must be sufficient to provide a predetermined threshold angle from which the RGB light is emitted from thesemiconductor chip 11. The emitted RGB light can thus be adequately mixed to yield white light illuminating thedisplay screen 12. The distance D1, however, is apt to increase a thickness of the bottom emitting LED, thereby increasing the overall size of the device. - Referring to
FIG. 2 , in a typical side emitting LED, adisplay screen 22 is stacked on alight guide plate 24, and asemiconductor chip 21 is disposed on at one side of the combineddisplay screen 22 andlight guide plate 24. Light emitted from thesemiconductor chip 21 travels along light paths including light paths 23 (only one of many is shown). Thelight paths 23 are located within thelight guide plate 24, so that the light can be reflected continuously until exiting a top of thelight guide plate 24 and illuminating thedisplay screen 22. The side emitting LED provides improved uniformity of light illuminating thedisplay screen 22. However, light energy can be lost with each reflection, thus the side emitting LED is limited in light utilization efficiency. In addition, in the case of alarge display screen 22, some areas of thedisplay screen 22 may not be sufficiently illuminated. -
FIG. 3 shows anoptical lens 31 in another bottom emitting LED. Theoptical lens 31 is configured to improve the efficiency of light utilization. Theoptical lens 31 includes abase portion 32, a top reflectingsurface 34, a peripheral first refractingsurface 36 obliquely angled with respect to acentral axis 35 of theoptical lens 31, and a peripheral, curved second refractingsurface 38 extending from a bottom of thebase portion 32 to the first refractingsurface 36. Thebase portion 32 defines a bottom cavity (not labeled) therein. A bottom surface of thebase portion 32 is shaped like a flat-topped dome. A semiconductor chip (not shown) can be disposed in or below the bottom cavity. Typically, the semiconductor chip emits light from a point “F” as shown. Light entering theoptical lens 31 through a central flat portion of the bottom surface of thebase portion 32 in the cavity propagates to the reflectingsurface 34. The light is reflected by thereflecting surface 34 to the first refractingsurface 36. The light is refracted by the first refractingsurface 36, and exits theoptical lens 31 in a direction substantially perpendicular to thecentral axis 35. Light entering theoptical lens 31 through a peripheral curved portion of the bottom surface of thebase portion 32 in the cavity propagates to the second refractingsurface 38. The light is refracted by the second refractingsurface 38, and exits theoptical lens 31 in a direction substantially perpendicular to thecentral axis 35. - The
optical lens 31 may be employed in side light-emitting devices, so that the side light-emitting devices may be advantageously used with light guides and reflectors that have very thin profiles and/or large illuminated areas. However, each of the first refractingsurface 36 and the second refractingsurface 38 is a single smooth peripheral surface. Thus it is difficult to manufacture theoptical lens 31 to achieve desired light distribution characteristics and optimum light emitting angles. In addition, if the light incidence angle at the central flat portion of the bottom surface of thebase portion 32 is not within a predetermined range, the light may escape from theoptical lens 31 through the reflectingsurface 34 rather than reflecting to the first refractingsurface 36. When this happens, the efficiency of light utilization is reduced. - Therefore an optical lens which can overcome the above-described shortcomings is desired, as is a light emitting device employing the optical lens.
- The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present optical lens and light emitting device. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views, and all the views are schematic.
-
FIG. 1 is an isometric view of parts of a frequently used bottom emitting LED. -
FIG. 2 is a side view of the LED ofFIG. 1 , showing an essential optical path thereof. -
FIG. 3 is a cross-section of an optical lens in another kind of frequently used bottom emitting LED. -
FIG. 4 is a plan view of a light emitting device in accordance with a first embodiment of the disclosure. -
FIG. 5 is a cross-section of the light emitting device shown inFIG. 4 . -
FIG. 6 is similar toFIG. 5 , but shows essential optical paths of the light emitting device. -
FIG. 7 is a cross-section of an optical lens in accordance with a second embodiment of the disclosure. -
FIG. 8 is a cross-section of an optical lens in accordance with a third embodiment of the disclosure. -
FIG. 9 is a cross-section of an optical lens in accordance with a fourth embodiment of the disclosure. -
FIG. 10 is a cross-section of an optical lens in accordance with a fifth embodiment of the disclosure. - Referring to
FIGS. 4 and 5 , a light-emitting device 100 in accordance with a first embodiment is shown. The light-emitting device 100 includes a light-emittingsemiconductor unit 200, and anoptical lens 300 coupled to the light-emittingsemiconductor unit 200. The light-emitting device 100 is a symmetrical body having acentral axis 101 passing through centers of the light-emittingsemiconductor unit 200 and theoptical lens 300. - The light-emitting
semiconductor unit 200 includes apackage body 201, and asemiconductor chip 202 fixed on thepackage body 201. Thepackage body 201 includes aprotruding portion 2011 at a top end thereof, and a connectingportion 2012 at an opposite bottom end thereof. Thesemiconductor chip 202 is disposed on a middle of the protrudingportion 2011. The connectingportion 2012 is configured for electrically connecting thesemiconductor chip 202 to an external circuit (not shown). Thesemiconductor chip 202 has a light emitting PN (positive negative) junction, and is configured for emitting light. Thesemiconductor chip 202 may be of any of various shapes, including a cube, a rectangular block, a hemisphere, or other. - The
optical lens 300 is symmetrical about thecentral axis 101. For example, theoptical lens 300 can be cylindrically symmetrical about thecentral axis 101. Theoptical lens 300 includes atop surface 301, abase portion 304 opposite to thetop surface 301, and a peripheral side surface (not labeled). The peripheral side surface has a corrugatedrefractive portion 302 and a smoothrefractive portion 303 thereat. Thebase portion 304 has an inverted U-shaped cross-section taken along a plane passing through thecentral axis 101, and defines a cavity (not labeled) receiving the protrudingportion 2011 therein. Thus, thesemiconductor chip 202 disposed on the middle of the protrudingportion 2011 is protected. In alternative embodiments, theoptical lens 300 may be radially symmetrical about thecentral axis 101. That is, theoptical lens 300 may be generally polyhedral, with the peripheral side surface thereof being generally polygonal. - The
optical lens 300 is made of transparent material, such as (but not limited to) cyclic olefin copolymer (COC), polymethyl methacrylate (PMMA), polycarbonate (PC), PC/PMMA, silicone, fluorocarbon polymer, or polyetherimide (PEI). Theoptical lens 300 may be manufactured independently using any of various well-known techniques, such as diamond turning (i.e., theoptical lens 300 is shaped by a lathe with a diamond bit), injection molding, or casting. Alternatively, theoptical lens 300 may be integrally formed on thepackage body 201 having thesemiconductor chip 202 by any of various techniques such as (but not limited to) injection molding (e.g., insert molding), or casting. - The
top surface 301 is substantially funnel-shaped or cone-shaped. If theoptical lens 300 is cylindrically symmetrical about thecentral axis 101, thetop surface 301 has the same symmetrical double-curved cross-section taken along any plane passing through thecentral axis 101. The two curves of the symmetrical double-arc shape are convex, with thetop surface 301 being generally convex. That is, thetop surface 301 has a uniform curvature through 360° measured around thecentral axis 101. Thereby, thetop surface 301 provides a total internal reflective surface. This means thetop surface 301 can effectively reflect light so that the light exits theoptical lens 300 through the corrugatedrefractive portion 302. If theoptical lens 300 is radially symmetrical about thecentral axis 101, thetop surface 301 may have a symmetrical double-curved cross-section for a cross-section taken along a plane passing through thecentral axis 101, and may have two or more different double-curved cross-sections taken along a plane passing through thecentral axis 101, depending on where the plane of the cross-section passes through thecentral axis 101 is located, and depending on the particular radially symmetrical configuration of theoptical lens 300. That is, thetop surface 301 includes a plurality of curved portions connected to each other. The curved portions cooperatively provide thetop surface 301 with a total internal reflective surface. Thereby, thetop surface 301 can effectively reflect light so that the light exits theoptical lens 300 through the corrugatedrefractive portion 302. - The corrugated
refractive portion 302 includes a top end (not labeled) connecting to thetop surface 301, and a bottom end (not labeled) connecting to the smoothrefractive portion 303. The bottom end of the corrugatedrefractive portion 302 is configured to be lower than a bottommost extremity of thetop surface 301. The corrugatedrefractive portion 302 includes a plurality of protruding ridge structures that encircle or surround theoptical lens 300 thereat. In the illustrated embodiment, the ridge structures are parallel to each other. Each of the ridge structures has a triangular cross-section taken along a plane passing through thecentral axis 101. In the illustrated embodiment, the triangular cross-sections of the ridge structures have the same orientation. Each of the ridge structures includes an angledrefractive surface 3021. In the illustrated embodiment, the angledrefractive surfaces 3021 of the ridge structures are angled at the same angle relative to thecentral axis 101. A desired light emitting angle of each ridge structure can be obtained by configuring the angle of therefractive surface 3021 accordingly. It should be understood that in alternative embodiments, therefractive surfaces 3021 may have different angles. Thus, the light distribution characteristics of the corrugatedrefractive portion 302 can be configured as needed. - In one embodiment, the smooth
refractive portion 303 has a cylindrical surface. The smoothrefractive portion 303 is configured for refracting light that is directly received from thesemiconductor chip 202, that is, light that is not reflected by thetop surface 301. The light refracted at the smoothrefractive portion 303 then exits theoptical lens 300. - Referring to
FIG. 6 , in use, a major portion of light emitted from thesemiconductor chip 202 transmits upwardly to thetop surface 301. The light is then totally reflected by thetop surface 301, and exits theoptical lens 300 through the corrugatedrefractive portion 302. A minor portion of the light emitted from thesemiconductor chip 202 transmits directly to the smoothrefractive portion 303. The light is then refracted by the smoothrefractive portion 303 and exits theoptical lens 300. - Referring to
FIG. 7 , anoptical lens 400 in accordance with a second embodiment is similar to theoptical lens 300 of the first embodiment. Theoptical lens 400 includes atop surface 401, a corrugatedrefractive portion 402, and a smoothrefractive portion 403. A bottom end of the corrugatedrefractive portion 402 is configured to be higher than a bottommost extremity of thetop surface 401. The corrugatedrefractive portion 402 includes a firstrefractive section 4022 and a secondrefractive section 4023. The firstrefractive section 4022 and the secondrefractive section 4023 each include a plurality of ridge structures. Each of the ridge structures has a triangular cross-section taken along a plane passing through a central axis of theoptical lens 400. The firstrefractive section 4022 includes a plurality of first refractive surfaces (not labeled) having the same first angle relative to the central axis. The secondrefractive section 4023 includes a plurality of second refractive surfaces (not labeled) having the same second angle relative to the central axis. The first angle of the first refractive surfaces is different from the second angle of the second refractive surfaces. Desired light emitting angles of the firstrefractive section 4022 and the secondrefractive section 4023 can be obtained by configuring the respective angles accordingly. Thus, a desired light distribution characteristic of the corrugatedrefractive portion 402 can be achieved. - Referring to
FIG. 8 , anoptical lens 500 in accordance with a third embodiment is similar to theoptical lens 300 of the first embodiment. Theoptical lens 500 includes atop surface 501, a first corrugatedrefractive portion 502, a second corrugated refractive portion 503, and a cylindrical side surface (not labeled). A bottom end of the second corrugated refractive portion 503 is configured to be lower than a bottommost extremity of thetop surface 501. The first corrugatedrefractive portion 502 includes a plurality of ridge structures, each including a firstrefractive surface 5021. The second corrugated refractive portion 503 includes a plurality of ridge structures, each including a secondrefractive surface 5032. The firstrefractive surfaces 5021 have the same first angle relative to a central axis of theoptical lens 500. The secondrefractive surfaces 5032 have the same second angle relative to the central axis of theoptical lens 500. In the illustrated embodiment, the first angle is equal to the second angle. However, the firstrefractive surfaces 5021 and the secondrefractive surfaces 5032 are oriented symmetrically relative to each other. The first corrugatedrefractive portion 502 is configured for refracting light that is received from a semiconductor chip (not shown) via thetop surface 501, whereupon the refracted light exits theoptical lens 500. The second corrugated refractive portion 503 is configured for refracting light that is directly received from the semiconductor chip, whereupon the refracted light exits theoptical lens 500. - Referring to
FIG. 9 , anoptical lens 600 in accordance with a fourth embodiment is similar to theoptical lens 300 of the first embodiment. Theoptical lens 600 includes atop surface 601, a corrugatedrefractive portion 602, a smoothrefractive portion 603, and a reflectingsheet 604. The reflectingsheet 604 is disposed above thetop surface 601. The reflectingsheet 604 is configured for reflecting any light that escapes out of thetop surface 601 back into theoptical lens 600. Thereby, the efficiency of light utilization provided by theoptical lens 600 can be improved. In the illustrated embodiment, the reflectingsheet 604 is a reflecting plate. - Referring to
FIG. 10 , anoptical lens 700 in accordance with a fifth embodiment is similar to theoptical lens 300 of the first embodiment. Theoptical lens 700 includes atop surface 701, a corrugatedrefractive portion 702, a smoothrefractive portion 703, and a reflectingfilm 704. The reflectingfilm 704 is located on thetop surface 701. The reflectingfilm 704 is configured for preventing any light from escaping from thetop surface 701. Thereby, the efficiency of light utilization provided by theoptical lens 700 can be improved, and the uniformity of light output from theoptical lens 700 enhanced. - It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.
Claims (11)
1. A light emitting device, comprising:
a light-emitting semiconductor unit; and
an optical lens coupled to the light-emitting semiconductor unit, the optical lens comprising:
a top surface;
a base portion opposite to the top surface; and
a peripheral side surface defining a first refractive portion corrugated with a plurality of protruding ridge structures, each including a first refractive surface.
2. The light emitting device as claimed in claim 1 , wherein the light-emitting semiconductor unit includes a package body disposed adjacent to a bottom of the optical lens and a semiconductor chip fixed on the package body.
3. The light emitting device as claimed in claim 2 , wherein the package body includes a protruding portion at an end thereof on which the semiconductor chip is disposed, and the base portion defines a bottom cavity receiving the protruding portion bearing the semiconductor chip thereon.
4. The light emitting device as claimed in claim 1 , wherein the peripheral side surface further defines a second refractive portion including a top end adjacent to the top surface and a bottom end adjacent to the second refractive portion.
5. The light emitting device as claimed in claim 4 , wherein the second refractive portion is corrugated with a plurality of protruding ridge structures, each including a second refractive surface, symmetrically relative to each of which each of the first refractive surfaces of the first refractive portion is oriented.
6. The light emitting device as claimed in claim 4 , wherein the second refractive portion is cylindrical.
7. The light emitting device as claimed in claim 6 , wherein the first refractive portion includes a first refractive section and a second refractive section, each including a plurality of ridge structures, each of which has a triangular cross-section, the ridge structures of the first refractive section including a plurality of first refractive surfaces having the same first angle relative to a central axis of the optical lens, the ridge structures of the second refractive section including a plurality of second refractive surfaces having the same second angle relative to the central axis, and the first angle of the first refractive surfaces is different from the second angle of the second refractive surfaces.
8. The light emitting device as claimed in claim 1 , wherein the optical lens is made of a transparent material selected from the group consisting of cyclic olefin copolymer, polymethyl methacrylate, polycarbonate, silicone, fluorocarbon polymer, and polyetherimide.
9. The light emitting device as claimed in claim 1 , wherein each of the ridge structures has a triangular cross-section, wherein the triangular cross-sections of the ridge structures have the same orientation, and each of the ridge structures includes an angled refractive surface, and the angled refractive surfaces of the ridge structures are angled at the same angle relative to a central axis of the optical lens.
10. The light emitting device as claimed in claim 1 , wherein the optical lens further comprises a reflecting sheet above the top surface.
11. The light emitting device as claimed in claim 1 , wherein the optical lens further comprises a reflecting film on the top surface.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006102008925A CN101150159B (en) | 2006-09-22 | 2006-09-22 | LED and its lens body |
CN200610200892.5 | 2006-09-22 |
Publications (1)
Publication Number | Publication Date |
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US20100065875A1 true US20100065875A1 (en) | 2010-03-18 |
Family
ID=39224735
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Application Number | Title | Priority Date | Filing Date |
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US11/697,304 Expired - Fee Related US7659552B2 (en) | 2006-09-22 | 2007-04-06 | Optical lens and light emitting device using the same |
US12/620,606 Abandoned US20100065875A1 (en) | 2006-09-22 | 2009-11-18 | Optical lens and light emitting device using the same |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/697,304 Expired - Fee Related US7659552B2 (en) | 2006-09-22 | 2007-04-06 | Optical lens and light emitting device using the same |
Country Status (2)
Country | Link |
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US (2) | US7659552B2 (en) |
CN (1) | CN101150159B (en) |
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Also Published As
Publication number | Publication date |
---|---|
US20080074886A1 (en) | 2008-03-27 |
CN101150159A (en) | 2008-03-26 |
CN101150159B (en) | 2011-05-11 |
US7659552B2 (en) | 2010-02-09 |
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