US20040132861A1 - Polyurethane based binder system for the manufacture of foundry cores and molds - Google Patents
Polyurethane based binder system for the manufacture of foundry cores and molds Download PDFInfo
- Publication number
- US20040132861A1 US20040132861A1 US10/661,731 US66173103A US2004132861A1 US 20040132861 A1 US20040132861 A1 US 20040132861A1 US 66173103 A US66173103 A US 66173103A US 2004132861 A1 US2004132861 A1 US 2004132861A1
- Authority
- US
- United States
- Prior art keywords
- resin component
- phenolic resin
- weight
- fatty acid
- phenolic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000011230 binding agent Substances 0.000 title claims abstract description 53
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000004814 polyurethane Substances 0.000 title description 2
- 229920002635 polyurethane Polymers 0.000 title description 2
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 52
- 239000005011 phenolic resin Substances 0.000 claims abstract description 52
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 48
- -1 fatty acid ester Chemical class 0.000 claims abstract description 44
- 235000014113 dietary fatty acids Nutrition 0.000 claims abstract description 39
- 239000000194 fatty acid Substances 0.000 claims abstract description 39
- 229930195729 fatty acid Natural products 0.000 claims abstract description 39
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229920005989 resin Polymers 0.000 claims abstract description 31
- 239000011347 resin Substances 0.000 claims abstract description 31
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 16
- 239000001301 oxygen Substances 0.000 claims abstract description 16
- 239000012948 isocyanate Substances 0.000 claims abstract description 13
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 13
- 229920003987 resole Polymers 0.000 claims abstract description 13
- 239000003960 organic solvent Substances 0.000 claims abstract description 9
- 239000002904 solvent Substances 0.000 claims description 33
- 239000000203 mixture Substances 0.000 claims description 29
- 125000004432 carbon atom Chemical group C* 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 20
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 16
- 150000004665 fatty acids Chemical class 0.000 claims description 15
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 14
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 9
- 238000005266 casting Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 239000003784 tall oil Substances 0.000 claims description 6
- 150000005676 cyclic carbonates Chemical class 0.000 claims description 5
- 150000003997 cyclic ketones Chemical class 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical class OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 3
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 claims description 3
- 239000012970 tertiary amine catalyst Substances 0.000 claims description 2
- 239000003495 polar organic solvent Substances 0.000 claims 4
- 125000003158 alcohol group Chemical group 0.000 claims 2
- 125000004122 cyclic group Chemical group 0.000 claims 2
- 239000005056 polyisocyanate Substances 0.000 description 21
- 229920001228 polyisocyanate Polymers 0.000 description 21
- 238000012360 testing method Methods 0.000 description 19
- 150000002989 phenols Chemical class 0.000 description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 239000000779 smoke Substances 0.000 description 10
- 150000001299 aldehydes Chemical class 0.000 description 8
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 8
- 239000003849 aromatic solvent Substances 0.000 description 8
- 239000004576 sand Substances 0.000 description 8
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- 239000002798 polar solvent Substances 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000004821 distillation Methods 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 235000019198 oils Nutrition 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- VTCDZPUMZAZMSB-UHFFFAOYSA-N 3,4,5-trimethoxyphenol Chemical compound COC1=CC(O)=CC(OC)=C1OC VTCDZPUMZAZMSB-UHFFFAOYSA-N 0.000 description 2
- FDQQNNZKEJIHMS-UHFFFAOYSA-N 3,4,5-trimethylphenol Chemical compound CC1=CC(O)=CC(C)=C1C FDQQNNZKEJIHMS-UHFFFAOYSA-N 0.000 description 2
- XQDNFAMOIPNVES-UHFFFAOYSA-N 3,5-Dimethoxyphenol Chemical compound COC1=CC(O)=CC(OC)=C1 XQDNFAMOIPNVES-UHFFFAOYSA-N 0.000 description 2
- LPCJHUPMQKSPDC-UHFFFAOYSA-N 3,5-diethylphenol Chemical compound CCC1=CC(O)=CC(CC)=C1 LPCJHUPMQKSPDC-UHFFFAOYSA-N 0.000 description 2
- HMNKTRSOROOSPP-UHFFFAOYSA-N 3-Ethylphenol Chemical compound CCC1=CC=CC(O)=C1 HMNKTRSOROOSPP-UHFFFAOYSA-N 0.000 description 2
- MBGGFXOXUIDRJD-UHFFFAOYSA-N 4-Butoxyphenol Chemical compound CCCCOC1=CC=C(O)C=C1 MBGGFXOXUIDRJD-UHFFFAOYSA-N 0.000 description 2
- ZSBDGXGICLIJGD-UHFFFAOYSA-N 4-phenoxyphenol Chemical compound C1=CC(O)=CC=C1OC1=CC=CC=C1 ZSBDGXGICLIJGD-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 235000019387 fatty acid methyl ester Nutrition 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 229920002866 paraformaldehyde Polymers 0.000 description 2
- 238000005191 phase separation Methods 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 230000008092 positive effect Effects 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- WGYZMNBUZFHYRX-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-ol Chemical compound COCC(C)OCC(C)O WGYZMNBUZFHYRX-UHFFFAOYSA-N 0.000 description 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- JTXMVXSTHSMVQF-UHFFFAOYSA-N 2-acetyloxyethyl acetate Chemical compound CC(=O)OCCOC(C)=O JTXMVXSTHSMVQF-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- MVRPPTGLVPEMPI-UHFFFAOYSA-N 2-cyclohexylphenol Chemical compound OC1=CC=CC=C1C1CCCCC1 MVRPPTGLVPEMPI-UHFFFAOYSA-N 0.000 description 1
- HRUHVKFKXJGKBQ-UHFFFAOYSA-N 3,5-dibutylphenol Chemical compound CCCCC1=CC(O)=CC(CCCC)=C1 HRUHVKFKXJGKBQ-UHFFFAOYSA-N 0.000 description 1
- PEZSSBYAUDZEMO-UHFFFAOYSA-N 3,5-dicyclohexylphenol Chemical compound C=1C(O)=CC(C2CCCCC2)=CC=1C1CCCCC1 PEZSSBYAUDZEMO-UHFFFAOYSA-N 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- LKVFCSWBKOVHAH-UHFFFAOYSA-N 4-Ethoxyphenol Chemical compound CCOC1=CC=C(O)C=C1 LKVFCSWBKOVHAH-UHFFFAOYSA-N 0.000 description 1
- CHQPRDVSUIJJNP-NSCUHMNNSA-N 4-[(e)-but-2-enyl]phenol Chemical compound C\C=C\CC1=CC=C(O)C=C1 CHQPRDVSUIJJNP-NSCUHMNNSA-N 0.000 description 1
- ILASIIGKRFKNQC-UHFFFAOYSA-N 4-methoxy-3-methylphenol Chemical compound COC1=CC=C(O)C=C1C ILASIIGKRFKNQC-UHFFFAOYSA-N 0.000 description 1
- CYYZDBDROVLTJU-UHFFFAOYSA-N 4-n-Butylphenol Chemical compound CCCCC1=CC=C(O)C=C1 CYYZDBDROVLTJU-UHFFFAOYSA-N 0.000 description 1
- ZNPSUQQXTRRSBM-UHFFFAOYSA-N 4-n-Pentylphenol Chemical compound CCCCCC1=CC=C(O)C=C1 ZNPSUQQXTRRSBM-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N 4-nonylphenol Chemical compound CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- NTDQQZYCCIDJRK-UHFFFAOYSA-N 4-octylphenol Chemical compound CCCCCCCCC1=CC=C(O)C=C1 NTDQQZYCCIDJRK-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 240000006240 Linum usitatissimum Species 0.000 description 1
- 235000004431 Linum usitatissimum Nutrition 0.000 description 1
- QORUGOXNWQUALA-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 QORUGOXNWQUALA-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229920000538 Poly[(phenyl isocyanate)-co-formaldehyde] Polymers 0.000 description 1
- 235000019484 Rapeseed oil Nutrition 0.000 description 1
- 235000019486 Sunflower oil Nutrition 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000004996 alkyl benzenes Chemical class 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- YXVFYQXJAXKLAK-UHFFFAOYSA-N biphenyl-4-ol Chemical compound C1=CC(O)=CC=C1C1=CC=CC=C1 YXVFYQXJAXKLAK-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003240 coconut oil Substances 0.000 description 1
- 235000019864 coconut oil Nutrition 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- UYAAVKFHBMJOJZ-UHFFFAOYSA-N diimidazo[1,3-b:1',3'-e]pyrazine-5,10-dione Chemical compound O=C1C2=CN=CN2C(=O)C2=CN=CN12 UYAAVKFHBMJOJZ-UHFFFAOYSA-N 0.000 description 1
- QYMFNZIUDRQRSA-UHFFFAOYSA-N dimethyl butanedioate;dimethyl hexanedioate;dimethyl pentanedioate Chemical compound COC(=O)CCC(=O)OC.COC(=O)CCCC(=O)OC.COC(=O)CCCCC(=O)OC QYMFNZIUDRQRSA-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002191 fatty alcohols Chemical class 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 125000002485 formyl group Chemical group [H]C(*)=O 0.000 description 1
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- IVSZLXZYQVIEFR-UHFFFAOYSA-N m-xylene Chemical compound CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 235000012054 meals Nutrition 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- OJURWUUOVGOHJZ-UHFFFAOYSA-N methyl 2-[(2-acetyloxyphenyl)methyl-[2-[(2-acetyloxyphenyl)methyl-(2-methoxy-2-oxoethyl)amino]ethyl]amino]acetate Chemical compound C=1C=CC=C(OC(C)=O)C=1CN(CC(=O)OC)CCN(CC(=O)OC)CC1=CC=CC=C1OC(C)=O OJURWUUOVGOHJZ-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- DAZXVJBJRMWXJP-UHFFFAOYSA-N n,n-dimethylethylamine Chemical compound CCN(C)C DAZXVJBJRMWXJP-UHFFFAOYSA-N 0.000 description 1
- 150000002790 naphthalenes Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 150000002889 oleic acids Chemical class 0.000 description 1
- 229910052609 olivine Inorganic materials 0.000 description 1
- 239000010450 olivine Substances 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 150000003138 primary alcohols Chemical class 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 229940116423 propylene glycol diacetate Drugs 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000003333 secondary alcohols Chemical class 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002600 sunflower oil Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- YZYKBQUWMPUVEN-UHFFFAOYSA-N zafuleptine Chemical compound OC(=O)CCCCCC(C(C)C)NCC1=CC=C(F)C=C1 YZYKBQUWMPUVEN-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C1/00—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds
- B22C1/16—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents
- B22C1/20—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents
- B22C1/22—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents of resins or rosins
- B22C1/2233—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by the use of binding agents; Mixtures of binding agents of organic agents of resins or rosins obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- B22C1/2273—Polyurethanes; Polyisocyanates
Definitions
- This invention relates to a binder system comprising a phenolic resin component and an isocyanate component, wherein the phenolic resin component comprises (a) an alkoxy-modified phenolic resole resin and (b) an oxygen-rich polar, organic solvent, and a process for preparing molds and cores with the binder system.
- a well-known and commercially successful method for preparing foundry cores and molds is the “Cold-Box-Process” or the “Ashland-Process”.
- a two-component polyurethane binder system is used for the bonding of sand.
- the first component consists of a solution of a polyol, which contains at least two OH groups per molecule.
- the second component is a solution of an isocyanate having at least two NCO groups per molecule.
- the curing of the binder system takes place in the presence of a basic catalyst. Liquid bases can be added to the binder system before the molding stage, in order to bring the two components to reaction (U.S. Pat. No. 3,676,392).
- Another possibility, according to U.S. Pat. No. 3,409,579, is to pass gaseous tertiary amines through a shaped mixture of an aggregate and the binder.
- phenolic resins are used as polyols, which are prepared through condensation of phenol with aldehydes, preferably formaldehyde, in the liquid phase, at temperatures of up to around 130° C., in the presence of divalent metal catalysts.
- aldehydes preferably formaldehyde
- divalent metal catalysts preferably aluminum silicates
- substituted phenols especially o-cresol and p-nonyl phenol
- solvents for the phenolic components mixtures of high-boiling point polar solvents (for example, esters and ketones) and high boiling point aromatic hydrocarbons are typically used.
- the polyisocyanates are preferably dissolved in high boiling point aromatic hydrocarbons.
- European Patent application EP-A-0 177 599 formulations are described, which eliminate or reduce the amount of aromatic solvents, as a result of the use of fatty acid methyl esters.
- the fatty acid methyl esters are used either as stand-alone solvents or with the addition of polarity-raising solvents (phenolic-components), or, as the case may be, aromatic solvents (isocyanate components). Cores manufactured with this binder system are particularly easy to remove from the mold tooling.
- binder systems formulated according to EP-A-0 771 599 display a serious disadvantage. They produce smoke during the casting process, so much that in many foundries, they are not practical to use.
- This invention relates to a binder system comprising a phenolic resin component and an isocyanate component, wherein the phenolic resin component comprises (a) an alkoxy-modified phenolic resole resin and (b) an oxygen-rich polar, organic solvent.
- the invention also relates to foundry mixes prepared with an aggregate and the binder, a process for making cores and molds, and a process for casting metals.
- the binder system has a little or no odor and the exhibits a low incidence of smoke during casting.
- the cores produced with the binder exhibit good flexural strength, particularly good immediate strength, and are easily released from the molding equipment.
- the alkoxy-modified phenolic resin makes it possible to reduce the quantities of solvents needed, both in the phenolic resin component and in the isocyanate component. Furthermore, the use of aromatic hydrocarbons in one or both of the binder components can be dispensed with. Through the combination of the alkoxy-modified phenolic resin with oxygen-rich, polar, organic solvents, improved immediate strengths are achieved with reduced build up of smoke. The addition of fatty acid ester has a positive effect on the separation effect and on moisture resistance.
- Phenolic resins are manufactured by condensation of phenols and aldehydes (Ullmann's Encyclopedia of Industrial Chemistry, Bd. A19, page 371 ff, 5th, edition, VCH Publishing House, Weinheim).
- substituted phenols and mixtures thereof can also be used. All conventionally used substituted phenols are suitable.
- the phenolic binders are not substituted, either in both ortho-positions or in one ortho- and in the para-position, in order to enable the polymerization. The remaining ring sites can be substituted. There is no particular limitation on the choice of substituent, as long as the substituent does not negatively influence the polymerization of the phenol and the aldehyde.
- substituted phenols are alkyl-substituted phenols, aryl-substituted phenols, cycloalkyl-substituted phenols, alkenyl-substituted phenols, alkoxy-substituted phenols, aryloxy-substituted phenols and halogen-substituted phenols.
- substituents have 1 to 26, and preferably 1 to 12, carbon atoms.
- suitable phenols in addition to the especially preferred unsubstituted phenols, are o-cresol, m-cresol, p-cresol, 3,5-xylol, 3,4-xylol, 3,4,5-trimethyl phenol, 3-ethylphenol, 3,5-diethylphenol, p-butylphenol, 3,5-dibutylphenol, p-amylphenol, cyclohexylphenol, p-octylphenol, 3,5-dicyclohexylphenol, p-crotylphenol, p-phenylphenol, 3,5-dimethoxyphenol, 3,4,5-trimethoxyphenol, p-ethoxyphenol, p-butoxyphenol, 3-methyl-4-methoxyphenol, and p-phenoxyphenol.
- phenol itself.
- the phenols can likewise be described with the general formula:
- A, B and C can be hydrogen, alkyl radicals, alkoxy radicals or halogens.
- aldehydes which are traditionally used for the manufacture of phenolic resins, can be used within the scope of the invention. Examples of this are formaldehyde, acetaldehyde, propionaldehyde, furfuraldehyde, and benzaldehyde.
- the aldehydes commonly used should have the general formula R′CHO, where R′ is hydrogen or a hydrocarbon radical with 1-8 carbon atoms. Particularly preferred is formaldehyde, either in its diluted aqueous form or as paraformaldehyde.
- a molar ratio aldehyde to phenol of at least 1.0 should be used.
- a molar ratio of aldehyde to phenol is preferred of at least 1:1.0, with at least 1:0.58 being the most preferable.
- primary and secondary aliphatic alcohols are used having an OH-group containing from 1 to 10 carbon atoms.
- Suitable primary or secondary alcohols include, for example, methanol, ethanol, n-propanol, isopropanol, n-butanol, and hexanol.
- Alcohols with 1 to 8 carbon atoms are preferred, in particular, methanol and butanol.
- alkoxy-modified phenolic resins are described in EP-B-0 177 871. They can be manufactured using either a one-step or a two-step process. With the one-step-process, the phenolic components, the aldehyde and the alcohol are brought to a reaction in the presence of suitable catalysts. With the two-step-process, an unmodified resin is first manufactured, which is subsequently treated with alcohol.
- the ratio of alcohol to phenol influences the properties of the resin as well as the speed of the reaction.
- the molar ratio of alcohol to phenol amounts to less than 0.25.
- a molar ratio of from 0.18-0.25 is most preferred. If the molar ratio of alcohol to phenol amounts to more than 0.25, the moisture resistance decreases.
- Suitable catalysts are divalent salts of Mn, Zn, Cd, Mg, Co, Ni, Fe, Pb, Ca and Ba. Zinc acetate is preferred.
- Alkoxylation leads to resins with a low viscosity.
- the resins predominantly exhibit ortho-ortho benzyl ether bridges and furthermore, in ortho- and para-position to the phenolic OH-groups, they exhibit alkoxymethylene groups with the general formula —(CH 2 O) n R.
- R is the alkyl group of the alcohol, and n is a small whole number in the range of 1 to 5.
- All solvents which are conventionally used in binder systems in the field of foundry technology, can be used. It is even possible to use aromatic hydrocarbons in large quantities as essential elements in the solution, except that those solvents are not preferred because of environmental considerations. For that reason, the use of oxygen-rich, polar, organic solvents are preferred as solvents for the phenolic resin components.
- the most suitable are dicarboxylic acid ester, glycol ether ester, glycol diester, glycol diether, cyclic ketone, cyclic ester (lactone) or cyclic carbonate.
- Cyclic ketone and cyclic carbonate are preferred.
- Dicarboxylic acid ester exhibits the formula R 1 OOC—R 2 —COOR 1 , where R 1 , represents an independent alkyl group with 1-12, and preferably 1-6 carbon atoms, and R 2 is an alkylene group with 1-4 carbon atoms. Examples are dimethyl ester from carboxylic acids with 4 to 6 carbon atoms, which can, for example, be obtained under the name dibasic ester from DuPont.
- Glycol ether esters are binders with the formula R 3 —O—R 4 —OOCR 5 , where R 3 represents an alkyl group with 1-4 carbon atoms, R 4 is an alkylene group with 2-4 carbon atoms, and R 5 is an alkyl group with 1-3 carbon atoms (for example butyl glycolacetate), with glycol etheracetate being preferred.
- Glycol diesters exhibit the general formula R 5 COO—R 4 —OOCR 5 where R 4 and R 5 are as defined above and the remaining R 5 , are selected, independent of each other (for example, propyleneglycol diacetate), with glycol diacetate being preferred.
- Glycol diether is characterized by the formula R 3 —O—R 4 —O—R 3 , where R 3 and R 4 are as defined above and the remaining R 3 are selected independent of each other (for example, dipropyleneglycol dimethyl ether).
- Cyclic ketone, cyclic ester and cyclic carbonate with 4-5 carbon atoms are likewise suitable (for example, propylene carbonate).
- the alkyl- and alkylene groups can be branched or unbranched.
- organic polar solvents can preferably be used either as stand-alone solvents for the phenolic resin or in combination with fatty acid esters, where the content of oxygen-rich solvents in a solvent mixture should predominate.
- the content of oxygen-rich solvents is preferably at least 50% by weight, more preferably at least 55% by weight of the total solvents.
- the viscosity with reduced quantities of solvent lies well outside the range, which is favorable for technical applications of up to around 400 mPas. In some parts, the solubility is also so bad that at room temperature phase separation can be observed. At the same time the immediate strength of the cores manufactured with this binder system is very low. Suitable binder systems exhibit an immediate strength of at least 150 N/cm 2 when 0.8 parts by weight each of the phenolic resin and isocyanate component are used for 100 parts by weight of an aggregate, like, for example, Quarzsand H32 (s. EP-A-0 771 599 or DE-A-4 327 292).
- fatty acid ester to the solvent of the phenolic component leads to especially good release properties.
- Fatty acids are suitable, such as, for example, those with 8 to 22 carbons, which are esterified with an aliphatic alcohol.
- fatty acids with a natural origin are used, like, for example, those from tall oil, rapeseed oil, sunflower oil, germ oil, and coconut oil.
- single fatty acids like palmitic fatty acid or myristic fatty acid can, of course, be used.
- Aliphatic mono alcohols with 1 to 12 carbons are particularly suitable for the esterification of fatty acids. Alcohols with 1 to 10 carbon atoms are preferred, with alcohols with 4 to 10 carton atoms being especially preferred. Based on the low polarity of fatty acid esters, whose alcohol components exhibit 4 to 10 carbon atoms, it is possible to reduce the quantity of fatty acid esters, and to reduce the buildup of smoke. A line of fatty acid esters is commercially obtainable.
- fatty acid esters whose alcohol components contain from 4 to 10 carbon atoms, are especially advantageous, since they also give binder systems excellent release properties, when their content in the solvent component of the phenolic component amounts to less than 50% by weight based upon the total amount of solvents in the phenolic resin component.
- fatty acid esters with longer alcohol components are the butyl esters of oleic acids and tall oil fatty acid, as well as the mixed octyl-decylesters of tall oil fatty acids.
- invention based binder systems with at least 50% by weight of the above named oxygen-rich, polar, organic solvents as components in the solvents of the phenolic components leads, moreover, to a doubtlessly lower development of smoke, in comparison with conventional systems with a high proportion of fatty acid esters in the solvent.
- the two components of the binder system include an aliphatic, cycloaliphatic or aromatic polyisocyanate, preferably with 2 to 5 isocyanate groups. Based on the desired properties, each can also include mixtures of organic isocyanates. Suitable polyisocyanates include aliphatic polyisocyanates, like, for example, hexamethylenediisocyanate, alicyclic polyisocyanates like, for example, 4,4′-dicyclohexylmethanediisocyanate, and dimethyl derivates thereof.
- aromatic polyisocyanates examples include toluol-2,4-diisocyanate, toluol-2,6-diisocyanate, 1,5-napththalenediisocyanate, triphenylmethanetriisocyanate, xylylenediisocyanate and its methyl derivatives, polymethylenepolyphenyl isocyanate and chlorophenylene-2,4-diisocyanate.
- Preferred polyisocyanates are aromatic polyisocyanates, in particular, polymethylenepolyphenyl polyisocyanates such as diphenylmethane diisocyanate.
- polyisocyanates In general 10-500% by weight of the polyisocyanates compared to the weight of the phenolic resins are used. 20-300% by weight of the polyisocyanates is preferred. Liquid polyisocyanates can be used in undiluted form, whereas solid or viscous polyisocyanates can be dissolved in organic solvents. The solvent can consist of up to 80% by weight of the isocyanate components. As solvents for the polyisocyanate, either the above-named fatty acid esters or a mixture of fatty acid esters and up to 50% by weight of aromatic solvents can be used.
- Suitable aromatic solvents are naphthalene, alkyl-substituted naphthalenes, alkyl-substituted benzenes, and mixtures thereof.
- aromatic solvents which consist of mixtures of the above named aromatic solvents and which have a boiling point range of between 140° C. and 230° C.
- no aromatic solvents are used.
- the amount of polyisocyanate used results in the number of the isocyanate group being from 80 to 120% with respect to the number of the free hydroxyl group of the resin.
- the binder systems can include conventional additives, like, for example, silane (U.S. Pat. No. 4,540,724), drying oils (U.S. Pat. No. 4,268,425) or “ Komplex Kunststoffner” (WO 95/03903).
- the binder systems are offered, preferably, as two-component-systems, whereby the solution of the phenolic resin represents one component and the polyisocyanate, also in solution, if appropriate, is the other component. Both components are combined and subsequently mixed with sand or a similar aggregate, in order to produce the molding compound.
- the molding compound contains an effective binding quantity of up to 15% by weight of the invention-based binder system with respect to the weight of the aggregate.
- the mixture can contain other conventional ingredients, like iron oxide, ground flax fiber, xylem, pitch and refractory meal (powder).
- the aggregate In order to manufacture foundry molded pieces from sand, the aggregate should exhibit a sufficiently large particle size. In this way, the founded piece has sufficient porosity, and fugitive gasses can escape during the casting process. In general at least 80% by weight and preferably 90% by weight of the aggregate should have an average particle size of less than or equal to 290 ⁇ m. The average particle size of the aggregate should have between 100 and 300 ⁇ m.
- sand is preferred as the aggregate material to be used, where at least 70% by weight, and preferably more than 80% by weight of the sand is silicon dioxide.
- Zircon, olivine, aluminosilicate sands and chromite sands are likewise suitable as aggregate materials.
- the aggregate material is the main component in founded pieces.
- the proportion of binder in general amounts to up to 15% by weight, and often between 0.5 and 7% by weight, with respect to the weight of the aggregate.
- Especially preferred is 0.6 to 5% by weight of binder compared to the weight of the aggregate.
- the aggregate is primarily added dry, up to 0.1% by weight of moisture can be tolerated, with respect to the weight of the aggregate.
- the founded piece is cured so that it retains its exterior shape after being removed from the mold.
- Conventional liquid or gaseous curing systems can be used for hardening in the invention-based binder system.
- a slightly volatile tertiary amine like, for example, triethylamine or dimethylethylamine, as described in U.S. Pat. No. 3,409,579, can also be passed through the founded piece.
- the invention also relates to a process for preparing a foundry shape by the no-bake process, which comprises (a) forming a foundry mix with the binder and an aggregate, (b) forming a foundry shape by introducing the foundry mix obtained from step (a) into a pattern; (c) contacting the shaped foundry mix with a liquid tertiary amine catalyst; and (d) removing the foundry shape of step (c) from the pattern.
- silane with the general formula therefor—(R′—O) 3 —Si—R— is added to the molding compound before the curing begins.
- R′ is a hydrocarbon radical, preferably an alkyl radical with 1-6 carbon atoms
- R is an alkyl radical, an alkoxy-substituted alkyl radical or an alkyl amine-substituted amine radical with alkyl groups, which have 1-6 carbon atoms.
- silanes examples include Dow Corning Z6040 and Union Carbide A-187 ( ⁇ -glycidoxypropyltrimethoxysilane), Union Carbide A-1100 ( ⁇ -aminopropyl triethoxysilane), Union Carbide A-1120 (N- ⁇ -(aminoethyl)- ⁇ -amino-propyltrimethoxysilane) and Union Carbide A1160 (ureidosilane).
- additives can be used, including wetting agents and sand mixture extending additives (English Benchlife-additives), such as those in U.S. Pat. No. 4,683,252 or U.S. Pat. No. 4,540,724.
- mold release agents like fatty acids, fatty alcohols and their derivatives can be used, but as a rule, they are not necessary.
- phenolic resin components 1B-1D are outside the favorable range for technical applications, which is up to around 400 mPas. On the other hand, there was no phase separation of the phenolic resin components 2A-2H prepared with the phenolic resin 2 (within the scope of the invention) and the viscosities of these phenolic resin components were acceptable.
- Table III shows the polyisocyanate components used in the binder systems. TABLE III (Composition of polyisocyanate components)
- Example 3A 3B 3C MDI 9 80% 80% 80% Forbiol 102 (H) 19.8% 10% Forbiol 152 (H) 10 19.8% Solvesso 100 (H) 11 9.8% Acid chloride 0.2% 0.2% 0.2%
- Test cores were prepared as follows:
- test cores are manufactured according to DIN 52401, which are cured by gassing with triethylamine (10 seconds at 4 bar pressure, followed by 10 seconds purging with air).
- the flexural strength of the test bodies is determined by GF-methods. In this way the flexural strength of the test bodies is tested immediately after they are manufactured (immediate strength) as well as after 1, 2, and 24 hours after manufacturing them. The results are shown in Table IV. Tests 1-3 were conducted with binders using resin components containing comparative phenolic resole resin 1 and are outside the scope of the invention. Tests 4-13 were conducted with binders using resin components containing phenolic resole resin 2 and are within the scope of this invention.
- Both the fatty acid butyl ester and the fatty acid octyl/decyl ester are equally suitable as solvents for the binders within the scope of this invention (Tests 7 and 12).
- the use of aromatic solvents is just as feasible (Tests 7 and 13).
Abstract
A cold-box process for preparing a foundry shape, e.g. mold or core, that uses a binder comprising a phenolic resin component and an isocyanate component, wherein the phenolic resin component comprises (a) an alkoxy-modified phenolic resole resin and (b) an oxygen-rich polar, organic solvent component, which contains a fatty acid ester.
Description
- This application is a continuation application of U.S. application Ser. No. 9/806,864 filed on Jul. 9, 2001. Applicants claim priority to PCT/EP99/08419 filed on Nov. 4, 1999, DE 198 50 833 filed on Nov. 4, 1998, and U.S. application Ser. No. 9/806,864 filed on Jul. 9, 2001.
- This invention relates to a binder system comprising a phenolic resin component and an isocyanate component, wherein the phenolic resin component comprises (a) an alkoxy-modified phenolic resole resin and (b) an oxygen-rich polar, organic solvent, and a process for preparing molds and cores with the binder system.
- A well-known and commercially successful method for preparing foundry cores and molds is the “Cold-Box-Process” or the “Ashland-Process”. According to this method, a two-component polyurethane binder system is used for the bonding of sand. The first component consists of a solution of a polyol, which contains at least two OH groups per molecule. The second component is a solution of an isocyanate having at least two NCO groups per molecule. The curing of the binder system takes place in the presence of a basic catalyst. Liquid bases can be added to the binder system before the molding stage, in order to bring the two components to reaction (U.S. Pat. No. 3,676,392). Another possibility, according to U.S. Pat. No. 3,409,579, is to pass gaseous tertiary amines through a shaped mixture of an aggregate and the binder.
- In both these patents, phenolic resins are used as polyols, which are prepared through condensation of phenol with aldehydes, preferably formaldehyde, in the liquid phase, at temperatures of up to around 130° C., in the presence of divalent metal catalysts. The manufacture of such phenolic resins is described in detail in U.S. Pat. No. 3,485,797. In addition to unsubstituted phenol, substituted phenols, especially o-cresol and p-nonyl phenol, can be used (for example, EP-A-1 83 782).
- As additional reaction components, according to EP-B-0 177 871, aliphatic monoalcohols with one to eight carbon atoms can be used to prepare alkoxylated phenolic resins. According to this patent, the use of alkoxylated phenolic resins in the binder results in binders that have a higher thermal stability.
- As solvents for the phenolic components, mixtures of high-boiling point polar solvents (for example, esters and ketones) and high boiling point aromatic hydrocarbons are typically used. The polyisocyanates, on the other hand, are preferably dissolved in high boiling point aromatic hydrocarbons. In European Patent application EP-A-0 177 599, formulations are described, which eliminate or reduce the amount of aromatic solvents, as a result of the use of fatty acid methyl esters. The fatty acid methyl esters are used either as stand-alone solvents or with the addition of polarity-raising solvents (phenolic-components), or, as the case may be, aromatic solvents (isocyanate components). Cores manufactured with this binder system are particularly easy to remove from the mold tooling.
- In practice, however, binder systems formulated according to EP-A-0 771 599, display a serious disadvantage. They produce smoke during the casting process, so much that in many foundries, they are not practical to use.
- In order to comply with the increasingly higher environmental standards and health and safety requirements, there has for many years been a growing interest in binder systems which contain no, or very little aromatic hydrocarbon solvent, but produce cores with adequate tensile properties.
- This invention relates to a binder system comprising a phenolic resin component and an isocyanate component, wherein the phenolic resin component comprises (a) an alkoxy-modified phenolic resole resin and (b) an oxygen-rich polar, organic solvent. The invention also relates to foundry mixes prepared with an aggregate and the binder, a process for making cores and molds, and a process for casting metals.
- The binder system has a little or no odor and the exhibits a low incidence of smoke during casting. The cores produced with the binder exhibit good flexural strength, particularly good immediate strength, and are easily released from the molding equipment.
- Selecting an alkoxy-modified phenolic resole resin that exhibits low viscosity and favorable polarity is fundamental to the invention. According to the invention, the alkoxy-modified phenolic resin makes it possible to reduce the quantities of solvents needed, both in the phenolic resin component and in the isocyanate component. Furthermore, the use of aromatic hydrocarbons in one or both of the binder components can be dispensed with. Through the combination of the alkoxy-modified phenolic resin with oxygen-rich, polar, organic solvents, improved immediate strengths are achieved with reduced build up of smoke. The addition of fatty acid ester has a positive effect on the separation effect and on moisture resistance.
- Phenolic resins are manufactured by condensation of phenols and aldehydes (Ullmann's Encyclopedia of Industrial Chemistry, Bd. A19, page 371 ff, 5th, edition, VCH Publishing House, Weinheim). In the framework of this invention, substituted phenols and mixtures thereof can also be used. All conventionally used substituted phenols are suitable. The phenolic binders are not substituted, either in both ortho-positions or in one ortho- and in the para-position, in order to enable the polymerization. The remaining ring sites can be substituted. There is no particular limitation on the choice of substituent, as long as the substituent does not negatively influence the polymerization of the phenol and the aldehyde. Examples of substituted phenols are alkyl-substituted phenols, aryl-substituted phenols, cycloalkyl-substituted phenols, alkenyl-substituted phenols, alkoxy-substituted phenols, aryloxy-substituted phenols and halogen-substituted phenols.
- The above named substituents have 1 to 26, and preferably 1 to 12, carbon atoms. Examples of suitable phenols, in addition to the especially preferred unsubstituted phenols, are o-cresol, m-cresol, p-cresol, 3,5-xylol, 3,4-xylol, 3,4,5-trimethyl phenol, 3-ethylphenol, 3,5-diethylphenol, p-butylphenol, 3,5-dibutylphenol, p-amylphenol, cyclohexylphenol, p-octylphenol, 3,5-dicyclohexylphenol, p-crotylphenol, p-phenylphenol, 3,5-dimethoxyphenol, 3,4,5-trimethoxyphenol, p-ethoxyphenol, p-butoxyphenol, 3-methyl-4-methoxyphenol, and p-phenoxyphenol. Especially preferred is phenol itself. The phenols can likewise be described with the general formula:
- where A, B and C can be hydrogen, alkyl radicals, alkoxy radicals or halogens.
- All aldehydes, which are traditionally used for the manufacture of phenolic resins, can be used within the scope of the invention. Examples of this are formaldehyde, acetaldehyde, propionaldehyde, furfuraldehyde, and benzaldehyde. Preferably, the aldehydes commonly used should have the general formula R′CHO, where R′ is hydrogen or a hydrocarbon radical with 1-8 carbon atoms. Particularly preferred is formaldehyde, either in its diluted aqueous form or as paraformaldehyde.
- In order to prepare the phenolic resole resins, a molar ratio aldehyde to phenol of at least 1.0 should be used. A molar ratio of aldehyde to phenol is preferred of at least 1:1.0, with at least 1:0.58 being the most preferable.
- In order to obtain alkoxy-modified phenolic resins, primary and secondary aliphatic alcohols are used having an OH-group containing from 1 to 10 carbon atoms. Suitable primary or secondary alcohols include, for example, methanol, ethanol, n-propanol, isopropanol, n-butanol, and hexanol. Alcohols with 1 to 8 carbon atoms are preferred, in particular, methanol and butanol.
- The manufacture of alkoxy-modified phenolic resins is described in EP-B-0 177 871. They can be manufactured using either a one-step or a two-step process. With the one-step-process, the phenolic components, the aldehyde and the alcohol are brought to a reaction in the presence of suitable catalysts. With the two-step-process, an unmodified resin is first manufactured, which is subsequently treated with alcohol.
- The ratio of alcohol to phenol influences the properties of the resin as well as the speed of the reaction. Preferably, the molar ratio of alcohol to phenol amounts to less than 0.25. A molar ratio of from 0.18-0.25 is most preferred. If the molar ratio of alcohol to phenol amounts to more than 0.25, the moisture resistance decreases.
- Suitable catalysts are divalent salts of Mn, Zn, Cd, Mg, Co, Ni, Fe, Pb, Ca and Ba. Zinc acetate is preferred.
- Alkoxylation leads to resins with a low viscosity. The resins predominantly exhibit ortho-ortho benzyl ether bridges and furthermore, in ortho- and para-position to the phenolic OH-groups, they exhibit alkoxymethylene groups with the general formula —(CH2O)nR. In this case R is the alkyl group of the alcohol, and n is a small whole number in the range of 1 to 5.
- All solvents, which are conventionally used in binder systems in the field of foundry technology, can be used. It is even possible to use aromatic hydrocarbons in large quantities as essential elements in the solution, except that those solvents are not preferred because of environmental considerations. For that reason, the use of oxygen-rich, polar, organic solvents are preferred as solvents for the phenolic resin components. The most suitable are dicarboxylic acid ester, glycol ether ester, glycol diester, glycol diether, cyclic ketone, cyclic ester (lactone) or cyclic carbonate.
- Cyclic ketone and cyclic carbonate are preferred. Dicarboxylic acid ester exhibits the formula R1OOC—R2—COOR1, where R1, represents an independent alkyl group with 1-12, and preferably 1-6 carbon atoms, and R2 is an alkylene group with 1-4 carbon atoms. Examples are dimethyl ester from carboxylic acids with 4 to 6 carbon atoms, which can, for example, be obtained under the name dibasic ester from DuPont. Glycol ether esters are binders with the formula R3—O—R4—OOCR5, where R3 represents an alkyl group with 1-4 carbon atoms, R4 is an alkylene group with 2-4 carbon atoms, and R5 is an alkyl group with 1-3 carbon atoms (for example butyl glycolacetate), with glycol etheracetate being preferred. Glycol diesters exhibit the general formula R5COO—R4—OOCR5 where R4 and R5 are as defined above and the remaining R5, are selected, independent of each other (for example, propyleneglycol diacetate), with glycol diacetate being preferred. Glycol diether is characterized by the formula R3—O—R4—O—R3, where R3 and R4 are as defined above and the remaining R3 are selected independent of each other (for example, dipropyleneglycol dimethyl ether). Cyclic ketone, cyclic ester and cyclic carbonate with 4-5 carbon atoms are likewise suitable (for example, propylene carbonate). The alkyl- and alkylene groups can be branched or unbranched.
- These organic polar solvents can preferably be used either as stand-alone solvents for the phenolic resin or in combination with fatty acid esters, where the content of oxygen-rich solvents in a solvent mixture should predominate. The content of oxygen-rich solvents is preferably at least 50% by weight, more preferably at least 55% by weight of the total solvents.
- Reducing the content of solvents in binder systems can have a positive effect on the development of smoke. Whereas conventional phenolic resins generally contain around 45% by weight and, sometimes, up to 55% by weight of solvents, in order to achieve an acceptable process viscosity (of up to 400 mPas), the amount of solvent in the phenolic-component can be restricted to at most 40% by weight, and preferably even 35% by weight, through the use of the low viscosity phenolic resins described herein, where the dynamic viscosity is determined by the Brookfield Head Spindle Process. If conventional non alkoxy-modified phenolic resins are used, the viscosity with reduced quantities of solvent lies well outside the range, which is favorable for technical applications of up to around 400 mPas. In some parts, the solubility is also so bad that at room temperature phase separation can be observed. At the same time the immediate strength of the cores manufactured with this binder system is very low. Suitable binder systems exhibit an immediate strength of at least 150 N/cm2 when 0.8 parts by weight each of the phenolic resin and isocyanate component are used for 100 parts by weight of an aggregate, like, for example, Quarzsand H32 (s. EP-A-0 771 599 or DE-A-4 327 292).
- The addition of fatty acid ester to the solvent of the phenolic component leads to especially good release properties. Fatty acids are suitable, such as, for example, those with 8 to 22 carbons, which are esterified with an aliphatic alcohol. Usually fatty acids with a natural origin are used, like, for example, those from tall oil, rapeseed oil, sunflower oil, germ oil, and coconut oil. Instead of the natural oils, which are found in most mixtures of various fatty acids, single fatty acids, like palmitic fatty acid or myristic fatty acid can, of course, be used.
- Aliphatic mono alcohols with 1 to 12 carbons are particularly suitable for the esterification of fatty acids. Alcohols with 1 to 10 carbon atoms are preferred, with alcohols with 4 to 10 carton atoms being especially preferred. Based on the low polarity of fatty acid esters, whose alcohol components exhibit 4 to 10 carbon atoms, it is possible to reduce the quantity of fatty acid esters, and to reduce the buildup of smoke. A line of fatty acid esters is commercially obtainable.
- Surprisingly, it has been shown that fatty acid esters, whose alcohol components contain from 4 to 10 carbon atoms, are especially advantageous, since they also give binder systems excellent release properties, when their content in the solvent component of the phenolic component amounts to less than 50% by weight based upon the total amount of solvents in the phenolic resin component. As examples of fatty acid esters with longer alcohol components, are the butyl esters of oleic acids and tall oil fatty acid, as well as the mixed octyl-decylesters of tall oil fatty acids.
- By using the alkoxy-modified phenolic resins described herein, aromatic hydrocarbons can be avoided as solvents for the phenolic component. This is because of the excellent polarity of the binders. Oxygen-rich organic, polar solvents, can now be used as stand-alone solvents. Through the use of the invention-based alkoxy-modified phenolic resins, the quantity of solvents required can be restricted to less than 35% by weight of the phenolic component. This is made possible by the low viscosity of the resins. The use of aromatic hydrocarbons can, moreover, be avoided. The use of invention based binder systems with at least 50% by weight of the above named oxygen-rich, polar, organic solvents as components in the solvents of the phenolic components leads, moreover, to a doubtlessly lower development of smoke, in comparison with conventional systems with a high proportion of fatty acid esters in the solvent.
- The two components of the binder system include an aliphatic, cycloaliphatic or aromatic polyisocyanate, preferably with 2 to 5 isocyanate groups. Based on the desired properties, each can also include mixtures of organic isocyanates. Suitable polyisocyanates include aliphatic polyisocyanates, like, for example, hexamethylenediisocyanate, alicyclic polyisocyanates like, for example, 4,4′-dicyclohexylmethanediisocyanate, and dimethyl derivates thereof. Examples of suitable aromatic polyisocyanates are toluol-2,4-diisocyanate, toluol-2,6-diisocyanate, 1,5-napththalenediisocyanate, triphenylmethanetriisocyanate, xylylenediisocyanate and its methyl derivatives, polymethylenepolyphenyl isocyanate and chlorophenylene-2,4-diisocyanate. Preferred polyisocyanates are aromatic polyisocyanates, in particular, polymethylenepolyphenyl polyisocyanates such as diphenylmethane diisocyanate.
- In general 10-500% by weight of the polyisocyanates compared to the weight of the phenolic resins are used. 20-300% by weight of the polyisocyanates is preferred. Liquid polyisocyanates can be used in undiluted form, whereas solid or viscous polyisocyanates can be dissolved in organic solvents. The solvent can consist of up to 80% by weight of the isocyanate components. As solvents for the polyisocyanate, either the above-named fatty acid esters or a mixture of fatty acid esters and up to 50% by weight of aromatic solvents can be used. Suitable aromatic solvents are naphthalene, alkyl-substituted naphthalenes, alkyl-substituted benzenes, and mixtures thereof. Especially preferred are aromatic solvents, which consist of mixtures of the above named aromatic solvents and which have a boiling point range of between 140° C. and 230° C. However, preferably no aromatic solvents are used. Preferably, the amount of polyisocyanate used results in the number of the isocyanate group being from 80 to 120% with respect to the number of the free hydroxyl group of the resin.
- In addition to the already mentioned components, the binder systems can include conventional additives, like, for example, silane (U.S. Pat. No. 4,540,724), drying oils (U.S. Pat. No. 4,268,425) or “Komplexbildner” (WO 95/03903). The binder systems are offered, preferably, as two-component-systems, whereby the solution of the phenolic resin represents one component and the polyisocyanate, also in solution, if appropriate, is the other component. Both components are combined and subsequently mixed with sand or a similar aggregate, in order to produce the molding compound. The molding compound contains an effective binding quantity of up to 15% by weight of the invention-based binder system with respect to the weight of the aggregate. It is also possible to subsequently mix the components with quantities of sand or aggregates and then to join these two mixtures. Processes for obtaining a uniform mixture of components and aggregates are known to the expert. In addition, if appropriate, the mixture can contain other conventional ingredients, like iron oxide, ground flax fiber, xylem, pitch and refractory meal (powder).
- In order to manufacture foundry molded pieces from sand, the aggregate should exhibit a sufficiently large particle size. In this way, the founded piece has sufficient porosity, and fugitive gasses can escape during the casting process. In general at least 80% by weight and preferably 90% by weight of the aggregate should have an average particle size of less than or equal to 290 μm. The average particle size of the aggregate should have between 100 and 300 μm.
- For standard-founded pieces, sand is preferred as the aggregate material to be used, where at least 70% by weight, and preferably more than 80% by weight of the sand is silicon dioxide. Zircon, olivine, aluminosilicate sands and chromite sands are likewise suitable as aggregate materials.
- The aggregate material is the main component in founded pieces. In founded pieces from sand for standard applications, the proportion of binder in general amounts to up to 15% by weight, and often between 0.5 and 7% by weight, with respect to the weight of the aggregate. Especially preferred is 0.6 to 5% by weight of binder compared to the weight of the aggregate.
- Although the aggregate is primarily added dry, up to 0.1% by weight of moisture can be tolerated, with respect to the weight of the aggregate. The founded piece is cured so that it retains its exterior shape after being removed from the mold. Conventional liquid or gaseous curing systems can be used for hardening in the invention-based binder system. A slightly volatile tertiary amine, like, for example, triethylamine or dimethylethylamine, as described in U.S. Pat. No. 3,409,579, can also be passed through the founded piece.
- The invention also relates to a process for preparing a foundry shape by the no-bake process, which comprises (a) forming a foundry mix with the binder and an aggregate, (b) forming a foundry shape by introducing the foundry mix obtained from step (a) into a pattern; (c) contacting the shaped foundry mix with a liquid tertiary amine catalyst; and (d) removing the foundry shape of step (c) from the pattern.
- It is further possible, to add a liquid amine to the molding compound in order to cure it. After removing the piece from the mold, further hardening takes place in the well-known way, finally resulting in the finished piece.
- In a preferred implementation, silane with the general formula therefor—(R′—O)3—Si—R— is added to the molding compound before the curing begins. Here, R′ is a hydrocarbon radical, preferably an alkyl radical with 1-6 carbon atoms, and R is an alkyl radical, an alkoxy-substituted alkyl radical or an alkyl amine-substituted amine radical with alkyl groups, which have 1-6 carbon atoms. The addition of from 0.1 to 2% by weight with respect to the weight of the binder system and catalysts, reduces the moisture sensitivity of the system. Examples of commercially obtainable silanes are Dow Corning Z6040 and Union Carbide A-187 (γ-glycidoxypropyltrimethoxysilane), Union Carbide A-1100 (γ-aminopropyl triethoxysilane), Union Carbide A-1120 (N-β-(aminoethyl)-γ-amino-propyltrimethoxysilane) and Union Carbide A1160 (ureidosilane).
- If applicable, other additives can be used, including wetting agents and sand mixture extending additives (English Benchlife-additives), such as those in U.S. Pat. No. 4,683,252 or U.S. Pat. No. 4,540,724. In addition, mold release agents like fatty acids, fatty alcohols and their derivatives can be used, but as a rule, they are not necessary.
- The invention is further clarified by the following examples.
- If not otherwise specified, all percentages are by weight.
- 1. Manufacture of Phenolic Resins
- The raw materials in Table I are placed in a reaction vessel fitted with reflux condenser, thermometer and agitator. The temperature is raised uniformly, under agitation, to 105-115° C., and held there until a refractive index of 1.5590 is reached. Next the condenser is switched over to distillation and the temperature is brought up to 124-126° C. over the course of an hour. At this temperature, further distillation should occur until obtaining a refractive index of 1.5940. Next a vacuum is applied, and distillation is continued under reduced pressure, until reaching a refractive index of 1.600. The yields amount to around 83% in Example 1 and around 78% in Example 2.
TABLE I (Amounts of components used to prepare comparison resin and resin within the scope of the invention) Resin 1 2 not within the scope of within the scope of the the invention invention Phenol 2130.7 g 1770.6 g Paraformaldehyde 91% 865.3 g 984.3 g n-butanol — 279.6 g Zinc acetate-dihydrate 1.0 g 1.5 g - 2. Manufacture of Phenolic Resin Solutions
- With the phenolic resin manufactured according to the above instructions, the solutions shown in Table II are manufactured. Trade names are shown with an “H”.
TABLE II (Resin components prepared with comparison resin 1 that is not within the scope of the invention) Resin Component 1A 1B 1C 1D Phenolic resin 1 67.5% 67.5% 67.5% 67.5% DBE (H)1 19.0% 24.5% 27.0% 32% Forbiol 102 (H)2 13.0% 7.5% 5.0% Silane 0.5% 0.5% 0.5% 0.5% Viscosity 2 phases 659 617 561 (mPas) - It is noteworthy that all of these formulations for the phenolic resin component contain less than 40% by weight solvent based upon the weight of the phenolic resin component.
TABLE II (Continued) (Resin components prepared with resin that is within the scope of the invention) Resin Component 2A 2B 2C 2D 2E 2F 2G 2H Phenolic resin 2 67.5% 67.5% 67.5% 67.5% 67.5% 67.5% 67.5% 67.5% DBE (H)3 19.0% 24.5% 27.0% 32.0% BGA4 32.0% EGD5 32.0% DPGME6 32.0% PPC7 32.0% Forbiol 102 (H)8 13.0% 7.5% 5.0% Silane 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% Viscosity (mPas) 289 280 264 241 217 297 271 338 - phenolic resin components 1B-1D are outside the favorable range for technical applications, which is up to around 400 mPas. On the other hand, there was no phase separation of the phenolic resin components 2A-2H prepared with the phenolic resin 2 (within the scope of the invention) and the viscosities of these phenolic resin components were acceptable.
- 3. Manufacture of polyisocyanate solutions Table III shows the polyisocyanate components used in the binder systems.
TABLE III (Composition of polyisocyanate components) Example 3A 3B 3C MDI9 80% 80% 80% Forbiol 102 (H) 19.8% 10% Forbiol 152 (H)10 19.8% Solvesso 100 (H)11 9.8% Acid chloride 0.2% 0.2% 0.2% -
- 4.) Manufacture and testing of the aggregate/binder mixture: Test cores were prepared as follows:
- Into a laboratory mixer, 0.8 parts by weight of the phenolic resin solution from Table II, and 0.8 parts by weight of the polyisocyanate solution from Table III are added to 100 parts by weight of Quarzsand H 32 (Quarzwerke GmbH, Frechen), in the order given, and mixed intensively. With this mixture, test cores are manufactured according to DIN 52401, which are cured by gassing with triethylamine (10 seconds at 4 bar pressure, followed by 10 seconds purging with air).
- The flexural strength of the test bodies is determined by GF-methods. In this way the flexural strength of the test bodies is tested immediately after they are manufactured (immediate strength) as well as after 1, 2, and 24 hours after manufacturing them. The results are shown in Table IV. Tests 1-3 were conducted with binders using resin components containing comparative phenolic resole resin 1 and are outside the scope of the invention. Tests 4-13 were conducted with binders using resin components containing phenolic resole resin 2 and are within the scope of this invention.
TABLE IV Test 1 2 3 4 5 6 7 8 9 10 11 12 13 RC12 1B 1C 1D 2A 2B 2C 2D 2E 2F 2G 2H 2D 2D PIC13 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3A 3B 3C Strength (N/cm2) Immediate 105 120 140 205 235 225 205 225 200 230 180 190 210 1 hr 380 355 390 555 575 565 580 560 555 530 430 580 500 2 hr 400 405 400 555 575 565 580 560 570 590 440 585 530 24 hr 555 540 530 590 630 610 590 570 570 600 550 590 570 -
- The data in Table IV indicate the following:
- Cores made with binders using conventional phenolic resins (Comparative Tests 1-3) have lower initial strengths than those binder systems that use phenolic resin components within the scope of the invention (Tests 4-13). Also, the increase in strength over time is slower.
- The strengths of cores, particularly, the immediate strengths, of all the cores made with binders within the scope of the invention (Tests 4-13), are the same within the precision of the test method. There is no identifiable dependency on the content of fatty acid ester/polar solvents.
- Both the fatty acid butyl ester and the fatty acid octyl/decyl ester are equally suitable as solvents for the binders within the scope of this invention (Tests 7 and 12). The use of aromatic solvents is just as feasible (Tests 7 and 13).
- 5. Observation of smoke development GF-test bars are kept in the oven 1 minute at 650° C. After removing them, the development of smoke is observed against a dark background and assessed with a rating of 10 (very strong)-1 (scarcely perceptible).
- The results are shown in Table V.
TABLE V (Smoke generation tests using cores made from binders within the scope of the invention) Cores from Tests Described in Table IV 4 5 6 7 8 9 10 11 12 RC 2A 2B 2C 2D 2E 2F 2G 2H 2D PIC 3A 3A 3A 3A 3A 3A 3A 3A 3B Value 10 8 8 5 5 5 5 5 5 - The data in Table V indicate that the development of smoke is less if the fatty acid (Forbiol 102) is reduced in favor of oxygen-rich solvents. Casting tests with cores, which correspond to those prepared for Test 4 (containing the fatty acid ester), and those prepared with Test core 7 (no fatty acid) confirm this.
Claims (10)
1. A process for preparing a foundry shape by the cold-box process which comprises:
(a) forming a foundry mix comprising a major amount of aggregate and an effectively binding amount of a binder system comprising:
(1) a phenolic resole resin component, and
(2) an isocyanate component,
wherein the phenolic resin component comprises (a) an alkoxy-modified phenolic resole resin component such that the mole ratio of alcohol to phenol used to prepare said alkoxy-modified phenolic resole resin is less than 0.25:1.0, and (b) at least one oxygen-rich, polar organic solvent component, wherein the solvent portion of the phenolic resin component of the binder system amounts to no more than 40% by weight, based upon the weight of the phenolic resin component, and the amount of oxygen-rich polar organic solvent is at least 50 weight percent based on the total weight of the solvent in the phenolic resin component; and
wherein either the phenolic resin component, isocyanate component, or both of said components contain a fatty acid ester having from 1 to 12 carbon atoms in the alcohol chain of the fatty acid ester;
(b) forming a foundry shape by introducing the foundry mix obtained from step (a) into a pattern;
(c) contacting foundry shape mix with a volatile tertiary amine catalyst; and
(d) removing the foundry shape of step (c) from the pattern.
2. The process of claim 1 wherein the oxygen-rich polar, organic solvent is selected from the group consisting of glycol ether esters, glycol diesters, glycol diethers, cyclic ketones, cyclic esters, cyclic carbonate, and mixtures thereof.
3. The process of claim 2 wherein the fatty acid ester is part of the phenolic resin component and is derived from an alcohol having from 4 to 10 carbon atoms.
4. The process of claim 3 wherein the fatty acid ester is the butyl ester of tall oil fatty acids.
5. The process of claim 4 wherein the amount of said binder in said foundry mix is about 0.6 percent to about 5.0 percent based upon the weight of the aggregate.
6. A process of casting a metal which comprises:
(a) preparing a foundry shape in accordance with claims 1, 2, 3, 4, or 5;
(b) pouring said metal while in the liquid state into and a round said shape;
(c) allowing said metal to cool and solidify; and
(d) then separating the molded article.
7. A binder system comprising:
(a) a phenolic resole resin component, and
(b) an isocyanate component,
wherein the phenolic resin component comprises (a) an alkoxy-modified phenolic resole resin component such that the mole ratio of alcohol to phenol used to prepare said alkoxy-modified phenolic resole resin is less than 0.25:1.0, and (b) at least one oxygen-rich, polar organic solvent component, wherein the solvent portion of the phenolic resin component of the binder system amounts to no more than 40% by weight, based upon the weight of the phenolic resin component, and the amount of oxygen-rich polar organic solvent is at least 50 weight percent based on the total weight of the solvent in the phenolic resin component; and
wherein either the phenolic resin component, isocyanate component, or both of said components contain a fatty acid ester having from 1 to 12 carbon atoms in the alcohol chain of the fatty acid ester.
8. The binder system of claim 7 wherein the oxygen-rich polar, organic solvent is selected from the group consisting of glycol ether esters, glycol diesters, glycol diethers, cyclic ketones, cyclic esters, cyclic carbonate, and mixtures thereof.
9. The binder system of claim 8 wherein the fatty acid ester is part of the phenolic resin component and is derived from an alcohol having from 4 to 10 carbon atoms.
10. The binder system of claim 9 wherein the fatty acid ester is the butyl ester of tall oil fatty acids.
Priority Applications (1)
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US10/661,731 US20040132861A1 (en) | 1998-11-04 | 2003-09-12 | Polyurethane based binder system for the manufacture of foundry cores and molds |
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DE19850833A1 | 1998-11-04 | ||
DE19850833A DE19850833C2 (en) | 1998-11-04 | 1998-11-04 | Binder system for the production of cores and molds based on polyurethane, their use and method for producing a mold part based on polyurethane |
US80686401A | 2001-07-09 | 2001-07-09 | |
US10/661,731 US20040132861A1 (en) | 1998-11-04 | 2003-09-12 | Polyurethane based binder system for the manufacture of foundry cores and molds |
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PCT/EP1999/008419 Continuation WO2000025957A1 (en) | 1998-11-04 | 1999-11-04 | Binder system for producing polyurethane-based cores and melting moulds |
US09806864 Continuation | 2001-07-09 |
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US10/661,731 Abandoned US20040132861A1 (en) | 1998-11-04 | 2003-09-12 | Polyurethane based binder system for the manufacture of foundry cores and molds |
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CN102717024A (en) * | 2012-06-29 | 2012-10-10 | 济南圣泉集团股份有限公司 | Epoxy resin double-component adhesion agent prepared by using cold box process as well as casting mixture and casting formed body |
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DE102008007181A1 (en) * | 2008-02-01 | 2009-08-06 | Ashland-Südchemie-Kernfest GmbH | Use of branched alkanediolcarboxylic diesters in polyurethane-based foundry binders |
US8623959B2 (en) * | 2009-10-06 | 2014-01-07 | Joseph M. Fuqua | Non-veining urethane resins for foundry sand casting |
US8853299B2 (en) | 2009-10-06 | 2014-10-07 | Amcol International Corp. | Lignite-based urethane resins with enhanced suspension properties and foundry sand binder performance |
US8426494B2 (en) * | 2009-10-06 | 2013-04-23 | Amcol International Corp. | Lignite urethane based resins for enhanced foundry sand performance |
US8309620B2 (en) * | 2009-10-06 | 2012-11-13 | Amcol International Corp. | Lignite-based urethane resins with enhanced suspension properties and foundry sand binder performance |
US8436073B2 (en) | 2009-10-06 | 2013-05-07 | Amcol International | Lignite-based foundry resins |
CN104673152B (en) * | 2013-11-26 | 2019-07-23 | 罗门哈斯公司 | The aqueous adhesive composition of aliphatic or alicyclic dicarbaldehyde and resorcinol |
Family Cites Families (10)
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US4657950A (en) * | 1984-10-12 | 1987-04-14 | Acme Resin Corporation | Refractory binders |
US4546124A (en) * | 1984-10-12 | 1985-10-08 | Acme Resin Corporation | Polyurethane binder compositions |
US4848442A (en) * | 1984-10-12 | 1989-07-18 | Acme Resin Corporation | Resin binders for foundry sand cores and molds |
US4852629A (en) * | 1986-08-25 | 1989-08-01 | Ashland Oil, Inc. | Cold-box process for forming foundry shapes which utilizes certain carboxylic acids as bench life extenders |
US5101001A (en) * | 1989-12-21 | 1992-03-31 | Ashland Oil, Inc. | Polyurethane-forming foundry binders and their use |
US5516859A (en) * | 1993-11-23 | 1996-05-14 | Ashland Inc. | Polyurethane-forming no-bake foundry binder systems |
ES2103248T5 (en) * | 1995-11-01 | 2004-07-16 | Huttenes-Albertus Chemische-Werke Gmbh | POLYURETHANE-BASED BINDER FOR THE MANUFACTURE OF COMPOSITIONS OF MOLDS AND FOUNDING MALE. |
WO1998002473A1 (en) * | 1996-07-17 | 1998-01-22 | Ashland Inc. | Benzylic ether phenolic resole resins, their preparation, and uses |
US5908914A (en) * | 1996-07-17 | 1999-06-01 | Ashland Inc. | Benzylic ether phenolic resole resins and their uses |
US5874487A (en) * | 1996-11-07 | 1999-02-23 | Ashland Inc. | Foundary binder systems which contain alcohol modified polyisocyanates |
-
2003
- 2003-06-26 US US10/603,673 patent/US6772820B2/en not_active Expired - Fee Related
- 2003-09-12 US US10/661,731 patent/US20040132861A1/en not_active Abandoned
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CN102717024A (en) * | 2012-06-29 | 2012-10-10 | 济南圣泉集团股份有限公司 | Epoxy resin double-component adhesion agent prepared by using cold box process as well as casting mixture and casting formed body |
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