US20080240178A1 - Method and apparatus for material processing - Google Patents
Method and apparatus for material processing Download PDFInfo
- Publication number
- US20080240178A1 US20080240178A1 US12/116,162 US11616208A US2008240178A1 US 20080240178 A1 US20080240178 A1 US 20080240178A1 US 11616208 A US11616208 A US 11616208A US 2008240178 A1 US2008240178 A1 US 2008240178A1
- Authority
- US
- United States
- Prior art keywords
- laser
- certain embodiments
- interaction region
- head
- coupled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
- B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
Definitions
- the present invention relates to the field of material processing, particularly, to an apparatus and method for drilling, cutting, and surface processing of materials using energy waves.
- an apparatus processes a surface of an inhabitable structure.
- the apparatus comprises a laser base unit adapted to provide laser light to an interaction region, the laser light removing material from the structure.
- the laser base unit comprising a laser generator and a laser head coupled to the laser generator.
- the laser head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure.
- the apparatus further comprises a laser manipulation system.
- the laser manipulation system comprises an anchoring mechanism adapted to be releasably coupled to the structure.
- the laser manipulation system further comprises a positioning mechanism coupled to the anchoring mechanism and coupled to the laser head.
- the laser manipulation system is adapted to controllably adjust the position of the laser head relative to the structure.
- the apparatus further comprises a controller electrically coupled to the laser base unit and the laser manipulation system. The controller is adapted to transmit control signals to the laser base unit and to the laser manipulation system in response to user input.
- an apparatus processes a surface of an inhabitable structure with reduced disruption to activities within the structure.
- the apparatus comprises means for generating laser light.
- the apparatus further comprises means for providing the laser light to an interaction region of the structure to remove material from the structure.
- the apparatus further comprises means for confining the material and removing the material from the interaction region.
- the apparatus further comprises means for controllably adjusting a position of the interaction region relative to the surface of the structure.
- the apparatus further comprises means for controlling the laser light and the position of the interaction region in response to user input.
- a method processes a surface of an inhabitable structure with reduced disruption to activities within the structure.
- the method comprises remotely generating laser light.
- the method further comprises providing the laser light to the surface, the laser light interacting with the structure in an interaction region to remove material from the structure.
- the method further comprises confining the material and removing the material from the interaction region.
- the method further comprises controllably adjusting a position of the interaction region relative to the surface of the structure.
- the method further comprises controlling the laser light and the position of the interaction region in response to user input.
- an apparatus processes a surface of an inhabitable structure.
- the apparatus comprises a base unit adapted to provide energy waves to an interaction region, the energy waves removing material from the structure.
- the base unit comprises a generator and a head coupled to the generator.
- the head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure.
- the apparatus further comprises a manipulation system.
- the manipulation system comprises an anchoring mechanism adapted to be releasably coupled to the structure.
- the manipulation system further comprises a positioning mechanism coupled to the anchoring mechanism and coupled to the head.
- the manipulation system is adapted to controllably adjust the position of the head relative to the structure.
- the apparatus further comprises a controller electrically coupled to the base unit and the manipulation system.
- the controller is adapted to transmit control signals to the base unit and to the manipulation system in response to user input.
- an apparatus processes a surface of an inhabitable structure.
- the apparatus comprises a laser base unit adapted to provide laser light to an interaction region, the laser light removing material from the structure.
- the laser base unit comprising a laser generator and a laser head coupled to the laser generator.
- the laser head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure.
- the apparatus further comprises an anchoring mechanism adapted to be releasably coupled to the structure and releasably coupled to the laser head.
- the apparatus further comprises a controller electrically coupled to the laser base unit. The controller is adapted to transmit control signals to the laser base unit in response to user input.
- an apparatus processes a surface of an inhabitable structure with reduced disruption to activities within the structure.
- the apparatus comprises means for generating laser light.
- the apparatus further comprises means for providing the laser light to an interaction region of the structure to remove material from the structure.
- the apparatus further comprises means for confining the material and removing the material from the interaction region.
- the apparatus further comprises means for controlling the laser light in response to user input.
- a method processes a surface of an inhabitable structure with reduced disruption to activities within the structure.
- the method comprises remotely generating laser light.
- the method further comprises providing the laser light to the surface, the laser light interacting with the structure in an interaction region to remove material from the structure.
- the method further comprises confining the material and removing the material from the interaction region.
- the method further comprises controlling the laser light in response to user input.
- an apparatus processes a surface of an inhabitable structure.
- the apparatus comprises a base unit adapted to provide energy waves to an interaction region, the energy waves removing material from the structure.
- the base unit comprises a generator and a head coupled to the generator.
- the head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure.
- the apparatus further comprises an anchoring mechanism adapted to be releasably coupled to the structure and releasably coupled to the head.
- the apparatus further comprises a controller electrically coupled to the base unit. The controller is adapted to transmit control signals to the base unit in response to user input.
- an apparatus processes a surface of an inhabitable structure.
- the apparatus comprises a laser base unit which irradiates an interaction region with laser light, the laser light removing material from the structure.
- the laser base unit comprises a laser generator and a laser head coupled to the laser generator.
- the laser head comprises a containment plenum which confines and removes material from the interaction region.
- the containment plenum comprises a rubber seal which contacts the structure and which substantially surrounds the interaction region, thereby facilitating confinement and removal of material from the interaction region and providing reduced disruption to activities within the structure.
- the apparatus further comprises an anchoring mechanism releasably coupled to the structure and releasably coupled to the laser head.
- the apparatus further comprises a controller electrically coupled to the laser base unit. The controller transmits control signals to the laser base unit in response to user input.
- an apparatus processes a surface of an inhabitable structure with reduced disruption to activities within the structure.
- the apparatus comprises means for generating laser light.
- the apparatus further comprises means for providing the laser light to an interaction region of the structure to remove material from the structure.
- the apparatus further comprises means for confining the material and removing the material from the interaction region.
- the confining means comprises a rubber seal which substantially surrounds the interaction region.
- the apparatus further comprises means for controlling the laser light in response to user input.
- a method processes a surface of an inhabitable structure with reduced disruption to activities within the structure.
- the method comprises remotely generating laser light.
- the method further comprises providing the laser light to the surface, the laser light interacting with the structure in an interaction region to remove material from the structure.
- the method further comprises confining the material and removing the material from the interaction region.
- the material is confined by a rubber seal which substantially surrounds the interaction region.
- the method further comprises controlling the laser light in response to user input.
- FIG. 1 schematically illustrates an embodiment of an apparatus for processing a surface of a structure
- FIG. 2 schematically illustrates a laser base unit compatible with embodiments described herein;
- FIG. 3A schematically illustrates a laser head in accordance with embodiments described herein;
- FIGS. 3B and 3C schematically illustrate two alternative embodiments of the laser head
- FIG. 4 schematically illustrates a cross-sectional view of a containment plenum in accordance with embodiments described herein;
- FIG. 5 schematically illustrates a laser head comprising a sensor adapted to measure the relative distance between the laser head and the interaction region;
- FIGS. 6A and 6B schematically illustrate two opposite elevated perspectives of an embodiment in which the laser manipulation system comprises an anchoring mechanism adapted to be releasably coupled to the structure and a positioning mechanism coupled to the anchoring mechanism and coupled to the laser head;
- FIG. 7 schematically illustrates an embodiment of an attachment interface of the anchoring mechanism
- FIG. 8 schematically illustrates an exploded view of one embodiment of the positioning mechanism along with the attachment interfaces of the anchoring mechanism
- FIG. 9 schematically illustrates an embodiment of a first-axis position system
- FIG. 10 schematically illustrates an embodiment of a second-axis position system
- FIGS. 11A and 11B schematically illustrate an embodiment of an interface in two alternative configurations
- FIG. 12 schematically illustrates an embodiment of a laser head receiver
- FIG. 13 schematically illustrates an embodiment of a support structure coupled to the other components of the apparatus
- FIG. 14A schematically illustrates an embodiment of a suspension-based support system coupled to the apparatus
- FIG. 14B schematically illustrates an embodiment of the apparatus comprising suspension-based support connectors
- FIG. 15 schematically illustrates an embodiment of a controller comprising a control panel, a microprocessor, a laser generator interface, a positioning system interface, a sensor interface, and a user interface;
- FIG. 16 schematically illustrates a control pendant comprising a screen and a plurality of buttons
- FIG. 17A illustrates an exemplary “MAIN SCREEN” display of the control pendant
- FIG. 17B illustrates an exemplary “SELECT OPERATION SCREEN” display of the control pendant
- FIG. 17C illustrates an exemplary “CIRCLE SETUP/OPERATION SCREEN” display of the control pendant
- FIG. 17D illustrates an exemplary “PIERCE SETUP/OPERATION SCREEN” display of the control pendant
- FIG. 17E illustrates an exemplary “CUT SETUP/OPERATION SCREEN” display of the control pendant
- FIG. 17F illustrates an exemplary “SURFACE KEYING SETUP/OPERATION SCREEN” display of the control pendant
- FIG. 17G illustrates an exemplary “FAULT SCREEN” display of the control pendant
- FIG. 17H illustrates an exemplary “MAINTENANCE SCREEN” display of the control pendant
- FIG. 18A schematically illustrates a detector compatible with embodiments described herein;
- FIG. 18B schematically illustrates a computer system adapted to analyze the resulting spectroscopic data
- FIG. 19 shows a graph of the light spectrum of wavelengths detected upon irradiating concrete with laser light and the light spectrum detected upon irradiating concrete with embedded rebar;
- FIG. 20 schematically illustrates an exemplary compact configuration of a laser head in accordance with embodiments described herein;
- FIGS. 21A-21C schematically illustrate various anchoring mechanisms in accordance with embodiments described herein;
- FIG. 21D illustrates an exemplary compact configuration of a laser head and an anchoring mechanism in accordance with embodiments described herein;
- FIG. 22A schematically illustrates a lightweight configuration of a laser head in accordance with embodiments described herein;
- FIG. 22B illustrates another exemplary lightweight configuration of a laser head and an anchoring mechanism in accordance with embodiments described herein;
- FIG. 22C schematically illustrates a containment plenum coupled to the laser head of FIG. 22B ;
- FIG. 23 is a flowchart of an exemplary method for determining a spectral ratio in accordance with embodiments described herein.
- Prior technologies are plagued by disruptive characteristics, thereby making them virtually unsuitable for retrofitting occupied structures. Additionally, such material processing technologies often present dangerous and costly “cut through” dangers. “Cut through” dangers include instances such as a worker unintentionally cutting an embedded object while drilling through the subject material. For example, a construction worker drilling a hole in an existing concrete wall may accidentally encounter reinforcing steel or rebar, or embedded utilities, such as live electrical conduit and conductors. Such an incident may result in costly damage to tools or the subject material, as well as potentially deadly consequences (e.g., electrocution) for workers. Traditional drilling methods also can include “punch through” dangers of unexpectedly punching through the material drilled and damaging structures or personnel on the opposite side of the material.
- Handheld power drilling and hammering devices commonly weigh in excess of fifty pounds and are often required to be held overhead by the operator for extended period of time.
- Conventional devices also typically produce jarring forces that the operator must absorb while holding the device.
- the operator and those in the vicinity of the device may be exposed to falling or projectile debris, as well as dust, fumes, vapors, vibration, and noise.
- This level of noisome activity is unsuitable in general for occupied structures, and is entirely unsuitable for structures used as hospitals, laboratories, and the like, where noise and vibration can be completely unacceptable.
- energy waves are directed toward the surface to be processed to overcome some or all of such drawbacks.
- the energy waves of certain embodiments are electromagnetic waves (e.g., laser light, microwaves), while in other embodiments, they are acoustic waves (e.g., ultrasonic waves).
- such cutting units can be as bulky and often are as difficult to maneuver as their mechanical counterparts. The speed at which a laser cuts or drills through concrete can be dependent on the type, size, and concentration of aggregate in the concrete.
- lasers can be subject to the same “cut through” dangers as described above, wherein objects hidden within the matrix of the material to be processed can be inadvertently damaged. Lasers can also pose additional dangers of “punch through” with danger to persons or objects in the path of the laser beam. Lasers can also present complexities in removing drilled material from a cut or a drilled hole.
- the laser system would incorporate a remote laser generator communicating with a portable processing head that incorporates numerous non-disruptive and safety features allowing the system to be utilized within or near occupied structures.
- Certain embodiments of the present invention provide fast material processing while addressing many of the shortcomings of prior technologies and allowing for heretofore unavailable benefits (e.g., reduced disruption to activities within the structure).
- the method and apparatus utilize fiber connections between elements such that noisy, bulky, and heavy elements can operate at a significant distance from the actual work area.
- Certain embodiments are low in both noise and vibration during operation, and effectively remove dust and debris.
- Certain embodiments include a detection system to reduce the dangers of “cut through” or “punch through.”
- Certain embodiments enhance worker safety by allowing workers to be located away from the work area during material processing.
- Certain embodiments are separable into man-portable pieces (e.g., less than 50 pounds) to facilitate transportation to locations in proximity to or within the structure being processed by providing easy and fast portability and set-up.
- Certain embodiments of the present invention provide a method and apparatus for processing fragile structures which may be damaged by conventional processing techniques. For example, using conventional saws for processing concrete grain silos as part of a retrofit or refurbishment process may result in vibrations damaging to other portions of the silo. Using a laser to process the fragile structure can reduce the collateral damage done to the structure during processing. Furthermore, certain embodiments described herein are easily assembled/disassembled, so they can be used in otherwise inaccessible portions of the structures. While embodiments described herein are disclosed in terms of processing man-made structures, in still other embodiments, the present invention can be useful for processing natural formations (e.g., as part of a mining or drilling operation).
- inventions of the apparatus comprise new and novel arrangements of elements and methods that are configured in unique and novel ways and which demonstrate previously unavailable but desirable capabilities.
- certain embodiments of the present invention provide a material processing method that is quiet, substantially vibration-free, and less likely to exude dust, debris, or noxious fumes. Additionally, certain embodiments allow a higher rate of material processing than do conventional technologies.
- FIG. 1 schematically illustrates an embodiment of an apparatus 50 for processing a structure having a surface.
- the apparatus 50 comprises a laser base unit 300 , a laser manipulation system 100 , and a controller 500 .
- the laser base unit 300 is adapted to provide laser light to an interaction region and includes a laser generator 310 and a laser head 200 coupled to the laser generator 310 .
- the laser head 200 is adapted to remove the material from the interaction region.
- the laser manipulation system 100 includes an anchoring mechanism 110 adapted to be releasably coupled to the structure and a positioning mechanism 121 coupled to the anchoring mechanism 110 and coupled to the laser head 200 .
- the laser manipulation system 100 is adapted to controllably adjust the position of the laser head 200 relative to the structure.
- the controller 500 is electrically coupled to the laser base unit 300 and the laser manipulation system 100 .
- the controller 500 is adapted to transmit control signals to the laser base unit 300 and to the laser manipulation system 100 in response to user input.
- the laser head 200 is releasably coupled to the laser generator 310 and is releasably coupled to the positioning mechanism 121 .
- the positioning mechanism 121 is releasably coupled to the anchoring mechanism 110
- the controller 500 is releasably coupled to the laser base unit 300 and the laser manipulation system 100 .
- Such embodiments can provide an apparatus 50 which can be reversibly assembled and disassembled to facilitate transportation of the apparatus 50 to locations in proximity to or within the structure being processed.
- laser base unit 300 Certain embodiments of the laser base unit 300 are described below. While the laser base unit 300 is described below as comprising separate components, other embodiments can include combinations of two or more of these components in an integral unit.
- FIG. 2 schematically illustrates a laser base unit 300 compatible with embodiments described herein.
- the laser base unit 300 comprises a laser generator 310 and a cooling subsystem 320 .
- the laser generator 310 is coupled to a power source (not shown) which provides electrical power of appropriate voltage, phase, and amperage sufficient to power the laser generator 310 .
- the power source can also be portable in certain embodiments, and can operate without cooling water, air, or power from the facility at which the apparatus 50 is operating.
- Exemplary power sources include, but are not limited to, diesel-powered electric generators.
- the laser generator 310 preferably comprises an arc-lamp-pumped Nd:YAG laser, but may alternatively comprise a CO 2 laser, a diode laser, a diode-pumped Nd:YAG laser, a fiber laser, a disk laser, or other types of laser systems.
- the laser generator 310 can be operated in either a pulsed mode or a continuous-wave mode.
- One exemplary laser generator 310 in accordance with embodiments described herein includes a Trumpf 4006D, 4000-watt, continuous-wave laser available from Trumpf Lasertechnik GmbH of Ditzingen, Germany.
- a Yb-doped fiber laser or an Er-doped fiber laser can be used.
- the laser generator 310 can be located within a shipping container for ease of transport and storage.
- the laser generator 310 generates laser light which is preferably delivered through a glass fiber-optic cable from the laser generator 310 to the work location.
- the laser generator 310 comprises a gas-based CO 2 laser which generates laser light by the excitation of CO 2 gas.
- gas-based CO 2 lasers provide high power output (e.g., ⁇ 100 W-50 kW) at high efficiencies (e.g., ⁇ 5-13%), and are relatively inexpensive.
- the laser light generated by such gas-based CO 2 lasers is typically delivered by mirrors and by using a system of ducts or arms to deliver the laser light around bends or corners.
- the laser generator 310 comprises a diode laser.
- diode lasers are compact compared to gas and Nd:YAG lasers so they can be used in a direct delivery configuration (e.g., in close proximity to the work site).
- Diode lasers provide high power (e.g., ⁇ 10 W-6 kW) at high power efficiencies (e.g., ⁇ 25-40%).
- the laser light from a diode laser can be delivered via optical fiber, but with some corresponding losses of power.
- Embodiments using a Nd:YAG laser can have certain advantages over embodiments with CO 2 lasers or diode lasers.
- the laser light from a Nd:YAG laser can be delivered by optical fiber with only slight power losses (e.g., ⁇ 12%) through a relatively small and long optical fiber. This permits the staging of the laser generator 310 and support equipment in locations relatively far (e.g., about 100 meters) from the work area. Maintaining the laser generator 310 at a distance from the surface being processed allows the remainder of the apparatus 50 to be smaller and more portable.
- Arc-lamp-pumped Nd:YAG lasers use an arc lamp to excite a Nd:YAG crystal to generate laser light.
- Diode-pumped Nd:YAG lasers use diode lasers to excite the Nd:YAG crystal, resulting in an increase in power efficiency (e.g., 10-25%, as compared to less than 5% for arc-lamp-pumped Nd:YAG lasers). This increased efficiency results in the diode-pumped laser having a better beam quality, and requiring a smaller cooling subsystem 320 .
- An exemplary arc-lamp-pumped Nd:YAG laser is available from Trumpf Lasertechnik GmbH of Ditzingen, Germany.
- Nd:YAG and other solid state lasers compatible with embodiments described herein can be configured and pumped by a number of methods. These methods include, but are not limited to, flash and arc lamps, as well as diode lasers.
- Various configurations of the solid state media are compatible with embodiments described herein, including, but not limited to, rod, slab, and disk configurations. The advantages of the different configurations and pumping methods will impact various aspects of the laser generator 310 , including, but not limited to, the efficiency, the beam quality, and the operational mode of the laser generator 310 .
- disk lasers are based on a diode-pumped wafer or “disk” that uses one of its reflective surfaces as a heat sink.
- a disk laser permits high power output with low thermal impact, and can provide high efficiency (e.g., 20%) and high quality laser beams which can be injected into small diameter fibers.
- An exemplary diode-laser-pumped Nd:YAG disk laser is available from Trumpf Lasertechnik GmbH of Ditzingen, Germany.
- Fiber lasers use a doped (e.g., doped with ytterbium or erbium) fiber to produce a laser beam.
- the doped fiber can be pumped by other light sources including, but not limited to, arc lamps and diodes.
- the fiber laser can be coupled into a delivery fiber which carries the laser beam to the interaction location.
- a fiber laser provides an advantageous efficiency of approximately 15% to approximately 20%. Such high efficiencies make the laser generator 310 more mobile, since they utilize smaller chiller units. In addition, such high efficiency laser generators 310 can be located closer to the processing area.
- An exemplary fiber laser compatible with embodiments described herein is YLR-4000, 4000-watt, continuous-wave (CW) ytterbium: yttrium-aluminum-garnet (Yb: YAG) fiber laser operating at a near-infrared wavelength of approximately 1070 nanometers, available from IPG Photonics of Oxford, Mass.
- CW continuous-wave
- Yb yttrium-aluminum-garnet
- the generation of laser light by the laser generator 310 creates excess heat which is preferably removed from the laser generator 310 by the cooling subsystem 320 coupled to the laser generator 310 .
- the amount of cooling needed is determined by the size and type of laser used, but can be about 190 kW of cooling capacity for a 4-kW Nd:YAG laser.
- the cooling subsystem 320 can utilize excess cooling capability at a job site, such as an existing process water or chilled water cooling subsystem.
- a unitary cooling subsystem 320 dedicated to the laser generator 310 is preferably used.
- Unitary cooling subsystems 320 may be air- or liquid-cooled.
- the cooling subsystem 320 comprises a heat exchanger 322 and a water chiller 324 coupled to the laser 310 to provide sufficient circulatory cooling water to the laser generator 310 to remove the excess heat.
- the heat exchanger 322 preferably removes a portion of the excess heat from the water, and circulates the water back to the water chiller 324 .
- the water chiller 324 cools the water to a predetermined temperature and returns the cooling water to the laser generator 310 .
- Exemplary heat exchangers 322 and water coolers 324 in accordance with embodiments described herein are available from Trumpf Lasertechnik GmbH of Ditzingen, Germany.
- the laser head 200 is coupled to the laser generator 310 and serves as the interface between the apparatus 50 and the structure being irradiated.
- an energy conduit 400 couples the laser head 200 and the laser generator 310 and facilitates the transmission of energy from the laser generator 310 to the laser head 200 .
- the energy conduit 400 comprises an optical fiber which transmits laser light from the laser generator 310 to the laser head 200 .
- the energy conduit 400 comprises conductors that may include fiber-optic, power, or control wiring cables.
- An exemplary energy conduit 400 comprises a 50-meter fiber.
- the surface being irradiated is within the inhabitable structure. As described more fully below, certain embodiments provide a relatively small, compact, and lightweight apparatus which can be transported to various places within the inhabitable structure and can be used within relatively small and enclosed spaces within the inhabitable structure.
- FIG. 3A schematically illustrates a laser head 200 in accordance with embodiments described herein.
- the laser head 200 comprises a connector 210 , at least one optical element 220 , a housing 230 , and a containment plenum 240 .
- the connector 210 is coupled to the housing 230 , is optically coupled to the laser generator 310 via the energy conduit 400 , and is adapted to transmit laser light from the laser generator 310 .
- the optical element 220 can be located within the connector 210 , the housing 230 , or the containment plenum 240 .
- FIG. 3A illustrates an embodiment in which the optical element 220 is within the housing 230 .
- the conduit 400 provides laser light to the laser head 200
- the laser light is transmitted through the optical element 220 prior to impinging on the structure being irradiated.
- FIG. 3B schematically illustrates one configuration of a laser head 200 in accordance with embodiments described herein.
- the housing 230 comprises a distal portion 232 , an angle portion 234 , and a proximal portion 236 .
- distal and proximal have their standard definitions, referring generally to the position of the portion relative to the interaction region.
- the connector 210 is coupled to the distal portion 232 , which is coupled to the angle portion 234 , which is coupled to the proximal portion 236 , which is coupled to the containment plenum 240 .
- Configurations such as that illustrated by FIG. 3B can be used for drilling and scabbling the surface of the structure (e.g., concrete wall).
- Various components of the laser head 200 are available from Laser Mechanisms, Inc. of Farmington Hills, Mich.
- the connector 210 receives laser light transmitted from the laser generator 310 through the optical fiber to the laser head 200 .
- the connector 210 comprises a lens 212 which collimates the diverging laser light emitted by the conduit 400 .
- the lens 212 can comprise various materials which are transmissive and will refract the laser light in a desired amount. Such materials include, but are not limited to, borosilicate crown glass (BK7), quartz (SiO 2 ), zinc selenide (ZnSe), and sodium chloride (NaCl).
- BK7 borosilicate crown glass
- quartz SiO 2
- ZnSe zinc selenide
- NaCl sodium chloride
- the material of the lens 212 can be selected based on the quality, cost, and stability of the material. Borosilicate crown glass is commonly used for transmissive optics with Nd:YAG lasers, and zinc selenide is commonly used for transmissive optics with CO 2 lasers.
- the lens 212 can be mounted in a removable assembly in certain embodiments to facilitate cleaning, maintenance, and replacement of the lens 212 .
- the mounting of the lens 212 can be adjustable (e.g., using thumbscrews or Allen hex screws) so as to optimize the alignment and focus of the light beam.
- the lens 212 can provide additional modification of the beam profile (e.g., focussing, beam shape).
- the collimated laser light of certain embodiments is then transmitted through the laser head 200 via other optical elements within the laser head 200 .
- the distal portion 232 comprises a generally straight first tube through which laser light propagates to the angle portion 234
- the proximal portion 236 comprises a generally straight second tube through which the laser light from the angle portion 234 propagates.
- the distal portion 232 contains a lens 233
- the angle portion 234 contains a mirror 235 which directs the light through the proximal portion 236 and the containment plenum 240 onto the structure.
- other devices e.g., a prism
- the lens 233 can be mounted in a removable assembly in certain embodiments to facilitate cleaning, maintenance, and replacement of the lens 233 .
- the mounting of the lens 233 can be adjustable (e.g., using thumbscrews or Allen hex screws) so as to optimize the alignment and focus of the light beam.
- the lens 233 focuses the light received from the lens 212 , while in other embodiments, the lens 233 can provide additional modification of the beam profile (e.g., beam shape).
- Exemplary lenses 233 include, but are not limited to, a 600-mm focal length silica plano-convex lens (e.g., Part No. PLCX-50.8-309.1-UV-1064 available from CV1 Laser Corp. of Albuquerque, N.
- the lens 233 can comprise various materials which are transmissive and will refract the laser light in a desired amount. Such materials include, but are not limited to, borosilicate crown glass, quartz, zinc selenide, and sodium chloride. Exemplary lens mounting assemblies include, but are not limited to, Part Nos. PLALH0097 and PLFLH0119 available from Laser Mechanisms, Inc. of Farmington Hills, Mich.
- the mirror 235 reflects the light through an angle of approximately 90 degrees. Other embodiments are configured to reflect the light through other angles.
- the mirror 235 can be mounted on a removable assembly in certain embodiments to facilitate cleaning, maintenance, and replacement of the mirror 235 .
- the mounting of the mirror 235 can be adjustable (e.g., using thumbscrews or Allen hex screws) so as to optimize the alignment and focus of the light beam.
- the mirror 235 can also have a curvature or otherwise be configured so as to focus the light beam or otherwise modify the beam profile (e.g., beam shape).
- Exemplary mirrors 235 include, but are not limited to, metal mirrors such as copper mirrors (e.g., Part Nos. PLTRG19 and PLTRC0024 from Laser Mechanisms, Inc. of Farmington Hills, Mich.), and gold-coated copper mirrors (e.g., Part No. PLTRC0100 from Laser Mechanisms, Inc.). In other embodiments, dielectric-coated mirrors can be used.
- metal mirrors such as copper mirrors (e.g., Part Nos. PLTRG19 and PLTRC0024 from Laser Mechanisms, Inc. of Farmington Hills, Mich.), and gold-coated copper mirrors (e.g., Part No. PLTRC0100 from Laser Mechanisms, Inc.).
- dielectric-coated mirrors can be used.
- FIG. 3C schematically illustrates another configuration of a laser head 200 in accordance with embodiments described herein.
- the housing 230 comprises the distal portion 232 , a first angle portion 234 , a second angle portion 234 ′, and the proximal portion 236 .
- the connector 210 is coupled to the distal portion 232 , which is coupled to the first angle portion 234 , which is coupled to the second angle portion 234 ′, which is coupled to the proximal portion 236 , which is coupled to the containment plenum 240 .
- Configurations such as that illustrated by FIG. 3C can be used for cutting the structure in spatially constrained regions (e.g., cutting off portions of a concrete wall near a corner or protrusion).
- the connector 210 comprises a lens 212 and the distal portion 232 is tubular and contains a lens 233 .
- the first angle portion 234 of the embodiment illustrated by FIG. 3C contains a first mirror 235 which directs the light to the second angle portion 234 ′ which contains a second mirror 235 ′.
- the second mirror 235 ′ directs the light through the proximal portion 236 , which can be tubular, and through the containment plenum 240 onto the structure.
- the light is transmitted through a window 243 and a nozzle 244 to the interaction region.
- the laser head 200 comprises the window 243 and the nozzle 244 , while in other embodiments, the window 243 and the nozzle 244 are components of the containment plenum 240 .
- the first mirror 235 reflects the light through an angle of approximately 90 degrees and the second mirror 235 ′ reflects the light through an angle of approximately ⁇ 90 degrees such that the proximal portion 236 is substantially parallel to the distal portion 232 .
- the light emitted by the containment plenum 240 is substantially parallel to, but displaced from, the light propagating through the distal portion 232 .
- Other embodiments have the first mirror 235 and the second mirror 235 ′ configured to reflect the light through other angles. Certain embodiments comprise a straight tubular portion between the first angle portion 234 and the second angle portion 234 ′ to provide additional displacement of the light emitted by the containment plenum 240 from the light propagating through the distal portion 232 .
- the coupling between the distal portion 232 and the first angle portion 234 is rotatable. In certain other embodiments, the coupling between the first angle portion 234 and the second angle portion 234 ′ is rotatable. These rotatable couplings can comprise swivel joints which can be locked in position by thumbscrews. Such embodiments provide additional flexibility in directing the light emitted by the containment plenum 240 in a selected direction. In certain embodiments, the selected direction is non-planar with the light propagating through the distal portion 232 .
- first mirror 235 and the second mirror 235 ′ can be mounted on a removable assembly in certain embodiments to facilitate cleaning, maintenance, and replacement.
- the mountings of the first mirror 235 and/or the second mirror 235 ′ can be adjustable (e.g., using thumbscrews or Allen hex screws) so as to optimize the alignment and focus of the light beam.
- one or both of the first mirror 235 and the second mirror 235 ′ can also have a curvature or otherwise be configured so as to focus the light beam or otherwise modify the beam profile (e.g., beam shape).
- one or more of the optical elements 220 within the laser head 200 are water-cooled or air-cooled. Cooling water can be supplied by a heat exchanger located near the laser head 200 and dedicated to providing sufficient water flow to the laser head 200 .
- the conduits for the cooling water for each of the optical elements 220 can be connected in series so that the cooling water flows sequentially in proximity to the optical elements 220 . In other embodiments, the conduits are connected in parallel so that separate portions of the cooling water flow in proximity to the various optical elements 220 .
- Exemplary heat exchangers include, but are not limited to a Miller CoolmateTM 4, available from Miller Electric Manufacturing Co. of Appleton, Wis.
- the flow rate of the cooling water is preferably at least approximately 0.5 gallons per minute.
- FIGS. 20 and 21 A- 21 C schematically illustrate other configurations of a laser head 1200 in accordance with embodiments described herein.
- FIG. 21D illustrates an exemplary compact configuration of a laser head 1200 and an anchoring mechanism 1110 in accordance with embodiments described herein.
- Certain embodiments of the laser head 1200 are adapted to be movable and placed in position relative to the surface to be irradiated by a single person.
- the combination of the laser head 1200 and certain embodiments of the anchoring mechanism 1110 weighs less than fifty pounds. Certain such embodiments are advantageously used to drill holes in concrete up to approximately nine-and-one-half inches in depth.
- FIG. 20 is generally adapted for drilling holes in the surface to be irradiated, and is generally of smaller size and weight than the embodiments of FIGS. 3B and 3C , thereby providing an apparatus which is adapted to access more constrained spaces.
- the embodiment of FIG. 20 is generally more simple and more robust than the embodiments of FIGS. 3B and 3C , thereby providing an apparatus which is adapted to withstand rough handling and non-ideal operating conditions.
- the laser head 1200 in certain embodiments comprises a generally rectangular housing 1230 .
- the other components of the laser head 1200 are positioned on the housing 1230 or within the housing 1230 .
- the housing 1230 of certain embodiments comprises a connection structure (not shown) which is adapted to be releasably coupled to an anchoring mechanism 1110 which, as described further below, is adapted to position the laser head 1200 relative to the surface to be irradiated.
- the housing 1230 has a length of approximately 12 inches, a height of approximately 8 inches, and a width of approximately 4 inches. Other shapes and dimensions of the housing 1230 are compatible with embodiments described herein.
- the laser head 1200 further comprises a connector 1210 which is adapted to be coupled to the conduit 400 carrying laser light from the laser generator 310 to the laser head 1200 .
- the connector 1210 comprises a lens (not shown) which collimates the diverging laser light emitted by the conduit 400 .
- the lens has a focal length of approximately 23.6 inches (approximately 600 millimeters) and is located in an adjustable lens drawer.
- the lens of various embodiments can comprise various materials, can be removably mounted to the housing 1230 , can be adjustably mounted to the housing 1230 , and can provide additional modification of the beam profile.
- the laser head 1200 further comprises a first mirror 1235 adapted to reflect light from the connector 1210 through a first non-zero angle, and a second mirror 1235 ′ adapted to reflect light from the first mirror 1235 through a second non-zero angle to a nozzle 1244 which is adapted to be coupled to the containment plenum 240 .
- the first non-zero angle is approximately equal to the negative of the second non-zero angle.
- Such two-mirror configurations are sometimes called “folded optics” configurations since reflecting the light between the mirrors effectively “folds” a propagation path having a length into a smaller space.
- Certain embodiments of the laser head 1200 comprise additional optical components adapted to modify the beam profile of the laser light.
- At least one of the first mirror 1235 and the second mirror 1235 ′ is mounted in the housing 1230 on a removable and adjustable assembly.
- at least one of the first mirror 1235 and the second mirror 1235 ′ of certain embodiments has a curvature or is otherwise configured to modify the beam profile.
- At least one of the first mirror 1235 and the second mirror 1235 ′ of certain embodiments is cooled by either air or water provided by cooling conduits. For example, in certain embodiments, water flow is provided to the laser head 1200 at a rate of at least approximately 0.5 gallons per minute.
- the cooling conduits are contained within the housing 1230 , thereby facilitating transport and placement of the laser head 1200 by making the laser head 1200 less unwieldy and making the laser head 1200 more robust.
- the laser head 1200 of certain embodiments further comprises an electrical connector 1215 which can be coupled to an electrical cord to supply power to the laser head 1200 and/or to provide sensor signals from the laser head 1200 to the controller 500 .
- the laser head 1200 further comprises one or more status lights 1217 which provide information regarding the status of the laser head 1200 .
- the laser head 1200 comprises a laser head handle 1240 coupled to the housing 1230 .
- the laser head handle 1240 is adapted to facilitate transporting and positioning the laser head 1200 at a selected location.
- Other configurations of the laser head handle 1240 are compatible with other embodiments described herein.
- the laser head 1200 of certain embodiments further comprises a coupler 1250 adapted to releasably couple the laser head 1200 to the anchoring mechanism 1110 .
- Other configurations of the laser head 1200 are compatible with embodiments described herein.
- the compact configuration of the laser head (“compact laser head”) 1200 is advantageously used in certain applications rather than the extended configuration of the laser head (“extended laser head”) 200 as shown in FIGS. 3B and 3C .
- extended laser head the extended configuration of the laser head
- FIGS. 3B and 3C the extended configuration of the laser head
- the compact laser head 1200 has a smaller volume, thereby allowing access to smaller areas.
- the compact laser head 1200 is used in conjunction with an energy conduit 400 comprising a pivoting collimator head 1250 adapted to provide a rotational coupling between the energy conduit 400 and the connector 1210 of the laser head 1200 .
- the pivoting collimator head provides additional flexibility by allowing the laser head 1200 to access smaller areas.
- the collimator head can be straight such that the energy conduit 400 points along the same direction in which laser light enters the laser head 1200 , or can have an angle (e.g., 90 degrees) such that the energy conduit 400 points along a different direction, as illustrated in FIG. 21D .
- Using collimator heads with different orientations advantageously permits various orientations of the energy conduit 400 for providing access to constrained areas.
- Exemplary collimator heads compatible with embodiments described herein are available from Trumpf Lasertechnik GmbH of Ditzingen, Germany.
- the compact laser head 1200 also incorporates the various sensors, proximity switches, and flow meters of the laser head 1200 within the housing 1230 .
- the laser head 1200 can comprise one or more sensors which determine one or more of the following: whether the laser head 1200 is in contact with a surface of the inhabitable structure, whether the laser head 1200 is coupled to the anchoring mechanism 1110 , and whether the laser generator 310 is on or starting.
- Such embodiments are generally more simple and more robust than the extended laser head 200 , thereby providing an apparatus which is adapted to withstand rough handling and non-ideal operating conditions, and is less likely to be damaged.
- FIG. 22A schematically illustrates a lightweight laser head 2200 with an anchoring mechanism 1110 .
- FIG. 22B illustrates another exemplary lightweight laser head 2200 and anchoring mechanism 1110 .
- the lightweight laser head 2200 comprises a connector 2210 through which laser light is transmitted into the laser head 2200 .
- the laser head 2200 of certain embodiments further comprises an electrical connector 2215 which can be coupled to an electrical cord to supply power to the laser head 2200 and/or to provide sensor signals from the laser head 2200 to the controller 500 .
- the laser head 2200 further comprises one or more status lights 2217 which provide information regarding the status of the laser head 2200 .
- the laser head 2200 is coupled to cooling lines 2218 which can provide cooling water to the mirrors, lenses, or other optical elements within the laser head 2200 .
- FIG. 22C illustrates a containment plenum 240 coupled to the laser head 2200 of FIG. 22B .
- the containment plenum 240 comprises a plenum housing 242 and a resilient interface 246 configured to contact the surface being irradiated.
- the containment plenum 240 is removable from and/or adjustable along the laser head 2200 to facilitate positioning of the laser head 2200 and the containment plenum 240 for laser irradiation of the surface.
- the laser head 2200 has a 140-millimeter focal length and is commercially available, e.g., a D35 90-degree focus head with cooling and observation port available from Trumpf Lasertechnik GmbH of Ditzingen, Germany (Catalog No. 35902090).
- the laser head 2200 of certain embodiments is adapted for drilling relatively shallow holes (e.g., up to approximately 65 millimeters in depth) with a diameter of approximately six millimeters.
- the laser head/anchoring mechanism combination weighs less than 10 pounds, while in other embodiments, the combination weighs approximately 8 pounds.
- the laser head 2200 comprises one or more sensors, proximity switches, or flow meters as described above.
- the laser head 200 comprises a containment plenum 240 coupled to the proximal portion 236 and which interfaces with the structure.
- the containment plenum 240 is adapted to confine material (e.g., debris and fumes generated during laser processing) removed from the structure and remove the material from the interaction region.
- the containment plenum 240 can also be further adapted to reduce noise and light emitted from the interaction region out of the containment plenum 240 (e.g., into the nominal hazard zone (“NHZ”) of the laser).
- One goal of the containment plenum 240 can be to ensure that no laser radiation in excess of the accessible emission limit (“AEL”) or maximum-permissible exposure (“MPE”) limit reaches the eye or skin of any personnel.
- AEL accessible emission limit
- MPE maximum-permissible exposure
- FIG. 4 schematically illustrates a cross-sectional view of a containment plenum 240 in accordance with embodiments described herein.
- the containment plenum 240 of FIG. 4 comprises a plenum housing 242 , a window 243 , a nozzle 244 , a resilient interface 246 , an extraction port 248 , and a compressed gas inlet 249 .
- the plenum housing 242 can be coupled to a source of laser light (e.g., the proximal portion 236 of the laser head 200 ) and can provide structural support for the other components of the containment plenum 240 .
- Exemplary materials for the plenum housing 242 include, but are not limited to, metals (e.g., aluminum, steel) which can be in the form of thin flexible sheets, ceramic materials, glass or graphite fibers, and fabric made from glass or graphite fibers.
- the plenum housing 242 is either air-cooled or water-cooled to reduce heating of the plenum housing 242 .
- Coolant conduits for the plenum housing 242 can be coupled in series or in parallel with the coolant conduits for other components of the laser head 200 .
- the window 243 of certain embodiments is positioned upstream of the nozzle 244 and within the propagation path of the laser light from the proximal portion 236 to the structure.
- the terms “downstream” and “upstream” have their ordinary meanings referring to the propagation direction of the laser light and to the direction opposite to the propagation direction of the laser light, respectively.
- the light propagating through the containment plenum 240 reaches the window 243 prior to reaching the nozzle 244 .
- the window 243 is substantially transparent to the laser light.
- the window 243 can be mounted within the plenum housing 242 to transmit the laser light in the downstream direction.
- the window 243 can have a number of shapes, including, but not limited to, square and circular.
- Exemplary windows 243 include, but are not limited to, a silica window (e.g., Part No. W2-PW-2037-UV-1064-0 available from CVI Laser Corp. of Albuquerque, N. Mex.).
- Dust and/or dirt on the optical elements of the laser head 200 can absorb an appreciable fraction of the laser light, resulting in nonuniform heating which can damage the optical elements.
- the window 243 is mounted within the plenum housing 242 to provide a barrier to the upstream transport of dust, smoke, or other particulate matter generated by the interaction of the laser light and the structure. In this way, the window 243 can facilitate protection of the upstream optical elements within the other portions of the laser head 200 .
- the window 243 can be mounted in a removable assembly in certain embodiments to facilitate cleaning, maintenance, and replacement of the window 243 .
- the window 243 focuses the light received from the proximal portion 236 , while in other embodiments, the window 243 can provide additional modification of the beam profile (e.g., beam shape).
- the mounting of the window 243 can be adjustable (e.g., using thumbscrews or Allen hex screws) so as to optimize the alignment and focus of the light beam.
- Exemplary window mounting assemblies include, but are not limited to, Part Nos. PLALH0097 and PLFLH0119 available from Laser Mechanisms, Inc. of Farmington Hills, Mich.
- the window 243 is either air-cooled or water-cooled.
- the laser light transmitted through the window 243 is emitted through the nozzle 244 towards the interaction region of the structure.
- the laser light can be focussed near the opening of the nozzle 244 .
- Exemplary materials for the nozzle 244 include, but are not limited to metals (e.g., copper).
- the nozzle 244 is either air-cooled or water-cooled to reduce heating of the nozzle 244 .
- Coolant conduits for the nozzle 244 can be coupled in series or in parallel with the coolant conduits for other components of the laser head 200 .
- the laser light propagating through the nozzle 244 preferably does not impinge the nozzle 244 (termed “clipping”) to avoid excessively heating and damaging the nozzle 244 . Improper alignment of the laser light through the laser head 200 can cause clipping.
- the opening of the nozzle 244 can be sufficiently large so that the laser light does not appreciably interact with the nozzle 244 .
- the nozzle 244 is approximately 0.3 inches in diameter.
- the resilient interface 246 of the containment plenum 240 is adapted to contact the structure and to substantially surround the interaction region, thereby facilitating confinement and removal of material from the interaction region.
- the resilient interface 246 can facilitate blocking light and/or sound from escaping outside the containment plenum 240 .
- Exemplary resilient interfaces 246 include, but are not limited to, a wire brush or a rubber seal (e.g., a bulb seal).
- the wire brush comprises a metal material which can withstand exposure to the heat, light, molten materials, and other environmental aspects of the interaction region.
- the rubber seal comprises a rubber material which can withstand exposure to the heat, light, molten materials, and other environmental aspects of the interaction region.
- the extraction port 248 of the containment plenum 240 is adapted to extract an appreciable portion of the material (e.g., gas, vapor, dust, and debris) generated within the interaction region during operation.
- the extraction port 248 can be coupled to a vacuum generator (not shown) which creates a vacuum to pull material (e.g., airborne particulates, gases, and vapors) from the interaction region. In this way, the extraction port 248 can provide a pathway for removal of the material from the containment plenum 240 .
- the compressed gas inlet 249 is adapted to provide compressed gas (e.g., air) to the containment plenum 240 .
- the compressed gas inlet 249 is fluidly coupled to the nozzle 244 which is adapted to direct a compressed gas stream to the interaction region.
- compressed gas flows coaxially with the laser light through the nozzle 244 .
- the window 243 of certain embodiments provides a surface against which the compressed gas exerts pressure. In this way, the compressed gas can flow through the nozzle 244 to the interaction region at a selected pressure and velocity.
- the compressed gas flowing from the compressed gas inlet 249 through the nozzle 244 can be used to deter dust, debris, smoke, and other particulate matter from entering the nozzle 244 .
- the compressed gas can facilitate protection of the window 243 from such particulate matter.
- the compressed gas can be directed by the nozzle 244 to the interaction region so as to facilitate removal of material from the interaction region and/or to cool the interaction region.
- the nozzle 244 can be used in this manner in embodiments in which the structure includes concrete with a high percentage of Si, so that the resultant glassy slag is sufficiently viscous and more difficult to remove from the interaction region.
- the compressed air is substantially free of oil, moisture, or other contaminants to avoid contaminating the surface of the window 243 and potentially damaging the window 243 by nonuniform heating.
- An exemplary source of instrument quality (“IQ”) compressed air is the 300-IQ air compressor available from Ingersoll-Rand Air Solutions Group of Davidson, N.C.
- the source of compressed air preferably provides air at a sufficient flow rate determined in part by the length of the hose delivering the air, and the number of components using the air and their requirements.
- the air compressor can be located hundreds of feet away from the laser head 200 .
- the source of compressed air can comprise an air dryer to reduce the amount of moisture condensing in the air conduits or hoses between the air compressor and the laser head 200 .
- An exemplary air dryer in accordance with embodiments described herein is the 400 HSB air dryer available from Zeks Compressed Air Solutions of West Chester, Pa.
- the laser head 200 comprises a sensor 250 adapted to measure the relative distance between the laser head 200 and the interaction region.
- FIG. 5 schematically illustrates an embodiment in which the containment plenum 240 comprises the sensor 250 , although other locations of the sensor 250 are also compatible with embodiments described herein.
- the interaction region extends into the structure.
- the sensor 250 then provides a measure of the depth of the interaction region from the surface of the structure.
- the sensor 250 can use various technologies to determine this distance, including, but not limited to, acoustic sensors, infrared sensors, tactile sensors, and imaging sensors.
- a sensor 250 comprising a diode laser and utilizing triangulation could be used to determine the distance between the laser head 200 and the surface being processed. Such a sensor 250 can also provide a measure of the amount of material removed from the surface.
- the senor 250 is coupled to the controller 500 , and the controller 500 is adapted to transmit control signals to the laser base unit 300 in response to signals from the sensor 250 .
- the laser base unit 300 can be adapted to adjust one or more parameters of the laser light in response to the control signals. In this way, the depth information from the sensor 250 can be used in real-time to adjust the focus or other parameters of the laser light.
- the controller 500 is adapted to transmit control signals to the laser manipulation system 100 in response to signals from the sensor 250 .
- the laser manipulation system 100 is adapted to adjust the relative distance between the laser head 200 and the interaction region in response to the control signals.
- the laser manipulation system 100 can be adapted to adjust the position of the laser head 200 along the surface of the structure in response to the control signals. In this way, the depth information from the sensor 250 at a first location can be used in real-time to move the laser light to another location along the surface once a desired depth at the first location is achieved.
- the senor 250 is used in conjunction with statistical methods to determine the depth of the interaction region.
- the sensor 250 is first used in a measurement phase to develop statistical data which correlates penetration depths with certain processing parameters (e.g., material being processed, light intensity).
- processing parameters e.g., material being processed, light intensity
- selected processing parameters are systematically varied for processing a test or sample surfaces indicative of the surfaces of the structure to be processed.
- the sensor 250 is used in the measurement phase to determine the depth of the interaction region corresponding to these processing parameters.
- the sensor 250 can be separate from the laser head 200 , and can be used during the processing of the structure or during periods when the processing has been temporarily halted in order to measure the depth of the interaction region.
- Exemplary sensors 250 compatible with such embodiments include, but are not limited to, calipers or other manual measuring devices which are inserted into the resultant hole to determine the depth of the interaction region.
- the controller 500 contains this resulting statistical data regarding the correlation between the processing parameters and the depth of the interaction region.
- the controller 500 can be adapted to determine the relative distance by accessing the statistical data corresponding to the particular processing parameters being used. Such an approach represents a reliable and cost-effective approach for determining the depth of the interaction region while processing the structure.
- the senor 250 is adapted to provide a measure of the distance between the laser head 200 and the surface of the structure.
- the sensor 250 can be adapted to provide a fail condition signal to the controller 500 upon detection of the relative distance between the laser head 200 and the structure exceeding a predetermined distance.
- a fail condition may result from the apparatus 50 inadvertently becoming detached from the structure.
- the controller 500 can be adapted to respond to the fail condition signal by sending appropriate signals to the laser base unit 300 to halt the transmission of energy between the laser base unit 300 and the laser head 200 .
- the transmission is preferably halted when the laser head 200 is further than one centimeter from the surface of the structure.
- the apparatus 50 can utilize the sensor 250 to insure that laser light is not emitted unless the containment plenum 240 is in contact with the structure.
- the sensor 250 comprises a proximity switch which contacts the surface of the structure while the apparatus 50 is attached to the structure.
- LMS Laser Manipulation System
- the laser manipulation system 100 serves to accurately and repeatedly position the laser head 200 in relation to the structure so as to provide articulated robotic motion generally parallel to the surface to be processed. To do so, the laser manipulation system 100 can be releasably affixed to the structure to be processed, and can then accurately move the laser head 200 in proximity to that surface.
- FIGS. 6A and 6B schematically illustrate two opposite elevated perspectives of an embodiment in which the laser manipulation system 100 comprises an anchoring mechanism 110 adapted to be releasably coupled to the structure and a positioning mechanism 121 coupled to the anchoring mechanism 110 and coupled to the laser head 200 .
- the laser manipulation system 100 can be advantageously disassembled and reassembled for transport, storage, or maintenance.
- Certain embodiments of the laser manipulation system 100 comprise an anchoring mechanism 110 to releasably affix the laser manipulation system 100 to the structure to be processed.
- the anchoring mechanism 110 can be adapted to be releasably coupled to the structure and can comprise one or more attachment interfaces 111 .
- the anchoring mechanism 110 is releasably coupled to a surface within the inhabitable structure. Certain such embodiments advantageously allow the apparatus to be used to process a surface within the inhabitable structure. In certain embodiments, the anchoring mechanism 110 is releasably coupled to the surface being irradiated by laser light. Certain such embodiments advantageously allow the apparatus to be used in relatively small, enclosed spaces within or external to the inhabitable structure.
- the anchoring mechanism 110 comprises a pair of attachment interfaces 111 .
- Each attachment interface 111 comprises at least one resilient vacuum pad 112 , at least one interface mounting device 114 , at least one vacuum conduit 116 , at least one mounting connector 118 , and a coupler 119 adapted to couple the attachment interface 111 of the anchoring mechanism 110 to the positioning mechanism 121 .
- FIGS. 6A and 6B have two vacuum pads 112 for each of the two attachment interfaces 111
- other embodiments utilize any configuration or number of attachment interfaces 111 and vacuum pads 112 .
- each vacuum pad 112 comprises a circular rubber pad which forms an effectively air-tight region when placed on the structure.
- Each vacuum pad 112 is fluidly coupled to at least one vacuum generator (not shown) via a vacuum conduit 116 (e.g., a flexible hose).
- the vacuum generator may use fluid power (e.g., compressed air) to generate the vacuum, or it may use an external vacuum source.
- the vacuum generator draws air out from the air-tight region between the vacuum pad 112 and the structure via the vacuum conduit 116 , thereby creating a vacuum within the air-tight region. Atmospheric pressure provides a force which reversibly affixes the vacuum pad 112 to the structure.
- the interface mounting device 114 comprises a rigid metal support upon which is mounted the vacuum pads 112 , the mounting connector 118 , and the coupler 119 .
- the mounting connector 118 can comprise a ground-based support connector 118 a adapted to be releasably attached to a ground-based support system 700 , as described more fully below.
- the mounting connector 118 can comprise at least one suspension-based support connector 118 b adapted to be releasably attached to a suspension-based support system 800 , as described more fully below.
- the coupler 119 is adapted to releasably couple the interface mounting device 114 to the positioning mechanism 121 .
- the coupler 119 comprises at least one protrusion which is connectable to at least one corresponding recess in the positioning mechanism 121 .
- the anchoring mechanism 110 can comprise other technologies for anchoring the apparatus 50 to the structure to be processed. These other technologies include, but are not limited to, a winch, suction devices (e.g., cups, komats, or skirts) affixed to the apparatus 50 or on quasi-tank treads, mobile scaffolding suspended from the structure, and a rigid ladder. These technologies can also be used in combination with one another in certain embodiments of the anchoring mechanism 110 .
- suction devices e.g., cups, komats, or skirts
- FIG. 8 schematically illustrates an exploded view of one embodiment of the positioning mechanism 121 along with the attachment interfaces 111 of the anchoring mechanism 110 .
- the positioning mechanism 121 of FIG. 8 comprises a first-axis position system 130 , a second-axis position system 150 , an interface 140 , and a laser head receiver 220 .
- the first-axis position system 130 is releasably coupled to the attachment interfaces 111 of the anchoring mechanism 110 by at least one coupler 132 .
- the interface 140 (comprising a first piece 140 a and a second piece 140 b in the embodiment of FIG.
- the laser head receiver 220 is releasably coupled to the second-axis position system 150 , and is adapted to be releasably coupled to the housing 230 of the laser head 200 .
- the first-axis position system 130 comprises at least one coupler 132 having a recess which is releasably connectable to at least one corresponding protrusion of the coupler 119 of the anchoring mechanism 110 .
- Such embodiments are advantageously disassembled and reassembled for transport, storage, or maintenance of the positioning mechanism 121 .
- Other embodiments can have the first-axis position system 130 fixedly coupled to the anchoring mechanism 110 .
- the first-axis position system 130 moves the laser head 200 in a first direction substantially parallel to the surface of the structure.
- the first-axis position system 130 further comprises a first rail 134 , a first drive 136 , and a first stage 138 .
- the first stage 138 is movably coupled to the first rail 134 under the influence of the first drive 136 .
- the first piece 140 a of the interface 140 is fixedly coupled to the first stage 138 so that the first drive 136 can be used to move the interface 140 along the first rail 134 .
- the first-axis position system 130 further comprises sensors, limit switches, or other devices which provide information regarding the position of the first stage 138 along the first rail 134 . This information can be provided to the controller 500 , which is adapted to transmit control signals to the first drive 136 or other components of the laser manipulation system 100 in response to this information.
- Exemplary first drives 136 include, but are not limited to, hydraulic drives, pneumatic drives, electromechanical drives, screw drives, and belt drives.
- First rails 134 , first drives 136 , and first stages 138 compatible with embodiments described herein are available from Tol-O-Matic, Inc. of Hamel, Minn. Other types and configurations of first rails 134 , first drives 136 , and first stages 138 are also compatible with embodiments described herein.
- the second-axis position system 150 moves the laser head 200 in a second direction substantially parallel to the surface of the structure.
- the second direction in certain embodiments is substantially perpendicular to the first direction of the first-axis position system 130 .
- the second-axis position system 150 comprises a second rail 152 , a second drive 154 , and a second stage 156 .
- the first-axis position system 130 and the second-axis position system 150 provide linear movements of the laser head 200 .
- the first-axis position system 130 and the second-axis position system 150 provide circular and axial movements of the laser head 200 , respectively.
- the second stage 156 is movably coupled to the second rail 152 under the influence of the second drive 154 .
- the laser head receiver 220 is releasably coupled to the second stage 156 so that the second drive 154 can be used to move the laser head receiver 220 along the second rail 152 .
- the second-axis position system 150 further comprises sensors, limit switches, or other devices which provide information regarding the position of the second stage 156 along the second rail 152 . This information can be provided to the controller 500 , which is adapted to transmit control signals to the second drive 154 or other components of the laser manipulation system 100 in response to this information.
- Exemplary second drives 154 include, but are not limited to, hydraulic drives, pneumatic drives, electromechanical drives, screw drives, and belt drives.
- Second rails 152 , second drives 154 , and second stages 156 compatible with embodiments described herein are available from Tol-O-Matic, Inc. of Hamel, Minn. Other types and configurations of second rails 152 , second drives 154 , and second stages 156 are also compatible with embodiments described herein.
- the second rail 152 is fixedly coupled to the second piece 140 b of the interface 140 .
- the second piece 140 b can comprise at least one recess which is releasably connectable to at least one corresponding protrusion of the first piece 140 a of the interface 140 .
- Such embodiments are advantageously disassembled and reassembled for transport, storage, or maintenance of the positioning mechanism 121 .
- the interface 140 can be made of a single piece which is releasably coupled to one or both of the first stage 138 and the second rail 152 .
- Other embodiments are not configured for convenient disassembly (e.g., having an interface 140 made of a single piece and that is fixedly coupled to both the first stage 138 and the second rail 152 ).
- the interface 140 comprises a tilt mechanism 144 to adjust the relative orientation between the first rail 134 and the second rail 152 .
- the first piece 140 a of the interface 140 is coupled to the first stage 138 on the first rail 134 , and comprises a pair of protuberances 142 adapted to couple with corresponding recesses of the second piece 140 b of the interface 140 .
- the tilt mechanism 144 comprises a first plate 145 , a hinge 146 , a second plate 147 , and a pair of support braces 148 .
- the first plate 145 is fixedly mounted to the first stage 138 and is substantially parallel to the surface upon which the anchoring mechanism 110 is mounted.
- the second plate 147 is pivotally coupled to the first plate 145 by the hinge 146 , and can be locked in place by the support braces 148 .
- the tilt mechanism 144 is configured so that the first plate 145 and the second plate 147 are substantially parallel to one another. In this configuration, the plane of movement defined by the first direction and the second direction of the laser head 200 is substantially parallel to the surface upon which the anchoring mechanism 110 is coupled.
- the tilt mechanism 144 is configured so that the second plate 147 is at a non-zero angle (e.g., 90 degrees) relative to the first plate 145 . In this configuration, the plane of movement defined by the first direction and the second direction of the laser head 200 is at a non-zero angle relative to the surface upon which the anchoring mechanism 110 is coupled.
- the laser head receiver 220 is releasably coupled the housing 230 of the laser head 200 .
- FIG. 12 schematically illustrates a laser head receiver 220 compatible with embodiments described herein.
- the laser head receiver 220 is coupled to the second stage 156 and comprises a releasable clamp 222 and a third-axis position system 224 .
- the clamp 222 is adapted to hold the housing 230 of the laser head 200 .
- the third-axis position system 224 is adapted to adjust the relative distance between the laser head 200 and the structure being processed.
- the third-axis position system 224 comprises a screw drive which moves the clamp 222 substantially perpendicularly to the second rail 152 .
- the screw drive is manually actuated by a handle 226 , which can be rotated to move the clamp 222 .
- the screw drive is automatically controlled by equipment responsive to control signals from the controller 500 .
- the apparatus 50 can be utilized with a ground-based support system 700 which is releasably coupled to the apparatus 50 .
- the interface mounting devices 114 can each comprise a ground-based support connector 118 a adapted to releasably couple to the ground-based support system 700 .
- the ground-based support system 700 advantageously attaches to various types of external boom systems, such as commercially-available lifting- or positioning-type systems, which can support some of the weight of the apparatus 50 , thereby reducing the weight load supported by the anchoring mechanism 110 .
- the ground-based support system 700 can be used to facilitate use of the apparatus 50 on substantially vertical surfaces (e.g., walls) or on substantially horizontal surfaces (e.g., ceilings).
- the ground-based support system 700 includes a support structure 710 such as that schematically illustrated in FIG. 13 .
- the support structure 710 of FIG. 13 comprises a boom connector 712 , a rotational mount 714 , a spreader member 716 , a pair of primary posts 718 , and a pair of auxiliary posts 720 .
- the boom connector 712 is adapted to attach to a selected external boom system.
- the rotational mount 714 is adapted to be rotatably coupled to the boom connector 712 and fixedly coupled to the spreader member 716 so that the boom connector 712 can be advantageously rotated relative to the support structure 710 .
- the primary posts 718 are coupled to the spreader member 716 and are substantially parallel to one another. Each of the primary posts 718 is adapted to be coupled to one of the ground-based support connectors 118 a of the interface mounting devices 114 . The primary posts 718 can each be coupled to the spreader member 716 at various positions so that they are aligned with the ground-based support connectors 118 a . Each primary post 718 is also coupled to, and is substantially perpendicular to, an auxiliary post 720 .
- the auxiliary posts 720 can be coupled to the ground-based support connectors 118 a , thereby effectively rotating the support structure 710 by 90 degrees relative to the anchoring mechanism 110 .
- Such embodiments advantageously provide adjustability for processing various configurations of structures and to permit alternative configurations best suited for particular applications.
- the apparatus 50 can be utilized with a suspension-based support system 800 which is releasably coupled to the apparatus 50 .
- the interface mounting devices 114 can each comprise at least one suspension-based support connector 118 b adapted to releasably couple to the suspension-based support system 800 .
- the suspension-based support system 800 advantageously supports some of the weight of the apparatus 50 , thereby reducing the weight load supported by the anchoring mechanism 110 .
- the suspension-based support system 800 can be used to facilitate use of the apparatus 50 on substantially vertical surfaces (e.g., outside walls).
- the suspension-based support system 800 comprises a winch 810 , a primary cable 812 , and a pair of secondary cables 814 .
- the winch 810 is positioned on the roof or other portion of a structure to be processed.
- the winch 810 is coupled to the primary cable 812 , which is coupled to the secondary cables 814 .
- the secondary cables 814 are each coupled to a suspension-based support connector 118 b of the interface mounting device 114 of the anchoring mechanism 110 .
- FIG. 14B schematically illustrates one embodiment of the apparatus having the suspension-based support connectors 118 b .
- the apparatus 50 can then be lowered or raised by utilizing the winch 810 to shorten or lengthen the working length of the primary cable 814 .
- the ground-based support connectors 118 a can be configured to serve also as the suspension-based support connectors 118 b.
- FIGS. 21A-21D schematically illustrate other anchoring mechanisms 1110 in accordance with embodiments described herein.
- the anchoring mechanism 1110 comprises a resilient vacuum pad 1112 adapted to be releasably coupled to the structure, a coupler 1114 adapted to be releasably attached to the laser head 1200 , and a handle 1116 .
- the anchoring mechanism 1110 provides a simplified mechanism to releasably hold the laser head 1200 of FIG. 20 at a selected position in relation to the structure being irradiated.
- the vacuum pad 1112 comprises a circular rubber membrane (not shown) which forms an effectively air-tight region when placed on the structure.
- the vacuum pad 1112 is fluidly coupled to at least one vacuum generator (not shown) via a vacuum conduit 1113 , shown in FIG. 21D .
- Exemplary materials for the vacuum conduit 1113 include, but are not limited to, flexible rubber hose.
- the vacuum generator By drawing air out from the air-tight region between the rubber membrane and the structure via the vacuum conduit, the vacuum generator creates a vacuum within the air-tight region. Atmospheric pressure provides a force which reversibly affixes the anchoring mechanism 1110 to the structure.
- the vacuum pad 112 is configured to hold the laser head 1200 in any orientation against gravitational forces.
- the anchoring mechanism 1110 supports the laser head 1200 to be in contact with a substantially vertical concrete surface. Removal of the anchoring mechanism 1110 from the surface is achieved by allowing air back into the air-tight region between the rubber membrane and the structure.
- Vacuum pads 1112 compatible with embodiments described herein are available from a variety of sources.
- An exemplary vacuum pad 1112 is provided by the 376281-DD-CR-1 Complete Core Rig Stand from Hilti Corporation of Schaan in the Principality of Liechtenstein.
- the coupler 1114 comprises a structure which mates with a corresponding laser head coupler 1250 of the laser head 1200 .
- the coupler 1114 comprises at least one protrusion 1115 which is attached to the vacuum pad 1112 .
- the coupler 1114 is connectable to the laser head coupler 1250 which comprises at least one corresponding recess 1116 .
- the coupler 1114 comprises a recess and the laser head coupler 1250 comprises a corresponding protrusion.
- the coupler 1114 comprises a collar 1117 which is adapted to hold the laser head 2200 , as schematically illustrated by FIG. 22A .
- the connector 1114 comprises at least one rod 1118 and the coupler 1250 of the laser head 1200 comprises at least one collar 1119 .
- the coupler 1114 comprises two rods 1118 a , 1118 b and the laser head coupler 1250 comprises two collars 1119 a , 1119 b .
- Each collar 1119 is releasably coupled to the corresponding rod 1118 such that the laser head 1200 can be adjustably positioned at various locations along the length of the rod 1118 .
- the collar 1119 can be adjustably rotated with respect to the rod 1118 to allow the laser head 1200 to be rotated about the rod 1118 .
- one collar 1119 a can be detached from its corresponding rod 1118 a , and the other collar 119 b can be rotated about its corresponding rod 1118 b .
- Such embodiments provide the capability to rotate the laser head 1200 away from its drilling position so that visual inspection can be made of the hole being drilled. Once visual inspection has been made, the laser head 1200 can then be replaced back into the drilling position by rotating the laser head 1200 back and recoupling the collar 1119 a to its corresponding rod 1118 a.
- the handle 1116 is adapted to facilitate transporting and positioning the anchoring mechanism 1110 at a desired location.
- Other configurations of the handle 1116 besides that schematically illustrated by FIGS. 21A-21D are compatible with other embodiments described herein.
- Such simplified anchoring mechanisms 1110 can be used when the apparatus is used to only drill or pierce holes into the structure.
- the anchoring mechanism 1110 can be releasably affixed to the structure so that the laser head 1200 is positioned to irradiate the structure to drill a hole at a selected location.
- the anchoring mechanism 1110 is removed from the structure and moved so that the laser head 1200 is repositioned to irradiate the structure at the second selected location.
- such simplified embodiments provide a lighter weight alternative which is movable and positionable by a single person.
- such simplified embodiments are more robust than those described in relation to FIGS. 6A , 6 B, 7 , and 8 .
- the controller 500 is electrically coupled to the laser base unit 300 and is adapted to transmit control signals to the laser base unit 300 . In other embodiments, the controller 500 is electrically coupled to both the laser base unit 300 and the laser manipulation system 100 , and is adapted to transmit control signals to both the laser base unit 300 and the laser manipulation system 100 .
- FIG. 15 schematically illustrates an embodiment of a controller 500 in accordance with embodiments described herein.
- the controller 500 comprises a control panel 510 , a microprocessor 520 , a laser generator interface 530 , a positioning system interface 540 , a sensor interface 550 , and a user interface 560 .
- control panel 510 includes a main power supply, main power switch, emergency power off switch, and various electrical connectors adapted to couple to other components of the controller 500 .
- the control panel 510 is adapted to be coupled to an external power source (not shown in FIG. 15 ) and to provide power to various components of the apparatus 50 .
- the microprocessor 520 can comprise a Programmable Logic Controller microprocessor (PLC).
- PLCs are rugged, reliable, and easy-to-configure, and exemplary PLCs are available from Rockwell Automation of Milwaukee, Wis., Schneider Electric of Palatine, Ill., and Siemens AG of Kunststoff, Germany.
- the microprocessor 520 comprises a personal computer microprocessor, or PC/104 embedded PC modules which provide easy and flexible implementation.
- the microprocessor 520 can be adapted to respond to input signals from the user (via the user interface 560 ), as well as from various sensors of the apparatus 50 (via the sensor interface 550 ), by transmitting control signals to the other components of the apparatus 50 (via the laser generator interface 530 and the positioning system interface 540 ) to achieve the desired cutting or drilling pattern.
- the microprocessor 520 can be implemented in hardware, software, or a combination of the two. When implemented in a combination of hardware and software, the software can reside on a processor-readable storage medium. In addition, the microprocessor 520 of certain embodiments comprises memory to hold information used during operation.
- the laser generator interface 530 is coupled to the laser base unit 300 and is adapted to transmit control signals from the microprocessor 520 to various components of the laser base unit 300 .
- the laser generator interface 530 can transmit control signals to the laser generator 310 to set desired operational parameters, including, but not limited to, laser power output levels and laser pulse profiles and timing.
- the laser generator interface 530 can transmit control signals to the cooling subsystem 320 to set appropriate cooling levels, the source of compressed gas coupled to the compressed gas inlet 249 of the containment plenum 240 , or to the vacuum generator coupled to the extraction port 248 .
- the positioning system interface 540 is coupled to the positioning mechanism 121 of the laser manipulation system 100 and is compatible with the first-axis position system 130 and second-axis position system 150 , as described above.
- the positioning system interface 540 comprises servo-drivers for the first-axis position system 130 and the second-axis position system 150 .
- the servo-drivers are preferably responsive to control signals from the microprocessor 520 to generate driving voltages and currents for the first drive 136 and the second drive 154 . In this way, the controller 500 can determine how the laser head 200 is scanned across the surface of the structure.
- the servo-drivers receive their power from the control panel 510 of the controller 500 .
- the positioning system interface 540 further comprises an appropriate servo-driver so that the controller 500 can determine the relative distance between the laser head 200 and the structure surface being processed.
- the sensor interface 550 is coupled to various sensors (not shown in FIG. 15 ) of the apparatus 50 which provide data upon which operation parameters can be selected or modified.
- the laser head 200 can comprise a sensor 250 adapted to measure the relative distance between the laser head 200 and the interaction region.
- the sensor interface 550 of such embodiments receives data from the sensor 250 and provide this data to the microprocessor 520 .
- the microprocessor 520 can then adjust various operational parameters of the laser base unit 300 and/or the laser manipulation system 100 , as appropriate, in real-time.
- sensors which can be coupled to the controller 500 via the sensor interface 550 include, but are not limited to, proximity sensors to confirm that the laser head 200 is in position relative to the surface being processed, temperature or flow sensors for the various cooling, compressed air, and vacuum systems, and rebar detectors (as described more fully below).
- the user interface 560 adapted to provide information regarding the apparatus 50 to the user and to receive user input which is transmitted to the microprocessor 520 .
- the user interface 560 comprises a control pendant 570 which is electrically coupled to the microprocessor 520 .
- the control pendant 570 comprises a screen 572 and a plurality of buttons 574 .
- the control pendant 570 comprises a plurality of buttons 574 and is separate from a screen 572 .
- the screen 572 can be used to display status information and operational parameter information to the user.
- Exemplary screens 572 include, but are not limited to, liquid-crystal displays.
- the buttons 574 can be used to allow a user to input data which is used by the microprocessor 520 to set operational parameters of the apparatus 50 .
- Other embodiments can use other technologies for communicating user input to the apparatus 50 , including, but not limited to, keyboard, mouse, touchpad, and potentiometer knobs and/or dials.
- the control pendant 570 is hard-wired to the apparatus 50 , while in other embodiments, the control pendant 570 communicates remotely (e.g., wirelessly) with the apparatus 50 .
- control pendant 570 further comprises an emergency stop button and a cycle stop button.
- the apparatus 50 Upon pressing the emergency stop button, the apparatus 50 immediately ceases all movement and the laser irradiation is immediately halted.
- the apparatus 50 Upon pressing the cycle stop button, the apparatus 50 similarly ceases all movement and halts laser irradiation corresponding to the cutting sequence being performed, but the user is then provided with the option to return to the beginning of the cutting sequence or to re-start cutting at the spot where the cutting sequence was stopped.
- the control pendant 570 further comprises a “dead man switch,” which must be manually actuated by the user for the apparatus 50 to perform. Such a switch provides a measure of safety by ensuring that the apparatus 50 is not run without someone actively using the control pendant 570 .
- FIGS. 17A-17H illustrate a set of exemplary screen displays of the control pendant 570 .
- the function of each of the buttons 574 along the left and right sides of the screen 572 is dependent on the operation mode of the apparatus 50 .
- Each of the screen displays provides information regarding system status along with relevant information regarding the current operation mode.
- the “MAIN SCREEN” display of FIG. 17A comprises a “Machine Status” field, a “System Status” field, and label fields corresponding to the functions of some or all of the buttons 574 of the control pendant 570 .
- the “Machine Status” field includes a text message which describes what the apparatus 50 is doing and what the user may do next.
- the “System Status” field includes a box which shows the operational mode of the apparatus 50 . In the example illustrated by FIG.
- the apparatus is in “maintenance mode.”
- the “System Status” field also includes a plurality of status boxes which indicate the status of various components of the apparatus 50 , including, but not limited to, the vacuum pads 112 of the anchoring system 110 , the air or vacuum pressure, the first-axis position system 130 , and the second-axis position system 150 .
- the “System Status” field also indicates whether there are any faults sensed with the laser base unit 300 . In certain embodiments, nominal status of a component is shown with the corresponding status box as green. The ready state of the apparatus 50 is illustrated by having all the system status boxes appear as green.
- the corresponding status box is shown as red, and the system interlocks are enabled, preventing operation of the apparatus 50 .
- the system interlocks are enabled and must be cleared prior to operation of the apparatus 50 .
- the text messages of the “Machine Status” field provide information regarding the actions to be performed to place the apparatus 50 within operational parameters and to clear the system interlocks. Upon clearing all the system interlocks, the “Machine Status” field will indicate that the apparatus 50 is ready to be used.
- the “SELECT OPERATION SCREEN” display of FIG. 17B comprises the “Machine Status” field, the “System Status” field, and the label fields corresponding to the functions of some or all of the buttons 574 .
- the “System Status” field includes information regarding the position of the laser head 200 along the first-axis position system 130 (referred to as the long axis) and the second-axis position system 150 (referred to as the short axis).
- Some of the buttons 574 are configured to enable various operations. For example, four buttons 574 are configured to enable four different operations: circle, pierce, straight cut, and surface keying, as illustrated in FIG. 17B .
- FIG. 17C shows a “CIRCLE SETUP/OPERATION SCREEN” display which provides information regarding the circle operation of the apparatus 50 in which the laser head 200 moves circularly to cut a circular pattern to a desired depth into the surface of the structure to be processed.
- the circle operation can be used for “trepanning,” whereby a solid circular core is cut and removed from the surface, leaving a circular hole.
- a “Circle Status” field provides information regarding the status of the circle operation and corresponding instructions to the user.
- the starting position of the laser head 200 along the first-axis position system 130 and the second-axis position system 150 are provided in the “System Status” field.
- a “Circle Parameters” field provides information regarding various parameters associated with the cutting of a circular pattern, including, but not limited to, the number of revolutions around the circular pattern, the diameter, time period that the cutting will be performed, the speed of motion of the laser head 200 around the circle, and the laser base unit (LBU) program number.
- the LBU program number corresponds to operational parameters of the laser head 200 including, but not limited to, beam focus and intensity.
- the various parameters can be changed by touching the parameter on the screen 572 , upon which a numerical keypad will pop up on the screen 572 so that a new value can be entered.
- the “set point” value corresponds to the value currently in memory and the last value that was entered.
- the “status” value corresponds to the current value being selected.
- the “status” and “set point” values are the same. Pressing the button 574 a labeled “Auto/Dry Run” will initiate the circular movement of the laser head 200 without activating the laser beam, to ensure the desired motion.
- Pressing the button 574 b labeled “Cycle Start” will initiate the cutting of the circular pattern, including both the movement of the laser head 200 and the activation of the laser beam. Pressing the button 574 c labeled “Cycle Stop” will halt or pause the cutting and movement, with the option to re-start the cutting and movement where it was halted. Pressing the button 574 d labeled “Machine Reset” will place the apparatus 50 in a neutral condition. Pressing the button 574 e labeled “Next” upon completion of the cutting will return to the “SELECT OPERATION SCREEN.”
- FIG. 17D shows a “PIERCE SETUP/OPERATION SCREEN” display which provides information regarding the pierce operation of the apparatus 50 in which the laser head 200 drills a hole to a desired depth into the surface of the structure to be processed.
- a “Pierce Status” field provides information regarding the status of the pierce operation and corresponding instructions to the user. The starting position of the laser head 200 along the first-axis position system 130 and the second-axis position system 150 are provided in the “System Status” field.
- a “Pierce Parameters” field provides information regarding various parameters associated with the drilling of a hole.
- the laser parameters can include, but are not limited to, the laser power, the laser spot size, and the time period for drilling (each of which can influence the diameter of the resultant hole which is formed in the structure), and the LBU program number.
- the parameters can be changed as described above.
- the buttons 574 labeled “Auto/Dry Run,” “Cycle Start,” “Cycle Stop,” “Machine Reset,” and “Next” operate as described above.
- FIG. 17E shows a “CUT SETUP/OPERATION SCREEN” display which provides information regarding the straight cutting operation of the apparatus 50 in which the laser head 200 makes a straight cut to a desired depth in the surface of the structure to be processed.
- the straight cut is preferably along one of the axes of the apparatus 50 .
- a “Cut Status” field provides information regarding the status of the cut operation and corresponding instructions to the user. The starting position of the laser head 200 along the first-axis position system 130 and the second-axis position system 150 are provided in the “System Status” field.
- a “Cut Parameters” field provides information regarding various parameters associated with the cutting, including, but not limited to, the speed of motion of the laser head 200 , the length of the cut to be made, and the LBU program number.
- buttons 574 f , 574 g labeled “Long Axis” and “Short Axis” are used to select either the first axis or the second axis respectively as the axis of motion of the laser head 200 .
- the buttons 574 labeled “Auto/Dry Run,” “Cycle Start,” “Cycle Stop,” “Machine Reset,” and “Next” operate as described above.
- FIG. 17F shows a “SURFACE KEYING SETUP/OPERATION SCREEN” display which provides information regarding the surface keying operation of the apparatus 50 in which the laser head 200 cuts an indentation or key into the surface of the structure to be processed.
- the surface keying operation includes scanning the laser beam across the surface to create an indentation or “key” in the surface with a desired depth and with a generally rectangular area.
- the surface keying operation can be used to perform “scabbling” of the surface, whereby the surface is roughened by interaction with the laser beam across an area (e.g., rectangular).
- a “Surface Keying Status” field provides information regarding the status of the surface keying operation and corresponding instructions to the user.
- the starting position of the laser head 200 along the first-axis position system 130 and the second-axis position system 150 are provided in the “System Status” field.
- a “Surface Keying Parameters” field provides information regarding various parameters associated with the cutting, including, but not limited to, the speed of motion of the laser head 200 , the length of the key to be made along the first axis and along the second axis, the offset length that the apparatus 50 will increment between movement along the first axis and the second axis, and the LBU program number. The parameters can be changed as described above.
- buttons 574 f , 574 g labeled “Long Axis” and “Short Axis” are used to select either the first axis or the second axis respectively as the axis of motion of the laser head 200 .
- the buttons 574 labeled “Auto/Dry Run,” “Cycle Start,” “Cycle Stop,” “Machine Reset,” and “Next” operate as described above.
- FIG. 17G shows a “FAULT SCREEN” display which provides information regarding detected operation faults.
- a fault occurs when a sensor (e.g., flowmeters, temperature sensors, safety switches, emergencies stops) of the monitored systems detects a non-operational condition, and can occur while the apparatus 50 is any of the operational modes and while any of the screens are being displayed.
- a scrolling message indicating the fault is preferably provided at the bottom of the current screen being displayed.
- the “Machine Status” field will indicate to the user to clear the faults.
- the “FAULT SCREEN” can be accessed from any of the other screens by pressing an appropriate button 574 . As illustrated in FIG.
- the “FAULT SCREEN” displays the detected faults in a table with the relevant data, including, but not limited to, the date and the type of fault.
- the detected faults are preferably cleared by the user. After clearing the detected faults, the user can press an appropriate button 574 (e.g., “Acknowledge All”) to acknowledge the faults. If the faults are not cleared, the user can press an appropriate button 574 (e.g., “Machine Reset”) to return to the screen being displayed when the fault occurred. Pressing the “Machine Reset” button 574 again will return the user to the “MAIN SCREEN” from where the apparatus 50 can be reset.
- an appropriate button 574 e.g., “Acknowledge All”
- the user can press an appropriate button 574 (e.g., “Machine Reset”) to return to the screen being displayed when the fault occurred. Pressing the “Machine Reset” button 574 again will return the user to the “MAIN SCREEN” from where the apparatus 50 can
- FIG. 17H shows a “MAINTENANCE SCREEN” display which provides information regarding the apparatus 50 .
- the maintenance mode can be accessed from the “MAIN SCREEN” display by pressing an appropriate button 574 .
- the system interlocks are bypassed, therefore the user preferably practices particular care to avoid damaging the apparatus 50 or people or materials in proximity to the apparatus 50 .
- the “MAINTENANCE SCREEN” can display an appropriate warning to the user.
- the maintenance mode provides an opportunity for the user to check the operation of various components of the apparatus 50 independent of the fault status of the apparatus 50 .
- the vacuum system can be turned on and off, the compressed air can be turned on and off via a solenoid valve, and the first drive 136 and second drive 154 can be turned on and off.
- the default jog speed of the first axis and second axis can be changed by pressing the screen 572 to pop up a numerical keypad display, as described above.
- the “System Status” field also includes a plurality of status boxes which indicate the status of various components of the apparatus 50 , including, but not limited to, the vacuum pads 112 of the anchoring system 110 , the air or vacuum pressure, the first-axis position system 130 , and the second-axis position system 150 .
- the “System Status” field also indicates whether there are any faults sensed with the laser base unit 300 . In certain embodiments, nominal status of a component is shown with the corresponding status box as green. The ready state of the apparatus 50 is illustrated by having all the system status boxes appear as green. If the status of one of these components is outside operational parameters, the corresponding status box is shown as red.
- the “MAINTENANCE SCREEN” can also provide the capability to move the laser head 200 along the first axis and second axis, as desired.
- a set of three buttons 574 are configured to move the laser head 200 along the first axis to a home position, in a forward direction, or in a backward direction, respectively.
- another set of three buttons 574 are configured for similar movement of the laser head 200 along the second axis.
- the label field for these sets of buttons can include information regarding the position of the laser head 200 along these two axes.
- the controller 500 is coupled to a detector 600 adapted to detect embedded material in the structure while processing the structure, and to transmit detection signals to the controller 500 .
- the controller 500 is adapted to avoid substantially damaging the embedded material by transmitting appropriate control signals to the laser base unit 300 or to both the laser base unit 300 and the laser manipulation system 100 .
- the detector 600 is adapted to utilize light emitted by the interaction region during processing to detect embedded material.
- Spectral analysis of the light emitted by the interaction region during processing can provide information regarding the chemical constituents of the material in the interaction region. By analyzing the wavelength and/or the intensity of the light, it is possible to determine the composition of the material being heated and its temperature. Using spectroscopic information, the detection of embedded materials in certain embodiments relies on monitoring changes in the light spectrum during processing. With the differences in composition of embedded materials, by way of example and not limitation, such as rebar (e.g., steel) embedded in concrete, variations in the melting and boiling temperatures for the diverse materials will produce noticeable changes in the amount of light, and/or the wavelength of the light when the laser light impinges and heats the embedded material.
- rebar e.g., steel
- FIG. 18A schematically illustrates an exemplary detector 600 compatible with embodiments described herein.
- the detector 600 comprises a collimating lens 610 , an optical fiber 620 , and a spectrometer 630 .
- the spectrometer 630 of certain embodiments comprises an input slit 631 , an optical grating 632 , a collection lens 633 , and a light sensor 634 .
- the collimating lens 610 is positioned to receive light emitted from the interaction region, and to direct the light onto the optical fiber 620 .
- the optical fiber 620 then delivers the light to the spectrometer 630 , and the light is transmitted through the input slit 631 to the optical grating 632 of the spectrometer 630 .
- the optical grating 632 separates the light into a spectrum of wavelengths.
- the separated light having a selected range of wavelengths can then be directed through the collection lens 633 onto the light sensor 634 which generates a signal corresponding to the intensity of the light in the range of wavelengths.
- the detector 600 is mounted onto the laser head 200 .
- the collimating lens 610 can be positioned close to the axis of the emitted laser light so as to receive light from the interaction region.
- the collimating lens 610 can be behind the nozzle 244 and protected by the compressed air from the compressed air inlet 249 , as is the window 243 .
- the collimating lens 610 is coaxial with the laser beam, while in other embodiments, the collimating lens 610 is located off-axis.
- Exemplary collimating lenses 610 include, but are not limited to, UV-74 from Ocean Optics of Dunedin, Fla.
- the optical fiber 620 comprises a material selected to provide sufficiently low attenuation of the light intensity transmitted from the laser head 200 to the spectrometer 630 .
- Exemplary materials for the optical fiber 620 include, but are not limited to, silica and fused silica.
- the optical fiber 620 comprises a pure fused silica core, a doped fused silica cladding, and a polyimide buffer coating.
- the optical fiber 620 of certain embodiments is protected by an outer jacket (e.g., Teflon®, Tefzel®, Kevlar®, and combinations thereof) and a stainless steel sheath.
- optical fiber 620 of certain embodiments is connectable to the laser head 200 using a right-angle fiber mount.
- Other types of optical fibers 620 and mounting configurations are compatible with embodiments described herein.
- Exemplary optical fibers 620 include, but are not limited to, P400-2-UV/VIS from Ocean Optics of Dunedin, Fla.
- the spectrometer 630 comprises an adjustable input slit 631 .
- the input slit 631 of certain embodiments has a height of approximately 1 millimeter and a width in a range between approximately 5 microns and approximately 200 microns.
- the input slit 631 determines the amount of light entering the spectrometer 630 .
- the width of the input slit 631 affects the resolution of the light sensor 634 .
- an input slit width of approximately 5 microns corresponds to a resolution of approximately 3 pixels
- an input slit width of approximately 200 microns corresponds to a resolution of approximately 24 pixels.
- the width of the input slit 631 is advantageously selected to provide sufficient light transmittance as well as sufficient resolution.
- the optical grating 632 of certain embodiments receives light from the input slit 631 and diffracts the various wavelength components of the light by corresponding angles dependent on the wavelength of the light. In this way, the optical grating 632 separates the various wavelength components of the light. In certain embodiments, the angle between the optical grating 632 and the light from the input slit 631 is scanned (e.g., by moving the optical grating 632 ), thereby scanning the wavelength components which reach the light sensor 634 .
- Exemplary spectrometers 630 utilizing an optical grating 632 include, but are not limited to, USB2000(VIS/UV) from Ocean Optics of Dunedin, Fla.
- the collection lens 633 of the spectrometer 630 is adapted to increase the light reception efficiency of the light sensor 634 .
- the collection lens 633 comprises a cylindrical lens affixed onto the light sensor 634 .
- Such embodiments of the collection lens 633 are advantageously useful with large diameter entrance apertures (limited by the width of the input slit 631 or the size of the optical fiber 620 ) and with low-light-level applications.
- the collection lens 633 improves the efficiency of the spectrometer 630 by reducing the amount of stray light which reaches the light sensor 634 .
- Other spectrometers 630 with other configurations of the input slit 631 , the optical grating 632 , and the collection lens 633 are compatible with embodiments described herein.
- the detection system 600 comprises a computer system 640 coupled to the spectrometer 630 , as schematically illustrated by FIG. 18B .
- the computer system 640 is adapted to analyze the resulting spectroscopic data.
- the computer system 640 of certain embodiments comprises a microprocessor 641 , a memory subsystem 642 , and a display 643 .
- the microprocessor 641 and the memory subsystem 642 can be mounted within a National Electrical Manufacturers Association (NEMA)-rated enclosure 644 with input and output power and signal connections on one or more side panels of the enclosure for easy access.
- NEMA National Electrical Manufacturers Association
- the computer system 640 is powered by 110 V from a wall outlet, while in certain embodiments, the computer system 630 further comprises a battery backup power supply (not shown) to ensure functionality in the event of power loss.
- the microprocessor 641 comprises a Pentium-200 microprocessor chip, while in other embodiments, the microprocessor 641 comprises a Pentium-III 850-MHz microprocessor chip.
- the memory subsystem 642 comprises a hard disk drive. Other types of microprocessors 641 and memory subsystems 642 are compatible with embodiments described herein.
- the display 643 comprises a thin-film-transistor (TFT) touch screen display. Besides being used to display spectroscopic results to a user, such a touch screen display can be used to provide user input to the detector 600 to modify various operation parameters.
- TFT thin-film-transistor
- the spectrometer 630 can monitor specific wavelengths that are associated with various embedded materials in the structure. In certain embodiments, the spectrometer 630 can monitor the relative intensity of the light at, or in spectral regions in proximity to, these wavelengths. Additionally, at least one neutral density filter may be employed to decrease the light reaching the spectrometer 630 to improve spectral analysis performance.
- the spectrometer 630 monitors the intensity at a specific wavelength and the intensities on both sides of this wavelength.
- the spectrometer 630 of certain embodiments also monitors the reduction of the intensities resulting from the increased depth of the hole being drilled.
- FIG. 19 shows an exemplary graph of the light spectrum detected upon irradiating concrete with laser light and the light spectrum detected upon irradiating an embedded rebar.
- the spectrum from concrete shows an emission peak at a wavelength of approximately 592 nanometers.
- the spectrum from rebar does not have this emission peak, but instead shows an absorption dip at approximately the same wavelength.
- the emission spectrum at about 592 nanometers can be used to provide a real-time indication of whether an embedded rebar is being cut by the laser light.
- the detector 600 can determine whether the emission spectrum has a dip corresponding to concrete or a peak corresponding to embedded rebar.
- Other spectroscopic data can be used in other embodiments.
- the detector 600 examines a spectral region defined by an upper cutoff wavelength (e.g., 582 nanometers) and a lower cutoff wavelength (e.g., 600 nanometers) and determines a spectral ratio R characteristic of the detection or non-detection of embedded rebar.
- FIG. 23 is a flowchart of an exemplary method 2500 for determining the spectral ratio R in accordance with embodiments described herein. The method 2500 does not address changes in the light from the interaction region as the hole becomes deeper.
- the method 2500 comprises an operational block 2510 in which the data within the spectral region is compared to a selected amplitude range. If any of the data fall outside the amplitude range, the spectrum is deemed to correspond to non-detection of embedded rebar.
- the method 2500 further comprises analyzing the data of the spectral region to determine the existence of a valley and two peaks. In certain embodiments, this analysis comprises determining whether the data of the spectral region comprises a valley in an operational block 2520 . If a valley is determined to exist, then a valley value V is calculated in an operational block 2530 and the spectral region is analyzed to determine whether the data of the spectral region comprises two peaks in an operational block 2540 . In certain embodiments, the valley value V corresponds to the amplitude of the data at the valley. In certain other embodiments, calculating the valley value V comprises determining a minimum value of the data in a first portion of the spectral region. In certain embodiments, the first portion of the spectral region corresponds to a range of wavelengths between approximately 588 nanometers and approximately 594 nanometers.
- a peak value P is calculated in the operational block 2550 and the spectral ratio R is calculated by dividing the valley value V by the peak value P in an operational block 2560 .
- the peak value P is calculated by averaging the values of the two peaks. If the spectral ratio R is greater than or equal to one, then the spectrum is deemed to correspond to detection of embedded rebar.
- a first maximum value M 1 is calculated from the data of a second portion of the spectral region in an operational block 2570 and a second maximum value M 2 is calculated from the data of a third portion of the spectral region in an operational block 2580 .
- the second portion of the spectral region corresponds to a range of wavelengths from approximately 582 nanometers to approximately 588 nanometers
- the third portion of the spectral region corresponds to a range of wavelengths from approximately 594 nanometers to approximately 600 nanometers.
- the first maximum value M 1 corresponds to a maximum data amplitude in the second portion of the spectral region and the second maximum value M 2 corresponds to a maximum data amplitude in the third portion of the spectral region.
- the peak value P is calculated by averaging the first maximum value M 1 and the second maximum value M 2 in an operational block 2590 .
- the spectral ratio R is calculated by dividing the valley value V by the peak value P in an operational block 2600 . If the spectral ratio R is greater than or equal to one, then the spectrum is deemed to correspond to detection of embedded rebar.
- a peak value P′ is calculated in an operational block 2610 and the peak value P′ is compared to a predetermined threshold value T in an operational block 2620 .
- calculating the peak value P′ comprises averaging the intensity values of any peaks detected in the spectral region. If the peak value P′ is less than the threshold value T, then the spectrum is deemed to correspond to detection of embedded rebar.
- An alternative technology for detecting embedded materials uses high speed shutter monitoring.
- This approach utilizes advances in Coupled Capacitance Discharge (CCD) camera systems to monitor discrete changes in the interactions between the material to be processed and the laser light.
- CCD Coupled Capacitance Discharge
- Newer CCD cameras have systems that can decrease the time the shutter is open to about 0.0001 second. At this speed, it is possible to see many features of the interaction between the laser light and the material being processed.
- neutral density filters may be employed to decrease the glare observed from the incandescent interaction of the laser light and the material to be processed and to better image the interaction region.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Laser Beam Processing (AREA)
Abstract
An apparatus processes a surface of an inhabitable structure. The apparatus includes a laser base unit which irradiates an interaction region with laser light, the laser light removing material from the structure. The laser base unit includes a laser generator and a laser head coupled to the laser generator. The laser head includes a containment plenum which confines and removes material from the interaction region. The containment plenum includes a rubber seal which contacts the structure and which substantially surrounds the interaction region, thereby facilitating confinement and removal of material from the interaction region, and providing reduced disruption to activities within the structure. The apparatus further includes an anchoring mechanism releasably coupled to the structure and releasably coupled to the laser head. The apparatus further includes a controller electrically coupled to the laser base unit. The controller transmits control signals to the laser base unit in response to user input.
Description
- This application is a continuation of U.S. patent application Ser. No. 11/205,290, filed Aug. 16, 2005, which claims the benefit under 35 U.S.C. § 119(e) to U.S. Provisional Patent Application No. 60/601,816, filed Aug. 16, 2004, and which is a continuation-in-part from U.S. patent application Ser. No. 10/803,272 filed Mar. 18, 2004, which is a continuation-in-part from U.S. patent application Ser. No. 10/690,983, filed Oct. 22, 2003, which claims benefit under 35 U.S.C. § 119(e) to U.S. Provisional Patent Application No. 60/456,043, filed Mar. 18, 2003, to U.S. Provisional Patent Application No. 60/471,057, filed May 16, 2003, and to U.S. Provisional Patent Application No. 60/496,460, filed Aug. 20, 2003. Each of U.S. patent application Ser. Nos. 11/205,290, 10/803,272, 10/690,983, and U.S. Provisional Patent Application Nos. 60/601,816, 60/456,043, 60/471,057, and 60/496,460 is incorporated in its entirety by reference herein.
- This application is related to U.S. patent application Ser. Nos. 10/690,833, 10/690,975, 10/691,481, and 10/691,444, each of which were filed on Oct. 22, 2003 and each of which is incorporated in its entirety by reference herein. This application is also related to U.S. patent application Ser. Nos. 10/803,243 and 10/803,267, both of which were filed on Mar. 18, 2004, and are incorporated in their entireties by reference herein. This application is also related to U.S. patent application Ser. Nos. 11/401,114 and 11/401,116, both of which were filed on Apr. 10, 2006, U.S. patent application Ser. No. 11/653,081, filed Jan. 12, 2007, U.S. patent application Ser. No. 11/363,805, filed Feb. 28, 2006, and U.S. patent application Ser. Nos. 11/861,184 and 11/861,193, both of which were filed Sep. 25, 2007.
- This invention was funded, in part, by the Federal Emergency Management Agency as part of the Robert T. Stafford Disaster Relief and Emergency Assistance Act (42 U.S.C. § 5121 et seq.).
- 1. Field of the Invention
- The present invention relates to the field of material processing, particularly, to an apparatus and method for drilling, cutting, and surface processing of materials using energy waves.
- 2. Description of the Related Art
- Those in the wide ranging materials processing industries have long recognized the need for non-disruptive material processing. In the past, virtually all material processing, including drilling, cutting, scabbling, and the like have included numerous disruptive aspects (e.g., noise, vibration, dust, vapors, and fumes). Material processing generally includes mechanical technologies such as drilling, hammering, and other power assisted methods, and water jet based technologies. Demonstrative of the problems of material processing, U.S. Pat. No. 5,085,026 is highly illustrative. The '026 device requires mechanical drilling of materials such as concrete or other masonry, and generates all the disruptive aspects noted above.
- In certain embodiments, an apparatus processes a surface of an inhabitable structure. The apparatus comprises a laser base unit adapted to provide laser light to an interaction region, the laser light removing material from the structure. The laser base unit comprising a laser generator and a laser head coupled to the laser generator. The laser head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure. The apparatus further comprises a laser manipulation system. The laser manipulation system comprises an anchoring mechanism adapted to be releasably coupled to the structure. The laser manipulation system further comprises a positioning mechanism coupled to the anchoring mechanism and coupled to the laser head. The laser manipulation system is adapted to controllably adjust the position of the laser head relative to the structure. The apparatus further comprises a controller electrically coupled to the laser base unit and the laser manipulation system. The controller is adapted to transmit control signals to the laser base unit and to the laser manipulation system in response to user input.
- In certain embodiments, an apparatus processes a surface of an inhabitable structure with reduced disruption to activities within the structure. The apparatus comprises means for generating laser light. The apparatus further comprises means for providing the laser light to an interaction region of the structure to remove material from the structure. The apparatus further comprises means for confining the material and removing the material from the interaction region. The apparatus further comprises means for controllably adjusting a position of the interaction region relative to the surface of the structure. The apparatus further comprises means for controlling the laser light and the position of the interaction region in response to user input.
- In certain embodiments, a method processes a surface of an inhabitable structure with reduced disruption to activities within the structure. The method comprises remotely generating laser light. The method further comprises providing the laser light to the surface, the laser light interacting with the structure in an interaction region to remove material from the structure. The method further comprises confining the material and removing the material from the interaction region. The method further comprises controllably adjusting a position of the interaction region relative to the surface of the structure. The method further comprises controlling the laser light and the position of the interaction region in response to user input.
- In certain embodiments, an apparatus processes a surface of an inhabitable structure. The apparatus comprises a base unit adapted to provide energy waves to an interaction region, the energy waves removing material from the structure. The base unit comprises a generator and a head coupled to the generator. The head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure. The apparatus further comprises a manipulation system. The manipulation system comprises an anchoring mechanism adapted to be releasably coupled to the structure. The manipulation system further comprises a positioning mechanism coupled to the anchoring mechanism and coupled to the head. The manipulation system is adapted to controllably adjust the position of the head relative to the structure. The apparatus further comprises a controller electrically coupled to the base unit and the manipulation system. The controller is adapted to transmit control signals to the base unit and to the manipulation system in response to user input.
- In certain embodiments, an apparatus processes a surface of an inhabitable structure. The apparatus comprises a laser base unit adapted to provide laser light to an interaction region, the laser light removing material from the structure. The laser base unit comprising a laser generator and a laser head coupled to the laser generator. The laser head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure. The apparatus further comprises an anchoring mechanism adapted to be releasably coupled to the structure and releasably coupled to the laser head. The apparatus further comprises a controller electrically coupled to the laser base unit. The controller is adapted to transmit control signals to the laser base unit in response to user input.
- In certain embodiments, an apparatus processes a surface of an inhabitable structure with reduced disruption to activities within the structure. The apparatus comprises means for generating laser light. The apparatus further comprises means for providing the laser light to an interaction region of the structure to remove material from the structure. The apparatus further comprises means for confining the material and removing the material from the interaction region. The apparatus further comprises means for controlling the laser light in response to user input.
- In certain embodiments, a method processes a surface of an inhabitable structure with reduced disruption to activities within the structure. The method comprises remotely generating laser light. The method further comprises providing the laser light to the surface, the laser light interacting with the structure in an interaction region to remove material from the structure. The method further comprises confining the material and removing the material from the interaction region. The method further comprises controlling the laser light in response to user input.
- In certain embodiments, an apparatus processes a surface of an inhabitable structure. The apparatus comprises a base unit adapted to provide energy waves to an interaction region, the energy waves removing material from the structure. The base unit comprises a generator and a head coupled to the generator. The head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure. The apparatus further comprises an anchoring mechanism adapted to be releasably coupled to the structure and releasably coupled to the head. The apparatus further comprises a controller electrically coupled to the base unit. The controller is adapted to transmit control signals to the base unit in response to user input.
- In certain embodiments, an apparatus processes a surface of an inhabitable structure. The apparatus comprises a laser base unit which irradiates an interaction region with laser light, the laser light removing material from the structure. The laser base unit comprises a laser generator and a laser head coupled to the laser generator. The laser head comprises a containment plenum which confines and removes material from the interaction region. The containment plenum comprises a rubber seal which contacts the structure and which substantially surrounds the interaction region, thereby facilitating confinement and removal of material from the interaction region and providing reduced disruption to activities within the structure. The apparatus further comprises an anchoring mechanism releasably coupled to the structure and releasably coupled to the laser head. The apparatus further comprises a controller electrically coupled to the laser base unit. The controller transmits control signals to the laser base unit in response to user input.
- In certain embodiments, an apparatus processes a surface of an inhabitable structure with reduced disruption to activities within the structure. The apparatus comprises means for generating laser light. The apparatus further comprises means for providing the laser light to an interaction region of the structure to remove material from the structure. The apparatus further comprises means for confining the material and removing the material from the interaction region. The confining means comprises a rubber seal which substantially surrounds the interaction region. The apparatus further comprises means for controlling the laser light in response to user input.
- In certain embodiments, a method processes a surface of an inhabitable structure with reduced disruption to activities within the structure. The method comprises remotely generating laser light. The method further comprises providing the laser light to the surface, the laser light interacting with the structure in an interaction region to remove material from the structure. The method further comprises confining the material and removing the material from the interaction region. The material is confined by a rubber seal which substantially surrounds the interaction region. The method further comprises controlling the laser light in response to user input.
- For purposes of summarizing the present invention, certain aspects, advantages and novel features of the present invention have been described herein above. It is to be understood, however, that not necessarily all such advantages may be achieved in accordance with any particular embodiment of the present invention. Thus, the present invention may be embodied or carried out in a manner that achieves or optimizes one advantage or group of advantages as taught herein without necessarily achieving other advantages as may be taught or suggested herein.
- Without limiting the scope of the present invention as claimed below and referring now to the drawings and figures:
-
FIG. 1 schematically illustrates an embodiment of an apparatus for processing a surface of a structure; -
FIG. 2 schematically illustrates a laser base unit compatible with embodiments described herein; -
FIG. 3A schematically illustrates a laser head in accordance with embodiments described herein; -
FIGS. 3B and 3C schematically illustrate two alternative embodiments of the laser head; -
FIG. 4 schematically illustrates a cross-sectional view of a containment plenum in accordance with embodiments described herein; -
FIG. 5 schematically illustrates a laser head comprising a sensor adapted to measure the relative distance between the laser head and the interaction region; -
FIGS. 6A and 6B schematically illustrate two opposite elevated perspectives of an embodiment in which the laser manipulation system comprises an anchoring mechanism adapted to be releasably coupled to the structure and a positioning mechanism coupled to the anchoring mechanism and coupled to the laser head; -
FIG. 7 schematically illustrates an embodiment of an attachment interface of the anchoring mechanism; -
FIG. 8 schematically illustrates an exploded view of one embodiment of the positioning mechanism along with the attachment interfaces of the anchoring mechanism; -
FIG. 9 schematically illustrates an embodiment of a first-axis position system; -
FIG. 10 schematically illustrates an embodiment of a second-axis position system; -
FIGS. 11A and 11B schematically illustrate an embodiment of an interface in two alternative configurations; -
FIG. 12 schematically illustrates an embodiment of a laser head receiver; -
FIG. 13 schematically illustrates an embodiment of a support structure coupled to the other components of the apparatus; -
FIG. 14A schematically illustrates an embodiment of a suspension-based support system coupled to the apparatus; -
FIG. 14B schematically illustrates an embodiment of the apparatus comprising suspension-based support connectors; -
FIG. 15 schematically illustrates an embodiment of a controller comprising a control panel, a microprocessor, a laser generator interface, a positioning system interface, a sensor interface, and a user interface; -
FIG. 16 schematically illustrates a control pendant comprising a screen and a plurality of buttons; -
FIG. 17A illustrates an exemplary “MAIN SCREEN” display of the control pendant; -
FIG. 17B illustrates an exemplary “SELECT OPERATION SCREEN” display of the control pendant; -
FIG. 17C illustrates an exemplary “CIRCLE SETUP/OPERATION SCREEN” display of the control pendant; -
FIG. 17D illustrates an exemplary “PIERCE SETUP/OPERATION SCREEN” display of the control pendant; -
FIG. 17E illustrates an exemplary “CUT SETUP/OPERATION SCREEN” display of the control pendant; -
FIG. 17F illustrates an exemplary “SURFACE KEYING SETUP/OPERATION SCREEN” display of the control pendant; -
FIG. 17G illustrates an exemplary “FAULT SCREEN” display of the control pendant; -
FIG. 17H illustrates an exemplary “MAINTENANCE SCREEN” display of the control pendant; -
FIG. 18A schematically illustrates a detector compatible with embodiments described herein; -
FIG. 18B schematically illustrates a computer system adapted to analyze the resulting spectroscopic data; -
FIG. 19 shows a graph of the light spectrum of wavelengths detected upon irradiating concrete with laser light and the light spectrum detected upon irradiating concrete with embedded rebar; -
FIG. 20 schematically illustrates an exemplary compact configuration of a laser head in accordance with embodiments described herein; -
FIGS. 21A-21C schematically illustrate various anchoring mechanisms in accordance with embodiments described herein; -
FIG. 21D illustrates an exemplary compact configuration of a laser head and an anchoring mechanism in accordance with embodiments described herein; -
FIG. 22A schematically illustrates a lightweight configuration of a laser head in accordance with embodiments described herein; -
FIG. 22B illustrates another exemplary lightweight configuration of a laser head and an anchoring mechanism in accordance with embodiments described herein; -
FIG. 22C schematically illustrates a containment plenum coupled to the laser head ofFIG. 22B ; and -
FIG. 23 is a flowchart of an exemplary method for determining a spectral ratio in accordance with embodiments described herein. - Reducing the disruptive aspects of material processing has long been a goal of those in materials processing industries, particularly in industries that require materials processing within or near occupied structures, such as is common in renovation and many other applications. Such long-felt needs have been particularly prevalent in seismically active areas of the earth, where there is a pressing need for an effective and economical means of retrofitting occupied structures to increase the safety of these structures.
- Prior technologies are plagued by disruptive characteristics, thereby making them virtually unsuitable for retrofitting occupied structures. Additionally, such material processing technologies often present dangerous and costly “cut through” dangers. “Cut through” dangers include instances such as a worker unintentionally cutting an embedded object while drilling through the subject material. For example, a construction worker drilling a hole in an existing concrete wall may accidentally encounter reinforcing steel or rebar, or embedded utilities, such as live electrical conduit and conductors. Such an incident may result in costly damage to tools or the subject material, as well as potentially deadly consequences (e.g., electrocution) for workers. Traditional drilling methods also can include “punch through” dangers of unexpectedly punching through the material drilled and damaging structures or personnel on the opposite side of the material.
- In addition, traditional material processing equipment has been extremely burdensome to operate. Handheld power drilling and hammering devices commonly weigh in excess of fifty pounds and are often required to be held overhead by the operator for extended period of time. Conventional devices also typically produce jarring forces that the operator must absorb while holding the device. Besides the potentially injurious jarring forces, sustained heavy lifting, and “cut through” dangers, the operator and those in the vicinity of the device may be exposed to falling or projectile debris, as well as dust, fumes, vapors, vibration, and noise. This level of noisome activity is unsuitable in general for occupied structures, and is entirely unsuitable for structures used as hospitals, laboratories, and the like, where noise and vibration can be completely unacceptable.
- What continues to be needed but missing from this field of art is a non-disruptive material processing technology that overcomes the drawbacks illustrated above. In certain embodiments described herein, energy waves are directed toward the surface to be processed to overcome some or all of such drawbacks. The energy waves of certain embodiments are electromagnetic waves (e.g., laser light, microwaves), while in other embodiments, they are acoustic waves (e.g., ultrasonic waves). However, in certain embodiments, such cutting units can be as bulky and often are as difficult to maneuver as their mechanical counterparts. The speed at which a laser cuts or drills through concrete can be dependent on the type, size, and concentration of aggregate in the concrete. In addition, lasers can be subject to the same “cut through” dangers as described above, wherein objects hidden within the matrix of the material to be processed can be inadvertently damaged. Lasers can also pose additional dangers of “punch through” with danger to persons or objects in the path of the laser beam. Lasers can also present complexities in removing drilled material from a cut or a drilled hole. In certain embodiments, the laser system would incorporate a remote laser generator communicating with a portable processing head that incorporates numerous non-disruptive and safety features allowing the system to be utilized within or near occupied structures.
- Certain embodiments of the present invention provide fast material processing while addressing many of the shortcomings of prior technologies and allowing for heretofore unavailable benefits (e.g., reduced disruption to activities within the structure). In certain embodiments, the method and apparatus utilize fiber connections between elements such that noisy, bulky, and heavy elements can operate at a significant distance from the actual work area. Certain embodiments are low in both noise and vibration during operation, and effectively remove dust and debris. Certain embodiments include a detection system to reduce the dangers of “cut through” or “punch through.” Certain embodiments enhance worker safety by allowing workers to be located away from the work area during material processing. Certain embodiments are separable into man-portable pieces (e.g., less than 50 pounds) to facilitate transportation to locations in proximity to or within the structure being processed by providing easy and fast portability and set-up.
- Certain embodiments of the present invention provide a method and apparatus for processing fragile structures which may be damaged by conventional processing techniques. For example, using conventional saws for processing concrete grain silos as part of a retrofit or refurbishment process may result in vibrations damaging to other portions of the silo. Using a laser to process the fragile structure can reduce the collateral damage done to the structure during processing. Furthermore, certain embodiments described herein are easily assembled/disassembled, so they can be used in otherwise inaccessible portions of the structures. While embodiments described herein are disclosed in terms of processing man-made structures, in still other embodiments, the present invention can be useful for processing natural formations (e.g., as part of a mining or drilling operation).
- The method and apparatus described herein represent a significant advance in the state of the art. Various embodiments of the apparatus comprise new and novel arrangements of elements and methods that are configured in unique and novel ways and which demonstrate previously unavailable but desirable capabilities. In particular, certain embodiments of the present invention provide a material processing method that is quiet, substantially vibration-free, and less likely to exude dust, debris, or noxious fumes. Additionally, certain embodiments allow a higher rate of material processing than do conventional technologies.
- The detailed description set forth below in connection with the drawings is intended merely as a description of various embodiments of the present invention, and is not intended to represent the only form in which the present invention may be constructed or utilized. The description sets forth illustrated embodiments of the designs, functions, apparatus, and methods of implementing the invention. It is to be understood, however, that the same or equivalent functions and features may be accomplished by different embodiments that are also intended to be encompassed within the spirit and scope of the invention.
-
FIG. 1 schematically illustrates an embodiment of anapparatus 50 for processing a structure having a surface. Theapparatus 50 comprises alaser base unit 300, alaser manipulation system 100, and acontroller 500. Thelaser base unit 300 is adapted to provide laser light to an interaction region and includes alaser generator 310 and alaser head 200 coupled to thelaser generator 310. Thelaser head 200 is adapted to remove the material from the interaction region. Thelaser manipulation system 100 includes ananchoring mechanism 110 adapted to be releasably coupled to the structure and apositioning mechanism 121 coupled to theanchoring mechanism 110 and coupled to thelaser head 200. Thelaser manipulation system 100 is adapted to controllably adjust the position of thelaser head 200 relative to the structure. Thecontroller 500 is electrically coupled to thelaser base unit 300 and thelaser manipulation system 100. Thecontroller 500 is adapted to transmit control signals to thelaser base unit 300 and to thelaser manipulation system 100 in response to user input. - In certain embodiments, the
laser head 200 is releasably coupled to thelaser generator 310 and is releasably coupled to thepositioning mechanism 121. In certain embodiments, thepositioning mechanism 121 is releasably coupled to theanchoring mechanism 110, and thecontroller 500 is releasably coupled to thelaser base unit 300 and thelaser manipulation system 100. Such embodiments can provide anapparatus 50 which can be reversibly assembled and disassembled to facilitate transportation of theapparatus 50 to locations in proximity to or within the structure being processed. - Certain embodiments of the
laser base unit 300 are described below. While thelaser base unit 300 is described below as comprising separate components, other embodiments can include combinations of two or more of these components in an integral unit. - Laser Generator
-
FIG. 2 schematically illustrates alaser base unit 300 compatible with embodiments described herein. In certain embodiments, thelaser base unit 300 comprises alaser generator 310 and acooling subsystem 320. Thelaser generator 310 is coupled to a power source (not shown) which provides electrical power of appropriate voltage, phase, and amperage sufficient to power thelaser generator 310. The power source can also be portable in certain embodiments, and can operate without cooling water, air, or power from the facility at which theapparatus 50 is operating. Exemplary power sources include, but are not limited to, diesel-powered electric generators. - In certain embodiments, the
laser generator 310 preferably comprises an arc-lamp-pumped Nd:YAG laser, but may alternatively comprise a CO2 laser, a diode laser, a diode-pumped Nd:YAG laser, a fiber laser, a disk laser, or other types of laser systems. Thelaser generator 310 can be operated in either a pulsed mode or a continuous-wave mode. Oneexemplary laser generator 310 in accordance with embodiments described herein includes a Trumpf 4006D, 4000-watt, continuous-wave laser available from Trumpf Lasertechnik GmbH of Ditzingen, Germany. In other exemplary embodiments, a Yb-doped fiber laser or an Er-doped fiber laser can be used. Other types of lasers with other power outputs (e.g., 2000-watt) are compatible with embodiments described herein. Depending on the requirements unique to a given application of the method and apparatus described herein, one skilled in the art will be able to select the optimal laser for the purposes at hand. - In certain embodiments, the
laser generator 310 can be located within a shipping container for ease of transport and storage. Thelaser generator 310 generates laser light which is preferably delivered through a glass fiber-optic cable from thelaser generator 310 to the work location. - In certain alternative embodiments, the
laser generator 310 comprises a gas-based CO2 laser which generates laser light by the excitation of CO2 gas. Such lasers provide high power output (e.g., ˜100 W-50 kW) at high efficiencies (e.g., ˜5-13%), and are relatively inexpensive. The laser light generated by such gas-based CO2 lasers is typically delivered by mirrors and by using a system of ducts or arms to deliver the laser light around bends or corners. - In certain alternative embodiments, the
laser generator 310 comprises a diode laser. Such diode lasers are compact compared to gas and Nd:YAG lasers so they can be used in a direct delivery configuration (e.g., in close proximity to the work site). Diode lasers provide high power (e.g., ˜10 W-6 kW) at high power efficiencies (e.g., ˜25-40%). In certain embodiments, the laser light from a diode laser can be delivered via optical fiber, but with some corresponding losses of power. - Embodiments using a Nd:YAG laser can have certain advantages over embodiments with CO2 lasers or diode lasers. There is long industrial experience with Nd:YAG lasers in the materials processing industry and they provide high power (e.g., ˜100 W-6 kW). Additionally, the laser light from a Nd:YAG laser can be delivered by optical fiber with only slight power losses (e.g., ˜12%) through a relatively small and long optical fiber. This permits the staging of the
laser generator 310 and support equipment in locations relatively far (e.g., about 100 meters) from the work area. Maintaining thelaser generator 310 at a distance from the surface being processed allows the remainder of theapparatus 50 to be smaller and more portable. - Arc-lamp-pumped Nd:YAG lasers use an arc lamp to excite a Nd:YAG crystal to generate laser light. Diode-pumped Nd:YAG lasers use diode lasers to excite the Nd:YAG crystal, resulting in an increase in power efficiency (e.g., 10-25%, as compared to less than 5% for arc-lamp-pumped Nd:YAG lasers). This increased efficiency results in the diode-pumped laser having a better beam quality, and requiring a
smaller cooling subsystem 320. An exemplary arc-lamp-pumped Nd:YAG laser is available from Trumpf Lasertechnik GmbH of Ditzingen, Germany. - Nd:YAG and other solid state lasers (e.g., Nd:YLiF4, Ti:Sapphire, Yb:YAG, etc.) compatible with embodiments described herein can be configured and pumped by a number of methods. These methods include, but are not limited to, flash and arc lamps, as well as diode lasers. Various configurations of the solid state media are compatible with embodiments described herein, including, but not limited to, rod, slab, and disk configurations. The advantages of the different configurations and pumping methods will impact various aspects of the
laser generator 310, including, but not limited to, the efficiency, the beam quality, and the operational mode of thelaser generator 310. For example, disk lasers are based on a diode-pumped wafer or “disk” that uses one of its reflective surfaces as a heat sink. In certain embodiments, such a disk laser permits high power output with low thermal impact, and can provide high efficiency (e.g., 20%) and high quality laser beams which can be injected into small diameter fibers. An exemplary diode-laser-pumped Nd:YAG disk laser is available from Trumpf Lasertechnik GmbH of Ditzingen, Germany. - Fiber lasers use a doped (e.g., doped with ytterbium or erbium) fiber to produce a laser beam. The doped fiber can be pumped by other light sources including, but not limited to, arc lamps and diodes. The fiber laser can be coupled into a delivery fiber which carries the laser beam to the interaction location. In certain embodiments, a fiber laser provides an advantageous efficiency of approximately 15% to approximately 20%. Such high efficiencies make the
laser generator 310 more mobile, since they utilize smaller chiller units. In addition, such highefficiency laser generators 310 can be located closer to the processing area. An exemplary fiber laser compatible with embodiments described herein is YLR-4000, 4000-watt, continuous-wave (CW) ytterbium: yttrium-aluminum-garnet (Yb: YAG) fiber laser operating at a near-infrared wavelength of approximately 1070 nanometers, available from IPG Photonics of Oxford, Mass. - Typically, the generation of laser light by the
laser generator 310 creates excess heat which is preferably removed from thelaser generator 310 by thecooling subsystem 320 coupled to thelaser generator 310. The amount of cooling needed is determined by the size and type of laser used, but can be about 190 kW of cooling capacity for a 4-kW Nd:YAG laser. Thecooling subsystem 320 can utilize excess cooling capability at a job site, such as an existing process water or chilled water cooling subsystem. Alternatively, aunitary cooling subsystem 320 dedicated to thelaser generator 310 is preferably used.Unitary cooling subsystems 320 may be air- or liquid-cooled. - In certain embodiments, as schematically illustrated in
FIG. 2 , thecooling subsystem 320 comprises aheat exchanger 322 and awater chiller 324 coupled to thelaser 310 to provide sufficient circulatory cooling water to thelaser generator 310 to remove the excess heat. Theheat exchanger 322 preferably removes a portion of the excess heat from the water, and circulates the water back to thewater chiller 324. Thewater chiller 324 cools the water to a predetermined temperature and returns the cooling water to thelaser generator 310.Exemplary heat exchangers 322 andwater coolers 324 in accordance with embodiments described herein are available from Trumpf Lasertechnik GmbH of Ditzingen, Germany. - Laser Head
- In certain embodiments, the
laser head 200 is coupled to thelaser generator 310 and serves as the interface between theapparatus 50 and the structure being irradiated. As schematically illustrated byFIG. 1 , anenergy conduit 400 couples thelaser head 200 and thelaser generator 310 and facilitates the transmission of energy from thelaser generator 310 to thelaser head 200. In certain embodiments, theenergy conduit 400 comprises an optical fiber which transmits laser light from thelaser generator 310 to thelaser head 200. In other embodiments, theenergy conduit 400 comprises conductors that may include fiber-optic, power, or control wiring cables. Anexemplary energy conduit 400 comprises a 50-meter fiber. In certain embodiments, the surface being irradiated is within the inhabitable structure. As described more fully below, certain embodiments provide a relatively small, compact, and lightweight apparatus which can be transported to various places within the inhabitable structure and can be used within relatively small and enclosed spaces within the inhabitable structure. -
FIG. 3A schematically illustrates alaser head 200 in accordance with embodiments described herein. Thelaser head 200 comprises aconnector 210, at least oneoptical element 220, ahousing 230, and acontainment plenum 240. In certain embodiments, theconnector 210 is coupled to thehousing 230, is optically coupled to thelaser generator 310 via theenergy conduit 400, and is adapted to transmit laser light from thelaser generator 310. Theoptical element 220 can be located within theconnector 210, thehousing 230, or thecontainment plenum 240.FIG. 3A illustrates an embodiment in which theoptical element 220 is within thehousing 230. In embodiments in which theconduit 400 provides laser light to thelaser head 200, the laser light is transmitted through theoptical element 220 prior to impinging on the structure being irradiated. - Laser Head: Extended Configuration
-
FIG. 3B schematically illustrates one configuration of alaser head 200 in accordance with embodiments described herein. Thehousing 230 comprises adistal portion 232, anangle portion 234, and aproximal portion 236. As used herein, the terms “distal” and “proximal” have their standard definitions, referring generally to the position of the portion relative to the interaction region. Theconnector 210 is coupled to thedistal portion 232, which is coupled to theangle portion 234, which is coupled to theproximal portion 236, which is coupled to thecontainment plenum 240. Configurations such as that illustrated byFIG. 3B can be used for drilling and scabbling the surface of the structure (e.g., concrete wall). Various components of thelaser head 200 are available from Laser Mechanisms, Inc. of Farmington Hills, Mich. - In certain embodiments in which the
energy conduit 400 comprises an optical fiber, theconnector 210 receives laser light transmitted from thelaser generator 310 through the optical fiber to thelaser head 200. In certain such embodiments, theconnector 210 comprises alens 212 which collimates the diverging laser light emitted by theconduit 400. Thelens 212 can comprise various materials which are transmissive and will refract the laser light in a desired amount. Such materials include, but are not limited to, borosilicate crown glass (BK7), quartz (SiO2), zinc selenide (ZnSe), and sodium chloride (NaCl). The material of thelens 212 can be selected based on the quality, cost, and stability of the material. Borosilicate crown glass is commonly used for transmissive optics with Nd:YAG lasers, and zinc selenide is commonly used for transmissive optics with CO2 lasers. - The
lens 212 can be mounted in a removable assembly in certain embodiments to facilitate cleaning, maintenance, and replacement of thelens 212. In addition, the mounting of thelens 212 can be adjustable (e.g., using thumbscrews or Allen hex screws) so as to optimize the alignment and focus of the light beam. In certain embodiments, thelens 212 can provide additional modification of the beam profile (e.g., focussing, beam shape). - The collimated laser light of certain embodiments is then transmitted through the
laser head 200 via other optical elements within thelaser head 200. In certain embodiments, thedistal portion 232 comprises a generally straight first tube through which laser light propagates to theangle portion 234, and theproximal portion 236 comprises a generally straight second tube through which the laser light from theangle portion 234 propagates. In certain embodiments, thedistal portion 232 contains alens 233, and theangle portion 234 contains amirror 235 which directs the light through theproximal portion 236 and thecontainment plenum 240 onto the structure. In other embodiments, other devices (e.g., a prism) can be used in theangle portion 234 to direct the light through theproximal portion 236 and thecontainment plenum 240 onto the structure. - The
lens 233 can be mounted in a removable assembly in certain embodiments to facilitate cleaning, maintenance, and replacement of thelens 233. In addition, the mounting of thelens 233 can be adjustable (e.g., using thumbscrews or Allen hex screws) so as to optimize the alignment and focus of the light beam. In certain embodiments, thelens 233 focuses the light received from thelens 212, while in other embodiments, thelens 233 can provide additional modification of the beam profile (e.g., beam shape).Exemplary lenses 233 include, but are not limited to, a 600-mm focal length silica plano-convex lens (e.g., Part No. PLCX-50.8-309.1-UV-1064 available from CV1 Laser Corp. of Albuquerque, N. Mex.). Thelens 233 can comprise various materials which are transmissive and will refract the laser light in a desired amount. Such materials include, but are not limited to, borosilicate crown glass, quartz, zinc selenide, and sodium chloride. Exemplary lens mounting assemblies include, but are not limited to, Part Nos. PLALH0097 and PLFLH0119 available from Laser Mechanisms, Inc. of Farmington Hills, Mich. - In the embodiment schematically illustrated by
FIG. 3B in which thedistal portion 232 is substantially perpendicular to theproximal portion 236, themirror 235 reflects the light through an angle of approximately 90 degrees. Other embodiments are configured to reflect the light through other angles. Themirror 235 can be mounted on a removable assembly in certain embodiments to facilitate cleaning, maintenance, and replacement of themirror 235. In addition, the mounting of themirror 235 can be adjustable (e.g., using thumbscrews or Allen hex screws) so as to optimize the alignment and focus of the light beam. In certain embodiments, themirror 235 can also have a curvature or otherwise be configured so as to focus the light beam or otherwise modify the beam profile (e.g., beam shape).Exemplary mirrors 235 include, but are not limited to, metal mirrors such as copper mirrors (e.g., Part Nos. PLTRG19 and PLTRC0024 from Laser Mechanisms, Inc. of Farmington Hills, Mich.), and gold-coated copper mirrors (e.g., Part No. PLTRC0100 from Laser Mechanisms, Inc.). In other embodiments, dielectric-coated mirrors can be used. -
FIG. 3C schematically illustrates another configuration of alaser head 200 in accordance with embodiments described herein. Thehousing 230 comprises thedistal portion 232, afirst angle portion 234, asecond angle portion 234′, and theproximal portion 236. Theconnector 210 is coupled to thedistal portion 232, which is coupled to thefirst angle portion 234, which is coupled to thesecond angle portion 234′, which is coupled to theproximal portion 236, which is coupled to thecontainment plenum 240. Configurations such as that illustrated byFIG. 3C can be used for cutting the structure in spatially constrained regions (e.g., cutting off portions of a concrete wall near a corner or protrusion). - As described above, in certain embodiments, the
connector 210 comprises alens 212 and thedistal portion 232 is tubular and contains alens 233. Thefirst angle portion 234 of the embodiment illustrated byFIG. 3C contains afirst mirror 235 which directs the light to thesecond angle portion 234′ which contains asecond mirror 235′. Thesecond mirror 235′ directs the light through theproximal portion 236, which can be tubular, and through thecontainment plenum 240 onto the structure. In certain embodiments, as described more fully below with respect to thecontainment plenum 240, the light is transmitted through awindow 243 and anozzle 244 to the interaction region. In certain embodiments, thelaser head 200 comprises thewindow 243 and thenozzle 244, while in other embodiments, thewindow 243 and thenozzle 244 are components of thecontainment plenum 240. - In the embodiment schematically illustrated by
FIG. 3C , thefirst mirror 235 reflects the light through an angle of approximately 90 degrees and thesecond mirror 235′ reflects the light through an angle of approximately −90 degrees such that theproximal portion 236 is substantially parallel to thedistal portion 232. In such embodiments, the light emitted by thecontainment plenum 240 is substantially parallel to, but displaced from, the light propagating through thedistal portion 232. Other embodiments have thefirst mirror 235 and thesecond mirror 235′ configured to reflect the light through other angles. Certain embodiments comprise a straight tubular portion between thefirst angle portion 234 and thesecond angle portion 234′ to provide additional displacement of the light emitted by thecontainment plenum 240 from the light propagating through thedistal portion 232. - In certain embodiments, the coupling between the
distal portion 232 and thefirst angle portion 234 is rotatable. In certain other embodiments, the coupling between thefirst angle portion 234 and thesecond angle portion 234′ is rotatable. These rotatable couplings can comprise swivel joints which can be locked in position by thumbscrews. Such embodiments provide additional flexibility in directing the light emitted by thecontainment plenum 240 in a selected direction. In certain embodiments, the selected direction is non-planar with the light propagating through thedistal portion 232. - As described above, one or both of the
first mirror 235 and thesecond mirror 235′ can be mounted on a removable assembly in certain embodiments to facilitate cleaning, maintenance, and replacement. In addition, the mountings of thefirst mirror 235 and/or thesecond mirror 235′ can be adjustable (e.g., using thumbscrews or Allen hex screws) so as to optimize the alignment and focus of the light beam. In certain embodiments, one or both of thefirst mirror 235 and thesecond mirror 235′ can also have a curvature or otherwise be configured so as to focus the light beam or otherwise modify the beam profile (e.g., beam shape). - In certain embodiments, one or more of the
optical elements 220 within the laser head 200 (e.g.,lens 212,lens 233,mirror 235,mirror 235′) are water-cooled or air-cooled. Cooling water can be supplied by a heat exchanger located near thelaser head 200 and dedicated to providing sufficient water flow to thelaser head 200. In certain such embodiments, the conduits for the cooling water for each of theoptical elements 220 can be connected in series so that the cooling water flows sequentially in proximity to theoptical elements 220. In other embodiments, the conduits are connected in parallel so that separate portions of the cooling water flow in proximity to the variousoptical elements 220. Exemplary heat exchangers include, but are not limited to a Miller Coolmate™ 4, available from Miller Electric Manufacturing Co. of Appleton, Wis. The flow rate of the cooling water is preferably at least approximately 0.5 gallons per minute. - Laser Head: Compact Configuration
- FIGS. 20 and 21A-21C schematically illustrate other configurations of a
laser head 1200 in accordance with embodiments described herein.FIG. 21D illustrates an exemplary compact configuration of alaser head 1200 and ananchoring mechanism 1110 in accordance with embodiments described herein. Certain embodiments of thelaser head 1200 are adapted to be movable and placed in position relative to the surface to be irradiated by a single person. In certain such embodiments, the combination of thelaser head 1200 and certain embodiments of theanchoring mechanism 1110, discussed below, weighs less than fifty pounds. Certain such embodiments are advantageously used to drill holes in concrete up to approximately nine-and-one-half inches in depth. - The embodiment illustrated by
FIG. 20 is generally adapted for drilling holes in the surface to be irradiated, and is generally of smaller size and weight than the embodiments ofFIGS. 3B and 3C , thereby providing an apparatus which is adapted to access more constrained spaces. In addition, the embodiment ofFIG. 20 is generally more simple and more robust than the embodiments ofFIGS. 3B and 3C , thereby providing an apparatus which is adapted to withstand rough handling and non-ideal operating conditions. - The
laser head 1200 in certain embodiments comprises a generallyrectangular housing 1230. The other components of thelaser head 1200 are positioned on thehousing 1230 or within thehousing 1230. Thehousing 1230 of certain embodiments comprises a connection structure (not shown) which is adapted to be releasably coupled to ananchoring mechanism 1110 which, as described further below, is adapted to position thelaser head 1200 relative to the surface to be irradiated. In an exemplary embodiment, thehousing 1230 has a length of approximately 12 inches, a height of approximately 8 inches, and a width of approximately 4 inches. Other shapes and dimensions of thehousing 1230 are compatible with embodiments described herein. - In certain embodiments, the
laser head 1200 further comprises aconnector 1210 which is adapted to be coupled to theconduit 400 carrying laser light from thelaser generator 310 to thelaser head 1200. In certain embodiments, theconnector 1210 comprises a lens (not shown) which collimates the diverging laser light emitted by theconduit 400. In an exemplary embodiment, the lens has a focal length of approximately 23.6 inches (approximately 600 millimeters) and is located in an adjustable lens drawer. As described above in relation to the extended configuration, the lens of various embodiments can comprise various materials, can be removably mounted to thehousing 1230, can be adjustably mounted to thehousing 1230, and can provide additional modification of the beam profile. - In certain embodiments, the
laser head 1200 further comprises afirst mirror 1235 adapted to reflect light from theconnector 1210 through a first non-zero angle, and asecond mirror 1235′ adapted to reflect light from thefirst mirror 1235 through a second non-zero angle to anozzle 1244 which is adapted to be coupled to thecontainment plenum 240. In certain embodiments, as schematically illustrated inFIG. 20 , the first non-zero angle is approximately equal to the negative of the second non-zero angle. Such two-mirror configurations are sometimes called “folded optics” configurations since reflecting the light between the mirrors effectively “folds” a propagation path having a length into a smaller space. Certain embodiments of thelaser head 1200 comprise additional optical components adapted to modify the beam profile of the laser light. - As described above in relation to the extended configuration, at least one of the
first mirror 1235 and thesecond mirror 1235′ is mounted in thehousing 1230 on a removable and adjustable assembly. In addition, at least one of thefirst mirror 1235 and thesecond mirror 1235′ of certain embodiments has a curvature or is otherwise configured to modify the beam profile. At least one of thefirst mirror 1235 and thesecond mirror 1235′ of certain embodiments is cooled by either air or water provided by cooling conduits. For example, in certain embodiments, water flow is provided to thelaser head 1200 at a rate of at least approximately 0.5 gallons per minute. In certain embodiments, the cooling conduits are contained within thehousing 1230, thereby facilitating transport and placement of thelaser head 1200 by making thelaser head 1200 less unwieldy and making thelaser head 1200 more robust. Thelaser head 1200 of certain embodiments further comprises anelectrical connector 1215 which can be coupled to an electrical cord to supply power to thelaser head 1200 and/or to provide sensor signals from thelaser head 1200 to thecontroller 500. In certain embodiments, thelaser head 1200 further comprises one ormore status lights 1217 which provide information regarding the status of thelaser head 1200. - In certain embodiments, as shown in
FIGS. 21C and 21D , thelaser head 1200 comprises alaser head handle 1240 coupled to thehousing 1230. Thelaser head handle 1240 is adapted to facilitate transporting and positioning thelaser head 1200 at a selected location. Other configurations of thelaser head handle 1240 are compatible with other embodiments described herein. Thelaser head 1200 of certain embodiments further comprises acoupler 1250 adapted to releasably couple thelaser head 1200 to theanchoring mechanism 1110. Other configurations of thelaser head 1200 are compatible with embodiments described herein. - In certain embodiments, the compact configuration of the laser head (“compact laser head”) 1200, such as shown in
FIGS. 21A-21D , is advantageously used in certain applications rather than the extended configuration of the laser head (“extended laser head”) 200 as shown inFIGS. 3B and 3C . For example, when drilling holes in the structure, there may be areas in which theextended laser head 200 may not have access due to its length or other constraints (e.g., rigidity of the coupling between theenergy conduit 400 and the connector 210). Thecompact laser head 1200 has a smaller volume, thereby allowing access to smaller areas. - In addition, in certain embodiments, the
compact laser head 1200 is used in conjunction with anenergy conduit 400 comprising a pivotingcollimator head 1250 adapted to provide a rotational coupling between theenergy conduit 400 and theconnector 1210 of thelaser head 1200. In such embodiments, the pivoting collimator head provides additional flexibility by allowing thelaser head 1200 to access smaller areas. The collimator head can be straight such that theenergy conduit 400 points along the same direction in which laser light enters thelaser head 1200, or can have an angle (e.g., 90 degrees) such that theenergy conduit 400 points along a different direction, as illustrated inFIG. 21D . Using collimator heads with different orientations advantageously permits various orientations of theenergy conduit 400 for providing access to constrained areas. Exemplary collimator heads compatible with embodiments described herein are available from Trumpf Lasertechnik GmbH of Ditzingen, Germany. - Furthermore, in certain embodiments, the
compact laser head 1200 also incorporates the various sensors, proximity switches, and flow meters of thelaser head 1200 within thehousing 1230. For example, thelaser head 1200 can comprise one or more sensors which determine one or more of the following: whether thelaser head 1200 is in contact with a surface of the inhabitable structure, whether thelaser head 1200 is coupled to theanchoring mechanism 1110, and whether thelaser generator 310 is on or starting. Such embodiments are generally more simple and more robust than theextended laser head 200, thereby providing an apparatus which is adapted to withstand rough handling and non-ideal operating conditions, and is less likely to be damaged. - Laser Head Lightweight Configuration
-
FIG. 22A schematically illustrates alightweight laser head 2200 with ananchoring mechanism 1110.FIG. 22B illustrates another exemplarylightweight laser head 2200 andanchoring mechanism 1110. As shown inFIG. 22B , thelightweight laser head 2200 comprises aconnector 2210 through which laser light is transmitted into thelaser head 2200. Thelaser head 2200 of certain embodiments further comprises anelectrical connector 2215 which can be coupled to an electrical cord to supply power to thelaser head 2200 and/or to provide sensor signals from thelaser head 2200 to thecontroller 500. In certain embodiments, thelaser head 2200 further comprises one ormore status lights 2217 which provide information regarding the status of thelaser head 2200. In certain embodiments, thelaser head 2200 is coupled to coolinglines 2218 which can provide cooling water to the mirrors, lenses, or other optical elements within thelaser head 2200. -
FIG. 22C illustrates acontainment plenum 240 coupled to thelaser head 2200 ofFIG. 22B . Thecontainment plenum 240 comprises aplenum housing 242 and aresilient interface 246 configured to contact the surface being irradiated. In certain embodiments, thecontainment plenum 240 is removable from and/or adjustable along thelaser head 2200 to facilitate positioning of thelaser head 2200 and thecontainment plenum 240 for laser irradiation of the surface. - In certain embodiments, the
laser head 2200 has a 140-millimeter focal length and is commercially available, e.g., a D35 90-degree focus head with cooling and observation port available from Trumpf Lasertechnik GmbH of Ditzingen, Germany (Catalog No. 35902090). Thelaser head 2200 of certain embodiments is adapted for drilling relatively shallow holes (e.g., up to approximately 65 millimeters in depth) with a diameter of approximately six millimeters. In certain embodiments, the laser head/anchoring mechanism combination weighs less than 10 pounds, while in other embodiments, the combination weighs approximately 8 pounds. In certain embodiments, thelaser head 2200 comprises one or more sensors, proximity switches, or flow meters as described above. - Laser Head: Containment Plenum
- In certain embodiments, the
laser head 200 comprises acontainment plenum 240 coupled to theproximal portion 236 and which interfaces with the structure. In certain embodiments, thecontainment plenum 240 is adapted to confine material (e.g., debris and fumes generated during laser processing) removed from the structure and remove the material from the interaction region. Thecontainment plenum 240 can also be further adapted to reduce noise and light emitted from the interaction region out of the containment plenum 240 (e.g., into the nominal hazard zone (“NHZ”) of the laser). One goal of thecontainment plenum 240 can be to ensure that no laser radiation in excess of the accessible emission limit (“AEL”) or maximum-permissible exposure (“MPE”) limit reaches the eye or skin of any personnel. -
FIG. 4 schematically illustrates a cross-sectional view of acontainment plenum 240 in accordance with embodiments described herein. Thecontainment plenum 240 ofFIG. 4 comprises aplenum housing 242, awindow 243, anozzle 244, aresilient interface 246, anextraction port 248, and acompressed gas inlet 249. Theplenum housing 242 can be coupled to a source of laser light (e.g., theproximal portion 236 of the laser head 200) and can provide structural support for the other components of thecontainment plenum 240. Exemplary materials for theplenum housing 242 include, but are not limited to, metals (e.g., aluminum, steel) which can be in the form of thin flexible sheets, ceramic materials, glass or graphite fibers, and fabric made from glass or graphite fibers. In certain embodiments, theplenum housing 242 is either air-cooled or water-cooled to reduce heating of theplenum housing 242. Coolant conduits for theplenum housing 242 can be coupled in series or in parallel with the coolant conduits for other components of thelaser head 200. - The
window 243 of certain embodiments is positioned upstream of thenozzle 244 and within the propagation path of the laser light from theproximal portion 236 to the structure. As used herein, the terms “downstream” and “upstream” have their ordinary meanings referring to the propagation direction of the laser light and to the direction opposite to the propagation direction of the laser light, respectively. In such embodiments, the light propagating through thecontainment plenum 240 reaches thewindow 243 prior to reaching thenozzle 244. In such embodiments in which the light propagates downstream through thewindow 243, thewindow 243 is substantially transparent to the laser light. Thewindow 243 can be mounted within theplenum housing 242 to transmit the laser light in the downstream direction. Thewindow 243 can have a number of shapes, including, but not limited to, square and circular.Exemplary windows 243 include, but are not limited to, a silica window (e.g., Part No. W2-PW-2037-UV-1064-0 available from CVI Laser Corp. of Albuquerque, N. Mex.). - Dust and/or dirt on the optical elements of the
laser head 200 can absorb an appreciable fraction of the laser light, resulting in nonuniform heating which can damage the optical elements. In certain embodiments, thewindow 243 is mounted within theplenum housing 242 to provide a barrier to the upstream transport of dust, smoke, or other particulate matter generated by the interaction of the laser light and the structure. In this way, thewindow 243 can facilitate protection of the upstream optical elements within the other portions of thelaser head 200. - The
window 243 can be mounted in a removable assembly in certain embodiments to facilitate cleaning, maintenance, and replacement of thewindow 243. In certain embodiments, thewindow 243 focuses the light received from theproximal portion 236, while in other embodiments, thewindow 243 can provide additional modification of the beam profile (e.g., beam shape). In such embodiments, the mounting of thewindow 243 can be adjustable (e.g., using thumbscrews or Allen hex screws) so as to optimize the alignment and focus of the light beam. Exemplary window mounting assemblies include, but are not limited to, Part Nos. PLALH0097 and PLFLH0119 available from Laser Mechanisms, Inc. of Farmington Hills, Mich. In certain embodiments, thewindow 243 is either air-cooled or water-cooled. - The laser light transmitted through the
window 243 is emitted through thenozzle 244 towards the interaction region of the structure. The laser light can be focussed near the opening of thenozzle 244. Exemplary materials for thenozzle 244 include, but are not limited to metals (e.g., copper). In certain embodiments, thenozzle 244 is either air-cooled or water-cooled to reduce heating of thenozzle 244. Coolant conduits for thenozzle 244 can be coupled in series or in parallel with the coolant conduits for other components of thelaser head 200. - The laser light propagating through the
nozzle 244 preferably does not impinge the nozzle 244 (termed “clipping”) to avoid excessively heating and damaging thenozzle 244. Improper alignment of the laser light through thelaser head 200 can cause clipping. The opening of thenozzle 244 can be sufficiently large so that the laser light does not appreciably interact with thenozzle 244. In certain embodiments, thenozzle 244 is approximately 0.3 inches in diameter. - In certain embodiments, the
resilient interface 246 of thecontainment plenum 240 is adapted to contact the structure and to substantially surround the interaction region, thereby facilitating confinement and removal of material from the interaction region. In addition, theresilient interface 246 can facilitate blocking light and/or sound from escaping outside thecontainment plenum 240. Exemplaryresilient interfaces 246 include, but are not limited to, a wire brush or a rubber seal (e.g., a bulb seal). The wire brush comprises a metal material which can withstand exposure to the heat, light, molten materials, and other environmental aspects of the interaction region. The rubber seal comprises a rubber material which can withstand exposure to the heat, light, molten materials, and other environmental aspects of the interaction region. In view of the disclosure herein, persons skilled in the art are able to select appropriate materials for theresilient interface 246 in accordance with embodiments described herein. - In certain embodiments, the
extraction port 248 of thecontainment plenum 240 is adapted to extract an appreciable portion of the material (e.g., gas, vapor, dust, and debris) generated within the interaction region during operation. Theextraction port 248 can be coupled to a vacuum generator (not shown) which creates a vacuum to pull material (e.g., airborne particulates, gases, and vapors) from the interaction region. In this way, theextraction port 248 can provide a pathway for removal of the material from thecontainment plenum 240. - In certain embodiments, the compressed
gas inlet 249 is adapted to provide compressed gas (e.g., air) to thecontainment plenum 240. In certain embodiments, the compressedgas inlet 249 is fluidly coupled to thenozzle 244 which is adapted to direct a compressed gas stream to the interaction region. In certain embodiments, compressed gas flows coaxially with the laser light through thenozzle 244. Thewindow 243 of certain embodiments provides a surface against which the compressed gas exerts pressure. In this way, the compressed gas can flow through thenozzle 244 to the interaction region at a selected pressure and velocity. - The compressed gas flowing from the compressed
gas inlet 249 through thenozzle 244 can be used to deter dust, debris, smoke, and other particulate matter from entering thenozzle 244. In this way, the compressed gas can facilitate protection of thewindow 243 from such particulate matter. In addition, the compressed gas can be directed by thenozzle 244 to the interaction region so as to facilitate removal of material from the interaction region and/or to cool the interaction region. Thenozzle 244 can be used in this manner in embodiments in which the structure includes concrete with a high percentage of Si, so that the resultant glassy slag is sufficiently viscous and more difficult to remove from the interaction region. - In certain embodiments, the compressed air is substantially free of oil, moisture, or other contaminants to avoid contaminating the surface of the
window 243 and potentially damaging thewindow 243 by nonuniform heating. An exemplary source of instrument quality (“IQ”) compressed air is the 300-IQ air compressor available from Ingersoll-Rand Air Solutions Group of Davidson, N.C. The source of compressed air preferably provides air at a sufficient flow rate determined in part by the length of the hose delivering the air, and the number of components using the air and their requirements. - In certain embodiments, the air compressor can be located hundreds of feet away from the
laser head 200. In such embodiments, the source of compressed air can comprise an air dryer to reduce the amount of moisture condensing in the air conduits or hoses between the air compressor and thelaser head 200. An exemplary air dryer in accordance with embodiments described herein is the 400 HSB air dryer available from Zeks Compressed Air Solutions of West Chester, Pa. - In certain embodiments, as schematically illustrated in
FIG. 5 , thelaser head 200 comprises asensor 250 adapted to measure the relative distance between thelaser head 200 and the interaction region.FIG. 5 schematically illustrates an embodiment in which thecontainment plenum 240 comprises thesensor 250, although other locations of thesensor 250 are also compatible with embodiments described herein. As material is removed from the structure, the interaction region extends into the structure. Thesensor 250 then provides a measure of the depth of the interaction region from the surface of the structure. Thesensor 250 can use various technologies to determine this distance, including, but not limited to, acoustic sensors, infrared sensors, tactile sensors, and imaging sensors. In certain embodiments in which laser scabbling or machining is performed, asensor 250 comprising a diode laser and utilizing triangulation could be used to determine the distance between thelaser head 200 and the surface being processed. Such asensor 250 can also provide a measure of the amount of material removed from the surface. - In certain embodiments, the
sensor 250 is coupled to thecontroller 500, and thecontroller 500 is adapted to transmit control signals to thelaser base unit 300 in response to signals from thesensor 250. Thelaser base unit 300 can be adapted to adjust one or more parameters of the laser light in response to the control signals. In this way, the depth information from thesensor 250 can be used in real-time to adjust the focus or other parameters of the laser light. - In other embodiments, the
controller 500 is adapted to transmit control signals to thelaser manipulation system 100 in response to signals from thesensor 250. Thelaser manipulation system 100 is adapted to adjust the relative distance between thelaser head 200 and the interaction region in response to the control signals. In addition, thelaser manipulation system 100 can be adapted to adjust the position of thelaser head 200 along the surface of the structure in response to the control signals. In this way, the depth information from thesensor 250 at a first location can be used in real-time to move the laser light to another location along the surface once a desired depth at the first location is achieved. - In other embodiments, the
sensor 250 is used in conjunction with statistical methods to determine the depth of the interaction region. In such embodiments, thesensor 250 is first used in a measurement phase to develop statistical data which correlates penetration depths with certain processing parameters (e.g., material being processed, light intensity). During the measurement phase, selected processing parameters are systematically varied for processing a test or sample surfaces indicative of the surfaces of the structure to be processed. Thesensor 250 is used in the measurement phase to determine the depth of the interaction region corresponding to these processing parameters. In certain such embodiments, thesensor 250 can be separate from thelaser head 200, and can be used during the processing of the structure or during periods when the processing has been temporarily halted in order to measure the depth of the interaction region.Exemplary sensors 250 compatible with such embodiments include, but are not limited to, calipers or other manual measuring devices which are inserted into the resultant hole to determine the depth of the interaction region. - In certain embodiments, the
controller 500 contains this resulting statistical data regarding the correlation between the processing parameters and the depth of the interaction region. During a subsequent processing phase, the structure is processed, but rather than using thesensor 250 at this time, thecontroller 500 can be adapted to determine the relative distance by accessing the statistical data corresponding to the particular processing parameters being used. Such an approach represents a reliable and cost-effective approach for determining the depth of the interaction region while processing the structure. - In alternative embodiments, the
sensor 250 is adapted to provide a measure of the distance between thelaser head 200 and the surface of the structure. In such embodiments, thesensor 250 can be adapted to provide a fail condition signal to thecontroller 500 upon detection of the relative distance between thelaser head 200 and the structure exceeding a predetermined distance. Such a fail condition may result from theapparatus 50 inadvertently becoming detached from the structure. Thecontroller 500 can be adapted to respond to the fail condition signal by sending appropriate signals to thelaser base unit 300 to halt the transmission of energy between thelaser base unit 300 and thelaser head 200. In certain embodiments, the transmission is preferably halted when thelaser head 200 is further than one centimeter from the surface of the structure. In this way, theapparatus 50 can utilize thesensor 250 to insure that laser light is not emitted unless thecontainment plenum 240 is in contact with the structure. In certain embodiments, thesensor 250 comprises a proximity switch which contacts the surface of the structure while theapparatus 50 is attached to the structure. - In certain embodiments, the
laser manipulation system 100 serves to accurately and repeatedly position thelaser head 200 in relation to the structure so as to provide articulated robotic motion generally parallel to the surface to be processed. To do so, thelaser manipulation system 100 can be releasably affixed to the structure to be processed, and can then accurately move thelaser head 200 in proximity to that surface.FIGS. 6A and 6B schematically illustrate two opposite elevated perspectives of an embodiment in which thelaser manipulation system 100 comprises ananchoring mechanism 110 adapted to be releasably coupled to the structure and apositioning mechanism 121 coupled to theanchoring mechanism 110 and coupled to thelaser head 200. In certain embodiments, thelaser manipulation system 100 can be advantageously disassembled and reassembled for transport, storage, or maintenance. - Anchoring Mechanism
- Certain embodiments of the
laser manipulation system 100 comprise ananchoring mechanism 110 to releasably affix thelaser manipulation system 100 to the structure to be processed. Theanchoring mechanism 110 can be adapted to be releasably coupled to the structure and can comprise one or more attachment interfaces 111. - In certain embodiments, the
anchoring mechanism 110 is releasably coupled to a surface within the inhabitable structure. Certain such embodiments advantageously allow the apparatus to be used to process a surface within the inhabitable structure. In certain embodiments, theanchoring mechanism 110 is releasably coupled to the surface being irradiated by laser light. Certain such embodiments advantageously allow the apparatus to be used in relatively small, enclosed spaces within or external to the inhabitable structure. - In the embodiment schematically illustrated in
FIG. 6B , theanchoring mechanism 110 comprises a pair of attachment interfaces 111. Eachattachment interface 111 comprises at least oneresilient vacuum pad 112, at least oneinterface mounting device 114, at least onevacuum conduit 116, at least one mountingconnector 118, and acoupler 119 adapted to couple theattachment interface 111 of theanchoring mechanism 110 to thepositioning mechanism 121. While the embodiment schematically illustrated inFIGS. 6A and 6B have twovacuum pads 112 for each of the twoattachment interfaces 111, other embodiments utilize any configuration or number of attachment interfaces 111 andvacuum pads 112. - In the embodiment illustrated by
FIG. 7 , twovacuum pads 112 are coupled to theinterface mounting device 114. In certain embodiments, eachvacuum pad 112 comprises a circular rubber pad which forms an effectively air-tight region when placed on the structure. Eachvacuum pad 112 is fluidly coupled to at least one vacuum generator (not shown) via a vacuum conduit 116 (e.g., a flexible hose). The vacuum generator may use fluid power (e.g., compressed air) to generate the vacuum, or it may use an external vacuum source. The vacuum generator draws air out from the air-tight region between thevacuum pad 112 and the structure via thevacuum conduit 116, thereby creating a vacuum within the air-tight region. Atmospheric pressure provides a force which reversibly affixes thevacuum pad 112 to the structure. - The
interface mounting device 114 comprises a rigid metal support upon which is mounted thevacuum pads 112, the mountingconnector 118, and thecoupler 119. In certain embodiments, the mountingconnector 118 can comprise a ground-basedsupport connector 118 a adapted to be releasably attached to a ground-basedsupport system 700, as described more fully below. In other embodiments, the mountingconnector 118 can comprise at least one suspension-basedsupport connector 118 b adapted to be releasably attached to a suspension-basedsupport system 800, as described more fully below. Thecoupler 119 is adapted to releasably couple theinterface mounting device 114 to thepositioning mechanism 121. In certain embodiments, thecoupler 119 comprises at least one protrusion which is connectable to at least one corresponding recess in thepositioning mechanism 121. - In alternative embodiments, the
anchoring mechanism 110 can comprise other technologies for anchoring theapparatus 50 to the structure to be processed. These other technologies include, but are not limited to, a winch, suction devices (e.g., cups, gekkomats, or skirts) affixed to theapparatus 50 or on quasi-tank treads, mobile scaffolding suspended from the structure, and a rigid ladder. These technologies can also be used in combination with one another in certain embodiments of theanchoring mechanism 110. - Positioning Mechanism
- Certain embodiments of the
laser manipulation system 100 comprise apositioning mechanism 121 to accurately move thelaser head 200 while in proximity to the structure to be processed.FIG. 8 schematically illustrates an exploded view of one embodiment of thepositioning mechanism 121 along with the attachment interfaces 111 of theanchoring mechanism 110. Thepositioning mechanism 121 ofFIG. 8 comprises a first-axis position system 130, a second-axis position system 150, aninterface 140, and alaser head receiver 220. The first-axis position system 130 is releasably coupled to the attachment interfaces 111 of theanchoring mechanism 110 by at least onecoupler 132. The interface 140 (comprising afirst piece 140 a and asecond piece 140 b in the embodiment ofFIG. 8 ) releasably couples the second-axis position system 150 to the first-axis position system 130. Thelaser head receiver 220 is releasably coupled to the second-axis position system 150, and is adapted to be releasably coupled to thehousing 230 of thelaser head 200. - In certain embodiments, the first-
axis position system 130 comprises at least onecoupler 132 having a recess which is releasably connectable to at least one corresponding protrusion of thecoupler 119 of theanchoring mechanism 110. Such embodiments are advantageously disassembled and reassembled for transport, storage, or maintenance of thepositioning mechanism 121. Other embodiments can have the first-axis position system 130 fixedly coupled to theanchoring mechanism 110. - In certain embodiments, the first-
axis position system 130 moves thelaser head 200 in a first direction substantially parallel to the surface of the structure. In the embodiment schematically illustrated byFIG. 9 , the first-axis position system 130 further comprises afirst rail 134, afirst drive 136, and afirst stage 138. Thefirst stage 138 is movably coupled to thefirst rail 134 under the influence of thefirst drive 136. Thefirst piece 140 a of theinterface 140 is fixedly coupled to thefirst stage 138 so that thefirst drive 136 can be used to move theinterface 140 along thefirst rail 134. In certain embodiments, the first-axis position system 130 further comprises sensors, limit switches, or other devices which provide information regarding the position of thefirst stage 138 along thefirst rail 134. This information can be provided to thecontroller 500, which is adapted to transmit control signals to thefirst drive 136 or other components of thelaser manipulation system 100 in response to this information. - Exemplary
first drives 136 include, but are not limited to, hydraulic drives, pneumatic drives, electromechanical drives, screw drives, and belt drives.First rails 134,first drives 136, andfirst stages 138 compatible with embodiments described herein are available from Tol-O-Matic, Inc. of Hamel, Minn. Other types and configurations offirst rails 134,first drives 136, andfirst stages 138 are also compatible with embodiments described herein. - In certain embodiments, the second-
axis position system 150 moves thelaser head 200 in a second direction substantially parallel to the surface of the structure. The second direction in certain embodiments is substantially perpendicular to the first direction of the first-axis position system 130. In the embodiment schematically illustrated byFIG. 10 , the second-axis position system 150 comprises asecond rail 152, asecond drive 154, and asecond stage 156. In certain embodiments, the first-axis position system 130 and the second-axis position system 150 provide linear movements of thelaser head 200. In other embodiments, the first-axis position system 130 and the second-axis position system 150 provide circular and axial movements of thelaser head 200, respectively. - In certain embodiments, the
second stage 156 is movably coupled to thesecond rail 152 under the influence of thesecond drive 154. Thelaser head receiver 220 is releasably coupled to thesecond stage 156 so that thesecond drive 154 can be used to move thelaser head receiver 220 along thesecond rail 152. In certain embodiments, the second-axis position system 150 further comprises sensors, limit switches, or other devices which provide information regarding the position of thesecond stage 156 along thesecond rail 152. This information can be provided to thecontroller 500, which is adapted to transmit control signals to thesecond drive 154 or other components of thelaser manipulation system 100 in response to this information. - Exemplary
second drives 154 include, but are not limited to, hydraulic drives, pneumatic drives, electromechanical drives, screw drives, and belt drives.Second rails 152,second drives 154, andsecond stages 156 compatible with embodiments described herein are available from Tol-O-Matic, Inc. of Hamel, Minn. Other types and configurations ofsecond rails 152,second drives 154, andsecond stages 156 are also compatible with embodiments described herein. - In certain embodiments, the
second rail 152 is fixedly coupled to thesecond piece 140 b of theinterface 140. Thesecond piece 140 b can comprise at least one recess which is releasably connectable to at least one corresponding protrusion of thefirst piece 140 a of theinterface 140. Such embodiments are advantageously disassembled and reassembled for transport, storage, or maintenance of thepositioning mechanism 121. In other embodiments, theinterface 140 can be made of a single piece which is releasably coupled to one or both of thefirst stage 138 and thesecond rail 152. Other embodiments are not configured for convenient disassembly (e.g., having aninterface 140 made of a single piece and that is fixedly coupled to both thefirst stage 138 and the second rail 152). - In certain embodiments, the
interface 140 comprises atilt mechanism 144 to adjust the relative orientation between thefirst rail 134 and thesecond rail 152. As schematically illustrated inFIG. 11A , thefirst piece 140 a of theinterface 140 is coupled to thefirst stage 138 on thefirst rail 134, and comprises a pair ofprotuberances 142 adapted to couple with corresponding recesses of thesecond piece 140 b of theinterface 140. Thetilt mechanism 144 comprises afirst plate 145, ahinge 146, asecond plate 147, and a pair of support braces 148. Thefirst plate 145 is fixedly mounted to thefirst stage 138 and is substantially parallel to the surface upon which theanchoring mechanism 110 is mounted. Thesecond plate 147 is pivotally coupled to thefirst plate 145 by thehinge 146, and can be locked in place by the support braces 148. - In
FIG. 11A , thetilt mechanism 144 is configured so that thefirst plate 145 and thesecond plate 147 are substantially parallel to one another. In this configuration, the plane of movement defined by the first direction and the second direction of thelaser head 200 is substantially parallel to the surface upon which theanchoring mechanism 110 is coupled. InFIG. 11B , thetilt mechanism 144 is configured so that thesecond plate 147 is at a non-zero angle (e.g., 90 degrees) relative to thefirst plate 145. In this configuration, the plane of movement defined by the first direction and the second direction of thelaser head 200 is at a non-zero angle relative to the surface upon which theanchoring mechanism 110 is coupled. - In certain embodiments, the
laser head receiver 220 is releasably coupled thehousing 230 of thelaser head 200.FIG. 12 schematically illustrates alaser head receiver 220 compatible with embodiments described herein. Thelaser head receiver 220 is coupled to thesecond stage 156 and comprises areleasable clamp 222 and a third-axis position system 224. Theclamp 222 is adapted to hold thehousing 230 of thelaser head 200. The third-axis position system 224 is adapted to adjust the relative distance between thelaser head 200 and the structure being processed. In certain embodiments, the third-axis position system 224 comprises a screw drive which moves theclamp 222 substantially perpendicularly to thesecond rail 152. In certain embodiments, as schematically illustrated byFIG. 12 , the screw drive is manually actuated by ahandle 226, which can be rotated to move theclamp 222. In other embodiments, the screw drive is automatically controlled by equipment responsive to control signals from thecontroller 500. - Ground-Based Support System
- In certain embodiments, the
apparatus 50 can be utilized with a ground-basedsupport system 700 which is releasably coupled to theapparatus 50. Theinterface mounting devices 114 can each comprise a ground-basedsupport connector 118 a adapted to releasably couple to the ground-basedsupport system 700. The ground-basedsupport system 700 advantageously attaches to various types of external boom systems, such as commercially-available lifting- or positioning-type systems, which can support some of the weight of theapparatus 50, thereby reducing the weight load supported by theanchoring mechanism 110. The ground-basedsupport system 700 can be used to facilitate use of theapparatus 50 on substantially vertical surfaces (e.g., walls) or on substantially horizontal surfaces (e.g., ceilings). - In certain embodiments, the ground-based
support system 700 includes a support structure 710 such as that schematically illustrated inFIG. 13 . The support structure 710 ofFIG. 13 comprises aboom connector 712, arotational mount 714, aspreader member 716, a pair ofprimary posts 718, and a pair ofauxiliary posts 720. Theboom connector 712 is adapted to attach to a selected external boom system. Therotational mount 714 is adapted to be rotatably coupled to theboom connector 712 and fixedly coupled to thespreader member 716 so that theboom connector 712 can be advantageously rotated relative to the support structure 710. - The
primary posts 718 are coupled to thespreader member 716 and are substantially parallel to one another. Each of theprimary posts 718 is adapted to be coupled to one of the ground-basedsupport connectors 118 a of theinterface mounting devices 114. Theprimary posts 718 can each be coupled to thespreader member 716 at various positions so that they are aligned with the ground-basedsupport connectors 118 a. Eachprimary post 718 is also coupled to, and is substantially perpendicular to, anauxiliary post 720. In such embodiments, rather than having theprimary posts 718 coupled to the ground-basedsupport connectors 118 a, theauxiliary posts 720 can be coupled to the ground-basedsupport connectors 118 a, thereby effectively rotating the support structure 710 by 90 degrees relative to theanchoring mechanism 110. Such embodiments advantageously provide adjustability for processing various configurations of structures and to permit alternative configurations best suited for particular applications. - Suspension-Based Support System
- Alternatively, the
apparatus 50 can be utilized with a suspension-basedsupport system 800 which is releasably coupled to theapparatus 50. Theinterface mounting devices 114 can each comprise at least one suspension-basedsupport connector 118 b adapted to releasably couple to the suspension-basedsupport system 800. The suspension-basedsupport system 800 advantageously supports some of the weight of theapparatus 50, thereby reducing the weight load supported by theanchoring mechanism 110. The suspension-basedsupport system 800 can be used to facilitate use of theapparatus 50 on substantially vertical surfaces (e.g., outside walls). - In certain embodiments, as schematically illustrated in
FIG. 14A , the suspension-basedsupport system 800 comprises awinch 810, aprimary cable 812, and a pair ofsecondary cables 814. Thewinch 810 is positioned on the roof or other portion of a structure to be processed. Thewinch 810 is coupled to theprimary cable 812, which is coupled to thesecondary cables 814. Thesecondary cables 814 are each coupled to a suspension-basedsupport connector 118 b of theinterface mounting device 114 of theanchoring mechanism 110.FIG. 14B schematically illustrates one embodiment of the apparatus having the suspension-basedsupport connectors 118 b. Theapparatus 50 can then be lowered or raised by utilizing thewinch 810 to shorten or lengthen the working length of theprimary cable 814. In alternative embodiments, the ground-basedsupport connectors 118 a can be configured to serve also as the suspension-basedsupport connectors 118 b. -
FIGS. 21A-21D schematically illustrateother anchoring mechanisms 1110 in accordance with embodiments described herein. Theanchoring mechanism 1110 comprises aresilient vacuum pad 1112 adapted to be releasably coupled to the structure, acoupler 1114 adapted to be releasably attached to thelaser head 1200, and ahandle 1116. Rather than the above-describedlaser manipulation system 100 which comprises a four-vacuum-pad anchoring mechanism 110 and a multiple-axis positioning mechanism 121, theanchoring mechanism 1110 provides a simplified mechanism to releasably hold thelaser head 1200 ofFIG. 20 at a selected position in relation to the structure being irradiated. - In certain embodiments, the
vacuum pad 1112 comprises a circular rubber membrane (not shown) which forms an effectively air-tight region when placed on the structure. Thevacuum pad 1112 is fluidly coupled to at least one vacuum generator (not shown) via avacuum conduit 1113, shown inFIG. 21D . Exemplary materials for thevacuum conduit 1113 include, but are not limited to, flexible rubber hose. By drawing air out from the air-tight region between the rubber membrane and the structure via the vacuum conduit, the vacuum generator creates a vacuum within the air-tight region. Atmospheric pressure provides a force which reversibly affixes theanchoring mechanism 1110 to the structure. In certain embodiments, thevacuum pad 112 is configured to hold thelaser head 1200 in any orientation against gravitational forces. For example, in the embodiment schematically illustrated byFIG. 21D , theanchoring mechanism 1110 supports thelaser head 1200 to be in contact with a substantially vertical concrete surface. Removal of theanchoring mechanism 1110 from the surface is achieved by allowing air back into the air-tight region between the rubber membrane and the structure.Vacuum pads 1112 compatible with embodiments described herein are available from a variety of sources. Anexemplary vacuum pad 1112 is provided by the 376281-DD-CR-1 Complete Core Rig Stand from Hilti Corporation of Schaan in the Principality of Liechtenstein. - In certain embodiments, the
coupler 1114 comprises a structure which mates with a correspondinglaser head coupler 1250 of thelaser head 1200. For theanchoring mechanism 1110 schematically illustrated byFIG. 21A , thecoupler 1114 comprises at least oneprotrusion 1115 which is attached to thevacuum pad 1112. Thecoupler 1114 is connectable to thelaser head coupler 1250 which comprises at least onecorresponding recess 1116. In other embodiments, thecoupler 1114 comprises a recess and thelaser head coupler 1250 comprises a corresponding protrusion. In still other embodiments, thecoupler 1114 comprises acollar 1117 which is adapted to hold thelaser head 2200, as schematically illustrated byFIG. 22A . - As schematically illustrated by
FIG. 21C , in still other embodiments, theconnector 1114 comprises at least onerod 1118 and thecoupler 1250 of thelaser head 1200 comprises at least onecollar 1119. In the exemplary embodiment ofFIG. 21C , thecoupler 1114 comprises tworods laser head coupler 1250 comprises twocollars collar 1119 is releasably coupled to thecorresponding rod 1118 such that thelaser head 1200 can be adjustably positioned at various locations along the length of therod 1118. In certain such embodiments, thecollar 1119 can be adjustably rotated with respect to therod 1118 to allow thelaser head 1200 to be rotated about therod 1118. For example, in the embodiment schematically illustrated byFIG. 21C , onecollar 1119 a can be detached from itscorresponding rod 1118 a, and the other collar 119 b can be rotated about itscorresponding rod 1118 b. Such embodiments provide the capability to rotate thelaser head 1200 away from its drilling position so that visual inspection can be made of the hole being drilled. Once visual inspection has been made, thelaser head 1200 can then be replaced back into the drilling position by rotating thelaser head 1200 back and recoupling thecollar 1119 a to itscorresponding rod 1118 a. - In certain embodiments, the
handle 1116 is adapted to facilitate transporting and positioning theanchoring mechanism 1110 at a desired location. Other configurations of thehandle 1116 besides that schematically illustrated byFIGS. 21A-21D are compatible with other embodiments described herein. - Such
simplified anchoring mechanisms 1110, as described above, can be used when the apparatus is used to only drill or pierce holes into the structure. In certain such embodiments, theanchoring mechanism 1110 can be releasably affixed to the structure so that thelaser head 1200 is positioned to irradiate the structure to drill a hole at a selected location. To drill a second hole at a second selected location in such embodiments, theanchoring mechanism 1110 is removed from the structure and moved so that thelaser head 1200 is repositioned to irradiate the structure at the second selected location. By simplifying the anchoring mechanism 1110 (as compared to theanchoring mechanism 110 ofFIGS. 6A , 6B, 7, and 8) and avoiding the use of apositioning mechanism 121, such simplified embodiments provide a lighter weight alternative which is movable and positionable by a single person. In addition, such simplified embodiments are more robust than those described in relation toFIGS. 6A , 6B, 7, and 8. - In certain embodiments, the
controller 500 is electrically coupled to thelaser base unit 300 and is adapted to transmit control signals to thelaser base unit 300. In other embodiments, thecontroller 500 is electrically coupled to both thelaser base unit 300 and thelaser manipulation system 100, and is adapted to transmit control signals to both thelaser base unit 300 and thelaser manipulation system 100.FIG. 15 schematically illustrates an embodiment of acontroller 500 in accordance with embodiments described herein. Thecontroller 500 comprises acontrol panel 510, amicroprocessor 520, alaser generator interface 530, apositioning system interface 540, asensor interface 550, and auser interface 560. - In certain embodiments, the
control panel 510 includes a main power supply, main power switch, emergency power off switch, and various electrical connectors adapted to couple to other components of thecontroller 500. Thecontrol panel 510 is adapted to be coupled to an external power source (not shown inFIG. 15 ) and to provide power to various components of theapparatus 50. - In certain embodiments, the
microprocessor 520 can comprise a Programmable Logic Controller microprocessor (PLC). PLCs are rugged, reliable, and easy-to-configure, and exemplary PLCs are available from Rockwell Automation of Milwaukee, Wis., Schneider Electric of Palatine, Ill., and Siemens AG of Munich, Germany. In alternative embodiments, themicroprocessor 520 comprises a personal computer microprocessor, or PC/104 embedded PC modules which provide easy and flexible implementation. Themicroprocessor 520 can be adapted to respond to input signals from the user (via the user interface 560), as well as from various sensors of the apparatus 50 (via the sensor interface 550), by transmitting control signals to the other components of the apparatus 50 (via thelaser generator interface 530 and the positioning system interface 540) to achieve the desired cutting or drilling pattern. - The
microprocessor 520 can be implemented in hardware, software, or a combination of the two. When implemented in a combination of hardware and software, the software can reside on a processor-readable storage medium. In addition, themicroprocessor 520 of certain embodiments comprises memory to hold information used during operation. - In certain embodiments, the
laser generator interface 530 is coupled to thelaser base unit 300 and is adapted to transmit control signals from themicroprocessor 520 to various components of thelaser base unit 300. For example, thelaser generator interface 530 can transmit control signals to thelaser generator 310 to set desired operational parameters, including, but not limited to, laser power output levels and laser pulse profiles and timing. In addition, thelaser generator interface 530 can transmit control signals to thecooling subsystem 320 to set appropriate cooling levels, the source of compressed gas coupled to the compressedgas inlet 249 of thecontainment plenum 240, or to the vacuum generator coupled to theextraction port 248. - In certain embodiments, the
positioning system interface 540 is coupled to thepositioning mechanism 121 of thelaser manipulation system 100 and is compatible with the first-axis position system 130 and second-axis position system 150, as described above. In certain such embodiments, thepositioning system interface 540 comprises servo-drivers for the first-axis position system 130 and the second-axis position system 150. The servo-drivers are preferably responsive to control signals from themicroprocessor 520 to generate driving voltages and currents for thefirst drive 136 and thesecond drive 154. In this way, thecontroller 500 can determine how thelaser head 200 is scanned across the surface of the structure. In certain embodiments, the servo-drivers receive their power from thecontrol panel 510 of thecontroller 500. In embodiments in which thepositioning mechanism 121 further comprises a third-axis position system, thepositioning system interface 540 further comprises an appropriate servo-driver so that thecontroller 500 can determine the relative distance between thelaser head 200 and the structure surface being processed. - In certain embodiments, the
sensor interface 550 is coupled to various sensors (not shown inFIG. 15 ) of theapparatus 50 which provide data upon which operation parameters can be selected or modified. For example, as described above, thelaser head 200 can comprise asensor 250 adapted to measure the relative distance between thelaser head 200 and the interaction region. Thesensor interface 550 of such embodiments receives data from thesensor 250 and provide this data to themicroprocessor 520. Themicroprocessor 520 can then adjust various operational parameters of thelaser base unit 300 and/or thelaser manipulation system 100, as appropriate, in real-time. Other sensors which can be coupled to thecontroller 500 via thesensor interface 550 include, but are not limited to, proximity sensors to confirm that thelaser head 200 is in position relative to the surface being processed, temperature or flow sensors for the various cooling, compressed air, and vacuum systems, and rebar detectors (as described more fully below). - In certain embodiments, the
user interface 560 adapted to provide information regarding theapparatus 50 to the user and to receive user input which is transmitted to themicroprocessor 520. In certain embodiments, theuser interface 560 comprises acontrol pendant 570 which is electrically coupled to themicroprocessor 520. As schematically illustrated inFIG. 16 , in certain embodiments, thecontrol pendant 570 comprises ascreen 572 and a plurality ofbuttons 574. In certain other embodiments, thecontrol pendant 570 comprises a plurality ofbuttons 574 and is separate from ascreen 572. - The
screen 572 can be used to display status information and operational parameter information to the user.Exemplary screens 572 include, but are not limited to, liquid-crystal displays. Thebuttons 574 can be used to allow a user to input data which is used by themicroprocessor 520 to set operational parameters of theapparatus 50. Other embodiments can use other technologies for communicating user input to theapparatus 50, including, but not limited to, keyboard, mouse, touchpad, and potentiometer knobs and/or dials. In certain embodiments, thecontrol pendant 570 is hard-wired to theapparatus 50, while in other embodiments, thecontrol pendant 570 communicates remotely (e.g., wirelessly) with theapparatus 50. - In certain embodiments, the
control pendant 570 further comprises an emergency stop button and a cycle stop button. Upon pressing the emergency stop button, theapparatus 50 immediately ceases all movement and the laser irradiation is immediately halted. Upon pressing the cycle stop button, theapparatus 50 similarly ceases all movement and halts laser irradiation corresponding to the cutting sequence being performed, but the user is then provided with the option to return to the beginning of the cutting sequence or to re-start cutting at the spot where the cutting sequence was stopped. In certain embodiments, thecontrol pendant 570 further comprises a “dead man switch,” which must be manually actuated by the user for theapparatus 50 to perform. Such a switch provides a measure of safety by ensuring that theapparatus 50 is not run without someone actively using thecontrol pendant 570. -
FIGS. 17A-17H illustrate a set of exemplary screen displays of thecontrol pendant 570. The function of each of thebuttons 574 along the left and right sides of thescreen 572 is dependent on the operation mode of theapparatus 50. Each of the screen displays provides information regarding system status along with relevant information regarding the current operation mode. - The “MAIN SCREEN” display of
FIG. 17A comprises a “Machine Status” field, a “System Status” field, and label fields corresponding to the functions of some or all of thebuttons 574 of thecontrol pendant 570. The “Machine Status” field includes a text message which describes what theapparatus 50 is doing and what the user may do next. The “System Status” field includes a box which shows the operational mode of theapparatus 50. In the example illustrated byFIG. 17A , the apparatus is in “maintenance mode.” The “System Status” field also includes a plurality of status boxes which indicate the status of various components of theapparatus 50, including, but not limited to, thevacuum pads 112 of theanchoring system 110, the air or vacuum pressure, the first-axis position system 130, and the second-axis position system 150. The “System Status” field also indicates whether there are any faults sensed with thelaser base unit 300. In certain embodiments, nominal status of a component is shown with the corresponding status box as green. The ready state of theapparatus 50 is illustrated by having all the system status boxes appear as green. If the status of one of these components is outside operational parameters, the corresponding status box is shown as red, and the system interlocks are enabled, preventing operation of theapparatus 50. Upon startup, the system interlocks are enabled and must be cleared prior to operation of theapparatus 50. The text messages of the “Machine Status” field provide information regarding the actions to be performed to place theapparatus 50 within operational parameters and to clear the system interlocks. Upon clearing all the system interlocks, the “Machine Status” field will indicate that theapparatus 50 is ready to be used. - The “SELECT OPERATION SCREEN” display of
FIG. 17B comprises the “Machine Status” field, the “System Status” field, and the label fields corresponding to the functions of some or all of thebuttons 574. The “System Status” field includes information regarding the position of thelaser head 200 along the first-axis position system 130 (referred to as the long axis) and the second-axis position system 150 (referred to as the short axis). Some of thebuttons 574 are configured to enable various operations. For example, fourbuttons 574 are configured to enable four different operations: circle, pierce, straight cut, and surface keying, as illustrated inFIG. 17B . -
FIG. 17C shows a “CIRCLE SETUP/OPERATION SCREEN” display which provides information regarding the circle operation of theapparatus 50 in which thelaser head 200 moves circularly to cut a circular pattern to a desired depth into the surface of the structure to be processed. In certain embodiments, the circle operation can be used for “trepanning,” whereby a solid circular core is cut and removed from the surface, leaving a circular hole. - A “Circle Status” field provides information regarding the status of the circle operation and corresponding instructions to the user. The starting position of the
laser head 200 along the first-axis position system 130 and the second-axis position system 150 are provided in the “System Status” field. A “Circle Parameters” field provides information regarding various parameters associated with the cutting of a circular pattern, including, but not limited to, the number of revolutions around the circular pattern, the diameter, time period that the cutting will be performed, the speed of motion of thelaser head 200 around the circle, and the laser base unit (LBU) program number. In certain embodiments, the LBU program number corresponds to operational parameters of thelaser head 200 including, but not limited to, beam focus and intensity. - In certain embodiments, the various parameters can be changed by touching the parameter on the
screen 572, upon which a numerical keypad will pop up on thescreen 572 so that a new value can be entered. For each parameter, the “set point” value corresponds to the value currently in memory and the last value that was entered. The “status” value corresponds to the current value being selected. Upon saving the new parameter value, the “status” and “set point” values are the same. Pressing the button 574 a labeled “Auto/Dry Run” will initiate the circular movement of thelaser head 200 without activating the laser beam, to ensure the desired motion. Pressing the button 574 b labeled “Cycle Start” will initiate the cutting of the circular pattern, including both the movement of thelaser head 200 and the activation of the laser beam. Pressing the button 574 c labeled “Cycle Stop” will halt or pause the cutting and movement, with the option to re-start the cutting and movement where it was halted. Pressing the button 574 d labeled “Machine Reset” will place theapparatus 50 in a neutral condition. Pressing the button 574 e labeled “Next” upon completion of the cutting will return to the “SELECT OPERATION SCREEN.” -
FIG. 17D shows a “PIERCE SETUP/OPERATION SCREEN” display which provides information regarding the pierce operation of theapparatus 50 in which thelaser head 200 drills a hole to a desired depth into the surface of the structure to be processed. A “Pierce Status” field provides information regarding the status of the pierce operation and corresponding instructions to the user. The starting position of thelaser head 200 along the first-axis position system 130 and the second-axis position system 150 are provided in the “System Status” field. A “Pierce Parameters” field provides information regarding various parameters associated with the drilling of a hole. The laser parameters can include, but are not limited to, the laser power, the laser spot size, and the time period for drilling (each of which can influence the diameter of the resultant hole which is formed in the structure), and the LBU program number. The parameters can be changed as described above. Thebuttons 574 labeled “Auto/Dry Run,” “Cycle Start,” “Cycle Stop,” “Machine Reset,” and “Next” operate as described above. -
FIG. 17E shows a “CUT SETUP/OPERATION SCREEN” display which provides information regarding the straight cutting operation of theapparatus 50 in which thelaser head 200 makes a straight cut to a desired depth in the surface of the structure to be processed. The straight cut is preferably along one of the axes of theapparatus 50. A “Cut Status” field provides information regarding the status of the cut operation and corresponding instructions to the user. The starting position of thelaser head 200 along the first-axis position system 130 and the second-axis position system 150 are provided in the “System Status” field. A “Cut Parameters” field provides information regarding various parameters associated with the cutting, including, but not limited to, the speed of motion of thelaser head 200, the length of the cut to be made, and the LBU program number. The parameters can be changed as described above. The buttons 574 f, 574 g labeled “Long Axis” and “Short Axis” are used to select either the first axis or the second axis respectively as the axis of motion of thelaser head 200. Thebuttons 574 labeled “Auto/Dry Run,” “Cycle Start,” “Cycle Stop,” “Machine Reset,” and “Next” operate as described above. -
FIG. 17F shows a “SURFACE KEYING SETUP/OPERATION SCREEN” display which provides information regarding the surface keying operation of theapparatus 50 in which thelaser head 200 cuts an indentation or key into the surface of the structure to be processed. The surface keying operation includes scanning the laser beam across the surface to create an indentation or “key” in the surface with a desired depth and with a generally rectangular area. In certain embodiments, the surface keying operation can be used to perform “scabbling” of the surface, whereby the surface is roughened by interaction with the laser beam across an area (e.g., rectangular). - A “Surface Keying Status” field provides information regarding the status of the surface keying operation and corresponding instructions to the user. The starting position of the
laser head 200 along the first-axis position system 130 and the second-axis position system 150 are provided in the “System Status” field. A “Surface Keying Parameters” field provides information regarding various parameters associated with the cutting, including, but not limited to, the speed of motion of thelaser head 200, the length of the key to be made along the first axis and along the second axis, the offset length that theapparatus 50 will increment between movement along the first axis and the second axis, and the LBU program number. The parameters can be changed as described above. The buttons 574 f, 574 g labeled “Long Axis” and “Short Axis” are used to select either the first axis or the second axis respectively as the axis of motion of thelaser head 200. Thebuttons 574 labeled “Auto/Dry Run,” “Cycle Start,” “Cycle Stop,” “Machine Reset,” and “Next” operate as described above. -
FIG. 17G shows a “FAULT SCREEN” display which provides information regarding detected operation faults. A fault occurs when a sensor (e.g., flowmeters, temperature sensors, safety switches, emergencies stops) of the monitored systems detects a non-operational condition, and can occur while theapparatus 50 is any of the operational modes and while any of the screens are being displayed. When a fault occurs, a scrolling message indicating the fault is preferably provided at the bottom of the current screen being displayed. In addition, the “Machine Status” field will indicate to the user to clear the faults. The “FAULT SCREEN” can be accessed from any of the other screens by pressing anappropriate button 574. As illustrated inFIG. 17G , in certain embodiments, the “FAULT SCREEN” displays the detected faults in a table with the relevant data, including, but not limited to, the date and the type of fault. To prepare theapparatus 50 for operation, the detected faults are preferably cleared by the user. After clearing the detected faults, the user can press an appropriate button 574 (e.g., “Acknowledge All”) to acknowledge the faults. If the faults are not cleared, the user can press an appropriate button 574 (e.g., “Machine Reset”) to return to the screen being displayed when the fault occurred. Pressing the “Machine Reset”button 574 again will return the user to the “MAIN SCREEN” from where theapparatus 50 can be reset. -
FIG. 17H shows a “MAINTENANCE SCREEN” display which provides information regarding theapparatus 50. The maintenance mode can be accessed from the “MAIN SCREEN” display by pressing anappropriate button 574. In the maintenance mode, the system interlocks are bypassed, therefore the user preferably practices particular care to avoid damaging theapparatus 50 or people or materials in proximity to theapparatus 50. The “MAINTENANCE SCREEN” can display an appropriate warning to the user. - The maintenance mode provides an opportunity for the user to check the operation of various components of the
apparatus 50 independent of the fault status of theapparatus 50. For example, by pressingappropriate buttons 574 in the maintenance mode, the vacuum system can be turned on and off, the compressed air can be turned on and off via a solenoid valve, and thefirst drive 136 andsecond drive 154 can be turned on and off. In addition, the default jog speed of the first axis and second axis can be changed by pressing thescreen 572 to pop up a numerical keypad display, as described above. - The “System Status” field also includes a plurality of status boxes which indicate the status of various components of the
apparatus 50, including, but not limited to, thevacuum pads 112 of theanchoring system 110, the air or vacuum pressure, the first-axis position system 130, and the second-axis position system 150. The “System Status” field also indicates whether there are any faults sensed with thelaser base unit 300. In certain embodiments, nominal status of a component is shown with the corresponding status box as green. The ready state of theapparatus 50 is illustrated by having all the system status boxes appear as green. If the status of one of these components is outside operational parameters, the corresponding status box is shown as red. - The “MAINTENANCE SCREEN” can also provide the capability to move the
laser head 200 along the first axis and second axis, as desired. A set of threebuttons 574 are configured to move thelaser head 200 along the first axis to a home position, in a forward direction, or in a backward direction, respectively. Similarly, another set of threebuttons 574 are configured for similar movement of thelaser head 200 along the second axis. The label field for these sets of buttons can include information regarding the position of thelaser head 200 along these two axes. - Detector
- In certain embodiments, the
controller 500 is coupled to adetector 600 adapted to detect embedded material in the structure while processing the structure, and to transmit detection signals to thecontroller 500. In certain embodiments, thecontroller 500 is adapted to avoid substantially damaging the embedded material by transmitting appropriate control signals to thelaser base unit 300 or to both thelaser base unit 300 and thelaser manipulation system 100. In certain embodiments, thedetector 600 is adapted to utilize light emitted by the interaction region during processing to detect embedded material. - Various technologies for detecting embedded material are compatible with embodiments of the present invention. Spectral analysis of the light emitted by the interaction region during processing can provide information regarding the chemical constituents of the material in the interaction region. By analyzing the wavelength and/or the intensity of the light, it is possible to determine the composition of the material being heated and its temperature. Using spectroscopic information, the detection of embedded materials in certain embodiments relies on monitoring changes in the light spectrum during processing. With the differences in composition of embedded materials, by way of example and not limitation, such as rebar (e.g., steel) embedded in concrete, variations in the melting and boiling temperatures for the diverse materials will produce noticeable changes in the amount of light, and/or the wavelength of the light when the laser light impinges and heats the embedded material.
-
FIG. 18A schematically illustrates anexemplary detector 600 compatible with embodiments described herein. Thedetector 600 comprises acollimating lens 610, anoptical fiber 620, and aspectrometer 630. Thespectrometer 630 of certain embodiments comprises aninput slit 631, anoptical grating 632, acollection lens 633, and alight sensor 634. Thecollimating lens 610 is positioned to receive light emitted from the interaction region, and to direct the light onto theoptical fiber 620. Theoptical fiber 620 then delivers the light to thespectrometer 630, and the light is transmitted through the input slit 631 to theoptical grating 632 of thespectrometer 630. Theoptical grating 632 separates the light into a spectrum of wavelengths. The separated light having a selected range of wavelengths can then be directed through thecollection lens 633 onto thelight sensor 634 which generates a signal corresponding to the intensity of the light in the range of wavelengths. - In certain embodiments, at least a portion of the
detector 600 is mounted onto thelaser head 200. In embodiments in which thecollimating lens 610 is part of thelaser head 200, thecollimating lens 610 can be positioned close to the axis of the emitted laser light so as to receive light from the interaction region. In such embodiments, thecollimating lens 610 can be behind thenozzle 244 and protected by the compressed air from thecompressed air inlet 249, as is thewindow 243. In certain embodiments, thecollimating lens 610 is coaxial with the laser beam, while in other embodiments, thecollimating lens 610 is located off-axis. Exemplarycollimating lenses 610 include, but are not limited to, UV-74 from Ocean Optics of Dunedin, Fla. - In certain embodiments, the
optical fiber 620 comprises a material selected to provide sufficiently low attenuation of the light intensity transmitted from thelaser head 200 to thespectrometer 630. Exemplary materials for theoptical fiber 620 include, but are not limited to, silica and fused silica. In certain embodiments, theoptical fiber 620 comprises a pure fused silica core, a doped fused silica cladding, and a polyimide buffer coating. In addition, theoptical fiber 620 of certain embodiments is protected by an outer jacket (e.g., Teflon®, Tefzel®, Kevlar®, and combinations thereof) and a stainless steel sheath. In addition, theoptical fiber 620 of certain embodiments is connectable to thelaser head 200 using a right-angle fiber mount. Other types ofoptical fibers 620 and mounting configurations are compatible with embodiments described herein. Exemplaryoptical fibers 620 include, but are not limited to, P400-2-UV/VIS from Ocean Optics of Dunedin, Fla. - In certain embodiments, the
spectrometer 630 comprises an adjustable input slit 631. The input slit 631 of certain embodiments has a height of approximately 1 millimeter and a width in a range between approximately 5 microns and approximately 200 microns. The input slit 631 determines the amount of light entering thespectrometer 630. The width of the input slit 631 affects the resolution of thelight sensor 634. For example, in certain embodiments, an input slit width of approximately 5 microns corresponds to a resolution of approximately 3 pixels, while an input slit width of approximately 200 microns corresponds to a resolution of approximately 24 pixels. The width of the input slit 631 is advantageously selected to provide sufficient light transmittance as well as sufficient resolution. - The
optical grating 632 of certain embodiments receives light from the input slit 631 and diffracts the various wavelength components of the light by corresponding angles dependent on the wavelength of the light. In this way, theoptical grating 632 separates the various wavelength components of the light. In certain embodiments, the angle between theoptical grating 632 and the light from the input slit 631 is scanned (e.g., by moving the optical grating 632), thereby scanning the wavelength components which reach thelight sensor 634.Exemplary spectrometers 630 utilizing anoptical grating 632 include, but are not limited to, USB2000(VIS/UV) from Ocean Optics of Dunedin, Fla. - In certain embodiments, the
collection lens 633 of thespectrometer 630 is adapted to increase the light reception efficiency of thelight sensor 634. In certain embodiments, thecollection lens 633 comprises a cylindrical lens affixed onto thelight sensor 634. Such embodiments of thecollection lens 633 are advantageously useful with large diameter entrance apertures (limited by the width of the input slit 631 or the size of the optical fiber 620) and with low-light-level applications. In addition, in certain embodiments, thecollection lens 633 improves the efficiency of thespectrometer 630 by reducing the amount of stray light which reaches thelight sensor 634.Other spectrometers 630 with other configurations of the input slit 631, theoptical grating 632, and thecollection lens 633 are compatible with embodiments described herein. - In certain embodiments, the
detection system 600 comprises acomputer system 640 coupled to thespectrometer 630, as schematically illustrated byFIG. 18B . Thecomputer system 640 is adapted to analyze the resulting spectroscopic data. Thecomputer system 640 of certain embodiments comprises amicroprocessor 641, amemory subsystem 642, and adisplay 643. To provide more robustness to thecomputer system 640, themicroprocessor 641 and thememory subsystem 642 can be mounted within a National Electrical Manufacturers Association (NEMA)-ratedenclosure 644 with input and output power and signal connections on one or more side panels of the enclosure for easy access. In certain embodiments, thecomputer system 640 is powered by 110 V from a wall outlet, while in certain embodiments, thecomputer system 630 further comprises a battery backup power supply (not shown) to ensure functionality in the event of power loss. - In certain embodiments, the
microprocessor 641 comprises a Pentium-200 microprocessor chip, while in other embodiments, themicroprocessor 641 comprises a Pentium-III 850-MHz microprocessor chip. In certain embodiments, thememory subsystem 642 comprises a hard disk drive. Other types ofmicroprocessors 641 andmemory subsystems 642 are compatible with embodiments described herein. - In certain embodiments, the
display 643 comprises a thin-film-transistor (TFT) touch screen display. Besides being used to display spectroscopic results to a user, such a touch screen display can be used to provide user input to thedetector 600 to modify various operation parameters. - The
spectrometer 630 can monitor specific wavelengths that are associated with various embedded materials in the structure. In certain embodiments, thespectrometer 630 can monitor the relative intensity of the light at, or in spectral regions in proximity to, these wavelengths. Additionally, at least one neutral density filter may be employed to decrease the light reaching thespectrometer 630 to improve spectral analysis performance. - In certain embodiments, the
spectrometer 630 monitors the intensity at a specific wavelength and the intensities on both sides of this wavelength. Thespectrometer 630 of certain embodiments also monitors the reduction of the intensities resulting from the increased depth of the hole being drilled.FIG. 19 shows an exemplary graph of the light spectrum detected upon irradiating concrete with laser light and the light spectrum detected upon irradiating an embedded rebar. The spectrum from concrete shows an emission peak at a wavelength of approximately 592 nanometers. The spectrum from rebar does not have this emission peak, but instead shows an absorption dip at approximately the same wavelength. Thus, the emission spectrum at about 592 nanometers can be used to provide a real-time indication of whether an embedded rebar is being cut by the laser light. For example, in certain embodiments in which thedetector 600 assumes that either a valley or a peak exists in the spectrum at 592 nanometers, by sampling the emission spectrum at about 588.5 nanometers, 592 nanometers, and 593 nanometers, and calculating the ratio: (2×I592)/(I593+I588.5), thedetector 600 can determine whether the emission spectrum has a dip corresponding to concrete or a peak corresponding to embedded rebar. Other spectroscopic data can be used in other embodiments. - In certain embodiments, the
detector 600 examines a spectral region defined by an upper cutoff wavelength (e.g., 582 nanometers) and a lower cutoff wavelength (e.g., 600 nanometers) and determines a spectral ratio R characteristic of the detection or non-detection of embedded rebar.FIG. 23 is a flowchart of anexemplary method 2500 for determining the spectral ratio R in accordance with embodiments described herein. Themethod 2500 does not address changes in the light from the interaction region as the hole becomes deeper. - In certain embodiments, the
method 2500 comprises anoperational block 2510 in which the data within the spectral region is compared to a selected amplitude range. If any of the data fall outside the amplitude range, the spectrum is deemed to correspond to non-detection of embedded rebar. - In certain embodiments, the
method 2500 further comprises analyzing the data of the spectral region to determine the existence of a valley and two peaks. In certain embodiments, this analysis comprises determining whether the data of the spectral region comprises a valley in anoperational block 2520. If a valley is determined to exist, then a valley value V is calculated in anoperational block 2530 and the spectral region is analyzed to determine whether the data of the spectral region comprises two peaks in anoperational block 2540. In certain embodiments, the valley value V corresponds to the amplitude of the data at the valley. In certain other embodiments, calculating the valley value V comprises determining a minimum value of the data in a first portion of the spectral region. In certain embodiments, the first portion of the spectral region corresponds to a range of wavelengths between approximately 588 nanometers and approximately 594 nanometers. - If the data of the spectral region is determined to contain two peaks, then a peak value P is calculated in the
operational block 2550 and the spectral ratio R is calculated by dividing the valley value V by the peak value P in anoperational block 2560. In certain embodiments, the peak value P is calculated by averaging the values of the two peaks. If the spectral ratio R is greater than or equal to one, then the spectrum is deemed to correspond to detection of embedded rebar. - If the data of the spectral region is determined to not contain two peaks, then in certain embodiments, a first maximum value M1 is calculated from the data of a second portion of the spectral region in an
operational block 2570 and a second maximum value M2 is calculated from the data of a third portion of the spectral region in anoperational block 2580. In certain embodiments, the second portion of the spectral region corresponds to a range of wavelengths from approximately 582 nanometers to approximately 588 nanometers, and the third portion of the spectral region corresponds to a range of wavelengths from approximately 594 nanometers to approximately 600 nanometers. In certain embodiments, the first maximum value M1 corresponds to a maximum data amplitude in the second portion of the spectral region and the second maximum value M2 corresponds to a maximum data amplitude in the third portion of the spectral region. In certain embodiments, the peak value P is calculated by averaging the first maximum value M1 and the second maximum value M2 in anoperational block 2590. In such embodiments, the spectral ratio R is calculated by dividing the valley value V by the peak value P in anoperational block 2600. If the spectral ratio R is greater than or equal to one, then the spectrum is deemed to correspond to detection of embedded rebar. - If a valley is determined to not exist in the data of the spectral region, a peak value P′ is calculated in an
operational block 2610 and the peak value P′ is compared to a predetermined threshold value T in anoperational block 2620. In certain embodiments in which the spectral region comprises one or more peaks, calculating the peak value P′ comprises averaging the intensity values of any peaks detected in the spectral region. If the peak value P′ is less than the threshold value T, then the spectrum is deemed to correspond to detection of embedded rebar. - An alternative technology for detecting embedded materials uses high speed shutter monitoring. This approach utilizes advances in Coupled Capacitance Discharge (CCD) camera systems to monitor discrete changes in the interactions between the material to be processed and the laser light. Newer CCD cameras have systems that can decrease the time the shutter is open to about 0.0001 second. At this speed, it is possible to see many features of the interaction between the laser light and the material being processed. Additionally, neutral density filters may be employed to decrease the glare observed from the incandescent interaction of the laser light and the material to be processed and to better image the interaction region.
- Numerous alterations, modifications, and variations of the various embodiments disclosed herein will be apparent to those skilled in the art and they are all anticipated and contemplated to be within the spirit and scope of the instant invention. For example, although specific embodiments have been described in detail, those with skill in the art will understand that the preceding embodiments and variations can be modified to incorporate various types of substitute and/or additional or alternative materials, relative arrangement of elements, and dimensional configurations. Accordingly, even though only few variations of the present invention are described herein, it is to be understood that the practice of such additional modifications and variations and the equivalents thereof, are within the spirit and scope of the invention as defined in the following claims.
- The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the claims below are intended to include any structure, material, or acts for performing the functions in combination with other claimed elements as specifically claimed.
Claims (20)
1. An apparatus for processing a surface of an inhabitable structure, the apparatus comprising:
a head adapted to provide energy waves to an interaction region, the energy waves removing material from the structure, the head comprising a containment plenum which confines and removes material from the interaction region, the containment plenum comprising an interface portion which contacts the structure and which substantially surrounds the interaction region, thereby facilitating confinement and removal of material from the interaction region and providing reduced disruption to activities within the structure; and
an anchoring mechanism releasably coupled to the structure and releasably coupled to the head.
2. The apparatus of claim 1 , wherein the head comprises optical elements adapted to receive laser light from an energy wave generator and to direct laser light to the interaction region.
3. The apparatus of claim 1 , wherein the containment plenum is further adapted to reduce noise and light emitted out of the containment plenum from the interaction region.
4. The apparatus of claim 1 , wherein the containment plenum comprises an extraction port which provides a pathway for removal of the material from the containment plenum.
5. The apparatus of claim 1 , wherein the interface portion comprises a seal.
6. The apparatus of claim 1 , wherein the head comprises one or more sensors which senses one or more of the following: whether the head is in contact with a surface of the inhabitable structure, and whether the head is coupled to the anchoring mechanism.
7. The apparatus of claim 1 , wherein the head comprises a nozzle fluidly coupled to a compressed gas supply, the nozzle adapted to direct a compressed gas stream to the interaction region.
8. The apparatus of claim 1 , wherein the anchoring mechanism comprises one or more resilient vacuum pads coupled to at least one vacuum generator.
9. The apparatus of claim 1 , further comprising a detector coupled to a controller and adapted to detect embedded material in the structure while processing the structure, and to transmit detection signals to the controller, the controller adapted to avoid substantially damaging the embedded material by transmitting appropriate control signals to the head.
10. The apparatus of claim 9 , wherein the detector is adapted to detect embedded material by using light emitted by the interaction region during processing.
11. The apparatus of claim 1 , wherein the anchoring mechanism is releasably coupled to a surface within the inhabitable structure.
12. The apparatus of claim 1 , wherein the anchoring mechanism is releasably coupled to the surface being irradiated by the head.
13. The apparatus of claim 1 , wherein the surface being irradiated is within the inhabitable structure.
14. An apparatus for processing a surface of an inhabitable structure with reduced disruption to activities within the structure, the apparatus comprising:
means for providing energy waves to an interaction region of the structure to remove material from the structure;
means for confining the material and removing the material from the interaction region, said confining means comprising an interface portion which substantially surrounds the interaction region; and
means for anchoring said apparatus, said anchoring means being releasably coupled to the structure and releasably coupled to said means for providing the energy waves.
15. The apparatus of claim 14 , wherein the means for providing the energy waves to the interaction region comprises laser optical elements adapted to receive laser light and to direct said laser light to the interaction region.
16. The apparatus of claim 14 , wherein the means for anchoring said apparatus comprises one or more resilient vacuum pads coupled to at least one vacuum generator.
17. The apparatus of claim 14 , wherein the means for anchoring said apparatus is releasably coupled to a surface within the inhabitable structure.
18. A method of processing a surface of an inhabitable structure with reduced disruption to activities within the structure, the method comprising:
releasably coupling an anchoring mechanism to the structure and to a head;
providing energy waves from the head to the surface, the energy waves interacting with the structure in an interaction region to remove material from the structure; and
confining the material and removing the material from the interaction region.
19. The method of claim 18 , wherein the confining and removing of material comprises providing a containment plenum which contacts the structure and which substantially surrounds the interaction region.
20. The method of claim 18 , further comprising reversibly assembling and disassembling the anchoring mechanism with the head to facilitate transportation of the anchoring mechanism and the head to a location in proximity to or within the structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/116,162 US20080240178A1 (en) | 2003-03-18 | 2008-05-06 | Method and apparatus for material processing |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US45604303P | 2003-03-18 | 2003-03-18 | |
US47105703P | 2003-05-16 | 2003-05-16 | |
US49646003P | 2003-08-20 | 2003-08-20 | |
US10/690,983 US7060932B2 (en) | 2003-03-18 | 2003-10-22 | Method and apparatus for material processing |
US10/803,272 US7180920B2 (en) | 2003-03-18 | 2004-03-18 | Method and apparatus for material processing |
US60181604P | 2004-08-16 | 2004-08-16 | |
US11/205,290 US7379483B2 (en) | 2003-03-18 | 2005-08-16 | Method and apparatus for material processing |
US12/116,162 US20080240178A1 (en) | 2003-03-18 | 2008-05-06 | Method and apparatus for material processing |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/205,290 Continuation US7379483B2 (en) | 2003-03-18 | 2005-08-16 | Method and apparatus for material processing |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080240178A1 true US20080240178A1 (en) | 2008-10-02 |
Family
ID=46322452
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/205,290 Expired - Fee Related US7379483B2 (en) | 2003-03-18 | 2005-08-16 | Method and apparatus for material processing |
US12/116,162 Abandoned US20080240178A1 (en) | 2003-03-18 | 2008-05-06 | Method and apparatus for material processing |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/205,290 Expired - Fee Related US7379483B2 (en) | 2003-03-18 | 2005-08-16 | Method and apparatus for material processing |
Country Status (1)
Country | Link |
---|---|
US (2) | US7379483B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060144834A1 (en) * | 2003-03-18 | 2006-07-06 | Denney Paul E | Containment plenum for laser irradiation and removal of material from a surface of a structure |
US20060196861A1 (en) * | 2003-03-18 | 2006-09-07 | Denney Paul E | Manipulation apparatus for system that removes material from a surface of a structure |
US20070189347A1 (en) * | 2003-03-18 | 2007-08-16 | Denney Paul E | Method and apparatus for material processing |
US20090021731A1 (en) * | 2003-03-18 | 2009-01-22 | Denney Paul E | Method and apparatus for detecting embedded material within an interaction region of structure |
US7971368B2 (en) * | 2005-07-26 | 2011-07-05 | Mitsubishi Electric Corporation | Hand drying apparatus |
US10092979B2 (en) * | 2015-12-25 | 2018-10-09 | Gigaphoton Inc. | Laser irradiation apparatus |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7379483B2 (en) * | 2003-03-18 | 2008-05-27 | Loma Linda University Medical Center | Method and apparatus for material processing |
US20080234669A1 (en) * | 2007-03-19 | 2008-09-25 | Kauvar Arielle N B | Method and device for treating skin by superficial coagulation |
US20080282573A1 (en) * | 2007-05-14 | 2008-11-20 | William Hein | Tilting microwave dryer and heater |
US8153925B2 (en) * | 2007-12-19 | 2012-04-10 | Illinois Tool Works Inc. | Heat exchanger and moisture removal for a plasma cutting system |
EP2409808A1 (en) * | 2010-07-22 | 2012-01-25 | Bystronic Laser AG | Laser processing machine |
EP2663419A2 (en) * | 2011-01-13 | 2013-11-20 | Tamarack Scientific Co. Inc. | Laser removal of conductive seed layers |
US9289852B2 (en) | 2011-01-27 | 2016-03-22 | Bystronic Laser Ag | Laser processing machine, laser cutting machine, and method for adjusting a focused laser beam |
WO2012101533A1 (en) | 2011-01-27 | 2012-08-02 | Bystronic Laser Ag | Laser processing machine, in particular laser cutting machine, and method for centering a laser beam, in particular a focused laser beam |
JP6275833B2 (en) | 2013-09-26 | 2018-02-07 | コンパニー ゼネラール デ エタブリッスマン ミシュラン | Correction of local tire surface anomalies |
EP2883647B1 (en) | 2013-12-12 | 2019-05-29 | Bystronic Laser AG | Method for configuring a laser machining device |
US10335899B2 (en) * | 2014-10-31 | 2019-07-02 | Prima Power Laserdyne | Cross jet laser welding nozzle |
CN111054920B (en) * | 2014-11-14 | 2022-09-16 | 株式会社尼康 | Molding device and molding method |
CN117484865A (en) | 2014-11-14 | 2024-02-02 | 株式会社 尼康 | Molding apparatus and molding method |
GB2536434A (en) * | 2015-03-16 | 2016-09-21 | Sony Corp | A cutting device, cutting equipment and method |
US10903107B2 (en) * | 2017-07-11 | 2021-01-26 | Brooks Automation, Inc. | Semiconductor process transport apparatus comprising an adapter pendant |
EP3492210B1 (en) * | 2017-12-04 | 2023-08-30 | Synova S.A. | Apparatus for 3d shaping of a workpiece by a liquid jet guided laser beam |
US20230085851A1 (en) * | 2020-02-20 | 2023-03-23 | Agc Glass Europe | Apparatus to be detachably fixed on a mounted glazing panel and associated method |
Citations (74)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3369101A (en) * | 1964-04-30 | 1968-02-13 | United Aircraft Corp | Laser micro-processer |
US3569660A (en) * | 1968-07-29 | 1971-03-09 | Nat Res Dev | Laser cutting apparatus |
US3676673A (en) * | 1969-08-18 | 1972-07-11 | Ppg Industries Inc | Apparatus for irradiation in a controlled atmosphere |
US3871485A (en) * | 1973-11-02 | 1975-03-18 | Sun Oil Co Pennsylvania | Laser beam drill |
US4060327A (en) * | 1976-09-13 | 1977-11-29 | International Business Machines Corporation | Wide band grating spectrometer |
US4137778A (en) * | 1977-03-05 | 1979-02-06 | Krautkramer-Branson, Incorporated | Method and apparatus for producing ultrasonic waves in light absorbing surfaces of workpieces |
US4151393A (en) * | 1978-02-13 | 1979-04-24 | The United States Of America As Represented By The Secretary Of The Navy | Laser pile cutter |
US4227582A (en) * | 1979-10-12 | 1980-10-14 | Price Ernest H | Well perforating apparatus and method |
US4568814A (en) * | 1983-04-18 | 1986-02-04 | Agency Of Industrial Science & Technology | Method and apparatus for cutting concrete by use of laser |
US4578554A (en) * | 1984-04-30 | 1986-03-25 | Teledyne, Inc. | Laser welding apparatus |
US4618758A (en) * | 1984-05-22 | 1986-10-21 | Prima Industrie S.P.A. | Focusing head for a laser-beam cutting machine |
US4642445A (en) * | 1985-06-28 | 1987-02-10 | Westinghouse Electric Corp. | Shielding apparatus for metal processing operations |
US4675501A (en) * | 1983-10-29 | 1987-06-23 | Trumpf Gmbh & Co. | Laser apparatus with novel beam aligning means and method of laser processing of workpieces using same |
US4727628A (en) * | 1985-10-24 | 1988-03-01 | Rudholm & Co. I Boras Ab | Strap buckle with self-locking function |
US4737628A (en) * | 1984-02-07 | 1988-04-12 | International Technical Associates | Method and system for controlled and selective removal of material |
US4850763A (en) * | 1988-10-03 | 1989-07-25 | The Boeing Company | Tool track for use on aircraft |
US4896015A (en) * | 1988-07-29 | 1990-01-23 | Refractive Laser Research & Development Program, Ltd. | Laser delivery system |
US5026966A (en) * | 1988-12-24 | 1991-06-25 | Roth Werke Gmbh | Method and a device for cutting a tub |
US5034010A (en) * | 1985-03-22 | 1991-07-23 | Massachusetts Institute Of Technology | Optical shield for a laser catheter |
US5085026A (en) * | 1990-11-20 | 1992-02-04 | Mcgill Scott A | Conical seismic anchor and drill bit for use with unreinforced masonry structures |
US5107516A (en) * | 1990-02-15 | 1992-04-21 | Laser-Laboratorium | Apparatus for controlled ablation by laser radiation |
US5148446A (en) * | 1991-06-07 | 1992-09-15 | Tektronix, Inc. | Laser objective lens shield |
US5160824A (en) * | 1990-12-18 | 1992-11-03 | Maho Aktiengesellschaft | Machine tool for laser-beam machining of workpieces |
US5256852A (en) * | 1990-10-10 | 1993-10-26 | Framatome | Process and device for laser working with remote control |
US5359176A (en) * | 1993-04-02 | 1994-10-25 | International Business Machines Corporation | Optics and environmental protection device for laser processing applications |
US5554335A (en) * | 1995-02-22 | 1996-09-10 | Laser Light Technologies, Inc. | Process for engraving ceramic surfaces using local laser vitrification |
US5569398A (en) * | 1992-09-10 | 1996-10-29 | Electro Scientific Industries, Inc. | Laser system and method for selectively trimming films |
US5592283A (en) * | 1995-04-03 | 1997-01-07 | Westinghouse Hanford Company | Testing of concrete by laser ablation |
US5601735A (en) * | 1992-04-13 | 1997-02-11 | Hitachi, Ltd. | Long-sized tubular grounding container unit for gas-insulated electrical device and laser welding device for manufacturing the same |
US5657595A (en) * | 1995-06-29 | 1997-08-19 | Hexcel-Fyfe Co., L.L.C. | Fabric reinforced beam and column connections |
US5664389A (en) * | 1996-07-22 | 1997-09-09 | Williams; Merlin Ray | Method and apparatus for building construction |
US5690845A (en) * | 1994-10-07 | 1997-11-25 | Sumitomo Electric Industries, Ltd. | Optical device for laser machining |
US5717487A (en) * | 1996-09-17 | 1998-02-10 | Trw Inc. | Compact fast imaging spectrometer |
US5780806A (en) * | 1995-07-25 | 1998-07-14 | Lockheed Idaho Technologies Company | Laser ablation system, and method of decontaminating surfaces |
US5782043A (en) * | 1996-11-19 | 1998-07-21 | Duncan; C. Warren | Seismic correction system for retrofitting structural columns |
US5822057A (en) * | 1996-07-26 | 1998-10-13 | Stress Engineering Services, Inc. | System and method for inspecting a cast structure |
US5920938A (en) * | 1997-08-05 | 1999-07-13 | Elcock; Stanley E. | Method for rejuvenating bridge hinges |
US5977515A (en) * | 1994-10-05 | 1999-11-02 | Hitachi, Ltd. | Underwater laser processing device including chamber with partitioning wall |
US5986234A (en) * | 1997-03-28 | 1999-11-16 | The Regents Of The University Of California | High removal rate laser-based coating removal system |
US6056827A (en) * | 1996-02-15 | 2000-05-02 | Japan Nuclear Cycle Development Institute | Laser decontamination method |
US6064034A (en) * | 1996-11-22 | 2000-05-16 | Anolaze Corporation | Laser marking process for vitrification of bricks and other vitrescent objects |
US6114676A (en) * | 1999-01-19 | 2000-09-05 | Ramut University Authority For Applied Research And Industrial Development Ltd. | Method and device for drilling, cutting, nailing and joining solid non-conductive materials using microwave radiation |
US6114651A (en) * | 1995-05-30 | 2000-09-05 | Frauenhofer Society For The Promotion Of Applied Research | Laser beam apparatus and workpiece machining process |
US6191382B1 (en) * | 1998-04-02 | 2001-02-20 | Avery Dennison Corporation | Dynamic laser cutting apparatus |
US6201214B1 (en) * | 1998-02-19 | 2001-03-13 | M. J. Technologies, Limited | Laser drilling with optical feedback |
US6215094B1 (en) * | 1993-10-01 | 2001-04-10 | Universitat Stuttgart | Process for determining the instantaneous penetration depth and a machining laser beam into a workpiece, and device for implementing this process |
US6264649B1 (en) * | 1998-04-09 | 2001-07-24 | Ian Andrew Whitcroft | Laser treatment cooling head |
US6288362B1 (en) * | 1998-04-24 | 2001-09-11 | James W. Thomas | Method and apparatus for treating surfaces and ablating surface material |
US6288363B1 (en) * | 1992-10-23 | 2001-09-11 | Mitsubishi Denki Kabushiki Kaisha | Machining head and laser machining apparatus |
US6350326B1 (en) * | 1996-01-15 | 2002-02-26 | The University Of Tennessee Research Corporation | Method for practicing a feedback controlled laser induced surface modification |
US6417487B2 (en) * | 1998-06-08 | 2002-07-09 | Mitsubishi Heavy Industries, Ltd. | Laser beam machining head |
US6507000B2 (en) * | 2000-05-12 | 2003-01-14 | Matsushita Electric Industrial Co., Ltd. | Laser drilling machine and method for collecting dust |
US6521864B2 (en) * | 2000-01-10 | 2003-02-18 | L'air Liquide Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitatiion Des Procedes Georges Claude | Method and apparatus for the laser cutting of mild steel or structural steel with a multifocus optical component |
US6542230B1 (en) * | 1998-07-28 | 2003-04-01 | Keymed (Medical & Industrial) Ltd. | Apparatus for performing operations on a workpiece at an inaccessible location |
US6563130B2 (en) * | 1998-10-21 | 2003-05-13 | Canadian Space Agency | Distance tracking control system for single pass topographical mapping |
US20030132210A1 (en) * | 2000-11-07 | 2003-07-17 | Koji Fujii | Optical machining device |
US6614002B2 (en) * | 2000-12-04 | 2003-09-02 | Precitec Kg | Laser machining head |
US20030183608A1 (en) * | 2002-03-28 | 2003-10-02 | Fanuc Ltd. | Laser machining method and apparatus therefor |
US6683277B1 (en) * | 2002-12-20 | 2004-01-27 | Osram Opto Semiconductors | Laser ablation nozzle assembly |
US6693255B2 (en) * | 2001-03-22 | 2004-02-17 | R. F. Envirotech, Inc. | Laser ablation cleaning |
US6693256B2 (en) * | 2001-05-08 | 2004-02-17 | Koike Sanso Kogyo Co., Ltd. | Laser piercing method |
US6720567B2 (en) * | 2001-01-30 | 2004-04-13 | Gsi Lumonics Corporation | Apparatus and method for focal point control for laser machining |
US6742694B2 (en) * | 2001-02-16 | 2004-06-01 | Hitachi Global Storage Technologies Netherlands B.V. | Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus |
US6777646B2 (en) * | 2001-07-27 | 2004-08-17 | Precitec Kg | Laser machining head for machining a workpiece by means of a laser beam |
US20040182841A1 (en) * | 2003-03-18 | 2004-09-23 | Denney Paul E. | Laser manipulation system for controllably moving a laser head for irradiation and removal of material from a surface of a structure |
US20040182839A1 (en) * | 2003-03-18 | 2004-09-23 | Denney Paul E. | Containment plenum for laser irradiation and removal of material from a surface of a structure |
US20040182998A1 (en) * | 2003-03-18 | 2004-09-23 | Denney Paul E. | Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light |
US20040182840A1 (en) * | 2003-03-18 | 2004-09-23 | Denney Paul E. | Method and apparatus for material processing |
US20040182842A1 (en) * | 2003-03-18 | 2004-09-23 | Denney Paul E. | Laser head for irradiation and removal of material from a surface of a structure |
US6875951B2 (en) * | 2000-08-29 | 2005-04-05 | Mitsubishi Denki Kabushiki Kaisha | Laser machining device |
US20050109745A1 (en) * | 2003-03-15 | 2005-05-26 | Michael Wessner | Laser processing head |
US20060065650A1 (en) * | 2004-09-30 | 2006-03-30 | Wen Guo | Compact coaxial nozzle for laser cladding |
US20060231533A1 (en) * | 2003-02-04 | 2006-10-19 | Wolfgang Danzer | Laser beam welding method |
US7379483B2 (en) * | 2003-03-18 | 2008-05-27 | Loma Linda University Medical Center | Method and apparatus for material processing |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5987992A (en) | 1982-11-11 | 1984-05-21 | Mitsubishi Electric Corp | Optical head for laser machining |
JPS62179884A (en) | 1986-02-04 | 1987-08-07 | Fujita Corp | Method and device for cutting structure |
JPS63157780A (en) | 1986-08-26 | 1988-06-30 | Ohbayashigumi Ltd | Concrete cutting method by laser beam |
JPH0798274B2 (en) | 1986-12-22 | 1995-10-25 | 大成建設株式会社 | Method and apparatus for cutting solid material by laser irradiation |
JPS63224891A (en) | 1987-03-16 | 1988-09-19 | Fujita Corp | Concrete cutting device |
EP0397777A1 (en) | 1988-01-25 | 1990-11-22 | Refractive Laser Research And Development, Inc. | Method and apparatus for laser surgery |
JPH0381080A (en) | 1989-08-25 | 1991-04-05 | Fujita Corp | Concrete cutting device utilizing laser beam |
DE4016199A1 (en) | 1990-05-19 | 1991-11-21 | Linde Ag | Cutting tool with focusable laser beam - has cutting nozzle with narrowing and widening sections to focus beam on thick workpiece surface |
JPH04316000A (en) | 1991-04-16 | 1992-11-06 | Ohbayashi Corp | Method for dismantling nuclear reactor using laser beam |
JP2617048B2 (en) | 1991-04-23 | 1997-06-04 | ファナック株式会社 | Laser processing equipment |
JP2591371B2 (en) | 1991-07-03 | 1997-03-19 | 三菱電機株式会社 | Laser processing equipment |
JP3427273B2 (en) | 1994-03-28 | 2003-07-14 | 大成建設株式会社 | How to clean and remove contaminated concrete surfaces |
US6009115A (en) | 1995-05-25 | 1999-12-28 | Northwestern University | Semiconductor micro-resonator device |
JPH09242453A (en) | 1996-03-06 | 1997-09-16 | Tomoo Fujioka | Drilling method |
JPH10331434A (en) | 1997-06-02 | 1998-12-15 | Taisei Corp | Method of drilling concrete wall surface |
JPH1119785A (en) | 1997-07-03 | 1999-01-26 | Taisei Corp | Method of drilling cement hardened body |
EP1117503B1 (en) | 1998-09-30 | 2003-11-26 | Lasertec GmbH | Method and device for removing material from a surface of a work piece |
ATE273768T1 (en) | 1998-12-22 | 2004-09-15 | Element Six Pty Ltd | CUTTING ULTRA HARD MATERIALS |
US6528754B2 (en) | 2000-03-31 | 2003-03-04 | Kabushiki Kaisha Toshiba | Underwater maintenance repair device and method |
US6667458B1 (en) | 2000-04-19 | 2003-12-23 | Optimet, Optical Metrology Ltd. | Spot size and distance characterization for a laser tool |
FR2817782B1 (en) | 2000-12-13 | 2003-02-28 | Air Liquide | LASER CUTTING PROCESS AND INSTALLATION WITH DOUBLE-FLOW CUTTING HEAD AND DOUBLE FIREPLACE |
ITTO20010185A1 (en) | 2001-03-02 | 2002-09-02 | Comau Systems Spa | PROCEDURE AND SYSTEM FOR LASER WELDING OF TWO OR MORE METAL SHEETS BETWEEN THEIR SUPPOSITORS, AND LOCKING DEVICE FOR THE SHEETS |
DE10123097B8 (en) | 2001-05-07 | 2006-05-04 | Jenoptik Automatisierungstechnik Gmbh | Tool head for laser material processing |
GB0112234D0 (en) | 2001-05-18 | 2001-07-11 | Welding Inst | Surface modification |
US6970619B2 (en) | 2001-05-21 | 2005-11-29 | Lucent Technologies Inc. | Mechanically tunable optical devices such as interferometers |
US20030062126A1 (en) | 2001-10-03 | 2003-04-03 | Scaggs Michael J. | Method and apparatus for assisting laser material processing |
WO2003028943A1 (en) | 2001-10-03 | 2003-04-10 | Lambda Physik Application Center, L.L.C. | Method and apparatus for fine liquid spray assisted laser material processing |
JP3678693B2 (en) | 2001-10-30 | 2005-08-03 | コマツ産機株式会社 | Thermal cutting machine |
SE524066C2 (en) | 2002-01-21 | 2004-06-22 | Permanova Lasersystem Ab | Device for centering the laser beam in a laser processing system |
US7180080B2 (en) | 2002-02-20 | 2007-02-20 | Loma Linda University Medical Center | Method for retrofitting concrete structures |
US6710285B2 (en) | 2002-06-01 | 2004-03-23 | First Call Explosive Solutions, Inc. | Laser system for slag removal |
DE102005027800A1 (en) * | 2005-06-13 | 2006-12-14 | Jenoptik Automatisierungstechnik Gmbh | Device for multiple separation of a flat workpiece from a brittle material by means of laser |
-
2005
- 2005-08-16 US US11/205,290 patent/US7379483B2/en not_active Expired - Fee Related
-
2008
- 2008-05-06 US US12/116,162 patent/US20080240178A1/en not_active Abandoned
Patent Citations (98)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3369101A (en) * | 1964-04-30 | 1968-02-13 | United Aircraft Corp | Laser micro-processer |
US3569660A (en) * | 1968-07-29 | 1971-03-09 | Nat Res Dev | Laser cutting apparatus |
US3676673A (en) * | 1969-08-18 | 1972-07-11 | Ppg Industries Inc | Apparatus for irradiation in a controlled atmosphere |
US3871485A (en) * | 1973-11-02 | 1975-03-18 | Sun Oil Co Pennsylvania | Laser beam drill |
US4060327A (en) * | 1976-09-13 | 1977-11-29 | International Business Machines Corporation | Wide band grating spectrometer |
US4137778A (en) * | 1977-03-05 | 1979-02-06 | Krautkramer-Branson, Incorporated | Method and apparatus for producing ultrasonic waves in light absorbing surfaces of workpieces |
US4151393A (en) * | 1978-02-13 | 1979-04-24 | The United States Of America As Represented By The Secretary Of The Navy | Laser pile cutter |
US4227582A (en) * | 1979-10-12 | 1980-10-14 | Price Ernest H | Well perforating apparatus and method |
US4568814A (en) * | 1983-04-18 | 1986-02-04 | Agency Of Industrial Science & Technology | Method and apparatus for cutting concrete by use of laser |
US4675501A (en) * | 1983-10-29 | 1987-06-23 | Trumpf Gmbh & Co. | Laser apparatus with novel beam aligning means and method of laser processing of workpieces using same |
US4737628A (en) * | 1984-02-07 | 1988-04-12 | International Technical Associates | Method and system for controlled and selective removal of material |
US4578554A (en) * | 1984-04-30 | 1986-03-25 | Teledyne, Inc. | Laser welding apparatus |
US4618758A (en) * | 1984-05-22 | 1986-10-21 | Prima Industrie S.P.A. | Focusing head for a laser-beam cutting machine |
US5034010A (en) * | 1985-03-22 | 1991-07-23 | Massachusetts Institute Of Technology | Optical shield for a laser catheter |
US4642445A (en) * | 1985-06-28 | 1987-02-10 | Westinghouse Electric Corp. | Shielding apparatus for metal processing operations |
US4727628A (en) * | 1985-10-24 | 1988-03-01 | Rudholm & Co. I Boras Ab | Strap buckle with self-locking function |
US4896015A (en) * | 1988-07-29 | 1990-01-23 | Refractive Laser Research & Development Program, Ltd. | Laser delivery system |
US4850763A (en) * | 1988-10-03 | 1989-07-25 | The Boeing Company | Tool track for use on aircraft |
US5026966A (en) * | 1988-12-24 | 1991-06-25 | Roth Werke Gmbh | Method and a device for cutting a tub |
US5107516A (en) * | 1990-02-15 | 1992-04-21 | Laser-Laboratorium | Apparatus for controlled ablation by laser radiation |
US5256852A (en) * | 1990-10-10 | 1993-10-26 | Framatome | Process and device for laser working with remote control |
US5085026A (en) * | 1990-11-20 | 1992-02-04 | Mcgill Scott A | Conical seismic anchor and drill bit for use with unreinforced masonry structures |
US5160824A (en) * | 1990-12-18 | 1992-11-03 | Maho Aktiengesellschaft | Machine tool for laser-beam machining of workpieces |
US5148446A (en) * | 1991-06-07 | 1992-09-15 | Tektronix, Inc. | Laser objective lens shield |
US5601735A (en) * | 1992-04-13 | 1997-02-11 | Hitachi, Ltd. | Long-sized tubular grounding container unit for gas-insulated electrical device and laser welding device for manufacturing the same |
US5569398A (en) * | 1992-09-10 | 1996-10-29 | Electro Scientific Industries, Inc. | Laser system and method for selectively trimming films |
US6288363B1 (en) * | 1992-10-23 | 2001-09-11 | Mitsubishi Denki Kabushiki Kaisha | Machining head and laser machining apparatus |
US5359176A (en) * | 1993-04-02 | 1994-10-25 | International Business Machines Corporation | Optics and environmental protection device for laser processing applications |
US6215094B1 (en) * | 1993-10-01 | 2001-04-10 | Universitat Stuttgart | Process for determining the instantaneous penetration depth and a machining laser beam into a workpiece, and device for implementing this process |
US5977515A (en) * | 1994-10-05 | 1999-11-02 | Hitachi, Ltd. | Underwater laser processing device including chamber with partitioning wall |
US5690845A (en) * | 1994-10-07 | 1997-11-25 | Sumitomo Electric Industries, Ltd. | Optical device for laser machining |
US5554335A (en) * | 1995-02-22 | 1996-09-10 | Laser Light Technologies, Inc. | Process for engraving ceramic surfaces using local laser vitrification |
US5592283A (en) * | 1995-04-03 | 1997-01-07 | Westinghouse Hanford Company | Testing of concrete by laser ablation |
US6114651A (en) * | 1995-05-30 | 2000-09-05 | Frauenhofer Society For The Promotion Of Applied Research | Laser beam apparatus and workpiece machining process |
US5657595A (en) * | 1995-06-29 | 1997-08-19 | Hexcel-Fyfe Co., L.L.C. | Fabric reinforced beam and column connections |
US5780806A (en) * | 1995-07-25 | 1998-07-14 | Lockheed Idaho Technologies Company | Laser ablation system, and method of decontaminating surfaces |
US6350326B1 (en) * | 1996-01-15 | 2002-02-26 | The University Of Tennessee Research Corporation | Method for practicing a feedback controlled laser induced surface modification |
US6056827A (en) * | 1996-02-15 | 2000-05-02 | Japan Nuclear Cycle Development Institute | Laser decontamination method |
US5664389A (en) * | 1996-07-22 | 1997-09-09 | Williams; Merlin Ray | Method and apparatus for building construction |
US5822057A (en) * | 1996-07-26 | 1998-10-13 | Stress Engineering Services, Inc. | System and method for inspecting a cast structure |
US5717487A (en) * | 1996-09-17 | 1998-02-10 | Trw Inc. | Compact fast imaging spectrometer |
US5782043A (en) * | 1996-11-19 | 1998-07-21 | Duncan; C. Warren | Seismic correction system for retrofitting structural columns |
US6064034A (en) * | 1996-11-22 | 2000-05-16 | Anolaze Corporation | Laser marking process for vitrification of bricks and other vitrescent objects |
US5986234A (en) * | 1997-03-28 | 1999-11-16 | The Regents Of The University Of California | High removal rate laser-based coating removal system |
US5920938A (en) * | 1997-08-05 | 1999-07-13 | Elcock; Stanley E. | Method for rejuvenating bridge hinges |
US6201214B1 (en) * | 1998-02-19 | 2001-03-13 | M. J. Technologies, Limited | Laser drilling with optical feedback |
US6191382B1 (en) * | 1998-04-02 | 2001-02-20 | Avery Dennison Corporation | Dynamic laser cutting apparatus |
US6264649B1 (en) * | 1998-04-09 | 2001-07-24 | Ian Andrew Whitcroft | Laser treatment cooling head |
US6288362B1 (en) * | 1998-04-24 | 2001-09-11 | James W. Thomas | Method and apparatus for treating surfaces and ablating surface material |
US6417487B2 (en) * | 1998-06-08 | 2002-07-09 | Mitsubishi Heavy Industries, Ltd. | Laser beam machining head |
US6542230B1 (en) * | 1998-07-28 | 2003-04-01 | Keymed (Medical & Industrial) Ltd. | Apparatus for performing operations on a workpiece at an inaccessible location |
US6563130B2 (en) * | 1998-10-21 | 2003-05-13 | Canadian Space Agency | Distance tracking control system for single pass topographical mapping |
US6114676A (en) * | 1999-01-19 | 2000-09-05 | Ramut University Authority For Applied Research And Industrial Development Ltd. | Method and device for drilling, cutting, nailing and joining solid non-conductive materials using microwave radiation |
US6521864B2 (en) * | 2000-01-10 | 2003-02-18 | L'air Liquide Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitatiion Des Procedes Georges Claude | Method and apparatus for the laser cutting of mild steel or structural steel with a multifocus optical component |
US6507000B2 (en) * | 2000-05-12 | 2003-01-14 | Matsushita Electric Industrial Co., Ltd. | Laser drilling machine and method for collecting dust |
US6875951B2 (en) * | 2000-08-29 | 2005-04-05 | Mitsubishi Denki Kabushiki Kaisha | Laser machining device |
US20030132210A1 (en) * | 2000-11-07 | 2003-07-17 | Koji Fujii | Optical machining device |
US6791061B2 (en) * | 2000-11-07 | 2004-09-14 | Matsushita Electric Industrial Co., Ltd. | Optical machining device |
US6614002B2 (en) * | 2000-12-04 | 2003-09-02 | Precitec Kg | Laser machining head |
US6720567B2 (en) * | 2001-01-30 | 2004-04-13 | Gsi Lumonics Corporation | Apparatus and method for focal point control for laser machining |
US6742694B2 (en) * | 2001-02-16 | 2004-06-01 | Hitachi Global Storage Technologies Netherlands B.V. | Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus |
US6693255B2 (en) * | 2001-03-22 | 2004-02-17 | R. F. Envirotech, Inc. | Laser ablation cleaning |
US6693256B2 (en) * | 2001-05-08 | 2004-02-17 | Koike Sanso Kogyo Co., Ltd. | Laser piercing method |
US6777646B2 (en) * | 2001-07-27 | 2004-08-17 | Precitec Kg | Laser machining head for machining a workpiece by means of a laser beam |
US20030183608A1 (en) * | 2002-03-28 | 2003-10-02 | Fanuc Ltd. | Laser machining method and apparatus therefor |
US6683277B1 (en) * | 2002-12-20 | 2004-01-27 | Osram Opto Semiconductors | Laser ablation nozzle assembly |
US6797919B1 (en) * | 2002-12-20 | 2004-09-28 | Osram Opto Semiconductors Gmbh | Laser ablation nozzle assembly |
US20060231533A1 (en) * | 2003-02-04 | 2006-10-19 | Wolfgang Danzer | Laser beam welding method |
US20050109745A1 (en) * | 2003-03-15 | 2005-05-26 | Michael Wessner | Laser processing head |
US20040182998A1 (en) * | 2003-03-18 | 2004-09-23 | Denney Paul E. | Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light |
US7180920B2 (en) * | 2003-03-18 | 2007-02-20 | Loma Linda University Medical Center | Method and apparatus for material processing |
US20040182842A1 (en) * | 2003-03-18 | 2004-09-23 | Denney Paul E. | Laser head for irradiation and removal of material from a surface of a structure |
US20040208212A1 (en) * | 2003-03-18 | 2004-10-21 | Denney Paul E. | Method and apparatus for material processing |
US20050040150A1 (en) * | 2003-03-18 | 2005-02-24 | Denney Paul E. | Laser head for irradiation and removal of material from a surface of a structure |
US20040182840A1 (en) * | 2003-03-18 | 2004-09-23 | Denney Paul E. | Method and apparatus for material processing |
US20040182839A1 (en) * | 2003-03-18 | 2004-09-23 | Denney Paul E. | Containment plenum for laser irradiation and removal of material from a surface of a structure |
US8258425B2 (en) * | 2003-03-18 | 2012-09-04 | Loma Linda University Medical Center | Laser head for irradiation and removal of material from a surface of a structure |
US7038164B2 (en) * | 2003-03-18 | 2006-05-02 | Loma Linda University Medical Center | Laser head for irradiation and removal of material from a surface of a structure |
US7038166B2 (en) * | 2003-03-18 | 2006-05-02 | Loma Linda University Medical Center | Containment plenum for laser irradiation and removal of material from a surface of a structure |
US7057134B2 (en) * | 2003-03-18 | 2006-06-06 | Loma Linda University Medical Center | Laser manipulation system for controllably moving a laser head for irradiation and removal of material from a surface of a structure |
US7060932B2 (en) * | 2003-03-18 | 2006-06-13 | Loma Linda University Medical Center | Method and apparatus for material processing |
US20060144834A1 (en) * | 2003-03-18 | 2006-07-06 | Denney Paul E | Containment plenum for laser irradiation and removal of material from a surface of a structure |
US20060196861A1 (en) * | 2003-03-18 | 2006-09-07 | Denney Paul E | Manipulation apparatus for system that removes material from a surface of a structure |
US20040182841A1 (en) * | 2003-03-18 | 2004-09-23 | Denney Paul E. | Laser manipulation system for controllably moving a laser head for irradiation and removal of material from a surface of a structure |
US20040182999A1 (en) * | 2003-03-18 | 2004-09-23 | Denney Paul E. | Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser |
US7286223B2 (en) * | 2003-03-18 | 2007-10-23 | Loma Linda University Medical Center | Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light |
US7289206B2 (en) * | 2003-03-18 | 2007-10-30 | Loma Linda University Medical Center | Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light |
US20080067331A1 (en) * | 2003-03-18 | 2008-03-20 | Denney Paul E | Method and apparatus for detecting embedded material within an interaction region of a structure |
US7379483B2 (en) * | 2003-03-18 | 2008-05-27 | Loma Linda University Medical Center | Method and apparatus for material processing |
US20090021731A1 (en) * | 2003-03-18 | 2009-01-22 | Denney Paul E | Method and apparatus for detecting embedded material within an interaction region of structure |
US7492453B2 (en) * | 2003-03-18 | 2009-02-17 | Loma Linda University Medical Center | Method and apparatus for detecting embedded material within an interaction region of a structure |
US7864315B2 (en) * | 2003-03-18 | 2011-01-04 | Loma Linda University Medical Center | Method and apparatus for detecting embedded material within an interaction region of a structure |
US7880116B2 (en) * | 2003-03-18 | 2011-02-01 | Loma Linda University Medical Center | Laser head for irradiation and removal of material from a surface of a structure |
US7880114B2 (en) * | 2003-03-18 | 2011-02-01 | Loma Linda University Medical Center | Method and apparatus for material processing |
US7880877B2 (en) * | 2003-03-18 | 2011-02-01 | Loma Linda University Medical Center | System and method for detecting laser irradiated embedded material in a structure |
US8094303B2 (en) * | 2003-03-18 | 2012-01-10 | Loma Linda University Medical Center | Method and apparatus for detecting embedded material within an interaction region of a structure |
US8228501B2 (en) * | 2003-03-18 | 2012-07-24 | Loma Linda University Medical Center | Method and apparatus for detecting embedded material within an interaction region of a structure |
US20060065650A1 (en) * | 2004-09-30 | 2006-03-30 | Wen Guo | Compact coaxial nozzle for laser cladding |
Non-Patent Citations (1)
Title |
---|
english machine translation of JP 2002-296183, Oct, 2002. * |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7864315B2 (en) | 2003-03-18 | 2011-01-04 | Loma Linda University Medical Center | Method and apparatus for detecting embedded material within an interaction region of a structure |
US20110102789A1 (en) * | 2003-03-18 | 2011-05-05 | Loma Linda University Medical Center | Method and apparatus for detecting embedded material within an interaction region of a structure |
US20070189347A1 (en) * | 2003-03-18 | 2007-08-16 | Denney Paul E | Method and apparatus for material processing |
US20090021731A1 (en) * | 2003-03-18 | 2009-01-22 | Denney Paul E | Method and apparatus for detecting embedded material within an interaction region of structure |
US7620085B2 (en) * | 2003-03-18 | 2009-11-17 | Loma Linda University Medical Center | Method and apparatus for material processing |
US20090284739A1 (en) * | 2003-03-18 | 2009-11-19 | Loma Linda University Medical Center | Method and apparatus for detecting embedded material within an interaction region of a structure |
US20060196861A1 (en) * | 2003-03-18 | 2006-09-07 | Denney Paul E | Manipulation apparatus for system that removes material from a surface of a structure |
US7880877B2 (en) | 2003-03-18 | 2011-02-01 | Loma Linda University Medical Center | System and method for detecting laser irradiated embedded material in a structure |
US20060144834A1 (en) * | 2003-03-18 | 2006-07-06 | Denney Paul E | Containment plenum for laser irradiation and removal of material from a surface of a structure |
US8624158B2 (en) | 2003-03-18 | 2014-01-07 | Loma Linda University Medical Center | Manipulation apparatus for system that removes material from a surface of a structure |
US8094303B2 (en) | 2003-03-18 | 2012-01-10 | Loma Linda University Medical Center | Method and apparatus for detecting embedded material within an interaction region of a structure |
US8228501B2 (en) | 2003-03-18 | 2012-07-24 | Loma Linda University Medical Center | Method and apparatus for detecting embedded material within an interaction region of a structure |
US8306079B2 (en) | 2003-03-18 | 2012-11-06 | Loma Linda University Medical Center | Method and apparatus for material processing |
US7971368B2 (en) * | 2005-07-26 | 2011-07-05 | Mitsubishi Electric Corporation | Hand drying apparatus |
US10092979B2 (en) * | 2015-12-25 | 2018-10-09 | Gigaphoton Inc. | Laser irradiation apparatus |
Also Published As
Publication number | Publication date |
---|---|
US20060062265A1 (en) | 2006-03-23 |
US7379483B2 (en) | 2008-05-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8306079B2 (en) | Method and apparatus for material processing | |
US8258425B2 (en) | Laser head for irradiation and removal of material from a surface of a structure | |
US7379483B2 (en) | Method and apparatus for material processing | |
US7864315B2 (en) | Method and apparatus for detecting embedded material within an interaction region of a structure | |
CA2519624C (en) | Containment plenum for laser irradiation and removal of material from a surface of a structure | |
US8624158B2 (en) | Manipulation apparatus for system that removes material from a surface of a structure | |
AU2005285425B2 (en) | Method and apparatus for material processing |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |