US20070206434A1 - Memory with multi-page read - Google Patents
Memory with multi-page read Download PDFInfo
- Publication number
- US20070206434A1 US20070206434A1 US11/276,477 US27647706A US2007206434A1 US 20070206434 A1 US20070206434 A1 US 20070206434A1 US 27647706 A US27647706 A US 27647706A US 2007206434 A1 US2007206434 A1 US 2007206434A1
- Authority
- US
- United States
- Prior art keywords
- data
- page
- memory device
- memory
- array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/26—Sensing or reading circuits; Data output circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/02—Detection or location of defective auxiliary circuits, e.g. defective refresh counters
- G11C29/025—Detection or location of defective auxiliary circuits, e.g. defective refresh counters in signal lines
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/44—Indication or identification of errors, e.g. for repair
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/50—Marginal testing, e.g. race, voltage or current testing
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
- G11C7/1015—Read-write modes for single port memories, i.e. having either a random port or a serial port
- G11C7/1018—Serial bit line access mode, e.g. using bit line address shift registers, bit line address counters, bit line burst counters
- G11C7/1021—Page serial bit line access mode, i.e. using an enabled row address stroke pulse with its associated word line address and a sequence of enabled column address stroke pulses each with its associated bit line address
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
- G11C16/3418—Disturbance prevention or evaluation; Refreshing of disturbed memory data
Definitions
- the present invention relates to non-volatile memory devices and, more particularly, to flash memory devices.
- Flash memory is non-volatile, which means that it stores information on a semiconductor in a way that does not need power to maintain the information in the chip. Flash memory stores information in an array of transistors called “cells,” each of which traditionally stores one or more bits of information. Current flash memory devices are made in two forms: NOR flash and NAND flash. The names refer to the type of logic used in the storage cell array.
- a flash cell is similar to a standard MOSFET transistor, except that it has two gates instead of just one.
- One gate is the control gate (CG) like in other MOS transistors, but the second is a floating gate (FG) that is insulated all around by an oxide layer.
- the FG is between the CG and the substrate. Because the FG is isolated by its insulating oxide layer, any electrons placed on it get trapped there and thus store the information.
- Memory cells of memory devices are typically arranged in an array with rows and columns. Generally, the rows are coupled via a word line conductor and the columns are coupled via a bit line conductor. During data read and write functions, voltage coupling between bit lines can influence proper memory operation. Further, close physical proximity of memory cells can result in floating gate to floating gate coupling. Again, coupling can influence proper memory operation and data accuracy.
- FIG. 1 is a block diagram of a memory device according to embodiments of the present invention.
- FIG. 2 illustrates a simplified portion of a NAND flash memory array of FIG. 1 ;
- FIG. 3 illustrates a portion of an array of FIG. 1 .
- memory devices of the type described herein are generally fabricated as an integrated circuit containing a variety of semiconductor devices.
- the integrated circuit is supported by a substrate. Integrated circuits are typically repeated multiple times on each substrate.
- the substrate is further processed to separate the integrated circuits into dice, as is well known in the art.
- the figures are provided to help facilitate an understanding of the detailed description, are not intended to be accurate in scale, and have been simplified.
- the term conductor as used herein is intended to include conductors and semi-conductors, including but not limited to metals, metal alloy, doped silicon and polysilicon.
- FIG. 1 is a simplified block diagram of an integrated circuit memory device 100 in accordance with an embodiment of the invention.
- the memory device 100 includes an array of non-volatile floating gate memory cells 102 , address circuitry 104 , control circuitry 110 , and Input/Output (I/O) circuitry 114 .
- the memory cells are also referred to as Flash memory cells because blocks of memory cells are typically erased concurrently, in a flash operation.
- the memory device 100 can be coupled to a processor 120 or other memory controller for accessing the memory array 102 .
- the memory device 100 coupled to a processor 120 forms part of an electronic system.
- electronic systems include personal computers, peripheral devices, wireless devices, digital cameras, personal digital assistants (PDA's) and audio recorders.
- the memory device 100 receives control signals across control lines 122 from the processor 120 to control access to the memory array 102 via control circuitry 110 . Access to the memory array 102 is directed to one or more target memory cells in response to address signals received across address lines 124 . Once the array is accessed in response to the control signals and the address signals, data can be written to or read from the memory cells across data, DQ, lines 126 .
- control circuit 110 performs a read operation on the memory cells.
- the read operation can include accessing multiple rows or pages of data to allow for a more informed reading of data.
- FIG. 1 has been simplified to help focus on the invention. It will be understood that the above description of a memory device is intended to provide a general understanding of the memory and is not a complete description of all the elements and features of a typical memory device.
- FIG. 2 illustrates a simplified portion of a NAND flash memory array of one embodiment of FIG. 1 .
- NAND Flash uses tunnel injection for writing and tunnel release for erasing.
- the NAND memory includes floating gate memory cells 220 coupled to source line 224 , word lines 226 and a bit line 230 .
- the cells are coupled in series between the bit line and source line.
- One or more bit line select transistors 240 are used to selectively isolate the cells from the bit and source lines.
- a word line of a target (selected) memory cell can be maintained at a low voltage level. All unselected cell word lines are coupled to a voltage sufficiently high to activate the unselected cells regardless of their floating gate charge. If the selected cell has an uncharged floating gate, it is activated. The bit line and source line are then coupled through the series of memory cells. If the selected cell has a charged floating gate, it will not activate. The bit line and source lines, therefore, are not coupled through the series of memory cells.
- bit line coupling can be a problem during reading/sensing operations. That is, the length and close spacing of adjacent bit lines results in voltage noise on bit lines.
- floating gate to floating gate coupling of adjacent rows, or pages, of memory cells can influence data storage and reading.
- Prior art light imager sensors often use data levels from neighboring pixels to interpolate a pixel level for a specific pixel. That is, one pixel is typically not independent of a neighboring pixel in that light does not abruptly change from pixel to pixel, but has a change gradient.
- Embodiments of the present invention recognize that although memory cell data can abruptly change from cell to cell, the close physical proximity of cells can be used advantageously to evaluate data which may have been altered by neighboring cells.
- the memory device accesses an identified target cell, row, or page, of the memory array.
- the memory accesses one or more physically adjacent cells or rows of the array.
- the multiple rows of data are used to evaluate the data of the identified cells and possible data influences from the cells of adjacent row(s). It will be appreciated that the adjacent row(s) are based on physical location and not necessarily address proximity. For example, adjacent rows of a NAND memory array are typically assigned to different addressable pages.
- the multiple pages of data are weighted and used to evaluate a page of data.
- the weighting function can be performed using a fixed weight value or custom weight functions.
- the memory device is tested and custom (device specific) weighting data, or matrix, is calculated based upon actual memory cell influences.
- the weighting data can be stored in the memory device, such as in weighting register 130 of FIG. 1 , or in an external location such as register 140 with processor 120 .
- the weighting data when reading a row of data, can be applied to the accessed data by the memory device prior to outputting the data. In another embodiment, the weighting data is read from the memory to be applied by the external processor.
- FIG. 3 An example read operation is described with reference to the array 102 of FIG. 3 .
- the array illustrated is one embodiment of the memory of FIG. 1 and is simplified to illustrate array data pages of embodiments of the invention and not actual physical construction of the array.
- the memory accesses pages P N , P N+1 and P N ⁇ 4 where P N+1 and P N ⁇ 1 are physically adjacent to page P N . If P N is located at an array edge with only one adjacent page, that page P N ⁇ 1 is accessed.
- the data value for a specified cell can be evaluated.
- the following examples illustrate some of the possible way to evaluate the data.
- Weighted P N ( i ) P N ( i )+ W ⁇ 1 P N ⁇ 1 ( i )+ W +1 P N+1 ( i ), where P N (i) is the i th cell in the P N page, W ⁇ 1 is the weight value applied to cells of page P N ⁇ 1 and W +1 is the weight value applied to cells of page P N+1 .
- Weighted P N ( i ) P N ( i )+ W ⁇ 1 P N ⁇ 1 ( i )+ W +1 P N+1 ( i )+ W A P N ( i ⁇ 1)+ W B P N ( i+ 1), where W A is the weight value applied an adjacent cell P N (i ⁇ 1) on page P N and W B is the weight value applied another adjacent cell P N (i+1).
- Weighted P N ( i ) P N ( i )+ W ⁇ 2 P N ⁇ 2 ( i )+ W ⁇ 1 P N ⁇ 1 ( i )+ W +2 P N+2 ( i )+ W +1 P N+1 ( i )+ W A P N ( i ⁇ 1)+ W B P N ( i+ 1).
- Weighted P N ( i ) P N ( i )+[ W ⁇ 1 P N ⁇ 1 ( i )+ W A ⁇ 1 P N ⁇ 1 ( i ⁇ 1)+ W B+1 P N ⁇ 1 ( i+ 1)]+[W +1 P N+1 ( i )+ W A ⁇ 1 P N+1 ( i ⁇ 1)+ W B+1 P N+1 ( i+ 1)], where W A ⁇ 1 is a weight value applied to cells P N ⁇ 1 (i ⁇ 1) and P N+1 (i ⁇ 1) of adjacent pages and W B+1 is a weight value applied to cells P N ⁇ 1 (i+1) and P N+1 (i+1).
- the above examples illustrate different weighting equations that can be applied to evaluate data in a non-volatile memory device.
- the evaluation can include determining an influence factor of a second array page upon a first array page. It will be appreciated by those skilled in the art with the benefit of the present description that additional equations can be formulated. The invention is therefore not limited to these specific examples.
- a non-volatile memory device has been described that provides increased output data to help evaluate data errors from bit line coupling and floating gate coupling. Multiple rows, or pages, of data are read to allow an internal or external decoder to evaluate memory cell data.
Landscapes
- Read Only Memory (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Abstract
Description
- The present invention relates to non-volatile memory devices and, more particularly, to flash memory devices.
- Flash memory is non-volatile, which means that it stores information on a semiconductor in a way that does not need power to maintain the information in the chip. Flash memory stores information in an array of transistors called “cells,” each of which traditionally stores one or more bits of information. Current flash memory devices are made in two forms: NOR flash and NAND flash. The names refer to the type of logic used in the storage cell array.
- A flash cell is similar to a standard MOSFET transistor, except that it has two gates instead of just one. One gate is the control gate (CG) like in other MOS transistors, but the second is a floating gate (FG) that is insulated all around by an oxide layer. The FG is between the CG and the substrate. Because the FG is isolated by its insulating oxide layer, any electrons placed on it get trapped there and thus store the information.
- When electrons are trapped on the FG, they modify (partially cancel out) an electric field coming from the CG, which modifies the threshold voltage (Vt) of the cell. Thus, when the cell is “read” by placing a specific voltage on the CG, electrical current will either flow or not flow between the cell's source and drain connections, depending on the Vt of the cell. This presence or absence of current can be sensed and translated into 1's and 0's, reproducing the stored data.
- Memory cells of memory devices are typically arranged in an array with rows and columns. Generally, the rows are coupled via a word line conductor and the columns are coupled via a bit line conductor. During data read and write functions, voltage coupling between bit lines can influence proper memory operation. Further, close physical proximity of memory cells can result in floating gate to floating gate coupling. Again, coupling can influence proper memory operation and data accuracy.
- For reasons stated below which will become apparent to those skilled in the art upon reading and understanding the present specification, there is a need for methods and devices to read non-volatile memory devices.
-
FIG. 1 is a block diagram of a memory device according to embodiments of the present invention; -
FIG. 2 illustrates a simplified portion of a NAND flash memory array ofFIG. 1 ; and -
FIG. 3 illustrates a portion of an array ofFIG. 1 . - In the following detailed description of the invention, reference is made to the accompanying drawings which form a part hereof, and in which is shown, by way of illustration, different embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. Other embodiments may be utilized and structural, logical, and electrical changes may be made without departing from the scope of the present invention.
- As recognized by those skilled in the art, memory devices of the type described herein are generally fabricated as an integrated circuit containing a variety of semiconductor devices. The integrated circuit is supported by a substrate. Integrated circuits are typically repeated multiple times on each substrate. The substrate is further processed to separate the integrated circuits into dice, as is well known in the art. The figures are provided to help facilitate an understanding of the detailed description, are not intended to be accurate in scale, and have been simplified. The term conductor as used herein is intended to include conductors and semi-conductors, including but not limited to metals, metal alloy, doped silicon and polysilicon.
- The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims, along with the full scope of equivalents to which such claims are entitled.
-
FIG. 1 is a simplified block diagram of an integratedcircuit memory device 100 in accordance with an embodiment of the invention. Thememory device 100 includes an array of non-volatile floatinggate memory cells 102,address circuitry 104,control circuitry 110, and Input/Output (I/O)circuitry 114. The memory cells are also referred to as Flash memory cells because blocks of memory cells are typically erased concurrently, in a flash operation. - The
memory device 100 can be coupled to aprocessor 120 or other memory controller for accessing thememory array 102. Thememory device 100 coupled to aprocessor 120 forms part of an electronic system. Some examples of electronic systems include personal computers, peripheral devices, wireless devices, digital cameras, personal digital assistants (PDA's) and audio recorders. - The
memory device 100 receives control signals acrosscontrol lines 122 from theprocessor 120 to control access to thememory array 102 viacontrol circuitry 110. Access to thememory array 102 is directed to one or more target memory cells in response to address signals received acrossaddress lines 124. Once the array is accessed in response to the control signals and the address signals, data can be written to or read from the memory cells across data, DQ,lines 126. - In addition to general memory functions,
control circuit 110 performs a read operation on the memory cells. As explained below, the read operation can include accessing multiple rows or pages of data to allow for a more informed reading of data. - It will be appreciated by those skilled in the art that additional circuitry and control signals can be provided, and that the memory device of
FIG. 1 has been simplified to help focus on the invention. It will be understood that the above description of a memory device is intended to provide a general understanding of the memory and is not a complete description of all the elements and features of a typical memory device. -
FIG. 2 illustrates a simplified portion of a NAND flash memory array of one embodiment ofFIG. 1 . NAND Flash uses tunnel injection for writing and tunnel release for erasing. The NAND memory includes floatinggate memory cells 220 coupled to source line 224,word lines 226 and abit line 230. The cells are coupled in series between the bit line and source line. One or more bit lineselect transistors 240 are used to selectively isolate the cells from the bit and source lines. - In a read operation, a word line of a target (selected) memory cell can be maintained at a low voltage level. All unselected cell word lines are coupled to a voltage sufficiently high to activate the unselected cells regardless of their floating gate charge. If the selected cell has an uncharged floating gate, it is activated. The bit line and source line are then coupled through the series of memory cells. If the selected cell has a charged floating gate, it will not activate. The bit line and source lines, therefore, are not coupled through the series of memory cells.
- Because of the close proximity of the memory cells, bit line coupling can be a problem during reading/sensing operations. That is, the length and close spacing of adjacent bit lines results in voltage noise on bit lines. In addition to bit line coupling, floating gate to floating gate coupling of adjacent rows, or pages, of memory cells can influence data storage and reading. Prior art light imager sensors often use data levels from neighboring pixels to interpolate a pixel level for a specific pixel. That is, one pixel is typically not independent of a neighboring pixel in that light does not abruptly change from pixel to pixel, but has a change gradient. Embodiments of the present invention recognize that although memory cell data can abruptly change from cell to cell, the close physical proximity of cells can be used advantageously to evaluate data which may have been altered by neighboring cells.
- During a read operation, the memory device accesses an identified target cell, row, or page, of the memory array. In addition to the identified cell or row, the memory accesses one or more physically adjacent cells or rows of the array. The multiple rows of data are used to evaluate the data of the identified cells and possible data influences from the cells of adjacent row(s). It will be appreciated that the adjacent row(s) are based on physical location and not necessarily address proximity. For example, adjacent rows of a NAND memory array are typically assigned to different addressable pages.
- The multiple pages of data are weighted and used to evaluate a page of data. The weighting function can be performed using a fixed weight value or custom weight functions. In one embodiment, the memory device is tested and custom (device specific) weighting data, or matrix, is calculated based upon actual memory cell influences. The weighting data can be stored in the memory device, such as in
weighting register 130 ofFIG. 1 , or in an external location such asregister 140 withprocessor 120. - In one embodiment, when reading a row of data, the weighting data can be applied to the accessed data by the memory device prior to outputting the data. In another embodiment, the weighting data is read from the memory to be applied by the external processor.
- An example read operation is described with reference to the
array 102 ofFIG. 3 . The array illustrated is one embodiment of the memory ofFIG. 1 and is simplified to illustrate array data pages of embodiments of the invention and not actual physical construction of the array. In response to a read request for page PN, the memory accesses pages PN, PN+1 and PN−4 where PN+1 and PN−1 are physically adjacent to page PN. If PN is located at an array edge with only one adjacent page, that page PN−1 is accessed. - Using the data from two or more pages the data value for a specified cell can be evaluated. The following examples illustrate some of the possible way to evaluate the data.
- This example applies weight values to the adjacent pages to account for page to page coupling. The weighted value is calculated as:
Weighted P N(i)=P N(i)+W −1 P N−1(i)+W +1 P N+1(i),
where PN(i) is the ith cell in the PN page, W−1 is the weight value applied to cells of page PN−1 and W+1 is the weight value applied to cells of page PN+1. - This example applies weight values to the adjacent pages to account for page to page coupling and coupling within the page. The weighted value is calculated as:
Weighted P N(i)=P N(i)+W −1 P N−1(i)+W +1 P N+1(i)+W A P N(i−1)+W B P N(i+1),
where WA is the weight value applied an adjacent cell PN(i−1) on page PN and WB is the weight value applied another adjacent cell PN(i+1). - This example applies weight values to four adjacent pages to account for page to page coupling and coupling within the page. The weighted value is calculated as:
Weighted P N(i)=P N(i)+W −2 P N−2(i)+W −1 P N−1(i)+W +2 P N+2(i)+W +1 P N+1(i)+W A P N(i−1)+W B P N(i+1). - This example applies weight values to two adjacent pages to account for page to page coupling from multiple cells. The weighted value is calculated as:
Weighted P N(i)=P N(i)+[W −1 P N−1(i)+W A−1 P N−1(i−1)+W B+1 P N−1(i+1)]+[W+1 P N+1(i)+W A−1 P N+1(i−1)+W B+1 P N+1(i+1)],
where WA−1 is a weight value applied to cells PN−1(i−1) and PN+1(i−1) of adjacent pages and WB+1 is a weight value applied to cells PN−1(i+1) and PN+1(i+1). - The above examples illustrate different weighting equations that can be applied to evaluate data in a non-volatile memory device. The evaluation can include determining an influence factor of a second array page upon a first array page. It will be appreciated by those skilled in the art with the benefit of the present description that additional equations can be formulated. The invention is therefore not limited to these specific examples.
- A non-volatile memory device has been described that provides increased output data to help evaluate data errors from bit line coupling and floating gate coupling. Multiple rows, or pages, of data are read to allow an internal or external decoder to evaluate memory cell data.
- Although embodiments have been described with reference to specific example embodiments, it will be evident that various modifications and changes may be made to these embodiments without departing from the broader spirit and scope of the invention. Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense.
Claims (21)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/276,477 US7453723B2 (en) | 2006-03-01 | 2006-03-01 | Memory with weighted multi-page read |
US12/267,308 US7990763B2 (en) | 2006-03-01 | 2008-11-07 | Memory with weighted multi-page read |
US13/189,726 US8331143B2 (en) | 2006-03-01 | 2011-07-25 | Memory with multi-page read |
US13/686,488 US8670272B2 (en) | 2006-03-01 | 2012-11-27 | Memory with weighted multi-page read |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/276,477 US7453723B2 (en) | 2006-03-01 | 2006-03-01 | Memory with weighted multi-page read |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/267,308 Division US7990763B2 (en) | 2006-03-01 | 2008-11-07 | Memory with weighted multi-page read |
Publications (2)
Publication Number | Publication Date |
---|---|
US20070206434A1 true US20070206434A1 (en) | 2007-09-06 |
US7453723B2 US7453723B2 (en) | 2008-11-18 |
Family
ID=38471312
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/276,477 Active 2026-07-27 US7453723B2 (en) | 2006-03-01 | 2006-03-01 | Memory with weighted multi-page read |
US12/267,308 Active 2026-09-13 US7990763B2 (en) | 2006-03-01 | 2008-11-07 | Memory with weighted multi-page read |
US13/189,726 Active US8331143B2 (en) | 2006-03-01 | 2011-07-25 | Memory with multi-page read |
US13/686,488 Active US8670272B2 (en) | 2006-03-01 | 2012-11-27 | Memory with weighted multi-page read |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/267,308 Active 2026-09-13 US7990763B2 (en) | 2006-03-01 | 2008-11-07 | Memory with weighted multi-page read |
US13/189,726 Active US8331143B2 (en) | 2006-03-01 | 2011-07-25 | Memory with multi-page read |
US13/686,488 Active US8670272B2 (en) | 2006-03-01 | 2012-11-27 | Memory with weighted multi-page read |
Country Status (1)
Country | Link |
---|---|
US (4) | US7453723B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080037320A1 (en) * | 2006-08-14 | 2008-02-14 | Micron Technology, Inc. | Flash memory with multi-bit read |
US20090067249A1 (en) * | 2006-03-01 | 2009-03-12 | William Henry Radke | Memory with multi-page read |
US8429391B2 (en) | 2010-04-16 | 2013-04-23 | Micron Technology, Inc. | Boot partitions in memory devices and systems |
US8451664B2 (en) | 2010-05-12 | 2013-05-28 | Micron Technology, Inc. | Determining and using soft data in memory devices and systems |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7567455B2 (en) * | 2007-06-19 | 2009-07-28 | Micron Technology, Inc. | Method and system for programming non-volatile memory cells based on programming of proximate memory cells |
US7898863B2 (en) | 2007-08-01 | 2011-03-01 | Micron Technology, Inc. | Method, apparatus, and system for improved read operation in memory |
US7746691B2 (en) * | 2008-06-10 | 2010-06-29 | Micron Technology, Inc. | Methods and apparatus utilizing predicted coupling effect in the programming of non-volatile memory |
US8291294B2 (en) * | 2009-05-21 | 2012-10-16 | Seagate Technology Llc | Intersymbol interference encoding in a solid state drive |
US8018766B2 (en) * | 2009-05-29 | 2011-09-13 | Seagate Technology Llc | Concurrent intersymbol interference encoding in a solid state memory |
US8077515B2 (en) | 2009-08-25 | 2011-12-13 | Micron Technology, Inc. | Methods, devices, and systems for dealing with threshold voltage change in memory devices |
US8271697B2 (en) | 2009-09-29 | 2012-09-18 | Micron Technology, Inc. | State change in systems having devices coupled in a chained configuration |
US9595341B2 (en) | 2010-03-02 | 2017-03-14 | Samsung Electronics Co., Ltd. | Memory system to determine interference of a memory cell by adjacent memory cells, and operating method thereof |
KR101710663B1 (en) * | 2010-03-02 | 2017-02-28 | 삼성전자주식회사 | Memory system and operating method thereof |
US8464137B2 (en) | 2010-12-03 | 2013-06-11 | International Business Machines Corporation | Probabilistic multi-tier error correction in not-and (NAND) flash memory |
US8560922B2 (en) | 2011-03-04 | 2013-10-15 | International Business Machines Corporation | Bad block management for flash memory |
KR102089532B1 (en) | 2013-02-06 | 2020-03-16 | 삼성전자주식회사 | Memory controller, memory system and operating method of memory controller |
US9183940B2 (en) | 2013-05-21 | 2015-11-10 | Aplus Flash Technology, Inc. | Low disturbance, power-consumption, and latency in NAND read and program-verify operations |
WO2014210424A2 (en) | 2013-06-27 | 2014-12-31 | Aplus Flash Technology, Inc. | Novel nand array architecture for multiple simultaneous program and read |
WO2015013689A2 (en) | 2013-07-25 | 2015-01-29 | Aplus Flash Technology, Inc. | Nand array hiarchical bl structures for multiple-wl and all -bl simultaneous erase, erase-verify, program, program-verify, and read operations |
US9293205B2 (en) | 2013-09-14 | 2016-03-22 | Aplus Flash Technology, Inc | Multi-task concurrent/pipeline NAND operations on all planes |
US9613704B2 (en) | 2013-12-25 | 2017-04-04 | Aplus Flash Technology, Inc | 2D/3D NAND memory array with bit-line hierarchical structure for multi-page concurrent SLC/MLC program and program-verify |
WO2016014731A1 (en) | 2014-07-22 | 2016-01-28 | Aplus Flash Technology, Inc. | Yukai vsl-based vt-compensation for nand memory |
KR102318561B1 (en) | 2014-08-19 | 2021-11-01 | 삼성전자주식회사 | Storage device and operating method of storage device |
CN110327070B (en) * | 2019-07-12 | 2024-07-12 | 山东大骋医疗科技有限公司 | CT apparatus with energy storage system |
Citations (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2717315A (en) * | 1950-11-28 | 1955-09-06 | Hartford Nat Bank & Trust Co | X-ray apparatus |
US5077737A (en) * | 1989-08-18 | 1991-12-31 | Micron Technology, Inc. | Method and apparatus for storing digital data in off-specification dynamic random access memory devices |
US5646835A (en) * | 1995-11-20 | 1997-07-08 | General Electric Company | Series resonant converter |
US5754567A (en) * | 1996-10-15 | 1998-05-19 | Micron Quantum Devices, Inc. | Write reduction in flash memory systems through ECC usage |
US5787484A (en) * | 1996-08-08 | 1998-07-28 | Micron Technology, Inc. | System and method which compares data preread from memory cells to data to be written to the cells |
US5815458A (en) * | 1996-09-06 | 1998-09-29 | Micron Technology, Inc. | System and method for writing data to memory cells so as to enable faster reads of the data using dual wordline drivers |
US5854800A (en) * | 1995-06-07 | 1998-12-29 | Micron Technlogy, Inc. | Method and apparatus for a high speed cyclical redundancy check system |
US5864569A (en) * | 1996-10-18 | 1999-01-26 | Micron Technology, Inc. | Method and apparatus for performing error correction on data read from a multistate memory |
US5910921A (en) * | 1997-04-22 | 1999-06-08 | Micron Technology, Inc. | Self-test of a memory device |
US5923682A (en) * | 1997-01-29 | 1999-07-13 | Micron Technology, Inc. | Error correction chip for memory applications |
US5925138A (en) * | 1997-03-04 | 1999-07-20 | Micron Electronics, Inc. | Method for allowing data transfers with a memory having defective storage locations |
US6034891A (en) * | 1997-12-01 | 2000-03-07 | Micron Technology, Inc. | Multi-state flash memory defect management |
US6076182A (en) * | 1996-12-16 | 2000-06-13 | Micron Electronics, Inc. | Memory fault correction system and method |
US6112314A (en) * | 1996-10-24 | 2000-08-29 | Micron Technology, Inc. | Apparatus and method for detecting over-programming condition in multistate memory device |
US6141247A (en) * | 1997-10-24 | 2000-10-31 | Micron Technology, Inc. | Non-volatile data storage unit and method of controlling same |
US6279072B1 (en) * | 1999-07-22 | 2001-08-21 | Micron Technology, Inc. | Reconfigurable memory with selectable error correction storage |
US20010023475A1 (en) * | 1996-06-13 | 2001-09-20 | Micron Technology, Inc. | Word selection logic to implement an 80 or 96-bit cache SRAM |
US6331948B2 (en) * | 1999-12-09 | 2001-12-18 | Kabushiki Kaisha Toshiba | Error correcting circuit for making efficient error correction, and involatile semiconductor memory device incorporating the same error correcting circuit |
US6381672B1 (en) * | 2000-05-11 | 2002-04-30 | Advanced Micro Devices, Inc. | Speculative opening of a new page when approaching page boundary during read/write of isochronous streams |
US20020070941A1 (en) * | 2000-12-13 | 2002-06-13 | Peterson James R. | Memory system having programmable multiple and continuous memory regions and method of use thereof |
US20030041210A1 (en) * | 2001-08-24 | 2003-02-27 | Micron Technology, Inc. | Erase block management |
US20030067472A1 (en) * | 2001-10-09 | 2003-04-10 | William Radke | Embedded memory system and method including data error correction |
US20030115538A1 (en) * | 2001-12-13 | 2003-06-19 | Micron Technology, Inc. | Error correction in ROM embedded DRAM |
US6657899B2 (en) * | 2000-06-30 | 2003-12-02 | Micron Technology, Inc. | Flash memory with multiple status reading capability |
US6674836B2 (en) * | 2000-01-17 | 2004-01-06 | Kabushiki Kaisha Toshiba | X-ray computer tomography apparatus |
US6728825B1 (en) * | 1996-10-15 | 2004-04-27 | Micron Technology, Inc. | Apparatus and method for reducing programming cycles for multistate memory system |
US6734865B1 (en) * | 2000-12-13 | 2004-05-11 | Micron Technology, Inc. | Method and system for mapping various length data regions |
US6775168B1 (en) * | 2002-04-10 | 2004-08-10 | Integrated Device Technology, Inc. | Content addressable memory (CAM) devices having adjustable match line precharge circuits therein |
US6784889B1 (en) * | 2000-12-13 | 2004-08-31 | Micron Technology, Inc. | Memory system and method for improved utilization of read and write bandwidth of a graphics processing system |
US6838331B2 (en) * | 2002-04-09 | 2005-01-04 | Micron Technology, Inc. | Method and system for dynamically operating memory in a power-saving error correction mode |
US6870774B2 (en) * | 2002-12-10 | 2005-03-22 | Micron, Technology, Inc. | Flash memory architecture for optimizing performance of memory having multi-level memory cells |
US6883044B1 (en) * | 2000-07-28 | 2005-04-19 | Micron Technology, Inc. | Synchronous flash memory with simultaneous access to one or more banks |
US6906691B2 (en) * | 2000-12-26 | 2005-06-14 | Samsung Electronics Co., Ltd. | LCD device and a method for reducing flickers |
US20050172207A1 (en) * | 2004-01-30 | 2005-08-04 | Radke William H. | Error detection and correction scheme for a memory device |
US20050268203A1 (en) * | 2004-05-26 | 2005-12-01 | Micron Technology, Inc. | Erasure pointer error correction |
US6975698B2 (en) * | 2003-06-30 | 2005-12-13 | General Electric Company | X-ray generator and slip ring for a CT system |
US6982900B2 (en) * | 2004-02-05 | 2006-01-03 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit device |
US6987684B1 (en) * | 2003-07-15 | 2006-01-17 | Integrated Device Technology, Inc. | Content addressable memory (CAM) devices having multi-block error detection logic and entry selective error correction logic therein |
US6999376B2 (en) * | 2000-08-25 | 2006-02-14 | Micron Technology, Inc. | Burst read addressing in a non-volatile memory device |
US20060248434A1 (en) * | 2005-04-28 | 2006-11-02 | Micron Technology, Inc. | Non-systematic coded error correction |
US7196928B2 (en) * | 2005-04-05 | 2007-03-27 | Sandisk Corporation | Compensating for coupling during read operations of non-volatile memory |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3999822B2 (en) * | 1993-12-28 | 2007-10-31 | 株式会社東芝 | Storage system |
US5909449A (en) * | 1997-09-08 | 1999-06-01 | Invox Technology | Multibit-per-cell non-volatile memory with error detection and correction |
US5867429A (en) * | 1997-11-19 | 1999-02-02 | Sandisk Corporation | High density non-volatile flash memory without adverse effects of electric field coupling between adjacent floating gates |
JP2001014269A (en) * | 1999-06-29 | 2001-01-19 | Toshiba Corp | Computer system |
JP4184586B2 (en) | 2000-09-28 | 2008-11-19 | 株式会社東芝 | Semiconductor memory device |
US6757193B2 (en) | 2001-05-31 | 2004-06-29 | Macronix International Co., Ltd. | Coding method of multi-level memory cell |
US6542407B1 (en) * | 2002-01-18 | 2003-04-01 | Sandisk Corporation | Techniques of recovering data from memory cells affected by field coupling with adjacent memory cells |
US6870749B1 (en) | 2003-07-15 | 2005-03-22 | Integrated Device Technology, Inc. | Content addressable memory (CAM) devices with dual-function check bit cells that support column redundancy and check bit cells with reduced susceptibility to soft errors |
US7372730B2 (en) * | 2004-01-26 | 2008-05-13 | Sandisk Corporation | Method of reading NAND memory to compensate for coupling between storage elements |
US7443726B2 (en) * | 2005-12-29 | 2008-10-28 | Sandisk Corporation | Systems for alternate row-based reading and writing for non-volatile memory |
US7453723B2 (en) | 2006-03-01 | 2008-11-18 | Micron Technology, Inc. | Memory with weighted multi-page read |
JP4896605B2 (en) | 2006-07-04 | 2012-03-14 | 株式会社東芝 | Nonvolatile semiconductor memory system |
US7369434B2 (en) * | 2006-08-14 | 2008-05-06 | Micron Technology, Inc. | Flash memory with multi-bit read |
-
2006
- 2006-03-01 US US11/276,477 patent/US7453723B2/en active Active
-
2008
- 2008-11-07 US US12/267,308 patent/US7990763B2/en active Active
-
2011
- 2011-07-25 US US13/189,726 patent/US8331143B2/en active Active
-
2012
- 2012-11-27 US US13/686,488 patent/US8670272B2/en active Active
Patent Citations (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2717315A (en) * | 1950-11-28 | 1955-09-06 | Hartford Nat Bank & Trust Co | X-ray apparatus |
US5077737A (en) * | 1989-08-18 | 1991-12-31 | Micron Technology, Inc. | Method and apparatus for storing digital data in off-specification dynamic random access memory devices |
US5854800A (en) * | 1995-06-07 | 1998-12-29 | Micron Technlogy, Inc. | Method and apparatus for a high speed cyclical redundancy check system |
US5646835A (en) * | 1995-11-20 | 1997-07-08 | General Electric Company | Series resonant converter |
US20010023475A1 (en) * | 1996-06-13 | 2001-09-20 | Micron Technology, Inc. | Word selection logic to implement an 80 or 96-bit cache SRAM |
US5787484A (en) * | 1996-08-08 | 1998-07-28 | Micron Technology, Inc. | System and method which compares data preread from memory cells to data to be written to the cells |
US5815458A (en) * | 1996-09-06 | 1998-09-29 | Micron Technology, Inc. | System and method for writing data to memory cells so as to enable faster reads of the data using dual wordline drivers |
US5754567A (en) * | 1996-10-15 | 1998-05-19 | Micron Quantum Devices, Inc. | Write reduction in flash memory systems through ECC usage |
US6728825B1 (en) * | 1996-10-15 | 2004-04-27 | Micron Technology, Inc. | Apparatus and method for reducing programming cycles for multistate memory system |
US6178537B1 (en) * | 1996-10-18 | 2001-01-23 | Micron Technology, Inc. | Method and apparatus for performing error correction on data read from a multistate memory |
US5864569A (en) * | 1996-10-18 | 1999-01-26 | Micron Technology, Inc. | Method and apparatus for performing error correction on data read from a multistate memory |
US6112314A (en) * | 1996-10-24 | 2000-08-29 | Micron Technology, Inc. | Apparatus and method for detecting over-programming condition in multistate memory device |
US6076182A (en) * | 1996-12-16 | 2000-06-13 | Micron Electronics, Inc. | Memory fault correction system and method |
US5923682A (en) * | 1997-01-29 | 1999-07-13 | Micron Technology, Inc. | Error correction chip for memory applications |
US5935258A (en) * | 1997-03-04 | 1999-08-10 | Micron Electronics, Inc. | Apparatus for allowing data transfers with a memory having defective storage locations |
US5925138A (en) * | 1997-03-04 | 1999-07-20 | Micron Electronics, Inc. | Method for allowing data transfers with a memory having defective storage locations |
US5910921A (en) * | 1997-04-22 | 1999-06-08 | Micron Technology, Inc. | Self-test of a memory device |
US6141247A (en) * | 1997-10-24 | 2000-10-31 | Micron Technology, Inc. | Non-volatile data storage unit and method of controlling same |
US6034891A (en) * | 1997-12-01 | 2000-03-07 | Micron Technology, Inc. | Multi-state flash memory defect management |
US6279072B1 (en) * | 1999-07-22 | 2001-08-21 | Micron Technology, Inc. | Reconfigurable memory with selectable error correction storage |
US6331948B2 (en) * | 1999-12-09 | 2001-12-18 | Kabushiki Kaisha Toshiba | Error correcting circuit for making efficient error correction, and involatile semiconductor memory device incorporating the same error correcting circuit |
US6674836B2 (en) * | 2000-01-17 | 2004-01-06 | Kabushiki Kaisha Toshiba | X-ray computer tomography apparatus |
US6381672B1 (en) * | 2000-05-11 | 2002-04-30 | Advanced Micro Devices, Inc. | Speculative opening of a new page when approaching page boundary during read/write of isochronous streams |
US6657899B2 (en) * | 2000-06-30 | 2003-12-02 | Micron Technology, Inc. | Flash memory with multiple status reading capability |
US6883044B1 (en) * | 2000-07-28 | 2005-04-19 | Micron Technology, Inc. | Synchronous flash memory with simultaneous access to one or more banks |
US6999376B2 (en) * | 2000-08-25 | 2006-02-14 | Micron Technology, Inc. | Burst read addressing in a non-volatile memory device |
US20020070941A1 (en) * | 2000-12-13 | 2002-06-13 | Peterson James R. | Memory system having programmable multiple and continuous memory regions and method of use thereof |
US6784889B1 (en) * | 2000-12-13 | 2004-08-31 | Micron Technology, Inc. | Memory system and method for improved utilization of read and write bandwidth of a graphics processing system |
US6734865B1 (en) * | 2000-12-13 | 2004-05-11 | Micron Technology, Inc. | Method and system for mapping various length data regions |
US6906691B2 (en) * | 2000-12-26 | 2005-06-14 | Samsung Electronics Co., Ltd. | LCD device and a method for reducing flickers |
US20030041210A1 (en) * | 2001-08-24 | 2003-02-27 | Micron Technology, Inc. | Erase block management |
US20040183808A1 (en) * | 2001-10-09 | 2004-09-23 | William Radke | Embedded memory system and method including data error correction |
US6741253B2 (en) * | 2001-10-09 | 2004-05-25 | Micron Technology, Inc. | Embedded memory system and method including data error correction |
US20030067472A1 (en) * | 2001-10-09 | 2003-04-10 | William Radke | Embedded memory system and method including data error correction |
US20030115538A1 (en) * | 2001-12-13 | 2003-06-19 | Micron Technology, Inc. | Error correction in ROM embedded DRAM |
US6838331B2 (en) * | 2002-04-09 | 2005-01-04 | Micron Technology, Inc. | Method and system for dynamically operating memory in a power-saving error correction mode |
US6775168B1 (en) * | 2002-04-10 | 2004-08-10 | Integrated Device Technology, Inc. | Content addressable memory (CAM) devices having adjustable match line precharge circuits therein |
US6870774B2 (en) * | 2002-12-10 | 2005-03-22 | Micron, Technology, Inc. | Flash memory architecture for optimizing performance of memory having multi-level memory cells |
US6975698B2 (en) * | 2003-06-30 | 2005-12-13 | General Electric Company | X-ray generator and slip ring for a CT system |
US6987684B1 (en) * | 2003-07-15 | 2006-01-17 | Integrated Device Technology, Inc. | Content addressable memory (CAM) devices having multi-block error detection logic and entry selective error correction logic therein |
US20050172207A1 (en) * | 2004-01-30 | 2005-08-04 | Radke William H. | Error detection and correction scheme for a memory device |
US6982900B2 (en) * | 2004-02-05 | 2006-01-03 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit device |
US20050268203A1 (en) * | 2004-05-26 | 2005-12-01 | Micron Technology, Inc. | Erasure pointer error correction |
US7196928B2 (en) * | 2005-04-05 | 2007-03-27 | Sandisk Corporation | Compensating for coupling during read operations of non-volatile memory |
US20060248434A1 (en) * | 2005-04-28 | 2006-11-02 | Micron Technology, Inc. | Non-systematic coded error correction |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7990763B2 (en) | 2006-03-01 | 2011-08-02 | Micron Technology, Inc. | Memory with weighted multi-page read |
US8670272B2 (en) | 2006-03-01 | 2014-03-11 | Micron Technology, Inc. | Memory with weighted multi-page read |
US8331143B2 (en) | 2006-03-01 | 2012-12-11 | Micron Technology, Inc. | Memory with multi-page read |
US20090067249A1 (en) * | 2006-03-01 | 2009-03-12 | William Henry Radke | Memory with multi-page read |
US7738292B2 (en) | 2006-08-14 | 2010-06-15 | Micron Technology, Inc. | Flash memory with multi-bit read |
US20100238726A1 (en) * | 2006-08-14 | 2010-09-23 | William Henry Radke | Flash memory with multi-bit read |
US20080037320A1 (en) * | 2006-08-14 | 2008-02-14 | Micron Technology, Inc. | Flash memory with multi-bit read |
US8189387B2 (en) | 2006-08-14 | 2012-05-29 | Micron Technology, Inc. | Flash memory with multi-bit read |
US20080215930A1 (en) * | 2006-08-14 | 2008-09-04 | Micron Technology, Inc. | Flash memory with multi-bit read |
US7369434B2 (en) | 2006-08-14 | 2008-05-06 | Micron Technology, Inc. | Flash memory with multi-bit read |
US8429391B2 (en) | 2010-04-16 | 2013-04-23 | Micron Technology, Inc. | Boot partitions in memory devices and systems |
US8762703B2 (en) | 2010-04-16 | 2014-06-24 | Micron Technology, Inc. | Boot partitions in memory devices and systems |
US9342371B2 (en) | 2010-04-16 | 2016-05-17 | Micron Technology, Inc. | Boot partitions in memory devices and systems |
US8451664B2 (en) | 2010-05-12 | 2013-05-28 | Micron Technology, Inc. | Determining and using soft data in memory devices and systems |
US9177659B2 (en) | 2010-05-12 | 2015-11-03 | Micron Technology, Inc. | Determining and using soft data in memory devices and systems |
US9293214B2 (en) | 2010-05-12 | 2016-03-22 | Micron Technology, Inc. | Determining and using soft data in memory devices and systems |
Also Published As
Publication number | Publication date |
---|---|
US7990763B2 (en) | 2011-08-02 |
US20130083605A1 (en) | 2013-04-04 |
US20090067249A1 (en) | 2009-03-12 |
US7453723B2 (en) | 2008-11-18 |
US8670272B2 (en) | 2014-03-11 |
US8331143B2 (en) | 2012-12-11 |
US20110280080A1 (en) | 2011-11-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7453723B2 (en) | Memory with weighted multi-page read | |
US7751242B2 (en) | NAND memory device and programming methods | |
US8189387B2 (en) | Flash memory with multi-bit read | |
US8400840B2 (en) | NAND memory device and programming methods | |
US8040732B2 (en) | NAND memory device column charging | |
US20200194070A1 (en) | Apparatus and methods for programming memory cells using multi-step programming pulses | |
US11776633B2 (en) | Apparatus and methods for determining data states of memory cells | |
US20210202020A1 (en) | Apparatus for determining a pass voltage of a read operation | |
CN113228188B (en) | Memory device and program operation thereof | |
WO2007013154A1 (en) | Semiconductor device and method for controlling the same | |
US11694753B2 (en) | Memory cell sensing | |
JPWO2006035502A1 (en) | Semiconductor device and data reading method | |
JP2004362665A (en) | Nonvolatile semiconductor memory device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: MICRON TECHNOLOGY, INC., IDAHO Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:RADKE, WILLIAM HENRY;REEL/FRAME:017237/0649 Effective date: 20060126 |
|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
AS | Assignment |
Owner name: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT, CALIFORNIA Free format text: SECURITY INTEREST;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:038669/0001 Effective date: 20160426 Owner name: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGEN Free format text: SECURITY INTEREST;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:038669/0001 Effective date: 20160426 |
|
AS | Assignment |
Owner name: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT, MARYLAND Free format text: PATENT SECURITY AGREEMENT;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:038954/0001 Effective date: 20160426 Owner name: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL Free format text: PATENT SECURITY AGREEMENT;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:038954/0001 Effective date: 20160426 |
|
AS | Assignment |
Owner name: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT, CALIFORNIA Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:043079/0001 Effective date: 20160426 Owner name: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGEN Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:043079/0001 Effective date: 20160426 |
|
AS | Assignment |
Owner name: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT, ILLINOIS Free format text: SECURITY INTEREST;ASSIGNORS:MICRON TECHNOLOGY, INC.;MICRON SEMICONDUCTOR PRODUCTS, INC.;REEL/FRAME:047540/0001 Effective date: 20180703 Owner name: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT, IL Free format text: SECURITY INTEREST;ASSIGNORS:MICRON TECHNOLOGY, INC.;MICRON SEMICONDUCTOR PRODUCTS, INC.;REEL/FRAME:047540/0001 Effective date: 20180703 |
|
AS | Assignment |
Owner name: MICRON TECHNOLOGY, INC., IDAHO Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT;REEL/FRAME:047243/0001 Effective date: 20180629 |
|
AS | Assignment |
Owner name: MICRON TECHNOLOGY, INC., IDAHO Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT;REEL/FRAME:050937/0001 Effective date: 20190731 |
|
AS | Assignment |
Owner name: MICRON TECHNOLOGY, INC., IDAHO Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT;REEL/FRAME:051028/0001 Effective date: 20190731 Owner name: MICRON SEMICONDUCTOR PRODUCTS, INC., IDAHO Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT;REEL/FRAME:051028/0001 Effective date: 20190731 |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 12TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1553); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 12 |