US20050121180A1 - Use of graphite foam materials in pumped liquid, two phase cooling, cold plates - Google Patents

Use of graphite foam materials in pumped liquid, two phase cooling, cold plates Download PDF

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Publication number
US20050121180A1
US20050121180A1 US10/949,650 US94965004A US2005121180A1 US 20050121180 A1 US20050121180 A1 US 20050121180A1 US 94965004 A US94965004 A US 94965004A US 2005121180 A1 US2005121180 A1 US 2005121180A1
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United States
Prior art keywords
cold plate
graphite material
plate structure
refrigerant
providing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/949,650
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English (en)
Inventor
Joseph Marsala
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thermal Form and Function LLC
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Thermal Form and Function LLC
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Filing date
Publication date
Application filed by Thermal Form and Function LLC filed Critical Thermal Form and Function LLC
Priority to US10/949,650 priority Critical patent/US20050121180A1/en
Publication of US20050121180A1 publication Critical patent/US20050121180A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to cooling of electrical and electronic components, and more particularly, to use of graphite foam materials in a pumped liquid two phase cooling system having one or more cold plate/evaporators in thermal contact with the electrical or electronic components to be cooled.
  • Electrical and electronic components e.g. microprocessors, IGBT's, power semiconductors etc.
  • IGBT's, power semiconductors etc. are most often cooled by air-cooled heat sinks with extended surfaces, directly attached to the surface to be cooled.
  • a fan or blower moves air across the heat sink fins, removing the heat generated by the component.
  • One method for removing heat from components when direct air-cooling is not possible uses a single-phase fluid which is pumped to a cold plate.
  • the cold plate typically has a serpentine tube attached to a flat metal plate.
  • the component to be cooled is thermally attached to the flat plate and a pumped single-phase fluid flowing through the tube removes the heat generated by the component.
  • Heat pipes are sealed devices which use a condensable fluid to move heat from one location to another. Fluid transfer is accomplished by capillary pumping of the liquid phase using a wick structure.
  • One end of the heat pipe (the evaporator) is located where the heat is generated in the component, and the other end (the condenser) is located where the heat is to be dissipated; often the condenser end is in contact with extended surfaces such as fins to help remove heat to the ambient air.
  • This method of removing heat is limited by the ability of the wick structure to transport fluid to the evaporator.
  • the cold plate is the evaporator of the cycle.
  • a compressor raises the temperature and pressure of the vapor, leaving the evaporator to a level such that an air-cooled condenser can be used to condense the vapor to its liquid state and be fed back to the cold plate for further evaporation and cooling.
  • This method has the advantage of high isothermal heat transfer rates and the ability to move heat considerable distances.
  • this method suffers from some major disadvantages which limit its practical application in cooling electrical and electronic devices.
  • Vapor compression refrigeration cycles are designed so as not to return any liquid refrigerant to the compressor which may cause physical damage to the compressor and shorten its life by diluting its lubricating oil.
  • the thermal load can be highly variable, causing unevaporated refrigerant to exit the cold plate and enter the compressor. This can cause damage and shorten the life of the compressor. This is yet another disadvantage of vapor compression cooling of components.
  • One way to improve the heat removal rate is to increase the surface area of the structure within the two phase cold plate. At the same time, the fluid velocities must be maintained within the cold plate so that the heat transfer coefficient remains high. Increasing the surface area and maintaining high velocities for high heat transfer coefficients using convoluted fin structures is difficult and is limited by the ability to form compact fin structures.
  • a liquid refrigerant pump circulates refrigerant to cold plate/evaporators which are in thermal contact with the electrical or electronic component to be cooled.
  • the liquid refrigerant is then partially or completely evaporated by the heat generated by the component.
  • the vapor is condensed by a conventional condenser coil, and the condensed liquid, along with any unevaporated liquid, is returned to the pump.
  • the available surface area is increased many times over that of the fin structure. Since the graphite foam has relatively high thermal conductivity of the ligament structure in the open cell foam, the fin efficiency of the heat transfer surface remains high. Also, due to the open nature of the graphite foam, the permeability of liquids and vapor through the foam is high, allowing for low pressure loss while still maintaining sufficient two phase flow to carry heat away from the electronics.
  • FIG. 1 is an exploded view illustrating the cold plate assembly in accordance with the present invention.
  • the present invention relates to cooling electronic components, including at least microprocessor semiconductors and power semiconductors, using a pumped liquid two phase cooling system, such as is described and claimed in U.S. Pat. No. 6,519,955, totally incorporated herein by reference.
  • the present invention is an improvement to the cold plate portion of the system which absorbs heat directly from the electronics to be cooled.
  • the purpose of the present invention is to increase the surface area for heat transfer within the cold plate structure with a high thermal conductivity foamed graphite material, while still allowing for flow of both liquid and vapor through the structure to carry away the heat generated by the electronics.
  • FIG. 1 there is illustrated a two phase cold plate assembly 10 such as is used in a pumped refrigerant forced convection cooling system for removing heat from electronic systems.
  • the present invention incorporates graphite foam into the two phase cold plate, replacing or assisting the heat transfer capabilities of a more conventional convoluted fin structure.
  • Graphite foam is and can be made by a number of processes known in the art, and by a variety of manufacturers.
  • the graphite foam made by Oak Ridge National Laboratory (ORNL) can be used, but it is understood that the invention is not limited to the graphite foam made by the ORNL process.
  • ORNL Oak Ridge National Laboratory
  • the graphite foam made by ORNL is taught in the following U.S. Pat. Nos.
  • a cold plate evaporator device 10 such as the two phase cold plate assembly illustrated, comprises a cold plate top lid 12 with a flat surface 14 on which may be mounted an electronic device or devices (not shown) which require cooling.
  • the cold plate top lid 12 attaches to a cold plate body 16 .
  • a graphite foam material 18 is thermally attached to the underside of the top lid 12 , typically proximate to the electronic heat source.
  • the graphite foam 18 may be attached to the cold plate top lid by any suitable means, such as, but not limited to, thermally conductive epoxy or adhesives, solder, brazing and so on.
  • the graphite foam 18 may be plated so the various solders and braze materials will wet both the foam and the cold plate surface.
  • the plating may be any suitable material, such as electroless nickel plating.
  • the cold plate body 16 may include a cut out area 20 for receiving the graphite foam as the top lid 12 is attached to the cold plate body 16 .
  • the cold plate structure 10 has an inlet 22 so that a vaporizable liquid refrigerant may be pumped into the cold plate and come into thermal contact with the graphite foam.
  • the cold plate assembly 10 also has an outlet 24 so the vaporizable refrigerant may leave the graphite foam as a vapor or as a two phase mixture of liquid and vapor. Any vaporizable refrigerant may be used as long as it is compatible with the graphite foam and other materials of construction.
  • the cold plate is typically constructed such that the outlet extends through an o-ring 26 and a pipe attachment 28 , as shown in the drawing.
  • the present invention requires that the vaporizable refrigerant, for example, R-134a refrigerant, be pumped to the cold plate assembly 10 and pass through the graphite foam 18 in forced convection heat transfer.
  • the heat from the electronic device(s) to be cooled causes some or all of the refrigerant within the graphite foam 18 to evaporate.
  • the liquid refrigerant may pass through the graphite foam 18 from any direction, parallel, perpendicular or multi-pass, in any fluid distribution 30 flow, shown in the drawing for exemplary purposes only, and not to be considered as limiting the flow pattern to any particular pattern. Consequently, there is no limiting flow geometry requirement for the present invention.
  • the graphite foam 18 may be corrugated or have slots cut into it in the flow direction to reduce the pressure drop of the refrigerant through the foam. Any number of graphite foam elements may be used in a single cold plate or multiple cold plates in parallel or series flow, without departing from the spirit and scope of the present invention. Additionally, the graphite foam elements may be combined with more conventional heat transfer surfaces such as convoluted fin.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US10/949,650 2003-09-26 2004-09-24 Use of graphite foam materials in pumped liquid, two phase cooling, cold plates Abandoned US20050121180A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/949,650 US20050121180A1 (en) 2003-09-26 2004-09-24 Use of graphite foam materials in pumped liquid, two phase cooling, cold plates

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US50634703P 2003-09-26 2003-09-26
US10/949,650 US20050121180A1 (en) 2003-09-26 2004-09-24 Use of graphite foam materials in pumped liquid, two phase cooling, cold plates

Publications (1)

Publication Number Publication Date
US20050121180A1 true US20050121180A1 (en) 2005-06-09

Family

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US10/949,650 Abandoned US20050121180A1 (en) 2003-09-26 2004-09-24 Use of graphite foam materials in pumped liquid, two phase cooling, cold plates

Country Status (3)

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US (1) US20050121180A1 (de)
EP (1) EP1519646A3 (de)
CA (1) CA2482483A1 (de)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8077460B1 (en) 2010-07-19 2011-12-13 Toyota Motor Engineering & Manufacturing North America, Inc. Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same
US8199505B2 (en) 2010-09-13 2012-06-12 Toyota Motor Engineering & Manufacturing Norh America, Inc. Jet impingement heat exchanger apparatuses and power electronics modules
US8391008B2 (en) 2011-02-17 2013-03-05 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics modules and power electronics module assemblies
US8427832B2 (en) 2011-01-05 2013-04-23 Toyota Motor Engineering & Manufacturing North America, Inc. Cold plate assemblies and power electronics modules
US8482919B2 (en) 2011-04-11 2013-07-09 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics card assemblies, power electronics modules, and power electronics devices
US8659896B2 (en) 2010-09-13 2014-02-25 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules
US8786078B1 (en) 2013-01-04 2014-07-22 Toyota Motor Engineering & Manufacturing North America, Inc. Vehicles, power electronics modules and cooling apparatuses with single-phase and two-phase surface enhancement features
US9131631B2 (en) 2013-08-08 2015-09-08 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having enhanced heat transfer assemblies
US9537686B2 (en) 2014-04-03 2017-01-03 Redline Communications Inc. Systems and methods for increasing the effectiveness of digital pre-distortion in electronic communications
US11997838B2 (en) 2022-02-01 2024-05-28 Toyota Motor Engineering & Manufacturing North America, Inc. Power device assemblies and methods of fabricating the same

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* Cited by examiner, † Cited by third party
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US20070119572A1 (en) 2005-11-30 2007-05-31 Raytheon Company System and Method for Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements
EP1860695A3 (de) 2006-05-24 2010-06-16 Raytheon Company System und Verfahren zur Düsenprallkühlung mit erweiterten Oberflächen
WO2010096355A2 (en) * 2009-02-17 2010-08-26 Parker Hannifin Corporation Cooling system utilizing multiple cold plates
WO2011038184A1 (en) * 2009-09-24 2011-03-31 Parker Hannifin Corporation Embedded cooling of wound electrical components
US9854715B2 (en) 2011-06-27 2017-12-26 Ebullient, Inc. Flexible two-phase cooling system
US9901008B2 (en) 2014-10-27 2018-02-20 Ebullient, Inc. Redundant heat sink module
US9854714B2 (en) 2011-06-27 2017-12-26 Ebullient, Inc. Method of absorbing sensible and latent heat with series-connected heat sinks
US9848509B2 (en) 2011-06-27 2017-12-19 Ebullient, Inc. Heat sink module
US9901013B2 (en) 2011-06-27 2018-02-20 Ebullient, Inc. Method of cooling series-connected heat sink modules
US9832913B2 (en) 2011-06-27 2017-11-28 Ebullient, Inc. Method of operating a cooling apparatus to provide stable two-phase flow
CN104329684A (zh) * 2013-07-22 2015-02-04 中石化洛阳工程有限公司 一种降低排烟温度的方法及装置
US20160120059A1 (en) 2014-10-27 2016-04-28 Ebullient, Llc Two-phase cooling system
US9852963B2 (en) 2014-10-27 2017-12-26 Ebullient, Inc. Microprocessor assembly adapted for fluid cooling
US10184699B2 (en) 2014-10-27 2019-01-22 Ebullient, Inc. Fluid distribution unit for two-phase cooling system
US11201102B2 (en) 2018-05-10 2021-12-14 International Business Machines Corporation Module lid with embedded two-phase cooling and insulating layer
CN112752478B (zh) * 2020-12-14 2023-08-01 中车永济电机有限公司 一体式双面风冷散热功率模块

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US5526231A (en) * 1994-01-20 1996-06-11 Siemens Aktiengesellschaft Cooling unit for power semiconductors
US6305463B1 (en) * 1996-02-22 2001-10-23 Silicon Graphics, Inc. Air or liquid cooled computer module cold plate
US20020108743A1 (en) * 2000-12-11 2002-08-15 Wirtz Richard A. Porous media heat sink apparatus
US20040060692A1 (en) * 2002-09-27 2004-04-01 Pfeifer David W. Elongated heat sink for use in converter assemblies
US6719039B2 (en) * 2000-11-21 2004-04-13 Thermal Corp. Liquid cooled heat exchanger with enhanced flow
US20040123980A1 (en) * 2000-07-14 2004-07-01 Queheillalt Douglas T. Heat exchange foam
US6888720B2 (en) * 2002-06-18 2005-05-03 Sun Microsystems, Inc. Distributed graphitic foam heat exchanger system
US6898082B2 (en) * 2002-05-10 2005-05-24 Serguei V. Dessiatoun Enhanced heat transfer structure with heat transfer members of variable density

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US5761037A (en) * 1996-02-12 1998-06-02 International Business Machines Corporation Orientation independent evaporator
US6673328B1 (en) * 2000-03-06 2004-01-06 Ut-Battelle, Llc Pitch-based carbon foam and composites and uses thereof
US6508301B2 (en) * 2000-04-19 2003-01-21 Thermal Form & Function Cold plate utilizing fin with evaporating refrigerant

Patent Citations (8)

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Publication number Priority date Publication date Assignee Title
US5526231A (en) * 1994-01-20 1996-06-11 Siemens Aktiengesellschaft Cooling unit for power semiconductors
US6305463B1 (en) * 1996-02-22 2001-10-23 Silicon Graphics, Inc. Air or liquid cooled computer module cold plate
US20040123980A1 (en) * 2000-07-14 2004-07-01 Queheillalt Douglas T. Heat exchange foam
US6719039B2 (en) * 2000-11-21 2004-04-13 Thermal Corp. Liquid cooled heat exchanger with enhanced flow
US20020108743A1 (en) * 2000-12-11 2002-08-15 Wirtz Richard A. Porous media heat sink apparatus
US6898082B2 (en) * 2002-05-10 2005-05-24 Serguei V. Dessiatoun Enhanced heat transfer structure with heat transfer members of variable density
US6888720B2 (en) * 2002-06-18 2005-05-03 Sun Microsystems, Inc. Distributed graphitic foam heat exchanger system
US20040060692A1 (en) * 2002-09-27 2004-04-01 Pfeifer David W. Elongated heat sink for use in converter assemblies

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8077460B1 (en) 2010-07-19 2011-12-13 Toyota Motor Engineering & Manufacturing North America, Inc. Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same
US8199505B2 (en) 2010-09-13 2012-06-12 Toyota Motor Engineering & Manufacturing Norh America, Inc. Jet impingement heat exchanger apparatuses and power electronics modules
US8659896B2 (en) 2010-09-13 2014-02-25 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules
US8427832B2 (en) 2011-01-05 2013-04-23 Toyota Motor Engineering & Manufacturing North America, Inc. Cold plate assemblies and power electronics modules
US8391008B2 (en) 2011-02-17 2013-03-05 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics modules and power electronics module assemblies
US8482919B2 (en) 2011-04-11 2013-07-09 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics card assemblies, power electronics modules, and power electronics devices
US8786078B1 (en) 2013-01-04 2014-07-22 Toyota Motor Engineering & Manufacturing North America, Inc. Vehicles, power electronics modules and cooling apparatuses with single-phase and two-phase surface enhancement features
US9131631B2 (en) 2013-08-08 2015-09-08 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having enhanced heat transfer assemblies
US9537686B2 (en) 2014-04-03 2017-01-03 Redline Communications Inc. Systems and methods for increasing the effectiveness of digital pre-distortion in electronic communications
US20170077970A1 (en) * 2014-04-03 2017-03-16 Redline Communications Inc. Systems and methods for increasing the effectiveness of digital pre-distortion in electronic communications
US9819373B2 (en) * 2014-04-03 2017-11-14 Redline Communications Inc. Systems and methods for increasing the effectiveness of digital pre-distortion in electronic communications
US11997838B2 (en) 2022-02-01 2024-05-28 Toyota Motor Engineering & Manufacturing North America, Inc. Power device assemblies and methods of fabricating the same

Also Published As

Publication number Publication date
EP1519646A3 (de) 2007-09-26
CA2482483A1 (en) 2005-03-26
EP1519646A2 (de) 2005-03-30

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