US20050006777A1 - Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof - Google Patents

Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof Download PDF

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US20050006777A1
US20050006777A1 US10/912,216 US91221604A US2005006777A1 US 20050006777 A1 US20050006777 A1 US 20050006777A1 US 91221604 A US91221604 A US 91221604A US 2005006777 A1 US2005006777 A1 US 2005006777A1
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interlayer
copper
palladium
platinum
layer
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Panayotis Andricacos
Steven Boettcher
Fenton McFeely
Milan Paunovic
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International Business Machines Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
    • H01L21/28562—Selective deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
    • H01L21/76873—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers for electroplating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
    • H01L21/76874—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers for electroless plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
    • H01L23/53238—Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/10—Applying interconnections to be used for carrying current between separate components within a device
    • H01L2221/1068—Formation and after-treatment of conductors
    • H01L2221/1073—Barrier, adhesion or liner layers
    • H01L2221/1084—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
    • H01L2221/1089—Stacks of seed layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Definitions

  • the present invention relates to interconnection wiring on electronic devices such as on integrated circuits (IC) chips and more particularly to encapsulated copper interconnection in integrated circuits.
  • IC integrated circuits
  • Al—Cu and its related alloys were the preferred alloys for forming interconnections on electronic devices such as integrated circuit chips.
  • the amount of Cu in Al—Cu is typically in the range of 0.3 to 4 percent.
  • Dual Damascene a process in which a via and a line are fabricated together in a single step.
  • An integration issue that needs to be overcome to successfully fabricate Dual Damascene copper interconnects is the adhesion of the barrier to seed layer films and to the copper interconnects.
  • the International Technology Roadmap for Semiconductors, 1999 Edition calls for small via diameters and higher aspect ratios in future interconnect metallizations.
  • copper is electrodeposited on a copper seed layer which in turn is deposited onto a diffusion layer.
  • diffusion barrier and Cu seed layer are typically deposited using physical vapor deposition (PVD), ionized physical vapor deposition (IPVD), or chemical vapor deposition (CVD) techniques (Hu et al. Mat. Chem. Phys., 52 (1998)5).
  • the diffusion barrier is frequently composed of two layers (e.g. Ti/TiN bilayer barrier).
  • the present invention makes it possible to fabricate completely encapsulated copper interconnections for integrated circuits employing certain interlayers between the copper or seed layer and the underlying barrier layer.
  • the present invention is concerned with employing an interlayer of platinum and/or palladium.
  • the present invention relates to an electronic structure comprising a substrate having a dielectric layer having a via opening therein; the via opening having sidewalls and bottom surfaces; and a barrier layer on the sidewalls and bottom surfaces of the via opening; an interlayer of palladium and/or platinum; a layer of copper or copper alloy located on the interlayer.
  • Another aspect of the present invention relates to a method for fabricating an electronic structure which comprises forming an insulating material on a substrate; lithographically defining and forming recesses for lines and/or via in the insulating material in which interconnection conductor material will be deposited; a barrier layer in the recesses; depositing an interlayer of palladium and/or platinum; and depositing copper or a copper alloy on the interlayer to fill the recesses.
  • FIG. 1-6 are schematic diagram structures according to the present invention at different stages of fabrication.
  • the structures according to the present invention can be obtained by providing an insulating material 2 such as silicon dioxide on a substrate 1 (e.g. a semiconductor wafer substrate).
  • a substrate 1 e.g. a semiconductor wafer substrate.
  • Lines and/or vias openings 3 are lithographically defined and formed in the insulating material 2 by well-known techniques as illustrated in FIG. 2 .
  • a barrier layer 4 is deposited onto structure as illustrated in FIG. 3 .
  • the barrier layer is typically deposited by CVD (chemical vapor deposition), or sputtering such as physical vapor deposition (PVD) or ionized physical vapor deposition (IPVD).
  • an interlayer 5 of palladium and/or platinum is deposited onto the barrier layer 4 as illustrated in FIG. 4 .
  • the interlayer can be deposited by CVD, PVD or IPVD techniques.
  • the interlayer 5 is typically about 50 Angstroms to about 500 Angstroms thick and more typically about 50 Angstroms to about 100 Angstroms thick.
  • the interlayer 5 enhances adhesion between the barrier layer 4 and subsequently to be deposited copper layers.
  • the interlayer 5 can be deposited, for instance, by sputter deposition or chemical vapor deposition(CVD). If desired, optionally, a seed layer 6 such as copper can be deposited onto the interlayer 5 as illustrated in FIG. 5 .
  • the seed layer 6 is not required according to the present invention.
  • the copper layer 6 can be deposited such as by electrochemical deposition including electroless or electroplating techniques.
  • the seed layer 6 when employed is typically about 50 to about 200 nanometers thick and more typically about 60 to about 100 nanometers thick.
  • Typical electroless copper plating compositions are aqueous compositions comprising a source of cupric ions, a reducing agent and a complexing agent.
  • the compositions can also include stabilizers, surfactants, levelers and brighteners.
  • a typical source of cupric ions is CuSO 4 .
  • a typical reducing agent is formaldehyde.
  • Typical complexing agents are ethylenediamine tetraacetic acid (EDTA) and salts thereof.
  • Typical stabilizers are sodium cyanamide and 2,2′-dipyridil.
  • a typical surfactant is Triton X-114 (polyoxyethylene isooctyl phenyl ether).
  • the composition typically has a pH of about 10.8 to about 13 which can be adjusted by adding a pH adjuster such as NaOH or KOH.
  • the electroless deposition is typically carried out at about 20° C. to about 35° C. at a deposition rate of 25 nm/minute.
  • the copper seed layer 6 can be electrodeposited from an aqueous acidic copper solution.
  • a copper or copper alloy layer 7 is then deposited onto the interlayer 5 or the copper seed layer 6 when present.
  • the copper can be deposited directly on the interlayer 5 without any seed layer by electrochemical deposition such as electroplating or electroless plating. Examples of suitable electroplating compositions are disclosed in U.S. Ser. No. 09/348,632 disclosure of which is incorporated herein by reference.
  • the copper plating is employed to fill the lines and/or vias openings 3 .
  • any layers 4 , 5 and 6 present on the top surface of the substrate can be removed as illustrated in FIG. 6 by, for example, chemical mechanical polishing (CMP) to provide a planarized structure with copper being flush with the substrate and to achieve electrical isolation of individual lines and/or vias.
  • CMP chemical mechanical polishing
  • the chemical mechanical polishing can be carried out prior to depositing the copper in the event of electroless deposition.
  • the technique of the present invention can be used for Single and Dual Damascene structures.
  • the W/Pt and W/Pd structures can be deposited via a number of precursors on top of the W layer.
  • the following procedure is to be employed.
  • base pressure base pressure less than 10( ⁇ 6) torr
  • Ar inert carrier gas
  • the same deposition temperature as that used for the tungsten.
  • the flow of the pT or Pd precursor, entrained as was the W(CO)6 in an inert gas or other suitable carrier e.g. CO in some cases, is admitted into the chamber and allowed to flow over the heated substrate until a sufficient deposition has been achieved.
  • An electroless copper seed layer is deposited onto a structure of 50 nm sputtered Pd/10 nm PVD Ta/SiO 2 /Si from LeaRonal Electroless Coppermerse 20 solution having a pH of about 13.00, a commercially available bath.
  • the bath has a deposition rate of 25 nm/minute at 25° C.
  • Example 1 was repeated that the plating time is extended to produce a copper deposit of 50 nm thick. The deposit was an adherent coating.
  • a copper seed layer is electrodeposited onto a structure of 50 nm sputtered Pd/10 nm PVD Ta/SiO 2 /Si from Sel-Rex acid copper solution, a commercially available bath. Electrodeposition is carried out at a rate of 10 mA/cm 2 . A copper deposit of 221 nm thickness was an adherent coating.
  • Example 3 was repeated except that the plating time is extended to produce a copper deposit of about 663 nm thickness. The deposit was an adherent coating.
  • a copper seed layer is electrodeposited onto a structure of 5 nm Pd/10 nm Ta/SiO 2 /Si from an alkaline copper solution of the following composition: CuSO 4 .5H 2 O 0.03-0.08 M EDTA completing agent, ethylene 0.05-0.20 M diamine tetraacetic acid or a sodium mono, -di, tri, or tetra-sodium salt of EDTA) NaOH to pH 10.8-13.
  • An electroless copper seed layer is deposited onto a structure of 1.5 nm Pd/CVD W/SiO2/Si from the solution in example 5, at 50-65° C., to which formaldehyde (CH 2 O, 37% solution) is added as a reducing agent for Cu 2+ ions.
  • the bath has a deposition rate of about 5 to 60 nm/minute.

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Abstract

An interconnection structure comprising a substrate having a dielectric layer with a via opening therein; a barrier layer located in the via opening; an interlayer of palladium and/or platinum on the barrier layer; and a layer of copper or copper alloy on the interlayer is provided.

Description

    FIELD OF THE INVENTION
  • The present invention relates to interconnection wiring on electronic devices such as on integrated circuits (IC) chips and more particularly to encapsulated copper interconnection in integrated circuits.
    • BACKGROUND OF THE INVENTION
  • In the past, Al—Cu and its related alloys were the preferred alloys for forming interconnections on electronic devices such as integrated circuit chips. The amount of Cu in Al—Cu is typically in the range of 0.3 to 4 percent.
  • Replacement of Al—Cu by Cu and Cu alloys as chip interconnection materials results in advantages of performance. Performance is improved because the resistivity of Cu and certain copper alloys is less than the resistivity of Al—Cu; thus narrower lines can be used and higher wiring densities will be realized.
  • The advantages of Cu metallization have been recognized by the semiconductor industry. In fact, the semiconductor industry is rapidly moving away from aluminum and is adopting copper as the material of choice for chip interconnects because of its high conductivity and improved reliability.
  • Manufacturing of chip interconnects involves many process steps that are interrelated. In particular, copper interconnects are manufactured using a process called “Dual Damascene” in which a via and a line are fabricated together in a single step. An integration issue that needs to be overcome to successfully fabricate Dual Damascene copper interconnects is the adhesion of the barrier to seed layer films and to the copper interconnects. In addition, the International Technology Roadmap for Semiconductors, 1999 Edition, calls for small via diameters and higher aspect ratios in future interconnect metallizations.
  • In may prior art techniques, copper is electrodeposited on a copper seed layer which in turn is deposited onto a diffusion layer. Both diffusion barrier and Cu seed layer are typically deposited using physical vapor deposition (PVD), ionized physical vapor deposition (IPVD), or chemical vapor deposition (CVD) techniques (Hu et al. Mat. Chem. Phys., 52 (1998)5). Moreover, the diffusion barrier is frequently composed of two layers (e.g. Ti/TiN bilayer barrier).
  • Accordingly, room exists for improvement in the prior art for improving the adhesion to the seed layer or copper layers.
    • SUMMARY OF THE INVENTION
  • The present invention makes it possible to fabricate completely encapsulated copper interconnections for integrated circuits employing certain interlayers between the copper or seed layer and the underlying barrier layer. The present invention is concerned with employing an interlayer of platinum and/or palladium.
  • In particular, the present invention relates to an electronic structure comprising a substrate having a dielectric layer having a via opening therein; the via opening having sidewalls and bottom surfaces; and a barrier layer on the sidewalls and bottom surfaces of the via opening; an interlayer of palladium and/or platinum; a layer of copper or copper alloy located on the interlayer.
  • Another aspect of the present invention relates to a method for fabricating an electronic structure which comprises forming an insulating material on a substrate; lithographically defining and forming recesses for lines and/or via in the insulating material in which interconnection conductor material will be deposited; a barrier layer in the recesses; depositing an interlayer of palladium and/or platinum; and depositing copper or a copper alloy on the interlayer to fill the recesses.
  • Still other objects and advantages of the present invention will become readily apparent by those skilled in the art from the following detailed description, wherein it is shown and described preferred embodiments of the invention, simply by way of illustration of the best mode contemplated of carrying out the invention. As will be realized the invention is capable of other and different embodiments, and its several details are capable of modifications in various obvious respects, without departing from the invention. Accordingly, the description is to be regarded as illustrative in nature and not as restrictive.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1-6 are schematic diagram structures according to the present invention at different stages of fabrication.
    • BEST AND VARIOUS MODES FOR CARRYING OUT INVENTION
  • Reference will be made to the figure to facilitate an understanding of the present invention. As shown in FIG. 1, the structures according to the present invention can be obtained by providing an insulating material 2 such as silicon dioxide on a substrate 1 (e.g. a semiconductor wafer substrate).
  • Lines and/or vias openings 3 are lithographically defined and formed in the insulating material 2 by well-known techniques as illustrated in FIG. 2. A barrier layer 4 is deposited onto structure as illustrated in FIG. 3. The barrier layer is typically deposited by CVD (chemical vapor deposition), or sputtering such as physical vapor deposition (PVD) or ionized physical vapor deposition (IPVD).
  • According to the present invention, an interlayer 5 of palladium and/or platinum is deposited onto the barrier layer 4 as illustrated in FIG. 4. The interlayer can be deposited by CVD, PVD or IPVD techniques. The interlayer 5 is typically about 50 Angstroms to about 500 Angstroms thick and more typically about 50 Angstroms to about 100 Angstroms thick.
  • The interlayer 5 enhances adhesion between the barrier layer 4 and subsequently to be deposited copper layers. The interlayer 5 can be deposited, for instance, by sputter deposition or chemical vapor deposition(CVD). If desired, optionally, a seed layer 6 such as copper can be deposited onto the interlayer 5 as illustrated in FIG. 5. The seed layer 6 is not required according to the present invention. The copper layer 6 can be deposited such as by electrochemical deposition including electroless or electroplating techniques.
  • The seed layer 6 when employed is typically about 50 to about 200 nanometers thick and more typically about 60 to about 100 nanometers thick.
  • Typical electroless copper plating compositions are aqueous compositions comprising a source of cupric ions, a reducing agent and a complexing agent. The compositions can also include stabilizers, surfactants, levelers and brighteners.
  • A typical source of cupric ions is CuSO4. A typical reducing agent is formaldehyde. Typical complexing agents are ethylenediamine tetraacetic acid (EDTA) and salts thereof.
  • Typical stabilizers are sodium cyanamide and 2,2′-dipyridil. A typical surfactant is Triton X-114 (polyoxyethylene isooctyl phenyl ether).
  • The composition typically has a pH of about 10.8 to about 13 which can be adjusted by adding a pH adjuster such as NaOH or KOH. The electroless deposition is typically carried out at about 20° C. to about 35° C. at a deposition rate of 25 nm/minute. In addition, the copper seed layer 6 can be electrodeposited from an aqueous acidic copper solution.
  • A copper or copper alloy layer 7 is then deposited onto the interlayer 5 or the copper seed layer 6 when present. The copper can be deposited directly on the interlayer 5 without any seed layer by electrochemical deposition such as electroplating or electroless plating. Examples of suitable electroplating compositions are disclosed in U.S. Ser. No. 09/348,632 disclosure of which is incorporated herein by reference. The copper plating is employed to fill the lines and/or vias openings 3.
  • Any layers 4, 5 and 6 present on the top surface of the substrate can be removed as illustrated in FIG. 6 by, for example, chemical mechanical polishing (CMP) to provide a planarized structure with copper being flush with the substrate and to achieve electrical isolation of individual lines and/or vias.
  • If desired, the chemical mechanical polishing can be carried out prior to depositing the copper in the event of electroless deposition.
  • The technique of the present invention can be used for Single and Dual Damascene structures.
  • For the purposed of plating tests on blanket substrates, all depositions of platinum and palladium wee carried out by simple sputter deposition onto tungsten substrates which had previously been prepared by CVD from tungsten hexacarbonyl. Deposits of Pt and Pd wee typically on the order of 5 nm thick, and no particular sensitivity to the details of the depositions was noted in the palting experiments.
  • For the preferred implementation, the W/Pt and W/Pd structures can be deposited via a number of precursors on top of the W layer. The following procedure is to be employed. First the initial layer of W is deposited. This is accomplished by placing the substrate to be coated in a low pressure (base pressure less than 10(−6) torr) CVD reactor, and heating the substrate to a temperature in a range of 370-430 C. Tungsten hexacarbonyl vapor, entrained in an inert carrier gas (Ar) is flowed over the substrate until a film of the desired thickness is grown, typically 5 nm-30 nm. The flow of the W(CO)6 vapor is then halted and the chamber evacuated, and the substrate temperature adjusted as desired. Depending upon the precursor selected for the deposition of Pd or Pt, it may be possible to employ the same deposition temperature as that used for the tungsten. At this point the flow of the pT or Pd precursor, entrained as was the W(CO)6 in an inert gas or other suitable carrier (e.g. CO in some cases), is admitted into the chamber and allowed to flow over the heated substrate until a sufficient deposition has been achieved.
  • As the substrate would at this point be covered by a continuous layer of W, there is considerable latitude in the selection of precursors for Pt and Pd. In the case of Pt, these include the carbonyl chloride, Pt(acac)2, (acac=acetoacetonate), Pt(PF3)4, and various organometallics involving cyclooctadienly, cycloentadienly, alkyl, and allyl ligands. For the Pd, the number of suitable compounds is less extensive, however various bis(allyl) compounds, cyclopentadienely allyl Palladdium, and Pd(hfac)2 (hfac=hexafluoroacetoacetonate) are all suitable.
  • The following non-limiting examples are presented to further illustrate the present invention.
    • EXAMPLE 1
  • An electroless copper seed layer is deposited onto a structure of 50 nm sputtered Pd/10 nm PVD Ta/SiO2/Si from LeaRonal Electroless Coppermerse 20 solution having a pH of about 13.00, a commercially available bath. The bath has a deposition rate of 25 nm/minute at 25° C. The copper deposit, 25 nm thick, was an adherent coating and suitable for the present invention.
    • EXAMPLE 2
  • Example 1 was repeated that the plating time is extended to produce a copper deposit of 50 nm thick. The deposit was an adherent coating.
    • EXAMPLE 3
  • A copper seed layer is electrodeposited onto a structure of 50 nm sputtered Pd/10 nm PVD Ta/SiO2/Si from Sel-Rex acid copper solution, a commercially available bath. Electrodeposition is carried out at a rate of 10 mA/cm2. A copper deposit of 221 nm thickness was an adherent coating.
    • EXAMPLE 4
  • Example 3 was repeated except that the plating time is extended to produce a copper deposit of about 663 nm thickness. The deposit was an adherent coating.
    • EXAMPLE 5
  • A copper seed layer is electrodeposited onto a structure of 5 nm Pd/10 nm Ta/SiO2/Si from an alkaline copper solution of the following composition:
    CuSO4.5H2O 0.03-0.08 M
    EDTA completing agent, ethylene 0.05-0.20 M
    diamine tetraacetic acid or a sodium
    mono, -di, tri, or tetra-sodium salt
    of EDTA)
    NaOH to pH 10.8-13.
    2,2′-dipyridyl 10−8-10−2 M/L
    Triton X-114 0.10-0.30 mL/L (Triton X-114:
    polyoxyethylene (8) isooctylphenyl
    ether)
    H2O to 1 L
    Temperature 20-35° C.

    Electrodeposition is carried out at a rate of 7.8 mA/cm2
    A copper deposit of 87 nm thickness was an adherent deposit.
    • EXAMPLE 6
  • An electroless copper seed layer is deposited onto a structure of 1.5 nm Pd/CVD W/SiO2/Si from the solution in example 5, at 50-65° C., to which formaldehyde (CH2O, 37% solution) is added as a reducing agent for Cu2+ ions. The bath has a deposition rate of about 5 to 60 nm/minute. A copper deposit of 25 nm thickness, was an adherent coating and suitable for the present invention.
  • The foregoing description of the invention illustrates and describes the present invention. Additionally, the disclosure shows and describes only the preferred embodiments of the invention, but as aforementioned, it is to be understood that the invention is capable of use in various other combinations, modifications, and environments and is capable of changes or modifications within the scope of the inventive concept as expressed herein, commensurate with the above teachings, and/or the skill or knowledge of the relevant art. The embodiments described hereinabove are further intended to explain best modes known of practicing the invention and to enable others skilled in the art to utilize the invention in such, or other, embodiments and with the various modifications required by the particular applications or uses of the invention. Accordingly, the description is not intended to limit the invention to the form disclosed herein. Also, it is intended that the appended claims be construed to include alternative embodiments.

Claims (12)

1. An electronic structure comprising:
a substrate having a dielectric layer having a via opening therein; the via opening having sidewalls and bottom surfaces of the via opening;
an interlayer of a member selected from the group consisting of palladium, platinum and mixtures thereof; and
copper or copper alloy located on the interlayer.
2. The electronic structure of claim 1 wherein said interlayer is palladium.
3. The electronic structure of claim 1 wherein said interlayer is platinum.
4. The electronic structure of claim 1 wherein the interlayer is about 50 to about 500 Angstroms thick.
5. The electronic structure of claim 1 wherein the interlayer is about 50 to about 100 Angstroms thick.
6. The structure of claim 1 wherein the dielectric layer comprises silicon dioxide.
7. The structure of claim 1 wherein the via opening is about 100 to about 500 nanometers thick.
8. The structure of claim 1 wherein the barrier layer is about 5 to about 200 nanometers thick.
9. The structure of claim 1 wherein the barrier layer is selected from the group consisting of tungsten, alloys of tungsten, titanium, alloys of titanium, titanium nitride, tantalum, tantalum nitride and tantalum silicon nitride.
10. The structure of claim 1 which further comprises a copper seed layer on said interlayer intermediate said copper or copper alloy.
11-26. (canceled)
27. A structure obtained by a method which comprises forming an insulating material on a substrate; lithographically defining and forming recesses for lines and/or via in the insulating material in which interconnection conductor material will be deposited:
depositing in the recesses a barrier layer;
depositing an interlayer of a member selected from the group consisting of palladium, platinum, and mixtures thereof, and
depositing copper or a copper alloy on the interlayer to fill the recesses.
US10/912,216 2002-08-09 2004-08-06 Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof Abandoned US20050006777A1 (en)

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