US20090007932A1 - Aqueous composition containing a semiconductor - Google Patents
Aqueous composition containing a semiconductor Download PDFInfo
- Publication number
- US20090007932A1 US20090007932A1 US12/025,324 US2532408A US2009007932A1 US 20090007932 A1 US20090007932 A1 US 20090007932A1 US 2532408 A US2532408 A US 2532408A US 2009007932 A1 US2009007932 A1 US 2009007932A1
- Authority
- US
- United States
- Prior art keywords
- substrate
- aqueous composition
- semiconductor
- cleaning
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 55
- 239000000203 mixture Substances 0.000 title claims abstract description 34
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 28
- 238000004140 cleaning Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 16
- 239000004408 titanium dioxide Substances 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 11
- 239000002318 adhesion promoter Substances 0.000 claims description 8
- 150000002500 ions Chemical class 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 7
- 239000013543 active substance Substances 0.000 claims description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 5
- 239000002270 dispersing agent Substances 0.000 claims description 4
- 230000004048 modification Effects 0.000 claims description 4
- 238000012986 modification Methods 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 238000004627 transmission electron microscopy Methods 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910052703 rhodium Inorganic materials 0.000 claims description 3
- 239000010948 rhodium Substances 0.000 claims description 3
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 3
- 239000002562 thickening agent Substances 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 2
- 230000000737 periodic effect Effects 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 239000011435 rock Substances 0.000 claims description 2
- 239000002023 wood Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 24
- -1 platinum ions Chemical class 0.000 claims 1
- 238000005406 washing Methods 0.000 claims 1
- 239000012459 cleaning agent Substances 0.000 abstract description 16
- 230000009471 action Effects 0.000 description 15
- 239000000463 material Substances 0.000 description 14
- 239000006185 dispersion Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 239000010410 layer Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 241000894006 Bacteria Species 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000004659 sterilization and disinfection Methods 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- 241000195940 Bryophyta Species 0.000 description 3
- 241000195493 Cryptophyta Species 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000249 desinfective effect Effects 0.000 description 3
- 239000003814 drug Substances 0.000 description 3
- 239000011164 primary particle Substances 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000003899 bactericide agent Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 244000005700 microbiome Species 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 241000233866 Fungi Species 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 240000004808 Saccharomyces cerevisiae Species 0.000 description 1
- 241000700605 Viruses Species 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000013361 beverage Nutrition 0.000 description 1
- 230000007227 biological adhesion Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001246 colloidal dispersion Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000010353 genetic engineering Methods 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 231100000206 health hazard Toxicity 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 208000015181 infectious disease Diseases 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000010534 mechanism of action Effects 0.000 description 1
- MYWUZJCMWCOHBA-VIFPVBQESA-N methamphetamine Chemical compound CN[C@@H](C)CC1=CC=CC=C1 MYWUZJCMWCOHBA-VIFPVBQESA-N 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001699 photocatalysis Effects 0.000 description 1
- 239000011941 photocatalyst Substances 0.000 description 1
- 231100000760 phototoxic Toxicity 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 230000002110 toxicologic effect Effects 0.000 description 1
- 231100000027 toxicology Toxicity 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0063—Photo- activating compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/12—Water-insoluble compounds
- C11D3/1213—Oxides or hydroxides, e.g. Al2O3, TiO2, CaO or Ca(OH)2
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/20—Water-insoluble oxides
-
- C11D2111/46—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
Definitions
- the invention relates to the use of an aqueous composition comprising a semiconductor as a cleaning agent for surfaces.
- This relates in particular to textiles, household surfaces, for example working surfaces in the kitchen, applications in the sanitation sector, building facades, floor coverings or other surfaces which are exposed to weather or organic impurities such as exhaust gases.
- it is desirable or even necessary to clean certain surfaces regularly or keep them low in microbes or even microbe-free.
- the disadvantage with the known cleaning processes is that infection or fouling can start again immediately after the cleaning operation.
- the bactericidal action depends on the care of the respective cleaning operative and the cleaning intervals.
- a high microbe-free or “clean” state can therefore only be maintained laboriously and with great effort.
- the problem is made more difficult by the fact that some bacteria or microbes develop a certain resistance toward the bactericidal agents, so that disinfection, despite careful work, does not in fact occur, or occurs only to an insufficient extent. Under some circumstances, this error is not even noticed.
- Extensive disinfection measures using formaldehyde or ethylene oxide represent great problems from the toxicological aspect, since these gases penetrate the material and have relatively long outgassing times. As a result, a larger supply of instruments or rooms must be kept ready, since the availability is restricted by these times.
- DE-A 196 54 109 discloses designing the articles to be disinfected to have a surface layer which comprises a semiconductor material and into which is coupled UV radiation from a UV radiation source. As a result, the surface layer is disinfected or acts in an oxidizing manner.
- such a solution has the disadvantage that the articles to be treated must be fixed to a surface layer which comprises a semiconductor material.
- this object is achieved by using an aqueous composition comprising a semiconductor at a concentration of from 5 to 50 mg, based on 1 l of aqueous composition, as cleaning agent for surfaces, under the action of light.
- aqueous compositions which comprise a semiconductor at high dilution. It has been found that, owing to the high dilution of the semiconductor, no continuous layers form on the surfaces to be treated. This leads to a type of discontinuous application of the semiconductor. It has surprisingly been found that this is essential for good activity of the photocatalyst. Although the mechanism of action has not yet been completely explained, it is assumed that owing to the fact that the semiconductor is present in particles which are isolated from one another, the electron holes and electrons formed by the photocatalytic process cannot migrate through the semiconductor and therefore are more available for reaction compared with organic substances or microorganisms.
- an aqueous composition which comprises a semiconductor at a concentration of from 10 to 50 mg, based on 11 of aqueous composition.
- the semiconductor is titanium dioxide, preferably a titanium dioxide which is at least 70% by weight in the anatase modification.
- the semiconductor not in pure form, but in the form of a semiconductor doped with one or more transition metals of subgroup 8, in particular a titanium dioxide doped with platinum and/or rhodium.
- the doped semiconductor is to contain at least 60% by weight of the semiconductor ion and less than 40% by weight of the doping ion.
- Those which are particularly active are doped semiconductors having a regular distribution of the doping ions in the semiconductor matrix, and are described, for example, in WO 99/33564.
- the phototoxic and oxidative action of the semiconductor material in the aqueous composition is effected by light, that it to say by electromagnetic radiation, in particular of a wavelength in the range from 350 to 400 nm, preferably 380 nm, provided that undoped semiconductor material is used.
- undoped semiconductor material can be used preferably in the outdoors field or in the indoors field with the action of artificial light.
- the cleaning and/or disinfection action is preferably achieved using light of a wavelength in the range from 400 to 650 nm. Daylight is sufficient for this. Direct solar irradiation is not required, and diffuse light, for example in the indoors field, is also sufficient.
- any artificial light source which gives off radiation in the abovementioned wavelength range can also activate the semiconductor material.
- Doped semiconductor material can thus be used without restrictions in the outdoors field, just as in the indoors field, with the action of sunlight or diffuse light in the indoors field, as also under the action of artificial light in the indoors field.
- Semiconductor materials are generally not water-soluble; aqueous compositions of same can be provided in the form of dispersions by physical distribution of finely divided semiconductor particles in water. Such dispersions are used according to the invention for cleaning surfaces.
- the use in the outdoors field is possible for treating buildings or paths thereof, for example facades or outdoor surrounds of buildings, such as footpath paving slabs, to combat fouling due to macroscopic organisms, such as algae, lichens, mosses or slime-forming bacteria, or in the indoors sector for cleaning and disinfecting in the hygienically relevant sectors, for example in hospitals, in food-processing enterprises, in the beverage, cosmetics or pharmaceuticals industry, in bioengineering and genetic engineering, in particular against microscopic organisms, such as bacteria, fungi, viruses or amebae.
- buildings or paths thereof for example facades or outdoor surrounds of buildings, such as footpath paving slabs
- macroscopic organisms such as algae, lichens, mosses or slime-forming bacteria
- the indoors sector for cleaning and disinfecting in the hygienically relevant sectors, for example in hospitals, in food-processing enterprises, in the beverage, cosmetics or pharmaceuticals industry, in bioengineering and genetic engineering, in particular against microscopic organism
- the semiconductor material preferably titanium dioxide, is particularly active in a mean size of the primary particles, measured by transmission electron microscopy, in the range from 10 to 2000 nm, preferably in the range from about 20 to 200 nm.
- aqueous composition comprising a semiconductor without further additives as cleaning agent.
- auxiliaries listed hereinafter can be added: adhesion promoters, solubilizers, thickeners, surface-active agents and dispersants, in the amounts customary therefor.
- adhesion promoters are substances which enhance the adhesion of the aqueous composition to surfaces.
- the semiconductor material is to remain on the surfaces to be treated for a relatively long time. Owing to the low semiconductor concentration, after the application, for example by spraying, on the surface to be treated, a continuous layer does not form.
- the adhesion promoter ensures that the individual isolated semiconductor particles also remain sufficiently long on the surface and thus can develop their activity.
- Preferred adhesion promoters are short-chain polymers, for example natural and synthetic rubbers, polyacrylates, polyesters, polychloroprenes, polyisobutenes, polyvinyl ethers or polyurethanes. These can also be used in combination with other additives, such as resins, plasticizers and/or antioxidants.
- solubilizers act so that substances dissolve in an enhanced manner in a solvent in which they are usually only slightly soluble, in the present case customarily sparingly water-soluble organic substances.
- Solubilizers which can serve in the present case are, for example, organic solvents which are water-miscible, such as short-chain alcohols, in particular ethanol or isopropanol.
- the thickeners preferably used are to ensure that the cleaning agent, in the case of inclined or vertical surfaces, does not run off so rapidly and ensures a relatively long contact with the surface.
- These are organic high-molecular-weight substances which absorb liquids, swelling in the process and finally transforming into viscous true solutions or colloidal dispersions, to increase the viscosity of liquids and improve the thixotropic properties of gels.
- the surfactants generally fulfil a number of roles: firstly they improve the wetting of the surfaces to be treated. Especially in the case of structured surfaces, for example floor coverings or house facades, the cleaner can as a result penetrate better into the narrow gaps and cracks. Furthermore, owing to the action of surface-active substances, organic compounds, for example oils or fats, to which inorganic dirt particles frequently adhere, can be infiltrated and dispersed. As a result the surface-active substances support the action of titanium dioxide which breaks down the abovementioned compounds by oxidation with the result that the dirt can very readily be washed off from the surface. In addition, the surface-active substances can bring about formation of a stable foam, as a result of which the cleaner remains at the site of action for a longer period.
- Dispersants that is to say substances which facilitate the dispersion of solid particles in a dispersion medium by lowering the surface tension between the two components, that is to say inducing wetting. Dispersants ensure that the solid constituents of the dispersion, predominantly the semiconductors, in particular titanium dioxide particles, do not sediment, but remain in suspension.
- aqueous composition comprising a semiconductor can, according to the invention, be applied simply and in a targeted manner onto the surfaces to be treated, preferably by spraying.
- a distributor for example a brush, a sponge or a cloth.
- inventive buildings or parts thereof or outdoor surrounds of buildings can be treated. Further preference is given to the use for cleaning in the indoors field, in particular as kitchen or sanitary cleaner or in medicine, the pharmaceutical industry or the food industry.
- the cleaning agent is applied and, after a certain time of action, is removed again, for example by wiping or rinsing off.
- the time of action must conform with the predetermined reduction factors. Otherwise the use proceeds similarly to that described above for kitchen or sanitary cleaners.
- the disinfecting and/or cleaning action can be further enhanced by exposing the surfaces additionally to UV light.
- the invention also relates to a semiconductor powder, in particular titanium dioxide, preferably titanium dioxide in the anatase modification of a mean primary particle size, measured by transmission electron microscopy, in the range from 10 to 2000 nm, preferably in the range from 20 to 200 nm, for use as claimed in one of claims 1 to 11 .
- a semiconductor powder in particular titanium dioxide, preferably titanium dioxide in the anatase modification of a mean primary particle size, measured by transmission electron microscopy, in the range from 10 to 2000 nm, preferably in the range from 20 to 200 nm, for use as claimed in one of claims 1 to 11 .
- the invention thus has the advantage that any surfaces can be cleaned and/or disinfected by simple spraying without any fixing of the semiconductor in a layer being necessary for this. Activating the semiconductor material does not require a separate radiation source being available, daylight, even diffuse daylight, is sufficient for this.
- the cleaning agent acts over a relatively long period of several months, and the treatment can be repeated as often as desired after the effect has decayed.
- the invention makes it possible to detach inorganic impurities, since the biological adhesion promoter in the form of extra polymeric substances of the microorganisms is destroyed or removed.
- a further advantage is that development of resistance does not occur on the treated surfaces.
- an aqueous dispersion containing 50 mg of titanium dioxide in the anatase modification with a mean primary particle size of 21 nm (the particle size was determined by transmission electron microscopy) per liter of dispersion was applied as cleaning agent in the outdoors field to various materials such as wood, washed concrete slabs, natural rocks, plastics and masonry walls.
- This aqueous composition was applied to said surfaces using a spray bottle not only without further auxiliaries, but also with addition of 0.5% by weight, based on total weight of aqueous dispersion, of an acrylate polymer as adhesion promoter and 5% by weight, based on total weight of aqueous dispersion, of isopropanol as solubilizer.
- the surfaces were exposed only in part to the cleaning agent, so that untreated points were immediately next to treated points and as a result immediate visual assessment of the cleaning action was possible.
Abstract
The use of an aqueous composition comprising a semiconductor as cleaning agent for surfaces in the outdoors field and indoors field is proposed.
Description
- The invention relates to the use of an aqueous composition comprising a semiconductor as a cleaning agent for surfaces.
- In many areas, the unwanted biological colonization of surfaces with bacteria, yeasts, algae, mosses, lichens etc. plays an important part, which can give rise to health hazards, corrosion, danger of slipping and unsightliness.
- This relates in particular to textiles, household surfaces, for example working surfaces in the kitchen, applications in the sanitation sector, building facades, floor coverings or other surfaces which are exposed to weather or organic impurities such as exhaust gases. In all of these sectors, that is to say in the indoors and outdoors sectors equally, it is desirable or even necessary to clean certain surfaces regularly or keep them low in microbes or even microbe-free.
- It is known for this purpose to keep open surfaces clean by mechanical cleaning using bactericidal agents.
- The disadvantage with the known cleaning processes is that infection or fouling can start again immediately after the cleaning operation. The bactericidal action depends on the care of the respective cleaning operative and the cleaning intervals. A high microbe-free or “clean” state can therefore only be maintained laboriously and with great effort. In addition, the problem is made more difficult by the fact that some bacteria or microbes develop a certain resistance toward the bactericidal agents, so that disinfection, despite careful work, does not in fact occur, or occurs only to an insufficient extent. Under some circumstances, this error is not even noticed.
- Extensive disinfection measures using formaldehyde or ethylene oxide, for example at quarantine stations, represent great problems from the toxicological aspect, since these gases penetrate the material and have relatively long outgassing times. As a result, a larger supply of instruments or rooms must be kept ready, since the availability is restricted by these times.
- The photo-induced disinfecting activity of semiconductor materials, in particular titanium dioxide, is known and is described, for example, in Blake D. M. et al. in Sep. Pur. Meth. 28 (1999), pages 1 to 50.
- DE-A 196 54 109 discloses designing the articles to be disinfected to have a surface layer which comprises a semiconductor material and into which is coupled UV radiation from a UV radiation source. As a result, the surface layer is disinfected or acts in an oxidizing manner. However, such a solution has the disadvantage that the articles to be treated must be fixed to a surface layer which comprises a semiconductor material.
- In contrast, it is an object of the invention to provide a cleaning process for surfaces which is easy to handle, makes possible individual and targeted treatment of the sites which are to be disinfected, using a cleaning agent, which, when required, can be removed again without problem and specifically.
- In particular, it is an object of the invention to provide a cleaning agent having significantly improved activity compared with known cleaning agents.
- According to the invention this object is achieved by using an aqueous composition comprising a semiconductor at a concentration of from 5 to 50 mg, based on 1 l of aqueous composition, as cleaning agent for surfaces, under the action of light.
- Thus, according to the invention, aqueous compositions are used which comprise a semiconductor at high dilution. It has been found that, owing to the high dilution of the semiconductor, no continuous layers form on the surfaces to be treated. This leads to a type of discontinuous application of the semiconductor. It has surprisingly been found that this is essential for good activity of the photocatalyst. Although the mechanism of action has not yet been completely explained, it is assumed that owing to the fact that the semiconductor is present in particles which are isolated from one another, the electron holes and electrons formed by the photocatalytic process cannot migrate through the semiconductor and therefore are more available for reaction compared with organic substances or microorganisms. In contrast, in the case of a continuous, extended semiconductor layer, as a result of the migration of electrons and electron holes, these are no longer available for reactions. Owing to the fact that the electrons and electron holes can be distributed over broad sections in the semiconductor layer, the probability that they are available for reactions at the surface of the semiconductor is less. Consequently, a markedly poorer activity of disinfection or cleaning results. Furthermore, these processes could lead to the fact that the probability of recombination of electrons and electron holes increases. This would be the reverse of the effect which was started by the action of light, likewise with the consequence of decreased activity.
- Particularly preferably an aqueous composition is used which comprises a semiconductor at a concentration of from 10 to 50 mg, based on 11 of aqueous composition.
- It is preferred in particular that the semiconductor is titanium dioxide, preferably a titanium dioxide which is at least 70% by weight in the anatase modification.
- It is also possible to use the semiconductor, not in pure form, but in the form of a semiconductor doped with one or more transition metals of subgroup 8, in particular a titanium dioxide doped with platinum and/or rhodium. In this case the doped semiconductor is to contain at least 60% by weight of the semiconductor ion and less than 40% by weight of the doping ion. Those which are particularly active are doped semiconductors having a regular distribution of the doping ions in the semiconductor matrix, and are described, for example, in WO 99/33564.
- The phototoxic and oxidative action of the semiconductor material in the aqueous composition is effected by light, that it to say by electromagnetic radiation, in particular of a wavelength in the range from 350 to 400 nm, preferably 380 nm, provided that undoped semiconductor material is used. Thus undoped semiconductor material can be used preferably in the outdoors field or in the indoors field with the action of artificial light. In the event that, as described above, doped semiconductors are used, the cleaning and/or disinfection action is preferably achieved using light of a wavelength in the range from 400 to 650 nm. Daylight is sufficient for this. Direct solar irradiation is not required, and diffuse light, for example in the indoors field, is also sufficient. Obviously, any artificial light source which gives off radiation in the abovementioned wavelength range can also activate the semiconductor material. Doped semiconductor material can thus be used without restrictions in the outdoors field, just as in the indoors field, with the action of sunlight or diffuse light in the indoors field, as also under the action of artificial light in the indoors field.
- Semiconductor materials are generally not water-soluble; aqueous compositions of same can be provided in the form of dispersions by physical distribution of finely divided semiconductor particles in water. Such dispersions are used according to the invention for cleaning surfaces.
- In this case there are no restrictions with respect to the surfaces to be treated and the impurities to be removed: the use in the outdoors field is possible for treating buildings or paths thereof, for example facades or outdoor surrounds of buildings, such as footpath paving slabs, to combat fouling due to macroscopic organisms, such as algae, lichens, mosses or slime-forming bacteria, or in the indoors sector for cleaning and disinfecting in the hygienically relevant sectors, for example in hospitals, in food-processing enterprises, in the beverage, cosmetics or pharmaceuticals industry, in bioengineering and genetic engineering, in particular against microscopic organisms, such as bacteria, fungi, viruses or amebae.
- The semiconductor material, preferably titanium dioxide, is particularly active in a mean size of the primary particles, measured by transmission electron microscopy, in the range from 10 to 2000 nm, preferably in the range from about 20 to 200 nm.
- It is possible to use the aqueous composition comprising a semiconductor without further additives as cleaning agent. However, preferably, one or more of the auxiliaries listed hereinafter can be added: adhesion promoters, solubilizers, thickeners, surface-active agents and dispersants, in the amounts customary therefor.
- On the auxiliaries individually:
- adhesion promoters are substances which enhance the adhesion of the aqueous composition to surfaces. The semiconductor material is to remain on the surfaces to be treated for a relatively long time. Owing to the low semiconductor concentration, after the application, for example by spraying, on the surface to be treated, a continuous layer does not form. The adhesion promoter ensures that the individual isolated semiconductor particles also remain sufficiently long on the surface and thus can develop their activity. Preferred adhesion promoters are short-chain polymers, for example natural and synthetic rubbers, polyacrylates, polyesters, polychloroprenes, polyisobutenes, polyvinyl ethers or polyurethanes. These can also be used in combination with other additives, such as resins, plasticizers and/or antioxidants.
- The solubilizers preferably used act so that substances dissolve in an enhanced manner in a solvent in which they are usually only slightly soluble, in the present case customarily sparingly water-soluble organic substances. Solubilizers which can serve in the present case are, for example, organic solvents which are water-miscible, such as short-chain alcohols, in particular ethanol or isopropanol.
- The thickeners preferably used are to ensure that the cleaning agent, in the case of inclined or vertical surfaces, does not run off so rapidly and ensures a relatively long contact with the surface. These are organic high-molecular-weight substances which absorb liquids, swelling in the process and finally transforming into viscous true solutions or colloidal dispersions, to increase the viscosity of liquids and improve the thixotropic properties of gels.
- Further auxiliaries which can be used are interface-active substances (surfactants). The surfactants generally fulfil a number of roles: firstly they improve the wetting of the surfaces to be treated. Especially in the case of structured surfaces, for example floor coverings or house facades, the cleaner can as a result penetrate better into the narrow gaps and cracks. Furthermore, owing to the action of surface-active substances, organic compounds, for example oils or fats, to which inorganic dirt particles frequently adhere, can be infiltrated and dispersed. As a result the surface-active substances support the action of titanium dioxide which breaks down the abovementioned compounds by oxidation with the result that the dirt can very readily be washed off from the surface. In addition, the surface-active substances can bring about formation of a stable foam, as a result of which the cleaner remains at the site of action for a longer period.
- Further preferably usable auxiliaries are dispersants, that is to say substances which facilitate the dispersion of solid particles in a dispersion medium by lowering the surface tension between the two components, that is to say inducing wetting. Dispersants ensure that the solid constituents of the dispersion, predominantly the semiconductors, in particular titanium dioxide particles, do not sediment, but remain in suspension.
- The aqueous composition comprising a semiconductor can, according to the invention, be applied simply and in a targeted manner onto the surfaces to be treated, preferably by spraying. However, it is also possible to apply the cleaning agent using a distributor, for example a brush, a sponge or a cloth.
- It is completely problem-free to remove the applied cleaning agent in a targeted manner, as required, from the desired points, in the simplest manner by rinsing off with water, if appropriate using a high-pressure cleaner. The removal can be facilitated by adding a surface-active substance to the water. It is also possible to remove the cleaning agent dry.
- With respect to the surface to be treated, there are in principle no restrictions, these can be equally smooth or structured, and disposed in the indoor or outdoor area. Particularly preferably, inventive buildings or parts thereof or outdoor surrounds of buildings can be treated. Further preference is given to the use for cleaning in the indoors field, in particular as kitchen or sanitary cleaner or in medicine, the pharmaceutical industry or the food industry.
- For the use as a surface cleaner indoors, for example, as a kitchen or sanitary cleaner, the cleaning agent is applied and, after a certain time of action, is removed again, for example by wiping or rinsing off.
- In fields where hygiene is critical, such as in medicine, the pharmaceutical industry or food industry, the time of action must conform with the predetermined reduction factors. Otherwise the use proceeds similarly to that described above for kitchen or sanitary cleaners. The disinfecting and/or cleaning action can be further enhanced by exposing the surfaces additionally to UV light.
- The invention also relates to a semiconductor powder, in particular titanium dioxide, preferably titanium dioxide in the anatase modification of a mean primary particle size, measured by transmission electron microscopy, in the range from 10 to 2000 nm, preferably in the range from 20 to 200 nm, for use as claimed in one of claims 1 to 11.
- Particular preference is also given to a semiconductor powder containing at least 60 mol % semiconductor ions and less than 40 mol % of one or more doping ions from subgroup 8 of the Periodic Table of the Elements, in particular of rhodium and/or platinum, for use as claimed in one of claims 4 to 11.
- The invention thus has the advantage that any surfaces can be cleaned and/or disinfected by simple spraying without any fixing of the semiconductor in a layer being necessary for this. Activating the semiconductor material does not require a separate radiation source being available, daylight, even diffuse daylight, is sufficient for this. The cleaning agent acts over a relatively long period of several months, and the treatment can be repeated as often as desired after the effect has decayed. The invention makes it possible to detach inorganic impurities, since the biological adhesion promoter in the form of extra polymeric substances of the microorganisms is destroyed or removed. A further advantage is that development of resistance does not occur on the treated surfaces.
- The invention will now be described in more detail with reference to an example.
- The action of the inventive cleaning agent was established in the following experiments: an aqueous dispersion containing 50 mg of titanium dioxide in the anatase modification with a mean primary particle size of 21 nm (the particle size was determined by transmission electron microscopy) per liter of dispersion was applied as cleaning agent in the outdoors field to various materials such as wood, washed concrete slabs, natural rocks, plastics and masonry walls. This aqueous composition was applied to said surfaces using a spray bottle not only without further auxiliaries, but also with addition of 0.5% by weight, based on total weight of aqueous dispersion, of an acrylate polymer as adhesion promoter and 5% by weight, based on total weight of aqueous dispersion, of isopropanol as solubilizer. The surfaces were exposed only in part to the cleaning agent, so that untreated points were immediately next to treated points and as a result immediate visual assessment of the cleaning action was possible.
- In the experimental variant using adhesion promoter and solubilizer, a rapid action was observed, that is to say mosses, lichens and algae died off and disappeared within a few hours. In contrast, the same action, that is to say death and disappearance of the impurities was also observed in the case of treatment with the aqueous composition without auxiliaries, but was delayed in time, that is to say only after some days. In both cases the treatment exhibited a long-term action, that is to say even after several months the beneficial patterns of observations of the treated surfaces did not change.
Claims (22)
1-13. (canceled)
14. An aqueous composition comprising a semiconductor at a concentration of from 5 to 50 mg per 1 liter of aqueous composition.
15. An aqueous composition according to claim 14 , wherein the concentration of the semiconductor in the aqueous composition is from 10 to 50 mg per 1 liter of aqueous composition.
16. An aqueous composition according to claim 14 , wherein the semiconductor comprises titanium dioxide.
17. An aqueous composition according to claim 16 , wherein the titanium dioxide comprises at least 70% by weight of the anatase modification.
18. An aqueous composition according to claim 14 , wherein the semiconductor comprises a doped semiconductor.
19. An aqueous composition according to claim 18 , wherein the doped semiconductor comprises at least 60 mol % semiconductor ions and less than 40 mol % of one or more doping ions from subgroup 8 of the Periodic Table of the Elements.
20. An aqueous composition according to claim 19 , wherein the doped semiconductor is doped with rhodium and/or platinum ions.
21. An aqueous composition according to claim 14 , wherein the semiconductor comprises semiconductor particles having a mean particle size, as measured by transmission electron microscopy, of from 10 to 2000 nm.
22. An aqueous composition according to claim 21 , wherein the semiconductor particles have a mean particle size of from 20 to 200 nm.
23. An aqueous composition according to claim 14 , further comprising one or more auxiliary components selected from the group consisting of adhesion promoters, solubilizers, surface-active substances, dispersants and thickeners.
24. A method of cleaning a substrate, comprising applying the aqueous composition according to claim 14 to the substrate and exposing the substrate to light.
25. A method of cleaning a substrate according to claim 24 , wherein the step of applying comprises spraying the substrate or applying the aqueous composition to the substrate with a brush, sponge or cloth.
26. A method of cleaning a substrate according to claim 24 , wherein the step of applying comprises providing a discontinuous layer of the semiconductor on the substrate.
27. A method of cleaning a substrate according to claim 24 , wherein the substrate comprises wood, a concrete slab, natural rock, plastic or masonry.
28. A method of cleaning a substrate according to claim 24 , wherein the substrate comprises a building facade, a foot path or a floor covering.
29. A method of cleaning a substrate according to claim 24 , wherein the step of exposing the substrate to light comprises exposing the substrate to light having a wavelength in the range from 350 to 400 nm n.
30. A method of cleaning a substrate according to claim 24 , wherein the step of exposing the substrate to light comprises exposing the substrate to light having a wavelength in the range from 400 to 650 nm.
31. A method of cleaning a substrate according to claim 24 , further comprising removing the aqueous composition from the substrate.
32. A method of cleaning a substrate according to claim 24 , further comprising allowing the aqueous composition to dry and removing the resulting dried composition from the substrate.
33. A method of cleaning a substrate according to claim 31 , wherein the step of removing comprises washing off the composition with a high-pressure cleaner.
34. A substrate cleaned by the method of claim 24 .
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/025,324 US20090007932A1 (en) | 2000-12-21 | 2008-02-04 | Aqueous composition containing a semiconductor |
US12/591,996 US8172951B2 (en) | 2000-12-21 | 2009-12-07 | Method of cleaning with an aqueous composition containing a semiconductor |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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DE10064069A DE10064069A1 (en) | 2000-12-21 | 2000-12-21 | Aqueous composition containing a semiconductor |
DE10064069.9 | 2000-12-21 | ||
PCT/EP2001/015013 WO2002050224A1 (en) | 2000-12-21 | 2001-12-19 | Aqueous composition containing a semiconductor |
US10/451,400 US20040157757A1 (en) | 2000-12-21 | 2001-12-19 | Aqueous composition containing a semiconductor |
US12/025,324 US20090007932A1 (en) | 2000-12-21 | 2008-02-04 | Aqueous composition containing a semiconductor |
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US10451400 Continuation | 2001-12-19 | ||
PCT/EP2001/015013 Continuation WO2002050224A1 (en) | 2000-12-21 | 2001-12-19 | Aqueous composition containing a semiconductor |
US10/451,400 Continuation US20040157757A1 (en) | 2000-12-21 | 2001-12-19 | Aqueous composition containing a semiconductor |
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US12/591,996 Continuation US8172951B2 (en) | 2000-12-21 | 2009-12-07 | Method of cleaning with an aqueous composition containing a semiconductor |
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US20090007932A1 true US20090007932A1 (en) | 2009-01-08 |
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Application Number | Title | Priority Date | Filing Date |
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US12/025,324 Abandoned US20090007932A1 (en) | 2000-12-21 | 2008-02-04 | Aqueous composition containing a semiconductor |
US12/591,996 Expired - Fee Related US8172951B2 (en) | 2000-12-21 | 2009-12-07 | Method of cleaning with an aqueous composition containing a semiconductor |
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US10/451,400 Abandoned US20040157757A1 (en) | 2000-12-21 | 2001-12-19 | Aqueous composition containing a semiconductor |
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US12/591,996 Expired - Fee Related US8172951B2 (en) | 2000-12-21 | 2009-12-07 | Method of cleaning with an aqueous composition containing a semiconductor |
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US (3) | US20040157757A1 (en) |
DE (1) | DE10064069A1 (en) |
WO (1) | WO2002050224A1 (en) |
Cited By (1)
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US20100294304A1 (en) * | 2000-12-21 | 2010-11-25 | Massholder Karl F | Aqueous composition containing a semiconductor |
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US7736631B2 (en) | 2003-04-01 | 2010-06-15 | L'oreal S.A. | Cosmetic dye composition with a lightening effect for human keratin materials, comprising at least one fluorescent dye and at least one aminosilicone, and process of dyeing |
WO2008003632A1 (en) * | 2006-07-07 | 2008-01-10 | Henkel Ag & Co. Kgaa | Disinfectant skin care product |
DE102007019428A1 (en) | 2006-07-07 | 2008-10-30 | Henkel Ag & Co. Kgaa | Washing, cleaning and care products 2 |
DE102007014875A1 (en) * | 2007-03-26 | 2008-10-02 | Henkel Ag & Co. Kgaa | cleaning supplies |
DE102007019373A1 (en) * | 2007-04-23 | 2008-10-30 | Henkel Ag & Co. Kgaa | Liquid washing or cleaning agent with yield point |
EP2650335B1 (en) * | 2012-04-13 | 2018-05-30 | Tata Consultancy Services Ltd. | A process for synthesis of doped titania nanoparticles having photocatalytic activity in sunlight |
IN2013MU02425A (en) * | 2013-07-20 | 2015-06-19 | Tata Consultancy Services Ltd | |
CN109788760B (en) | 2016-07-28 | 2021-12-14 | 艾克森实验室有限公司 | Antimicrobial photoreactive compositions comprising organic and inorganic multijunction composites |
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Also Published As
Publication number | Publication date |
---|---|
US20100294304A1 (en) | 2010-11-25 |
DE10064069A1 (en) | 2002-07-04 |
US20040157757A1 (en) | 2004-08-12 |
WO2002050224A1 (en) | 2002-06-27 |
US8172951B2 (en) | 2012-05-08 |
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