US20040159967A1 - Bubble elimination system for use with stereolithography apparatus and bubble elimination methods - Google Patents
Bubble elimination system for use with stereolithography apparatus and bubble elimination methods Download PDFInfo
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- US20040159967A1 US20040159967A1 US10/705,249 US70524903A US2004159967A1 US 20040159967 A1 US20040159967 A1 US 20040159967A1 US 70524903 A US70524903 A US 70524903A US 2004159967 A1 US2004159967 A1 US 2004159967A1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
- B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
- B29C64/135—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/188—Processes of additive manufacturing involving additional operations performed on the added layers, e.g. smoothing, grinding or thickness control
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/35—Cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/357—Recycling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
Abstract
A programmed material consolidation apparatus includes at least one fabrication site and a material consolidation system associated with the at least one fabrication site. The at least one fabrication site may be configured to receive one or more fabrication substrates, such as semiconductor substrates. A machine vision system with a translatable or locationally fixed camera may be associated with the at least one fabrication site and the material consolidation system. A cleaning component may also be associated with the at least one fabrication site. The cleaning component may share one or more elements with the at least one fabrication site, or may be separate therefrom. The programmed material consolidation apparatus may also include a substrate handling system, which places fabrication substrates at appropriate locations of the programmed material consolidation apparatus.
Description
- This application claims the benefit of U.S. Provisional Application No. 60/425,567, filed Nov. 11, 2002, the disclosure of which is hereby incorporated in its entirety by this reference.
- 1. Field of the Invention
- The present invention relates generally to apparatus for effecting programmed material consolidation techniques, such as stereolithography, and, more particularly, to apparatus that are configured to fabricate features on semiconductor devices and related components. The present invention also relates to programmed material consolidation methods that include use of such apparatus.
- 2. Background of Related Art
- Over the past decade or so, a manufacturing technique which has become known as “stereolithography” and which is also known as “layered manufacturing” has evolved to a degree where it is employed in many industries.
- Basically, stereolithography, as conventionally practiced, involves utilizing a computer, typically under control of three-dimensional (3-D) computer-aided design (CAD) software, to generate a 3-D mathematical simulation or model of an object to be fabricated. The computer mathematically separates or “slices” the simulation or model into a large number of relatively thin, parallel, usually vertically superimposed layers. Each layer has defined boundaries and other features that correspond to a substantially planar section of the simulation or model and, thus, of the actual object to be fabricated. A complete assembly or stack of all of the layers defines the entire simulation or model. A simulation or model which has been manipulated in this manner is typically stored and, thus, embodied as a CAD computer file. The simulation or model is then employed to fabricate an actual, physical object by building the object, layer by superimposed layer. Surface resolution of the fabricated object is, in part, dependent upon the thickness of the layers.
- A wide variety of approaches to stereolithography by different companies has resulted in techniques for fabricating objects from various types of materials. Regardless of the material employed to fabricate an object, stereolithographic techniques usually involve disposition of a layer of unconsolidated or unfixed material corresponding to each layer of the simulation or model. Next, the material of a layer is selectively consolidated or fixed to at least a partially consolidated, partially fixed, or semisolid state in those areas of a given layer that correspond to solid areas of the corresponding section of the simulation or model. Also, while the material of a layer is being consolidated or fixed, that layer may be bonded to a lower layer of the object which is being fabricated.
- The unconsolidated material employed to build an object may be supplied in particulate or liquid form. The material may itself be consolidated or fixed. Alternatively, when the unconsolidated material comprises particles, a separate binder material mixed therein or coating the particles may facilitate bonding of the particles to one another, as well as to the particles of a previously formed layer.
- Surface resolution of the features of a fabricated object depends, at least in part, upon the material being used. For example, when particulate materials are employed, resolution of object surfaces is highly dependent upon particle size, whereas when a liquid is employed, surface resolution is highly dependent upon the minimum surface area of the liquid which can be consolidated or fixed and the minimum thickness of a material layer that can be generated. Of course, in either case, resolution and accuracy of the features of an object being produced from the simulation or model are also dependent upon the ability of the apparatus used to consolidate or fix the material to precisely track the mathematical instructions indicating solid areas and boundaries for each layer of material.
- Toward that end, and depending upon the type and form of material to be fixed, stereolithographic fabrication processes have employed various fixation approaches. For example, particles have been selectively consolidated by particle bombardment (e.g., with electron beams), disposition of a binder or other fixative in a manner similar to ink-jet printing techniques, and focused irradiation using heat or specific wavelength ranges. In some instances, thin, preformed sheets of material may be superimposed to build an object, each sheet being fixed to a next-lower sheet and unwanted portions of each sheet removed, a stack of such sheets defining the completed object.
- Early on in its development, stereolithography was used to rapidly fabricate prototypes of objects from CAD files. Prototypes of objects might be built to verify the accuracy of the CAD file defining the object (e.g., an object or negative of a mold to be machined) and to detect any design deficiencies and possible fabrication problems before a design was committed to large-scale production. Stereolithographic techniques have also been used in the fabrication of molds. Using stereolithographic techniques, either male or female forms on which mold material might be disposed could be rapidly generated.
- In more recent years, stereolithography has been employed to develop and refine object designs in relatively inexpensive materials. Stereolithography has also been used to fabricate small quantities of objects for which the cost of conventional fabrication techniques is prohibitive, such as in the case of plastic objects that have conventionally been formed by injection molding techniques. It is also known to employ stereolithography in the custom fabrication of products generally built in small quantities or where a product design is rendered only once. Finally, it has been appreciated in some industries that stereolithography provides a capability to fabricate products, such as those including closed interior chambers or convoluted passageways, which cannot be fabricated satisfactorily using conventional manufacturing techniques. It has also been recognized in some industries that a stereolithographic object or component may be formed or built around another, pre-existing object or component to create a larger product.
- Conventionally, stereolithographic apparatus have been used to fabricate freestanding structures. Such structures have been formed directly on a platen or other support system of the stereolithographic fabrication apparatus, which is located within the fabrication tank of the stereolithographic apparatus. As the freestanding structures are fabricated directly on the support system, there is typically no need to precisely and accurately position features of the stereolithographically fabricated structure. As such, conventional stereolithographic apparatus lack machine vision systems for ensuring that structures are fabricated at certain locations.
- Moreover, conventional stereolithographic apparatus lack support systems, handling systems, and cleaning equipment which are suitable for use with relatively delicate structures, such as semiconductor substrates and semiconductor devices that have been fabricated thereon.
- Accordingly, there is a need for stereolithography apparatus which are configured to form structures on fabrication substrates, such as semiconductor substrates and semiconductor device components and which include systems for accurately positioning the fabricated structures, supporting and handling the fabrication substrates, and cleaning excess and residual material from the fabrication substrates.
- The present invention includes stereolithography apparatus and other programmable material consolidation apparatus and systems that are configured to fabricate features on semiconductor devices or on components that are configured for use with semiconductor devices. In addition, the present invention includes stereolithographic and other programmed material consolidation methods (e.g., stereolithography, layered object manufacturing (LOM), selective laser sintering (SLS), photopolymer jetting, selective particle atomization and consolidation (laser engineered net shaping, or “LENS”), and other so-called “rapid prototyping” technologies) that include use of apparatus according to the present invention. As used herein, the term “stereolithography” and variations thereof, where applicable, are intended to denote all types of programmed material consolidation techniques and is used synonymously with the phrase “programmed material consolidation” and variations thereof.
- A programmed material consolidation apparatus, or “stereolithography apparatus” for simplicity, according to the present invention includes a fabrication tank, which is also referred to herein as a “fabrication chamber” or even more broadly as a “fabrication site.” The fabrication tank includes a platen or other support system suitable for carrying substrates upon which structures are to be stereolithographically fabricated, which may also be termed “fabrication substrates.” By way of example only, the fabrication tank and the support therein may be sized and configured to receive one or more semiconductor substrates, each of which carries a plurality of semiconductor devices. Alternatively, or in addition, the platen or other support system may be configured to support freestanding structures as they are fabricated. In addition, the fabrication tank may include a reservoir that is configured to hold a volume of unconsolidated material, such as a liquid polymer.
- A material consolidation system is associated with the fabrication tank in such a way as to direct consolidating energy (e.g., in the form of radiation, such as a laser beam or less-focused radiation) to a surface of the quantity of unconsolidated material within the reservoir of the fabrication tank. When selective consolidation is desired, a high level of precision may be achieved when the consolidating energy is focused and the surface of the quantity of unconsolidated material and the focal point for the consolidating energy substantially intersect one another.
- Optionally, a stereolithography apparatus that incorporates teachings of the present invention may include a machine vision system. The machine vision system includes an optical detection element, such as a camera, as well as a controller or processing element, such as a computer processor or a collection of computer processors, associated with the optical detection element. The optical detection element may be positioned in a fixed location relative to the fabrication tank or configured to move relative to the fabrication tank.
- When included as part of a stereolithographic apparatus that incorporates teachings of the present invention, the optical detection element of a machine vision system is useful for identifying the locations of recognizable features, including, without limitation, features on a fabrication substrate and features, such as fiducial marks, at a fabrication site. For example, the optical detection element may be configured and/or located to “see” relatively large structures, such as those that can be seen by the naked eye (i.e., macroscopic structures), such as the locations of semiconductor devices upon a fabrication substrate. Alternatively, or in addition, the optical detection element may be configured and/or located to “see” very small, even microscopic structures.
- Another optional feature of a stereolithographic apparatus of the present invention is a cleaning component. A cleaning component may be positioned and configured to remove excess liquid polymer from a fabrication substrate while the fabrication substrate remains positioned upon a support system that is associated with the fabrication tank. Such a cleaning component may comprise at least a part of the fabrication tank and, thus, operate prior to introduction of another fabrication substrate into the fabrication tank. Alternatively, excess liquid polymer may be removed from a fabrication substrate during or following removal thereof from the fabrication tank.
- Additionally, a stereolithographic apparatus that incorporates teachings of the present invention may include a material reclamation system. The material reclamation system may be associated with one or both of the fabrication tank and a cleaning component, if the stereolithographic apparatus includes a cleaning component. By way of example, the material reclamation system may collect material from the cleaning component and recycle the same into the fabrication tank.
- A programmed material consolidation system that incorporates teachings of the present invention may include a plurality of fabrication sites and share a common material consolidation system, machine vision system, handling system, cleaning component, or material reclamation system.
- The present invention also includes methods for calibrating stereolithographic apparatus that incorporate teachings of the present invention. For example, the locations at which unconsolidated material may be selectively consolidated may be calibrated with a machine vision system. As another example, the magnification of a machine vision system may be calibrated. Also, a material consolidation system of a stereolithographic apparatus according to the present invention may be calibrated to optimize the linearity with which selectively consolidating energy impinges on a surface of unconsolidated material.
- Programmed material consolidation fabrication processes, including methods of using each of the features described herein, are also within the scope of the present invention. In particular, stereolithographic fabrication processes that incorporate teachings of the present invention include the use of stereolithographic techniques to fabricate features on another structure, or fabrication substrate, such as a semiconductor substrate or semiconductor device component (e.g., a lead frame, a circuit board, etc.).
- Other features and advantages of the present invention will become apparent to those of skill in the art through consideration of the ensuing description, the accompanying drawings, and the appended claims.
- In the drawings, which depict exemplary embodiments of various features of the present invention:
- FIG. 1 is a schematic representation of various possible elements of a stereolithographic apparatus for fabricating features on semiconductor devices or associated components in accordance with the present invention, the elements including a fabrication tank, a material consolidation system, a machine vision system, a cleaning component, and a material reclamation system;
- FIG. 2 schematically depicts an exemplary stereolithographic apparatus in which a single material consolidation system and/or a single machine vision system may be shared by a plurality of fabrication tanks;
- FIG. 3 schematically depicts an exemplary embodiment of fabrication tank that may be used in a stereolithographic apparatus of the present invention, the fabrication tank including a cavity and a reservoir which are continuous with one another;
- FIG. 3A illustrates an exemplary support element of the fabrication tank of FIG. 3, which support element has a substantially planar support surface;
- FIG. 3B shows another exemplary support element of the fabrication tank shown in FIG. 3, which support element includes recesses formed in the support surface thereof;
- FIG. 3C illustrates an exemplary volume control element of the fabrication tank depicted in FIG. 3, which volume control element is configured to add unconsolidated material to and/or remove unconsolidated material from the reservoir of the fabrication tank;
- FIG. 3D depicts another exemplary volume control element of the fabrication tank of FIG. 3, which volume control element is configured to displace unconsolidated material located within the reservoir of the fabrication tank;
- FIG. 3E schematically depicts a stereolithographic fabrication tank which includes another variation of volume control and surface level control element;
- FIG. 4 schematically depicts another embodiment of fabrication tank that includes a rotatable support element and which may be used in a stereolithographic apparatus according to the present invention, such as those shown in FIGS. 1 and 2, which fabrication tank also comprises a cleaning component and a material reclamation system;
- FIG. 4A is a top view of an example of a retention system for use with a support system of the fabrication tank of FIG. 4;
- FIG. 4B is a cross-section taken along
line 4B-4B of FIG. 4A; - FIG. 4C is a top view of another example of a retention system for use with a support system of the fabrication tank of FIG. 4;
- FIG. 4D is a cross-section taken along
line 4D-4D of FIG. 4C; - FIG. 4E is a cross-sectional representation of another embodiment of support system that may be used in a fabrication tank of a semiconductor fabrication apparatus according to the present invention;
- FIG. 4F is a top view of the support system shown in FIG. 4E;
- FIG. 5 is a schematic representation of still another exemplary embodiment of fabrication tank that incorporates teachings of the present invention;
- FIG. 6 is a schematic representation of an exemplary embodiment of a material consolidation system according to the present invention, which is configured to focus consolidating energy so as to selectively consolidate unconsolidated material which has been placed over a fabrication substrate;
- FIG. 7 schematically depicts another exemplary embodiment of material consolidation system, which is configured to generally consolidate unconsolidated material which has been placed over a fabrication substrate;
- FIG. 8 schematically illustrates an exemplary embodiment of machine vision system that may be used with a fabrication tank of a stereolithographic apparatus according to the present invention, with the machine vision system being configured to move relative to a surface of unconsolidated material which is to be consolidated by the stereolithographic apparatus;
- FIG. 9 is a schematic representation of another exemplary embodiment of machine vision system, which embodiment is configured to remain at a fixed location relative to a surface of unconsolidated material which is to be consolidated by a stereolithographic apparatus with which the machine vision system is used;
- FIG. 10 is a schematic representation of another embodiment of cleaning component, as well as an exemplary embodiment of a material reclamation system;
- FIG. 11 is a schematic representation of yet another embodiment of cleaning component that may be used as part of a stereolithographic apparatus according to the present invention;
- FIG. 12 is a schematic representation of the manner in which the locations at which a layer of unconsolidated material is selectively consolidated may be calibrated with a machine vision system of a stereolithographic apparatus of the present invention;
- FIG. 13 is a top view of a fabrication tank, depicting an exemplary manner in which a linearity calibration may be conducted; and
- FIG. 14 is a cross-sectional representation of a fabrication substrate and an object being stereolithographically fabricated thereon in accordance with teachings of the present invention.
- An exemplary
stereolithographic apparatus 10 for fabricating features on semiconductor substrates 52,semiconductor devices 54 or associated components (e.g., lead frames, circuit boards, etc.) (not shown) orother fabrication substrates 50 is schematically depicted in FIG. 1. As shown,stereolithographic apparatus 10 includes afabrication tank 100 and amaterial consolidation system 200, amachine vision system 300, acleaning component 400, and amaterial reclamation system 500 that are associated withfabrication tank 100. The depictedstereolithographic apparatus 10 also includes asubstrate handling system 600, such as a rotary feed system or linear feed system available from Genmark Automation Inc. of Sunnyvale, Calif., for movingfabrication substrates 50 from one system of stereolithographic apparatus to another. Features of one or more of the foregoing systems may be associated with one ormore controllers 700, or processing elements, such as computer processors or smaller groups of logic circuits, in such a way as to effect their operation in a desired manner. -
Controller 700 may comprise a computer or a computer processor, such as a so-called “microprocessor,” which may be programmed to effect a number of different functions. Alternatively,controller 700 may be programmed to effect a specific set of related functions or even a single function. Eachcontroller 700 ofstereolithographic apparatus 10 may be associated with a single system thereof or a plurality of systems so as to orchestrate the operation of such systems relative to one another. -
Fabrication tank 100 includes achamber 110 which is configured to contain asupport system 130. In turn,support system 130 is configured to carry one ormore fabrication substrates 50. By way of example only, the types offabrication substrates 50 thatsupport system 130 may be configured to carry may include, without limitation, a bulk semiconductor substrate 52 (e.g., a full or partial wafer of semiconductive material, such as silicon, gallium arsenide, indium phosphide, a silicon-on-insulator (SOI) type substrate, such as silicon-on-ceramic (SOC), silicon-on-glass (SOG), or silicon-on-sapphire (SOS), etc.) that includes a plurality ofsemiconductor devices 54 thereon. -
Fabrication tank 100 may also have areservoir 120 associated therewith.Reservoir 120 may be continuous withchamber 110. Alternatively,reservoir 120 may be separate from, but communicate with,chamber 110 in such a way as to provideunconsolidated material 126 thereto.Reservoir 120 is configured to at least partially contain avolume 124 ofunconsolidated material 126, such as a photoimageable polymer, or “photopolymer,” particles of thermoplastic polymer, resin-coated particles, or the like. - Photopolymers believed to be suitable for use with a
stereolithography apparatus 10 according to the present invention include, without limitation, ACCURA® SI 40 Hc and AR materials, ACCURA® SI 40 ND material, and CIBATOOL SL 5170, SL 5210, SL 5530, and SL 7510 resins. The ACCURA® materials are available from 3D Systems, Inc., of Valencia, Calif., while the CIBATOOL resins are available from Ciba Specialty Chemicals Company of Basel, Switzerland. -
Reservoir 120 or another component associated with one or both offabrication tank 100 andreservoir 120 thereof may be configured to maintain asurface 128 of a portion ofvolume 124 located withinchamber 110 at a substantially constant elevation relative tochamber 110. - A
material consolidation system 200 is associated withfabrication tank 100 in such a way as to direct consolidatingenergy 220 intochamber 110 thereof, toward at least areas ofsurface 128 ofvolume 124 ofunconsolidated material 126 withinreservoir 120 that are located overfabrication substrate 50. Consolidatingenergy 200 may comprise, for example, electromagnetic radiation of a selected wavelength or a range of wavelengths, an electron beam, or other suitable energy for consolidatingunconsolidated material 126.Material consolidation system 200 includes asource 210 of consolidatingenergy 220. If consolidatingenergy 220 is focused,source 210 or alocation control element 212 associated therewith (e.g., a set of galvanometers, including one for x-axis movement and another for y-axis movement) may be configured to direct, or position, consolidatingenergy 220 toward a plurality of desired areas ofsurface 128. Alternatively, if consolidatingenergy 220 remains relatively unfocused, it may be directed generally towardsurface 128 from a single, fixed location or from a plurality of different locations. In any event, operation ofsource 210, as well as movement thereof, if any, may be effected under the direction ofcontroller 700. - When
material consolidation system 200 directs focused consolidatingenergy 220 towardsurface 128 ofvolume 124 ofunconsolidated material 126,stereolithographic apparatus 10 may also include amachine vision system 300.Machine vision system 300 facilitates the direction of focused consolidatingenergy 220 toward desired locations of features onfabrication substrate 50. As withmaterial consolidation system 200, operation ofmachine vision system 300 may be proscribed bycontroller 700. If any portion ofmachine vision system 300, such as acamera 310 thereof, moves relative tochamber 110 offabrication tank 100, that portion ofmachine vision system 300 may be positioned so as provide a clear path to all of the locations ofsurface 128 that are located over eachfabrication substrate 50 withinchamber 110. - Optionally, as schematically depicted in FIG. 2, one or both of material consolidation system200 (which may include a plurality of mirrors 214) and
machine vision system 300 of astereolithographic apparatus 10 may be oriented and configured to operate in association with a plurality offabrication tanks 100. Of course, one ormore controllers 700 would be useful for orchestrating the operation ofmaterial consolidation system 200,machine vision system 300, andsubstrate handling system 600 relative to a plurality offabrication tanks 100. - With returned reference to FIG. 1,
cleaning component 400 ofstereolithographic apparatus 10 may also operate under the direction ofcontroller 700.Cleaning component 400 ofstereolithographic apparatus 10 may be continuous with achamber 110 offabrication tank 100 or positioned adjacent tofabrication tank 100. If cleaningcomponent 400 is continuous withchamber 110, anyunconsolidated material 126 that remains on afabrication substrate 50 may be removed therefrom prior to introduction of anotherfabrication substrate 50 intochamber 110. - If
cleaning component 400 is positioned adjacent tofabrication tank 100, residualunconsolidated material 126 may be removed from afabrication substrate 50 asfabrication substrate 50 is removed fromchamber 110. Alternatively, anyunconsolidated material 126 remaining onfabrication substrate 50 may be removed therefrom afterfabrication substrate 50 has been removed fromchamber 110, in which case the cleaning process may occur as anotherfabrication substrate 50 is positioned withinchamber 110. -
Material reclamation system 500 collects excessunconsolidated material 126 that has been removed from afabrication substrate 50 by cleaningcomponent 400, then returns the excessunconsolidated material 126 toreservoir 120 associated withfabrication tank 100. - Turning now to FIGS.3-5, various exemplary embodiments of fabrication sites, chambers, or tanks, that may be used in a stereolithographic apparatus 10 (FIG. 1) or other programmable material consolidation apparatus or system that incorporates teachings of the present invention are illustrated.
- FIG. 3 shows a
fabrication tank 100′ which includes achamber 110′ that is continuous with areservoir 120′. Asupport system 130′, which includes a platen, orsupport element 132′, apositioning element 140′, and anactuation element 146′, is located withinreservoir 120′, beneathchamber 110′, and may be moved to a plurality of different vertical positions, or elevations, therein. - A substrate-supporting surface of
support element 132′, which is also referred to herein as asupport surface 134′ for the sake of simplicity, may be substantially planar, as shown in FIG. 3A. Alternatively, as depicted in FIG. 3B,support surface 134′ may have one ormore recesses 136′ formed therein, eachrecess 136′ being configured to receive at least a portion of afabrication substrate 50. Additionally, eachrecess 136′ may be configured to position afabrication substrate 50 in a desired orientation upon introduction of the same thereinto.Support surface 134′ may be configured to carry asingle fabrication substrate 50 or a plurality offabrication substrates 50. - Positioning
element 140′ may be coupled to abottom surface 138′ ofsupport element 132′ or otherwise operatively associated withsupport element 132′.Positioning element 140′ is depicted as being an elongate structure that includes acoupling end 142′ that has been secured tobottom surface 138′, as well as an opposite,actuation end 144′. Nonetheless,positioning elements 140′ of other configurations are also within the scope of the present invention. By way of example only,positioning element 140′ may comprise a hydraulically or pneumatically actuated piston, a screw, a linear actuator or stepper element, a series of gears, or the like. -
Actuation element 146′ is, of course, associated with and configured to effect movement ofpositioning element 140′. Accordingly, examples ofactuation elements 146′ that may be used as part ofsupport system 130′ include, but are not limited to, hydraulic actuators, pneumatic actuators, screw-drive motors, stepper motors, and other known actuation means for controlling the movement ofpositioning element 140′ in such a way as to causesupport element 132′ to move from one elevation to another in a substantially vertical direction and with a higher degree of dimensional precision. Additionally,positioning element 140′ andactuation element 146′ may desirably elevatesupport element 132′ and, thus, eachfabrication substrate 50 thereon out ofchamber 110′ to facilitate movement of eachfabrication substrate 50 by substrate handling system 600 (FIGS. 1 and 2). Alternatively, the level at which surface 128 ofvolume 124 ofunconsolidated material 126 is located may be lowered belowsupport surface 134′. - Control over the operation of
actuation element 146′ and, thus, over the movement ofpositioning element 140′ and elevation ofsupport element 132′ may be provided bycontroller 700 or anotherprocessing element 105′ (e.g., a processor or smaller collection of logic circuits), which may be dedicated for use withsupport system 130′ orfabrication tank 100′, in communication therewith, either as a part offabrication tank 100′ or, more generally, as a part of stereolithographic apparatus. -
Reservoir 120′ may include a surfacelevel control element 150′ which is configured to maintainsurface 128 ofvolume 124 ofunconsolidated material 126 at a substantially constant elevation. Surfacelevel control element 150′ may include asurface level sensor 152′ and an element for adjustingvolume 124 ofunconsolidated material 126, which element is referred to herein as a “volume adjustment element” 154′. Bothsurface level sensor 152′ andvolume adjustment element 154′ may communicate withcontroller 700 orprocessing element 105′, which monitors the level ofsurface 128, as indicated by signals produced and transmitted bysurface level sensor 152′, and facilitates adjustment or displacement ofvolume 124 by way ofvolume adjustment element 154′ to compensate for changes in the elevation ofsurface 128 and thereby maintainsurface 128 at a substantially constant elevation. - By way of example only,
surface level sensor 152′ may comprise a laser sensor and reflected laser beam, which may be used in connection with one or more charge-coupled device (CCD) cameras or complementary metal-oxide-semiconductor (CMOS) cameras. Triangulation techniques may be used with such devices to determine the distance ofsurface 128 from a fixed point and, thus, the elevation, or level, at which surface 128 is located. - If
volume adjustment element 154′ is configured to changevolume 124 ofunconsolidated material 126 withinreservoir 120′,volume adjustment element 154′ may comprise apump 156′ or series ofpumps 156′ that may removeunconsolidated material 126 fromreservoir 120′ and transport the same to anexternal reservoir 158′, as well as addunconsolidated material 126 from anexternal reservoir 158′ toreservoir 120′, as shown in FIG. 3C. - If
volume adjustment element 154′ is instead configured to displace a portion ofvolume 124 located withinreservoir 120′,volume adjustment element 154′ may, for example, comprise a piston or other displacement member 160′ which may be incrementally introduced into and withdrawn fromreservoir 120′, as shown in FIG. 3D. Of course, movement of such a displacement member 160′ may be effected by anactuator 162′ therefor, such as a hydraulic actuator, a pneumatic actuator, a screw-drive motor, a stepper motor, or the like. Alternatively, vibrations may be transmitted directly tounconsolidated material 126 by, for example, a piston face, diaphragm, or the like. - Alternatively, as shown in FIG. 3E, a
volume adjustment element 154″ may include one or more apertures orother openings 102 in aside wall 101 offabrication tank 100′ that havelower edges 103 that are positioned at an elevation withinfabrication tank 100′ at which surface 128 ofvolume 124 ofunconsolidated material 126 is to be maintained. In addition, surfacelevel control element 154″ includes one ormore receptacles 104 that communicate withopenings 102 to receive overflowingunconsolidated material 126 assupport element 132′ an a substrate or other workpiece thereon, as well as any stereolithographically fabricated objects, are lowered intofabrication tank 100′ and displaceunconsolidated material 126 therein. A pumping system or othermaterial recycling element 105 may communicate with eachreceptacle 104 in such a way as to return overflowedunconsolidated material 126 totank 100′ assupport element 132′ is raised to facilitate stereolithographic fabrication of one or more other objects. - The introduction of
support element 132′ or one ormore fabrication substrates 50 into avolume 124 ofunconsolidated material 126 contained withinreservoir 120′ may result in the introduction of gas or air bubbles intounconsolidated material 126. Accordingly, referring again to FIG. 3,fabrication tank 100′ may optionally include abubble elimination system 165′ which is associated with a boundary orwall 114′ ofreservoir 120′ or withsupport system 130′ so as to facilitate the removal of air or gas bubbles (not shown) fromunconsolidated material 126. By way of example,bubble elimination system 165′ may comprise an ultrasonic transducer of a known type (e.g., a piezoelectric transducer), which causesfabrication tank 100′ orsupport system 130′ thereof to vibrate. Vibrations infabrication tank 100′ orsupport system 130′ are transmitted tounconsolidated material 126 withinreservoir 120′, causing any bubbles therein to dislodge from a structure to which they are adhered and float to surface 128, where they will pop or may be removed, such as by use of negative pressure. - Referring now to FIG. 4, another exemplary embodiment of
fabrication tank 100″ is illustrated.Fabrication tank 100″ includes areservoir 120″ at the base thereof and achamber 110″ which is located overreservoir 120″ and which is continuous therewith. In addition,chamber 110″ offabrication tank 100″ includes amaterial reclamation zone 170″, as well as acleaning zone 180″ located abovematerial reclamation zone 170″. - As shown,
reservoir 120″ may be configured to contain a substantiallyconstant volume 124 of material, includingunconsolidated material 126 and, if stereolithographic processes have been initiated,consolidated material 126′ (FIG. 14). Accordingly,reservoir 120″ may include a surfacelevel control element 150′, such as that described above in reference to FIGS. 3, 3C, and 3D. - A
support system 130″ offabrication tank 100″ includes asupport element 132″ which is positionable at a plurality of distinct, precise elevations withinreservoir 120″ and, optionally, withinchamber 110″. Movement ofsupport element 132″ is effected by apositioning element 140″.Positioning element 140″ is, in turn, associated with anactuation element 146″, which may be actuated to causepositioning element 140″ to move so as to positionsupport element 132″ at a desired elevation withinreservoir 120″ orchamber 110″. Additionally,positioning element 140″ may elevatesupport element 132″ and, thus, anyfabrication substrates 50 thereon out ofchamber 110″ to facilitate handling offabrication substrates 50 by substrate handling system 600 (FIGS. 1 and 2).Actuation element 146″ may communicate withcontroller 700 orprocessing element 105′ in such a way thatcontroller 700 directs the operation ofactuation element 146″. - In addition,
actuation element 146″ may be configured to rotatesupport element 132″ about an axis A thereof and within a plane P in which supportelement 132″ is located. Alternatively,fabrication tank 100″ may include arotation element 148″ that is independent fromactuation element 146″ and which is configured to causesupport element 132″ to rotate. Such rotation may occur under instructions, in the form of signals or carrier waves, fromcontroller 700 orprocessing element 105′. By way of example and not by way of limitation, a stepper motor or a screw-drive motor that has been modified to move a screw, then maintain the screw in a substantially constant location when the screw has reached one or more certain positions (e.g.,material reclamation zone 170″ or cleaningzone 180″), may be used as eitheractuation element 146″ orrotation element 148″. - When
support element 132″ is moved intomaterial reclamation zone 170″ or cleaningzone 180″ ofchamber 110″,actuation element 146″ orrotation element 148″ may causesupport element 132″ to accelerate and rotate at a sufficient speed that centrifugal force causes any excessunconsolidated material 126 and/or cleaningagents 127, such as water, solvents forunconsolidated material 126, detergents, combinations thereof, or the like, to be removed from afabrication substrate 50 carried thereby while remaining substantially within the same plane as that within whichsupport element 132″ is located. -
Material reclamation zone 170″ andcleaning zone 180″ may each be provided with areceptacle 172″, 182″, respectively, that extends substantially around the periphery of an inner boundary orwall 114″ ofreservoir 120″.Receptacles 172″ and 182″ are each positioned at approximately the same elevations withinreservoir 120″ that supportelement 132″ will be located when positioned withinreclamation zone 170″ andcleaning zone 180″ thereof, respectively. Accordingly, as excessunconsolidated material 126 and/or cleaningagents 127 are removed, by spinning, from eachfabrication substrate 50 that is carried bysupport element 132″,receptacle 172″, 182″ will receive substantially all of the excessunconsolidated material 126 or cleaningagents 127 that are removed therefrom. - Since
support element 132″ offabrication tank 100″ is configured to be rotated, or spun, at relatively high speed,support element 132″ may be configured to retain one ormore fabrication substrates 50 during such rotation, or spinning. FIGS. 4A and 4B depict an example of aretention system 190 that may be used on asupport element 132″ to secure afabrication substrate 50 in place thereon, particularly whensupport element 132″ is being accelerated to spin at high rotational speeds. - The depicted
retention system 190 includes a raisedperiphery 191 that forms areceptacle 192 within which afabrication substrate 50 may be substantially laterally contained. Thus, whensupport element 132″ is rotated, or spun, raisedperiphery 191 prevents afabrication substrate 50 that is being carried bysupport element 132″ from being thrown laterally therefrom. One or more alignment features 193, which ensure thatfabrication substrate 50 has been properly positioned and oriented withinreceptacle 192, may also be formed by the inner border of raisedperiphery 191. In addition,retention system 190 may include one ormore access elements 194 which provide access to portions of anouter periphery 55 of afabrication substrate 50 located withinreceptacle 192, thereby facilitating removal offabrication substrate 50 fromreceptacle 192, as well as placement of anotherfabrication substrate 50 therein. - Optionally, raised
periphery 191 may protrude above anupper surface 56 of fabrication substrate 50 a distance which comprises a maximum distance a stereolithographically fabricated object (not shown) may protrude fromupper surface 56.Unconsolidated material 126 that is introduced ontoupper surface 56 offabrication substrate 50 may be laterally contained by raisedperiphery 191. Anupper surface 22U′ of theuppermost layer 22′ ofunconsolidated material 126 within the confines of raisedperiphery 191 may be planarized by translating aplanarizing element 195, such as a meniscus blade (which includes a meniscus at the trailing edge thereof) or air knife, thereacross to removeunconsolidated material 126 and/or smoothupper surface 22U′. An uppermost surface of raisedperiphery 191 defines the level at whichplanarizing element 195 may be translated acrossunconsolidated material 126. - Raised
periphery 191 may be an integral part of asupport surface 134″ ofsupport element 132″, with the majority ofretention system 190 being formed insupport surface 134″. Alternatively,retention system 190 may be formed separately from the manufacture ofsupport element 132″ and secured to supportsurface 134″ thereof. By way of example only, stereolithographic processes may be employed to fabricateretention system 190 onsupport surface 134″, such as by usingstereolithographic apparatus 10. - Additionally,
retention system 190 may include a sealingelement 198, which may be positioned onsupport surface 134″ so as to underlie at least a periphery of afabrication substrate 50 positioned thereover. By way of example only, sealingelement 198 may comprise a somewhat flattened ring which is configured to seal against anouter periphery 55 offabrication substrate 50, as well as regions ofbottom surface 51 offabrication substrate 50 which are located adjacent toouter periphery 55. Such a sealingelement 198 may preventunconsolidated material 126 from contactingbottom surface 51 offabrication substrate 50 andsupport surface 134″ ofsupport element 132″. Exemplary materials from which sealingelement 198 may be fabricated include, without limitation, compressible, resilient materials, such as silicone, polyurethane, ethylene vinyl alcohol (EVA), or the like. - Also, in order to secure
fabrication substrate 50 in place relative to supportsurface 134″,retention system 190 may include one ormore pressure ports 196, which are configured to communicate with a pressure source 197 (e.g., a vacuum or an air compressor). Assupport element 132″ is configured to be rotated, eachpressure port 196 may be fitted with avalve 199, which seals thatpressure port 196 whenpressure source 197 is not in communication therewith. Of course,such valves 199 are not necessary whensupport element 132″ does not rotate, as infabrication tank 100′. As a negative pressure is applied through the one ormore pressure ports 196 to abottom surface 51 offabrication substrate 50, the negative pressure pullsfabrication substrate 50 against sealingelement 198, sealingbottom surface 51 against sealingelement 198. In addition to securingfabrication substrate 50 oversupport surface 134″ and possibly providing a cushion forfabrication substrate 50, as noted previously, sealingelement 198 may prevent unconsolidated material from contactingbottom surface 51 andsupport surface 134″. Operation ofpressure source 197 and, if necessary, communication thereof withpressure ports 196 may be under control ofcontroller 700,processing element 105′, or another processing element that is dedicated for use withretention system 190. - FIGS. 4C and 4D illustrate a variation of
retention system 190′, which is useful withsupport element 132″ offabrication tank 100″.Retention system 190′ includes one ormore ejection elements 196′.Ejection elements 196′ are useful for removingfabrication substrate 50 fromreceptacle 192, as well as for breaking a seal caused by the presence of a negative pressure beneathfabrication substrate 50, which is applied against at least a portion ofbottom surface 51 thereof. Operation ofejection elements 196′ may be controlled by way of acontroller 700 in communication therewith. By way of example only, eachejection element 196′ may comprise a mechanical piston that may be recessed withinsupport surface 134″ to facilitate placement of afabrication substrate 50 thereon or raised by anactuation element 197′ (e.g., a pneumatic, hydraulic, or mechanical actuation element) to protrude fromsupport surface 134″ and eject afabrication substrate 50 fromrecess 192 and raisefabrication substrate 50 to facilitating grasping thereof bysubstrate handling system 600. In this example, it isactuation element 197′ that communicates withcontroller 700,processing element 105′, or another processing element and that operates in accordance with instructive signals, or carrier waves, fromcontroller 700,processing element 105′, or the other processing element. - Alternatively, referring again to FIGS. 4A and 4B, each
ejection element 196′ may comprise apressure port 196, which, as described previously herein, communicates with one or more pressure sources 197. A negative air pressure may be applied throughpressure port 196 to abottom surface 51 of afabrication substrate 50 to secure the same to supportsurface 134″. Conversely, a positive air pressure may be forced throughport 196 againstbottom surface 51 to eject afabrication substrate 50 fromsupport surface 134″. As shown, eachpressure source 197 may communicate withcontroller 700,processing element 105′, or another processing element (FIG. 4), which directs operation ofpressure source 197 by known means. The use ofejection element 196′ to apply positive air pressure tobottom surface 51 offabrication substrate 50 may also be used to break a seal, if any, betweenbottom surface 51 and a feature, such as a sealingelement 198, ofsupport element 132″. - Optionally,
pressure ports 196 may be configured and the output ofpressure source 197 modulated so as to create a circulating airflow beneathbottom surface 51 as positive pressure is forced therethrough, causingfabrication substrate 50 to be lifted off ofsupport surface 134″ in such a way as to hover thereover in accordance with Bernoulli's Law. Such anejection element 196′ is, therefore, useful for facilitating the grasping offabrication substrate 50 by a substrate handling system 600 (FIGS. 1 and 2) ofstereolithography apparatus unconsolidated material 126 fromsupport surface 134″. - Another embodiment of
support system 130′″ that may be used in afabrication tank stereolithographic apparatus Support system 130′″ includes asupport element 132′″ and alocking ring 191′″ that surrounds at least a portion ofouter periphery 55 offabrication substrate 50 to secure the same to supportelement 132′″. Lockingring 191′″ forms areceptacle 192′″ within whichfabrication substrate 50 is laterally contained. Anupper surface 56 offabrication substrate 50, however, remains substantially exposed. - Locking
ring 191′″ includes an upper, laterally inwardly extendinglip 193′″ which is configured to contact anupper surface 56 offabrication substrate 50. As lockingring 191′″ also defines a fixed distance between asupport surface 134′″ andlip 193′″, which distance may not be the same as the thickness of afabrication substrate 50 to be positioned therebetween, one ormore spacers 194′″ may be fabricated (e.g., stereolithographically) or positioned onsupport surface 134′″ so thatsupport system 130′″ may be tailored to accommodatethinner fabrication substrates 50.Spacers 194′″ are also useful for preventingbottom surface 51 offabrication substrate 50 from adhering tosupport surface 134′″ ofsupport element 132′″.Support elements 132′″ of this type, including stereolithographically fabricatedsupport elements 132′″, may be reused. - A thickness of
lip 193′″ may define a maximum distance a stereolithographically fabricated object (not shown) may protrude fromupper surface 56 offabrication substrate 50. The thickness oflip 193′″ may be increased by positioning or forming (e.g., stereolithographically) anextension ring 202′″ thereon.Unconsolidated material 126 that is introduced ontoupper surface 56 offabrication substrate 50 may be laterally contained bylip 193′″. By way of example only,unconsolidated material 126 may be introduced within the confines oflip 193′″ and any extension rings 202′″ thereon by loweringsupport system 130′″ beneath surface 128 (FIG. 4) ofvolume 124 ofunconsolidated material 126 so as to permitunconsolidated material 126 to flow therein, then raisingsupport system 130′″ so that an upper edge oflip 193′″ or anextension ring 202′″ thereon is substantially coplanar withsurface 128. - An
upper surface 22U′ of theuppermost layer 22′ ofunconsolidated material 126 within the confines oflip 193′″ and any extension rings 202′″ thereon may be planarized by translating aplanarizing element 195, such as a meniscus blade or air knife, thereacross (FIG. 4B). An uppermost surface oflip 193′″ or anextension ring 202′″ thereon defines the level at whichplanarizing element 195 may be translated acrossunconsolidated material 126. - Optionally, with returned reference to FIG. 4,
fabrication tank 100″ may include abubble elimination system 165′, such as that described in reference to FIG. 3. Alternatively,stereolithographic fabrication tanks 100, such as those that havechambers 110 with relatively small volumes (e.g., which are sufficient to contain only a single semiconductor substrate 52), may include bubble elimination systems that create a negative pressure, or vacuum, within the chambers thereof. Such a bubble elimination system may, for example, include one or more sealing elements, which substantially seal stereolithographic apparatus 10 (FIG. 1)chamber 110, as well as a negative pressure source that communicates at least withchamber 110 so as to facilitate the creation of a negative pressure therein. - Turning now to FIG. 5, still another embodiment of
fabrication tank 100′″ that may be used in astereolithographic apparatus Fabrication tank 100′″ includes substantially all of the same elements as the embodiment offabrication tank 100″ described in reference to FIG. 4, except forreservoir 120″. Instead of an integral reservoir, such asreservoir 120″,fabrication tank 100′″ includes adispenser 120′″ for applyingunconsolidated material 126, which is drawn from anexternal reservoir 159′″, to afabrication substrate 50. By way of example only,dispenser 120′″ may comprise a laminar flow dispenser or a spray nozzle of a known type. A laminar flow dispenser is currently preferred for use asmaterial dispenser 120′″, as laminar flow would result in the presence of fewer air bubbles inunconsolidated material 126 than would be present ifunconsolidated material 126 were sprayed ontofabrication substrate 50 and, thus, eliminate the need for removing such bubbles. Additionally, when dispensed with a laminar flow dispenser,unconsolidated material 126 may be applied toupper surface 56 offabrication substrate 50 without covering any structures that protrude therefrom (e.g., solder balls that protrude from a semiconductor device 54), thereby eliminating the need to subsequently remove consolidated material orunconsolidated material 126 from such structures.Dispenser 120′″ may apply a predetermined quantity, or metered amount, ofunconsolidated material 126 ontofabrication substrate 50 to form asingle layer 22 ormultiple layers unconsolidated material 126 thereon, which are to be sequentially dispensed and, possibly, sequentially consolidated. - Of course, operation of
dispenser 120′″ may be controlled bycontroller 700 or by aprocessing element 105′″ (e.g., a processor smaller group of logic circuits) that is associated withfabrication tank 100′″. - Various exemplary embodiments of material consolidation systems200 (FIGS. 1 and 2) that may be used in a
stereolithographic apparatus 10 according to the present invention are shown in FIGS. 6 and 7. - With reference to FIGS. 1 and 6, a
stereolithographic apparatus 10 that incorporates teachings of the present invention may include amaterial consolidation system 200′ which is configured to direct a focused beam of consolidating energy, such as alaser beam 220′, into achamber 110 of afabrication tank 100 and onto selected locations of asurface 128 of avolume 124 ofunconsolidated material 126 which is exposed tochamber 110. - When a
laser beam 220′ is employed as the consolidating energy,material consolidation system 200′ includes alaser 210′ of a known type that generateslaser beam 220′. By way of example only,laser 210′ may include asource 211′ which is configured to generate light in the ultraviolet (UV) range of wavelengths of electromagnetic radiation.Laser 210′ may also include one ormore lenses 216 to focus alaser beam 220′ that has been emitted bysource 211 ′ to a desired resolution. Alocation control element 212′, such as a scan controller (e.g., a galvanometer) of a known type, may be associated withsource 211 ′ oflaser 210′ in such a way as to control the path of alaser beam 220′ emitted fromsource 211 ′ and, thus, to effect movement oflaser beam 220′. The operation oflocation control element 212′ and, thus, the movement of alaser beam 220′, may be controlled bycontroller 700 or a processing element 205′ (e.g., a processor or smaller group of logic circuits) which is dedicated for use withlaser 210′, in accordance with a CAD program and an accompanying CAD file for the object to be fabricated. - It is well known that the resolution of a
laser beam 220′ that is to be moved may be substantially maintained by keeping the path oflaser beam 220′ as constant (in this case, vertical) as possible. This may be done by increasing the path length of thatlaser beam 220′ (e.g., to about twelve (12) feet). Nonetheless, it may not be practical for a stereolithographic apparatus 10 (FIG. 1) that incorporates teachings of the present invention to include alaser 210′ with asource 211′ that is positioned a sufficient distance fromsurface 128 ofvolume 124 ofunconsolidated material 126 that is to be selectively consolidated bylaser beam 220′. Accordingly,laser 210′ may also include asuitable mirror 214′ or series ofmirrors 214′ that results in a nonlinear path forlaser 210′ to provide a desired path length L forlaser beam 220′ in a fixed amount of available space. As depicted, the area ofmirror 214′ may be large enough to substantially cover the entire cone of possible angles at whichlaser beam 220′ may be directed bylocation control element 212′ and, thus, to reflectlaser beam 220′ from every possible direction onto a corresponding location ofsurface 128. - Optionally, or as an alternative to the use of a
location control element 212′, the position and/or orientation of one or more ofmirrors 214′ may be moved, such as by anactuator 215′ therefor (e.g., a motor). The operation ofactuator 215′ and, thus, the movement of amirror 214′ associated therewith, may be controlled bycontroller 700. - The size of the “spot”222′ of a
laser beam 220′ that impinges onsurface 128 ofunconsolidated material 126 to consolidate (e.g., cure) the same may be on the order of about 0.001 inch to about 0.008 inch across. It is currently preferred that, whenlaser beam 220′ is moved across surface 128 (i.e., in the X-Y plane), the resolution oflaser beam 220′ be ±0.0003 inch over at least a 0.5 inch×0.25 inch field from a predetermined center point C onsurface 128, thereby providing a high resolution scan across an area of at least 1.0 inch'0.5 inch. Of course, it is desirable to have substantially this high a resolution across the entirety ofsurface 128 to be scanned bylaser beam 220′, such area being termed the “field of exposure.” - FIG. 7 depicts another exemplary embodiment of
material consolidation system 200″, which is configured to direct unfocused, or blanket, consolidatingenergy 220″ in the form of electromagnetic radiation (e.g., light or a light beam) into achamber 110 of afabrication tank 100 and onto asurface 128 of avolume 124 ofunconsolidated material 126 which is exposed tochamber 110. - A
source 210″ of consolidatingenergy 220″ may remain in a fixed position as consolidatingenergy 220″ is introduced intochamber 110 orsource 210″ may be moved, such as by anactuation system 217″ therefor. By way of example only, such anactuation system 217″ may comprise an X-Y plotter of a known type, which may operate and, thus, movesource 210″ under the direction of signals, or carrier waves, that have been transmitted bycontroller 700 or by a processing element 205″ (e.g., a processor or smaller group of logic circuits) that controls operation ofmachine consolidation system 200″. Operation ofsource 210″ may be under control of controller or processing element 205″. - Of course, when
unconsolidated material 126 is nonselectively consolidated by consolidatingenergy 220″ fromsource 210″, a machine vision system 300 (FIGS. 1 and 2) is not employed at that time. - With returned reference to FIG. 1, a
stereolithographic apparatus 10 according to the present invention that employs a material consolidation system 200 (e.g.,material consolidation system 200′ shown in FIG. 6) which selectively consolidatesmaterial 126 may also include amachine vision system 300. It is currently preferred that the field of vision ofmachine vision system 300 be substantially coextensive with the field of exposure of alaser beam 220′ (FIG. 6) or other consolidatingenergy 220 employed by amaterial consolidation system 200 to be used in conjunction withmachine vision system 300. - Examples of different types of
machine vision systems 300 that may be used in accordance with teachings of the present invention are illustrated in FIGS. 8 and 9. - In FIG. 8, a scanning embodiment of
machine vision system 300′, or one which is configured to move relative to achamber 110 of a fabrication tank 100 (FIGS. 1 and 2) with which it is used, is depicted.Machine vision system 300′ includes acamera 310′ which may be carried and moved over afabrication substrate 50 by ascan element 312′.Scan element 312′positions camera 310′ in close proximity to (e.g., inches from) surface 128 (FIG. 1) ofvolume 124 of unconsolidated material 126 (FIG. 1) so as to enablecamera 310′ to view minute features on a fabrication substrate 50 (e.g., bond pads, fuses, or other circuit elements of a semiconductor device) that is located at or nearsurface 128. Upon viewingfabrication substrate 50,camera 310′ communicates information about the precise locations of such features (e.g., with an accuracy of up to about ±0.1 mil (i.e., 0.0001 inch)) to acomputer 320′ ofmachine vision system 300′. -
Camera 310′ may comprise any one of a number of commercially available cameras, such as CCD cameras or CMOS cameras available from a number of vendors. Of course, the image resolution ofcamera 310′ should be sufficiently high as to enablecamera 310′ to view the desired features offabrication substrate 50 and, thus, to enablecomputer 320′ to precisely determine the positions of such features. In order to provide one or more reference points for the features that are viewed bycamera 310′,camera 310′ may also “view” one or morefiducial marks 112 within a chamber 110 (FIG. 1) of a fabrication tank 100 (FIG. 1) with whichmachine vision system 300′ is used. - Suitable electronic componentry, as required for adapting or converting the signals, or carrier waves, that are output by
camera 310′, may be incorporated in aboard 322′ installed in acomputer 320′. Such electronic componentry may include one ormore processors 324′, other groups of logic circuits, or other processing or control elements that have been dedicated for use in conjunction withcamera 310′. At least oneprocessing element 324′, which may include aprocessor 324′, another, smaller group of logic circuits, or other control element that has been dedicated for use in conjunction withcamera 310′, is programmed, as known in the art, to process signals that represent images that have been “viewed” bycamera 310′ and respond to such signals. - A self-contained machine vision system available from a commercial vendor of such equipment may be employed as
machine vision system 300′. Examples of such machine vision systems and their various features are described, without limitation, in U.S. Pat. Nos. 4,526,646; 4,543,659; 4,736,437; 4,899,921; 5,059,559; 5,113,565; 5,145,099; 5,238,174; 5,463,227; 5,288,698; 5,471,310; 5,506,684; 5,516,023; 5,516,026; and 5,644,245. The disclosure of each of the immediately foregoing patents is hereby incorporated herein in its entirety by this reference. Such systems are available, for example, from Cognex Corporation of Natick, Massachusetts. As an example, and not to limit the scope of the present invention, the apparatus of the Cognex BGA Inspection Package™ or the SMD Placement Guidance Package™ may be adapted for use in a stereolithographic apparatus 10 (FIG. 1) that incorporates teachings of the present invention, although it is currently believed that the MVS-8000™ product family and the Checkpoint® product line, the latter employed in combination with Cognex PatMax™ software, may be especially suitable for use in the present invention. - A response by
computer 320′ may be in the form of instructions regarding the operation of a material consolidation system 200 (FIGS. 1 and 2), such as the selectively consolidatingmaterial consolidation system 200′ shown in FIG. 6. These instructions may be embodied as signals, or carrier waves. By way of example only, such responsive instructions may be communicated tocontroller 700 ofstereolithographic apparatus material consolidation system 200′ shown in FIG. 6) with whichmachine vision system 300′ is used.Controller 700 or control element 205′ may, in turn, causematerial consolidation system 200′ to operate in such a way as to effect the stereolithographic fabrication of one or more objects onfabrication substrate 50 precisely at the intended locations thereof. - Due to the close proximity of
camera 310′ to surface 128 (FIG. 1), the field of vision ofcamera 310′ is relatively small. In order to enablecamera 310′ to view a larger area ofsurface 128 than that which is “covered” by or located within the field ofvision camera 310′, ascan element 312′ of a known type is configured to traversecamera 310′ over at least part of the area ofsurface 128.Scan element 312′ is also useful for movingcamera 310′ out of the path of any selectively consolidating energy being directed towardsurface 128. By way of example only,scan element 312′ may comprise an X-Y plotter or scanner of a known type. Generally, an X-Y plotter or scanner includes anx-axis element 313′ and a y-axis element 315′ that intersect one another. As depicted,camera 310′ is carried by bothx-axis element 313′ and y-axis element 315′ and, thus, is positioned at or near the location wherex-axis element 313′ and y-axis element 315′ intersect one another. -
X-axis element 313′ and y-axis element 315′ are both configured to move relative to and, thus, to positioncamera 310′ at a plurality of locations over afabrication substrate 50. Movement ofx-axis element 313′ is effected by anactuator 314′ (e.g., a stepper motor and actuation system, such as a gear or wheel that movesx-axis element 313′ along a track) that has been operatively coupled thereto, withactuator 314′ being configured to causex-axis element 313′ to move laterally (i.e., perpendicular to the length thereof) along a y-axis. Y-axis element 315′ is operatively coupled to anactuator 316′ therefor, which is configured to cause y-axis element 315′ to move laterally along an x-axis.Actuators 314′ and 316′ may be configured to move theirrespective x-axis element 313′ and y-axis element 315′ in a substantially continuous fashion or in an incremental fashion. Movement ofactuators 314′ and 316′ may be controlled by a processing element such ascomputer 320′ or ascanning controller 326′, such as a processor or smaller group of logic circuits, that is dedicated to operation ofscan element 312′ and which may communicate withcomputer 320′ in such a way as to providecomputer 320′ with information as to the specific location ofcamera 310′ relative to surface 128 (FIG. 1). - FIG. 9 shows an embodiment of
machine vision system 300″ that includes acamera 310″ which is mounted or otherwise secured in a fixed position relative to surface 128 and may be maintained in a fixed position relative to achamber 110 of a fabrication tank 100 (FIGS. 1 and 2) with whichmachine vision system 300″ is to be used. By way of example only,camera 310″ may be positioned in close proximity to amirror 214′ ofmaterial consolidation system 200′ (FIG. 6) or at any other location which will providecamera 310″ with a substantially unobstructed field of vision that covers the areas within whichfabrication substrates 50 may be located. - Like
camera 310′, which is described in reference to FIG. 8,camera 310″ may comprise a CCD camera, a CMOS camera, or any other suitable type of camera. Ascamera 310″ is positioned farther away from afabrication substrate 50 to be viewed thereby, however,camera 310″ may have an effectively larger field of vision thancamera 310′. Of course, suitable optical and/or digital magnification technology may be associated withcamera 310″ to provide the desired level of resolution. Further, althoughcamera 310″ may be locationally stationary, a suitable gimbals structure with rotational actuators may be employed to pointcamera 310″ at a specific location in the field of exposure with little actual rotational movement. Thus,camera 310″ may be used for both broad, or “macro,” vision and viewing and inspection of miniature features. - While
machine vision system 300″ lacks a scan element, the remaining features thereof may be the same as and operate in the same or a similar manner to the corresponding features ofmachine vision system 300′, which is described in reference to FIG. 8. - Exemplary embodiments of cleaning
components 400 that may be used with astereolithographic apparatus 10 that incorporates teachings of the present invention, shown in FIG. 1, are depicted in FIGS. 4, 10, and 11. - The embodiment of
cleaning component 400′ shown in FIG. 4 is configured to be used with afabrication tank 100″ that is configured like the one shown in FIG. 4.Cleaning component 400′ may include an initialmaterial removal component 410′ which is configured to remove excessunconsolidated material 126 from afabrication substrate 50, anapplicator 420′ which is configured to introduce one or more cleaning agents 127 (e.g., water, solvents, detergents, etc.) onto at least an exposed surface offabrication substrate 50, and a secondarymaterial removal component 430′ that removes cleaningagents 127 and any residualunconsolidated material 126 fromfabrication substrate 50. - Initial
material removal component 410′ ofcleaning component 400′ comprisessupport system 130″ offabrication tank 100″, as well asmaterial reclamation zone 170″ ofchamber 110″ andreceptacle 172″ offabrication tank 100″.Support system 130″ and, in particular,actuation element 146″ orrotation element 148″ thereof, is configured to accelerate rotation of afabrication substrate 50 carried thereby to a relatively high speed (e.g., about 50 to about 6,000 rpm) in such a way that anyunconsolidated material 126 thereon will be forced therefrom under centrifugal force along substantially the same plane as that within whichfabrication substrate 50 is located, intoreceptacle 172″, and prevented from falling intoreservoir 120″. - Optionally, a
protective cover 175 may be positioned beneathsupport element 132″ and oversurface 128 ofvolume 124 ofunconsolidated material 126. Of course,protective cover 175 is configured to be placed in the appropriate location in such a way as to avoid contact withpositioning element 140″. Accordingly,protective cover 175 may include two ormore sections positioning element 140″ upon being moved into position. Eachsection protective cover 175 may, for example, be moved into position in a hinged fashion (i.e., about hinges 177), as depicted, or by horizontally sliding eachsection protective cover 175 into position, it may be operably coupled with an actuator 176 (e.g., a motor). Operation ofactuator 176 and, thus, movement ofprotective cover 175 may be directed bycontroller 700 or by aprocessing element 178, such as a processor or smaller group of logic circuits, that is dedicated for use withcleaning component 400′. - As an alternative to forcing excess
unconsolidated material 126 which is removed fromfabrication substrate 50 intoreceptacle 172″ by rotating, or spinning,unconsolidated material 126 may be caused to fall intoreservoir 120″ and, thus, captured directly thereby. - Once excess
unconsolidated material 126 has been substantially removed fromfabrication substrate 50,positioning element 140″ is moved to raisesupport element 132″ frommaterial reclamation zone 170″ to cleaningzone 180″. - By way of example only,
applicator 420′ may comprise a fixed or movable high-pressure spray nozzle or group of nozzles that form aspray head 421′, which is in flow communication with asource 422′ of cleaning agent 127 (e.g., water, solvents forunconsolidated material 126, detergents, etc.).Applicator 420′ is configured to be oriented so as to direct one ormore cleaning agents 127 intochamber 110″ offabrication tank 100″ and onto an exposed surface of afabrication substrate 50 that is carried bysupport system 130″ and located within cleaningzone 180″ ofchamber 110″. -
Applicator 420′ may be located in a fixed position relative tofabrication tank 100″ or carried by amovable element 424′, such as a robotic arm, which is configured to positionapplicator 420′ so as to orient the same towardfabrication substrate 50, as depicted in FIG. 4. -
Controller 700 or one or morededicated processing elements 426′ (e.g., a processor, a smaller group of logic circuits, etc.) that communicate withcontroller 700, may communicate withapplicator 420′ and its associatedmovable element 424′, if any. Accordingly, operation ofapplicator 420′, including, without limitation, the orientation ofspray head 421 ′ and the application of cleaningagent 127 onto a surface offabrication substrate 50, may be performed under the direction of eithercontroller 700 or adedicated processing element 426′. - Like initial
material removal component 410′, secondarymaterial removal component 430′ ofcleaning component 400′ includessupport system 130″ offabrication tank 100″. In addition, secondarymaterial removal component 430′ includes cleaningzone 180″ andreceptacle 182 thereof ofchamber 110″.Support system 130″ and, in particular,actuation element 146″ orrotation element 148″ thereof, is configured to accelerate rotation of afabrication substrate 50 carried thereby to a sufficiently high speed (e.g., about 50 to about 6,000 rpm) so that anycleaning agents 127 orunconsolidated material 126 thereon will be forced therefrom along substantially the same plane as that within whichfabrication substrate 50 is located, intoreceptacle 172″, and prevented from falling intoreservoir 120″. - Optionally, positive air pressure, which may be supplied by use of a so-called “air knife,” such as that depicted and described in reference to FIG. 11, may be positioned over each
fabrication substrate 50 following the cleaning process to dry anyresidual cleaning agents 127 therefrom. - A variation of cleaning
component 400′ does not comprise part of afabrication tank 100″ but, rather, is separate therefrom so as to completely avoid the potential for contamination ofunconsolidated material 126 withinreservoir 120″ with excessunconsolidated material 126 being removed fromfabrication substrate 50 with cleaningagents 127. - Turning now to FIG. 10, another exemplary embodiment of
cleaning component 400″ is depicted.Cleaning component 400″ includes amaterial removal component 410″ and awash element 420″, as well as asupport element 430″ upon which one ormore fabrication substrates 50 are supported whilematerial removal component 410″ and washelement 420″ perform their intended tasks. -
Material removal component 410″, which is positioned external tofabrication tank 100″, may comprise one or more removal heads 412″, through which either a negative pressure (e.g., a vacuum) or a positive pressure (e.g., about 30 psi (which is typically not sufficient to puncture the skin of an operator ofstereolithographic apparatus unconsolidated material 126 fromfabrication substrate 50 and, thus, removeunconsolidated material 126 from fabrication substrate 50) may be applied to afabrication substrate 50. Eachremoval head 412″ may be supported by apositioning element 414″, such as a robotic arm.Positioning element 414″ placesremoval head 412″ in sufficient proximity to one or more surfaces of afabrication substrate 50 so that a negative pressure (e.g., a vacuum) or positive pressure applied tofabrication substrate 50 byremoval head 412″ may respectively draw any excessunconsolidated material 126 onfabrication substrate 50 intoremoval head 412″ or blow any excessunconsolidated material 126 fromfabrication substrate 50. Alternatively,support element 430″ may be transported so as to movefabrication substrate 50 in proximity to one or more removal heads 412″.Material removal component 410″ may be used in combination with a bulk removal process, such as tipping or inverting afabrication substrate 50 to permitunconsolidated material 126 to flow therefrom. - As
fabrication substrate 50 is brought in proximity to washelement 420″ or washelement 420″ is brought into proximity tofabrication substrate 50,support element 430″ may remain secured tofabrication substrate 50. As shown,wash element 420″ may include one or more spray heads 421″ that communicate with asource 422″ of cleaningagent 127 and which may be oriented to direct cleaningagent 127 ontofabrication substrate 50. - Any
cleaning agent 127 that remains onfabrication substrate 50 may be removed therefrom by way of one or more removal heads 412″, which may include at least oneremoval head 412″ that was used to remove excessunconsolidated material 126 fromfabrication substrate 50 or adifferent removal head 412″. - Another embodiment of
cleaning component 400′″ that may be used in astereolithography apparatus Cleaning component 400′″ includes atank 440′″ which is at least partially filled with one ormore cleaning agents 127 and within which one ormore fabrication substrates 50 may be introduced, such as by the illustratedwafer boat 450′″. Additionally,cleaning component 400′″ may include anagitation system 460′″, which facilitates the removal of residual unconsolidated material fromfabrication substrates 50. By way of example only,agitation system 460′″ may include a vertical agitation system, which repeatedly moves asupport 452′″ upon whichwafer boat 450′″ is carried up and down. - As another alternative, a rotary wash system (not shown), such as that available from Semitool of Kalispel, Montana, may be used to remove any residual unconsolidated material from one or more fabrication substrates.
- Again referring to FIGS. 4 and 10, an exemplary embodiment of
material reclamation system 500, shown in FIG. 1, is illustrated. - As depicted in FIG. 4,
material reclamation system 500 includes acollection conduit 510 which includes afirst end 512 that communicates withreceptacle 172″ ofcleaning component 400′ so as to receive excessunconsolidated material 126 which has been collected byreceptacle 172″. When used with the embodiment ofcleaning component 400″ that is shown in FIG. 10,first end 512 ofcollection conduit 510 communicates withmaterial removal component 410″, such as a negative pressure head, so as to collect excessunconsolidated material 126 that has been drawn intomaterial removal component 410″. - The opposite,
second end 514 ofcollection conduit 510 communicates with eitherreservoir 120′, 120″, as shown, or anexternal reservoir 158′ (FIG. 3C) in communication therewith. Accordingly,unconsolidated material 126 may be returned toreservoir 120′, 120″, or 158′ throughcollection conduit 510. - One or
more filters 530, which are configured to permit the passage ofunconsolidated material 126 therethrough while trapping particulate contaminants that are larger than a selected size, may also be positioned along the length ofcollection conduit 510 or at anend - One or more pumps520 (e.g., peristaltic pumps) may communicate with
collection conduit 510, each applying either a positive or negative pressure thereto, to facilitate the transport ofunconsolidated material 126 therethrough, as well as the return ofunconsolidated material 126 toreservoir 120′, 120″, 158′ throughconduit 510. - With returned reference to FIGS. 1, 2, and6, as well as with reference to FIG. 12, machine vision system 300 (e.g., either a movable
machine vision system 300′, such as that shown in FIG. 8, or a stationarymachine vision system 300″, such as that shown in FIG. 9) may be used to calibratestereolithographic apparatus material consolidation system 200′ shown in FIG. 6) thereof. Various types of calibration may be effected, including, but not limited to, calibration of the position (X-Y) at which a selectively consolidating energy, such aslaser beam 220′, impinges uponsurface 128 ofvolume 124 ofunconsolidated material 126, calibration of the magnification ofmachine vision system 300 and required movement of the selectively consolidating energy to effect fabrication of a structure of desired dimensions, and calibration of the “squareness” of a grid of locations at which the selectively consolidating energy impinges uponsurface 128. - The position at which selectively consolidating energy impinges upon
surface 128 may, by way example only, be calibrated by selectively consolidatingunconsolidated material 126 at one or more calibration locations, each of which is referred to herein as a “reference pixel” 750, onsurface 128. Next, eachreference pixel 750 is “viewed” bymachine vision system 300 to locate the same relative to a reference grid (not shown), which may be stored in memory of eithercomputer 320′ (FIG. 8) or controller 700 (FIG. 1). The location at which eachreference pixel 750 actually appears is then compared with theanticipated location 750′ forreference pixel 750.Material consolidation system 200, the reference grid, or a combination of both may then be adjusted, as known in the art, to compensate for any difference betweenanticipated location 750′ and the actual location ofreference pixel 750. - The magnification with which a movable
machine vision system 300′, such as that shown in FIG. 8, views objects that are located within or exposed tochamber 110 may be determined by movingcamera 310′ a fixed distance and determining the number ofreference pixels 750 that are “viewed” (e.g., as changes in contrast sensed bycamera 310′) ascamera 310′ is moved. For example, ifcamera 310′ is moved a linear distance of 10 mils (i.e., 0.010 inch) and twenty (20) pixel widths (e.g., ten (10) pixels, each positioned one pixel width apart from each other) are detected (e.g., as nineteen (19) changes, or transitions, in contrast),camera 310′ is magnifying a viewed image by a value which equates to a 20:1 pixels-per-mil ratio. This process may then be repeated at least once to check the measured magnification ofcamera 310′. Knowledge of the pixel-to-mil ratio is useful for controlling the movement of selectively consolidating energy, such as by controlling operation of alocation control element 212′ (e.g., pulsing of a stepper motor that moves a galvanometer) that moves alaser beam 220′ (FIG. 6). - A calibration plate (not shown) of a known type, which, of course, is configured specifically for the type of apparatus to be calibrated, may be used to determine the magnification with which a fixed
camera 310″ ofmachine vision system 300″, shown in FIG. 9, views objects that are located within or exposed tochamber 110. The calibration plate, which is also referred to as a “prime standard,” includes features of known dimensions and locations. These known dimensions may be compared, as known in the art, with the image viewed bycamera 310″ to determine the degree to which an image of these features is magnified or demagnified bycamera 310″. - The linearity with which selectively consolidating energy impinges upon
surface 128 across the field of exposure ofmaterial consolidation system 200′ may be determined and calibrated by determining the actual locations 760 (FIG. 13), particularly at the corners and edges of a rectangular field of exposure, at which selectively consolidating energy, such aslaser beam 220′, impinges onsurface 128. Theactual locations 760 at which the selectively consolidating energy impinges onsurface 128 may then be compared tolocations 760′ (FIG. 13) that are anticipated if the selectively consolidating energy were impinging onsurface 128 in a linear path. Responsive to this comparison, movement of the selectively consolidating energy may be adjusted, or calibrated, in such a way as to increase the linearity of the path along which the selectively consolidating energy impinges onsurface 128 and, thus, the accuracy with which the selectively consolidating energy impinges onsurface 128, particularly at the corners and edges of the field of exposure. In the example of alaser beam 220′, adjustments in the movement thereof may be effected by adjustments in the manner in whichlocation control element 212′ (FIG. 6), such as a pair of galvanometers, are moved. - With reference to FIG. 13, such linearity calibration may be effected by positioning light-
sensitive elements 770, such as phototransistors, CCD arrays, or CMOS arrays, at selected locations withinchamber 110, such as at the fourcomers 116 thereof and along theedges 118 thereof, midway between twocomers 116. Alternatively, a light-sensitive plate (not shown) of a known type (e.g., a large phototransistor, CCD array, or CMOS array) may be positioned withinchamber 110 at an elevation which is substantially the same as that at which surface 128 (FIG. 6) is to be maintained during stereolithographic fabrication. As another alternative,reference pixels 750 may be formed by use ofmaterial consolidation system 200′ (FIG. 6) and viewed bymachine vision system - In reference again to FIGS. 1 and 2, as well as to FIG. 14, an example of the use of a programmed material consolidation apparatus, such as
stereolithographic apparatus - In order to stereolithographically fabricate one or
more objects 20, corresponding data from the .stl files, which comprise a 3-D CAD simulation or model, resident in memory (e.g., random-access memory (RAM)) associated withcontroller 700 are processed bycontroller 700. The data, which mathematically represents the one or more objects to be fabricated, may be divided into subsets, each subset representing alayer 22, or “slice,” of theobject 20. The division of data may be effected by mathematically sectioning the 3-D CAD model into at least onelayer 22, a single layer or a “stack” ofsuch layers 22 representing theobject 20. Each slice may be from about 0.0001 inch to about 0.0180 inch thick. A thinner slice promotes higher resolution by enabling better reproduction of fine vertical surface features of the object or objects to be fabricated. - Before fabrication of a
first layer 22 a of anobject 20 is commenced, the operational parameters forapparatus laser beam 220′ shown in FIG. 6), if such is used to at least partially consolidateunconsolidated material 126. - In addition,
controller 700 may automatically check and, if necessary, adjust by means known in the art the elevation, or level, ofsurface 128 ofvolume 124 ofunconsolidated material 126 to maintain the same at an appropriate focal length forlaser beam 220′. U.S. Pat. No. 5,174,931, the disclosure of which is hereby incorporated herein in its entirety by this reference, discloses an example of a suitable level control system. Alternatively, the height of amirror 214′ (FIG. 6) that reflectslaser beam 220′ onto an appropriate location ofsurface 128 may be adjusted responsive to a detected elevation ofsurface 128 to cause the focal point oflaser beam 220′ to be located precisely atsurface 128, although this approach is more complex. - A
support system unconsolidated material 126 withinreservoir layer 22 or slice of theobject 20 to be formed so as to form alayer 22′ ofunconsolidated material 126 onfabrication substrate 50. The elevation ofsurface 128 may subsequently be readjusted, as required to accommodate any differences betweenunconsolidated material 126 andconsolidated material 126′. Alternatively, alayer 22′ ofunconsolidated material 126 may be disposed onto an exposedupper surface 56 offabrication substrate 50. - A
machine vision system fabrication substrate 50 and to identify each location thereof over which anobject 20 is to be fabricated. -
Laser 210′ (FIG. 6) may then be activated solaser beam 220′ will scansurface 128 ofvolume 124 ofunconsolidated material 126 so as to at least partially consolidate (e.g., polymerize to an at least semisolid state) the same, thereby defining boundaries of alayer 22 ofobject 20 and filling in solid portions thereof.Support system next layer 22 ofobject 20 to be fabricated thereover, and the selective consolidation process repeated, as often as necessary, layer by layer, until eachobject 20 is completed. Of course, the number oflayers 22 that are required to formobject 20 may depend upon the height ofobject 20 and the desired thickness for eachlayer 22 thereof.Different layers 22 of a stereolithographically fabricatedobject 20 may have different thicknesses. - If desired, an
uppermost layer 22U′ ofunconsolidated material 126 may be planarized, for example, by use of aplanarizing element 195, such as that described in reference to FIG. 4B.Planarizing elements 195 are particularly useful when one ormore layers 22′ ofunconsolidated material 126 are dispensed overfabrication substrate 50 rather than being formed thereover by submersion. - With continued reference to FIG. 14, as well as to FIG. 7,
unconsolidated material 126 oflayer 22′ may be consolidated with less selectivity by exposinglayer 22′ tolaser beam 220′ which has been emitted fromlaser 210′ (not shown). - Although the foregoing description contains many specifics, these should not be construed as limiting the scope of the present invention, but merely as providing illustrations of some of the presently preferred embodiments. Similarly, other embodiments of the invention may be devised which do not depart from the spirit or scope of the present invention. Moreover, features from different embodiments of the invention may be employed in combination. The scope of the invention is, therefore, indicated and limited only by the appended claims and their legal equivalents, rather than by the foregoing description. All additions, deletions, and modifications to the invention, as disclosed herein, which fall within the meaning and scope of the claims are to be embraced thereby.
Claims (20)
1. A stereolithography apparatus, comprising:
a fabrication chamber in which a volume of liquid material is contained; and
a bubble elimination system associated with the fabrication chamber and configured to facilitate the removal of gas bubbles from the volume of liquid material.
2. The stereolithography apparatus of claim 1 , wherein the bubble elimination system causes the liquid material to vibrate.
3. The stereolithography apparatus of claim 2 , wherein the bubble elimination system is associated with a wall of the fabrication chamber.
4. The stereolithography apparatus of claim 2 , wherein the bubble elimination system is associated with a structure located at least partially within the fabrication chamber.
5. The stereolithography apparatus of claim 4 , wherein the structure located at least partially within the fabrication chamber comprises a fabrication support.
6. The stereolithography apparatus of claim 2 , wherein the bubble elimination system comprises an ultrasonic transducer.
7. The stereolithography apparatus of claim 6 , wherein the ultrasonic transducer comprises a piezoelectric transducer.
8. The stereolithography apparatus of claim 1 , further comprising:
a negative pressure source for applying a negative pressure to a surface of the volume of liquid material.
9. The stereolithography apparatus of claim 8 , wherein the negative pressure source is configured to apply negative pressure sufficient for removing bubbles at or near the surface.
10. A method for removing bubbles from a volume liquid material within a fabrication chamber of a stereolithography apparatus, comprising vibrating the volume of liquid material.
11. The method of claim 10 , wherein vibrating the volume of liquid material comprises causing bubbles within the volume of liquid material to dislodge from a surface of the fabrication chamber or from a structure within the fabrication chamber.
12. The method of claim 11 , wherein vibrating the volume of liquid material comprises causing the bubbles to float to a surface of the volume of liquid material.
13. The method of claim 10 , wherein vibrating the volume of liquid material is indirectly effected.
14. The method of claim 13 , wherein vibrating the volume of liquid material comprises vibrating a surface of the fabrication chamber which contacts the volume of liquid material.
15. The method of claim 13 , wherein vibrating the volume of liquid material comprises vibrating a structure located at least partially within the volume of liquid material to vibrate.
16. The method of claim 15 , wherein causing the structure located at least partially within the volume of liquid material to vibrate comprises causing a fabrication support to vibrate.
17. The method of claim 10 , wherein vibrating the volume of liquid material is effected with an ultrasonic transducer.
18. The method of claim 17 , wherein vibrating the volume of liquid material is effected with a piezoelectric transducer.
19. The method of claim 10 , further comprising applying a negative pressure to a surface of the volume of liquid material.
20. The method of claim 19 , wherein applying the negative pressure facilitates removal of bubbles at or near the surface.
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Also Published As
Publication number | Publication date |
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US20040148048A1 (en) | 2004-07-29 |
US20070179655A1 (en) | 2007-08-02 |
ATE396032T1 (en) | 2008-06-15 |
JP2006506249A (en) | 2006-02-23 |
US20040159344A1 (en) | 2004-08-19 |
US20040153193A1 (en) | 2004-08-05 |
US20040167663A1 (en) | 2004-08-26 |
DE60321139D1 (en) | 2008-07-03 |
EP1478504B1 (en) | 2008-05-21 |
US20050049751A1 (en) | 2005-03-03 |
US20070157952A1 (en) | 2007-07-12 |
US20040158343A1 (en) | 2004-08-12 |
US7239933B2 (en) | 2007-07-03 |
KR20050072666A (en) | 2005-07-12 |
US20040159340A1 (en) | 2004-08-19 |
US20060226579A1 (en) | 2006-10-12 |
EP1478504A2 (en) | 2004-11-24 |
US20040186608A1 (en) | 2004-09-23 |
US7239932B2 (en) | 2007-07-03 |
US20070179654A1 (en) | 2007-08-02 |
US20070168074A1 (en) | 2007-07-19 |
US20040164461A1 (en) | 2004-08-26 |
WO2004043680A2 (en) | 2004-05-27 |
US7225044B2 (en) | 2007-05-29 |
WO2004043680A3 (en) | 2004-09-23 |
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