US20080196858A1 - Heat exchanger assembly - Google Patents
Heat exchanger assembly Download PDFInfo
- Publication number
- US20080196858A1 US20080196858A1 US11/707,932 US70793207A US2008196858A1 US 20080196858 A1 US20080196858 A1 US 20080196858A1 US 70793207 A US70793207 A US 70793207A US 2008196858 A1 US2008196858 A1 US 2008196858A1
- Authority
- US
- United States
- Prior art keywords
- heat
- exchanger assembly
- section
- heat exchanger
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
Definitions
- the present invention relates to a heat exchanger assembly for removing heat from coolant and the heat exchanger assembly includes an enclosed path in which cold water flows continuously.
- a conventional heat exchanger assembly for removing heat from coolant of a refrigeration system includes two main ways, one of which uses water to absorb the heat from the coolant and the water is recycled or flows into rivers.
- the other one of the main ways uses cool air to absorb the heat of the coolant and the air is sent to the atmosphere.
- the first main way includes a piping system in which cold water flows and the piping system is arranged to close to the heat section of the refrigeration system so as to absorb the heat from the coolant.
- the vaporized coolant carries heat form the refrigeration system and the heat is removed to the cold water and becomes liquid status which is sent to absorb heat again.
- the water that absorbs heat is then directly sent to the surroundings such as lake or river. However, the water with high temperature is harmful to the eco environment in the water.
- the other way is to build a cooling tower on a building so as to cool the temperature of the water down.
- tiny water particles are generated and escape to the air and the water particles make the surroundings to have higher humidity which causes germs reproduction and mosses and is harmful to people.
- a longer piping system is needed to send the water to the cooling tower which also generates a lot of noise and requires significant electronic power.
- Calcium and Magnesium in the water are crystallized at high temperature and will attach to the inner side of the pipes and the crystallized Calcium and Magnesium reduce the efficiency for exchanging heat. Chemical material is used to remove the crystallized Calcium and Magnesium and may harmful to the environment and the people who clean the crystallized Calcium and Magnesium.
- the second way needs a fan to generate air flow to carry the heat of the coolant in the pipe and the cooler air absorbs the heat from the coolant so as to achieve the purpose for cooling the water. If the air with high temperature is sent to interior of a room, the interior temperature increases and a further cooling device is needed. If the air is to be sent to outside of the room, the pipe for the coolant has to be long enough to be located at outside of the room. This requires a larger compressor to send the coolant to flow in the longer pipe. A significant electric power is needed.
- the present invention intends to provide a heat exchanger assembly which is compact in size and can be easily installed to a desired position.
- the present invention relates to a heat exchanger assembly which comprises an enclosed pipe in which water flows and a pump is connected to the pipe so as to pump the water in the pipe.
- the pipe includes a heat absorbing section and a heat dispersing section, and the pump is located between the heat absorbing section and a heat dispersing section.
- the heat absorbing section is located close to a heat source and a fan is located close to the heat dispersing section.
- FIG. 1 shows heat exchanger assembly of the present invention
- FIG. 2 shows that fins are connected to the heat dispersing section of the pipe of the heat exchanger assembly of the present invention.
- the heat exchanger assembly of the present invention comprises an enclosed pipe 10 in which water flows and the enclosed pipe 10 includes a heat absorbing section 12 and a heat dispersing section 14 .
- a pump 20 is connected to the enclosed pipe 10 and located between the heat absorbing section 12 and a heat dispersing section 14 so as to pump water to flow through the pipe 10 continuously.
- the heat absorbing section 12 is located close to a heat source such as the pipe that coolant flows therein and a fan 30 is located close to the heat dispersing section 14 so as to generate air flow to bring heat from the heat dispersing section 14 .
- the heat dispersing section 14 includes a plurality of curved sections which increase the length of the heat dispersing section 14 so as to disperse more heat to the air.
- a plurality of fins 16 are connected to the heat dispersing section 14 to assist the efficiency for dispersing the heat.
- the enclosed pipe 10 ensures that the volume of the water therein is constant so that the user does not need to add water into the pipe 10 . No mist and small particles are released during heat exchange so as to keep the surroundings dry and clean.
- the heat exchange assembly can be easily carried to desired positions and the pump 20 needs only to pump the water in the enclosed pipe 10 so that the cost of electric energy is limited. Because the amount of water in the enclosed pipe 10 is not changed so that even if the crystallized Calcium and Magnesium are formed, they do not increase.
Abstract
A heat exchanger assembly includes an enclosed path in which cold water flows continuously. The enclosed path includes a heat absorbing section for absorbing heat from the coolant, and a heat dispersing section which is cooperated with a fan and fins so as to send heat from the heat dispersing section. No water is needed added into the heat exchanger assembly and a short distance of path is needed. The heat exchanger assembly can be conveniently carried to desired positions.
Description
- The present invention relates to a heat exchanger assembly for removing heat from coolant and the heat exchanger assembly includes an enclosed path in which cold water flows continuously.
- A conventional heat exchanger assembly for removing heat from coolant of a refrigeration system includes two main ways, one of which uses water to absorb the heat from the coolant and the water is recycled or flows into rivers. The other one of the main ways uses cool air to absorb the heat of the coolant and the air is sent to the atmosphere. The first main way includes a piping system in which cold water flows and the piping system is arranged to close to the heat section of the refrigeration system so as to absorb the heat from the coolant. The vaporized coolant carries heat form the refrigeration system and the heat is removed to the cold water and becomes liquid status which is sent to absorb heat again. The water that absorbs heat is then directly sent to the surroundings such as lake or river. However, the water with high temperature is harmful to the eco environment in the water. The other way is to build a cooling tower on a building so as to cool the temperature of the water down. During the process, tiny water particles are generated and escape to the air and the water particles make the surroundings to have higher humidity which causes germs reproduction and mosses and is harmful to people. Besides, a longer piping system is needed to send the water to the cooling tower which also generates a lot of noise and requires significant electronic power. Calcium and Magnesium in the water are crystallized at high temperature and will attach to the inner side of the pipes and the crystallized Calcium and Magnesium reduce the efficiency for exchanging heat. Chemical material is used to remove the crystallized Calcium and Magnesium and may harmful to the environment and the people who clean the crystallized Calcium and Magnesium.
- The second way needs a fan to generate air flow to carry the heat of the coolant in the pipe and the cooler air absorbs the heat from the coolant so as to achieve the purpose for cooling the water. If the air with high temperature is sent to interior of a room, the interior temperature increases and a further cooling device is needed. If the air is to be sent to outside of the room, the pipe for the coolant has to be long enough to be located at outside of the room. This requires a larger compressor to send the coolant to flow in the longer pipe. A significant electric power is needed.
- The present invention intends to provide a heat exchanger assembly which is compact in size and can be easily installed to a desired position.
- The present invention relates to a heat exchanger assembly which comprises an enclosed pipe in which water flows and a pump is connected to the pipe so as to pump the water in the pipe. The pipe includes a heat absorbing section and a heat dispersing section, and the pump is located between the heat absorbing section and a heat dispersing section. The heat absorbing section is located close to a heat source and a fan is located close to the heat dispersing section.
- The present invention will become more obvious from the following description when taken in connection with the accompanying drawings which show, for purposes of illustration only, a preferred embodiment in accordance with the present invention.
-
FIG. 1 shows heat exchanger assembly of the present invention, and -
FIG. 2 shows that fins are connected to the heat dispersing section of the pipe of the heat exchanger assembly of the present invention. - Referring to
FIGS. 1 and 2 , the heat exchanger assembly of the present invention comprises an enclosedpipe 10 in which water flows and the enclosedpipe 10 includes aheat absorbing section 12 and aheat dispersing section 14. Apump 20 is connected to the enclosedpipe 10 and located between theheat absorbing section 12 and aheat dispersing section 14 so as to pump water to flow through thepipe 10 continuously. - The
heat absorbing section 12 is located close to a heat source such as the pipe that coolant flows therein and afan 30 is located close to theheat dispersing section 14 so as to generate air flow to bring heat from theheat dispersing section 14. Theheat dispersing section 14 includes a plurality of curved sections which increase the length of theheat dispersing section 14 so as to disperse more heat to the air. A plurality offins 16 are connected to theheat dispersing section 14 to assist the efficiency for dispersing the heat. - The enclosed
pipe 10 ensures that the volume of the water therein is constant so that the user does not need to add water into thepipe 10. No mist and small particles are released during heat exchange so as to keep the surroundings dry and clean. The heat exchange assembly can be easily carried to desired positions and thepump 20 needs only to pump the water in the enclosedpipe 10 so that the cost of electric energy is limited. Because the amount of water in the enclosedpipe 10 is not changed so that even if the crystallized Calcium and Magnesium are formed, they do not increase. - While we have shown and described the embodiment in accordance with the present invention, it should be clear to those skilled in the art that further embodiments may be made without departing from the scope of the present invention.
Claims (3)
1. A heat exchanger assembly comprising:
an enclosed pipe and a pump connected to the pipe which including a heat absorbing section and a heat dispersing section, the pump located between the heat absorbing section and a heat dispersing section so as to pump water to flow through the pipe continuously, a fan located close to the heat dispersing section.
2. The assembly as claimed in claim 1 , wherein the heat dispersing section includes a plurality of curved sections.
3. The assembly as claimed in claim 1 , wherein a plurality of fins are connected to the heat dispersing section.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/707,932 US20080196858A1 (en) | 2007-02-20 | 2007-02-20 | Heat exchanger assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/707,932 US20080196858A1 (en) | 2007-02-20 | 2007-02-20 | Heat exchanger assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080196858A1 true US20080196858A1 (en) | 2008-08-21 |
Family
ID=39705647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/707,932 Abandoned US20080196858A1 (en) | 2007-02-20 | 2007-02-20 | Heat exchanger assembly |
Country Status (1)
Country | Link |
---|---|
US (1) | US20080196858A1 (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4468717A (en) * | 1982-06-09 | 1984-08-28 | Sperry Corporation | Apparatus for cooling integrated circuit chips |
US5285347A (en) * | 1990-07-02 | 1994-02-08 | Digital Equipment Corporation | Hybird cooling system for electronic components |
US5323847A (en) * | 1990-08-01 | 1994-06-28 | Hitachi, Ltd. | Electronic apparatus and method of cooling the same |
US5406807A (en) * | 1992-06-17 | 1995-04-18 | Hitachi, Ltd. | Apparatus for cooling semiconductor device and computer having the same |
US6166907A (en) * | 1999-11-26 | 2000-12-26 | Chien; Chuan-Fu | CPU cooling system |
US6263957B1 (en) * | 2000-01-13 | 2001-07-24 | Lucent Technologies Inc. | Integrated active cooling device for board mounted electric components |
US6600649B1 (en) * | 2002-05-24 | 2003-07-29 | Mei-Nan Tsai | Heat dissipating device |
-
2007
- 2007-02-20 US US11/707,932 patent/US20080196858A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4468717A (en) * | 1982-06-09 | 1984-08-28 | Sperry Corporation | Apparatus for cooling integrated circuit chips |
US5285347A (en) * | 1990-07-02 | 1994-02-08 | Digital Equipment Corporation | Hybird cooling system for electronic components |
US5323847A (en) * | 1990-08-01 | 1994-06-28 | Hitachi, Ltd. | Electronic apparatus and method of cooling the same |
US5406807A (en) * | 1992-06-17 | 1995-04-18 | Hitachi, Ltd. | Apparatus for cooling semiconductor device and computer having the same |
US6166907A (en) * | 1999-11-26 | 2000-12-26 | Chien; Chuan-Fu | CPU cooling system |
US6263957B1 (en) * | 2000-01-13 | 2001-07-24 | Lucent Technologies Inc. | Integrated active cooling device for board mounted electric components |
US6600649B1 (en) * | 2002-05-24 | 2003-07-29 | Mei-Nan Tsai | Heat dissipating device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: YANG, CHENG-FU; LA, CHENG-CHIEH, TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:YANG, CHENG-FU;REEL/FRAME:019011/0101 Effective date: 20070215 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |