US20080284283A1 - Piezo Stack With Novel Passivation - Google Patents

Piezo Stack With Novel Passivation Download PDF

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Publication number
US20080284283A1
US20080284283A1 US12/095,439 US9543907A US2008284283A1 US 20080284283 A1 US20080284283 A1 US 20080284283A1 US 9543907 A US9543907 A US 9543907A US 2008284283 A1 US2008284283 A1 US 2008284283A1
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United States
Prior art keywords
insulation
electrical
electronic component
openings
passivation
Prior art date
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Abandoned
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US12/095,439
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English (en)
Inventor
Michael Kaspar
Carsten Schuh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
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Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Assigned to SIEMENS AKTIENGESELLSCHAFT reassignment SIEMENS AKTIENGESELLSCHAFT ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KASPAR, MICHAEL, SCHUH, CARSTEN
Publication of US20080284283A1 publication Critical patent/US20080284283A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/02—Forming enclosures or casings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Definitions

  • the present invention relates to a method for electrical passivation of surfaces of electronic components featuring electrodes and to the electronic components produced accordingly.
  • Such components can for example be multilayer piezo stacks, piezoelectric bending converters and monolithic piezo components.
  • US 2004/135235 A1 discloses an integrated circuit structure, for example a semiconductor device with a self-passivating copper laser contactor featuring a passivation area.
  • the laser contactor has passivation areas on open copper surfaces of the contactor.
  • U.S. Pat. No. 5,629,531 A discloses an arrangement of a silicon carbide device with a thermally created oxide passivation layer which is substantially free of dopants, is electrically highly integrated and has small quantities of aluminum or carbon oxides.
  • the design of known piezoceramic multilayer actuators or multilayer sensors conventionally includes inner electrodes which are routed completely to the side surfaces of the stack. These inner electrodes have an active contact area which is kept as small as possible. This means that a large part of the side actuator/sensor surface is electrically active. This must therefore be electrically passivated for use in order in particular to avoid short circuits.
  • the passivation is provided in the conventional manner by applying silicon elastomers to the ceramic surface.
  • the passivation which corresponds to a provision of electrically inactive side surfaces, is expensive to produce for multilayer piezo stacks.
  • conventional passivations are not able to sufficiently withstand chemical stresses.
  • Further problems are involved with the adhesion of the passivation to the ceramic surfaces of the component.
  • the passivation requires large amounts of space but dissipates heat poorly.
  • the passivation of irregularly-shaped rough and uneven surfaces of electrical or electronic components respectively. Further problems arise if a number of side surfaces of a component are to be coated simultaneously. This relates especially to two side surfaces lying opposite one another.
  • Surfaces of an electrical component especially side surfaces of a multilayer piezostack, of a piezoelectric bending transducer or of a monolithic piezo component can be electrically passivated in a simple and effective manner. Use is to be guaranteed in chemically and thermally unfavorable environments.
  • a method for electrical passivation of at least one surface of at least one electronic component featuring an electrode of a piezoelectric bending transducer or of a monolithic piezo component may comprise
  • a plastic foil or a plastic sleeve can be laminated on as insulation, featuring an epoxide or polyimide.
  • electrode areas may be covered or sealed to prevent adhesion of the insulation, for example by means of Kapton foil or metallic structures.
  • the openings can be created by mechanical or physical removal of the insulation.
  • an insulation is printed on, by means of an ink jet method for example, and is hardened by means of UV radiation and/or temperature.
  • the insulation may be physically and chemically stable in relation to fuel.
  • a surface electrical contacting of the electrode areas can be undertaken after the application of the electrical insulation and after the creation of the openings, a surface electrical contacting of the electrode areas can be undertaken.
  • the surface electrical contacting can be undertaken by means of a flexible leadframe.
  • An electronic component can be created in accordance with the above described method.
  • FIG. 1 a first exemplary embodiment of an electrical passivation of a surface of an electrical component
  • FIG. 2 a second exemplary embodiment of a passivation of a side surface of an electronic component
  • FIG. 3 a third exemplary embodiment of an electrical passivation of a side surface of an electronic component
  • FIG. 4 a fourth exemplary embodiment of a passivation of a side surface of an electronic component
  • FIG. 5 an exemplary embodiment of an electrically passivated component.
  • a plastic foil is especially laminated onto a piezoceramic multilayer stack of conventional design for electrical passivation of the side surfaces.
  • This plastic foil features an epoxide or polyimide respectively for example.
  • the electrical contacting the reader is referred to the known Siemens-internal contacting by means of planar structures, especially metal structures.
  • the provision of an electrical passivation in accordance with an embodiment has the following advantages.
  • the insulation layer provided can be provided thermally stable up to appr. 200° C.
  • the materials used are likewise able to resist heavy chemical stresses. Applications can be found for example in vehicle fuel injection. Because of the lamination process, especially in autoclaves or in high-pressure vacuum presses, a very good adhesion, especially to piezoceramic surfaces, can be provided.
  • the narrow thickness of the created passivation layers according to various embodiments the space required around the passivated component is small.
  • a further effect of the narrow thickness of the passivation layer created is enhanced heat dissipation characteristics, especially in dynamic operation of actuators or sensors.
  • a plastic foil or a plastic sleeve featuring for example epoxides or polyimides, can be laminated on as the insulation for example.
  • electrode areas for example, may be covered or sealed by means of Kapton foil or metallic structures to prevent the adhesion of the insulation.
  • the openings can be created in a simple manner by mechanical or physical removal of the insulation.
  • a layer of insulation can be printed on as insulation in a simple manner, for example by means of an ink jet method, and hardened using UV radiation and/or temperature.
  • a surface electrical contacting of the electrode areas is undertaken. This enables conventional methods such as bonding for example to be avoided and electrical contacting to be provided in a simple manner.
  • the area of protection claimed by the present application likewise includes electronic components which were created according to such a method.
  • FIG. 1 shows a first exemplary embodiment of an electrical passivation.
  • the necessary contacting areas of an electrical or electronic component, especially of a piezo stack are covered or sealed with a first method step S 1 , before the application of an insulation with a second method step S 2 .
  • the surfaces can be covered for example by means of a Kapton foil or by means of metallic structures.
  • the sealing is designed to prevent the adhesion of an insulation provided with the second method step S 2 by means of a lamination foil.
  • the sealing explicitly allows areas to be excluded from the lamination process executed in the second method step S 2 .
  • Non-laminated foil surfaces can be removed for example by means of mechanical processing with a third method step S 3 .
  • FIG. 2 shows a second exemplary embodiment of an electrical passivation.
  • the passivation layer is structure after the lamination undertaken with a first method step S 1 .
  • This is done with a second method step S 2 by physical removal for example by means of laser processing after the lamination. During this removal or this laser processing contact surfaces are explicitly opened.
  • FIG. 3 shows a third exemplary embodiment of an electrical passivation.
  • a prestructured insulating foil is created with a first method step S 1 .
  • the structuring is undertaken for example by punching.
  • the prestructured insulating foil is laminated onto the side surface of the electronic or electrical component to be passivated.
  • FIG. 4 shows a fourth exemplary embodiment of an electrical passivation.
  • an insulating layer is printed directly with a first method step S 1 , for example by means of an Ink jet method, onto the surface to be passivated.
  • a second method step S 2 the insulation is hardened off by means of UV radiation or by utilizing a specific temperature range. The openings required for contacting are kept free. No printing onto these areas thus takes place.
  • FIG. 5 shows an exemplary embodiment of an electrically passivated piezo multilayer stack 1 with electrodes 3 brought out at side surfaces 2 and an associated passivation layer 4 .
  • the passivation layer 4 is provided with openings in the area of the electrodes 3 .
  • inventive method is not restricted to the passivation of piezo multilayer stacks. Further possible uses can be found for electronic components such as piezoelectric bending transducers or monolithic piezo components. Also covered by the scope of protection are all electronic or electrical components created with this method. The exemplary embodiments are merely embodiments and do not restrict the scope of protection of the present invention.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Fuel-Injection Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
US12/095,439 2006-01-11 2007-01-04 Piezo Stack With Novel Passivation Abandoned US20080284283A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102006001502 2006-01-11
DE102006001502.9 2006-01-19
DE102006002695A DE102006002695A1 (de) 2006-01-11 2006-01-19 Piezostack mit neuartiger Passivierung
DE102006002695.0 2006-01-19
PCT/EP2007/050073 WO2007082795A1 (de) 2006-01-11 2007-01-04 Piezostack mit neuartiger passivierung

Publications (1)

Publication Number Publication Date
US20080284283A1 true US20080284283A1 (en) 2008-11-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
US12/095,439 Abandoned US20080284283A1 (en) 2006-01-11 2007-01-04 Piezo Stack With Novel Passivation

Country Status (3)

Country Link
US (1) US20080284283A1 (de)
DE (1) DE102006002695A1 (de)
WO (1) WO2007082795A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090078227A1 (en) * 2007-09-24 2009-03-26 Aradi Allen A Surface passivation and to methods for the reduction of fuel thermal degradation deposits
US9887345B2 (en) 2011-12-30 2018-02-06 Continental Automotive Gmbh Piezo-stack with passivation, and a method for the passivation of a piezo-stack

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009038169B4 (de) * 2009-08-20 2018-01-25 Continental Automotive Gmbh Aktuatoreinheit für ein Einspritzventil und Verfahren zum Herstellen einer Aktuatoreinheit
DE102012207276B4 (de) 2011-08-01 2018-04-05 Continental Automotive Gmbh Vollaktiver Piezostack mit Passivierung

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4017752A (en) * 1973-12-14 1977-04-12 Murata Manufacturing Co., Ltd. Piezoelectric ceramic resonator mounting means
US4270449A (en) * 1978-03-02 1981-06-02 Toppan Printing Co., Ltd. Method of printing plastic surfaces
US5549926A (en) * 1993-05-31 1996-08-27 Murata Manufacturing Co., Ltd. Manufacturing method of electronic part
US5612656A (en) * 1993-12-24 1997-03-18 Murata Manufacturing Co., Ltd. Resonator with spiral-shaped pattern electrodes
US6104129A (en) * 1997-02-10 2000-08-15 Minolta Co., Ltd. Multilayer electrostrictive element and method of manufacturing same
US6488879B1 (en) * 1997-08-25 2002-12-03 Murata Manufacturing Co. Ltd. Method of producing an electronic device having a sheathed body
US20030168941A1 (en) * 2000-05-15 2003-09-11 Martin Maichl Piezoelectric flexion converter and use thereof
US20050263875A1 (en) * 2002-11-11 2005-12-01 Cesare Fumo Method for controlled ink-jet spreading of polymers for the insulation and/or protection of printed circuits
US7015629B2 (en) * 2001-04-30 2006-03-21 Siemens Aktiengesellschaft Additional contacting for an electrical component and piezoelectric component in the form of a multilayer structure
US20070216265A1 (en) * 2006-03-17 2007-09-20 Cooke Michael P Piezoelectric actuator

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0354876A (ja) * 1989-07-22 1991-03-08 Hitachi Metals Ltd 積層型変位素子
JP3644205B2 (ja) * 1997-08-08 2005-04-27 株式会社デンソー 半導体装置及びその製造方法
US7064401B2 (en) * 2003-03-06 2006-06-20 Matsushita Electric Industrial Co., Ltd. Thin film piezoelectric element, method of manufacturing the same, and actuator
JP2006303443A (ja) * 2005-03-24 2006-11-02 Ngk Spark Plug Co Ltd 積層型圧電素子、これを用いた燃料噴射装置、及び積層型圧電素子の製造方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4017752A (en) * 1973-12-14 1977-04-12 Murata Manufacturing Co., Ltd. Piezoelectric ceramic resonator mounting means
US4270449A (en) * 1978-03-02 1981-06-02 Toppan Printing Co., Ltd. Method of printing plastic surfaces
US5549926A (en) * 1993-05-31 1996-08-27 Murata Manufacturing Co., Ltd. Manufacturing method of electronic part
US5612656A (en) * 1993-12-24 1997-03-18 Murata Manufacturing Co., Ltd. Resonator with spiral-shaped pattern electrodes
US6104129A (en) * 1997-02-10 2000-08-15 Minolta Co., Ltd. Multilayer electrostrictive element and method of manufacturing same
US6488879B1 (en) * 1997-08-25 2002-12-03 Murata Manufacturing Co. Ltd. Method of producing an electronic device having a sheathed body
US20030168941A1 (en) * 2000-05-15 2003-09-11 Martin Maichl Piezoelectric flexion converter and use thereof
US7015629B2 (en) * 2001-04-30 2006-03-21 Siemens Aktiengesellschaft Additional contacting for an electrical component and piezoelectric component in the form of a multilayer structure
US20050263875A1 (en) * 2002-11-11 2005-12-01 Cesare Fumo Method for controlled ink-jet spreading of polymers for the insulation and/or protection of printed circuits
US20070216265A1 (en) * 2006-03-17 2007-09-20 Cooke Michael P Piezoelectric actuator

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090078227A1 (en) * 2007-09-24 2009-03-26 Aradi Allen A Surface passivation and to methods for the reduction of fuel thermal degradation deposits
US7878160B2 (en) * 2007-09-24 2011-02-01 Afton Chemical Corporation Surface passivation and to methods for the reduction of fuel thermal degradation deposits
US20110126788A1 (en) * 2007-09-24 2011-06-02 Afton Chemical Corporation Surface passivation and the methods for the reduction of fuel thermal degradation deposits
US8069826B2 (en) 2007-09-24 2011-12-06 Afton Chemical Corporation Surface passivation and the methods for the reduction of fuel thermal degradation deposits
US9887345B2 (en) 2011-12-30 2018-02-06 Continental Automotive Gmbh Piezo-stack with passivation, and a method for the passivation of a piezo-stack

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Publication number Publication date
WO2007082795A1 (de) 2007-07-26
DE102006002695A1 (de) 2007-08-09

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AS Assignment

Owner name: SIEMENS AKTIENGESELLSCHAFT, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KASPAR, MICHAEL;SCHUH, CARSTEN;REEL/FRAME:021521/0532;SIGNING DATES FROM 20080220 TO 20080221

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION