US20060213522A1 - Thin film intrauterine device - Google Patents

Thin film intrauterine device Download PDF

Info

Publication number
US20060213522A1
US20060213522A1 US11/392,998 US39299806A US2006213522A1 US 20060213522 A1 US20060213522 A1 US 20060213522A1 US 39299806 A US39299806 A US 39299806A US 2006213522 A1 US2006213522 A1 US 2006213522A1
Authority
US
United States
Prior art keywords
thin film
uterus
intrauterine device
shape
sufficient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/392,998
Inventor
Leticia Menchaca
A. Johnson
Vikas Gupta
Valery Martynov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TiNi Alloy Co
Original Assignee
TiNi Alloy Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TiNi Alloy Co filed Critical TiNi Alloy Co
Priority to US11/392,998 priority Critical patent/US20060213522A1/en
Publication of US20060213522A1 publication Critical patent/US20060213522A1/en
Assigned to TINI ALLOY COMPANY reassignment TINI ALLOY COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MENCHACA, LETECIA, GUPTA, VIKAS, JOHNSON, A. DAVID, MARTYNOV, VALERY
Abandoned legal-status Critical Current

Links

Images

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F6/00—Contraceptive devices; Pessaries; Applicators therefor
    • A61F6/06—Contraceptive devices; Pessaries; Applicators therefor for use by females
    • A61F6/14—Contraceptive devices; Pessaries; Applicators therefor for use by females intra-uterine type

Definitions

  • This invention relates to contraceptive intrauterine devices (IUDs) and methods of preventing conception.
  • Intrauterine contraceptive devices are objects inserted into the uterus to prevent conception. Introducing an object into the uterus for birth control is an ancient discovery that has evolved to become the modern IUD. The use of such devices is based on the fact that the presence of a foreign object in the uterus discourages conception. IUDs have been invented of numerous and varied solid shapes and configurations. The most well known shapes are the ring, the “S”, the coil or spiral, the “T” and the “T” with its transversal arms bent down. These devices are configured to occupy a significant portion of the uterine fundus in order to prevent expulsion through the cervical os, a lumen of a few millimeters in diameter.
  • IUDs are most commonly inserted using an insertion tube and a complementary plunger.
  • the extended arms of the “T” Prior to insertion, the extended arms of the “T” are manually inserted into the upper end of the insertion tube
  • the tube is of sufficient diameter and malleability to constrain the extended arms of the device in a folded position during insertion.
  • the loaded tube is pushed through the cervical os into the uterine cavity.
  • the tube is withdrawn to release the IUD while the inner plunger is manually held stationary. Withdrawal of the insertion tube allows the arms of the “T” to unfold inside the uterus.
  • the required manual placement of the IUD in the insertion tube is disadvantageous because it is cumbersome, time consuming, and increases the possibilities of compromising the sterile field.
  • the IUD must be positioned by human manipulation, there exists a hazard of erroneous placement that could reduce contraceptive effectiveness and may be a source of injury to the patient.
  • IUDs of some configurations must be positioned in the insertion tube by drawing back on the “tail,” i.e., the string attached to the IUD for removal from the uterus. Such a method, however, is undesirable for an IUD having a “T” configuration since the arms would be drawn upwards. In some devices the folding of the IUD or placement in the insertion tube occurs after the initial placement of the insertion tube in the uterus, resulting in less control on placement position.
  • Nitinol is already well established in other areas of medicine and thin film devices are being developed to replace or expand these applications.
  • thin film devices are successfully used in neuro- and neurovascular surgery, where miniaturization, flexibility, and compliance are imperative to reach small vessels and to remove clots and block aneurisms.
  • Another object to provide a device and method of use of the type described which is relatively smaller, safer, less intrusive, easier to insert and remove, more comfortable, and less expensive to manufacture than currently available IUDs.
  • the invention provides contraceptive IUD devices, and methods of use, made from thin-film, shape memory alloy materials exhibiting superplasticity and shape memory at the internal body temperatures of humans and other mammals.
  • FIG. 1 is a perspective view of a device in accordance with one embodiment of the invention.
  • FIG. 2 is a perspective view of a device in accordance with another embodiment.
  • the contraceptive devices of the invention are comprised of thin films of a shape memory alloy (SMA), such as TiNi (also known as Nitinol).
  • SMA shape memory alloy
  • TiNi thin film is ⁇ 5 microns thick and has shape memory at human body temperature. At lower temperatures, the material is in its martensitic state, is highly ductile, and can withstand large deformations. At higher temperatures, such as that of the human body, the material undergoes a phase transformation to a more rigid austenitic state in which it is not easily deformed.
  • the contraceptive thin film IUD is a micro-fabricated three-dimensional object.
  • FIG. 1 shows generally at 10 a thin film IUD device of frusto-conical shape in accordance with one preferred embodiment of the invention.
  • FIG. 2 shows generally at 20 a thin film IUD device in a generally U-shape in accordance with another preferred embodiment.
  • the invention contemplates that many other three-dimensional geometric shapes can be used for the device as long as the portions of the device surfaces make contact with the uterus wall sufficient to cause irritation of the wall. The irritation is believed to be the physiological reaction which prevents the mammal's egg from attaching to the wall, which would otherwise result in pregnancy. The uterus wall reacts and essentially “thinks” that conception has taken place when it has not.
  • Micro-electro-mechanical (MEM) techniques developed recently at TiNi Alloy Co permit the fabrication of seamless thin film three-dimensional structures that were impossible to fabricate in the past. Since this TiNi alloy film has a “body temperature phase transformation”, then once inserted and released into the uterine cavity (temperatures ⁇ 37° C.), the thin film contraceptive expands within the uterus so that the film makes contact with the uterine walls with sufficient force to maintain its predetermined shape. The inherent elasticity of the thin film will also enable it to comply and move with the walls during contraction and relaxation of the uterine muscles.
  • the IUD can be folded or rolled at low temperatures and introduced into the uterus within a very narrow tube, i.e. a catheter of less than 1 mm diameter. Once inside the uterus, the contraceptive foil is released from the catheter.
  • the inherent properties of the shape memory alloy allow the IUD to automatically unfold and adopt a desired shape.
  • the thin film contraceptive IUD can be manufactured, sterilized and pre-packed inside a catheter, minimizing contamination risks.
  • the thin film IUDs can be micro-fabricated with appendages or tails. These would not be placed extracervically but would remain inside the uterus or cervix. Material for adding radio-opaque features to the contraceptive can also be used.
  • a comparison between a regular IUD insertion tube and that used for a thin film contraceptive device is illustrated in FIG. 1 .
  • three-dimensional shapes of thin films are fabricated using the general teachings of Busch et. al. U.S. Pat. No. 5,061,914, the disclosure of which is incorporated by this reference.
  • Multiple layers of TiNi thin film and sacrificial material are sputter deposited sequentially on a polished and oxidized silicon wafer.
  • the sacrificial material can be chromium, aluminum, copper, or TiCuSil, a material obtained through Wesgo Metals. Chromium is preferentially used as a sacrificial layer.
  • a thin chromium layer is sputter deposited on the oxidized silicon wafer using RF sputtering at argon pressure of about 2 milliTorr.
  • the thickness of the deposited thin film can be 500 A or more.
  • a thin layer of TiNi is sputter deposited on top of the chromium layer using DC sputtering at an argon pressure of about 2 milliTorr.
  • the thickness of the deposited TiNi layer can be from 1 to 40 microns.
  • a thin chromium layer is then sputter deposited on top of the device layer. Typical thickness of this layer is about 1000 A.
  • This layer acts as a protective layer for the underlying TiNi layer during subsequent lithography steps and provides a sacrificial layer that in the final steps of fabrication is dissolved away chemically in order to selectively create a pocket between the two device layers.
  • Three-dimensional thin film shapes as shown in FIG. 1 require two photo masks (mask 1 and mask 2 ) with appropriate pattern designs.
  • the design of mask 1 determines the final three-dimensional shape of the device; e.g., solid triangles for cones, rectangles for cylinders, semicircles for hemispheres, etc.
  • Mask 2 contains designs for fenestration or any other surface patterns that may be needed for the final device.
  • Mask 1 is used to pattern the top sacrificial layer deposited on the wafer described above.
  • a thin layer of positive photo resist liquid is spin-coated on the above wafer at about 4000 rpm and baked at 90° C. in a clean room convection oven.
  • an ultraviolet light mask aligner the wafer and mask 1 are aligned and the photo resist layer is UV exposed though the mask plate which transfers the patterns from mask 1 on to the photo resist layer.
  • the wafer with exposed photo resist is immersed in developer solution to selectively remove the exposed sections of the photo resist thus creating windows in the photo resist layer on the wafer.
  • these windows in the photo resist allow for the selective etching of the chromium layer.
  • the photo resist layer is chemically dissolved away by immersing in a solvent.
  • the wafer is loaded back into the sputtering chamber that is taken to high vacuum.
  • the top exposed surface is sputter-etched to remove any contamination.
  • Sputter-etch is a process similar to sputtering except that in the case of sputter-etch the argon ions are accelerated to the substrate surface rather than the target surface. Highly energetic argon ions when operated in “sputter-etch” mode also remove the undesired thin native oxide layer on the surface, which may have formed during the lithography process.
  • another layer of TiNi film followed by another layer of chromium are sputter deposited on the substrate.
  • the resulting TiNi film is heat-treated at 500° C. in vacuum for crystallization so that the material exhibits the properties of shape memory and superelasticity.
  • Photo resist is spin coated again to pattern the layers with designs in mask 2 using the photolithography steps described above.
  • the underlying TiNi layers are also chemically etched with the same mask design in order to define the device's outer features.
  • This is followed by the complete removal of the photo resist layer.
  • the whole wafer with patterned layers is immersed in a chemical etchant to completely dissolve the sacrificial layer.
  • the etchant for this purpose should etch the sacrificial material selective to the device layer. This etching not only separates the devices from the substrate surface but also selectively creates an empty pocket between the two TiNi layers by etching away the chromium layer from between.
  • a pattern of fenestrations 14 ( FIG. 1 ) or 22 ( FIG. 2 ) can be formed in the TiNi layer.
  • the photo resist layer is patterned using mask 2 , which contains the necessary fenestration patterns.
  • the basic process sequence to fabricate thin film devices with fenestration patterns is the same as the one described above except for the added designs on mask 2 .
  • the chromium and TiNi layers are patterned by chemical etching.
  • the released multi-layered thin film devices from the above steps are in planar form which may be of various size and shapes: triangular, rectangular, semicircular etc. These multi-layered thin film devices may then be transformed into their corresponding three-dimensional shapes 12 ( FIG. 1 ) by inserting a stainless steel mandrel into the pocket between the TiNi layers and re-annealing them at 500° C. in vacuum. Re-annealing of the thin film device with an inserted mandrel causes shape-setting according to the shape of the mandrel.
  • Conical and hemispherical thin film devices with appended tentacle-type tails 16 or ridges 18 ( FIG. 1 ), or grooves 24 ( FIG. 2 ) may also be fabricated using the same processes.
  • TiNi In planar deposition of TiNi to produce three-dimensional structures, multiple layers, are deposited by planar sputtering, with intermediate sacrificial layers patterned selectively, producing structures that can be opened to produce cones, cylinders, and other shapes. Multiple alternating layers of TiNi film and Cr sacrificial layers are applied by sputtering alternatively from a TiNi target, patterning, depositing a sacrificial layer from a Cr target, patterning a second time, and depositing a second TiNi layer.
  • the number of TiNi layers is not limited to two: more complex structures may be formed by iteration of this sequence.
  • a metal such as copper is added as an integral part of the device. This is accomplished either by electroplating or by sputter deposition depending on the design of the finished film contraceptive product.
  • the tails 16 (or strings, ribbons etc.) can be formed in the device as integral features rather than attached or welded onto it. The tails can function as features for retrieval of the device, similar to the regular IUD tail, or as the medicated or contraceptive agent (copper) carrier.

Landscapes

  • Health & Medical Sciences (AREA)
  • Reproductive Health (AREA)
  • Engineering & Computer Science (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Vascular Medicine (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Orthopedics, Nursing, And Contraception (AREA)

Abstract

Contraceptive intrauterine devices made of thin film shape memory alloy materials. The devices are formed in three-dimensional shapes which contact uterus tissue of a human or other mammal to prevent conception. In certain embodiments, structural features such as tails, fenestrations, ridges or grooves are formed on the devices to enhance the contraceptive effect.

Description

    CROSS-REFERENCE TO PRIOR APPLICATION
  • This application claims the benefit under 35 USC §119(e) of U.S. provisional application serial No. 60/402,418 filed Aug. 8, 2002 and is a divisional of U.S. application Ser. No. 10/638,282 filed Aug. 7, 2003.
    • BACKGROUND OF THE INVENTION
  • 1.0 Field of Invention
  • This invention relates to contraceptive intrauterine devices (IUDs) and methods of preventing conception.
  • 2.0 Description of the Related Art
  • Reproductive medicine is lagging in contraception technologies at a time when the world population is about to include the largest proportion of people of reproductive age ever. This invention introduces Nitinol thin film, a recent major advancement in material science and micro-electro-mechanic technology, to help resolve longstanding limitations in existing contraceptive intrauterine devices.
  • Intrauterine contraceptive devices (IUDs) are objects inserted into the uterus to prevent conception. Introducing an object into the uterus for birth control is an ancient discovery that has evolved to become the modern IUD. The use of such devices is based on the fact that the presence of a foreign object in the uterus discourages conception. IUDs have been invented of numerous and varied solid shapes and configurations. The most well known shapes are the ring, the “S”, the coil or spiral, the “T” and the “T” with its transversal arms bent down. These devices are configured to occupy a significant portion of the uterine fundus in order to prevent expulsion through the cervical os, a lumen of a few millimeters in diameter.
  • Existing IUDs are most commonly inserted using an insertion tube and a complementary plunger. Prior to insertion, the extended arms of the “T” are manually inserted into the upper end of the insertion tube The tube is of sufficient diameter and malleability to constrain the extended arms of the device in a folded position during insertion. The loaded tube is pushed through the cervical os into the uterine cavity. When the desired position is achieved, the tube is withdrawn to release the IUD while the inner plunger is manually held stationary. Withdrawal of the insertion tube allows the arms of the “T” to unfold inside the uterus.
  • The required manual placement of the IUD in the insertion tube is disadvantageous because it is cumbersome, time consuming, and increases the possibilities of compromising the sterile field. Moreover, where the IUD must be positioned by human manipulation, there exists a hazard of erroneous placement that could reduce contraceptive effectiveness and may be a source of injury to the patient. Approximately 1 in 500 insertions of existing rigid IUDs cause perforation.
  • IUDs of some configurations must be positioned in the insertion tube by drawing back on the “tail,” i.e., the string attached to the IUD for removal from the uterus. Such a method, however, is undesirable for an IUD having a “T” configuration since the arms would be drawn upwards. In some devices the folding of the IUD or placement in the insertion tube occurs after the initial placement of the insertion tube in the uterus, resulting in less control on placement position.
  • Attempts have been made to reduce the size of convention solid IUDs to allow use by younger women, but reducing size and surface area result in a less effective contraceptive and an increased rate of expulsion. The challenges in adapting these devices for use by nulliparous women include reducing size to reduce trauma and adverse reactions, while maintaining a large enough inert or medicated surface area to maximize effectiveness and a size sufficient to resist expulsion. These problems have limited the use of existing IUDs, especially in younger women.
  • The use of Nitinol is already well established in other areas of medicine and thin film devices are being developed to replace or expand these applications. For example, thin film devices are successfully used in neuro- and neurovascular surgery, where miniaturization, flexibility, and compliance are imperative to reach small vessels and to remove clots and block aneurisms.
    • OBJECTS AND SUMMARY OF THE INVENTION
  • It is a general object of the invention to provide a new and improved reversible contraceptive device and method for intrauterine use in humans and other mammals
  • Another object to provide a device and method of use of the type described which is relatively smaller, safer, less intrusive, easier to insert and remove, more comfortable, and less expensive to manufacture than currently available IUDs.
  • In its general concept, the invention provides contraceptive IUD devices, and methods of use, made from thin-film, shape memory alloy materials exhibiting superplasticity and shape memory at the internal body temperatures of humans and other mammals.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a perspective view of a device in accordance with one embodiment of the invention.
  • FIG. 2 is a perspective view of a device in accordance with another embodiment.
    • DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • The contraceptive devices of the invention are comprised of thin films of a shape memory alloy (SMA), such as TiNi (also known as Nitinol). TiNi thin film is ˜5 microns thick and has shape memory at human body temperature. At lower temperatures, the material is in its martensitic state, is highly ductile, and can withstand large deformations. At higher temperatures, such as that of the human body, the material undergoes a phase transformation to a more rigid austenitic state in which it is not easily deformed.
  • The contraceptive thin film IUD is a micro-fabricated three-dimensional object. FIG. 1 shows generally at 10 a thin film IUD device of frusto-conical shape in accordance with one preferred embodiment of the invention. FIG. 2 shows generally at 20 a thin film IUD device in a generally U-shape in accordance with another preferred embodiment. The invention contemplates that many other three-dimensional geometric shapes can be used for the device as long as the portions of the device surfaces make contact with the uterus wall sufficient to cause irritation of the wall. The irritation is believed to be the physiological reaction which prevents the mammal's egg from attaching to the wall, which would otherwise result in pregnancy. The uterus wall reacts and essentially “thinks” that conception has taken place when it has not.
  • Micro-electro-mechanical (MEM) techniques developed recently at TiNi Alloy Co permit the fabrication of seamless thin film three-dimensional structures that were impossible to fabricate in the past. Since this TiNi alloy film has a “body temperature phase transformation”, then once inserted and released into the uterine cavity (temperatures ˜37° C.), the thin film contraceptive expands within the uterus so that the film makes contact with the uterine walls with sufficient force to maintain its predetermined shape. The inherent elasticity of the thin film will also enable it to comply and move with the walls during contraction and relaxation of the uterine muscles.
  • By virtue of the characteristics of TiNi shape memory alloy, the IUD can be folded or rolled at low temperatures and introduced into the uterus within a very narrow tube, i.e. a catheter of less than 1 mm diameter. Once inside the uterus, the contraceptive foil is released from the catheter. The inherent properties of the shape memory alloy allow the IUD to automatically unfold and adopt a desired shape. The thin film contraceptive IUD can be manufactured, sterilized and pre-packed inside a catheter, minimizing contamination risks. The thin film IUDs can be micro-fabricated with appendages or tails. These would not be placed extracervically but would remain inside the uterus or cervix. Material for adding radio-opaque features to the contraceptive can also be used. A comparison between a regular IUD insertion tube and that used for a thin film contraceptive device is illustrated in FIG. 1.
  • Fabrication of the Device
  • In the invention three-dimensional shapes of thin films are fabricated using the general teachings of Busch et. al. U.S. Pat. No. 5,061,914, the disclosure of which is incorporated by this reference. Multiple layers of TiNi thin film and sacrificial material are sputter deposited sequentially on a polished and oxidized silicon wafer. The sacrificial material can be chromium, aluminum, copper, or TiCuSil, a material obtained through Wesgo Metals. Chromium is preferentially used as a sacrificial layer.
  • A thin chromium layer is sputter deposited on the oxidized silicon wafer using RF sputtering at argon pressure of about 2 milliTorr. The thickness of the deposited thin film can be 500 A or more. A thin layer of TiNi is sputter deposited on top of the chromium layer using DC sputtering at an argon pressure of about 2 milliTorr. The thickness of the deposited TiNi layer can be from 1 to 40 microns. A thin chromium layer is then sputter deposited on top of the device layer. Typical thickness of this layer is about 1000 A. This layer acts as a protective layer for the underlying TiNi layer during subsequent lithography steps and provides a sacrificial layer that in the final steps of fabrication is dissolved away chemically in order to selectively create a pocket between the two device layers.
  • Three-dimensional thin film shapes as shown in FIG. 1 require two photo masks (mask1 and mask2) with appropriate pattern designs. The design of mask1 determines the final three-dimensional shape of the device; e.g., solid triangles for cones, rectangles for cylinders, semicircles for hemispheres, etc. Mask2 contains designs for fenestration or any other surface patterns that may be needed for the final device. Mask1 is used to pattern the top sacrificial layer deposited on the wafer described above.
  • Micro-photolithography techniques are then followed. A thin layer of positive photo resist liquid is spin-coated on the above wafer at about 4000 rpm and baked at 90° C. in a clean room convection oven. Using an ultraviolet light mask aligner, the wafer and mask1 are aligned and the photo resist layer is UV exposed though the mask plate which transfers the patterns from mask1 on to the photo resist layer. The wafer with exposed photo resist is immersed in developer solution to selectively remove the exposed sections of the photo resist thus creating windows in the photo resist layer on the wafer. When immersed in a chemical etchant, these windows in the photo resist allow for the selective etching of the chromium layer. After patterning, the photo resist layer is chemically dissolved away by immersing in a solvent.
  • The wafer is loaded back into the sputtering chamber that is taken to high vacuum. In the chamber, the top exposed surface is sputter-etched to remove any contamination. Sputter-etch is a process similar to sputtering except that in the case of sputter-etch the argon ions are accelerated to the substrate surface rather than the target surface. Highly energetic argon ions when operated in “sputter-etch” mode also remove the undesired thin native oxide layer on the surface, which may have formed during the lithography process. Following sputter-etch, another layer of TiNi film followed by another layer of chromium are sputter deposited on the substrate. The resulting TiNi film is heat-treated at 500° C. in vacuum for crystallization so that the material exhibits the properties of shape memory and superelasticity.
  • Photo resist is spin coated again to pattern the layers with designs in mask2 using the photolithography steps described above. In this step, after etching the top chromium layer, the underlying TiNi layers are also chemically etched with the same mask design in order to define the device's outer features. This is followed by the complete removal of the photo resist layer. To separate the devices from the surface of the substrate, the whole wafer with patterned layers is immersed in a chemical etchant to completely dissolve the sacrificial layer. The etchant for this purpose should etch the sacrificial material selective to the device layer. This etching not only separates the devices from the substrate surface but also selectively creates an empty pocket between the two TiNi layers by etching away the chromium layer from between.
  • A pattern of fenestrations 14 (FIG. 1) or 22 (FIG. 2) can be formed in the TiNi layer. To create fenestration patterns, the photo resist layer is patterned using mask2, which contains the necessary fenestration patterns. The basic process sequence to fabricate thin film devices with fenestration patterns is the same as the one described above except for the added designs on mask2. As described above, after patterning the photo resist layer with fenestration patterns, the chromium and TiNi layers are patterned by chemical etching.
  • The released multi-layered thin film devices from the above steps are in planar form which may be of various size and shapes: triangular, rectangular, semicircular etc. These multi-layered thin film devices may then be transformed into their corresponding three-dimensional shapes 12 (FIG. 1) by inserting a stainless steel mandrel into the pocket between the TiNi layers and re-annealing them at 500° C. in vacuum. Re-annealing of the thin film device with an inserted mandrel causes shape-setting according to the shape of the mandrel. Conical and hemispherical thin film devices with appended tentacle-type tails 16 or ridges 18 (FIG. 1), or grooves 24 (FIG. 2) may also be fabricated using the same processes.
  • In planar deposition of TiNi to produce three-dimensional structures, multiple layers, are deposited by planar sputtering, with intermediate sacrificial layers patterned selectively, producing structures that can be opened to produce cones, cylinders, and other shapes. Multiple alternating layers of TiNi film and Cr sacrificial layers are applied by sputtering alternatively from a TiNi target, patterning, depositing a sacrificial layer from a Cr target, patterning a second time, and depositing a second TiNi layer. The number of TiNi layers is not limited to two: more complex structures may be formed by iteration of this sequence.
  • During fabrication of three-dimensional nitinol thin film structures, a metal such as copper is added as an integral part of the device. This is accomplished either by electroplating or by sputter deposition depending on the design of the finished film contraceptive product. The tails 16 (or strings, ribbons etc.) can be formed in the device as integral features rather than attached or welded onto it. The tails can function as features for retrieval of the device, similar to the regular IUD tail, or as the medicated or contraceptive agent (copper) carrier.

Claims (19)

1. A method of preventing conception in a human or other mammal comprising the steps of providing an intrauterine device comprised of a thin film of shape memory alloy material, and placing the device in the uterus of the human or other mammal.
2. A method as in claim 1 in which the material has a crystalline phase change transformation temperature at which the device changes from an elastic phase shape when the material is below the temperature to a memory shape when the material is above the temperature, inserting the device into the uterus when the device is in the elastic phase, and enabling the device to change to the memory shape responsive to heat from the uterus.
3. An intrauterine device for use in the uterus of a human or other mammal, the device comprising a thin film formed of a shape memory alloy material that is characterized in having a crystalline phase change transformation temperature by which the film changes from an elastic phase shape when the material is below the temperature to a memory shape when the material is above the temperature, the elastic phase shape being sufficient to enable insertion of the device into the uterus, and the memory shape being sufficient to enable contact of at least a portion of the thin film with a wall of the uterus to prevent conception.
4. An intrauterine device as in claim 3 in which the memory shape is sufficient to conform to a portion of the uterus wall.
5. An intrauterine device as in claim 3 in which the memory shape is sufficient to resist ejection through a cervical channel leading from the uterus.
6. An intrauterine device as in claim 3 and further comprising a catheter enclosing the thin film when the film is in its elastic phase shape for enabling insertion of the device into the uterus.
7. An intrauterine device as in claim 3 and further comprising a structure formed on the thin film, the structure being selected from the group consisting of an appendage, a fenestration, a ridge, a groove and an indentation.
8. An intrauterine device as in claim 7 in which the structure is formed of a material selected from the group consisting of the same material forming the device, a metal, a polymer and an organic compound.
9. An intrauterine device as in claim 7 in which a plurality of structures are arrayed on the thin film in a pattern which is sufficient to control cell migration.
10. An intrauterine device as in claim 7 in which a plurality of structures are arrayed on the thin film in a pattern which is sufficient to control cell growth.
11. An intrauterine device as in claim 7 in which a plurality of structures are arrayed on the thin film in a pattern which is sufficient to bind with specific proteins.
12. An intrauterine device as in claim 7 in which a plurality of structures are arrayed on the thin film in a pattern which is sufficient to chemically modify the environment of the uterus.
13. (canceled)
14. (canceled)
15. An intrauterine device as in claim 3 in which at least one surface portion of the thin film has an attachment selected from the group consisting of copper, a hormone and a compound that enhances conception.
16. An intrauterine device as in claim 3 in which the material comprises a ternary alloy having an element selected from the group consisting of palladium, hafnium, platinum, aluminum, copper and nitrogen.
17. An intrauterine device as in claim 3 in which thin film comprises a portion which deliver a chemical selected from the group consisting of a chemical, a drug and a medication.
18. An intrauterine device as in claim 17 in which the chemical is delivered to a body part selected from the group consisting of the uterus, the cervix, the vagina and the fallopian tubes.
19. An intrauterine device as in claim 3 in which the device comprises a portion having changable properties selected from the group consisting of degradable, erodible and re-absorbable.
US11/392,998 2002-08-08 2006-03-30 Thin film intrauterine device Abandoned US20060213522A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/392,998 US20060213522A1 (en) 2002-08-08 2006-03-30 Thin film intrauterine device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US40241802P 2002-08-08 2002-08-08
US10/638,282 US7040323B1 (en) 2002-08-08 2003-08-07 Thin film intrauterine device
US11/392,998 US20060213522A1 (en) 2002-08-08 2006-03-30 Thin film intrauterine device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US10/638,282 Division US7040323B1 (en) 2002-08-08 2003-08-07 Thin film intrauterine device

Publications (1)

Publication Number Publication Date
US20060213522A1 true US20060213522A1 (en) 2006-09-28

Family

ID=36272105

Family Applications (2)

Application Number Title Priority Date Filing Date
US10/638,282 Expired - Fee Related US7040323B1 (en) 2002-08-08 2003-08-07 Thin film intrauterine device
US11/392,998 Abandoned US20060213522A1 (en) 2002-08-08 2006-03-30 Thin film intrauterine device

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US10/638,282 Expired - Fee Related US7040323B1 (en) 2002-08-08 2003-08-07 Thin film intrauterine device

Country Status (1)

Country Link
US (2) US7040323B1 (en)

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090248141A1 (en) * 2006-03-30 2009-10-01 The Regents Of The University Of Colorado Shape Memory Polymer Medical Devices
US20100152839A1 (en) * 2008-10-29 2010-06-17 The Regents Of The University Of Colorado, A Body Corporate Shape Memory Polymer Prosthetic Medical Device
US7763342B2 (en) 2005-03-31 2010-07-27 Tini Alloy Company Tear-resistant thin film methods of fabrication
US20100192959A1 (en) * 2006-12-19 2010-08-05 The Regents Of The University Of Colorado, A Body Corporate Shape memory polymer-based transcervical device for permanent or temporary sterilization
US7842143B2 (en) 2007-12-03 2010-11-30 Tini Alloy Company Hyperelastic shape setting devices and fabrication methods
US8007674B2 (en) 2007-07-30 2011-08-30 Tini Alloy Company Method and devices for preventing restenosis in cardiovascular stents
US20110271963A1 (en) * 2009-01-18 2011-11-10 Ocon Medical Ltd Novel intra uterine device
US8349099B1 (en) 2006-12-01 2013-01-08 Ormco Corporation Method of alloying reactive components
US8382917B2 (en) 2007-12-03 2013-02-26 Ormco Corporation Hyperelastic shape setting devices and fabrication methods
US8556969B2 (en) 2007-11-30 2013-10-15 Ormco Corporation Biocompatible copper-based single-crystal shape memory alloys
US8584767B2 (en) 2007-01-25 2013-11-19 Tini Alloy Company Sprinkler valve with active actuation
US8684101B2 (en) 2007-01-25 2014-04-01 Tini Alloy Company Frangible shape memory alloy fire sprinkler valve actuator
US9062141B2 (en) 2010-08-06 2015-06-23 Endoshape, Inc. Radiopaque shape memory polymers for medical devices
US9427493B2 (en) 2011-03-07 2016-08-30 The Regents Of The University Of Colorado Shape memory polymer intraocular lenses
US9731045B2 (en) 2005-04-01 2017-08-15 The Regents Of The University Of Colorado Shape memory polymer
US9789231B2 (en) 2013-02-08 2017-10-17 Endoshape, Inc. Radiopaque polymers for medical devices
US9808252B2 (en) 2009-04-02 2017-11-07 Endoshape, Inc. Vascular occlusion devices
US10124197B2 (en) 2012-08-31 2018-11-13 TiNi Allot Company Fire sprinkler valve actuator
US10201351B2 (en) 2011-09-30 2019-02-12 Endoshape, Inc. Continuous embolic coil and methods and devices for delivery of the same
US10590218B2 (en) 2013-03-15 2020-03-17 Endoshape, Inc. Polymer compositions with enhanced radiopacity
US10603043B2 (en) 2012-01-17 2020-03-31 Endoshape, Inc. Occlusion device for a vascular or biological lumen
US10905583B2 (en) 2014-12-11 2021-02-02 Ocon Medical Ltd. Device positionable in the uterine cavity
US11040230B2 (en) 2012-08-31 2021-06-22 Tini Alloy Company Fire sprinkler valve actuator

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7040323B1 (en) * 2002-08-08 2006-05-09 Tini Alloy Company Thin film intrauterine device
US7632361B2 (en) * 2004-05-06 2009-12-15 Tini Alloy Company Single crystal shape memory alloy devices and methods
US20060118210A1 (en) * 2004-10-04 2006-06-08 Johnson A D Portable energy storage devices and methods
JP2008039502A (en) * 2006-08-03 2008-02-21 Alps Electric Co Ltd Contact and its manufacturing method
US20080075557A1 (en) * 2006-09-22 2008-03-27 Johnson A David Constant load bolt
US20080213062A1 (en) * 2006-09-22 2008-09-04 Tini Alloy Company Constant load fastener
HUE030107T2 (en) * 2008-09-02 2017-04-28 Ablation Products Llc Silver ion delivery platform
WO2011006067A1 (en) * 2009-07-09 2011-01-13 Ams Research Corporation Apparatus and methods of treatment of pathologic proliferative conditions uterine tissue
US11684509B2 (en) * 2020-07-31 2023-06-27 Kathleen EDMUNDS Copper-including contraceptive shield

Citations (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US538593A (en) * 1895-04-30 Automatic fire-extinguisher
US1904828A (en) * 1930-01-28 1933-04-18 Pawtucket Screw Company Thermoelectric sprinkler head
US1913035A (en) * 1929-03-01 1933-06-06 Gen Fire Extinguisher Co Sprinkler
US2371614A (en) * 1942-12-31 1945-03-20 Packard Motor Car Co Engine connecting rod and method of securing parts together
US2586556A (en) * 1946-11-23 1952-02-19 Mullikin Alfred Flexible binder post
US2647017A (en) * 1951-04-19 1953-07-28 Ind Res Inst Nozzle
US3229956A (en) * 1962-03-02 1966-01-18 Stevens Mfg Co Inc Diaphragm fluid valve
US3435823A (en) * 1966-04-11 1969-04-01 Miles Lowell Edwards Anastomotic coupling with anti-pulse ring means
US3445086A (en) * 1966-11-25 1969-05-20 Zyrotron Ind Inc Snap acting valve and control mechanism therefor
US3454286A (en) * 1967-03-01 1969-07-08 Us Navy Thermally operated release mechanism
US3559641A (en) * 1968-09-30 1971-02-02 Inutcodes Inc Intrauterine device
US3561537A (en) * 1968-06-20 1971-02-09 Fire Protection Co Automatic sprinkler head
US3659625A (en) * 1970-02-16 1972-05-02 Westinghouse Air Brake Co Drain valve device
US3725835A (en) * 1970-07-20 1973-04-03 J Hopkins Memory material actuator devices
US3789838A (en) * 1971-02-19 1974-02-05 E Fournier Force transmitting intrauterine device
US3888975A (en) * 1972-12-27 1975-06-10 Alza Corp Erodible intrauterine device
US4072159A (en) * 1975-02-22 1978-02-07 Toyoki Kurosawa Emergency valve incorporating thermal foamable plastic material
US4096993A (en) * 1977-01-21 1978-06-27 Emerson Electric Co. Compensated control valve
US4243963A (en) * 1979-04-02 1981-01-06 Gte Automatic Electric Laboratories Incorporated Construction of a printed wiring card mountable reed relay
US4265684A (en) * 1978-07-26 1981-05-05 Vacuumschmelze Gmbh Magnetic core comprised of low-retentivity amorphous alloy
US4279790A (en) * 1979-07-05 1981-07-21 Kabushiki Kaisha Mikuni Seisakusho Composite material compositions using wasterpaper and method of producing same
US4340049A (en) * 1979-10-18 1982-07-20 Baxter Travenol Laboratories, Inc. Breakaway valve
US4434855A (en) * 1982-03-30 1984-03-06 The United States Of America As Represented By The Secretary Of The Navy Sprinkler valve
US4501058A (en) * 1979-08-27 1985-02-26 Pda Engineering Method of pre-stressing a structural member
US4524343A (en) * 1984-01-13 1985-06-18 Raychem Corporation Self-regulated actuator
US4567549A (en) * 1985-02-21 1986-01-28 Blazer International Corp. Automatic takeup and overload protection device for shape memory metal actuator
US4585209A (en) * 1983-10-27 1986-04-29 Harry E. Aine Miniature valve and method of making same
US4589179A (en) * 1984-09-10 1986-05-20 Caterpillar Tractor Co. Flexible positioner
US4654191A (en) * 1984-06-09 1987-03-31 Kernforschungszentrum Karlsruhe Gmbh Pressure release arrangement for the safety containment of a pressurized water nuclear reactor
US4821997A (en) * 1986-09-24 1989-04-18 The Board Of Trustees Of The Leland Stanford Junior University Integrated, microminiature electric-to-fluidic valve and pressure/flow regulator
US4824073A (en) * 1986-09-24 1989-04-25 Stanford University Integrated, microminiature electric to fluidic valve
US4823607A (en) * 1987-05-18 1989-04-25 Massachusetts Institute Of Technology Released film structures and method of measuring film properties
US4848388A (en) * 1987-10-19 1989-07-18 Memory Metals, Inc. Emergency valve with test capability
US4893655A (en) * 1989-08-23 1990-01-16 The United States Of America As Represented By The Secretary Of The Navy Double valve mechanism for an acoustic modulator
US4896728A (en) * 1987-10-02 1990-01-30 Thomas Bolton & Johnson Limited Fire sprinklers with frangible body closing a flow passage and separate means for shattering same
US4915773A (en) * 1986-11-26 1990-04-10 Kravetsky Dmitry Y Process for growing shaped single crystals
US4943032A (en) * 1986-09-24 1990-07-24 Stanford University Integrated, microminiature electric to fluidic valve and pressure/flow regulator
US5102276A (en) * 1990-07-12 1992-04-07 Ford Motor Company Removable fastener with elastic linking means
US5116252A (en) * 1991-08-02 1992-05-26 Hartman Thomas A In-line sleeve valve having velocity guide pressure equalization and drive assembly with improved drive pin mountings
US5117916A (en) * 1990-04-11 1992-06-02 Hochiki Kabushiki Kaisha Sprinkler head and operation monitor therefor
US5119555A (en) * 1988-09-19 1992-06-09 Tini Alloy Company Non-explosive separation device
US5129753A (en) * 1990-11-13 1992-07-14 Trw Inc. Shape memory wire latch mechanism
US5190546A (en) * 1983-10-14 1993-03-02 Raychem Corporation Medical devices incorporating SIM alloy elements
US5192147A (en) * 1991-09-03 1993-03-09 Lockheed Missiles & Space Company, Inc. Non-pyrotechnic release system
US5211371A (en) * 1991-07-22 1993-05-18 Advanced Control Technologies, Inc. Linearly actuated valve
US5218998A (en) * 1992-04-01 1993-06-15 Bakken Gary M Linearly adjustable
US5309717A (en) * 1993-03-22 1994-05-10 Minch Richard B Rapid shape memory effect micro-actuators
US5312152A (en) * 1991-10-23 1994-05-17 Martin Marietta Corporation Shape memory metal actuated separation device
US5494113A (en) * 1994-02-01 1996-02-27 Central Sprinkler Corporation Sprinklers with shape-memory alloy actuators
US5502982A (en) * 1994-04-28 1996-04-02 Liquid Carbonic Industries Corporation Cryogenic tie pin
US5605543A (en) * 1994-03-10 1997-02-25 Schneider (Usa) Inc. Catheter having shaft of varying stiffness
US5619177A (en) * 1995-01-27 1997-04-08 Mjb Company Shape memory alloy microactuator having an electrostatic force and heating means
US5622225A (en) * 1992-04-23 1997-04-22 Sundholm; Goeran Quick response sprinkler head
US5640217A (en) * 1995-02-02 1997-06-17 Fergaflex, Inc. Eyeglass frame with very high recoverable deformability
US5641364A (en) * 1994-10-28 1997-06-24 The Furukawa Electric Co., Ltd. Method of manufacturing high-temperature shape memory alloys
US5714690A (en) * 1991-12-13 1998-02-03 Honeywell Inc. Piezoresistive silicon pressure sensor manufacture implementing long diaphragms with large aspect ratios
US5722989A (en) * 1995-05-22 1998-03-03 The Regents Of The University Of California Microminiaturized minimally invasive intravascular micro-mechanical systems powered and controlled via fiber-optic cable
US5771742A (en) * 1995-09-11 1998-06-30 Tini Alloy Company Release device for retaining pin
US5772378A (en) * 1993-11-30 1998-06-30 Kvaerner Tamturbine Oy Pre-tensioning device for fastening elements and method for pre-tensioning a fastening element
US5867302A (en) * 1997-08-07 1999-02-02 Sandia Corporation Bistable microelectromechanical actuator
US5903099A (en) * 1997-05-23 1999-05-11 Tini Alloy Company Fabrication system, method and apparatus for microelectromechanical devices
US5924492A (en) * 1996-07-02 1999-07-20 Senju Sprinkler Company Limited Sprinkler head assembly
US5930651A (en) * 1994-04-28 1999-07-27 Ngk Insulators, Ltd. Method of forming a semiconductor device having a plurality of cavity defined gating regions
US6042553A (en) * 1997-04-15 2000-03-28 Symbiosis Corporation Linear elastic member
US6072617A (en) * 1996-11-26 2000-06-06 Texas Instruments Incorporated Micro mechanical device with memory metal component
US6075239A (en) * 1997-09-10 2000-06-13 Lucent Technologies, Inc. Article comprising a light-actuated micromechanical photonic switch
US6073700A (en) * 1997-07-25 2000-06-13 Hochiki Kabushiki Kaisha Sprinkler head
US6080160A (en) * 1996-12-04 2000-06-27 Light Sciences Limited Partnership Use of shape memory alloy for internally fixing light emitting device at treatment site
US6195478B1 (en) * 1998-02-04 2001-02-27 Agilent Technologies, Inc. Planar lightwave circuit-based optical switches using micromirrors in trenches
US6203715B1 (en) * 1999-01-19 2001-03-20 Daewoo Electronics Co., Ltd. Method for the manufacture of a thin film actuated mirror array
US6229640B1 (en) * 1999-08-11 2001-05-08 Adc Telecommunications, Inc. Microelectromechanical optical switch and method of manufacture thereof
US6247493B1 (en) * 2000-03-09 2001-06-19 Richard C. Henderson Miniature pulsatile flow controller
US20020018325A1 (en) * 1990-06-08 2002-02-14 Hitachi, Ltd. Magnetoresistance effect elements, magnetic heads and magnetic storage apparatus
US6386507B2 (en) * 1999-09-01 2002-05-14 Jds Uniphase Corporation Microelectromechanical valves including single crystalline material components
US20020062154A1 (en) * 2000-09-22 2002-05-23 Ayers Reed A. Non-uniform porosity tissue implant
US6406605B1 (en) * 1999-06-01 2002-06-18 Ysi Incorporated Electroosmotic flow controlled microfluidic devices
US6407478B1 (en) * 2000-08-21 2002-06-18 Jds Uniphase Corporation Switches and switching arrays that use microelectromechanical devices having one or more beam members that are responsive to temperature
US6410360B1 (en) * 1999-01-26 2002-06-25 Teledyne Industries, Inc. Laminate-based apparatus and method of fabrication
US20030002994A1 (en) * 2001-03-07 2003-01-02 Johnson A. David Thin film shape memory alloy actuated flow controller
US6524322B1 (en) * 1998-10-23 2003-02-25 Eric Berreklouw Anastomosis device
US6533905B2 (en) * 2000-01-24 2003-03-18 Tini Alloy Company Method for sputtering tini shape-memory alloys
US6537310B1 (en) * 1999-11-19 2003-03-25 Advanced Bio Prosthetic Surfaces, Ltd. Endoluminal implantable devices and method of making same
US20030078465A1 (en) * 2001-10-16 2003-04-24 Suresh Pai Systems for heart treatment
US6582985B2 (en) * 2000-12-27 2003-06-24 Honeywell International Inc. SOI/glass process for forming thin silicon micromachined structures
US6592724B1 (en) * 1999-09-22 2003-07-15 Delphi Technologies, Inc. Method for producing NiTiHf alloy films by sputtering
US6596102B2 (en) * 2000-07-06 2003-07-22 Toki Corporation Kabushiki Kaisha Shape memory alloy and method of treating the same
US6672502B1 (en) * 2000-11-28 2004-01-06 The State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University Method for making devices having intermetallic structures and intermetallic devices made thereby
US6688828B1 (en) * 2000-12-01 2004-02-10 Arizona Board Of Regents Self-torquing fasteners
US20040083006A1 (en) * 2002-04-09 2004-04-29 Astra Tech Ab Medical prosthetic devices having improved biocompatibility
US6729599B2 (en) * 2001-06-26 2004-05-04 Tini Alloy Company Liquid microvalve
US6742761B2 (en) * 2001-04-10 2004-06-01 Tini Alloy Company Miniature latching valve
US6746890B2 (en) * 2002-07-17 2004-06-08 Tini Alloy Company Three dimensional thin film devices and methods of fabrication
US6840329B2 (en) * 2002-03-06 2005-01-11 Senju Sprinkler Company Limited Cover assembly for a concealed sprinkler head
US6908275B2 (en) * 2002-04-29 2005-06-21 Charles Nelson Fastener having supplemental support and retention capabilities
US6918545B2 (en) * 2002-05-10 2005-07-19 The Viking Corporation Sprinkler head trigger assembly
US7040323B1 (en) * 2002-08-08 2006-05-09 Tini Alloy Company Thin film intrauterine device
US20060118210A1 (en) * 2004-10-04 2006-06-08 Johnson A D Portable energy storage devices and methods
US20070127740A1 (en) * 2004-01-29 2007-06-07 Sony Ericsson Mobile Communications Ab Sound reproduction in portable electronic equipment
US20070137740A1 (en) * 2004-05-06 2007-06-21 Atini Alloy Company Single crystal shape memory alloy devices and methods

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3351463A (en) * 1965-08-20 1967-11-07 Alexander G Rozner High strength nickel-base alloys
US3620212A (en) * 1970-06-15 1971-11-16 Robert D Fannon Jr Intrauterine contraceptive device
US3918443A (en) * 1971-10-20 1975-11-11 Ethyl Corp Method for birth control
US5061914A (en) * 1989-06-27 1991-10-29 Tini Alloy Company Shape-memory alloy micro-actuator

Patent Citations (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US538593A (en) * 1895-04-30 Automatic fire-extinguisher
US1913035A (en) * 1929-03-01 1933-06-06 Gen Fire Extinguisher Co Sprinkler
US1904828A (en) * 1930-01-28 1933-04-18 Pawtucket Screw Company Thermoelectric sprinkler head
US2371614A (en) * 1942-12-31 1945-03-20 Packard Motor Car Co Engine connecting rod and method of securing parts together
US2586556A (en) * 1946-11-23 1952-02-19 Mullikin Alfred Flexible binder post
US2647017A (en) * 1951-04-19 1953-07-28 Ind Res Inst Nozzle
US3229956A (en) * 1962-03-02 1966-01-18 Stevens Mfg Co Inc Diaphragm fluid valve
US3435823A (en) * 1966-04-11 1969-04-01 Miles Lowell Edwards Anastomotic coupling with anti-pulse ring means
US3445086A (en) * 1966-11-25 1969-05-20 Zyrotron Ind Inc Snap acting valve and control mechanism therefor
US3454286A (en) * 1967-03-01 1969-07-08 Us Navy Thermally operated release mechanism
US3561537A (en) * 1968-06-20 1971-02-09 Fire Protection Co Automatic sprinkler head
US3559641A (en) * 1968-09-30 1971-02-02 Inutcodes Inc Intrauterine device
US3659625A (en) * 1970-02-16 1972-05-02 Westinghouse Air Brake Co Drain valve device
US3725835A (en) * 1970-07-20 1973-04-03 J Hopkins Memory material actuator devices
US3789838A (en) * 1971-02-19 1974-02-05 E Fournier Force transmitting intrauterine device
US3888975A (en) * 1972-12-27 1975-06-10 Alza Corp Erodible intrauterine device
US4072159A (en) * 1975-02-22 1978-02-07 Toyoki Kurosawa Emergency valve incorporating thermal foamable plastic material
US4096993A (en) * 1977-01-21 1978-06-27 Emerson Electric Co. Compensated control valve
US4265684A (en) * 1978-07-26 1981-05-05 Vacuumschmelze Gmbh Magnetic core comprised of low-retentivity amorphous alloy
US4243963A (en) * 1979-04-02 1981-01-06 Gte Automatic Electric Laboratories Incorporated Construction of a printed wiring card mountable reed relay
US4279790A (en) * 1979-07-05 1981-07-21 Kabushiki Kaisha Mikuni Seisakusho Composite material compositions using wasterpaper and method of producing same
US4501058A (en) * 1979-08-27 1985-02-26 Pda Engineering Method of pre-stressing a structural member
US4340049A (en) * 1979-10-18 1982-07-20 Baxter Travenol Laboratories, Inc. Breakaway valve
US4434855A (en) * 1982-03-30 1984-03-06 The United States Of America As Represented By The Secretary Of The Navy Sprinkler valve
US5190546A (en) * 1983-10-14 1993-03-02 Raychem Corporation Medical devices incorporating SIM alloy elements
US4585209A (en) * 1983-10-27 1986-04-29 Harry E. Aine Miniature valve and method of making same
US4524343A (en) * 1984-01-13 1985-06-18 Raychem Corporation Self-regulated actuator
US4654191A (en) * 1984-06-09 1987-03-31 Kernforschungszentrum Karlsruhe Gmbh Pressure release arrangement for the safety containment of a pressurized water nuclear reactor
US4589179A (en) * 1984-09-10 1986-05-20 Caterpillar Tractor Co. Flexible positioner
US4567549A (en) * 1985-02-21 1986-01-28 Blazer International Corp. Automatic takeup and overload protection device for shape memory metal actuator
US4821997A (en) * 1986-09-24 1989-04-18 The Board Of Trustees Of The Leland Stanford Junior University Integrated, microminiature electric-to-fluidic valve and pressure/flow regulator
US4824073A (en) * 1986-09-24 1989-04-25 Stanford University Integrated, microminiature electric to fluidic valve
US4943032A (en) * 1986-09-24 1990-07-24 Stanford University Integrated, microminiature electric to fluidic valve and pressure/flow regulator
US4915773A (en) * 1986-11-26 1990-04-10 Kravetsky Dmitry Y Process for growing shaped single crystals
US4823607A (en) * 1987-05-18 1989-04-25 Massachusetts Institute Of Technology Released film structures and method of measuring film properties
US4896728A (en) * 1987-10-02 1990-01-30 Thomas Bolton & Johnson Limited Fire sprinklers with frangible body closing a flow passage and separate means for shattering same
US4848388A (en) * 1987-10-19 1989-07-18 Memory Metals, Inc. Emergency valve with test capability
US5119555A (en) * 1988-09-19 1992-06-09 Tini Alloy Company Non-explosive separation device
US4893655A (en) * 1989-08-23 1990-01-16 The United States Of America As Represented By The Secretary Of The Navy Double valve mechanism for an acoustic modulator
US5117916A (en) * 1990-04-11 1992-06-02 Hochiki Kabushiki Kaisha Sprinkler head and operation monitor therefor
US20020018325A1 (en) * 1990-06-08 2002-02-14 Hitachi, Ltd. Magnetoresistance effect elements, magnetic heads and magnetic storage apparatus
US5102276A (en) * 1990-07-12 1992-04-07 Ford Motor Company Removable fastener with elastic linking means
US5129753A (en) * 1990-11-13 1992-07-14 Trw Inc. Shape memory wire latch mechanism
US5211371A (en) * 1991-07-22 1993-05-18 Advanced Control Technologies, Inc. Linearly actuated valve
US5116252A (en) * 1991-08-02 1992-05-26 Hartman Thomas A In-line sleeve valve having velocity guide pressure equalization and drive assembly with improved drive pin mountings
US5192147A (en) * 1991-09-03 1993-03-09 Lockheed Missiles & Space Company, Inc. Non-pyrotechnic release system
US5312152A (en) * 1991-10-23 1994-05-17 Martin Marietta Corporation Shape memory metal actuated separation device
US5714690A (en) * 1991-12-13 1998-02-03 Honeywell Inc. Piezoresistive silicon pressure sensor manufacture implementing long diaphragms with large aspect ratios
US5218998A (en) * 1992-04-01 1993-06-15 Bakken Gary M Linearly adjustable
US5622225A (en) * 1992-04-23 1997-04-22 Sundholm; Goeran Quick response sprinkler head
US5309717A (en) * 1993-03-22 1994-05-10 Minch Richard B Rapid shape memory effect micro-actuators
US5772378A (en) * 1993-11-30 1998-06-30 Kvaerner Tamturbine Oy Pre-tensioning device for fastening elements and method for pre-tensioning a fastening element
US5494113A (en) * 1994-02-01 1996-02-27 Central Sprinkler Corporation Sprinklers with shape-memory alloy actuators
US5605543A (en) * 1994-03-10 1997-02-25 Schneider (Usa) Inc. Catheter having shaft of varying stiffness
US5502982A (en) * 1994-04-28 1996-04-02 Liquid Carbonic Industries Corporation Cryogenic tie pin
US5930651A (en) * 1994-04-28 1999-07-27 Ngk Insulators, Ltd. Method of forming a semiconductor device having a plurality of cavity defined gating regions
US5641364A (en) * 1994-10-28 1997-06-24 The Furukawa Electric Co., Ltd. Method of manufacturing high-temperature shape memory alloys
US5619177A (en) * 1995-01-27 1997-04-08 Mjb Company Shape memory alloy microactuator having an electrostatic force and heating means
US5640217A (en) * 1995-02-02 1997-06-17 Fergaflex, Inc. Eyeglass frame with very high recoverable deformability
US5722989A (en) * 1995-05-22 1998-03-03 The Regents Of The University Of California Microminiaturized minimally invasive intravascular micro-mechanical systems powered and controlled via fiber-optic cable
US5771742A (en) * 1995-09-11 1998-06-30 Tini Alloy Company Release device for retaining pin
US5924492A (en) * 1996-07-02 1999-07-20 Senju Sprinkler Company Limited Sprinkler head assembly
US6072617A (en) * 1996-11-26 2000-06-06 Texas Instruments Incorporated Micro mechanical device with memory metal component
US6080160A (en) * 1996-12-04 2000-06-27 Light Sciences Limited Partnership Use of shape memory alloy for internally fixing light emitting device at treatment site
US6042553A (en) * 1997-04-15 2000-03-28 Symbiosis Corporation Linear elastic member
US5903099A (en) * 1997-05-23 1999-05-11 Tini Alloy Company Fabrication system, method and apparatus for microelectromechanical devices
US6073700A (en) * 1997-07-25 2000-06-13 Hochiki Kabushiki Kaisha Sprinkler head
US5867302A (en) * 1997-08-07 1999-02-02 Sandia Corporation Bistable microelectromechanical actuator
US6075239A (en) * 1997-09-10 2000-06-13 Lucent Technologies, Inc. Article comprising a light-actuated micromechanical photonic switch
US6195478B1 (en) * 1998-02-04 2001-02-27 Agilent Technologies, Inc. Planar lightwave circuit-based optical switches using micromirrors in trenches
US6524322B1 (en) * 1998-10-23 2003-02-25 Eric Berreklouw Anastomosis device
US6203715B1 (en) * 1999-01-19 2001-03-20 Daewoo Electronics Co., Ltd. Method for the manufacture of a thin film actuated mirror array
US6410360B1 (en) * 1999-01-26 2002-06-25 Teledyne Industries, Inc. Laminate-based apparatus and method of fabrication
US6406605B1 (en) * 1999-06-01 2002-06-18 Ysi Incorporated Electroosmotic flow controlled microfluidic devices
US6229640B1 (en) * 1999-08-11 2001-05-08 Adc Telecommunications, Inc. Microelectromechanical optical switch and method of manufacture thereof
US6386507B2 (en) * 1999-09-01 2002-05-14 Jds Uniphase Corporation Microelectromechanical valves including single crystalline material components
US6592724B1 (en) * 1999-09-22 2003-07-15 Delphi Technologies, Inc. Method for producing NiTiHf alloy films by sputtering
US6537310B1 (en) * 1999-11-19 2003-03-25 Advanced Bio Prosthetic Surfaces, Ltd. Endoluminal implantable devices and method of making same
US6533905B2 (en) * 2000-01-24 2003-03-18 Tini Alloy Company Method for sputtering tini shape-memory alloys
US6247493B1 (en) * 2000-03-09 2001-06-19 Richard C. Henderson Miniature pulsatile flow controller
US6596102B2 (en) * 2000-07-06 2003-07-22 Toki Corporation Kabushiki Kaisha Shape memory alloy and method of treating the same
US6407478B1 (en) * 2000-08-21 2002-06-18 Jds Uniphase Corporation Switches and switching arrays that use microelectromechanical devices having one or more beam members that are responsive to temperature
US20020062154A1 (en) * 2000-09-22 2002-05-23 Ayers Reed A. Non-uniform porosity tissue implant
US6672502B1 (en) * 2000-11-28 2004-01-06 The State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University Method for making devices having intermetallic structures and intermetallic devices made thereby
US6688828B1 (en) * 2000-12-01 2004-02-10 Arizona Board Of Regents Self-torquing fasteners
US6582985B2 (en) * 2000-12-27 2003-06-24 Honeywell International Inc. SOI/glass process for forming thin silicon micromachined structures
US20030002994A1 (en) * 2001-03-07 2003-01-02 Johnson A. David Thin film shape memory alloy actuated flow controller
US6742761B2 (en) * 2001-04-10 2004-06-01 Tini Alloy Company Miniature latching valve
US6729599B2 (en) * 2001-06-26 2004-05-04 Tini Alloy Company Liquid microvalve
US20030078465A1 (en) * 2001-10-16 2003-04-24 Suresh Pai Systems for heart treatment
US6840329B2 (en) * 2002-03-06 2005-01-11 Senju Sprinkler Company Limited Cover assembly for a concealed sprinkler head
US20040083006A1 (en) * 2002-04-09 2004-04-29 Astra Tech Ab Medical prosthetic devices having improved biocompatibility
US6908275B2 (en) * 2002-04-29 2005-06-21 Charles Nelson Fastener having supplemental support and retention capabilities
US6918545B2 (en) * 2002-05-10 2005-07-19 The Viking Corporation Sprinkler head trigger assembly
US6746890B2 (en) * 2002-07-17 2004-06-08 Tini Alloy Company Three dimensional thin film devices and methods of fabrication
US7040323B1 (en) * 2002-08-08 2006-05-09 Tini Alloy Company Thin film intrauterine device
US20070127740A1 (en) * 2004-01-29 2007-06-07 Sony Ericsson Mobile Communications Ab Sound reproduction in portable electronic equipment
US20070137740A1 (en) * 2004-05-06 2007-06-21 Atini Alloy Company Single crystal shape memory alloy devices and methods
US20060118210A1 (en) * 2004-10-04 2006-06-08 Johnson A D Portable energy storage devices and methods

Cited By (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7763342B2 (en) 2005-03-31 2010-07-27 Tini Alloy Company Tear-resistant thin film methods of fabrication
US9731045B2 (en) 2005-04-01 2017-08-15 The Regents Of The University Of Colorado Shape memory polymer
US20090248141A1 (en) * 2006-03-30 2009-10-01 The Regents Of The University Of Colorado Shape Memory Polymer Medical Devices
US10190199B2 (en) 2006-12-01 2019-01-29 Ormco Corporation Method of alloying reactive components
US8349099B1 (en) 2006-12-01 2013-01-08 Ormco Corporation Method of alloying reactive components
US9340858B2 (en) 2006-12-01 2016-05-17 Ormco Corporation Method of alloying reactive components
US8685183B1 (en) 2006-12-01 2014-04-01 Ormco Corporation Method of alloying reactive components
US20100192959A1 (en) * 2006-12-19 2010-08-05 The Regents Of The University Of Colorado, A Body Corporate Shape memory polymer-based transcervical device for permanent or temporary sterilization
US8684101B2 (en) 2007-01-25 2014-04-01 Tini Alloy Company Frangible shape memory alloy fire sprinkler valve actuator
US8584767B2 (en) 2007-01-25 2013-11-19 Tini Alloy Company Sprinkler valve with active actuation
US10610620B2 (en) 2007-07-30 2020-04-07 Monarch Biosciences, Inc. Method and devices for preventing restenosis in cardiovascular stents
US8007674B2 (en) 2007-07-30 2011-08-30 Tini Alloy Company Method and devices for preventing restenosis in cardiovascular stents
US9539372B2 (en) 2007-11-30 2017-01-10 Ormco Corporation Biocompatible copper-based single-crystal shape memory alloys
US8556969B2 (en) 2007-11-30 2013-10-15 Ormco Corporation Biocompatible copper-based single-crystal shape memory alloys
US7842143B2 (en) 2007-12-03 2010-11-30 Tini Alloy Company Hyperelastic shape setting devices and fabrication methods
US9127338B2 (en) 2007-12-03 2015-09-08 Ormco Corporation Hyperelastic shape setting devices and fabrication methods
US8382917B2 (en) 2007-12-03 2013-02-26 Ormco Corporation Hyperelastic shape setting devices and fabrication methods
US9119714B2 (en) 2008-10-29 2015-09-01 The Regents Of The University Of Colorado, A Body Corporate Shape memory polymer prosthetic medical device
US20100152839A1 (en) * 2008-10-29 2010-06-17 The Regents Of The University Of Colorado, A Body Corporate Shape Memory Polymer Prosthetic Medical Device
US20110271963A1 (en) * 2009-01-18 2011-11-10 Ocon Medical Ltd Novel intra uterine device
US9750634B2 (en) * 2009-01-18 2017-09-05 Ocon Medical Ltd Intra uterine device
US12053413B2 (en) 2009-01-18 2024-08-06 Ocon Medical Ltd. Intra uterine device
US10639188B2 (en) 2009-01-18 2020-05-05 Ocon Medical Ltd. Intra uterine device
US9808252B2 (en) 2009-04-02 2017-11-07 Endoshape, Inc. Vascular occlusion devices
US9062141B2 (en) 2010-08-06 2015-06-23 Endoshape, Inc. Radiopaque shape memory polymers for medical devices
US9427493B2 (en) 2011-03-07 2016-08-30 The Regents Of The University Of Colorado Shape memory polymer intraocular lenses
US10272176B2 (en) 2011-03-07 2019-04-30 The Regents Of The University Of Colorado Shape memory polymer intraocular lenses
US10286107B2 (en) 2011-03-07 2019-05-14 The Regents Of The University Of Colorado, A Body Corporate Shape memory polymer intraocular lenses
US10286105B2 (en) 2011-03-07 2019-05-14 The Regents Of The University Of Colorado, A Body Corporate Shape memory polymer intraocular lenses
US10286106B2 (en) 2011-03-07 2019-05-14 The Regents Of The University Of Colorado Intraocular lenses
US10201351B2 (en) 2011-09-30 2019-02-12 Endoshape, Inc. Continuous embolic coil and methods and devices for delivery of the same
US10603043B2 (en) 2012-01-17 2020-03-31 Endoshape, Inc. Occlusion device for a vascular or biological lumen
US10124197B2 (en) 2012-08-31 2018-11-13 TiNi Allot Company Fire sprinkler valve actuator
US11040230B2 (en) 2012-08-31 2021-06-22 Tini Alloy Company Fire sprinkler valve actuator
US10434223B2 (en) 2013-02-08 2019-10-08 Endoshape, Inc. Radiopaque polymers for medical devices
US10814042B2 (en) 2013-02-08 2020-10-27 Endoshape, Inc. Radiopaque polymers for medical devices
US9789231B2 (en) 2013-02-08 2017-10-17 Endoshape, Inc. Radiopaque polymers for medical devices
US10590218B2 (en) 2013-03-15 2020-03-17 Endoshape, Inc. Polymer compositions with enhanced radiopacity
US10905583B2 (en) 2014-12-11 2021-02-02 Ocon Medical Ltd. Device positionable in the uterine cavity

Also Published As

Publication number Publication date
US7040323B1 (en) 2006-05-09

Similar Documents

Publication Publication Date Title
US20060213522A1 (en) Thin film intrauterine device
US12053413B2 (en) Intra uterine device
US7398780B2 (en) Contraceptive system and method of use
US6746890B2 (en) Three dimensional thin film devices and methods of fabrication
AU2021266229A1 (en) Intrauterine contraceptive device
EP2953558B1 (en) Embryo transfer catheter
WO2003026531A2 (en) Stent delivery system

Legal Events

Date Code Title Description
AS Assignment

Owner name: TINI ALLOY COMPANY, CALIFORNIA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MENCHACA, LETECIA;JOHNSON, A. DAVID;GUPTA, VIKAS;AND OTHERS;REEL/FRAME:019647/0668;SIGNING DATES FROM 20031201 TO 20031202

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION