US20070032097A1 - Method and apparatus for processing semiconductor work pieces - Google Patents
Method and apparatus for processing semiconductor work pieces Download PDFInfo
- Publication number
- US20070032097A1 US20070032097A1 US11/441,291 US44129106A US2007032097A1 US 20070032097 A1 US20070032097 A1 US 20070032097A1 US 44129106 A US44129106 A US 44129106A US 2007032097 A1 US2007032097 A1 US 2007032097A1
- Authority
- US
- United States
- Prior art keywords
- processing
- processing apparatus
- shaft
- coolant
- passageway
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4584—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
Definitions
- the present apparatus relates to a method and apparatus for processing semiconductor work pieces, and more specifically to an apparatus which includes multiple processing chambers for processing a plurality of semiconductor work pieces, and multiple processing stations within each of the multiple processing chambers.
- the first type of system is a batch processing system; while the second type of system which is commonly used processes single semiconductor work pieces.
- semiconductor work pieces are typically oriented in either a horizontal or vertical orientation, and are thereafter processed at the same time.
- single piece semiconductor processing systems have many advantages including producing uniform semiconductor products, they also have numerous shortcomings including low throughput; high overhead operating costs; and problems achieving uniform heating of the semiconductor work pieces that are being processed. These long recognized problems associated with single piece processing devices have yet to be overcome.
- a second, heating pedestal 13 Positioned below and in spaced relation relative to the carbon pedestal there is a second, heating pedestal 13 . Located within the heating pedestal there is a high frequency heating coil 14 which is operable to impart heat energy to the silicon substrate 11 . During processing, the carbon pedestal 12 can rotate around a central shaft together with the carbon pedestal support 15 . This arrangement has been utilized to try to insure uniform temperature processing.
- the semiconductor processing apparatus 20 includes a rotatable semiconductor work piece carrier 21 which is positioned within a processing chamber 22 .
- a semiconductor work piece 23 is placed on the semiconductor work piece carrier 21 .
- the semiconductor work piece carrier 21 rotates around a shaft 24 .
- a heating pedestal 25 is provided which is stationary, and located in a position which is closely adjacent thereto.
- a small passageway 26 is defined between the semiconductor work piece carrier 21 , and the adjacent reaction chamber 22 .
- the semiconductor work piece carrier is rotated while gas is simultaneously delivered to the reaction chamber and flows horizontally, outwardly along the passageway 26 . This arrangement attempts to provide uniform film growth on the semiconductor work piece 23 during processing.
- a first aspect of the present invention relates to a processing apparatus for semiconductor work pieces which includes a processing chamber having an internal cavity and which has a plurality of rotatable processing stations within the internal cavity, and which are each operable to process a semiconductor work piece.
- Another aspect of the present invention relates to a processing apparatus for semiconductor work pieces, and which includes a chamber defining an internal cavity; a plurality of rotatable and heated processing stations received in the internal cavity, and which are each operable to process a semiconductor work piece; and wherein at least two of the processing stations rotate in a substantially synchronous fashion so as to facilitate the substantially uniform processing of the semiconductor work pieces; and a motor drivingly coupled to the at least two of the rotatable and heated processing stations, and which facilitates the synchronous rotation of the at least two processing stations.
- a processing apparatus for semiconductor work pieces which includes a processing chamber having an internal cavity, and which has a plurality of rotatable processing stations within the internal cavity, and which are each operable to process a semiconductor work piece; a platform rotation mechanism individually cooperating with each of the rotatable processing stations, and positioned below each of the processing stations, and wherein the platform rotation mechanism rotates and heats the respective processing stations, and wherein the respective processing stations each define a passageway which extends therethrough, and which will accommodate electrical signal inputs; and a sealing member is borne by the processing chamber, and which facilitates the formation of an airtight environment within the internal cavity of the processing chamber.
- Still another aspect of the present invention relates to a processing apparatus for semiconductor work pieces and which includes a processing chamber having an internal cavity and which has a plurality of rotatable processing stations within the internal cavity, and which are each operable to process a semiconductor work piece, and wherein each of the plurality of rotatable processing stations can move upwardly, downwardly and/or rotate relative to the processing chamber; sealing assemblies mounted on the processing chamber and which maintain the internal cavity of the processing chamber substantially sealed while the rotatable processing stations move upwardly, downwardly and rotate; and a cooling apparatus for cooling the sealing assemblies to facilitate the proper operation of the sealing assemblies.
- Still another aspect of the present invention relates to a method for processing semiconductor work pieces which includes the steps of providing a processing chamber having an internal cavity; providing a plurality of processing stations within the internal cavity of the processing chamber; positioning individual semiconductor work pieces on each of the individual processing stations; and rotating and heating the individual processing stations so as to facilitate the effective processing of the semiconductor work pieces within the internal cavity of the processing chamber.
- FIG. 1 is a greatly simplified schematic diagram of an existing prior art processing apparatus for semiconductor work pieces.
- FIG. 2 is a second, greatly simplified schematic diagram of a second processing apparatus for semiconductor work pieces.
- FIG. 3 is a perspective, fragmentary view of the processing apparatus for semiconductor work pieces of the present invention.
- FIG. 4 is a fragmentary, side elevation view of the processing apparatus for semiconductor work pieces of the present invention.
- FIG. 5 is a second, fragmentary, side elevation view of the processing apparatus for semiconductor work pieces of the present invention, and which is taken from a position opposite to that seen in FIG. 4 .
- FIG. 6 is fragmentary, side elevation view of a single processing station which is useful in the present invention.
- FIG. 7 is a transverse, vertical sectional view of a processing station useful in the present invention, and which is taken from a position along line 7 - 7 of FIG. 6 .
- FIG. 8 is a fragmentary, greatly enlarged, transverse, sectional view taken from a position along line 7 - 7 of FIG. 6 .
- FIG. 9 is a longitudinal, vertical, sectional view taken through a portion of a shaft which is useful in the processing stations employed in the present invention.
- FIG. 10 is a longitudinal, vertical, sectional view which is taken from a position along line 10 - 10 of FIG. 9 .
- FIG. 11 is a fragmentary, greatly simplified view of the cooling passageways which are provided in the present invention. Some underlying surfaces are shown in phantom lines.
- FIG. 12 is a fragmentary, perspective, longitudinal, vertical, sectional view taken from a position along line 12 - 12 of FIG. 7 . Some supporting structures have been removed to illustrate the structure thereof.
- FIG. 13 is a fragmentary, longitudinal, vertical sectional view taken through a bellow which is useful in the present invention.
- FIG. 14 illustrates one possible form of a semiconductor processing system which may employ the apparatus of the present invention.
- FIG. 15 illustrates an arrangement which rotates the adjoining processing stations of the present invention.
- the semiconductor processing system 30 has a processing chamber 31 having an internal cavity 33 and which is operable to receive a plurality of rotatable processing stations which are generally indicated by the numeral 32 .
- the plurality of rotatable processing stations 32 process individual semiconductor work pieces in a manner not possible, heretofore. Therefore, one aspect of the present invention relates to a semiconductor processing system 30 which mounts a plurality of rotatable processing stations 32 , and which are each operable to process semiconductor work pieces while simultaneously heating same.
- FIG. 3 one embodiment of the processing apparatus 40 for semiconductor work pieces of the present invention is shown. For purposes of clarity, only two processing stations 32 are illustrated. However, it will be recognized that the present invention is not limited to two processing stations but may have various numbers of processing stations depending upon the arrangement of the processing chamber 31 .
- the processing apparatus for semiconductor work pieces 40 has a vertically oriented rail 41 which is positioned adjacent to, and below, the processing chamber 31 as seen in FIG. 14 .
- the vertically oriented rail has a first or upper end 42 which is positioned adjacent to the processing chamber 31 , and an opposite, second or distal end 43 which is remote thereto.
- the vertically oriented rail 41 defines at least one rail slot 44 , and which defines a path of travel for various elements of the processing apparatus 40 which will be described in greater detail hereinafter.
- a plurality of substantially vertically oriented apertures are disposed in predetermined spaced relation along the vertically oriented rail 41 . These holes or apertures are operable to cooperate with other elements of the assembly as the assembly moves along the rail.
- the arrangement of the vertically oriented rail 41 is designed such that pressure on the whole mechanical arrangement as seen in FIG. 4 is substantially alleviated.
- the present processing apparatus 10 includes a support housing 50 defining an internal chamber 51 , and which is mounted on the second end 43 of the rail 40 .
- a first motor 52 is mounted on the support housing 50 , and has a drive shaft 53 which extends outwardly therefrom.
- a worm gear mechanism Positioned within the chamber 51 of the support housing 50 is a worm gear mechanism which is generally indicated by the numeral 54 .
- the worm gear mechanism 54 is coupled to a drive shaft 55 .
- the processing apparatus 40 includes a drive shaft receiving bracket 60 .
- the drive shaft receiving bracket has a first end 61 , and an opposite second end 62 through which the drive shaft 55 extends.
- a position sensor 63 is mounted on the rail 41 , and which is operable to sense the position of other elements in the processing apparatus as they move along the rail.
- a second motor 64 is mounted near the first end 42 of the vertically oriented rail 41 .
- the second motor 64 is moveably mounted to the rail by means of a motor mount 65 .
- a position sensor 66 is mounted on the motor mount 65 and is operable to provide relevant positional information for various assemblies of the processing apparatus 40 as will be described in greater detail in the paragraphs which follow.
- the processing apparatus of the present invention includes a first support member which is generally indicated by the numeral 70 , and which is mounted to the drive shaft receiving bracket 60 , and which supports at least two processing stations 32 .
- the first motor 52 which is provided, is drivingly coupled to the first support member 70 , and is operable to selectively and simultaneously move the at least two processing stations 32 along a substantially vertically disposed path of travel as will be described hereinafter.
- the first support member 70 has a top surface 71 , and an opposite bottom surface 72 .
- apertures or receiving stations 73 FIG. 3
- first support member 70 selectively moves along a vertically disposed path of travel which is generally indicated by the numeral 74 .
- first support member 70 includes rail slot engagement members (not shown), and which are individually mounted on each of the first and second support members, and which are matingly received in each of the vertically oriented rail slots 44 . These assemblies guide the respective first and second support members along the substantially vertically oriented path of travel 74 .
- the processing apparatus 40 of the present invention includes a second support member which is generally indicated by the numeral 80 , and which is mounted adjacent to, and below the processing chamber 31 .
- the second support member 80 is drivingly coupled to the second motor 64 which was earlier described.
- the second support member has a first or top surface 81 , and an opposite, second, or bottom surface 82 .
- a pair of apertures 83 are formed therein ( FIG. 3 ), and which are operable to cooperate with other assemblies which will be described below.
- sealing members 84 here illustrated in the form of bellows, are mounted on the top surface 81 .
- the sealing members 84 are each individually operable to receive or otherwise sealingly cooperate with an ejection rod 85 which is sealably contained therein.
- the ejection rods 85 are each operable to cooperate with individual lifting pins 86 .
- the lifting pins movably cooperate with a pedestal which will be described in greater detail below.
- the individual sealing members or bellows 84 are connected to the bottom of the processing chamber 31 . Still further, the engagement of the ejection rods 85 with the lifting pins 86 are effective for lifting a semiconductor work piece 87 , as seen in FIG. 4 , off of the accompanying pedestal so that they may be moved into, and out of, the processing chamber 31 .
- the second support member 80 cooperates with a plurality of sift pins 86 to move the respective lift pins upwardly and downwardly relative to the respective processing stations 32 .
- the second motor 64 is drivingly coupled to the second support member 80 and operable to selectively move the second support member 80 along a path of travel 88 so as to cause the reciprocal upward and downward movement of the respective lift pins 86 in each of the respective processing stations 32 .
- the position sensor 66 is electrically coupled to the second motor 64 , and is operable to control the same motor so as to move the second support member 80 upwardly and downwardly along the vertically oriented rail 41 so as to engage the lift pins in an appropriate fashion.
- the position sensor 66 is rendered operable so as to stop the second motor when the second support member 80 passes the sensor 64 thus insuring that the individual lift pins can only rise and descend within a certain range.
- the processing apparatus for semiconductor work pieces 40 of the present invention includes a rotating shaft which is generally indicated by the numeral 100 .
- the rotating shaft has a first, upper or proximal end 101 , and a second, lower, or distal end 102 . Still further, the shaft defines an inside facing surface 103 , and an outside facing surface 104 . A longitudinally disposed passageway 105 is defined by the inside facing surface, and extends between the first and second ends thereof.
- the rotatable shaft 100 defines a connecting block seat 110 which is positioned at the first end 101 thereof, and which is operable to receive a connecting block 110 A.
- the connecting block has a passageway which extends therethrough ( FIG. 8 ). Further, formed in the rotating shaft 100 is a first coolant passageway which is generally indicated by the numeral 111 .
- the first coolant passageway has a first intake end 112 , and a second exhaust end which is generally indicated by the numeral 113 .
- Disposed intermediate the first and second ends 112 and 113 is a first coolant slot 114 which is formed thereabout, and in substantially circumscribing relation relative to the first end 101 .
- the first coolant passageway 111 has a first portion 115 which extends longitudinally therealong the rotating shaft 100 .
- the first portion 115 has a first end 116 , which is coupled in fluid flowing relation relative to the coolant slot 114 , and an opposite, second end 117 which is remote thereto.
- a first aperture 120 is formed in the rotating shaft 100 and is operable to couple the first portion 115 to a source of coolant which will be described in greater detail, hereinafter.
- the first coolant passageway 111 includes a second portion 121 which extends longitudinally therealong the rotating shaft 100 .
- the second portion has a first end 122 , and an opposite second end 123 .
- a second aperture 124 is formed through the rotating shaft 100 and allows the second portion of the passageway to be coupled in fluid flowing relation relative to another assembly which will be discussed in greater detail below.
- a sprocket belt roller which is generally indicated by the numeral 130 .
- the sprocket belt roller is operable to matingly engage a drive belt which will be discussed in greater detail hereinafter.
- the sprocket belt roller is operable to impart rotational force from a motor which will be described below, to cause the rotational movement of the shaft 100 .
- the sprocket belt roller 130 defines a centrally disposed passageway 131 , and which will accommodate the passage of a plurality of electrical conduits.
- a spacer assembly 132 is positioned on the opposite side of the sprocket belt roller 130 , and further defines a passageway 133 which extends therethrough and which is substantially coaxially aligned relative to the passageway 131 defined by the belt roller 130 . Still further, a hub assembly 134 is provided and which is mounted on the spacer assembly 132 . The hub assembly 134 similarly defines a passageway 135 which extends therethrough. The hub assembly allows electrical conduits to pass therethrough, but prevents the electrical conduits from being entangled while the respective processing stations 32 rotate. Mounted endwardly of the hub assembly 134 is a signal amplifier 136 . The signal amplifier is coupled to other components of the processing apparatus which will be described also in the paragraphs which follow.
- the processing apparatus for semiconductor work pieces 40 of the present invention includes a supporting rod, conduit, or member 140 , and which extends substantially longitudinally outwardly relative to the first end 101 of the rotating shaft 100 .
- the supporting rod 140 has a first or proximal end 141 , and an opposite second or distal end 142 , which is affixed in an appropriate fashion to the first end 101 of the rotating shaft by means of the connecting block 110 A. This attachment may be facilitated by means of various conventional fasteners, not shown.
- the supporting rod has an inside facing surface 143 , and an outside facing surface 144 .
- the inside facing surface defines a longitudinally disposed passageway 145 which extends between the first and second ends; and which accommodates the passage of other conduits which will be described, below.
- a pair of sealing members which are generally indicated by the numeral 150 , are mounted on, or cooperate with, the connecting block 110 A, and which are operable to sealably couple the supporting rod 140 to the rotating shaft 100 .
- a seal 151 is positioned in substantially covering relation relative to the first coolant passageway 111 .
- a pair of wire pipes, or conduits 152 and 153 extend through the coaxially aligned and longitudinally disposed passageways 105 and 145 , respectively.
- the wire pipes, or conduits include a first wire pipe 152 which directs electrical conduits (not shown) to a heating unit or assembly such as a resistor wire which is located within the pedestal 154 (not shown); and a second wire pipe 153 which directs electrical conduits (not shown) to a temperature detection apparatus which is operable to detect the surface temperature of the accompanying pedestal 154 .
- the pedestal 154 which is mounted on the first end 141 of the supporting rod has a top supporting surface 155 which supports the semiconductor work piece 87 ( FIG. 4 ) within the processing chamber 31 for processing.
- the processing apparatus for semiconductor work pieces 40 of the present invention includes individual bellow seals 160 which are positioned within each of the processing stations 32 .
- the respective bellow seals 160 operate to insure that the connection between the supporting rod 140 , and the processing chamber 31 is substantially sealed.
- the bellow seal 160 sealably couples to the bottom of the processing chamber 31 in the manner as follows.
- FIG. 13 it will be seen that the bellow seal 160 has a main body 161 through which the supporting rod 140 extends.
- the respective bellow seals 160 are generally longitudinally symmetrically deformable, and further has a corrugated main body 161 which can be distorted with pressure and then restored to its original length once the pressure is removed.
- the respective bellow seals 160 are typically fabricated from a metal material such as stainless steel or the like.
- the main body 161 has a first end 162 , and an opposite second end 163 . Still further, a first circumscribing flange 164 is positioned at the first end 162 , and further, a second circumscribing flange 165 is positioned at the second end 163 . As seen, the main body 161 defines a longitudinally disposed passageway 166 through which the supporting rod 140 extends. Additionally, a sealing member 167 is positioned about, or otherwise cooperates with the first flange 164 , and is operable to substantially seal the first flange to the bottom of the processing chamber 31 .
- the first and second flanges 164 and 165 are fabricated from metal. Therefore, the first and second flanges 164 and 165 can be affixed to adjacent surfaces by welding and the like.
- the processing apparatus for semiconductor work pieces 40 of the present invention further includes a first outer shell which is generally indicated by the numeral 170 .
- the first outer shell has a first or upper end 171 to which the second end 163 of the bellow seal 160 is secured by welding or the like. Further, the first outer shell 170 has a second, or lower end 172 which is remote thereto.
- the first outer sell 170 has an inside facing surface 173 , and an outside facing surface 174 . As seen in the drawings, the first outer shell 170 is received in the apertures or receiving stations 73 which are defined by the first support member 70 .
- the inside facing surface 173 defines a longitudinally disposed passageway 175 which extends between the first and second ends 171 and 172 , and which telescopingly receives the rotatable shaft 100 .
- a sealing member 176 is positioned or otherwise received on the first end 171 , and is operable to seal thereagainst the second end 163 of the bellow 160 .
- the rotating shaft 100 which comprises a part of the platform rotation mechanism for rotating the semiconductor work piece 87 extends into the longitudinally disposed passageway 175 of the first outer shell and is rotatable relative thereto. As will be seen by reference to FIG.
- a pair of bearings 180 are mounted or otherwise received within the longitudinally disposed passageway 175 and are positioned such that respective bearings are positioned on or near the opposite ends thereof.
- the pair of bearings 180 facilitate rotation of the rotatable shaft member 100 as described earlier.
- a magnetic sealing component which is generally indicated by the numeral 181 , is positioned near the first or upper end 171 , and thereby sealingly couples the rotating shaft 100 relative to the first outer shell 170 .
- FIGS. 8 and 12 it will be seen that the first outer shell 170 , and more specifically the first end 171 thereof, defines, at least in part, a second coolant passageway 182 ( FIG. 12 ).
- the second coolant passageway includes a second coolant slot 183 which is positioned near the first end 171 , and which circumscribes same.
- the second coolant slot 183 has a first intake end 184 , and a second exhaust end 185 .
- an external exhaust conduit 186 is coupled in fluid flowing relation relative to the second exhaust end 185 ( FIG. 12 ).
- the second coolant passageway 182 which is formed in the first outer shell 170 is positioned, at least in part, near the magnetic sealing component 181 .
- the first and second coolant passageways 111 and 182 are coupled in fluid flowing relation one relative to the other by way of an externally mounted conduit 187 .
- a sealing component 188 is positioned in covering relation relative to the second coolant slot 183 and thereby sealably engages the bellow seal which is generally indicated by the numeral 160 .
- the present invention 40 further includes a second outer shell which is generally indicated by the numeral 200 , and which cooperates with, and is generally coaxially aligned relative to the first outer shell 170 .
- the second outer shell has a first end 201 which is juxtaposed relative to the second or lower end 172 of the first outer shell, and is affixed thereto by conventional fasteners.
- the second outer shell has an opposite, second end 202 .
- the second outer shell has an inside facing surface 203 , and an outside facing surface 204 .
- a longitudinally disposed passageway 205 is defined by the inside facing surface 203 , and extends between the first and second ends 201 and 202 .
- This passageway is substantially coaxially aligned relative to the longitudinally disposed passageway 175 which is defined by the first outer shell 170 .
- the sprocket belt roller 130 is disposed in predetermined spaced relation relative to the second end 202 .
- rotational force imparted to the sprocket belt roller 130 is operable to impart rotational movement to the rotatable shaft 100 so that it may freely rotate within the passageway 175 .
- first and second apertures 206 and 207 are formed in the second outer shell 200 and which facilitate fluid flowing communication with the longitudinally disposed passageway 205 for the purposes which will be described in further detail, below.
- the processing apparatus 40 of the present invention includes a plurality of sealing components which are generally indicated by the numeral 210 , and which are received within the longitudinally disposed passageway 205 , and which sealingly couples the rotatable shaft 100 to the second outer shell 200 .
- the plurality of sealing components 210 are disposed in predetermined spaced relation along the rotatable shaft 100 .
- the plurality of sealing components further define a first ring gap 211 , and a second ring gap 212 which are best seen by reference to FIG. 11 .
- the first ring gap 211 , and the second ring gap 212 are operable to pass coolant therealong as will be described below.
- the first aperture 120 formed in the rotatable shaft 100 is located within the first ring gap 211 ; and further a coolant inlet or conduit 213 is coupled in fluid flowing relation relative thereto.
- a source of coolant (not shown) enters in through the coolant inlet/conduit 213 and travels along the first ring gap 211 .
- the coolant thereafter enters the first portion 115 of the first coolant passageway 111 .
- the second aperture 124 formed in the rotating shaft 100 and which is located at the second end 113 of the second portion 121 of the first coolant passageway 111 , is located within the second ring gap 212 .
- an external conduit 187 has a first end which is coupled in fluid flowing relation one relative to the second ring gap 212 , and an opposite second end which is coupled in fluid flowing relation one relative to the second coolant passageway 182 , which is defined, in part, by the second coolant slot 183 .
- coolant leaving the first portion 115 of the first cooling passageway 111 travels along the first coolant slot 114 , and then passes into the second portion 121 of the first coolant passageway. The coolant then exits the second portion of the first coolant passageway by way of the second aperture 124 . The coolant then travels along the second ring gap 212 .
- the coolant then exits the second ring gap 212 and enters into the first end 187 A of the external conduit 187 .
- the coolant exits the second end 187 B of the external conduit 187 and enters into the second coolant passageway 182 which is defined, in part, by the second coolant slot 183 .
- the second coolant slot 183 circumscribes, at least in part, the first end 171 of the first outer shell 170 and is further disposed in spaced relation relative to the first coolant slot 114 .
- the second coolant slot has a first intake end 184 and a second exhaust end 185 .
- the second end 187 B of the external conduit 187 is coupled in fluid flowing relation relative to the first intake end 184 of the second coolant slot.
- the present invention includes, as earlier described, an external exhaust conduit 186 coupled to the second exhaust end 185 of the second coolant slot and which exhausts the coolant to ambient.
- a processing apparatus for semiconductor work pieces 40 of the present invention includes a platform rotation mechanism which is generally indicated by the numeral 220 , and which individually cooperates with each of the heated and rotatable processing stations 32 in order to simultaneously heat and rotate the respective processing stations 32 in a synchronous fashion.
- the platform rotation mechanism which is mounted below the processing chamber 31 includes an electrical motor 221 which has a drive shaft (not shown), and wherein a drive sprocket/pulley 222 is mounted on the drive shaft and is rotatable therewith. Still further, and mounted adjacent to the electric motor 221 is a first pair of spaced idler pulleys 223 .
- a second pair of idler pulleys 224 are a second pair of idler pulleys 224 .
- a continuous belt 225 is received thereabout the drive sprocket/pulley 222 and is directed by way of the first and second pairs of idler pulleys 223 and 224 to matingly and forcibly engage the respective sprocket belt roller assemblies 130 as provided for on each of the processing stations 32 .
- the continuous belt 225 has an undulating or ribbed drive surface 226 .
- the sprocket belt rollers are operable to matingly and drivingly engage the undulating drive surface 226 of the continuous belt 225 .
- the single electric motor 221 is operable to simultaneously drive or rotate adjacent processing stations 32 in an advantageous manner.
- the present processing apparatus for semiconductor work pieces of the present invention 40 comprises a processing chamber 31 having an internal cavity 33 , and which further has a plurality of rotatable processing stations 32 positioned in the internal cavity 33 .
- Each of the respective rotatable processing stations 32 process individual semiconductor work pieces 87 .
- a platform rotation mechanism 220 individually cooperates with each of the rotatable processing stations 32 ; and an electrical motor 221 is coupled to at least two rotatable processing stations 32 so as to drive the respective processing station in a synchronous fashion.
- the electric motor 221 is drivingly coupled to the respective rotatable processing stations by a continuous belt 225 .
- a sprocket belt roller 130 is mounted on each of the respective rotatable processing stations 32 .
- the continuous belt 225 transmits force from the electric motor 221 to the respective sprocket belt rollers 130 so as to cause rotation of the respective rotatable processing stations 32 .
- a processing apparatus for semiconductor work pieces 40 which comprises a processing chamber 31 having an internal cavity 33 and which has a plurality of rotatable processing stations 32 located within the internal cavity 33 .
- the respective processing stations 32 are each operable to process a semiconductor work piece 87 .
- the plurality of rotatable processing stations 32 can move upwardly, downwardly and/or rotate relative to the processing chamber 31 .
- the present invention 40 further comprises a sealing assembly such as the bellow seal 160 , and the magnetic sealing components 181 , and which maintain the internal cavity 33 of the processing chamber 31 substantially sealed while the rotatable processing stations 32 move upwardly, downwardly and rotate.
- the processing apparatus 40 further comprises a cooling apparatus for cooling the sealing assemblies to facilitate the proper operation of the sealing assemblies.
- the cooling apparatus includes a first coolant passageway 111 ; a second coolant passageway 182 ; the first and second ring gaps 211 and 212 , respectively; as well as the externally mounted conduit 187 which is operable to direct a source of coolant which facilitates the cooling of various assemblies within the apparatus 40 , and further inhibits heat related damage to the seals of the processing chamber 30 .
- the present invention also relates to a method for processing semiconductor work pieces 87 which comprises a first step of providing a processing chamber 31 having an internal cavity 33 ; and providing a plurality of processing stations 32 within the internal cavity 33 of the processing chamber.
- the methodology further includes another step of positioning individual semiconductor work pieces 87 on each of the individual processing stations 32 ; and rotating and heating the individual processing stations 32 so as to facilitate the effective processing of the semiconductor work pieces 87 within the internal cavity 33 of the processing chamber 32 .
- the method includes another step whereby the plurality of processing stations 32 are synchronously rotated.
- a first outer shell 170 , and second outer shell 200 can be made into a unitary structure.
- the first coolant passageway 111 , and second coolant passageway 182 which are joined together in fluid flowing relation by the external conduit 187 , provides a convenient means whereby the coolant circulation path may be lengthened. This facilitates the efficient utilization of the coolant.
- the present invention provides only one coolant inlet 213 which provides the source of coolant to the present structure. This is an extremely efficient design, and further reduces the cost of manufacturing same.
- the present invention provides a convenient means for processing semiconductor work pieces in a manner not possible heretofore.
- the present invention further avoids many of the shortcomings attendant with the prior art practices and processes utilized heretofore, and effectively processes a multiplicity of semiconductor work pieces in an efficient and highly advantageous manner.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A processing apparatus for semiconductor work pieces and related methodology is disclosed and which includes a processing chamber having an internal cavity, and which has a plurality of rotatable processing stations positioned therein and wherein the rotatable processing stations each process a semiconductor work piece.
Description
- This application claims priority from Chinese Patent Application Serial No. 200510028563.2, and which was filed on Aug. 5, 2005.
- The present apparatus relates to a method and apparatus for processing semiconductor work pieces, and more specifically to an apparatus which includes multiple processing chambers for processing a plurality of semiconductor work pieces, and multiple processing stations within each of the multiple processing chambers.
- Presently, two types of semiconductor processing systems are employed for fabricating semiconductor work pieces. The first type of system is a batch processing system; while the second type of system which is commonly used processes single semiconductor work pieces. In batch processing systems, semiconductor work pieces are typically oriented in either a horizontal or vertical orientation, and are thereafter processed at the same time.
- Although single piece semiconductor processing systems have many advantages including producing uniform semiconductor products, they also have numerous shortcomings including low throughput; high overhead operating costs; and problems achieving uniform heating of the semiconductor work pieces that are being processed. These long recognized problems associated with single piece processing devices have yet to be overcome.
- Attempts have been made to address the problems associated with the prior art batch processing systems. For example, in U.S. Pat. No. 5,855,681, a batch processing system is described, and which includes multiple processing chambers. Each of the processing chambers includes multiple processing stations. In this prior art device, the processing chambers can process multiple semiconductor work pieces at one time.
- While these and other devices have worked with some degree of success, there are shortcomings that have detracted from their usefulness. For example, one of the biggest problems associated with batch processing systems lies principally with insuring uniformity during the processing of the respective semiconductor work pieces. In this regard, when batch processing a plurality of semiconductor work pieces, the multiple semiconductor work pieces are placed in the same chamber. Consequently, differences in heat and gas flow in the processing chamber may cause non-uniform processing of the several semiconductor work pieces. To overcome the problems associated with non-uniform processing, several solutions have been proposed. For example, and referring now to
FIG. 1 , a processing apparatus forsemiconductor work pieces 10 is illustrated and wherein a silicon substrate to be processed 11 is placed on acarbon pedestal 12. Positioned below and in spaced relation relative to the carbon pedestal there is a second,heating pedestal 13. Located within the heating pedestal there is a highfrequency heating coil 14 which is operable to impart heat energy to thesilicon substrate 11. During processing, thecarbon pedestal 12 can rotate around a central shaft together with thecarbon pedestal support 15. This arrangement has been utilized to try to insure uniform temperature processing. - Referring now to
FIG. 2 , another prior art semiconductor workpiece processing apparatus 20 is disclosed and which is more particularly discussed in published U.S. Patent Application 2005/0011459. Thesemiconductor processing apparatus 20 includes a rotatable semiconductorwork piece carrier 21 which is positioned within aprocessing chamber 22. Asemiconductor work piece 23 is placed on the semiconductorwork piece carrier 21. The semiconductorwork piece carrier 21 rotates around ashaft 24. Further, aheating pedestal 25 is provided which is stationary, and located in a position which is closely adjacent thereto. Asmall passageway 26 is defined between the semiconductorwork piece carrier 21, and theadjacent reaction chamber 22. In the present prior art device, the semiconductor work piece carrier is rotated while gas is simultaneously delivered to the reaction chamber and flows horizontally, outwardly along thepassageway 26. This arrangement attempts to provide uniform film growth on thesemiconductor work piece 23 during processing. - While many of the difficulties associated with prior art batch processing devices utilized heretofore can be remedied by means of the prior art devices shown in
FIGS. 1 and 2 , these same assemblies also create other problems. In both prior art devices, multiple semiconductor work pieces are placed on the same semiconductor work piece carrier. Further, these same semiconductor work piece carriers are heated by a stationary heating pedestal. Uniform heating of the semiconductor work pieces is affected by the rotation of the semiconductor work piece carrier apparatus relative to the stationary heating pedestal. The difficulty associated with this particular type of approach is that the separation of the heating apparatus from the semiconductor work piece carrier adds a degree of complexity to the overall processing system. Still further, achieving a uniform space or gap between the semiconductor work piece carrier and the underlying heating pedestal becomes difficult thereby making the control of the processing temperature an increasing problem. In addition to the foregoing difficulties, the prior art devices all employ semiconductor work piece carriers which are driven or rotate thereabout a common shaft. This is not an ideal solution for semiconductor processing devices which have multiple processing stations within one processing chamber. - Therefore, a semiconductor processing apparatus which avoids the shortcomings attendant with the prior art practices and methodology utilized heretofore is the subject matter of the present application.
- A first aspect of the present invention relates to a processing apparatus for semiconductor work pieces which includes a processing chamber having an internal cavity and which has a plurality of rotatable processing stations within the internal cavity, and which are each operable to process a semiconductor work piece.
- Another aspect of the present invention relates to a processing apparatus for semiconductor work pieces, and which includes a chamber defining an internal cavity; a plurality of rotatable and heated processing stations received in the internal cavity, and which are each operable to process a semiconductor work piece; and wherein at least two of the processing stations rotate in a substantially synchronous fashion so as to facilitate the substantially uniform processing of the semiconductor work pieces; and a motor drivingly coupled to the at least two of the rotatable and heated processing stations, and which facilitates the synchronous rotation of the at least two processing stations.
- Another aspect of the present invention relates to a processing apparatus for semiconductor work pieces and which includes a processing chamber having an internal cavity, and which has a plurality of rotatable processing stations within the internal cavity, and which are each operable to process a semiconductor work piece; a platform rotation mechanism individually cooperating with each of the rotatable processing stations, and positioned below each of the processing stations, and wherein the platform rotation mechanism rotates and heats the respective processing stations, and wherein the respective processing stations each define a passageway which extends therethrough, and which will accommodate electrical signal inputs; and a sealing member is borne by the processing chamber, and which facilitates the formation of an airtight environment within the internal cavity of the processing chamber.
- Still another aspect of the present invention relates to a processing apparatus for semiconductor work pieces and which includes a processing chamber having an internal cavity and which has a plurality of rotatable processing stations within the internal cavity, and which are each operable to process a semiconductor work piece, and wherein each of the plurality of rotatable processing stations can move upwardly, downwardly and/or rotate relative to the processing chamber; sealing assemblies mounted on the processing chamber and which maintain the internal cavity of the processing chamber substantially sealed while the rotatable processing stations move upwardly, downwardly and rotate; and a cooling apparatus for cooling the sealing assemblies to facilitate the proper operation of the sealing assemblies.
- Still another aspect of the present invention relates to a method for processing semiconductor work pieces which includes the steps of providing a processing chamber having an internal cavity; providing a plurality of processing stations within the internal cavity of the processing chamber; positioning individual semiconductor work pieces on each of the individual processing stations; and rotating and heating the individual processing stations so as to facilitate the effective processing of the semiconductor work pieces within the internal cavity of the processing chamber.
- These and other aspects of the present invention will become readily apparent hereinafter.
- Preferred embodiments of the invention are described below with reference to the following accompanying drawings.
-
FIG. 1 is a greatly simplified schematic diagram of an existing prior art processing apparatus for semiconductor work pieces. -
FIG. 2 is a second, greatly simplified schematic diagram of a second processing apparatus for semiconductor work pieces. -
FIG. 3 is a perspective, fragmentary view of the processing apparatus for semiconductor work pieces of the present invention. -
FIG. 4 is a fragmentary, side elevation view of the processing apparatus for semiconductor work pieces of the present invention. -
FIG. 5 is a second, fragmentary, side elevation view of the processing apparatus for semiconductor work pieces of the present invention, and which is taken from a position opposite to that seen inFIG. 4 . -
FIG. 6 is fragmentary, side elevation view of a single processing station which is useful in the present invention. -
FIG. 7 is a transverse, vertical sectional view of a processing station useful in the present invention, and which is taken from a position along line 7-7 ofFIG. 6 . -
FIG. 8 is a fragmentary, greatly enlarged, transverse, sectional view taken from a position along line 7-7 ofFIG. 6 . -
FIG. 9 is a longitudinal, vertical, sectional view taken through a portion of a shaft which is useful in the processing stations employed in the present invention. -
FIG. 10 is a longitudinal, vertical, sectional view which is taken from a position along line 10-10 ofFIG. 9 . -
FIG. 11 is a fragmentary, greatly simplified view of the cooling passageways which are provided in the present invention. Some underlying surfaces are shown in phantom lines. -
FIG. 12 is a fragmentary, perspective, longitudinal, vertical, sectional view taken from a position along line 12-12 ofFIG. 7 . Some supporting structures have been removed to illustrate the structure thereof. -
FIG. 13 is a fragmentary, longitudinal, vertical sectional view taken through a bellow which is useful in the present invention. -
FIG. 14 illustrates one possible form of a semiconductor processing system which may employ the apparatus of the present invention. -
FIG. 15 illustrates an arrangement which rotates the adjoining processing stations of the present invention. - This disclosure of the invention is submitted in furtherance of the constitutional purposes of the U.S. Patent Laws “to promote the progress of science and useful arts” (Article 1, Section 8).
- Referring more specifically to
FIG. 14 , a semiconductor processing system which incorporates the teachings of the present invention is shown therein. Thesemiconductor processing system 30 has aprocessing chamber 31 having aninternal cavity 33 and which is operable to receive a plurality of rotatable processing stations which are generally indicated by the numeral 32. As will be described in greater detail hereinafter, the plurality ofrotatable processing stations 32 process individual semiconductor work pieces in a manner not possible, heretofore. Therefore, one aspect of the present invention relates to asemiconductor processing system 30 which mounts a plurality ofrotatable processing stations 32, and which are each operable to process semiconductor work pieces while simultaneously heating same. - Referring more specifically to now
FIG. 3 , one embodiment of theprocessing apparatus 40 for semiconductor work pieces of the present invention is shown. For purposes of clarity, only twoprocessing stations 32 are illustrated. However, it will be recognized that the present invention is not limited to two processing stations but may have various numbers of processing stations depending upon the arrangement of theprocessing chamber 31. - Referring more specifically to
FIGS. 4 and 5 , the processing apparatus forsemiconductor work pieces 40 has a vertically orientedrail 41 which is positioned adjacent to, and below, theprocessing chamber 31 as seen inFIG. 14 . The vertically oriented rail has a first orupper end 42 which is positioned adjacent to theprocessing chamber 31, and an opposite, second ordistal end 43 which is remote thereto. The vertically orientedrail 41 defines at least onerail slot 44, and which defines a path of travel for various elements of theprocessing apparatus 40 which will be described in greater detail hereinafter. As seen by reference toFIG. 5 , a plurality of substantially vertically oriented apertures are disposed in predetermined spaced relation along the vertically orientedrail 41. These holes or apertures are operable to cooperate with other elements of the assembly as the assembly moves along the rail. The arrangement of the vertically orientedrail 41 is designed such that pressure on the whole mechanical arrangement as seen inFIG. 4 is substantially alleviated. - Referring still to
FIGS. 4 and 5 , it will be seen that thepresent processing apparatus 10 includes asupport housing 50 defining aninternal chamber 51, and which is mounted on thesecond end 43 of therail 40. As illustrated in the drawings, afirst motor 52 is mounted on thesupport housing 50, and has adrive shaft 53 which extends outwardly therefrom. Positioned within thechamber 51 of thesupport housing 50 is a worm gear mechanism which is generally indicated by the numeral 54. Theworm gear mechanism 54 is coupled to adrive shaft 55. As illustrated in the present drawings, theprocessing apparatus 40 includes a driveshaft receiving bracket 60. The drive shaft receiving bracket has afirst end 61, and an oppositesecond end 62 through which thedrive shaft 55 extends. As should be understood, by energizing thefirst motor 52, force is imparted to thedrive shaft 55 to cause the driveshaft receiving bracket 60 to move therealong therail 44 for the purposes which will be described in greater detail, below. In addition to the foregoing, it will be seen that aposition sensor 63 is mounted on therail 41, and which is operable to sense the position of other elements in the processing apparatus as they move along the rail. Still referring toFIGS. 4 and 5 , it will be seen that asecond motor 64 is mounted near thefirst end 42 of the vertically orientedrail 41. Thesecond motor 64 is moveably mounted to the rail by means of amotor mount 65. Still further, aposition sensor 66 is mounted on themotor mount 65 and is operable to provide relevant positional information for various assemblies of theprocessing apparatus 40 as will be described in greater detail in the paragraphs which follow. - The processing apparatus of the present invention includes a first support member which is generally indicated by the numeral 70, and which is mounted to the drive
shaft receiving bracket 60, and which supports at least twoprocessing stations 32. As seen by reference toFIGS. 4 and 5 , thefirst motor 52 which is provided, is drivingly coupled to thefirst support member 70, and is operable to selectively and simultaneously move the at least twoprocessing stations 32 along a substantially vertically disposed path of travel as will be described hereinafter. In this regard, thefirst support member 70 has atop surface 71, and anopposite bottom surface 72. Still further, apertures or receiving stations 73 (FIG. 3 ) are formed in the first support member, and which are individually operable to cooperate with other assemblies which will be described, below. Still further, the first support member selectively moves along a vertically disposed path of travel which is generally indicated by the numeral 74. It should be further understood that thefirst support member 70, as well as the second support member, which will be discussed below, includes rail slot engagement members (not shown), and which are individually mounted on each of the first and second support members, and which are matingly received in each of the vertically orientedrail slots 44. These assemblies guide the respective first and second support members along the substantially vertically oriented path oftravel 74. - Referring still to
FIGS. 4 and 5 , theprocessing apparatus 40 of the present invention includes a second support member which is generally indicated by the numeral 80, and which is mounted adjacent to, and below theprocessing chamber 31. Thesecond support member 80 is drivingly coupled to thesecond motor 64 which was earlier described. As seen in the drawings, the second support member has a first ortop surface 81, and an opposite, second, orbottom surface 82. A pair ofapertures 83 are formed therein (FIG. 3 ), and which are operable to cooperate with other assemblies which will be described below. As seen inFIGS. 4 and 5 , sealingmembers 84, here illustrated in the form of bellows, are mounted on thetop surface 81. The sealingmembers 84 are each individually operable to receive or otherwise sealingly cooperate with anejection rod 85 which is sealably contained therein. Theejection rods 85 are each operable to cooperate with individual lifting pins 86. The lifting pins movably cooperate with a pedestal which will be described in greater detail below. As should be understood, the individual sealing members or bellows 84 are connected to the bottom of theprocessing chamber 31. Still further, the engagement of theejection rods 85 with the lifting pins 86 are effective for lifting asemiconductor work piece 87, as seen inFIG. 4 , off of the accompanying pedestal so that they may be moved into, and out of, theprocessing chamber 31. It should be understood, therefore, that thesecond support member 80 cooperates with a plurality of sift pins 86 to move the respective lift pins upwardly and downwardly relative to therespective processing stations 32. Still further, thesecond motor 64 is drivingly coupled to thesecond support member 80 and operable to selectively move thesecond support member 80 along a path oftravel 88 so as to cause the reciprocal upward and downward movement of the respective lift pins 86 in each of therespective processing stations 32. In addition to the foregoing, it should be understood that theposition sensor 66 is electrically coupled to thesecond motor 64, and is operable to control the same motor so as to move thesecond support member 80 upwardly and downwardly along the vertically orientedrail 41 so as to engage the lift pins in an appropriate fashion. Theposition sensor 66 is rendered operable so as to stop the second motor when thesecond support member 80 passes thesensor 64 thus insuring that the individual lift pins can only rise and descend within a certain range. - Referring now to
FIGS. 7 and 9 , the processing apparatus forsemiconductor work pieces 40 of the present invention includes a rotating shaft which is generally indicated by the numeral 100. The rotating shaft has a first, upper orproximal end 101, and a second, lower, ordistal end 102. Still further, the shaft defines aninside facing surface 103, and anoutside facing surface 104. A longitudinally disposedpassageway 105 is defined by the inside facing surface, and extends between the first and second ends thereof. Referring more specifically now toFIGS. 9 and 10 , therotatable shaft 100 defines a connectingblock seat 110 which is positioned at thefirst end 101 thereof, and which is operable to receive a connecting block 110A. The connecting block has a passageway which extends therethrough (FIG. 8 ). Further, formed in therotating shaft 100 is a first coolant passageway which is generally indicated by the numeral 111. The first coolant passageway has afirst intake end 112, and a second exhaust end which is generally indicated by the numeral 113. Disposed intermediate the first and second ends 112 and 113 is afirst coolant slot 114 which is formed thereabout, and in substantially circumscribing relation relative to thefirst end 101. Still further, thefirst coolant passageway 111 has afirst portion 115 which extends longitudinally therealong therotating shaft 100. Thefirst portion 115 has afirst end 116, which is coupled in fluid flowing relation relative to thecoolant slot 114, and an opposite,second end 117 which is remote thereto. In addition to the foregoing, afirst aperture 120 is formed in therotating shaft 100 and is operable to couple thefirst portion 115 to a source of coolant which will be described in greater detail, hereinafter. Still further, thefirst coolant passageway 111 includes asecond portion 121 which extends longitudinally therealong therotating shaft 100. The second portion has afirst end 122, and an oppositesecond end 123. Still further, asecond aperture 124 is formed through therotating shaft 100 and allows the second portion of the passageway to be coupled in fluid flowing relation relative to another assembly which will be discussed in greater detail below. - Referring now to
FIG. 7 , and mounted in force transmitting relation relative to thesecond end 102 of therotating shaft 100, is a sprocket belt roller which is generally indicated by the numeral 130. The sprocket belt roller is operable to matingly engage a drive belt which will be discussed in greater detail hereinafter. The sprocket belt roller is operable to impart rotational force from a motor which will be described below, to cause the rotational movement of theshaft 100. Thesprocket belt roller 130 defines a centrallydisposed passageway 131, and which will accommodate the passage of a plurality of electrical conduits. Aspacer assembly 132 is positioned on the opposite side of thesprocket belt roller 130, and further defines apassageway 133 which extends therethrough and which is substantially coaxially aligned relative to thepassageway 131 defined by thebelt roller 130. Still further, ahub assembly 134 is provided and which is mounted on thespacer assembly 132. Thehub assembly 134 similarly defines apassageway 135 which extends therethrough. The hub assembly allows electrical conduits to pass therethrough, but prevents the electrical conduits from being entangled while therespective processing stations 32 rotate. Mounted endwardly of thehub assembly 134 is asignal amplifier 136. The signal amplifier is coupled to other components of the processing apparatus which will be described also in the paragraphs which follow. - Referring more specifically to
FIGS. 7 and 8 , the processing apparatus forsemiconductor work pieces 40 of the present invention includes a supporting rod, conduit, ormember 140, and which extends substantially longitudinally outwardly relative to thefirst end 101 of therotating shaft 100. The supportingrod 140 has a first orproximal end 141, and an opposite second ordistal end 142, which is affixed in an appropriate fashion to thefirst end 101 of the rotating shaft by means of the connecting block 110A. This attachment may be facilitated by means of various conventional fasteners, not shown. The supporting rod has aninside facing surface 143, and anoutside facing surface 144. The inside facing surface defines a longitudinallydisposed passageway 145 which extends between the first and second ends; and which accommodates the passage of other conduits which will be described, below. As further seen by references toFIGS. 7 and 8 , a pair of sealing members which are generally indicated by the numeral 150, are mounted on, or cooperate with, the connecting block 110A, and which are operable to sealably couple the supportingrod 140 to therotating shaft 100. Still further, aseal 151 is positioned in substantially covering relation relative to thefirst coolant passageway 111. As seen inFIGS. 7 and 8 , a pair of wire pipes, orconduits passageways first wire pipe 152 which directs electrical conduits (not shown) to a heating unit or assembly such as a resistor wire which is located within the pedestal 154 (not shown); and asecond wire pipe 153 which directs electrical conduits (not shown) to a temperature detection apparatus which is operable to detect the surface temperature of the accompanyingpedestal 154. Thepedestal 154 which is mounted on thefirst end 141 of the supporting rod has a top supportingsurface 155 which supports the semiconductor work piece 87 (FIG. 4 ) within theprocessing chamber 31 for processing. - Referring more specifically to
FIGS. 7, 8 and 13, the processing apparatus forsemiconductor work pieces 40 of the present invention includes individual bellow seals 160 which are positioned within each of theprocessing stations 32. The respective bellow seals 160 operate to insure that the connection between the supportingrod 140, and theprocessing chamber 31 is substantially sealed. In this regard, thebellow seal 160 sealably couples to the bottom of theprocessing chamber 31 in the manner as follows. Referring now toFIG. 13 , it will be seen that thebellow seal 160 has amain body 161 through which the supportingrod 140 extends. The respective bellow seals 160 are generally longitudinally symmetrically deformable, and further has a corrugatedmain body 161 which can be distorted with pressure and then restored to its original length once the pressure is removed. The respective bellow seals 160 are typically fabricated from a metal material such as stainless steel or the like. Themain body 161 has afirst end 162, and an oppositesecond end 163. Still further, afirst circumscribing flange 164 is positioned at thefirst end 162, and further, asecond circumscribing flange 165 is positioned at thesecond end 163. As seen, themain body 161 defines a longitudinallydisposed passageway 166 through which the supportingrod 140 extends. Additionally, a sealingmember 167 is positioned about, or otherwise cooperates with thefirst flange 164, and is operable to substantially seal the first flange to the bottom of theprocessing chamber 31. The first andsecond flanges second flanges - Referring now to
FIG. 8 , the processing apparatus forsemiconductor work pieces 40 of the present invention further includes a first outer shell which is generally indicated by the numeral 170. The first outer shell has a first orupper end 171 to which thesecond end 163 of thebellow seal 160 is secured by welding or the like. Further, the firstouter shell 170 has a second, orlower end 172 which is remote thereto. The firstouter sell 170 has aninside facing surface 173, and anoutside facing surface 174. As seen in the drawings, the firstouter shell 170 is received in the apertures or receivingstations 73 which are defined by thefirst support member 70. Theinside facing surface 173 defines a longitudinallydisposed passageway 175 which extends between the first and second ends 171 and 172, and which telescopingly receives therotatable shaft 100. As best seen by reference toFIG. 8 , a sealingmember 176 is positioned or otherwise received on thefirst end 171, and is operable to seal thereagainst thesecond end 163 of thebellow 160. As will be recognized, for example, by a study ofFIG. 8 , therotating shaft 100, which comprises a part of the platform rotation mechanism for rotating thesemiconductor work piece 87 extends into the longitudinally disposedpassageway 175 of the first outer shell and is rotatable relative thereto. As will be seen by reference toFIG. 8 , a pair ofbearings 180, of conventional design, are mounted or otherwise received within the longitudinally disposedpassageway 175 and are positioned such that respective bearings are positioned on or near the opposite ends thereof. The pair ofbearings 180 facilitate rotation of therotatable shaft member 100 as described earlier. In addition to the foregoing, a magnetic sealing component which is generally indicated by the numeral 181, is positioned near the first orupper end 171, and thereby sealingly couples therotating shaft 100 relative to the firstouter shell 170. Referring now toFIGS. 8 and 12 , it will be seen that the firstouter shell 170, and more specifically thefirst end 171 thereof, defines, at least in part, a second coolant passageway 182 (FIG. 12 ). The second coolant passageway includes asecond coolant slot 183 which is positioned near thefirst end 171, and which circumscribes same. Thesecond coolant slot 183 has afirst intake end 184, and a secondexhaust end 185. Still further, anexternal exhaust conduit 186 is coupled in fluid flowing relation relative to the second exhaust end 185 (FIG. 12 ). As should be understood, thesecond coolant passageway 182, which is formed in the firstouter shell 170 is positioned, at least in part, near themagnetic sealing component 181. Still further, the first andsecond coolant passageways conduit 187. As further seen by reference toFIGS. 7 and 8 , asealing component 188 is positioned in covering relation relative to thesecond coolant slot 183 and thereby sealably engages the bellow seal which is generally indicated by the numeral 160. - The
present invention 40 further includes a second outer shell which is generally indicated by the numeral 200, and which cooperates with, and is generally coaxially aligned relative to the firstouter shell 170. The second outer shell has afirst end 201 which is juxtaposed relative to the second orlower end 172 of the first outer shell, and is affixed thereto by conventional fasteners. Further, the second outer shell has an opposite,second end 202. Still further, the second outer shell has aninside facing surface 203, and anoutside facing surface 204. Still further, a longitudinally disposedpassageway 205 is defined by theinside facing surface 203, and extends between the first and second ends 201 and 202. This passageway is substantially coaxially aligned relative to the longitudinally disposedpassageway 175 which is defined by the firstouter shell 170. As best illustrated in the drawings, it will be appreciated that thesprocket belt roller 130 is disposed in predetermined spaced relation relative to thesecond end 202. As earlier described, rotational force imparted to thesprocket belt roller 130 is operable to impart rotational movement to therotatable shaft 100 so that it may freely rotate within thepassageway 175. As best seen by reference toFIG. 11 , it will be appreciated that first andsecond apertures outer shell 200 and which facilitate fluid flowing communication with the longitudinally disposedpassageway 205 for the purposes which will be described in further detail, below. - Referring more specifically to
FIGS. 11 and 12 , it will be seen that theprocessing apparatus 40 of the present invention includes a plurality of sealing components which are generally indicated by the numeral 210, and which are received within the longitudinally disposedpassageway 205, and which sealingly couples therotatable shaft 100 to the secondouter shell 200. The plurality of sealingcomponents 210 are disposed in predetermined spaced relation along therotatable shaft 100. The plurality of sealing components further define afirst ring gap 211, and asecond ring gap 212 which are best seen by reference toFIG. 11 . As should be understood, thefirst ring gap 211, and thesecond ring gap 212 are operable to pass coolant therealong as will be described below. With regard toFIGS. 9, 10 and 11, it will be appreciated that thefirst aperture 120 formed in therotatable shaft 100 is located within thefirst ring gap 211; and further a coolant inlet orconduit 213 is coupled in fluid flowing relation relative thereto. A source of coolant (not shown) enters in through the coolant inlet/conduit 213 and travels along thefirst ring gap 211. The coolant thereafter enters thefirst portion 115 of thefirst coolant passageway 111. Still further, thesecond aperture 124 formed in therotating shaft 100, and which is located at thesecond end 113 of thesecond portion 121 of thefirst coolant passageway 111, is located within thesecond ring gap 212. As earlier described, anexternal conduit 187 has a first end which is coupled in fluid flowing relation one relative to thesecond ring gap 212, and an opposite second end which is coupled in fluid flowing relation one relative to thesecond coolant passageway 182, which is defined, in part, by thesecond coolant slot 183. In this arrangement, coolant leaving thefirst portion 115 of thefirst cooling passageway 111 travels along thefirst coolant slot 114, and then passes into thesecond portion 121 of the first coolant passageway. The coolant then exits the second portion of the first coolant passageway by way of thesecond aperture 124. The coolant then travels along thesecond ring gap 212. The coolant then exits thesecond ring gap 212 and enters into the first end 187A of theexternal conduit 187. The coolant exits the second end 187B of theexternal conduit 187 and enters into thesecond coolant passageway 182 which is defined, in part, by thesecond coolant slot 183. As earlier described, thesecond coolant slot 183 circumscribes, at least in part, thefirst end 171 of the firstouter shell 170 and is further disposed in spaced relation relative to thefirst coolant slot 114. The second coolant slot has afirst intake end 184 and a secondexhaust end 185. The second end 187B of theexternal conduit 187 is coupled in fluid flowing relation relative to thefirst intake end 184 of the second coolant slot. Still further, the present invention includes, as earlier described, anexternal exhaust conduit 186 coupled to the secondexhaust end 185 of the second coolant slot and which exhausts the coolant to ambient. - Referring now to
FIG. 15 , it should be understood that a processing apparatus forsemiconductor work pieces 40 of the present invention includes a platform rotation mechanism which is generally indicated by the numeral 220, and which individually cooperates with each of the heated androtatable processing stations 32 in order to simultaneously heat and rotate therespective processing stations 32 in a synchronous fashion. In this regard, the platform rotation mechanism which is mounted below theprocessing chamber 31 includes anelectrical motor 221 which has a drive shaft (not shown), and wherein a drive sprocket/pulley 222 is mounted on the drive shaft and is rotatable therewith. Still further, and mounted adjacent to theelectric motor 221 is a first pair of spaced idler pulleys 223. Still further, and located in spaced relation relative to the respective sprocketbelt roller assemblies 130 which are mounted on therespective processing stations 32, are a second pair of idler pulleys 224. As seen from the drawing, acontinuous belt 225 is received thereabout the drive sprocket/pulley 222 and is directed by way of the first and second pairs ofidler pulleys belt roller assemblies 130 as provided for on each of theprocessing stations 32. As should be understood, thecontinuous belt 225 has an undulating orribbed drive surface 226. As earlier described, the sprocket belt rollers are operable to matingly and drivingly engage the undulatingdrive surface 226 of thecontinuous belt 225. As seen inFIG. 15 , the singleelectric motor 221 is operable to simultaneously drive or rotateadjacent processing stations 32 in an advantageous manner. - The operation of the described embodiment of the present invention is believed to be readily apparent and is briefly summarized at this point.
- In its broadest aspect, the present processing apparatus for semiconductor work pieces of the
present invention 40 comprises aprocessing chamber 31 having aninternal cavity 33, and which further has a plurality ofrotatable processing stations 32 positioned in theinternal cavity 33. Each of the respectiverotatable processing stations 32 process individualsemiconductor work pieces 87. As earlier described, aplatform rotation mechanism 220 individually cooperates with each of therotatable processing stations 32; and anelectrical motor 221 is coupled to at least tworotatable processing stations 32 so as to drive the respective processing station in a synchronous fashion. As seen inFIG. 15 , theelectric motor 221 is drivingly coupled to the respective rotatable processing stations by acontinuous belt 225. In the arrangement as seen in that drawing, asprocket belt roller 130 is mounted on each of the respectiverotatable processing stations 32. Thecontinuous belt 225 transmits force from theelectric motor 221 to the respectivesprocket belt rollers 130 so as to cause rotation of the respectiverotatable processing stations 32. - Another aspect of the present invention relates to a processing apparatus for
semiconductor work pieces 40 which comprises aprocessing chamber 31 having aninternal cavity 33 and which has a plurality ofrotatable processing stations 32 located within theinternal cavity 33. Therespective processing stations 32 are each operable to process asemiconductor work piece 87. The plurality ofrotatable processing stations 32 can move upwardly, downwardly and/or rotate relative to theprocessing chamber 31. Thepresent invention 40 further comprises a sealing assembly such as thebellow seal 160, and themagnetic sealing components 181, and which maintain theinternal cavity 33 of theprocessing chamber 31 substantially sealed while therotatable processing stations 32 move upwardly, downwardly and rotate. Still further, theprocessing apparatus 40 further comprises a cooling apparatus for cooling the sealing assemblies to facilitate the proper operation of the sealing assemblies. In this regard, the cooling apparatus includes afirst coolant passageway 111; asecond coolant passageway 182; the first andsecond ring gaps conduit 187 which is operable to direct a source of coolant which facilitates the cooling of various assemblies within theapparatus 40, and further inhibits heat related damage to the seals of theprocessing chamber 30. - The present invention also relates to a method for processing
semiconductor work pieces 87 which comprises a first step of providing aprocessing chamber 31 having aninternal cavity 33; and providing a plurality ofprocessing stations 32 within theinternal cavity 33 of the processing chamber. The methodology further includes another step of positioning individualsemiconductor work pieces 87 on each of theindividual processing stations 32; and rotating and heating theindividual processing stations 32 so as to facilitate the effective processing of thesemiconductor work pieces 87 within theinternal cavity 33 of theprocessing chamber 32. As earlier disclosed, the method includes another step whereby the plurality ofprocessing stations 32 are synchronously rotated. - As will be recognized from the foregoing, a first
outer shell 170, and secondouter shell 200, can be made into a unitary structure. Further, thefirst coolant passageway 111, andsecond coolant passageway 182, which are joined together in fluid flowing relation by theexternal conduit 187, provides a convenient means whereby the coolant circulation path may be lengthened. This facilitates the efficient utilization of the coolant. Further, the present invention provides only onecoolant inlet 213 which provides the source of coolant to the present structure. This is an extremely efficient design, and further reduces the cost of manufacturing same. - Therefore it will be seen that the present invention provides a convenient means for processing semiconductor work pieces in a manner not possible heretofore. The present invention further avoids many of the shortcomings attendant with the prior art practices and processes utilized heretofore, and effectively processes a multiplicity of semiconductor work pieces in an efficient and highly advantageous manner.
- In compliance with the statute, the invention has been described in language more or less specific as to structural and methodical features. It is to be understood, however, that the invention is not limited to the specific features shown and described, since the means herein disclosed comprise preferred forms of putting the invention into effect. The invention is, therefore, claimed in any of its forms or modifications within the proper scope of the appended claims appropriately interpreted in accordance with the doctrine of equivalents.
Claims (48)
1. A processing apparatus for semiconductor work pieces, comprising:
a processing chamber having an internal cavity and which has a plurality of rotatable processing stations within the internal cavity, and which are each operable to process a semiconductor work piece.
2. A processing apparatus as claimed in claim 1 , and further comprising:
a platform rotation mechanism individually cooperating with each of the rotatable processing stations.
3. A processing apparatus as claimed in claim 2 , and further comprising:
a motor mounted on the platform rotation mechanisms and which. is drivingly coupled to at least two of the processing station so as to drive the respective processing station in a synchronous fashion.
4. A processing apparatus as claimed in claim 3 , and wherein the motor is drivingly coupled to the respective processing stations by a continuous belt.
5. A processing apparatus as claimed in claim 4 , and further comprising:
a belt roller borne by each of the respective processing station, and wherein the continuous belt transmits force from the motor to the belt roller so as to cause rotation of the respective processing stations.
6. A processing apparatus as claim 5 , and wherein the continuous belt has an undulating drive surface, and wherein the belt roller further comprises a sprocket belt roller which is operable to matingly and drivingly engage the undulating drive surface of the continuous belt.
7. A processing apparatus as claimed in claim 2 , and wherein the plurality of processing stations include four rotatable processing stations, and wherein the processing apparatus further comprises a motor which synchronously drives two adjacent processing stations.
8. A processing apparatus as claimed in claim 1 , and further comprising:
a first support member mounted adjacent to the processing chamber and which supports at least two processing stations; and
a first motor drivingly coupled to the first support member and operable to selectively and simultaneously move the at least two processing stations along a substantially vertical path of travel.
9. A processing apparatus as claimed in claim 8 , and further comprising:
a first sensor borne by the first support member and which indicates the position of the first support member.
10. A processing apparatus as claimed in claim 8 , and further comprising:
a worm drive mounted on the first support member and drivingly coupled to the first motor, and which further transmits force from the first motor to the first support member.
11. A processing apparatus as claimed in claim 1 , and further comprising:
a plurality of lift pins moveably mounted on each of the processing stations, and which are operable to reciprocally move upwardly and downwardly relative to each of the processing stations.
12. A processing apparatus as claimed in claim 11 , and further comprising:
a second support member mounted adjacent to the processing chamber, and wherein the second support member cooperates within the plurality of lift pins to move the respective lift pins upwardly and downwardly relative to the respective processing stations; and
a second motor drivingly coupled to the second support member and operable to selectively move the second support member so as to cause the upward and downward movement of the respective lift pins in each of the respective processing stations.
13. A processing apparatus as claimed in claim 12 , and further comprising:
a second sensor borne by the second support member and which facilitates the positioning of the plurality of lift pins within a given range of travel relative to the respective processing stations.
14. A processing apparatus as claimed in claim 1 and further comprising:
a first support member mounted adjacent to the processing chamber and which supports at least two processing stations;
a first motor drivingly coupled to the first support member and operable to selectively and simultaneously move the at least two processing stations along a substantially vertical path of travel;
a plurality of lift pins moveably mounted on each processing station, and which are operable to reciprocally move upwardly and downwardly relative to each of the processing stations;
a second support member mounted adjacent to the processing chamber, and cooperating with the plurality of lift pins to move the respective lift pins upwardly and downwardly relative to the respective processing stations;
a second motor drivingly coupled to the second support member and operable to selectively move the second support member so as to cause the upward and downward movement of the respective lift pins in each of the respective processing stations;
a vertically oriented rail defining vertically oriented rail slots, and which is mounted on the processing chamber; and
rail slot engagement members individually mounted on each of the first and second support members and which are matingly received in each of the vertically oriented rail slots, and which guide the first and second support members along a substantially vertically oriented path of travel.
15. A processing apparatus as claimed in claim 1 , and further comprising:
a heating component associated with each of the processing stations, and which provides substantially uniform heat energy to each of the processing stations.
16. A processing apparatus as claimed in claim 2 , and wherein each of the processing stations comprise:
a shaft having a proximal and a distal end; and
a belt roller mounted on the distal end of the shaft.
17. A processing apparatus for semiconductor work pieces, comprises:
a processing chamber having an internal cavity, and which has a plurality of rotatable processing stations within the internal cavity, and which are each operable to process a semiconductor work piece;
a platform rotation mechanism individually cooperating with each of the rotatable processing stations, and positioned below each of the processing stations, and wherein the platform rotation mechanism rotates and heats the respective processing stations, and wherein the respective processing stations each defines a passageway which extends therethrough, and which will accommodate a plurality of electrical signal inputs; and
a sealing member mounted on the processing station and sealably engaging the processing chamber, and which facilitates the formation of an airtight environment within the internal cavity of the processing chamber.
18. A processing apparatus as claimed in claim 17 , and wherein each of the processing stations comprise:
a shaft having a proximal and a distal end; and
a belt roller mounted on the distal end of the shaft, and wherein rotation of the belt roller imparts rotational motion to the associated shaft.
19. A processing apparatus as claimed in claim 18 , and further comprising:
a hub mounted on the distal end of the shaft, and wherein the belt roller is mounted to the hub; and
a signal amplifier electrically coupled to the hub.
20. A processing apparatus as claimed in claim 18 , and further comprising:
a resistor wire borne by each of the processing stations, and which, when energized, emits heat energy;
a support conduit cooperating with and extending longitudinally outwardly relative to, the shaft of the respective processing stations, and wherein the shaft defines a longitudinally disposed passageway extending therethrough; and
an electrical conduit extending through the support conduit, and the shaft, and which is electrically coupled to the resistor wire, and wherein the electrical conduit delivers electricity to the resistor wire to energize same.
21. A processing apparatus as claimed in claim 20 , and further comprising:
a temperature detection apparatus mounted within the support conduit and which measures a surface temperature of the respective processing stations.
22. A processing apparatus as claimed in claim 20 , and wherein the processing chamber has a bottom surface, and wherein the processing apparatus further comprises:
a bellows seal having opposite first and second ends, and a longitudinal passageway which extends between the first and second ends, and wherein the first end is supported on the bottom surface of the processing chamber, and wherein the support conduit extends through the bellows seal; and
a sealing member positioned between the bellows seal and the bottom surface of the processing chamber so as to sealably mount the bellows seal to the bottom surface.
23. A processing apparatus as claimed in claim 22 , and further comprising:
a first outer shell having first and second ends, and which further has a passageway which extends between the first and second ends, and wherein the second end of the bellows seal is sealably mounted to the first end of the first outer shell, and wherein the shaft of the respective processing stations extend into the passageway of the first outer shell and is rotatable relative thereto; and
a bearing mounted adjacent to the first end of the first outer shell and which receives the shaft of the respective processing stations so as to facilitate the rotation of the processing stations.
24. A processing apparatus as claimed in claim 23 , and further comprising:
a sealing component positioned between the first outer shell and the bellows seal so as to substantially sealably secure the bellows seal to the first outer shell.
25. A processing apparatus as claimed in claim 23 , and further comprising:
a magnetic sealing component positioned between the first end of the first outer shell and the shaft so as to substantially sealably secure the shaft to the first outer shell while the shaft rotates relative to the first outer shell.
26. A processing apparatus as claimed in claim 20 , and wherein the support conduit and the shaft are sealably affixed to one another by fasteners, and wherein a sealing component is positioned between the support conduit and the shaft.
27. A processing apparatus as claimed in claim 26 , and further comprising:
a connecting block having opposite sides and which defines a passageway extending therethrough, and wherein the shaft is substantially coaxially aligned relative to the passageway of the connecting block and sealably mounted to one side thereof, and wherein the support conduit is substantially coaxially aligned relative to the passageway defined by the connecting block and is further sealably mounted to the opposite side of the connecting block, and wherein a sealing member is positioned between both the support conduit, and the shaft; and the adjoining connecting block.
28. A processing apparatus as claimed in claim 23 , and wherein the proximal end of the shaft is engaged by the bearing, and wherein the proximal end of the shaft defines, at least in part, a first coolant passageway which facilitates the cooling of the sealing component which cooperates with the shaft.
29. A processing apparatus as claimed in claim 28 , and wherein the first outer shell further defines a second coolant passageway which facilitates the cooling of the sealing component which cooperates with the shaft.
30. A processing apparatus as claimed in claim 29 , and wherein the first and second coolant passageways are coupled in fluid flowing relation by way of an external conduit.
31. A processing apparatus as claimed in claim 30 , and wherein the first coolant passageway has a first intake end, and an opposite, second, exhaust end, and wherein a source of coolant is supplied to the first intake end.
32. A processing apparatus as claimed in claim 31 , and wherein the first coolant passageway further comprises:
a first cooling slot which is positioned near, and which circumscribes, at least in part, the proximal end of the shaft, and which is further disposed in cooling relation relative to the sealing component which cooperates with the shaft;
a first portion of the first coolant passageway which extends longitudinally along the shaft and which has a first end which is coupled in fluid flowing relation relative to the first cooling slot, and an opposite second end, and wherein a first aperture is formed in the shaft at the second end of the first portion; and
a second portion of the first coolant passageway which extends longitudinally along the shaft, and which has a first end which is coupled in fluid flowing relation relative to the first cooling slot, and an opposite second end, and wherein a second aperture is formed in the shaft at the second end of the second portion.
33. A processing apparatus as claimed in claim 32 , and further comprising:
a second outer shell having opposite first and second ends, and which further defines a passageway which extends longitudinally thereof and between the first and second ends, and wherein first end of the second outer shell is mounted on, and is substantially coaxially aligned relative to, the second end of the first outer shell, and wherein the shaft extends through the second outer shell and is rotatable relative thereto; and
a plurality of sealing components which are received in the passageway which is defined by the second outer shell, and which sealingly couple the shaft to the second outer shell, and wherein first and second ring gaps are defined between adjacent sealing components, the shaft, and the second, outer shell.
34. A processing apparatus as claimed in claim 33 , and wherein the first aperture formed in the shaft, and located at the second end of the first portion of the first coolant passageway is located within the first ring gap, and wherein a coolant inlet is coupled in fluid flowing relation relative to the first ring gap, and wherein a source of coolant enters the coolant inlet, travels along the first ring gap, and then enters the first portion of the first coolant passageway by way of the first aperture.
35. A processing apparatus as claimed in claim 34 , and wherein the second aperture formed in the shaft, and which is located at the second end of the second portion of the first coolant passageway is located within the second ring gap, and wherein the external conduit has a first end which is coupled in fluid flowing relation relative to the second ring gap, and an opposite second end which is coupled in fluid flowing relation relative to the second coolant passageway, and wherein the coolant leaving the first portion of the first coolant passageway travels along the first cooling slot and then passes into the second portion of the first coolant passageway, and wherein the coolant exits the second portion of the first coolant passageway by way of the second aperture, and then travels along the second ring gap, and wherein the coolant exits the second ring gap and enters into the first end of the external conduit, and wherein the coolant exits the second end of the external conduit and enters into the second coolant passageway.
36. A processing apparatus as claimed in claim 35 , and wherein the second coolant passageway comprises:
a second coolant slot which is positioned near, and which further circumscribes, at least in part, the first end of the first outer shell, and which is further disposed in spaced relation relative to the first coolant slot, and wherein the second coolant slot has a first, intake end, and a second, exhaust end, and wherein the second end of the external conduit is coupled in fluid flowing relation relative to the first end of the second coolant slot; and
an external exhaust conduit coupled to the second end of the second coolant slot, and which exhausts the coolant to ambient.
37. A processing apparatus for semiconductor work pieces, comprising:
a processing chamber having an internal cavity and which has a plurality of rotatable processing stations within the internal cavity, and which are each operable to process a semiconductor work piece, and wherein each of the plurality of rotatable processing stations can move upwardly, downwardly and/or rotate relative to the processing chamber;
sealing assemblies mounted on the processing chamber and which maintain the internal cavity of the processing chamber substantially sealed while the rotatable processing stations move upwardly, downwardly, and rotate; and
a cooling apparatus for cooling the sealing assemblies to facilitate the proper operation of the sealing assemblies.
38. A processing apparatus as claimed in claim 37 , and further comprising:
a bellows seal having opposite first and second ends, and which further has a passageway which extends between the first and second ends, and wherein the processing chamber has a bottom surface, and the first end of the bellows is sealably secured to the bottom surface of the processing chamber; and
an elastic sealing member sealably cooperating with the bellows seal.
39. A processing apparatus as claimed in claim 38 , and further comprising:
a first outer shell having first and second ends, and which further has a passageway which extends between the first and second ends, and wherein the second end of the bellows is sealably mounted to the first end of the outer shell;
a shaft extending into the passageway of the outer shell and which is further rotatable relative thereto; and
a magnetic sealing component mounted on the first outer shell and sealably cooperating with the shaft so as to sealably secure the shaft for rotatable motion relative to first outer shell and the bellows seal.
40. A processing apparatus as claimed in claim 39 , and further comprising:
a sealing component positioned between the first end of the first outer shell, and the second end of the bellows, so as to facilitate the sealing of the bellows to the first outer shell.
41. A processing apparatus as claimed in claim 37 , and wherein the cooling apparatus comprises, at least in part, water cooling conduits, and wherein one of the water cooling conduits comprises an externally mounted conduit.
42. A processing apparatus as claimed in claim 41 , and wherein the cooling apparatus further comprises:
a first coolant passageway which is formed in the shaft, and which is positioned, at least in part near the sealing component; and
a second coolant passageway which is formed, in the first outer shell, and which is positioned, at least in part, near the sealing component, and wherein the first and second coolant passageways are coupled in fluid flowing relation one relative to the other by way of the externally mounted conduit.
43. A processing apparatus as claimed in claim 42 , and further comprising:
a second outer shell having opposite first and second ends, and which further has a passageway which extends longitudinally thereof, and between the first and second ends, and wherein first end of the second outer shell is mounted on, and is substantially coaxially aligned relative to, the second end of the first outer shell, and wherein the shaft extends through the second outer shell and is rotatable relative thereto; and
a plurality of sealing components which are received in the passageway of the second outer shell and which sealingly couple the shaft to the second outer shell, and wherein first and second ring gaps are defined between adjacent sealing components, the shaft, and the second, outer shell.
44. A processing apparatus as claimed in claim 43 , and further comprising:
an external coolant source coupled in fluid flowing relation relative to the first ring gap, and wherein the first ring gap and the first coolant passageway are coupled in fluid flowing relation, and wherein the source of the external coolant enters the first coolant passageway after first passing along the first ring gap.
45. A processing apparatus as claimed in claim 44 , and wherein at least one of the water cooling conduits is an external conduit having opposite first and second ends, and wherein the first coolant passageway is coupled in fluid flowing relation relative to the second ring gap, and wherein the external conduit has a first end coupled in fluid flowing relation relative to the second ring gap, and the second end of the external conduit is coupled in fluid flowing relation relative to the second coolant passageway, and wherein coolant in the first coolant passageway passes by means of the external conduit to the second coolant passageway.
46. A method for processing semiconductor work pieces, comprising:
providing a processing chamber having an internal cavity;
providing a plurality of processing stations within the internal cavity of the processing chamber;
positioning individual semiconductor work pieces on each of the individual processing stations; and
rotating and heating the individual processing stations so as to facilitate the effective processing of the semiconductor work pieces within the internal cavity of the processing chamber.
47. A method as claimed in claim 46 , and wherein the plurality of processing stations are synchronously rotated.
48. A processing apparatus for semiconductor work pieces, comprising:
a chamber defining an internal cavity;
a plurality of rotatable and heated processing stations received in the internal cavity, and which are each operable to process a semiconductor work piece; and wherein at least two of the processing stations rotate in a substantially synchronous fashion so as to facilitate the substantially uniform processing of the semiconductor work pieces; and
a motor drivingly coupled to the at least two of the rotatable and heated processing stations, and which facilitates the synchronous rotation of the at least two processing stations.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/016,742 US9947562B2 (en) | 2005-08-05 | 2011-01-28 | Method and apparatus for processing semiconductor work pieces |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100285632A CN100358098C (en) | 2005-08-05 | 2005-08-05 | Semiconductor arts piece processing device |
CN200510028563.2 | 2005-08-05 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/016,742 Division US9947562B2 (en) | 2005-08-05 | 2011-01-28 | Method and apparatus for processing semiconductor work pieces |
Publications (1)
Publication Number | Publication Date |
---|---|
US20070032097A1 true US20070032097A1 (en) | 2007-02-08 |
Family
ID=37700236
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/441,291 Abandoned US20070032097A1 (en) | 2005-08-05 | 2006-05-24 | Method and apparatus for processing semiconductor work pieces |
US13/016,742 Active 2029-08-11 US9947562B2 (en) | 2005-08-05 | 2011-01-28 | Method and apparatus for processing semiconductor work pieces |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/016,742 Active 2029-08-11 US9947562B2 (en) | 2005-08-05 | 2011-01-28 | Method and apparatus for processing semiconductor work pieces |
Country Status (3)
Country | Link |
---|---|
US (2) | US20070032097A1 (en) |
JP (1) | JP4850615B2 (en) |
CN (1) | CN100358098C (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090139453A1 (en) * | 2007-11-30 | 2009-06-04 | Aihua Chen | Multi-station plasma reactor with multiple plasma regions |
US20170057094A1 (en) * | 2015-08-31 | 2017-03-02 | Asm Ip Holding B.V. | Substrate processing apparatus, recording medium, and method of processing substrates |
WO2018057369A1 (en) * | 2016-09-22 | 2018-03-29 | Applied Materials, Inc. | Heater pedestal assembly for wide range temperature control |
US9947562B2 (en) | 2005-08-05 | 2018-04-17 | Applied Materials, Inc. | Method and apparatus for processing semiconductor work pieces |
US20190032210A1 (en) * | 2017-07-27 | 2019-01-31 | Applied Materials, Inc. | Quick disconnect resistance temperature detector assembly for rotating pedestal |
US10280507B2 (en) * | 2017-04-17 | 2019-05-07 | Applied Materials, Inc. | Flowable gapfill using solvents |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2065177B1 (en) * | 2007-11-30 | 2010-08-18 | Komax Holding AG | Hotplate with lifting element |
JP5562734B2 (en) * | 2010-06-17 | 2014-07-30 | 住友重機械工業株式会社 | Transport device |
TWI452001B (en) * | 2011-09-05 | 2014-09-11 | Sumitomo Heavy Industries | Handling device |
CN103000557B (en) * | 2011-09-13 | 2015-07-29 | 住友重机械工业株式会社 | Conveyer |
US20170114462A1 (en) * | 2015-10-26 | 2017-04-27 | Applied Materials, Inc. | High productivity pecvd tool for wafer processing of semiconductor manufacturing |
CN105296937B (en) * | 2015-12-02 | 2017-10-13 | 苏州奥夫特光学技术有限公司 | A kind of water cooling plant for optical filter vacuum evaporation equipment |
CN106935538B (en) * | 2015-12-30 | 2020-08-04 | 上海微电子装备(集团)股份有限公司 | Slide glass conveying device and conveying method thereof |
FR3086934B1 (en) * | 2018-10-08 | 2021-01-01 | Commissariat Energie Atomique | OBJECT TRANSPORT SYSTEM UNDER CONTROLLED ATMOSPHERE |
CN111540695B (en) * | 2020-05-07 | 2023-10-13 | 北京北方华创微电子装备有限公司 | Rotating assembly and semiconductor processing equipment |
WO2023027707A1 (en) * | 2021-08-25 | 2023-03-02 | Applied Materials, Inc. | Process gas containment using elastic objects mated with reactor interfaces |
CN116479411B (en) * | 2023-04-27 | 2024-03-12 | 大连皓宇电子科技有限公司 | Multistation silicon chip handling device that chemical vapor deposition equipment was used |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4548698A (en) * | 1983-02-26 | 1985-10-22 | Leybold-Heraeus Gmbh | Equipment for producing coatings having a rotationally symmetric thickness profile by cathodic evaporation |
US4821674A (en) * | 1987-03-31 | 1989-04-18 | Deboer Wiebe B | Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment |
US5029555A (en) * | 1988-03-10 | 1991-07-09 | International Business Machines Corporation | Wafer holder method and apparatus in a vacuum deposition system |
US5421892A (en) * | 1992-12-25 | 1995-06-06 | Tokyo Electron Kabushiki Kaisha | Vertical heat treating apparatus |
US5434110A (en) * | 1992-06-15 | 1995-07-18 | Materials Research Corporation | Methods of chemical vapor deposition (CVD) of tungsten films on patterned wafer substrates |
US5580524A (en) * | 1990-09-18 | 1996-12-03 | Anagen Limited | Assay or reaction apparatus with agitating device |
US5855681A (en) * | 1996-11-18 | 1999-01-05 | Applied Materials, Inc. | Ultra high throughput wafer vacuum processing system |
US6197121B1 (en) * | 1996-11-27 | 2001-03-06 | Emcore Corporation | Chemical vapor deposition apparatus |
US6235121B1 (en) * | 1999-01-26 | 2001-05-22 | Tokyo Electron Limited | Vertical thermal treatment apparatus |
US6576062B2 (en) * | 2000-01-06 | 2003-06-10 | Tokyo Electron Limited | Film forming apparatus and film forming method |
US6580082B1 (en) * | 2000-09-26 | 2003-06-17 | Axcelis Technologies, Inc. | System and method for delivering cooling gas from atmospheric pressure to a high vacuum through a rotating seal in a batch ion implanter |
US6620254B2 (en) * | 1998-12-15 | 2003-09-16 | Unaxis Balzers Ag | Planetary system workpiece support and method for surface treatment of workpieces |
US6689221B2 (en) * | 2000-12-04 | 2004-02-10 | Applied Materials, Inc. | Cooling gas delivery system for a rotatable semiconductor substrate support assembly |
US20050011459A1 (en) * | 2003-07-15 | 2005-01-20 | Heng Liu | Chemical vapor deposition reactor |
US6957956B2 (en) * | 2002-04-09 | 2005-10-25 | Tokyo Electron Limited | Vertical heat treating equipment |
US20070209932A1 (en) * | 2006-03-10 | 2007-09-13 | Veeco Instruments Inc. | Sputter deposition system and methods of use |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3128205A (en) | 1961-09-11 | 1964-04-07 | Optical Coating Laboratory Inc | Apparatus for vacuum coating |
US4438154A (en) | 1982-04-28 | 1984-03-20 | Stanley Electric Co., Ltd. | Method of fabricating an amorphous silicon film |
US4485759A (en) | 1983-01-19 | 1984-12-04 | Multi-Arc Vacuum Systems Inc. | Planetary substrate support apparatus for vapor vacuum deposition coating |
US4579618A (en) | 1984-01-06 | 1986-04-01 | Tegal Corporation | Plasma reactor apparatus |
US4790921A (en) | 1984-10-12 | 1988-12-13 | Hewlett-Packard Company | Planetary substrate carrier method and apparatus |
US5020475A (en) | 1987-10-15 | 1991-06-04 | Epsilon Technology, Inc. | Substrate handling and transporting apparatus |
JPH01318235A (en) * | 1988-06-20 | 1989-12-22 | Kawasaki Steel Corp | Semiconductor manufacturing device |
US5165165A (en) * | 1989-06-02 | 1992-11-24 | Canon Kabushiki Kaisha | Part inserting apparatus and method for use |
EP0452779B1 (en) * | 1990-04-20 | 1996-03-27 | Applied Materials, Inc. | Physical vapor deposition clamping mechanism |
JPH04326725A (en) * | 1991-04-26 | 1992-11-16 | Tokyo Electron Ltd | Plasma apparatus |
US5370739A (en) | 1992-06-15 | 1994-12-06 | Materials Research Corporation | Rotating susceptor semiconductor wafer processing cluster tool module useful for tungsten CVD |
JP2642858B2 (en) | 1993-12-20 | 1997-08-20 | 日本碍子株式会社 | Ceramic heater and heating device |
US5928427A (en) | 1994-12-16 | 1999-07-27 | Hwang; Chul-Ju | Apparatus for low pressure chemical vapor deposition |
US5830277A (en) * | 1995-05-26 | 1998-11-03 | Mattson Technology, Inc. | Thermal processing system with supplemental resistive heater and shielded optical pyrometry |
US5667592A (en) * | 1996-04-16 | 1997-09-16 | Gasonics International | Process chamber sleeve with ring seals for isolating individual process modules in a common cluster |
JP2825087B2 (en) * | 1996-09-30 | 1998-11-18 | 日本電気株式会社 | Cleaning equipment |
US5911834A (en) * | 1996-11-18 | 1999-06-15 | Applied Materials, Inc. | Gas delivery system |
US6152070A (en) * | 1996-11-18 | 2000-11-28 | Applied Materials, Inc. | Tandem process chamber |
US6352593B1 (en) * | 1997-08-11 | 2002-03-05 | Torrex Equipment Corp. | Mini-batch process chamber |
US5855164A (en) * | 1998-05-21 | 1999-01-05 | Chiang; Hanh | Roasting apparatus easily convertible into a bread making apparatus |
US20010009177A1 (en) * | 1998-07-13 | 2001-07-26 | Laizhong Luo | Systems and methods for two-sided etch of a semiconductor substrate |
US6143082A (en) * | 1998-10-08 | 2000-11-07 | Novellus Systems, Inc. | Isolation of incompatible processes in a multi-station processing chamber |
DE19922919C2 (en) * | 1999-05-19 | 2002-01-17 | Infineon Technologies Ag | Plant for processing wafers |
US6331212B1 (en) | 2000-04-17 | 2001-12-18 | Avansys, Llc | Methods and apparatus for thermally processing wafers |
US6413321B1 (en) * | 2000-12-07 | 2002-07-02 | Applied Materials, Inc. | Method and apparatus for reducing particle contamination on wafer backside during CVD process |
US6902622B2 (en) * | 2001-04-12 | 2005-06-07 | Mattson Technology, Inc. | Systems and methods for epitaxially depositing films on a semiconductor substrate |
US6807972B2 (en) | 2002-03-29 | 2004-10-26 | Applied Materials, Inc. | Gutter and splash-guard for protecting a wafer during transfer from a single wafer cleaning chamber |
US7201808B2 (en) | 2002-03-29 | 2007-04-10 | Applied Materials, Inc. | Method and apparatus for rotating a semiconductor substrate |
JP2003297275A (en) * | 2002-04-05 | 2003-10-17 | Hitachi High-Technologies Corp | Ion beam milling method and ion beam milling machine |
US20040247787A1 (en) * | 2002-04-19 | 2004-12-09 | Mackie Neil M. | Effluent pressure control for use in a processing system |
JP4417669B2 (en) * | 2003-07-28 | 2010-02-17 | 日本エー・エス・エム株式会社 | Semiconductor processing apparatus and semiconductor wafer introduction method |
US7827930B2 (en) * | 2004-01-26 | 2010-11-09 | Applied Materials, Inc. | Apparatus for electroless deposition of metals onto semiconductor substrates |
US20060005856A1 (en) * | 2004-06-29 | 2006-01-12 | Applied Materials, Inc. | Reduction of reactive gas attack on substrate heater |
US8454750B1 (en) * | 2005-04-26 | 2013-06-04 | Novellus Systems, Inc. | Multi-station sequential curing of dielectric films |
US8137465B1 (en) * | 2005-04-26 | 2012-03-20 | Novellus Systems, Inc. | Single-chamber sequential curing of semiconductor wafers |
US20060281310A1 (en) | 2005-06-08 | 2006-12-14 | Applied Materials, Inc. | Rotating substrate support and methods of use |
CN100358098C (en) | 2005-08-05 | 2007-12-26 | 中微半导体设备(上海)有限公司 | Semiconductor arts piece processing device |
CN100358097C (en) * | 2005-08-05 | 2007-12-26 | 中微半导体设备(上海)有限公司 | Semiconductor technology processing system and method |
CN100362620C (en) * | 2005-08-11 | 2008-01-16 | 中微半导体设备(上海)有限公司 | Loading umloading device of semiconductor processing piece and its loading and unloading method |
-
2005
- 2005-08-05 CN CNB2005100285632A patent/CN100358098C/en active Active
-
2006
- 2006-05-24 US US11/441,291 patent/US20070032097A1/en not_active Abandoned
- 2006-08-07 JP JP2006214829A patent/JP4850615B2/en active Active
-
2011
- 2011-01-28 US US13/016,742 patent/US9947562B2/en active Active
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4548698A (en) * | 1983-02-26 | 1985-10-22 | Leybold-Heraeus Gmbh | Equipment for producing coatings having a rotationally symmetric thickness profile by cathodic evaporation |
US4821674A (en) * | 1987-03-31 | 1989-04-18 | Deboer Wiebe B | Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment |
US5029555A (en) * | 1988-03-10 | 1991-07-09 | International Business Machines Corporation | Wafer holder method and apparatus in a vacuum deposition system |
US5580524A (en) * | 1990-09-18 | 1996-12-03 | Anagen Limited | Assay or reaction apparatus with agitating device |
US5434110A (en) * | 1992-06-15 | 1995-07-18 | Materials Research Corporation | Methods of chemical vapor deposition (CVD) of tungsten films on patterned wafer substrates |
US5421892A (en) * | 1992-12-25 | 1995-06-06 | Tokyo Electron Kabushiki Kaisha | Vertical heat treating apparatus |
US5855681A (en) * | 1996-11-18 | 1999-01-05 | Applied Materials, Inc. | Ultra high throughput wafer vacuum processing system |
US6197121B1 (en) * | 1996-11-27 | 2001-03-06 | Emcore Corporation | Chemical vapor deposition apparatus |
US6620254B2 (en) * | 1998-12-15 | 2003-09-16 | Unaxis Balzers Ag | Planetary system workpiece support and method for surface treatment of workpieces |
US6235121B1 (en) * | 1999-01-26 | 2001-05-22 | Tokyo Electron Limited | Vertical thermal treatment apparatus |
US6576062B2 (en) * | 2000-01-06 | 2003-06-10 | Tokyo Electron Limited | Film forming apparatus and film forming method |
US6580082B1 (en) * | 2000-09-26 | 2003-06-17 | Axcelis Technologies, Inc. | System and method for delivering cooling gas from atmospheric pressure to a high vacuum through a rotating seal in a batch ion implanter |
US6689221B2 (en) * | 2000-12-04 | 2004-02-10 | Applied Materials, Inc. | Cooling gas delivery system for a rotatable semiconductor substrate support assembly |
US6957956B2 (en) * | 2002-04-09 | 2005-10-25 | Tokyo Electron Limited | Vertical heat treating equipment |
US20050011459A1 (en) * | 2003-07-15 | 2005-01-20 | Heng Liu | Chemical vapor deposition reactor |
US20070209932A1 (en) * | 2006-03-10 | 2007-09-13 | Veeco Instruments Inc. | Sputter deposition system and methods of use |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9947562B2 (en) | 2005-08-05 | 2018-04-17 | Applied Materials, Inc. | Method and apparatus for processing semiconductor work pieces |
US20090139453A1 (en) * | 2007-11-30 | 2009-06-04 | Aihua Chen | Multi-station plasma reactor with multiple plasma regions |
US8336488B2 (en) * | 2007-11-30 | 2012-12-25 | Advanced Micro-Fabrication Equipment, Inc. Asia | Multi-station plasma reactor with multiple plasma regions |
US20170057094A1 (en) * | 2015-08-31 | 2017-03-02 | Asm Ip Holding B.V. | Substrate processing apparatus, recording medium, and method of processing substrates |
US10822698B2 (en) * | 2015-08-31 | 2020-11-03 | Asm Ip Holding B.V. | Substrate processing apparatus, recording medium, and method of processing substrates |
WO2018057369A1 (en) * | 2016-09-22 | 2018-03-29 | Applied Materials, Inc. | Heater pedestal assembly for wide range temperature control |
US10910238B2 (en) | 2016-09-22 | 2021-02-02 | Applied Materials, Inc. | Heater pedestal assembly for wide range temperature control |
US10280507B2 (en) * | 2017-04-17 | 2019-05-07 | Applied Materials, Inc. | Flowable gapfill using solvents |
US20190032210A1 (en) * | 2017-07-27 | 2019-01-31 | Applied Materials, Inc. | Quick disconnect resistance temperature detector assembly for rotating pedestal |
US10704142B2 (en) * | 2017-07-27 | 2020-07-07 | Applied Materials, Inc. | Quick disconnect resistance temperature detector assembly for rotating pedestal |
Also Published As
Publication number | Publication date |
---|---|
CN1909183A (en) | 2007-02-07 |
JP4850615B2 (en) | 2012-01-11 |
JP2007049151A (en) | 2007-02-22 |
US9947562B2 (en) | 2018-04-17 |
US20110305544A1 (en) | 2011-12-15 |
CN100358098C (en) | 2007-12-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9947562B2 (en) | Method and apparatus for processing semiconductor work pieces | |
CN105830201A (en) | Laser annealing device, serial conveyance path for laser annealing, laser beam radiation means, and laser annealing method | |
CN115070150A (en) | Online three-cavity vacuum welding furnace and vacuum welding process | |
CN117286570B (en) | Epitaxial equipment | |
JP6776214B2 (en) | Heat treatment equipment | |
JP6271096B2 (en) | Heat treatment equipment | |
CN116625096A (en) | Drying mechanism of chip plastic package curing device | |
CN116489836B (en) | Semiconductor heating plate structure and semiconductor track device | |
CN210481497U (en) | Tin-plating solder strip cooling system | |
CN116604123A (en) | Vacuum reflow oven and product processing method using the same | |
CN115763322A (en) | IGBT chip vacuum welding furnace capable of realizing rapid cooling and temperature rise and fall rate adjustment | |
CN103332433A (en) | Mattress spring processing equipment capable of being cooled by liquid with novel conveying system | |
KR920005799B1 (en) | Manufacturing apparatus of semiconductor device | |
CN208078840U (en) | A kind of motor stator reshaping device | |
CN219357459U (en) | Stretching and correcting mechanism for oriented electrical steel | |
KR20070017081A (en) | semiconductor workpiece processing apparatus | |
CN206307588U (en) | A kind of cooling structure of conveying device | |
US5992613A (en) | Air cooled pusher bar support for LEHR loader | |
CN220852701U (en) | Beef paste production is with high-efficient cooling device | |
CN218785773U (en) | Injection molding cooling device | |
CN215750316U (en) | Automatic nasal oxygen cannula assembling device | |
CN221166669U (en) | Stainless steel strip production cooling mechanism | |
CN117116814B (en) | Substrate processing apparatus | |
CN107027942A (en) | The intelligent burner module of continuous sugaring is heated in a kind of magnetic induction | |
CN221115800U (en) | Dry-type cooling transfer chain |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: ADVANCED MICRO-FABRICATION EQUIPMENT, INC. ASIA, C Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, AIHUA;TODAKA, RYOJI;YIN, GERALD;REEL/FRAME:017930/0868 Effective date: 20060516 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |