US20090301122A1 - Device for cooling, in particular, electronic components, gas cooler and evaporator - Google Patents
Device for cooling, in particular, electronic components, gas cooler and evaporator Download PDFInfo
- Publication number
- US20090301122A1 US20090301122A1 US12/282,273 US28227307A US2009301122A1 US 20090301122 A1 US20090301122 A1 US 20090301122A1 US 28227307 A US28227307 A US 28227307A US 2009301122 A1 US2009301122 A1 US 2009301122A1
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- United States
- Prior art keywords
- evaporator
- coolant
- gas cooler
- filling
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
- F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B45/00—Arrangements for charging or discharging refrigerant
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a device for cooling, in particular of electronic components in accordance with the generic term of Claim 1 as well as a gas cooler for the cooling of a coolant and an evaporator.
- Such a cooling device and such a gas cooler are known from WO 2006/055319 A2.
- the known system exhibits an evaporator for absorption of the heat of an electronic component as well as a condenser for emission of the heat to the environment.
- An ascending pipe extends from an outlet of the evaporator, said ascending pipe discharging in the condenser. In the ascending pipe bubbles of evaporated coolant from the evaporator ascend into the condenser and in this way bring about a circulation of the coolant in the system.
- coolants circuits which are provided with valves for a filling with coolant.
- the valve is conventionally arranged at an expansion valve of the circuit.
- the basic idea of the invention is filling a cooling device with one or more heat exchangers via a filling device on one of the heat exchangers.
- a good accessibility of the filling device in the case of the already installed cooling device is guaranteed, so that the filling device if necessary is simplified.
- the attachment of the filling device for example by means of bonding methods, is under circumstances simplified. For example the distribution or collection containers of the heat exchanger offer if necessary such areas for the attachment of a filling device.
- FIG. 1 shows a perspective view of a device for the cooling of electronic components
- FIG. 2 shows an exploded view of a device for the cooling of electronic components
- FIG. 3 shows a lateral view of a device for the cooling of electronic components
- FIG. 4 shows a longitudinal section of a device for the cooling of electronic components
- FIG. 5 shows a cross-section of a device for the cooling of electronic components
- FIG. 6 shows a view of a device for the cooling of electronic components
- FIG. 7 shows a longitudinal section of a distribution container of a gas cooler
- FIG. 8 shows a lateral view of a device for the cooling of electronic devices
- FIG. 9 shows a perspective view of a clamping device for the pressing of a cooling body against an exothermal component
- FIG. 10 shows six lateral views of a clamping device for the pressing of a cooling body against an exothermal component.
- FIG. 1 shows a cooling device 110 which is provided for the cooling of an exothermal component not shown in the figure, preferably a processor of a computer.
- the cooling device 110 exhibits an evaporator 120 , a condenser 130 , a first coolant conduit 140 and a second coolant conduit hidden in FIG. 1 .
- the first coolant conduit 140 connects an evaporator outlet 150 to a hidden condenser inlet and the second coolant conduit connects a hidden condenser outlet to a likewise hidden evaporator inlet.
- the evaporator 120 is inserted into a clamping device 160 , with which the cooling device 110 is clamped to the exothermal component.
- the condenser 130 exhibits a filling device 165 which is soldered onto a tubular distribution container of the condenser 130 .
- the condenser 130 is bordered framed between an essentially rectangular cover 170 with a recess 180 and an axial ventilator 190 .
- the coolant circuit consisting of the evaporator 120 , the condenser 130 and the first and second coolant conduits is first evacuated prior to use via the filling device 165 and then filled with coolant, wherein preferably the coolant known from technology, R134e, is used.
- the evaporator 120 transmits heat from the exothermal component to the coolant located within, which at least partially evaporates and gets to the condenser 130 via the first coolant conduit 140 .
- the condenser 130 transmits heat from the coolant located within to air, which is driven convectively or by the axial ventilator 190 through a ribbed pipe block of the condenser 130 and flows through the recess 180 .
- the coolant is cooled in the condenser 130 and if necessary at least partially condensed. Subsequently the coolant flows from the condenser 130 via the second coolant conduit back to the evaporator.
- FIG. 2 shows a cooling device 210 which essentially corresponds to the cooling device 110 in FIG. 1 , in exploded view.
- the cooling device 210 exhibits an evaporator 220 , a condenser 230 , a first coolant conduit 240 and a second coolant conduit 245 .
- the first coolant conduit 240 connects an evaporator outlet 250 to a hidden condenser inlet and the second coolant conduit 245 connects a hidden condenser outlet to a likewise hidden evaporator inlet.
- the evaporator 220 is inserted into a clamping device 260 , to which the cooling device 210 in FIG. 2 is clamped downward to the exothermal component.
- the clamping device 260 exhibits for this purpose a first tension element 262 and a second tension element 263 as well as a clamping web 264 arranged between the first and second tension elements.
- the first tension element 262 constructed as an eye and in FIG.
- the condenser 230 exhibits a filling device 265 which is soldered onto a tubular distribution container 232 of the condenser 230 .
- the condenser 230 is mounted between an essentially rectangular cover 270 with a frame 275 encompassing the condenser 230 and a recess 280 on the one side and an axial ventilator 290 on the other side.
- the evaporator 220 transmits heat from the exothermal component via a heat sink paste located in a protective covering and a cooling plate 224 to the coolant located within, which at least partially evaporates.
- the cooling plate preferably exhibits cooling elements, such as for example ribs, burls or pins, which protrude into the evaporator, in order to be circumflowed by coolant.
- a lid 226 closes the evaporator 220 and if necessary absorbs the cooling elements.
- the coolant gets to the condenser 230 via the first coolant conduit 240 .
- the condenser 230 transmits heat from the coolant to air, which is driven convectively or by the axial ventilator 290 through a ribbed pipe block 234 of the condenser 230 and flows through the recess 280 of the cover 270 .
- the axial ventilator 290 exhibits for this purpose a ventilator wheel with a hub 292 , ventilator blades 294 and an outer ring 296 , which rotates in a ventilator housing 298 , driven by an electric ventilator motor hidden by the hub.
- the coolant flows through a hidden condenser inlet into the distribution container 232 of the condenser and is distributed to the flat pipe 236 of the ribbed pipe block 232 , which in turn is soldered into pipe openings of the distribution container 232 .
- the cooled and if necessary condensed coolant is collected in the collection container 238 and subsequently flows via a condenser outlet over the second coolant conduit 245 back to the evaporator 220 .
- the condenser 230 and preferably also the evaporator 230 and the first and second coolant conduits are made of metal, preferably aluminum or an alloy, preferably aluminum alloy, and soldered.
- the cover 270 , the individual parts of the axial ventilator 290 with the exception of the ventilator motor and/or the clamping device 260 are preferably made of plastic, preferably by means of an injection molding process.
- FIG. 3 shows a cooling device 310 in a lateral view.
- the cooling device exhibits an evaporator 320 , a condenser 330 , a first coolant conduit 340 and a second coolant conduit 345 .
- the first coolant conduit 340 connects an evaporator outlet 350 to a condenser inlet hidden by a cover 370 and the second coolant conduit 345 connects a hidden condenser outlet to an evaporator inlet 352 .
- An axial ventilator 390 connects to the condenser 330 and is located near the evaporator 320 , so that between the axial ventilator 390 and the evaporator 320 no room remains for the placement of a clamping device.
- the evaporator 320 transmits heat from an exothermal component via a cooling plate 324 to a coolant located within, which evaporates at least partially.
- a lid 326 closes the evaporator 320 and if necessary absorbs existing cooling elements.
- the coolant gets to the condenser 330 via the first coolant conduit 340 .
- the condenser 330 transmits heat from the coolant to air, which driven convectively or by the axial ventilator 390 flows through the condenser 330 .
- After a heat transfer to the air the cooled and if necessary condensed coolant flows via a condenser outlet to the second coolant conduit 345 and from there back to the evaporator 320 .
- the circulation of the coolant is indicated in FIG. 3 by means of arrows.
- the evaporator outlet 350 is arranged geodetically higher than the evaporator inlet 352 . Since if necessary vapor bubbles in the coolant rise up in the evaporator, hence an overflow of the vapor bubbles via the evaporator outlet 350 into the first coolant conduit 340 is supported, an overflow of the vapor bubbles via the evaporator inlet 352 into the second coolant conduit 345 is on the other hand impeded.
- first coolant conduit 340 possesses a diameter preferably larger by one fourth than the second coolant conduit 345 .
- a diameter of 10 mm is advantageous for the first coolant conduit 340 and a diameter of 8 mm is advantageous for the second coolant conduit.
- FIG. 4 shows a cooling device 410 in a longitudinal section.
- the cooling device exhibits an evaporator 420 , a condenser 430 , a first coolant conduit 440 and a second coolant conduit 445 .
- the first coolant conduit 440 connects an evaporator outlet 450 to a condenser inlet 455 and the second coolant conduit 445 connects a condenser outlet 458 to an evaporator inlet arranged before the plane of projection and thus not visible.
- a coolant represented in black goes from the evaporator 420 via the first coolant conduit 440 via the evaporator outlet 450 , the first coolant conduit 440 and the condenser inlet 455 into an essentially cylindrical distribution container 432 of the condenser 430 .
- the condenser 430 transfers heat from the coolant to air, which flows through the ribbed pipe block 434 of the condenser 430 . After a heat transfer to the air the cooled and if necessary condensed coolant is collected in a collection container 438 and flows via the condenser outlet 458 into the second coolant conduit 445 and from there back to the evaporator 420 .
- the evaporator outlet 450 is arranged geodetically higher than the evaporator inlet.
- the circulation of the coolant is supported by the fact that the first coolant conduit 440 possesses a diameter preferably larger by one fourth than the second coolant conduit 445 .
- a diameter of 10 mm is advantageous for the first coolant conduit 440 and a diameter of 8 mm is advantageous for the second coolant conduit.
- advantageous for the circulation of the coolant are the at least horizontal course and for the most part continuous ascent of the first coolant conduit 440 as well as the continuous descent of the second coolant conduit 445 .
- a simple style is given under circumstances through the provision of a collar 451 projecting outward at the evaporator outlet 450 and/or of a collar 459 projecting outward at the condenser outlet 458 .
- collars 451 and 459 each have a similar or larger interior diameter than the first and second coolant conduits respectively, so that no bottleneck comes into being for the coolant.
- the first and the second coolant conduits then exhibit a first flared pipe end 441 and a second flared pipe end 446 for the slipping on with inside diameters which correspond to the outside dimensions of collars 451 and 459 respectively.
- FIG. 5 shows a cooling device 510 in cross-section which corresponds essentially to the cooling device 410 in FIG. 4 .
- the cooling device 510 exhibits an evaporator 520 , a condenser 530 , a first coolant conduit not arranged in the plane of projection and a second coolant conduit 545 .
- the second coolant conduit 545 connects a condenser outlet 558 to an evaporator inlet 552 and leaves the plane of projection section by section and is therefore not completely represented.
- pipe openings 531 are provided in which flat pipes 536 are inserted and soldered.
- the flat pipes 536 are divided by longitudinal partitions 539 into flow channels 535 wherein the flow channels 535 during a condensation of the coolant are partially filled with coolant and in which the condensed coolant is likewise cooled.
- a simple style is given under circumstances through the provision of a collar 559 projecting outward at the evaporator outlet 558 .
- the collar 459 has a similar or larger interior diameter than the second coolant conduit 545 , so that no bottleneck comes into being for the coolant.
- the second coolant conduit 545 exhibits a second flared pipe end 546 for the slipping on with inside diameters which correspond to the outside dimensions of the collar 459 .
- FIG. 6 shows a cooling device 610 which is provided for the cooling of an exothermal component not shown in the figure, preferably a processor of a computer.
- the cooling device 610 exhibits an evaporator 620 , a condenser 630 , a first coolant conduit 640 and a second coolant conduit 645 .
- the evaporator 620 is inserted into a clamping device 660 , with which the cooling device 610 is clamped to the exothermal component.
- the condenser 630 exhibits a filling device 665 which is soldered onto a tubular distribution container 632 of the condenser 630 .
- the condenser 130 is framed between a cover not shown in the figure and an axial ventilator 690 .
- the coolant circuit consisting of the evaporator 620 , the condenser 630 and the first and second coolant conduits is first evacuated prior to use via the filling device 665 and then filled with coolant.
- FIG. 7 shows Section A-A from FIG. 6 .
- the distribution container 632 exhibits a condenser inlet 665 for an insertion and soldering of the first coolant conduit 640 as well as a filling opening 656 for a soldering of the filling device 665 .
- the essentially cylindrical filling device 665 is arranged longitudinally as a connecting piece on the tubular distribution container 632 .
- a third coolant conduit is connected to a valve housing 666 of the filling device constructed as a valve, by screwing a coupling element arranged on the end of the third coolant conduit to the valve housing 666 .
- the coupling element shifts a valve insert 668 in a channel 669 in FIG. 7 to the left to a filling position, wherein a spring element within the valve insert 668 not shown in the figure which is supported via a stop element 667 at the filling opening 656 of the distribution container 632 or on the valve housing 66 , is clamped.
- the cooling device 610 is first evacuated via the channel released by the valve insert 668 in the filling position and is subsequently filled with coolant via the third coolant conduit and the channel 669 . Subsequently the coupling element is again unscrewed from the filling device, wherein the spring element in the valve insert 668 , under circumstances supported by an excess pressure of the coolant in the cooling device 610 , moves the valve insert 668 in FIG. 7 to the right into a locking position in which the valve insert 668 locks the channel 669 and seals it by means of at least one sealing ring.
- FIG. 8 shows the cooling device 610 from FIG. 6 in a lateral view.
- the ribbed pipe system 634 is in the process arranged between the cylindrical distribution container 632 and a likewise collection container 638 of the condenser 630 .
- the filling device is arranged at a right angle to the ribbed pipe system on the distribution container.
- FIG. 9 shows a clamping device 910 which is provided for a pressing of a cooling body against an exothermal component, for example against a processor of a computer, in a perspective view.
- the clamping device 910 exhibits a first tension element 920 and a second tension element 930 as well as a clamping web 940 arranged between the first and second tension elements.
- the clamping web 940 exhibits a fixture 950 for a cooling body as well as a hidden first holding element 960 and a second holding element 970 .
- the cooling body exhibits a stop pointing upward for the clamping device 910 so that the clamping device 910 is fixed on the cooling body after the insertion of the cooling body into the fixture 950 .
- the first and or second coolant conduit firmly connected to the evaporator, in particular soldered serves as a stop.
- the cooling body arrangement obtained in this manner is finally clamped to the exothermal component or to a frame connected therewith, for example an electronic board electronic board.
- a frame connected therewith for example an electronic board electronic board.
- the first tension element 920 constructed as an eye is mounted on the frame and subsequently the second tension element 930 is pressed downward and likewise mounted in a nose.
- the clamping device 910 exhibits a fixture 980 for a tool in the region of the second tension element 930 , such as for example a screwdriver.
- FIG. 10 shows six lateral views of a clamping device 1010 which corresponds essentially to the clamping device 910 in FIG. 9 , from six different sides.
- the clamping device 1010 exhibits a first tension element 1020 and a second tension element 1030 as well as a clamping web 1040 arranged in between.
- the clamping web 1040 exhibits a receptacle 1050 for a cooling body as well as a first holding element 1060 and a second holding element 1070 .
- the cooling body arrangement obtained in this manner is finally clamped to the exothermal component or to a frame connected therewith, for example an electronic board.
- first the first tension element 920 constructed as an eye is mounted on the frame and subsequently the second tension element 930 is pressed downward and likewise mounted in a nose.
- the clamping device 910 exhibits a fixture 980 for a tool in the region of the second tension element 930 , such as for example a screwdriver.
- the second tension element 1030 is constructed as a bracket that can be swiveled outward, preferably a metal bracket and exhibits a projection 1035 as an assembly aid.
- the second tension element 1030 can with this be easily swiveled into the counterpart provided for this purpose, for example into a nose and subsequently be released.
- the clamping web 1040 is then clamped and produces a tension force which is transferred via the tension elements as tensile force and via the cooling body as compression force to the exothermal component, so that a sufficient heat transfer from the exothermal component to the cooling body is guaranteed.
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- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Filling Or Discharging Of Gas Storage Vessels (AREA)
Abstract
Description
- The invention relates to a device for cooling, in particular of electronic components in accordance with the generic term of Claim 1 as well as a gas cooler for the cooling of a coolant and an evaporator.
- Such a cooling device and such a gas cooler are known from WO 2006/055319 A2. The known system exhibits an evaporator for absorption of the heat of an electronic component as well as a condenser for emission of the heat to the environment. An ascending pipe extends from an outlet of the evaporator, said ascending pipe discharging in the condenser. In the ascending pipe bubbles of evaporated coolant from the evaporator ascend into the condenser and in this way bring about a circulation of the coolant in the system.
- Additionally, coolants circuits are known which are provided with valves for a filling with coolant. For example, in order to fill a coolant circuit installed in a motor vehicle with coolant, the valve is conventionally arranged at an expansion valve of the circuit.
- It is the object of the present invention to simplify the filling of a device for cooling of the initially named type.
- This problem is solved by a device for cooling with the features of Claim 1, by a gas cooler with the features of Claim 17 as well as by an evaporator with the features of Claim 18.
- The basic idea of the invention is filling a cooling device with one or more heat exchangers via a filling device on one of the heat exchangers. In this way under circumstances a good accessibility of the filling device in the case of the already installed cooling device is guaranteed, so that the filling device if necessary is simplified. In the case that greater areas are available on the heat exchangers than on other components of the coolant circuit, the attachment of the filling device, for example by means of bonding methods, is under circumstances simplified. For example the distribution or collection containers of the heat exchanger offer if necessary such areas for the attachment of a filling device.
- Advantageous embodiments are the subject matter of the dependent claims and/or are explained more closely in the following in reference to the drawings. The figures show the following:
-
FIG. 1 shows a perspective view of a device for the cooling of electronic components, -
FIG. 2 shows an exploded view of a device for the cooling of electronic components, -
FIG. 3 shows a lateral view of a device for the cooling of electronic components, -
FIG. 4 shows a longitudinal section of a device for the cooling of electronic components, -
FIG. 5 shows a cross-section of a device for the cooling of electronic components, -
FIG. 6 shows a view of a device for the cooling of electronic components, -
FIG. 7 shows a longitudinal section of a distribution container of a gas cooler, -
FIG. 8 shows a lateral view of a device for the cooling of electronic devices, -
FIG. 9 shows a perspective view of a clamping device for the pressing of a cooling body against an exothermal component, and -
FIG. 10 shows six lateral views of a clamping device for the pressing of a cooling body against an exothermal component. -
FIG. 1 shows acooling device 110 which is provided for the cooling of an exothermal component not shown in the figure, preferably a processor of a computer. Thecooling device 110 exhibits anevaporator 120, acondenser 130, afirst coolant conduit 140 and a second coolant conduit hidden inFIG. 1 . Thefirst coolant conduit 140 connects anevaporator outlet 150 to a hidden condenser inlet and the second coolant conduit connects a hidden condenser outlet to a likewise hidden evaporator inlet. Theevaporator 120 is inserted into aclamping device 160, with which thecooling device 110 is clamped to the exothermal component. - The
condenser 130 exhibits afilling device 165 which is soldered onto a tubular distribution container of thecondenser 130. Thecondenser 130 is bordered framed between an essentiallyrectangular cover 170 with arecess 180 and anaxial ventilator 190. - The coolant circuit consisting of the
evaporator 120, thecondenser 130 and the first and second coolant conduits is first evacuated prior to use via thefilling device 165 and then filled with coolant, wherein preferably the coolant known from technology, R134e, is used. - In operation the
evaporator 120 transmits heat from the exothermal component to the coolant located within, which at least partially evaporates and gets to thecondenser 130 via thefirst coolant conduit 140. Thecondenser 130 transmits heat from the coolant located within to air, which is driven convectively or by theaxial ventilator 190 through a ribbed pipe block of thecondenser 130 and flows through therecess 180. Hence the coolant is cooled in thecondenser 130 and if necessary at least partially condensed. Subsequently the coolant flows from thecondenser 130 via the second coolant conduit back to the evaporator. -
FIG. 2 shows acooling device 210 which essentially corresponds to thecooling device 110 inFIG. 1 , in exploded view. Thecooling device 210 exhibits anevaporator 220, acondenser 230, afirst coolant conduit 240 and asecond coolant conduit 245. Thefirst coolant conduit 240 connects anevaporator outlet 250 to a hidden condenser inlet and thesecond coolant conduit 245 connects a hidden condenser outlet to a likewise hidden evaporator inlet. - The
evaporator 220 is inserted into a clamping device 260, to which thecooling device 210 inFIG. 2 is clamped downward to the exothermal component. The clamping device 260 exhibits for this purpose a first tension element 262 and asecond tension element 263 as well as aclamping web 264 arranged between the first and second tension elements. For the pressing of thecooling device 210 against the exothermal component the first tension element 262 constructed as an eye and inFIG. 2 pointing downward is mounted in a counterpart constructed as a nose on the exothermal component or a frame section connected to it and after that the second tension element, likewise constructed as an eye and pointing downward and likewise mounted in a counterpart, as a result of which via the clamping web 264 a tension force acts upon theevaporator 220 inserted into a fixture 266 of the clampingweb 264, said force pressing the evaporator on the exothermal component downward. The clamping direction is thus downward inFIGS. 1 and 2 . - The
condenser 230 exhibits afilling device 265 which is soldered onto atubular distribution container 232 of thecondenser 230. Thecondenser 230 is mounted between an essentiallyrectangular cover 270 with aframe 275 encompassing thecondenser 230 and arecess 280 on the one side and anaxial ventilator 290 on the other side. - In operation the
evaporator 220 transmits heat from the exothermal component via a heat sink paste located in a protective covering and acooling plate 224 to the coolant located within, which at least partially evaporates. For improved heat transfer the cooling plate preferably exhibits cooling elements, such as for example ribs, burls or pins, which protrude into the evaporator, in order to be circumflowed by coolant. A lid 226 closes theevaporator 220 and if necessary absorbs the cooling elements. - The coolant gets to the
condenser 230 via thefirst coolant conduit 240. Thecondenser 230 transmits heat from the coolant to air, which is driven convectively or by theaxial ventilator 290 through a ribbedpipe block 234 of thecondenser 230 and flows through therecess 280 of thecover 270. Theaxial ventilator 290 exhibits for this purpose a ventilator wheel with ahub 292,ventilator blades 294 and anouter ring 296, which rotates in aventilator housing 298, driven by an electric ventilator motor hidden by the hub. - The coolant flows through a hidden condenser inlet into the
distribution container 232 of the condenser and is distributed to theflat pipe 236 of the ribbedpipe block 232, which in turn is soldered into pipe openings of thedistribution container 232. After a heat transfer to the air circumflowing theribs 237 the cooled and if necessary condensed coolant is collected in thecollection container 238 and subsequently flows via a condenser outlet over thesecond coolant conduit 245 back to theevaporator 220. - The
condenser 230 and preferably also theevaporator 230 and the first and second coolant conduits are made of metal, preferably aluminum or an alloy, preferably aluminum alloy, and soldered. Thecover 270, the individual parts of theaxial ventilator 290 with the exception of the ventilator motor and/or the clamping device 260 are preferably made of plastic, preferably by means of an injection molding process. -
FIG. 3 shows acooling device 310 in a lateral view. The cooling device exhibits anevaporator 320, acondenser 330, afirst coolant conduit 340 and asecond coolant conduit 345. Thefirst coolant conduit 340 connects anevaporator outlet 350 to a condenser inlet hidden by acover 370 and thesecond coolant conduit 345 connects a hidden condenser outlet to anevaporator inlet 352. Anaxial ventilator 390 connects to thecondenser 330 and is located near theevaporator 320, so that between theaxial ventilator 390 and theevaporator 320 no room remains for the placement of a clamping device. - In operation the
evaporator 320 transmits heat from an exothermal component via acooling plate 324 to a coolant located within, which evaporates at least partially. Alid 326 closes theevaporator 320 and if necessary absorbs existing cooling elements. - The coolant gets to the
condenser 330 via the firstcoolant conduit 340. Thecondenser 330 transmits heat from the coolant to air, which driven convectively or by theaxial ventilator 390 flows through thecondenser 330. After a heat transfer to the air the cooled and if necessary condensed coolant flows via a condenser outlet to the secondcoolant conduit 345 and from there back to theevaporator 320. The circulation of the coolant is indicated inFIG. 3 by means of arrows. - In order to promote a circulation of the coolant in the desired manner, the
evaporator outlet 350 is arranged geodetically higher than theevaporator inlet 352. Since if necessary vapor bubbles in the coolant rise up in the evaporator, hence an overflow of the vapor bubbles via theevaporator outlet 350 into thefirst coolant conduit 340 is supported, an overflow of the vapor bubbles via theevaporator inlet 352 into thesecond coolant conduit 345 is on the other hand impeded. - In addition to this the circulation of the coolant is supported by the fact that the
first coolant conduit 340 possesses a diameter preferably larger by one fourth than thesecond coolant conduit 345. A diameter of 10 mm is advantageous for thefirst coolant conduit 340 and a diameter of 8 mm is advantageous for the second coolant conduit. - Likewise advantageous for the circulation of the coolant are the at least horizontal course and for the most part continuous ascent of the
first coolant conduit 340 from theevaporator outlet 350 to the condenser inlet as well as the continuous descent of thesecond coolant conduit 345 from the condenser outlet to theevaporator inlet 352. -
FIG. 4 shows acooling device 410 in a longitudinal section. The cooling device exhibits anevaporator 420, acondenser 430, afirst coolant conduit 440 and asecond coolant conduit 445. Thefirst coolant conduit 440 connects anevaporator outlet 450 to acondenser inlet 455 and thesecond coolant conduit 445 connects acondenser outlet 458 to an evaporator inlet arranged before the plane of projection and thus not visible. - A coolant represented in black goes from the
evaporator 420 via thefirst coolant conduit 440 via theevaporator outlet 450, thefirst coolant conduit 440 and thecondenser inlet 455 into an essentiallycylindrical distribution container 432 of thecondenser 430. Thecondenser 430 transfers heat from the coolant to air, which flows through the ribbedpipe block 434 of thecondenser 430. After a heat transfer to the air the cooled and if necessary condensed coolant is collected in acollection container 438 and flows via thecondenser outlet 458 into thesecond coolant conduit 445 and from there back to theevaporator 420. - In order to promote a circulation of the coolant in the desired manner, the
evaporator outlet 450 is arranged geodetically higher than the evaporator inlet. In addition to this the circulation of the coolant is supported by the fact that thefirst coolant conduit 440 possesses a diameter preferably larger by one fourth than thesecond coolant conduit 445. A diameter of 10 mm is advantageous for thefirst coolant conduit 440 and a diameter of 8 mm is advantageous for the second coolant conduit. Likewise advantageous for the circulation of the coolant are the at least horizontal course and for the most part continuous ascent of thefirst coolant conduit 440 as well as the continuous descent of thesecond coolant conduit 445. - It is advantageous to lower the flow resistance for the coolant circulating in the
cooling device 410 by inserting thefirst coolant conduit 440 into thecondenser inlet 455 with an overlap and slipping onto theevaporator outlet 450. A similar advantage is achieved by the fact that thesecond coolant conduit 445 is inserted into the evaporator inlet with an overlap and slipped onto thecondenser outlet 458. As a result of this bottlenecks for the coolant and/or a formation of eddies of the coolant are prevented or at least reduced, so that the circulation of the coolant in the desired direction is promoted in cost-effective and simple structural manner. Through the insertion under circumstances a backflow of condensed coolant into thefirst coolant conduit 440 or of evaporating coolant into thesecond coolant conduit 445 is prevented or at least retarded. - A simple style is given under circumstances through the provision of a
collar 451 projecting outward at theevaporator outlet 450 and/or of acollar 459 projecting outward at thecondenser outlet 458. Preferablycollars pipe end 441 and a second flaredpipe end 446 for the slipping on with inside diameters which correspond to the outside dimensions ofcollars -
FIG. 5 shows acooling device 510 in cross-section which corresponds essentially to thecooling device 410 inFIG. 4 . Thecooling device 510 exhibits anevaporator 520, acondenser 530, a first coolant conduit not arranged in the plane of projection and asecond coolant conduit 545. Thesecond coolant conduit 545 connects acondenser outlet 558 to anevaporator inlet 552 and leaves the plane of projection section by section and is therefore not completely represented. - In the
collection container 558 of thecondenser 530 pipe openings 531 are provided in whichflat pipes 536 are inserted and soldered. Theflat pipes 536 are divided by longitudinal partitions 539 into flow channels 535 wherein the flow channels 535 during a condensation of the coolant are partially filled with coolant and in which the condensed coolant is likewise cooled. - A simple style is given under circumstances through the provision of a
collar 559 projecting outward at theevaporator outlet 558. Preferably thecollar 459 has a similar or larger interior diameter than thesecond coolant conduit 545, so that no bottleneck comes into being for the coolant. Thesecond coolant conduit 545 exhibits a second flaredpipe end 546 for the slipping on with inside diameters which correspond to the outside dimensions of thecollar 459. -
FIG. 6 shows acooling device 610 which is provided for the cooling of an exothermal component not shown in the figure, preferably a processor of a computer. Thecooling device 610 exhibits anevaporator 620, acondenser 630, afirst coolant conduit 640 and asecond coolant conduit 645. Theevaporator 620 is inserted into aclamping device 660, with which thecooling device 610 is clamped to the exothermal component. - The
condenser 630 exhibits afilling device 665 which is soldered onto atubular distribution container 632 of thecondenser 630. Thecondenser 130 is framed between a cover not shown in the figure and anaxial ventilator 690. - The coolant circuit consisting of the
evaporator 620, thecondenser 630 and the first and second coolant conduits is first evacuated prior to use via thefilling device 665 and then filled with coolant. -
FIG. 7 shows Section A-A fromFIG. 6 . Thedistribution container 632 exhibits acondenser inlet 665 for an insertion and soldering of thefirst coolant conduit 640 as well as a fillingopening 656 for a soldering of thefilling device 665. The essentiallycylindrical filling device 665 is arranged longitudinally as a connecting piece on thetubular distribution container 632. - For the filling of the cooling device 610 a third coolant conduit is connected to a
valve housing 666 of the filling device constructed as a valve, by screwing a coupling element arranged on the end of the third coolant conduit to thevalve housing 666. In the process the coupling element shifts avalve insert 668 in achannel 669 inFIG. 7 to the left to a filling position, wherein a spring element within thevalve insert 668 not shown in the figure which is supported via a stop element 667 at the fillingopening 656 of thedistribution container 632 or on the valve housing 66, is clamped. - The
cooling device 610 is first evacuated via the channel released by thevalve insert 668 in the filling position and is subsequently filled with coolant via the third coolant conduit and thechannel 669. Subsequently the coupling element is again unscrewed from the filling device, wherein the spring element in thevalve insert 668, under circumstances supported by an excess pressure of the coolant in thecooling device 610, moves thevalve insert 668 inFIG. 7 to the right into a locking position in which thevalve insert 668 locks thechannel 669 and seals it by means of at least one sealing ring. -
FIG. 8 shows thecooling device 610 fromFIG. 6 in a lateral view. Theribbed pipe system 634 is in the process arranged between thecylindrical distribution container 632 and a likewisecollection container 638 of thecondenser 630. The filling device is arranged at a right angle to the ribbed pipe system on the distribution container. As a result of this a space saving style is achieved with simultaneous accessibility of the filling device. -
FIG. 9 shows aclamping device 910 which is provided for a pressing of a cooling body against an exothermal component, for example against a processor of a computer, in a perspective view. Theclamping device 910 exhibits a first tension element 920 and asecond tension element 930 as well as a clampingweb 940 arranged between the first and second tension elements. The clampingweb 940 exhibits afixture 950 for a cooling body as well as a hiddenfirst holding element 960 and asecond holding element 970. - For the pressing of the cooling body against the exothermal component first the cooling body in
FIG. 9 in inserted into the fixture from above. A lateral first projection of the cooling body is in the process slipped under the holdingelement 960 constructed as a recess, whereupon a second projection of the cooling body lying opposite the first projection is pressed under thesecond holding element 970. This is made possible by an elastic receding of the rearpartial web 945 of the clampingweb 940 and is facilitated by asloping ramp 975 of thesecond holding element 970. - In the case of the use of an evaporator in accordance with any one of
FIGS. 1 through 8 for example an overlap of the cooling plate opposite the lid of the evaporator serves as a projection. - Advantageously the cooling body exhibits a stop pointing upward for the
clamping device 910 so that theclamping device 910 is fixed on the cooling body after the insertion of the cooling body into thefixture 950. In the case of the use of an evaporator in accordance with any one ofFIGS. 1 through 8 for example the first and or second coolant conduit firmly connected to the evaporator, in particular soldered, serves as a stop. - The cooling body arrangement obtained in this manner is finally clamped to the exothermal component or to a frame connected therewith, for example an electronic board electronic board. For this purpose first the first tension element 920 constructed as an eye is mounted on the frame and subsequently the
second tension element 930 is pressed downward and likewise mounted in a nose. In order to facilitate the pressing downward, theclamping device 910 exhibits afixture 980 for a tool in the region of thesecond tension element 930, such as for example a screwdriver. -
FIG. 10 shows six lateral views of aclamping device 1010 which corresponds essentially to theclamping device 910 inFIG. 9 , from six different sides. Theclamping device 1010 exhibits afirst tension element 1020 and asecond tension element 1030 as well as a clampingweb 1040 arranged in between. The clampingweb 1040 exhibits areceptacle 1050 for a cooling body as well as afirst holding element 1060 and asecond holding element 1070. - For the pressing of the cooling body against the exothermal component first the cooling body in
FIG. 9 in inserted into the fixture from above. A lateral first Projection of the cooling body is in the process slipped under the holdingelement 960 constructed as a recess, whereupon a second projection of the cooling body lying opposite the first projection is pressed under thesecond holding element 970. This is made possible by an elastic receding of the rearpartial web 945 of the clampingweb 940 and is facilitated by asloping ramp 975 of thesecond holding element 970. In the case of the use of an evaporator in accordance with any one ofFIGS. 1 through 8 for example an overlap of the cooling plate opposite the lid of the evaporator serves as a projection. - The cooling body arrangement obtained in this manner is finally clamped to the exothermal component or to a frame connected therewith, for example an electronic board. For this purpose first the first tension element 920 constructed as an eye is mounted on the frame and subsequently the
second tension element 930 is pressed downward and likewise mounted in a nose. In order to facilitate the pressing downward, theclamping device 910 exhibits afixture 980 for a tool in the region of thesecond tension element 930, such as for example a screwdriver. - In addition to this the
second tension element 1030 is constructed as a bracket that can be swiveled outward, preferably a metal bracket and exhibits aprojection 1035 as an assembly aid. Thesecond tension element 1030 can with this be easily swiveled into the counterpart provided for this purpose, for example into a nose and subsequently be released. The clampingweb 1040 is then clamped and produces a tension force which is transferred via the tension elements as tensile force and via the cooling body as compression force to the exothermal component, so that a sufficient heat transfer from the exothermal component to the cooling body is guaranteed.
Claims (18)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006011331.4 | 2006-03-09 | ||
DE102006011331A DE102006011331A1 (en) | 2006-03-09 | 2006-03-09 | Apparatus for cooling, in particular electronic components, gas coolers and evaporators |
PCT/EP2007/002023 WO2007101694A2 (en) | 2006-03-09 | 2007-03-08 | Device comprising a gas cooler and evaporator for cooling, in particular, electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
US20090301122A1 true US20090301122A1 (en) | 2009-12-10 |
Family
ID=38336084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/282,273 Abandoned US20090301122A1 (en) | 2006-03-09 | 2007-03-08 | Device for cooling, in particular, electronic components, gas cooler and evaporator |
Country Status (4)
Country | Link |
---|---|
US (1) | US20090301122A1 (en) |
EP (1) | EP1997139A2 (en) |
DE (1) | DE102006011331A1 (en) |
WO (1) | WO2007101694A2 (en) |
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US4554792A (en) * | 1981-07-08 | 1985-11-26 | Margulefsky Allen L | Method and apparatus for rehabilitating refrigerant |
US4539817A (en) * | 1983-12-23 | 1985-09-10 | Staggs Michael J | Refrigerant recovery and charging device |
DE9402680U1 (en) * | 1994-02-18 | 1994-04-21 | Behr Gmbh & Co, 70469 Stuttgart | Connection adapter for filling or removing refrigerant in a refrigerant system |
KR19980019402A (en) * | 1998-03-16 | 1998-06-05 | 천기완 | CPU COOLING DEVICE OF PC |
DE10201557B4 (en) * | 2002-01-17 | 2011-06-30 | Modine Manufacturing Co., Wis. | Evaporative cooling container and method for evacuating and filling the container |
US6714413B1 (en) * | 2002-10-15 | 2004-03-30 | Delphi Technologies, Inc. | Compact thermosiphon with enhanced condenser for electronics cooling |
DE20314532U1 (en) * | 2003-09-16 | 2004-02-19 | Pries, Wulf H. | Device for dissipating heat from electronic and electrical components |
-
2006
- 2006-03-09 DE DE102006011331A patent/DE102006011331A1/en not_active Withdrawn
-
2007
- 2007-03-08 WO PCT/EP2007/002023 patent/WO2007101694A2/en active Application Filing
- 2007-03-08 US US12/282,273 patent/US20090301122A1/en not_active Abandoned
- 2007-03-08 EP EP07723116A patent/EP1997139A2/en not_active Withdrawn
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
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US5010743A (en) * | 1989-12-15 | 1991-04-30 | Richard E. Glaser | Test fitting adapter for refrigerant lines |
US5203399A (en) * | 1990-05-16 | 1993-04-20 | Kabushiki Kaisha Toshiba | Heat transfer apparatus |
US5159972A (en) * | 1991-03-21 | 1992-11-03 | Florida Power Corporation | Controllable heat pipes for thermal energy transfer |
US5458189A (en) * | 1993-09-10 | 1995-10-17 | Aavid Laboratories | Two-phase component cooler |
US5647430A (en) * | 1995-03-20 | 1997-07-15 | Calsonic Corporation | Electronic component cooling unit |
US6125644A (en) * | 1998-04-03 | 2000-10-03 | United Microelectronics, Corp. | Container of coolant |
US6234240B1 (en) * | 1999-07-01 | 2001-05-22 | Kioan Cheon | Fanless cooling system for computer |
US6525505B2 (en) * | 2000-06-02 | 2003-02-25 | Mannesmann Vdo Ag | Device for driving an air-conditioning compressor |
US6549408B2 (en) * | 2000-11-20 | 2003-04-15 | Global Cooling Bv | CPU cooling device using thermo-siphon |
US20030205363A1 (en) * | 2001-11-09 | 2003-11-06 | International Business Machines Corporation | Enhanced air cooling of electronic devices using fluid phase change heat transfer |
US20030151896A1 (en) * | 2002-02-12 | 2003-08-14 | Roy Zeighami | Loop thermosyphon using microchannel etched semiconductor die as evaporator |
US20050083656A1 (en) * | 2003-09-10 | 2005-04-21 | Hamman Brian A. | Liquid cooling system |
US20050217829A1 (en) * | 2004-03-31 | 2005-10-06 | Alex Belits | Low-profile thermosyphon-based cooling system for computers and other electronic devices |
US7404433B1 (en) * | 2007-01-31 | 2008-07-29 | Man Zai Industrial Co., Ltd. | Liquid cooled heat sink |
Also Published As
Publication number | Publication date |
---|---|
DE102006011331A1 (en) | 2007-09-13 |
EP1997139A2 (en) | 2008-12-03 |
WO2007101694A2 (en) | 2007-09-13 |
WO2007101694A3 (en) | 2007-11-15 |
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