US20090301122A1 - Device for cooling, in particular, electronic components, gas cooler and evaporator - Google Patents

Device for cooling, in particular, electronic components, gas cooler and evaporator Download PDF

Info

Publication number
US20090301122A1
US20090301122A1 US12/282,273 US28227307A US2009301122A1 US 20090301122 A1 US20090301122 A1 US 20090301122A1 US 28227307 A US28227307 A US 28227307A US 2009301122 A1 US2009301122 A1 US 2009301122A1
Authority
US
United States
Prior art keywords
evaporator
coolant
gas cooler
filling
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/282,273
Inventor
Steffan Grözinger
Volker Velte
Henry Madsen
Henrik Olsen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NOISE Ltd APS
Mahle Behr Industry GmbH and Co KG
Original Assignee
Behr Industrieanlagen GmbH and Co KG
Noise Limit ApS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Behr Industrieanlagen GmbH and Co KG, Noise Limit ApS filed Critical Behr Industrieanlagen GmbH and Co KG
Assigned to BEHR INDUSTRY GMBH & CO. KG, NOISE LIMITED APS reassignment BEHR INDUSTRY GMBH & CO. KG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MADSEN, HENRY, OLSEN, HENRIK, GROZINGER, STEFFEN, VELTE, VOLKER
Publication of US20090301122A1 publication Critical patent/US20090301122A1/en
Assigned to BEHR INDUSTRY GMBH & CO. KG reassignment BEHR INDUSTRY GMBH & CO. KG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NOISE LIMIT APS
Abandoned legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B45/00Arrangements for charging or discharging refrigerant
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a device for cooling, in particular of electronic components in accordance with the generic term of Claim 1 as well as a gas cooler for the cooling of a coolant and an evaporator.
  • Such a cooling device and such a gas cooler are known from WO 2006/055319 A2.
  • the known system exhibits an evaporator for absorption of the heat of an electronic component as well as a condenser for emission of the heat to the environment.
  • An ascending pipe extends from an outlet of the evaporator, said ascending pipe discharging in the condenser. In the ascending pipe bubbles of evaporated coolant from the evaporator ascend into the condenser and in this way bring about a circulation of the coolant in the system.
  • coolants circuits which are provided with valves for a filling with coolant.
  • the valve is conventionally arranged at an expansion valve of the circuit.
  • the basic idea of the invention is filling a cooling device with one or more heat exchangers via a filling device on one of the heat exchangers.
  • a good accessibility of the filling device in the case of the already installed cooling device is guaranteed, so that the filling device if necessary is simplified.
  • the attachment of the filling device for example by means of bonding methods, is under circumstances simplified. For example the distribution or collection containers of the heat exchanger offer if necessary such areas for the attachment of a filling device.
  • FIG. 1 shows a perspective view of a device for the cooling of electronic components
  • FIG. 2 shows an exploded view of a device for the cooling of electronic components
  • FIG. 3 shows a lateral view of a device for the cooling of electronic components
  • FIG. 4 shows a longitudinal section of a device for the cooling of electronic components
  • FIG. 5 shows a cross-section of a device for the cooling of electronic components
  • FIG. 6 shows a view of a device for the cooling of electronic components
  • FIG. 7 shows a longitudinal section of a distribution container of a gas cooler
  • FIG. 8 shows a lateral view of a device for the cooling of electronic devices
  • FIG. 9 shows a perspective view of a clamping device for the pressing of a cooling body against an exothermal component
  • FIG. 10 shows six lateral views of a clamping device for the pressing of a cooling body against an exothermal component.
  • FIG. 1 shows a cooling device 110 which is provided for the cooling of an exothermal component not shown in the figure, preferably a processor of a computer.
  • the cooling device 110 exhibits an evaporator 120 , a condenser 130 , a first coolant conduit 140 and a second coolant conduit hidden in FIG. 1 .
  • the first coolant conduit 140 connects an evaporator outlet 150 to a hidden condenser inlet and the second coolant conduit connects a hidden condenser outlet to a likewise hidden evaporator inlet.
  • the evaporator 120 is inserted into a clamping device 160 , with which the cooling device 110 is clamped to the exothermal component.
  • the condenser 130 exhibits a filling device 165 which is soldered onto a tubular distribution container of the condenser 130 .
  • the condenser 130 is bordered framed between an essentially rectangular cover 170 with a recess 180 and an axial ventilator 190 .
  • the coolant circuit consisting of the evaporator 120 , the condenser 130 and the first and second coolant conduits is first evacuated prior to use via the filling device 165 and then filled with coolant, wherein preferably the coolant known from technology, R134e, is used.
  • the evaporator 120 transmits heat from the exothermal component to the coolant located within, which at least partially evaporates and gets to the condenser 130 via the first coolant conduit 140 .
  • the condenser 130 transmits heat from the coolant located within to air, which is driven convectively or by the axial ventilator 190 through a ribbed pipe block of the condenser 130 and flows through the recess 180 .
  • the coolant is cooled in the condenser 130 and if necessary at least partially condensed. Subsequently the coolant flows from the condenser 130 via the second coolant conduit back to the evaporator.
  • FIG. 2 shows a cooling device 210 which essentially corresponds to the cooling device 110 in FIG. 1 , in exploded view.
  • the cooling device 210 exhibits an evaporator 220 , a condenser 230 , a first coolant conduit 240 and a second coolant conduit 245 .
  • the first coolant conduit 240 connects an evaporator outlet 250 to a hidden condenser inlet and the second coolant conduit 245 connects a hidden condenser outlet to a likewise hidden evaporator inlet.
  • the evaporator 220 is inserted into a clamping device 260 , to which the cooling device 210 in FIG. 2 is clamped downward to the exothermal component.
  • the clamping device 260 exhibits for this purpose a first tension element 262 and a second tension element 263 as well as a clamping web 264 arranged between the first and second tension elements.
  • the first tension element 262 constructed as an eye and in FIG.
  • the condenser 230 exhibits a filling device 265 which is soldered onto a tubular distribution container 232 of the condenser 230 .
  • the condenser 230 is mounted between an essentially rectangular cover 270 with a frame 275 encompassing the condenser 230 and a recess 280 on the one side and an axial ventilator 290 on the other side.
  • the evaporator 220 transmits heat from the exothermal component via a heat sink paste located in a protective covering and a cooling plate 224 to the coolant located within, which at least partially evaporates.
  • the cooling plate preferably exhibits cooling elements, such as for example ribs, burls or pins, which protrude into the evaporator, in order to be circumflowed by coolant.
  • a lid 226 closes the evaporator 220 and if necessary absorbs the cooling elements.
  • the coolant gets to the condenser 230 via the first coolant conduit 240 .
  • the condenser 230 transmits heat from the coolant to air, which is driven convectively or by the axial ventilator 290 through a ribbed pipe block 234 of the condenser 230 and flows through the recess 280 of the cover 270 .
  • the axial ventilator 290 exhibits for this purpose a ventilator wheel with a hub 292 , ventilator blades 294 and an outer ring 296 , which rotates in a ventilator housing 298 , driven by an electric ventilator motor hidden by the hub.
  • the coolant flows through a hidden condenser inlet into the distribution container 232 of the condenser and is distributed to the flat pipe 236 of the ribbed pipe block 232 , which in turn is soldered into pipe openings of the distribution container 232 .
  • the cooled and if necessary condensed coolant is collected in the collection container 238 and subsequently flows via a condenser outlet over the second coolant conduit 245 back to the evaporator 220 .
  • the condenser 230 and preferably also the evaporator 230 and the first and second coolant conduits are made of metal, preferably aluminum or an alloy, preferably aluminum alloy, and soldered.
  • the cover 270 , the individual parts of the axial ventilator 290 with the exception of the ventilator motor and/or the clamping device 260 are preferably made of plastic, preferably by means of an injection molding process.
  • FIG. 3 shows a cooling device 310 in a lateral view.
  • the cooling device exhibits an evaporator 320 , a condenser 330 , a first coolant conduit 340 and a second coolant conduit 345 .
  • the first coolant conduit 340 connects an evaporator outlet 350 to a condenser inlet hidden by a cover 370 and the second coolant conduit 345 connects a hidden condenser outlet to an evaporator inlet 352 .
  • An axial ventilator 390 connects to the condenser 330 and is located near the evaporator 320 , so that between the axial ventilator 390 and the evaporator 320 no room remains for the placement of a clamping device.
  • the evaporator 320 transmits heat from an exothermal component via a cooling plate 324 to a coolant located within, which evaporates at least partially.
  • a lid 326 closes the evaporator 320 and if necessary absorbs existing cooling elements.
  • the coolant gets to the condenser 330 via the first coolant conduit 340 .
  • the condenser 330 transmits heat from the coolant to air, which driven convectively or by the axial ventilator 390 flows through the condenser 330 .
  • After a heat transfer to the air the cooled and if necessary condensed coolant flows via a condenser outlet to the second coolant conduit 345 and from there back to the evaporator 320 .
  • the circulation of the coolant is indicated in FIG. 3 by means of arrows.
  • the evaporator outlet 350 is arranged geodetically higher than the evaporator inlet 352 . Since if necessary vapor bubbles in the coolant rise up in the evaporator, hence an overflow of the vapor bubbles via the evaporator outlet 350 into the first coolant conduit 340 is supported, an overflow of the vapor bubbles via the evaporator inlet 352 into the second coolant conduit 345 is on the other hand impeded.
  • first coolant conduit 340 possesses a diameter preferably larger by one fourth than the second coolant conduit 345 .
  • a diameter of 10 mm is advantageous for the first coolant conduit 340 and a diameter of 8 mm is advantageous for the second coolant conduit.
  • FIG. 4 shows a cooling device 410 in a longitudinal section.
  • the cooling device exhibits an evaporator 420 , a condenser 430 , a first coolant conduit 440 and a second coolant conduit 445 .
  • the first coolant conduit 440 connects an evaporator outlet 450 to a condenser inlet 455 and the second coolant conduit 445 connects a condenser outlet 458 to an evaporator inlet arranged before the plane of projection and thus not visible.
  • a coolant represented in black goes from the evaporator 420 via the first coolant conduit 440 via the evaporator outlet 450 , the first coolant conduit 440 and the condenser inlet 455 into an essentially cylindrical distribution container 432 of the condenser 430 .
  • the condenser 430 transfers heat from the coolant to air, which flows through the ribbed pipe block 434 of the condenser 430 . After a heat transfer to the air the cooled and if necessary condensed coolant is collected in a collection container 438 and flows via the condenser outlet 458 into the second coolant conduit 445 and from there back to the evaporator 420 .
  • the evaporator outlet 450 is arranged geodetically higher than the evaporator inlet.
  • the circulation of the coolant is supported by the fact that the first coolant conduit 440 possesses a diameter preferably larger by one fourth than the second coolant conduit 445 .
  • a diameter of 10 mm is advantageous for the first coolant conduit 440 and a diameter of 8 mm is advantageous for the second coolant conduit.
  • advantageous for the circulation of the coolant are the at least horizontal course and for the most part continuous ascent of the first coolant conduit 440 as well as the continuous descent of the second coolant conduit 445 .
  • a simple style is given under circumstances through the provision of a collar 451 projecting outward at the evaporator outlet 450 and/or of a collar 459 projecting outward at the condenser outlet 458 .
  • collars 451 and 459 each have a similar or larger interior diameter than the first and second coolant conduits respectively, so that no bottleneck comes into being for the coolant.
  • the first and the second coolant conduits then exhibit a first flared pipe end 441 and a second flared pipe end 446 for the slipping on with inside diameters which correspond to the outside dimensions of collars 451 and 459 respectively.
  • FIG. 5 shows a cooling device 510 in cross-section which corresponds essentially to the cooling device 410 in FIG. 4 .
  • the cooling device 510 exhibits an evaporator 520 , a condenser 530 , a first coolant conduit not arranged in the plane of projection and a second coolant conduit 545 .
  • the second coolant conduit 545 connects a condenser outlet 558 to an evaporator inlet 552 and leaves the plane of projection section by section and is therefore not completely represented.
  • pipe openings 531 are provided in which flat pipes 536 are inserted and soldered.
  • the flat pipes 536 are divided by longitudinal partitions 539 into flow channels 535 wherein the flow channels 535 during a condensation of the coolant are partially filled with coolant and in which the condensed coolant is likewise cooled.
  • a simple style is given under circumstances through the provision of a collar 559 projecting outward at the evaporator outlet 558 .
  • the collar 459 has a similar or larger interior diameter than the second coolant conduit 545 , so that no bottleneck comes into being for the coolant.
  • the second coolant conduit 545 exhibits a second flared pipe end 546 for the slipping on with inside diameters which correspond to the outside dimensions of the collar 459 .
  • FIG. 6 shows a cooling device 610 which is provided for the cooling of an exothermal component not shown in the figure, preferably a processor of a computer.
  • the cooling device 610 exhibits an evaporator 620 , a condenser 630 , a first coolant conduit 640 and a second coolant conduit 645 .
  • the evaporator 620 is inserted into a clamping device 660 , with which the cooling device 610 is clamped to the exothermal component.
  • the condenser 630 exhibits a filling device 665 which is soldered onto a tubular distribution container 632 of the condenser 630 .
  • the condenser 130 is framed between a cover not shown in the figure and an axial ventilator 690 .
  • the coolant circuit consisting of the evaporator 620 , the condenser 630 and the first and second coolant conduits is first evacuated prior to use via the filling device 665 and then filled with coolant.
  • FIG. 7 shows Section A-A from FIG. 6 .
  • the distribution container 632 exhibits a condenser inlet 665 for an insertion and soldering of the first coolant conduit 640 as well as a filling opening 656 for a soldering of the filling device 665 .
  • the essentially cylindrical filling device 665 is arranged longitudinally as a connecting piece on the tubular distribution container 632 .
  • a third coolant conduit is connected to a valve housing 666 of the filling device constructed as a valve, by screwing a coupling element arranged on the end of the third coolant conduit to the valve housing 666 .
  • the coupling element shifts a valve insert 668 in a channel 669 in FIG. 7 to the left to a filling position, wherein a spring element within the valve insert 668 not shown in the figure which is supported via a stop element 667 at the filling opening 656 of the distribution container 632 or on the valve housing 66 , is clamped.
  • the cooling device 610 is first evacuated via the channel released by the valve insert 668 in the filling position and is subsequently filled with coolant via the third coolant conduit and the channel 669 . Subsequently the coupling element is again unscrewed from the filling device, wherein the spring element in the valve insert 668 , under circumstances supported by an excess pressure of the coolant in the cooling device 610 , moves the valve insert 668 in FIG. 7 to the right into a locking position in which the valve insert 668 locks the channel 669 and seals it by means of at least one sealing ring.
  • FIG. 8 shows the cooling device 610 from FIG. 6 in a lateral view.
  • the ribbed pipe system 634 is in the process arranged between the cylindrical distribution container 632 and a likewise collection container 638 of the condenser 630 .
  • the filling device is arranged at a right angle to the ribbed pipe system on the distribution container.
  • FIG. 9 shows a clamping device 910 which is provided for a pressing of a cooling body against an exothermal component, for example against a processor of a computer, in a perspective view.
  • the clamping device 910 exhibits a first tension element 920 and a second tension element 930 as well as a clamping web 940 arranged between the first and second tension elements.
  • the clamping web 940 exhibits a fixture 950 for a cooling body as well as a hidden first holding element 960 and a second holding element 970 .
  • the cooling body exhibits a stop pointing upward for the clamping device 910 so that the clamping device 910 is fixed on the cooling body after the insertion of the cooling body into the fixture 950 .
  • the first and or second coolant conduit firmly connected to the evaporator, in particular soldered serves as a stop.
  • the cooling body arrangement obtained in this manner is finally clamped to the exothermal component or to a frame connected therewith, for example an electronic board electronic board.
  • a frame connected therewith for example an electronic board electronic board.
  • the first tension element 920 constructed as an eye is mounted on the frame and subsequently the second tension element 930 is pressed downward and likewise mounted in a nose.
  • the clamping device 910 exhibits a fixture 980 for a tool in the region of the second tension element 930 , such as for example a screwdriver.
  • FIG. 10 shows six lateral views of a clamping device 1010 which corresponds essentially to the clamping device 910 in FIG. 9 , from six different sides.
  • the clamping device 1010 exhibits a first tension element 1020 and a second tension element 1030 as well as a clamping web 1040 arranged in between.
  • the clamping web 1040 exhibits a receptacle 1050 for a cooling body as well as a first holding element 1060 and a second holding element 1070 .
  • the cooling body arrangement obtained in this manner is finally clamped to the exothermal component or to a frame connected therewith, for example an electronic board.
  • first the first tension element 920 constructed as an eye is mounted on the frame and subsequently the second tension element 930 is pressed downward and likewise mounted in a nose.
  • the clamping device 910 exhibits a fixture 980 for a tool in the region of the second tension element 930 , such as for example a screwdriver.
  • the second tension element 1030 is constructed as a bracket that can be swiveled outward, preferably a metal bracket and exhibits a projection 1035 as an assembly aid.
  • the second tension element 1030 can with this be easily swiveled into the counterpart provided for this purpose, for example into a nose and subsequently be released.
  • the clamping web 1040 is then clamped and produces a tension force which is transferred via the tension elements as tensile force and via the cooling body as compression force to the exothermal component, so that a sufficient heat transfer from the exothermal component to the cooling body is guaranteed.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)

Abstract

A device for cooling, in particular electronic components, in particular of a processor unit, having an evaporator for the absorption of heat in a coolant in particular by means of evaporation; a gas cooler for cooling of the coolant in particular by means of condensation; a first coolant conduit for communicating connection of an evaporator outlet with a gas cooler inlet; a second coolant conduit for communicating connection of a gas cooler outlet with an evaporator inlet; a filling device for filling of the device with coolant; and the filling device is arranged on the evaporator or on the gas cooler.

Description

  • The invention relates to a device for cooling, in particular of electronic components in accordance with the generic term of Claim 1 as well as a gas cooler for the cooling of a coolant and an evaporator.
  • Such a cooling device and such a gas cooler are known from WO 2006/055319 A2. The known system exhibits an evaporator for absorption of the heat of an electronic component as well as a condenser for emission of the heat to the environment. An ascending pipe extends from an outlet of the evaporator, said ascending pipe discharging in the condenser. In the ascending pipe bubbles of evaporated coolant from the evaporator ascend into the condenser and in this way bring about a circulation of the coolant in the system.
  • Additionally, coolants circuits are known which are provided with valves for a filling with coolant. For example, in order to fill a coolant circuit installed in a motor vehicle with coolant, the valve is conventionally arranged at an expansion valve of the circuit.
  • It is the object of the present invention to simplify the filling of a device for cooling of the initially named type.
  • This problem is solved by a device for cooling with the features of Claim 1, by a gas cooler with the features of Claim 17 as well as by an evaporator with the features of Claim 18.
  • The basic idea of the invention is filling a cooling device with one or more heat exchangers via a filling device on one of the heat exchangers. In this way under circumstances a good accessibility of the filling device in the case of the already installed cooling device is guaranteed, so that the filling device if necessary is simplified. In the case that greater areas are available on the heat exchangers than on other components of the coolant circuit, the attachment of the filling device, for example by means of bonding methods, is under circumstances simplified. For example the distribution or collection containers of the heat exchanger offer if necessary such areas for the attachment of a filling device.
  • Advantageous embodiments are the subject matter of the dependent claims and/or are explained more closely in the following in reference to the drawings. The figures show the following:
  • FIG. 1 shows a perspective view of a device for the cooling of electronic components,
  • FIG. 2 shows an exploded view of a device for the cooling of electronic components,
  • FIG. 3 shows a lateral view of a device for the cooling of electronic components,
  • FIG. 4 shows a longitudinal section of a device for the cooling of electronic components,
  • FIG. 5 shows a cross-section of a device for the cooling of electronic components,
  • FIG. 6 shows a view of a device for the cooling of electronic components,
  • FIG. 7 shows a longitudinal section of a distribution container of a gas cooler,
  • FIG. 8 shows a lateral view of a device for the cooling of electronic devices,
  • FIG. 9 shows a perspective view of a clamping device for the pressing of a cooling body against an exothermal component, and
  • FIG. 10 shows six lateral views of a clamping device for the pressing of a cooling body against an exothermal component.
  • FIG. 1 shows a cooling device 110 which is provided for the cooling of an exothermal component not shown in the figure, preferably a processor of a computer. The cooling device 110 exhibits an evaporator 120, a condenser 130, a first coolant conduit 140 and a second coolant conduit hidden in FIG. 1. The first coolant conduit 140 connects an evaporator outlet 150 to a hidden condenser inlet and the second coolant conduit connects a hidden condenser outlet to a likewise hidden evaporator inlet. The evaporator 120 is inserted into a clamping device 160, with which the cooling device 110 is clamped to the exothermal component.
  • The condenser 130 exhibits a filling device 165 which is soldered onto a tubular distribution container of the condenser 130. The condenser 130 is bordered framed between an essentially rectangular cover 170 with a recess 180 and an axial ventilator 190.
  • The coolant circuit consisting of the evaporator 120, the condenser 130 and the first and second coolant conduits is first evacuated prior to use via the filling device 165 and then filled with coolant, wherein preferably the coolant known from technology, R134e, is used.
  • In operation the evaporator 120 transmits heat from the exothermal component to the coolant located within, which at least partially evaporates and gets to the condenser 130 via the first coolant conduit 140. The condenser 130 transmits heat from the coolant located within to air, which is driven convectively or by the axial ventilator 190 through a ribbed pipe block of the condenser 130 and flows through the recess 180. Hence the coolant is cooled in the condenser 130 and if necessary at least partially condensed. Subsequently the coolant flows from the condenser 130 via the second coolant conduit back to the evaporator.
  • FIG. 2 shows a cooling device 210 which essentially corresponds to the cooling device 110 in FIG. 1, in exploded view. The cooling device 210 exhibits an evaporator 220, a condenser 230, a first coolant conduit 240 and a second coolant conduit 245. The first coolant conduit 240 connects an evaporator outlet 250 to a hidden condenser inlet and the second coolant conduit 245 connects a hidden condenser outlet to a likewise hidden evaporator inlet.
  • The evaporator 220 is inserted into a clamping device 260, to which the cooling device 210 in FIG. 2 is clamped downward to the exothermal component. The clamping device 260 exhibits for this purpose a first tension element 262 and a second tension element 263 as well as a clamping web 264 arranged between the first and second tension elements. For the pressing of the cooling device 210 against the exothermal component the first tension element 262 constructed as an eye and in FIG. 2 pointing downward is mounted in a counterpart constructed as a nose on the exothermal component or a frame section connected to it and after that the second tension element, likewise constructed as an eye and pointing downward and likewise mounted in a counterpart, as a result of which via the clamping web 264 a tension force acts upon the evaporator 220 inserted into a fixture 266 of the clamping web 264, said force pressing the evaporator on the exothermal component downward. The clamping direction is thus downward in FIGS. 1 and 2.
  • The condenser 230 exhibits a filling device 265 which is soldered onto a tubular distribution container 232 of the condenser 230. The condenser 230 is mounted between an essentially rectangular cover 270 with a frame 275 encompassing the condenser 230 and a recess 280 on the one side and an axial ventilator 290 on the other side.
  • In operation the evaporator 220 transmits heat from the exothermal component via a heat sink paste located in a protective covering and a cooling plate 224 to the coolant located within, which at least partially evaporates. For improved heat transfer the cooling plate preferably exhibits cooling elements, such as for example ribs, burls or pins, which protrude into the evaporator, in order to be circumflowed by coolant. A lid 226 closes the evaporator 220 and if necessary absorbs the cooling elements.
  • The coolant gets to the condenser 230 via the first coolant conduit 240. The condenser 230 transmits heat from the coolant to air, which is driven convectively or by the axial ventilator 290 through a ribbed pipe block 234 of the condenser 230 and flows through the recess 280 of the cover 270. The axial ventilator 290 exhibits for this purpose a ventilator wheel with a hub 292, ventilator blades 294 and an outer ring 296, which rotates in a ventilator housing 298, driven by an electric ventilator motor hidden by the hub.
  • The coolant flows through a hidden condenser inlet into the distribution container 232 of the condenser and is distributed to the flat pipe 236 of the ribbed pipe block 232, which in turn is soldered into pipe openings of the distribution container 232. After a heat transfer to the air circumflowing the ribs 237 the cooled and if necessary condensed coolant is collected in the collection container 238 and subsequently flows via a condenser outlet over the second coolant conduit 245 back to the evaporator 220.
  • The condenser 230 and preferably also the evaporator 230 and the first and second coolant conduits are made of metal, preferably aluminum or an alloy, preferably aluminum alloy, and soldered. The cover 270, the individual parts of the axial ventilator 290 with the exception of the ventilator motor and/or the clamping device 260 are preferably made of plastic, preferably by means of an injection molding process.
  • FIG. 3 shows a cooling device 310 in a lateral view. The cooling device exhibits an evaporator 320, a condenser 330, a first coolant conduit 340 and a second coolant conduit 345. The first coolant conduit 340 connects an evaporator outlet 350 to a condenser inlet hidden by a cover 370 and the second coolant conduit 345 connects a hidden condenser outlet to an evaporator inlet 352. An axial ventilator 390 connects to the condenser 330 and is located near the evaporator 320, so that between the axial ventilator 390 and the evaporator 320 no room remains for the placement of a clamping device.
  • In operation the evaporator 320 transmits heat from an exothermal component via a cooling plate 324 to a coolant located within, which evaporates at least partially. A lid 326 closes the evaporator 320 and if necessary absorbs existing cooling elements.
  • The coolant gets to the condenser 330 via the first coolant conduit 340. The condenser 330 transmits heat from the coolant to air, which driven convectively or by the axial ventilator 390 flows through the condenser 330. After a heat transfer to the air the cooled and if necessary condensed coolant flows via a condenser outlet to the second coolant conduit 345 and from there back to the evaporator 320. The circulation of the coolant is indicated in FIG. 3 by means of arrows.
  • In order to promote a circulation of the coolant in the desired manner, the evaporator outlet 350 is arranged geodetically higher than the evaporator inlet 352. Since if necessary vapor bubbles in the coolant rise up in the evaporator, hence an overflow of the vapor bubbles via the evaporator outlet 350 into the first coolant conduit 340 is supported, an overflow of the vapor bubbles via the evaporator inlet 352 into the second coolant conduit 345 is on the other hand impeded.
  • In addition to this the circulation of the coolant is supported by the fact that the first coolant conduit 340 possesses a diameter preferably larger by one fourth than the second coolant conduit 345. A diameter of 10 mm is advantageous for the first coolant conduit 340 and a diameter of 8 mm is advantageous for the second coolant conduit.
  • Likewise advantageous for the circulation of the coolant are the at least horizontal course and for the most part continuous ascent of the first coolant conduit 340 from the evaporator outlet 350 to the condenser inlet as well as the continuous descent of the second coolant conduit 345 from the condenser outlet to the evaporator inlet 352.
  • FIG. 4 shows a cooling device 410 in a longitudinal section. The cooling device exhibits an evaporator 420, a condenser 430, a first coolant conduit 440 and a second coolant conduit 445. The first coolant conduit 440 connects an evaporator outlet 450 to a condenser inlet 455 and the second coolant conduit 445 connects a condenser outlet 458 to an evaporator inlet arranged before the plane of projection and thus not visible.
  • A coolant represented in black goes from the evaporator 420 via the first coolant conduit 440 via the evaporator outlet 450, the first coolant conduit 440 and the condenser inlet 455 into an essentially cylindrical distribution container 432 of the condenser 430. The condenser 430 transfers heat from the coolant to air, which flows through the ribbed pipe block 434 of the condenser 430. After a heat transfer to the air the cooled and if necessary condensed coolant is collected in a collection container 438 and flows via the condenser outlet 458 into the second coolant conduit 445 and from there back to the evaporator 420.
  • In order to promote a circulation of the coolant in the desired manner, the evaporator outlet 450 is arranged geodetically higher than the evaporator inlet. In addition to this the circulation of the coolant is supported by the fact that the first coolant conduit 440 possesses a diameter preferably larger by one fourth than the second coolant conduit 445. A diameter of 10 mm is advantageous for the first coolant conduit 440 and a diameter of 8 mm is advantageous for the second coolant conduit. Likewise advantageous for the circulation of the coolant are the at least horizontal course and for the most part continuous ascent of the first coolant conduit 440 as well as the continuous descent of the second coolant conduit 445.
  • It is advantageous to lower the flow resistance for the coolant circulating in the cooling device 410 by inserting the first coolant conduit 440 into the condenser inlet 455 with an overlap and slipping onto the evaporator outlet 450. A similar advantage is achieved by the fact that the second coolant conduit 445 is inserted into the evaporator inlet with an overlap and slipped onto the condenser outlet 458. As a result of this bottlenecks for the coolant and/or a formation of eddies of the coolant are prevented or at least reduced, so that the circulation of the coolant in the desired direction is promoted in cost-effective and simple structural manner. Through the insertion under circumstances a backflow of condensed coolant into the first coolant conduit 440 or of evaporating coolant into the second coolant conduit 445 is prevented or at least retarded.
  • A simple style is given under circumstances through the provision of a collar 451 projecting outward at the evaporator outlet 450 and/or of a collar 459 projecting outward at the condenser outlet 458. Preferably collars 451 and 459 each have a similar or larger interior diameter than the first and second coolant conduits respectively, so that no bottleneck comes into being for the coolant. The first and the second coolant conduits then exhibit a first flared pipe end 441 and a second flared pipe end 446 for the slipping on with inside diameters which correspond to the outside dimensions of collars 451 and 459 respectively.
  • FIG. 5 shows a cooling device 510 in cross-section which corresponds essentially to the cooling device 410 in FIG. 4. The cooling device 510 exhibits an evaporator 520, a condenser 530, a first coolant conduit not arranged in the plane of projection and a second coolant conduit 545. The second coolant conduit 545 connects a condenser outlet 558 to an evaporator inlet 552 and leaves the plane of projection section by section and is therefore not completely represented.
  • In the collection container 558 of the condenser 530 pipe openings 531 are provided in which flat pipes 536 are inserted and soldered. The flat pipes 536 are divided by longitudinal partitions 539 into flow channels 535 wherein the flow channels 535 during a condensation of the coolant are partially filled with coolant and in which the condensed coolant is likewise cooled.
  • A simple style is given under circumstances through the provision of a collar 559 projecting outward at the evaporator outlet 558. Preferably the collar 459 has a similar or larger interior diameter than the second coolant conduit 545, so that no bottleneck comes into being for the coolant. The second coolant conduit 545 exhibits a second flared pipe end 546 for the slipping on with inside diameters which correspond to the outside dimensions of the collar 459.
  • FIG. 6 shows a cooling device 610 which is provided for the cooling of an exothermal component not shown in the figure, preferably a processor of a computer. The cooling device 610 exhibits an evaporator 620, a condenser 630, a first coolant conduit 640 and a second coolant conduit 645. The evaporator 620 is inserted into a clamping device 660, with which the cooling device 610 is clamped to the exothermal component.
  • The condenser 630 exhibits a filling device 665 which is soldered onto a tubular distribution container 632 of the condenser 630. The condenser 130 is framed between a cover not shown in the figure and an axial ventilator 690.
  • The coolant circuit consisting of the evaporator 620, the condenser 630 and the first and second coolant conduits is first evacuated prior to use via the filling device 665 and then filled with coolant.
  • FIG. 7 shows Section A-A from FIG. 6. The distribution container 632 exhibits a condenser inlet 665 for an insertion and soldering of the first coolant conduit 640 as well as a filling opening 656 for a soldering of the filling device 665. The essentially cylindrical filling device 665 is arranged longitudinally as a connecting piece on the tubular distribution container 632.
  • For the filling of the cooling device 610 a third coolant conduit is connected to a valve housing 666 of the filling device constructed as a valve, by screwing a coupling element arranged on the end of the third coolant conduit to the valve housing 666. In the process the coupling element shifts a valve insert 668 in a channel 669 in FIG. 7 to the left to a filling position, wherein a spring element within the valve insert 668 not shown in the figure which is supported via a stop element 667 at the filling opening 656 of the distribution container 632 or on the valve housing 66, is clamped.
  • The cooling device 610 is first evacuated via the channel released by the valve insert 668 in the filling position and is subsequently filled with coolant via the third coolant conduit and the channel 669. Subsequently the coupling element is again unscrewed from the filling device, wherein the spring element in the valve insert 668, under circumstances supported by an excess pressure of the coolant in the cooling device 610, moves the valve insert 668 in FIG. 7 to the right into a locking position in which the valve insert 668 locks the channel 669 and seals it by means of at least one sealing ring.
  • FIG. 8 shows the cooling device 610 from FIG. 6 in a lateral view. The ribbed pipe system 634 is in the process arranged between the cylindrical distribution container 632 and a likewise collection container 638 of the condenser 630. The filling device is arranged at a right angle to the ribbed pipe system on the distribution container. As a result of this a space saving style is achieved with simultaneous accessibility of the filling device.
  • FIG. 9 shows a clamping device 910 which is provided for a pressing of a cooling body against an exothermal component, for example against a processor of a computer, in a perspective view. The clamping device 910 exhibits a first tension element 920 and a second tension element 930 as well as a clamping web 940 arranged between the first and second tension elements. The clamping web 940 exhibits a fixture 950 for a cooling body as well as a hidden first holding element 960 and a second holding element 970.
  • For the pressing of the cooling body against the exothermal component first the cooling body in FIG. 9 in inserted into the fixture from above. A lateral first projection of the cooling body is in the process slipped under the holding element 960 constructed as a recess, whereupon a second projection of the cooling body lying opposite the first projection is pressed under the second holding element 970. This is made possible by an elastic receding of the rear partial web 945 of the clamping web 940 and is facilitated by a sloping ramp 975 of the second holding element 970.
  • In the case of the use of an evaporator in accordance with any one of FIGS. 1 through 8 for example an overlap of the cooling plate opposite the lid of the evaporator serves as a projection.
  • Advantageously the cooling body exhibits a stop pointing upward for the clamping device 910 so that the clamping device 910 is fixed on the cooling body after the insertion of the cooling body into the fixture 950. In the case of the use of an evaporator in accordance with any one of FIGS. 1 through 8 for example the first and or second coolant conduit firmly connected to the evaporator, in particular soldered, serves as a stop.
  • The cooling body arrangement obtained in this manner is finally clamped to the exothermal component or to a frame connected therewith, for example an electronic board electronic board. For this purpose first the first tension element 920 constructed as an eye is mounted on the frame and subsequently the second tension element 930 is pressed downward and likewise mounted in a nose. In order to facilitate the pressing downward, the clamping device 910 exhibits a fixture 980 for a tool in the region of the second tension element 930, such as for example a screwdriver.
  • FIG. 10 shows six lateral views of a clamping device 1010 which corresponds essentially to the clamping device 910 in FIG. 9, from six different sides. The clamping device 1010 exhibits a first tension element 1020 and a second tension element 1030 as well as a clamping web 1040 arranged in between. The clamping web 1040 exhibits a receptacle 1050 for a cooling body as well as a first holding element 1060 and a second holding element 1070.
  • For the pressing of the cooling body against the exothermal component first the cooling body in FIG. 9 in inserted into the fixture from above. A lateral first Projection of the cooling body is in the process slipped under the holding element 960 constructed as a recess, whereupon a second projection of the cooling body lying opposite the first projection is pressed under the second holding element 970. This is made possible by an elastic receding of the rear partial web 945 of the clamping web 940 and is facilitated by a sloping ramp 975 of the second holding element 970. In the case of the use of an evaporator in accordance with any one of FIGS. 1 through 8 for example an overlap of the cooling plate opposite the lid of the evaporator serves as a projection.
  • The cooling body arrangement obtained in this manner is finally clamped to the exothermal component or to a frame connected therewith, for example an electronic board. For this purpose first the first tension element 920 constructed as an eye is mounted on the frame and subsequently the second tension element 930 is pressed downward and likewise mounted in a nose. In order to facilitate the pressing downward, the clamping device 910 exhibits a fixture 980 for a tool in the region of the second tension element 930, such as for example a screwdriver.
  • In addition to this the second tension element 1030 is constructed as a bracket that can be swiveled outward, preferably a metal bracket and exhibits a projection 1035 as an assembly aid. The second tension element 1030 can with this be easily swiveled into the counterpart provided for this purpose, for example into a nose and subsequently be released. The clamping web 1040 is then clamped and produces a tension force which is transferred via the tension elements as tensile force and via the cooling body as compression force to the exothermal component, so that a sufficient heat transfer from the exothermal component to the cooling body is guaranteed.

Claims (18)

1. A device for cooling, in particular electronic components, in particular of a processor unit, comprising: an evaporator for the absorption of heat in a coolant in particular by means of evaporation; a gas cooler for cooling of the coolant in particular by means of condensation; a first coolant conduit for communicating connection of an evaporator outlet with a gas cooler inlet; a second coolant conduit for communicating connection of a gas cooler outlet with an evaporator inlet; a filling device for filling of the device with coolant; and the filling device is arranged on the evaporator or on the gas cooler.
2. The device according to claim 1, characterized in that the gas cooler or the evaporator exhibits a distribution container and a collection container, wherein the gas cooler inlet or evaporator inlet is arranged on the distribution container and the gas cooler outlet or evaporator outlet is arranged on the collection container, and wherein the distribution container and the collection container exhibit tube openings into which coolant tubes are inserted or upon which coolant tubes are slipped, wherein the coolant tubes are constructed in particular as flat tubes with corrugated ribs arranged in between, and that the filling device is arranged on the distribution container or on the collection container.
3. The device according to claim 2, characterized in that the distribution container and/or the collection container is constructed tubular, in particular cylindrical.
4. The device according to claim 2, characterized in that the filling device is arranged frontally on the tubular distribution container or collection container.
5. The device according to claim 2, characterized in that the filling device is arranged longitudinally on the tubular distribution container or collection container.
6. The device according to claim 2, characterized in that the tube openings are arranged longitudinally on the tubular distribution container or collection container.
7. The device according to claim 2, characterized in that the filling device is arranged essentially opposite the tube openings on the tubular distribution container or collection container.
8. The device according to claim 1, characterized in that the filling device is arranged essentially at a right angle to the tube openings on the tubular distribution container or collection container.
9. The device according to claim 1, characterized in that the filling device is firmly bonded to the gas cooler or evaporator, in particular bonded, soldered or welded.
10. The device according to claim 1, characterized in that the filling device is constructed in particular as an essentially cylindrical connecting piece.
11. The device according to claim 1, characterized in that the filling device is constructed as a valve with a valve housing for attachment of a third coolant conduit and with a valve insert for tight sealing of the filling device after a filling.
12. The device according to claim 11, characterized in that the valve insert is inserted displaceably into a channel within the valve housing between a filling position and a sealing position, wherein the value insert releases the channel in the filling position and locks it in the locking position, and wherein a spring element in the valve insert or an excess pressure in the gas cooler opposite an environment moves the valve insert into the locking position and a coupling element arranged on one end of the third coolant conduit moves the valve insert into the filling position in the case of attachment to the valve housing.
13. The device according to claim 1, characterized in that the device exhibits a conveying device, such as a ventilator, for conduction of a medium, in particular gas, in particular cooling air, through the gas cooler.
14. The device according to claim 1, characterized in that the device exhibits a coolant fan, such as a compressor, between the evaporator outlet and the gas cooler inlet and an expansion element, such as an expansion valve, between the gas cooler outlet and the evaporator inlet.
15. The device according to claim 1, characterized in that the device is provided for such a mounting in or on a exothermal component, that the gas cooler is arranged geodetically higher than the evaporator, so that the coolant flows of its own accord by evaporation form the evaporator to the gas cooler and after condensation from the gas cooler to the evaporator.
16. The device according to claim 15, characterized in that the evaporator is provided for a mounting on the exothermal component.
17. A gas cooler for the cooling of a coolant in particular by means of condensation, wherein the gas cooler exhibits a filling device for the filling of the gas cooler with coolant.
18. An evaporator for the cooling of an exothermal component, in particular of an electronic component, wherein the evaporator exhibits a filling device for the filling of the evaporator with coolant.
US12/282,273 2006-03-09 2007-03-08 Device for cooling, in particular, electronic components, gas cooler and evaporator Abandoned US20090301122A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102006011331.4 2006-03-09
DE102006011331A DE102006011331A1 (en) 2006-03-09 2006-03-09 Apparatus for cooling, in particular electronic components, gas coolers and evaporators
PCT/EP2007/002023 WO2007101694A2 (en) 2006-03-09 2007-03-08 Device comprising a gas cooler and evaporator for cooling, in particular, electronic components

Publications (1)

Publication Number Publication Date
US20090301122A1 true US20090301122A1 (en) 2009-12-10

Family

ID=38336084

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/282,273 Abandoned US20090301122A1 (en) 2006-03-09 2007-03-08 Device for cooling, in particular, electronic components, gas cooler and evaporator

Country Status (4)

Country Link
US (1) US20090301122A1 (en)
EP (1) EP1997139A2 (en)
DE (1) DE102006011331A1 (en)
WO (1) WO2007101694A2 (en)

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5010743A (en) * 1989-12-15 1991-04-30 Richard E. Glaser Test fitting adapter for refrigerant lines
US5159972A (en) * 1991-03-21 1992-11-03 Florida Power Corporation Controllable heat pipes for thermal energy transfer
US5203399A (en) * 1990-05-16 1993-04-20 Kabushiki Kaisha Toshiba Heat transfer apparatus
US5458189A (en) * 1993-09-10 1995-10-17 Aavid Laboratories Two-phase component cooler
US5647430A (en) * 1995-03-20 1997-07-15 Calsonic Corporation Electronic component cooling unit
US6125644A (en) * 1998-04-03 2000-10-03 United Microelectronics, Corp. Container of coolant
US6234240B1 (en) * 1999-07-01 2001-05-22 Kioan Cheon Fanless cooling system for computer
US6525505B2 (en) * 2000-06-02 2003-02-25 Mannesmann Vdo Ag Device for driving an air-conditioning compressor
US6549408B2 (en) * 2000-11-20 2003-04-15 Global Cooling Bv CPU cooling device using thermo-siphon
US20030151896A1 (en) * 2002-02-12 2003-08-14 Roy Zeighami Loop thermosyphon using microchannel etched semiconductor die as evaporator
US20030205363A1 (en) * 2001-11-09 2003-11-06 International Business Machines Corporation Enhanced air cooling of electronic devices using fluid phase change heat transfer
US20050083656A1 (en) * 2003-09-10 2005-04-21 Hamman Brian A. Liquid cooling system
US20050217829A1 (en) * 2004-03-31 2005-10-06 Alex Belits Low-profile thermosyphon-based cooling system for computers and other electronic devices
US7404433B1 (en) * 2007-01-31 2008-07-29 Man Zai Industrial Co., Ltd. Liquid cooled heat sink

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3903709A (en) * 1974-01-02 1975-09-09 Heil Quaker Corp Refrigerant charging apparatus
US4554792A (en) * 1981-07-08 1985-11-26 Margulefsky Allen L Method and apparatus for rehabilitating refrigerant
US4539817A (en) * 1983-12-23 1985-09-10 Staggs Michael J Refrigerant recovery and charging device
DE9402680U1 (en) * 1994-02-18 1994-04-21 Behr Gmbh & Co, 70469 Stuttgart Connection adapter for filling or removing refrigerant in a refrigerant system
KR19980019402A (en) * 1998-03-16 1998-06-05 천기완 CPU COOLING DEVICE OF PC
DE10201557B4 (en) * 2002-01-17 2011-06-30 Modine Manufacturing Co., Wis. Evaporative cooling container and method for evacuating and filling the container
US6714413B1 (en) * 2002-10-15 2004-03-30 Delphi Technologies, Inc. Compact thermosiphon with enhanced condenser for electronics cooling
DE20314532U1 (en) * 2003-09-16 2004-02-19 Pries, Wulf H. Device for dissipating heat from electronic and electrical components

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5010743A (en) * 1989-12-15 1991-04-30 Richard E. Glaser Test fitting adapter for refrigerant lines
US5203399A (en) * 1990-05-16 1993-04-20 Kabushiki Kaisha Toshiba Heat transfer apparatus
US5159972A (en) * 1991-03-21 1992-11-03 Florida Power Corporation Controllable heat pipes for thermal energy transfer
US5458189A (en) * 1993-09-10 1995-10-17 Aavid Laboratories Two-phase component cooler
US5647430A (en) * 1995-03-20 1997-07-15 Calsonic Corporation Electronic component cooling unit
US6125644A (en) * 1998-04-03 2000-10-03 United Microelectronics, Corp. Container of coolant
US6234240B1 (en) * 1999-07-01 2001-05-22 Kioan Cheon Fanless cooling system for computer
US6525505B2 (en) * 2000-06-02 2003-02-25 Mannesmann Vdo Ag Device for driving an air-conditioning compressor
US6549408B2 (en) * 2000-11-20 2003-04-15 Global Cooling Bv CPU cooling device using thermo-siphon
US20030205363A1 (en) * 2001-11-09 2003-11-06 International Business Machines Corporation Enhanced air cooling of electronic devices using fluid phase change heat transfer
US20030151896A1 (en) * 2002-02-12 2003-08-14 Roy Zeighami Loop thermosyphon using microchannel etched semiconductor die as evaporator
US20050083656A1 (en) * 2003-09-10 2005-04-21 Hamman Brian A. Liquid cooling system
US20050217829A1 (en) * 2004-03-31 2005-10-06 Alex Belits Low-profile thermosyphon-based cooling system for computers and other electronic devices
US7404433B1 (en) * 2007-01-31 2008-07-29 Man Zai Industrial Co., Ltd. Liquid cooled heat sink

Also Published As

Publication number Publication date
DE102006011331A1 (en) 2007-09-13
EP1997139A2 (en) 2008-12-03
WO2007101694A2 (en) 2007-09-13
WO2007101694A3 (en) 2007-11-15

Similar Documents

Publication Publication Date Title
CN101377392B (en) Heat exchanger
US5823248A (en) Cooling apparatus using boiling and condensing refrigerant
US5647430A (en) Electronic component cooling unit
US7918107B2 (en) Internal heat exchanger
US7604040B2 (en) Integrated liquid cooled heat sink for electronic components
US6119767A (en) Cooling apparatus using boiling and condensing refrigerant
CN1314306C (en) Modular cooling system and heat bus for large power electronic equipment cabinet
US5632158A (en) Electronic component cooling unit
US7882888B1 (en) Two-phase heat transfer system including a thermal capacitance device
AU699379B2 (en) Cooling apparatus using boiling and condensing refrigerant
EP2431701B1 (en) Heat dissipation device and radio frequency module with same
JP2019074301A (en) Cooling device
US20070273024A1 (en) Cooling System with a Bubble Pump
WO2007119783A1 (en) Cooling apparatus and power converter
CN212658104U (en) Heat pipe heat exchanger and heat dissipation device
KR101704256B1 (en) Device for heat transfer
WO2019077902A1 (en) Cooling device
KR200184333Y1 (en) Sealing apparatus for a heat exchanger manifold
CN102763056B (en) Floating coil heat exchanger
US20090301122A1 (en) Device for cooling, in particular, electronic components, gas cooler and evaporator
JP2004266247A (en) Cooling structure for heat generating component
CN2457553Y (en) Sheet shape heat pipe
US20100005832A1 (en) Device for cooling, in particular, electronic components
CN109595960A (en) Thermosyphon heat dissipation device
US20100223937A1 (en) Heat Exchanger Coupling Blocking Plug

Legal Events

Date Code Title Description
AS Assignment

Owner name: NOISE LIMITED APS, DENMARK

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:GROZINGER, STEFFEN;VELTE, VOLKER;MADSEN, HENRY;AND OTHERS;REEL/FRAME:022747/0904;SIGNING DATES FROM 20081023 TO 20090520

Owner name: BEHR INDUSTRY GMBH & CO. KG, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:GROZINGER, STEFFEN;VELTE, VOLKER;MADSEN, HENRY;AND OTHERS;REEL/FRAME:022747/0904;SIGNING DATES FROM 20081023 TO 20090520

AS Assignment

Owner name: BEHR INDUSTRY GMBH & CO. KG,GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:NOISE LIMIT APS;REEL/FRAME:024470/0984

Effective date: 20091212

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION