US20100059203A1 - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
US20100059203A1
US20100059203A1 US12/399,030 US39903009A US2010059203A1 US 20100059203 A1 US20100059203 A1 US 20100059203A1 US 39903009 A US39903009 A US 39903009A US 2010059203 A1 US2010059203 A1 US 2010059203A1
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US
United States
Prior art keywords
fins
heat dissipation
dissipation device
label member
engaging portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/399,030
Inventor
Ching-Hung Chu
Chang-Mu Li
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Assigned to HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHU, CHING-HUNG, LI, CHANG-MU
Publication of US20100059203A1 publication Critical patent/US20100059203A1/en
Abandoned legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54433Marks applied to semiconductor devices or parts containing identification or tracking information
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54473Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/54486Located on package parts, e.g. encapsulation, leads, package substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • Two mounting portions 16 extend horizontally and outwardly from two diagonally opposite corners of the base 12 , respectively. Each of the two mounting portions 16 defines a mounting hole 160 at a center thereof. Two mounting members (not shown) extend through the two mounting holes 160 and engage the printed circuit board, such that the heat sink 10 snugly contacts the electronic component mounted on the printed circuit board.

Abstract

A heat dissipation device for an electronic component includes a heat sink thermally contacting the electronic component and a label member fixed on the heat sink for providing information. The heat sink includes a base and a plurality of fins extending upwardly from a top surface of the base. Two engaging portions protrude from two spaced fins, towards each other. Two flanges angle outwardly from two opposite lateral sides of the label member and clasp the two engaging portions of the heat sink, respectively.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present disclosure relates to heat dissipation, and, more particularly, to a heat dissipation device providing product information of the heat dissipation device.
  • 2. Description of Related Art
  • Electronic components, such as central processing units (CPUs) comprise numerous circuits operating at high speed and generating substantial heat. Under most circumstances, it is necessary to cool the CPUs in order to maintain safe operating conditions and assure that the CPUs function properly and reliably. In the past, various approaches have been used to cool electronic components. Typically, a finned metal heat sink is attached to an outer surface of the CPU to remove the heat therefrom. The heat absorbed by the heat sink is then dissipated to ambient air. The related finned metal heat sink is made of highly heat-conductive metal, such as copper or aluminum, and generally comprises a base contacting the CPU to absorb the heat therefrom and a plurality of fins formed on the base for dissipating the heat.
  • Conventionally, the heat sink is further provided with an adhesive label directly attached thereon, adapted for showing product information, such as product logo, product name, and other information. However, the adhesive label is prone to accidental removal in whole or part, with such removal having the potential for unremoved adhesive to remain, contaminating the heat sink and environs. In addition, the adhesive label is aesthetically unpleasing.
  • What is needed, therefore, is a heat dissipation device incorporating a label member which can overcome the described limitations.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an assembled, isometric view of a heat dissipation device in accordance with the disclosure.
  • FIG. 2 is an exploded view of the heat dissipation device of FIG. 1.
  • DETAILED DESCRIPTION OF THE DISCLOSURE
  • Referring to FIG. 1, a heat dissipation device in accordance with the disclosure is provided to dissipate heat generated by an electronic component (not shown) mounted on a printed circuit board (not shown). The heat dissipation device comprises a heat sink 10 thermally contacting the electronic component and a label member 20 securely disposed on the heat sink 10.
  • Also referring to FIG. 2, the heat sink 10 is integrally formed of metal with good heat conductivity, such as aluminum, copper, or alloys thereof. The heat sink 10 comprises a rectangular base 12 and a plurality of fins 14 extending upwardly from a top surface thereof. The fins 14 are spaced from each other and extend along a width of the base 12. Between each two adjacent fins 14 a passage (not labeled) therebetween allows airflow therethrough. The fins 14 comprise a plurality of first fins 141 divided into two parts located at opposite lateral sides of the base 12, respectively, and a plurality of second fins 142 at a center of the base 12 and between the two parts of the first fins 141. Height of the second fins 142 gradually decreases from a middle second fin 142 to two outmost second fins 142, respectively, whereby top ends of the second fins 142 cooperatively form a curved surface. Each of the two outmost second fins 142 is shorter than a corresponding inmost first fin 141 close to the outmost second fin 142. Two engaging portions 140 protrude inwardly from top ends of the two inmost first fins 141, respectively, and towards each other. The two engaging portions 140 are two hooks each having a top inclined guide face and a bottom engaging face substantially parallel to the base 12. Each of the two engaging portions 140 has a triangular cross-section created by the guide face and the engaging face. The guide faces of the two engaging portions 140 substantially face each other. Two mounting portions 16 extend horizontally and outwardly from two diagonally opposite corners of the base 12, respectively. Each of the two mounting portions 16 defines a mounting hole 160 at a center thereof. Two mounting members (not shown) extend through the two mounting holes 160 and engage the printed circuit board, such that the heat sink 10 snugly contacts the electronic component mounted on the printed circuit board.
  • The label member 20 is an elongated plaque integrally formed of resilient metal or other material. A central portion of the label member 20 arches upwardly, whereby the label member 20 has a curved configuration. Two elongated flanges 22 angle upwardly from two opposite lateral sides of the label member 20, respectively. A span of the label member 20 along a length thereof is approximately equal to an interval between the two engaging portions 140 of the heat sink 10.
  • In assembly of the heat dissipation device, the two flanges 22 of the label member 20 securely clasp the bottom engaging faces of the two engaging portions 140 of the heat sink 10, respectively, by having one of the flanges 22 clasping the bottom engaging face of one of the engaging portions 140 and the other flange 22 moving downwardly along the top inclined guide face of the other engaging portion 140 until the other flange 22 also clasps the bottom engaging face of the other engaging portion 140. The label member 20 spans the second fins 142 of the heat sink 10, wherein a bottom surface of the label member 20 is snugly received on the top ends of the second fins 142. To release the label member 20, a lateral portion of the label member 20 is depressed until a corresponding flange 22 located there disengages from a corresponding engaging portion 140, then moves another flange 22 away from another engaging portion 140. Thus, the label member 20 can be easily removed.
  • In use, characters or images are formed on the label member 20 by stamping, etching or carving or other means, showing product information such as logo, product name or product ID, or other information.
  • It is believed that the disclosure and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being exemplary or exemplary embodiments of the invention.

Claims (18)

1. A heat dissipation device comprising:
a heat sink comprising a base and a plurality of fins extending upwardly from a top surface of the base, and two engaging portions protruding from two fins, respectively, and towards each other; and
an elongated label member fixed on the fins of the heat sink, two flanges angling outwardly from two opposite lateral sides of the label member and clasping the two engaging portions of the heat sink, respectively.
2. The heat dissipation device as claimed in claim 1, wherein the fins comprise a plurality of first fins divided into two parts located at two opposite lateral sides of the base, respectively, and a plurality of second fins located at a center of the base and between the two parts of the first fins.
3. The heat dissipation device as claimed in claim 2, wherein the two flanges protrude inwardly and horizontally from two inmost first fins located adjacent to the second fins, respectively.
4. The heat dissipation device as claimed in claim 3, wherein each of the two flanges protrudes from a top end of each of the two inmost first fins.
5. The heat dissipation device as claimed in claim 2, wherein height of the second fins gradually decreases from a middle second fin to two outmost second fins, whereby top ends of the second fins cooperatively form a curved surface.
6. The heat dissipation device as claimed in claim 5, wherein the label member spans the top ends of the second fins.
7. The heat dissipation device as claimed in claim 6, wherein a bottom surface of the label member is received on the top ends of the second fins.
8. The heat dissipation device as claimed in claim 1, wherein a central portion of the label member arches upwardly, such that the label member presents a curved configuration.
9. The heat dissipation device as claimed in claim 1, wherein the base of the heat sink is rectangular, and the fins of the heat sink extend along a width of the base.
10. The heat dissipation device as claimed in claim 1, wherein characters and images are formed on the label member by stamping, etching or carving.
11. The heat dissipation device as claimed in claim 1, wherein each of the engaging portions has a top inclined guide face and a bottom engaging face, and the flanges of the label member clasp the bottom engaging faces of the engaging portions.
12. A heat dissipation device comprising:
a heat sink comprising a base and a plurality of fins extending upwardly from a top surface of the base, the fins comprising two spaced first fins and a plurality of second fins located between the two first fins, two elongated engaging portions extending from the two first fins, respectively, and towards each other; and
an elongated label member disposed on the second fins of the heat sink, the two engaging portions pressing two opposite lateral ends of the label member downward, respectively.
13. The heat dissipation device as claimed in claim 12, wherein each of the two engaging portions protrudes from a top end of each of the two first fins.
14. The heat dissipation device as claimed in claim 12, wherein each of the engaging portions has an engaging face parallel to the base, the engaging faces of the engaging portions pressing the two lateral ends of the label member downward, respectively.
15. The heat dissipation device as claimed in claim 12, wherein the label member spans top ends of the second fins.
16. The heat dissipation device as claimed in claim 12, wherein top ends of the second fins cooperatively form a curved surface.
17. The heat dissipation device as claimed in claim 12, wherein the label member further comprises two flanges angling upwardly from two opposite lateral sides thereof to clasp the two engaging portions, respectively.
18. The heat dissipation device as claimed in claim 14, wherein each of the engaging portions has a top inclined guide face above the engaging face, and the engaging face is located at a bottom of the each of the engaging portions.
US12/399,030 2008-09-11 2009-03-06 Heat dissipation device Abandoned US20100059203A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200810304472.0 2008-09-11
CN200810304472.0A CN101674718A (en) 2008-09-11 2008-09-11 Radiation device

Publications (1)

Publication Number Publication Date
US20100059203A1 true US20100059203A1 (en) 2010-03-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
US12/399,030 Abandoned US20100059203A1 (en) 2008-09-11 2009-03-06 Heat dissipation device

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US (1) US20100059203A1 (en)
CN (1) CN101674718A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150079734A1 (en) * 2013-09-18 2015-03-19 Taiwan Semiconductor Manufacturing Company, Ltd. Die-Tracing in Integrated Circuit Manufacturing and Packaging
US20180138154A1 (en) * 2016-11-14 2018-05-17 Samsung Electronics Co., Ltd. Semiconductor module
US11152278B2 (en) * 2017-10-10 2021-10-19 Bitmain Technologies Inc. Heat sink, integrated circuit chip and circuit board
US20220408543A1 (en) * 2021-06-22 2022-12-22 Vacon Oy Heatsink cooling arrangement
US11923264B2 (en) 2019-09-20 2024-03-05 Samsung Electronics Co., Ltd. Semiconductor apparatus for discharging heat

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5584339A (en) * 1995-09-08 1996-12-17 Hong; Chen F. Heat sink assembly for the central processor of computer
US5594623A (en) * 1994-09-21 1997-01-14 Hewlett-Packard Co Method and apparatus for attaching a heat sink and a fan to an integrated circuit package
US5864464A (en) * 1997-06-09 1999-01-26 Lin; Alex Heat sink for integrated circuit
US5940269A (en) * 1998-02-10 1999-08-17 D-Link Corporation Heat sink assembly for an electronic device
US6118657A (en) * 1995-06-07 2000-09-12 Thermalloy, Inc. Fan attachment clip for heat sink
US6295202B1 (en) * 2000-06-29 2001-09-25 Hewlett-Packard Company Heatsink for actively cooled daughterboard system
US6415852B1 (en) * 2001-01-11 2002-07-09 Foxconn Precision Components Co., Ltd. Heat sink assembly
US6435467B1 (en) * 2000-06-02 2002-08-20 Yaw-Huey Lai Clamping device of cooling fan
US7339792B2 (en) * 2005-12-14 2008-03-04 Evga Corporation Graphics card apparatus with improved heat dissipating assemblies
US7515420B2 (en) * 2007-03-27 2009-04-07 Adc Telecommunications, Inc. Apparatus for transferring heat between two corner surfaces
US7616441B2 (en) * 2007-08-06 2009-11-10 Chin-Fu Horng Graphite heat dissipation apparatus and clamping frame for clamping graphite heat dissipation fin module
US20110002119A1 (en) * 2009-07-01 2011-01-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp with large light emitting angle

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5594623A (en) * 1994-09-21 1997-01-14 Hewlett-Packard Co Method and apparatus for attaching a heat sink and a fan to an integrated circuit package
US6118657A (en) * 1995-06-07 2000-09-12 Thermalloy, Inc. Fan attachment clip for heat sink
US5584339A (en) * 1995-09-08 1996-12-17 Hong; Chen F. Heat sink assembly for the central processor of computer
US5864464A (en) * 1997-06-09 1999-01-26 Lin; Alex Heat sink for integrated circuit
US5940269A (en) * 1998-02-10 1999-08-17 D-Link Corporation Heat sink assembly for an electronic device
US6435467B1 (en) * 2000-06-02 2002-08-20 Yaw-Huey Lai Clamping device of cooling fan
US6295202B1 (en) * 2000-06-29 2001-09-25 Hewlett-Packard Company Heatsink for actively cooled daughterboard system
US6415852B1 (en) * 2001-01-11 2002-07-09 Foxconn Precision Components Co., Ltd. Heat sink assembly
US7339792B2 (en) * 2005-12-14 2008-03-04 Evga Corporation Graphics card apparatus with improved heat dissipating assemblies
US7515420B2 (en) * 2007-03-27 2009-04-07 Adc Telecommunications, Inc. Apparatus for transferring heat between two corner surfaces
US7616441B2 (en) * 2007-08-06 2009-11-10 Chin-Fu Horng Graphite heat dissipation apparatus and clamping frame for clamping graphite heat dissipation fin module
US20110002119A1 (en) * 2009-07-01 2011-01-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp with large light emitting angle

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150079734A1 (en) * 2013-09-18 2015-03-19 Taiwan Semiconductor Manufacturing Company, Ltd. Die-Tracing in Integrated Circuit Manufacturing and Packaging
US9508653B2 (en) * 2013-09-18 2016-11-29 Taiwan Semiconductor Manufacturing Company, Ltd. Die-tracing in integrated circuit manufacturing and packaging
US20180138154A1 (en) * 2016-11-14 2018-05-17 Samsung Electronics Co., Ltd. Semiconductor module
US10529692B2 (en) * 2016-11-14 2020-01-07 Samsung Electronics Co., Ltd. Semiconductor module including package and heat transfer structure
US10593648B2 (en) 2016-11-14 2020-03-17 Samsung Electronics Co., Ltd. Heart transfer label structure
US20200176423A1 (en) * 2016-11-14 2020-06-04 Samsung Electronics Co., Ltd. Semiconductor module
US10840221B2 (en) * 2016-11-14 2020-11-17 Samsung Electronics Co., Ltd. Semiconductor module
TWI764887B (en) * 2016-11-14 2022-05-21 南韓商三星電子股份有限公司 Semiconductor module
US11152278B2 (en) * 2017-10-10 2021-10-19 Bitmain Technologies Inc. Heat sink, integrated circuit chip and circuit board
US11923264B2 (en) 2019-09-20 2024-03-05 Samsung Electronics Co., Ltd. Semiconductor apparatus for discharging heat
US20220408543A1 (en) * 2021-06-22 2022-12-22 Vacon Oy Heatsink cooling arrangement

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Legal Events

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AS Assignment

Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHU, CHING-HUNG;LI, CHANG-MU;REEL/FRAME:022353/0634

Effective date: 20090303

Owner name: HON HAI PRECISION INDUSTRY CO., LTD.,TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHU, CHING-HUNG;LI, CHANG-MU;REEL/FRAME:022353/0634

Effective date: 20090303

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION