US20090151897A1 - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
US20090151897A1
US20090151897A1 US11/959,323 US95932307A US2009151897A1 US 20090151897 A1 US20090151897 A1 US 20090151897A1 US 95932307 A US95932307 A US 95932307A US 2009151897 A1 US2009151897 A1 US 2009151897A1
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US
United States
Prior art keywords
base
heat dissipation
dissipation device
sleeve
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/959,323
Inventor
Wu Li
Yi-Qiang Wu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Original Assignee
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuzhun Precision Industry Shenzhen Co Ltd, Foxconn Technology Co Ltd filed Critical Fuzhun Precision Industry Shenzhen Co Ltd
Priority to US11/959,323 priority Critical patent/US20090151897A1/en
Assigned to FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD. reassignment FOXCONN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LI, WU, WU, YI-QIANG
Publication of US20090151897A1 publication Critical patent/US20090151897A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat dissipation device, more particularly to a heat dissipation device with bolts mounted thereon.
  • a conventional heat dissipation device for dissipating heat generated by an electronic component on a printed circuit board, includes a base connecting with the electronic component, a plurality of fins formed on a top surface of the base and a plurality of bolts extending through the base for engaging with corresponding nuts to mounting the heat dissipation device to the printed circuit board.
  • Each bolt includes a head and a thread end.
  • a spring fits is encircling the bolt and is sandwiched between the head of the bolt and the base. Before the heat dissipation device mounted to the printed circuit board, the thread end of the bolt is screwed engaging in a corresponding screw thread hole defined in the base, and the springs loosely fit around the bolts.
  • a heat dissipation device includes a base, a fin group mounted on a top surface of the base, and a plurality of fasteners secured on the base.
  • Each fastener includes a bolt extending through the base, and an elastic sleeve engaging with the bolt under the base.
  • the sleeve defines a hole and the hole has a configuration such that the sleeve securely clasp the bolt.
  • the bolt extends through the base and engages in the hole of the sleeve.
  • FIG. 1 is an assembled view of a heat dissipation device in accordance with a preferred embodiment of the present invention
  • FIG. 2 is an exploded view of FIG. 1 ;
  • FIG. 3 is an inverted view of FIG. 3 .
  • a heat dissipation device in accordance with a preferred embodiment of the present invention comprises a base 10 adapted for contacting with an electronic component (not shown) mounted on a printed circuit board (not shown), a fin group 20 mounted on a top of the base 10 , a pair of heat pipes 30 sandwiched between the fin group 20 and the base 10 , and a plurality of fasteners 40 secured on the base 10 .
  • the fin group 20 consists of a plurality of single fins 21 .
  • the fins 21 are spaced from each other such that channels (not labeled) are evenly defined between the fins 21 .
  • Each fin 21 comprises a rectangular body 211 , a pair of clasps 213 formed on opposite ends of a top edge of the body 211 , and an elongated flange 215 formed on a bottom edge of the body 211 along the same direction of the clasps 213 .
  • the clasps 213 of the adjacent fins 21 are clasped each other, thus, the fin group 20 is formed.
  • the flanges 215 are assembled together to form a flat bottom surface 217 to connect with the base 10 .
  • a cutout (not labeled) is defined at a rear end of the fin group 20 to prevent the fin group 20 and the fastener 40 from interfering with each other when the fasteners 40 are mounted on the base 10 .
  • Each heat pipe 30 is flattened and comprises a top surface (not shown) and a bottom surface (not shown) opposite to the top surface.
  • Each heat pipe 30 has a straight evaporating portion 31 and two bent condensing portions 33 extending from opposite ends of the evaporating portion 31 .
  • the heat pipes 30 are soldered in the base 10 , the evaporating portions 31 are parallel and near to each other, and corresponding condensing portions 33 are spaced from each other. Thus, a distance between the corresponding condensing portions 33 is larger than that between the evaporating portions 33 .
  • the heat pipes 30 defines an X-shaped configuration in the base 10 .
  • the base 10 has a rectangular configuration and is made of metal such as aluminum or copper which has a high degree of heat conductivity.
  • a length of the base 10 is larger than that of the fin group 20 .
  • the base 10 has a bottom surface (not labeled) and a top surface (not labeled) opposite to the bottom surface.
  • the bottom surface of the base 10 intimately contacts with the electronic component.
  • the bottom surface 217 of the fin group 20 thermally contacts with the top surface of the base 10 .
  • Two grooves 11 are defined at a top portion of the base 10 along a longitudinal direction of the base 10 .
  • the heat pipes 30 are received in the grooves 11 .
  • the top surface of the heat pipes 30 and the top surface of the base 10 are coplanar.
  • Each groove 11 has a straight portion (not labeled) located at a centre of the base 10 and two bent portions (not labeled) extending from opposite ends of the straight portion and located at a front and rear portion of the base 10 respectively.
  • the straight portions of the grooves 11 are adjoining to each other, and the bent portions at the front or rear portion of the base 10 are spaced from each other.
  • the front and the rear portions of the base 10 form a substantially triangular protrusion portion 13 respectively.
  • Two bulges 15 extend from the base 10 along a transverse direction of the base 10 .
  • the bulges 15 and the centre of the protrusion portions 13 define four counterbores 17 , respectively.
  • Each counterbore 17 defines a first through hole (not labeled) at a top portion of the base 10 and a smaller second through hole (not labeled) at a bottom portion of the base 10 .
  • Each fastener 40 is mounted in each counterbore 17 .
  • Each fastener 40 comprises a bolt 41 received in the counterbore 17 , a spring 43 encircling the bolt 41 and an elastic sleeve 45 engaged with the bolt 41 .
  • the bolt 41 has a circular head 411 and a shaft 413 extending downwardly from the head 411 .
  • the shaft 413 terminates with a screw end adapted for engaging in a nut (not shown) or a back plate (not shown) to mount the heat dissipation device on the printed circuit board.
  • the spring 43 has an outer diameter smaller than a diameter of the head 411 and larger than a diameter of the shaft 413 .
  • Each sleeve 45 is made of elastic material such as rubber and comprises a cylindrical base 453 and a cylindrical mounting portion 451 with a through hole 457 extending through a centre of the base 453 .
  • the mounting portion 451 has a diameter larger than that of the second through hole of the counterbore 17 .
  • the through hole 457 has a diameter smaller than that of the shaft 413 of the bolt 41 .
  • the mounting portion 451 has a circular cross section, and the through hole 457 is rectangular in the cross section.
  • the shaft 413 of each bolt 41 extends the counterbore 17 and engages in the sleeve 45 , thus, the bolt 41 is stably mounted on the base 10 .
  • the heat pipes 30 are soldered in the grooves 11 of the base 10 , and the fin group 20 are soldered on the top surface of the base 10 , and the fasteners 40 are secured on the base 10 .
  • a rear edge of the fin group 20 is aligned with a rear edge of the base 10 .
  • the fastener 40 located at the rear end of the base 10 is positioned in the cutout of the fin group 20 .
  • a front end of the fin group 20 is spaced from a front end of the base 10 and not covers the fastener 40 located at the front end of the base 10 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation device includes a base, a fin group mounted on a top surface of the base, and a plurality of fasteners secured on the base. Each fastener includes a bolt extending through the base, and an elastic sleeve engaging with the bolt under the base. The sleeve defines a hole and the hole has a configuration such that the sleeve securely clasp the bolt. The bolt extends through the base and engages in the hole of the sleeve.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a heat dissipation device, more particularly to a heat dissipation device with bolts mounted thereon.
  • 2. Description of Related Art
  • A conventional heat dissipation device, for dissipating heat generated by an electronic component on a printed circuit board, includes a base connecting with the electronic component, a plurality of fins formed on a top surface of the base and a plurality of bolts extending through the base for engaging with corresponding nuts to mounting the heat dissipation device to the printed circuit board. Each bolt includes a head and a thread end. A spring fits is encircling the bolt and is sandwiched between the head of the bolt and the base. Before the heat dissipation device mounted to the printed circuit board, the thread end of the bolt is screwed engaging in a corresponding screw thread hole defined in the base, and the springs loosely fit around the bolts. When transporting, the bolts drop from the base along the screw thread of the base because of vibration or other factors, which results in missing of the bolts from the heat dissipation device. This has adversely affected assembly quality of the heat dissipation device when the heat dissipation device is mounted to the printed circuit board.
  • What is needed, therefore, is a heat dissipation device which has bolts securely keeping with the heat dissipation device when transporting.
    • SUMMARY OF THE INVENTION
  • A heat dissipation device includes a base, a fin group mounted on a top surface of the base, and a plurality of fasteners secured on the base. Each fastener includes a bolt extending through the base, and an elastic sleeve engaging with the bolt under the base. The sleeve defines a hole and the hole has a configuration such that the sleeve securely clasp the bolt. The bolt extends through the base and engages in the hole of the sleeve.
  • Other advantages and novel features will become more apparent from the following detailed description of preferred embodiments when taken in conjunction with the accompanying drawings, in which:
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an assembled view of a heat dissipation device in accordance with a preferred embodiment of the present invention;
  • FIG. 2 is an exploded view of FIG. 1; and
  • FIG. 3 is an inverted view of FIG. 3.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • Referring to FIG. 1, a heat dissipation device in accordance with a preferred embodiment of the present invention comprises a base 10 adapted for contacting with an electronic component (not shown) mounted on a printed circuit board (not shown), a fin group 20 mounted on a top of the base 10, a pair of heat pipes 30 sandwiched between the fin group 20 and the base 10, and a plurality of fasteners 40 secured on the base 10.
  • Referring to FIGS. 2-3 also, the fin group 20 consists of a plurality of single fins 21. The fins 21 are spaced from each other such that channels (not labeled) are evenly defined between the fins 21. Each fin 21 comprises a rectangular body 211, a pair of clasps 213 formed on opposite ends of a top edge of the body 211, and an elongated flange 215 formed on a bottom edge of the body 211 along the same direction of the clasps 213. The clasps 213 of the adjacent fins 21 are clasped each other, thus, the fin group 20 is formed. The flanges 215 are assembled together to form a flat bottom surface 217 to connect with the base 10. A cutout (not labeled) is defined at a rear end of the fin group 20 to prevent the fin group 20 and the fastener 40 from interfering with each other when the fasteners 40 are mounted on the base 10.
  • Each heat pipe 30 is flattened and comprises a top surface (not shown) and a bottom surface (not shown) opposite to the top surface. Each heat pipe 30 has a straight evaporating portion 31 and two bent condensing portions 33 extending from opposite ends of the evaporating portion 31. When the heat pipes 30 are soldered in the base 10, the evaporating portions 31 are parallel and near to each other, and corresponding condensing portions 33 are spaced from each other. Thus, a distance between the corresponding condensing portions 33 is larger than that between the evaporating portions 33. The heat pipes 30 defines an X-shaped configuration in the base 10. [0015] The base 10 has a rectangular configuration and is made of metal such as aluminum or copper which has a high degree of heat conductivity. A length of the base 10 is larger than that of the fin group 20. The base 10 has a bottom surface (not labeled) and a top surface (not labeled) opposite to the bottom surface. The bottom surface of the base 10 intimately contacts with the electronic component. The bottom surface 217 of the fin group 20 thermally contacts with the top surface of the base 10. Two grooves 11 are defined at a top portion of the base 10 along a longitudinal direction of the base 10. The heat pipes 30 are received in the grooves 11. The top surface of the heat pipes 30 and the top surface of the base 10 are coplanar. Each groove 11 has a straight portion (not labeled) located at a centre of the base 10 and two bent portions (not labeled) extending from opposite ends of the straight portion and located at a front and rear portion of the base 10 respectively. The straight portions of the grooves 11 are adjoining to each other, and the bent portions at the front or rear portion of the base 10 are spaced from each other. Thus, the front and the rear portions of the base 10 form a substantially triangular protrusion portion 13 respectively. Two bulges 15 extend from the base 10 along a transverse direction of the base 10. The bulges 15 and the centre of the protrusion portions 13 define four counterbores 17, respectively. Each counterbore 17 defines a first through hole (not labeled) at a top portion of the base 10 and a smaller second through hole (not labeled) at a bottom portion of the base 10. Each fastener 40 is mounted in each counterbore 17.
  • Each fastener 40 comprises a bolt 41 received in the counterbore 17, a spring 43 encircling the bolt 41 and an elastic sleeve 45 engaged with the bolt 41. The bolt 41 has a circular head 411 and a shaft 413 extending downwardly from the head 411. The shaft 413 terminates with a screw end adapted for engaging in a nut (not shown) or a back plate (not shown) to mount the heat dissipation device on the printed circuit board. The spring 43 has an outer diameter smaller than a diameter of the head 411 and larger than a diameter of the shaft 413. Each sleeve 45 is made of elastic material such as rubber and comprises a cylindrical base 453 and a cylindrical mounting portion 451 with a through hole 457 extending through a centre of the base 453. The mounting portion 451 has a diameter larger than that of the second through hole of the counterbore 17. The through hole 457 has a diameter smaller than that of the shaft 413 of the bolt 41. In this embodiment, the mounting portion 451 has a circular cross section, and the through hole 457 is rectangular in the cross section. The shaft 413 of each bolt 41 extends the counterbore 17 and engages in the sleeve 45, thus, the bolt 41 is stably mounted on the base 10.
  • In assembly, the heat pipes 30 are soldered in the grooves 11 of the base 10, and the fin group 20 are soldered on the top surface of the base 10, and the fasteners 40 are secured on the base 10. A rear edge of the fin group 20 is aligned with a rear edge of the base 10. The fastener 40 located at the rear end of the base 10 is positioned in the cutout of the fin group 20. A front end of the fin group 20 is spaced from a front end of the base 10 and not covers the fastener 40 located at the front end of the base 10.
  • It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.

Claims (14)

1. A heat dissipation device adapted for dissipating heat generated by an electronic component mounted on a printed circuit board comprising:
a base;
a fin group mounted on a top surface of the base; and
a plurality of fasteners secured on the base, each fastener comprising a bolt extending through the base and an elastic sleeve engaging with the bolt under the base;
wherein the sleeve defines a hole and the hole has a configuration such that the sleeve securely clasp the bolt, and the bolt extends through the base and engages in the hole of the sleeve.
2. The heat dissipation device as claimed in claim 1 further comprising a spring encircling the bolt of each of the fasteners, wherein the bolt has a head and a shaft extending from the head, and the spring is sandwich between the head of the bolt and the base.
3. The heat dissipation device as claimed in claim 2, wherein the spring has an out diameter smaller than a diameter of the head and larger than a diameter of the shaft of the bolt of each of the fastener, and the diameter of the shaft is larger than that of the hole of the sleeve, the shaft extending through the base and engaging in the hole of the sleeve.
4. The heat dissipation device as claimed in claim 2, wherein the base defines a plurality of counterbores receiving the fasteners therein, each counterbore having a first through hole located at a top portion of the base and a smaller second through hole located at a bottom portion of the base, a part of spring being received in the first through hole and the shaft of the bolt extending through the counterbore.
5. The heat dissipation device as claimed in claim 4, wherein the sleeve has a diameter larger than that of the second through hole of the counterbore and is located under a bottom surface of the base.
6. The heat dissipation device as claimed in claim 1, wherein the sleeve is made of elastic material.
7. The heat dissipation device as claimed in claim 1 further comprising a pair of heat pipes sandwiched between the fin group and the base.
8. The heat dissipation device as claimed in claim 7, wherein each of heat pipe has a straight evaporating portion located at a centre of the base and two bent condensing portions extending from opposite ends of the evaporating portion, and a distance between the corresponding condensing portions is larger than that of between the evaporating portions.
9. The heat dissipation device as claimed in claim 7, wherein each of the heat pipes is flattened and comprises a top surface, and the top surfaces of the heat pipes and the top surface of the base are coplanar.
10. The heat dissipation device of claim 8, wherein the pair of heat pipes define an X-shaped configuration in the base.
11. The heat dissipation device as claimed in claim 1, wherein the fin group comprises a plurality of fins and the fins are clasped each other by a clasp formed on a top edge of each of the fins.
12. The heat dissipation device as claimed in claim 11, wherein each of the fins of the fin group further comprises an elongated flange formed on a bottom edge thereof, and the flange are assembled together to contact the top surface of the base.
13. The heat dissipation device of claim 1, wherein the hole of the sleeve is rectangular in a cross section direction of the sleeve.
14. The heat dissipation device of claim 1, wherein the sleeve comprises a base portion and mounting portion extending from the base, the hole extending through a centre of the mounting portion.
US11/959,323 2007-12-18 2007-12-18 Heat dissipation device Abandoned US20090151897A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100212869A1 (en) * 2009-02-26 2010-08-26 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device

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US4907929A (en) * 1986-11-25 1990-03-13 Johnston Jr Raymond B Bolt and nut cover
US5642973A (en) * 1995-12-26 1997-07-01 Pretty; Daniel Glenn Plumbing cleanout cover
US6135691A (en) * 1996-02-09 2000-10-24 Romilly International Ltd. Protective caps for bolts with nuts
US6307748B1 (en) * 2000-04-20 2001-10-23 Foxconn Precision Components Co., Ltd. Heat sink clip assembly
US6317328B1 (en) * 2001-04-05 2001-11-13 Compal Electronics, Inc. Heat-radiating module structure
US6412546B1 (en) * 2000-03-15 2002-07-02 Foxconn Precision Components Co., Ltd. Heat dissipation device for integrated circuits
US6588997B1 (en) * 2002-02-08 2003-07-08 King Slide Works Co., Ltd. Bolt fixing assembly
US6676353B1 (en) * 2002-07-15 2004-01-13 Harry M. Haytayan Self-drilling, self-tapping screws
US20060056159A1 (en) * 2004-09-10 2006-03-16 Foxconn Technology Co., Ltd. Locking device for heat sink
US20060098408A1 (en) * 2004-06-11 2006-05-11 Foxconn Technology Co., Ltd. Heat dissipating device
US7057897B2 (en) * 2004-04-07 2006-06-06 Asia Vital Component Co., Ltd. Means for securing a cooling device
US20060198716A1 (en) * 2005-03-02 2006-09-07 Milo Tseng Fastener cap
US20070107871A1 (en) * 2005-11-17 2007-05-17 Foxconn Technology Co., Ltd. Heat sink
US20070131387A1 (en) * 2003-09-12 2007-06-14 Kenya Kawabata Heat sink with heat pipes and method for manufacturing the same
US7342795B2 (en) * 2005-05-20 2008-03-11 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat sink assembly
US7435099B2 (en) * 2006-12-21 2008-10-14 Cinch Connectors, Inc. Electrical connector and packaging assembly
US7729122B2 (en) * 2006-10-13 2010-06-01 Illinois Tool Works Inc. Fastener for heat sinks

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4907929A (en) * 1986-11-25 1990-03-13 Johnston Jr Raymond B Bolt and nut cover
US5642973A (en) * 1995-12-26 1997-07-01 Pretty; Daniel Glenn Plumbing cleanout cover
US6135691A (en) * 1996-02-09 2000-10-24 Romilly International Ltd. Protective caps for bolts with nuts
US6412546B1 (en) * 2000-03-15 2002-07-02 Foxconn Precision Components Co., Ltd. Heat dissipation device for integrated circuits
US6307748B1 (en) * 2000-04-20 2001-10-23 Foxconn Precision Components Co., Ltd. Heat sink clip assembly
US6317328B1 (en) * 2001-04-05 2001-11-13 Compal Electronics, Inc. Heat-radiating module structure
US6588997B1 (en) * 2002-02-08 2003-07-08 King Slide Works Co., Ltd. Bolt fixing assembly
US6676353B1 (en) * 2002-07-15 2004-01-13 Harry M. Haytayan Self-drilling, self-tapping screws
US20070131387A1 (en) * 2003-09-12 2007-06-14 Kenya Kawabata Heat sink with heat pipes and method for manufacturing the same
US7057897B2 (en) * 2004-04-07 2006-06-06 Asia Vital Component Co., Ltd. Means for securing a cooling device
US20060098408A1 (en) * 2004-06-11 2006-05-11 Foxconn Technology Co., Ltd. Heat dissipating device
US20060056159A1 (en) * 2004-09-10 2006-03-16 Foxconn Technology Co., Ltd. Locking device for heat sink
US20060198716A1 (en) * 2005-03-02 2006-09-07 Milo Tseng Fastener cap
US7342795B2 (en) * 2005-05-20 2008-03-11 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat sink assembly
US20070107871A1 (en) * 2005-11-17 2007-05-17 Foxconn Technology Co., Ltd. Heat sink
US7729122B2 (en) * 2006-10-13 2010-06-01 Illinois Tool Works Inc. Fastener for heat sinks
US7435099B2 (en) * 2006-12-21 2008-10-14 Cinch Connectors, Inc. Electrical connector and packaging assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100212869A1 (en) * 2009-02-26 2010-08-26 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device

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AS Assignment

Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LI, WU;WU, YI-QIANG;REEL/FRAME:020265/0083

Effective date: 20071210

Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.,

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Effective date: 20071210

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