US20090246980A1 - Board-to-board electrical connector - Google Patents
Board-to-board electrical connector Download PDFInfo
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- US20090246980A1 US20090246980A1 US12/055,854 US5585408A US2009246980A1 US 20090246980 A1 US20090246980 A1 US 20090246980A1 US 5585408 A US5585408 A US 5585408A US 2009246980 A1 US2009246980 A1 US 2009246980A1
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- 230000013011 mating Effects 0.000 claims abstract description 79
- 230000007704 transition Effects 0.000 claims description 8
- 238000013461 design Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000014759 maintenance of location Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
- H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
- H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6473—Impedance matching
- H01R13/6477—Impedance matching by variation of dielectric properties
Abstract
Description
- The invention relates generally to electrical connectors and, more particularly, to a board-to-board connector for transmitting differential signals.
- With the ongoing trend toward smaller, faster, and higher performance electrical components, it has become increasingly important for the electrical interfaces along the electrical paths to also operate at higher frequencies and at higher densities with increased throughput.
- In a traditional approach for interconnecting circuit boards, one circuit board serves as a backplane or main board and the other as a daughter board. Rather than directly connecting the circuit boards, the backplane typically has a connector, commonly referred to as a header, that includes a plurality of signal pins or contacts which connect to conductive traces on the backplane. The daughter board connector, commonly referred to as a receptacle, also includes a plurality of contacts or pins. When the header and receptacle are mated, signals can be routed between the two circuit boards.
- The migration of electrical communications to higher data rates has resulted in more stringent requirements for density and throughput while maintaining signal integrity. At least some board-to-board connectors carry differential signals wherein each signal requires two lines that are referred to as a differential pair. For better performance, a ground may be associated with each differential pair. The ground provides shielding for the differential pair to reduce noise or crosstalk.
- A need remains for a connector having higher speed capability with reduced noise.
- In one embodiment, an electrical connector is provided. The connector includes a housing defining a connector mating interface. The housing holds a plurality of contact modules that cooperate to define a connector mounting interface. Each contact module contains signal leads and ground leads arranged in an alternating pattern of individual ground leads and pairs of signal leads positioned side-by-side with respect to a thickness of the contact module. The signal and ground leads have respective mating contacts proximate the mating interface and respective mounting contacts proximate the mounting interface. The mating and mounting contacts within each contact module are arranged in one of first and second contact patterns different from the pattern of the signal and ground leads. The mating and mounting contacts in adjacent contact modules are arranged in respective different ones of the first and second contact patterns.
- Optionally, each of said first and second contact patterns includes a column of ground contacts adjacent a column including signal contacts in alternating vertically coupled pairs and horizontally coupled pairs. The arrangement of signal contact pairs in the second contact pattern is offset from the arrangement of the signal contact pairs of the first contact pattern. The pairs of signal leads are configured to carry differential signals and are without skew. The mating and mounting interfaces are substantially perpendicular to one another. Each of the ground leads has a width sufficient to shield a pair of signal leads from other signal leads within the same contact module. Each contact module includes a housing having a centerline. The signal leads in each contact module are arranged in a first group positioned on one side of the centerline and a second group positioned on the other side of the centerline. Each pair of signal leads includes a signal lead from each of the first and second groups.
- In another embodiment, an electrical connector assembly is provided. The assembly includes a header connector having a housing holding a plurality of header contacts in a noise canceling arrangement. A receptacle connector is matable with the header connector. The receptacle connector includes a receptacle housing defining a connector mating interface. The receptacle housing holds a plurality of contact modules that cooperate to define a connector mounting interface. Each contact module contains signal leads and ground leads arranged in an alternating pattern of individual ground leads and pairs of signal leads positioned side-by-side with respect to a thickness of the contact module. The signal and ground leads have respective mating contacts proximate the mating interface and respective mounting contacts proximate the mounting interface. The mating and mounting contacts within each contact module are arranged in one of first and second contact patterns different from the pattern of the signal and ground leads. The mating and mounting contacts in adjacent contact modules are arranged in respective different ones of the first and second contact patterns.
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FIG. 1 is a perspective view of an electronic assembly including an electrical connector formed in accordance with an exemplary embodiment of the present invention. -
FIG. 2 is a perspective view of the header connector shown inFIG. 1 . -
FIG. 3 is a perspective view of a contact for the header connector shown inFIG. 2 . -
FIG. 4 is a perspective view of the receptacle connector shown inFIG. 1 . -
FIG. 5 is a perspective view of a contact module for the receptacle connector shown inFIG. 4 . -
FIG. 6 is a perspective view of a mating contact in the contact module shown inFIG. 5 . -
FIG. 7 is an exploded view of the contact module shown inFIG. 5 . -
FIG. 8 is a cross-sectional view of a receptacle connector taken along the line 8-8 inFIG. 4 . -
FIG. 9 is a cross-sectional view of a receptacle connector taken along the line 9-9 inFIG. 4 . -
FIG. 10 is a perspective view showing the contact footprints of the backplane board and the daughter board. -
FIG. 11 is a schematic view of signal and ground leads removed from a contact module and interconnecting a backplane board and a daughter board. -
FIG. 12 is an enlarged view of a horizontally coupled signal contact pair at the mounting interface with the daughter board. -
FIG. 13 is an enlarged view of a horizontally coupled signal contact pair at the mating interface with the backplane board. -
FIG. 14 is an enlarged view of a vertically coupled signal contact pair at the mounting interface with the daughter board. -
FIG. 15 is an enlarged view of a vertically coupled signal contact pair at the mating interface with the backplane board. -
FIG. 1 illustrates anelectronic assembly 100 including anelectrical connector assembly 110 formed in accordance with an exemplary embodiment of the present invention. Theconnector assembly 110 interconnects abackplane board 112 with adaughter board 114. Theconnector assembly 110 includes aheader connector 120 that is mounted on thebackplane 112 and areceptacle connector 124 that is mounted on thedaughter board 114. Theheader connector 120 andreceptacle connector 124 are mated to electrically connect thebackplane 112 and thedaughter board 114. While the invention is described in terms of aconnector assembly 100 for interconnecting circuit boards such as thebackplane 112 anddaughter board 114, it is to be understood that such description is for purposes of illustration and no limitation is intended thereby. That is, the benefits of the invention may also be incorporated into connector assemblies for interconnecting two electrical components to one another or one electrical component to a circuit board. -
FIG. 2 illustrates a perspective view of theheader connector 120. Theheader connector 120 includes adielectric housing 130 that has abase 132 andshrouds shrouds base 132 and each includes akeying slot 138. Theheader connector 120 includes amating face 142 and amounting face 144 that interfaces the backplane board 112 (FIG. 1 ) when theheader connector 120 is mounted on the backplane board. Theheader connector 120 holds a plurality ofelectrical contacts 150 that includessignal contacts 150A andground contacts 150B arranged in a pattern, as will be described. -
FIG. 3 illustrates a perspective view of acontact 150 that may be used in the header connector 120 (FIG. 2 ). Eachcontact 150 includes amating end 154 that is configured to be matable with contacts in the receptacle connector 124 (FIG. 1 ). Themating end 154 extends from a contact body orretention section 156 that is press fit into thebase 132 of theheader connector housing 130. Thecontact body 156 includesretention barbs 158 that retain thecontact 150 in the headerconnector housing base 132. Acontact tail 160 extends from thecontact body 156 opposite themating end 154. Thecontact tail 160 extends from thebase 132 of theheader connector 120 at the mountingface 144 to mount theheader connector 120 on thebackplane board 112. In one embodiment, thecontact tail 160 is a compliant eye of the needle design. In an exemplary embodiment, themating end 154 comprises a cylindrical pin design. Thesignal contacts 150A andground contacts 150B are substantially identical to one another; however, in some embodiments the mating ends 154 of theground contacts 150B have a length L that is greater than the length L of the mating ends 154 of thesignal contacts 150A so that theground contacts 150B are the first to mate and last to break when theheader connector 120 is mated and separated, respectively, from thereceptacle connector 124. Further, in some embodiments, the mating of thesignal contacts 150A is also sequenced. That is, selectedsignal contacts 150A may be configured to mate beforeother signal contacts 150A by further varying the lengths L of thesignal contacts 150A. -
FIG. 4 illustrates a perspective view of thereceptacle connector 124. Thereceptacle connector 124 includes adielectric housing 170 having a mating end ormating interface 172 and a mounting end or mountinginterface 174. In an exemplary embodiment, the mountinginterface 174 is substantially perpendicular to themating interface 172 such that thereceptacle connector 124 interconnects electrical components or circuit boards that are substantially at a right angle to one another other. Themating interface 172 includes a plurality ofcontact apertures 176 that are configured to receivecontacts 150 from the mating header connector 120 (FIG. 2 ) as will be described. Thereceptacle connector housing 170 includes atop wall 178, from which ashroud 180 rearwardly extends, and an oppositebottom wall 182.Alignment keys 184, only one of which is visible inFIG. 4 , are formed on the top andbottom walls alignment keys 184 are received in the keyingslots 138 in the header connector 120 (FIG. 2 ) to orient and align thereceptacle connector 124 with theheader connector 120. Thehousing 170 includes amodule receiving end 186 opposite themating interface 172 that receives a plurality of wafers orcontact modules 190. Thecontact modules 190 collectively define the mountinginterface 174. Thecontact modules 190 are provided in twocontact module types housing 170 in an alternating sequence. -
FIG. 5 illustrates a perspective view of thecontact module 190A formed in accordance with an exemplary embodiment of the present invention. Thecontact module 190A includes acontact module housing 194 fabricated from an insulative material. Thecontact module housing 194 includes aforward mating end 196 that is received in themodule receiving end 186 of the receptacle housing 170 (FIG. 4 ) and a mountingedge 198 that is substantially perpendicular to themating end 196. Analignment key 200 is provided proximate themating end 196 that is received in aslot 202 in the shroud 180 (seeFIG. 8 ) to facilitate positioning of thecontact module 190A in thereceptacle housing 170. Mountingcontacts 204 extend from the mountingedge 198 for attachment to a circuit board or other electrical component. In one embodiment, the mountingcontacts 204 may be a flexible eye of the needle design commonly used in circuit board connections.Mating contacts 210 are received in thecontact apertures 176 in thereceptacle housing 170 when thecontact module 190A is received in thereceptacle housing 170. -
FIG. 6 illustrates an enlarged perspective view of themating contact 210. In the illustrated embodiment, thecontact 210 is a tri-beam design having threecontact beams 212 that extend from acontact body 214. The contact beams 212 are arranged to receive thepin contact 150 in the header connector 120 (FIG. 2 ). -
FIG. 7 illustrates an exploded view of thecontact module 190A. Thecontact module housing 194 has a thickness T between afirst side 216 and asecond side 218 opposite thefirst side 216. Thecontact module 190A includes a plurality of signal leads 220 and ground leads 222 that provide conductive paths betweenrespective mating contacts 210 and mountingcontacts 204. The signal leads are arranged in afirst group 224 and asecond group 226. The ground leads 222 make up athird group 228. Eachground lead 222 has a width W that is only slightly less than the thickness T of thecontact module housing 194. In an exemplary embodiment, the signal leads 220 and ground leads 222 are stitched into thecontact module housing 194. In alternative embodiments, thesignal lead groups ground lead group 228 may be formed in lead frames (not shown) and over-molded in thecontact module housing 194 to form thecontact module 190A. The firstsignal lead group 224 is stitched into thefirst side 216 of thecontact module housing 194 while the secondsignal lead group 226 and theground lead group 228 are stitched into thesecond side 218 of thecontact module housing 194. In the assembledcontact module 190A thesignal lead groups centerline 219 through thecontact module housing 194. Eachindividual signal lead 220 in thefirst lead group 224 is positioned adjacent to or beside asignal lead 220 in thesecond lead group 226 to form a differential signal pair. Ground leads 222 are positioned between each pair of signal leads 220. All of thecontact modules 190 including bothtypes interfaces interfaces receptacle connector 124, thecontact modules 190A exhibit a first one of two different contact patterns at the mating and mountinginterfaces contact modules 190B exhibit a second of the two different contact patterns at the mating and mountinginterfaces -
FIG. 8 illustrates a cross-sectional view of thereceptacle connector 124 taken along the line 8-8 inFIG. 4 . The cross section shown inFIG. 8 is taken through theshroud 180 and behind themating interface 172. Thealignment keys 200 on thecontact module housings 194 are shown received in theslots 202 positioning thecontact modules 190 in the receptacle housing 170 (FIG. 4 ). In eachcontact module 190, including thecontact modules mating interface 172 and mountinginterface 174 wherein the signal leads 220 are arranged indifferential pairs 240 that are positioned side-by-side with respect to the thickness T (FIG. 7 ) of thecontact module housing 194 and positioned between individual ground leads 222. In one embodiment, the signal leads 220 in eachsignal lead pair 240 are on opposite sides of thecenterline 219 of thecontact module housing 194. - In each
contact module 190, the width W of the ground leads 222 is sufficient to shield the differential signal pairs 240 from adjacent signal pairs 240 to thereby minimize crosstalk between signal pairs 240 within thecontact module 190. Thecontact modules 190 are formed with air spaces orair pockets 242 that separate the signal pairs 240 from the signal pairs 240 inadjacent contact modules 190. Theair pockets 242 provide shielding from alien crosstalk fromadjacent contact modules 190. When transmitting differential signals, it is desirable that the lengths of the signal paths for the differential signal pair be as closely matched as possible so as to minimize skew in the transmitted signal. With the side-by-side arrangement of the signal leads 220 in thedifferential signal pair 240, the overall lengths of the signal leads 220 in each differential pair are identical thus eliminating skew within thedifferential signal pair 240. - The signal leads 220 in the differential signal pairs 240 have a spacing S1 therebetween. A spacing S2 is established between the differential signal pairs 240 and the ground leads 222. The spacings S1 and S2 are selected relative to characteristics of the contact module material and lead material and dimensions to provide a desired impedance through the
receptacle connector 124 to facilitate minimizing signal loss. In some embodiments, a lossy material may also be selectively located in thecontact module housing 194 to control connector impedance. Known simulation software may be used to optimize such variables for particular design goals including connector impedance. One such simulation software is known as HFSS™ which is available from Ansoft Corporation. In an exemplary embodiment, thereceptacle connector 124 has a characteristic impedance of one hundred ohms. -
FIG. 9 illustrates a cross-sectional view of thereceptacle connector 124 taken along the line 9-9 inFIG. 4 . This cross section is through thereceptacle housing 170 at themating face 172 and is through the tri-beam mating contacts 210 (FIG. 6 ) which are at ends of the signal and ground leads 220 and 222, respectively. The phantom lines inFIG. 9 extending from thetop wall 178 and thebottom wall 182 divide thehousing 170 intocolumns 250 that correspond to the contact modules 190 (FIG. 4 ) loaded into thereceptacle housing 170. At themating interface 172, themating contacts 210 are arranged in one of first and second contact patterns, both of which are different from the pattern of signal and ground leads 220 and 222, respectively, between themating interface 172 and mountinginterface 174 described above. - The first and second contact patterns both include vertically coupled signal contact pairs 210A, horizontally coupled signal contact pairs 210B, and
individual ground contacts 210C. The vertically coupled contact pairs 210A have acontact axis 252 and the horizontally coupled contact pairs 210B have acontact axis 254 that is substantially perpendicular to thecontact axis 252 of the vertically coupled contact pairs 210A. That is, vertically coupled contact pairs 210A and the horizontally coupled contact pairs 210B are angularly offset substantially ninety degrees from one another. It should be recognized that the signal contact pairs 210A and 210B along with theground contact 210C are structurally identical comprising the tri-beam contacts 210 (FIG. 6 ) previously described. In onecolumn 250A, the contact pairs 210A, 210B are arranged in ahorizontal pair 210B-to-vertical pair 210A-to-horizontal pair 210B alternating sequence from thetop wall 178 to thebottom wall 182. Theground contacts 210C are arranged in acolumn 256 adjacent the signal contact pairs 210A and 210B. In anadjacent column 250B, the contact pairs 210A, 210B are arranged in avertical pair 210A-to-horizontal pair 210B-to-vertical pair 210A alternating sequence from thetop wall 178 to thebottom wall 182. Again, theground contacts 210C are arranged in acolumn 256 adjacent the signal contact pairs 210A and 210B. The contact patterns are alternated from onecolumn 250 to thenext column 250 across thereceptacle housing 170. In each contact module 190 (FIG. 4 ) the pattern of the mounting contacts 204 (FIG. 5 ) is the same as that of themating contacts 210. Thus the mountinginterface 174 exhibits the same contact patterns as themating interface 172. The contact patterns at the mounting andmating interfaces mating interfaces -
FIG. 10 illustrates a perspective view showing the contact aperture patterns orfootprints 260 on thebackplane board daughter board 114. On thebackplane board 112, the apertures includesignal contact apertures 280 andground contact apertures 282. Differential pairs 284 ofsignal contact apertures 280 are shown encircled together. The differential pairs 284 ofsignal contact apertures 280 are arranged incolumns 286 that extend in the direction of thearrow 288 androws 290 that extend in the direction of thearrow 292 that is substantially perpendicular to thearrow 288. Thecontact aperture pattern 260 includescolumns 294 ofground contact apertures 282 andcolumns 286 ofdifferential pairs 284 ofsignal contact apertures 280 in an alternating sequence. Alternatively, the same pattern exists with respect to therows 290. Within eachcolumn 286 ofdifferential pairs 284, the differential pairs 284 are in one of two patterns, the first being vertically coupleddifferential pairs 284A-to-horizontally coupleddifferential pairs 284B-to-vertically coupleddifferential pairs 284A, and so on. The second pattern has horizontally coupleddifferential pairs 284B-to-vertically coupleddifferential pairs 284A-to-horizontally coupleddifferential pairs 284B, and so on. The patterns ofdifferential pairs 284 are similar but offset with respect to one another. From onedifferential pair column 286 to the next, the arrangement of the differential pairs 284 ofsignal contact apertures 280 within thedifferential pair columns 286 alternates between the first and second differential pair patterns. The vertically coupleddifferential pairs 284A have a spacing S3 between thecontact apertures 280. The horizontally coupleddifferential pairs 284B have a spacing S4 between thecontact apertures 280. - The pattern or
footprint 270 ofsignal contact apertures 300 andground contact apertures 302 on thedaughter board 114 is substantially identical to that of thebackplane board 112. Differential pairs 304 ofsignal contact apertures 300 are shown encircled together. The differential pairs 304 ofsignal contact apertures 300 are arranged incolumns 310 that extend in the direction of thearrow 312 androws 314 that extend in the direction of thearrow 316 that is substantially perpendicular to thearrow 312. Thecontact aperture pattern 270 includescolumns 318 ofground contact apertures 302 and columns ofdifferential pairs 304 ofsignal contact apertures 300 in an alternating sequence. As described above with respect to thebackplane board 112, within eachcolumn 310 ofdifferential pairs 304, the differential pairs 304 are in one of two patterns, the first being vertically coupleddifferential pairs 304A-to-horizontally coupleddifferential pairs 304B-to-vertically coupleddifferential pairs 304A, and so on. The second is horizontally coupleddifferential pairs 304B-to-vertically coupleddifferential pairs 304A-to-horizontally coupleddifferential pairs 304B, and so on. The patterns ofdifferential pairs 304 are similar but offset with respect to one another. From onedifferential pair column 310 to the next, the arrangement of the differential pairs 304 within thedifferential pair columns 310 alternates between the first and second differential pair patterns. The vertically coupleddifferential pairs 304A have a spacing S5 between thecontact apertures 300. The horizontally coupleddifferential pairs 304B have a spacing S6 between thecontact apertures 300. - The above described contact aperture footprints on the backplane and daughter board are noise canceling footprints as described in U.S. Pat. No. 7,207,807 which is hereby incorporated by reference in its entirety.
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FIG. 11 illustrates a schematic view of signal leads 220 and ground leads 222 removed from a contact module and interconnecting thebackplane board 112 and thedaughter board 114. For clarity, some of the ground leads 222 are not shown. The signal leads 220 are arranged in differential pairs 240. As previously described with reference toFIG. 9 , thecontacts 210 at themating interface 172 are arranged in alternating differential pairs of vertically coupled and horizontally coupledsignal contacts individual ground contacts 210C. Similarly, thecontacts 204 at the mountinginterface 174 are arranged in alternating differential pairs of vertically coupled and horizontally coupledsignal contacts 204A and 204B, respectively and individual ground contacts 204C. At the mating and mountinginterfaces signal lead 220 goes through a transition to arrange the mating and mountingsignal contacts aperture footprints backplane board 112 and thedaughter board 114. -
FIG. 12 illustrates an enlarged view of the horizontally coupled signal contact pair 204B at the mountinginterface 174 with thedaughter board 114.FIG. 13 illustrates an enlarged view of the horizontally coupledsignal contact pair 210B at themating interface 172 with thebackplane board 112. Eachsignal lead 220 includestransition regions interfaces mating contacts 210 and mountingcontacts 204 to thecorresponding footprints backplane board 112 and thedaughter board 114 respectively. Since the signal lead pairs 240 are in a side-by-side arrangement in thecontact modules 190, it is only necessary to adjust the contact spacing from the spacing S1 in the contact modules to the spacings S4 and S6 of the noise cancelingaperture footprints transition regions 332 at themating interface interface 174. -
FIG. 14 illustrates an enlarged view of the vertically coupledsignal contact pair 204A at the mountinginterface 174 with thedaughter board 114.FIG. 15 illustrates an enlarged view of the vertically coupledsignal contact pair 210A at themating interface 172 with thebackplane board 112. With the vertical coupling inFIGS. 14 and 15 , the orientation of the signal leads 220 is changed from the side-by-side orientation between the mating and mountinginterfaces contact module 190 to an orientation wherein the contact axis 252 (seeFIG. 9 ) of thedifferential pair 210A is substantially perpendicular to the side-by-side orientation of the signal leads 220. The transition occurs in thetransition regions contact module 190 to the spacings S3 and S5 of the noise cancelingaperture footprints - The embodiments herein described provide an
electrical connector assembly 110 for interconnectingcircuit boards connector assembly 110 includes aheader connector 120 and areceptacle connector 124 that carry differential signals and exhibit low noise characteristics. Thereceptacle connector 124 includescontact modules 190 having signal lead pairs 240 positioned side-by-side between individual ground leads 222. The arrangement of the signal lead pairs 240 and ground leads 222 is transitioned to conform to noise canceling footprints at thecircuit boards - Exemplary embodiments are described and/or illustrated herein in detail. The embodiments are not limited to the specific embodiments described herein, but rather, components and/or steps of each embodiment may be utilized independently and separately from other components and/or steps described herein. Each component, and/or each step of one embodiment, can also be used in combination with other components and/or steps of other embodiments. When introducing elements/components/etc. described and/or illustrated herein, the articles “a”, “an”, “the”, “said”, and “at least one” are intended to mean that there are one or more of the element(s)/component(s)/etc. The terms “comprising”, “including” and “having” are intended to be inclusive and mean that there may be additional element(s)/component(s)/etc. other than the listed element(s)/component(s)/etc. Moreover, the terms “first,” “second,” and “third,” etc. in the claims are used merely as labels, and are not intended to impose numerical requirements on their objects. Further, the limitations of the following claims are not written in means—plus-function format and are not intended to be interpreted based on 35 U.S.C. § 112, sixth paragraph, unless and until such claim limitations expressly use the phrase “means for” followed by a statement of function void of further structure.
- While the invention has been described in terms of various specific embodiments, those skilled in the art will recognize that the invention can be practiced with modification within the spirit and scope of the claims.
Claims (20)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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US12/055,854 US7651373B2 (en) | 2008-03-26 | 2008-03-26 | Board-to-board electrical connector |
EP09725536.8A EP2274802B1 (en) | 2008-03-26 | 2009-03-19 | Board-to-board electrical connector |
PCT/US2009/001724 WO2009120284A1 (en) | 2008-03-26 | 2009-03-19 | Board-to-board electrical connector |
CN2009801107287A CN101981764B (en) | 2008-03-26 | 2009-03-19 | Board-to-board electrical connector |
TW098109687A TWI463740B (en) | 2008-03-26 | 2009-03-25 | Board-to-board electrical connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/055,854 US7651373B2 (en) | 2008-03-26 | 2008-03-26 | Board-to-board electrical connector |
Publications (2)
Publication Number | Publication Date |
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US20090246980A1 true US20090246980A1 (en) | 2009-10-01 |
US7651373B2 US7651373B2 (en) | 2010-01-26 |
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US12/055,854 Active 2028-07-24 US7651373B2 (en) | 2008-03-26 | 2008-03-26 | Board-to-board electrical connector |
Country Status (5)
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US (1) | US7651373B2 (en) |
EP (1) | EP2274802B1 (en) |
CN (1) | CN101981764B (en) |
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WO (1) | WO2009120284A1 (en) |
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CN113131239B (en) | 2019-12-31 | 2023-08-15 | 富鼎精密工业(郑州)有限公司 | Electric connector |
CN113131241B (en) * | 2019-12-31 | 2024-02-20 | 富鼎精密工业(郑州)有限公司 | Electric connector |
CN113131287B (en) * | 2019-12-31 | 2023-06-16 | 富鼎精密工业(郑州)有限公司 | Electric connector |
US20220368069A1 (en) * | 2021-05-16 | 2022-11-17 | Electron Square Spólka Z Ograniczona Odpowiedzialnoscia | Electric interface |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060216969A1 (en) * | 2005-03-28 | 2006-09-28 | Tyco Electronics Corporation | Electrical connector |
US7131870B2 (en) * | 2005-02-07 | 2006-11-07 | Tyco Electronics Corporation | Electrical connector |
US7172461B2 (en) * | 2004-07-22 | 2007-02-06 | Tyco Electronics Corporation | Electrical connector |
US20080280492A1 (en) * | 2007-05-08 | 2008-11-13 | Brent Ryan Rothermel | Electrical connector with programmable lead frame |
US7473138B2 (en) * | 2005-06-08 | 2009-01-06 | Tyco Electroics Nederland B.V. | Electrical connector |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6899566B2 (en) * | 2002-01-28 | 2005-05-31 | Erni Elektroapparate Gmbh | Connector assembly interface for L-shaped ground shields and differential contact pairs |
US6808420B2 (en) * | 2002-05-22 | 2004-10-26 | Tyco Electronics Corporation | High speed electrical connector |
US7094102B2 (en) * | 2004-07-01 | 2006-08-22 | Amphenol Corporation | Differential electrical connector assembly |
US7371117B2 (en) * | 2004-09-30 | 2008-05-13 | Amphenol Corporation | High speed, high density electrical connector |
US7207807B2 (en) * | 2004-12-02 | 2007-04-24 | Tyco Electronics Corporation | Noise canceling differential connector and footprint |
US7448884B2 (en) * | 2006-07-14 | 2008-11-11 | Japan Aviation Electronics Industry, Limited | Electrical component with contact terminal portions arranged in generally trapezoidal shape |
CN201008051Y (en) * | 2006-11-17 | 2008-01-16 | 贵州航天电器股份有限公司 | High-speed high-density connector with shielding |
-
2008
- 2008-03-26 US US12/055,854 patent/US7651373B2/en active Active
-
2009
- 2009-03-19 CN CN2009801107287A patent/CN101981764B/en active Active
- 2009-03-19 WO PCT/US2009/001724 patent/WO2009120284A1/en active Application Filing
- 2009-03-19 EP EP09725536.8A patent/EP2274802B1/en active Active
- 2009-03-25 TW TW098109687A patent/TWI463740B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7172461B2 (en) * | 2004-07-22 | 2007-02-06 | Tyco Electronics Corporation | Electrical connector |
US7131870B2 (en) * | 2005-02-07 | 2006-11-07 | Tyco Electronics Corporation | Electrical connector |
US20060216969A1 (en) * | 2005-03-28 | 2006-09-28 | Tyco Electronics Corporation | Electrical connector |
US7473138B2 (en) * | 2005-06-08 | 2009-01-06 | Tyco Electroics Nederland B.V. | Electrical connector |
US20080280492A1 (en) * | 2007-05-08 | 2008-11-13 | Brent Ryan Rothermel | Electrical connector with programmable lead frame |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110043989A1 (en) * | 2009-08-18 | 2011-02-24 | Kai-Chen Tien | Motherboard and portable electronic device using the same |
CN102176561A (en) * | 2009-10-09 | 2011-09-07 | 泰科电子公司 | Modular connector system |
US8398432B1 (en) * | 2011-11-07 | 2013-03-19 | Tyco Electronics Corporation | Grounding structures for header and receptacle assemblies |
US10671907B2 (en) * | 2018-03-15 | 2020-06-02 | International Business Machines Corporation | Electrical junction |
US10679942B2 (en) | 2018-03-15 | 2020-06-09 | International Business Machines Corporation | Electrical junction for facilitating an integration of electrical crossing |
CN109546387A (en) * | 2019-01-18 | 2019-03-29 | 四川华丰企业集团有限公司 | Share the male end pedestal of air pocket |
Also Published As
Publication number | Publication date |
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US7651373B2 (en) | 2010-01-26 |
TWI463740B (en) | 2014-12-01 |
EP2274802A1 (en) | 2011-01-19 |
EP2274802B1 (en) | 2015-06-10 |
WO2009120284A1 (en) | 2009-10-01 |
CN101981764B (en) | 2013-05-08 |
CN101981764A (en) | 2011-02-23 |
TW200950220A (en) | 2009-12-01 |
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