US20030098253A1 - Spool case for bonding wire, and method of handling spool using same - Google Patents

Spool case for bonding wire, and method of handling spool using same Download PDF

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Publication number
US20030098253A1
US20030098253A1 US10/268,710 US26871002A US2003098253A1 US 20030098253 A1 US20030098253 A1 US 20030098253A1 US 26871002 A US26871002 A US 26871002A US 2003098253 A1 US2003098253 A1 US 2003098253A1
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United States
Prior art keywords
spool
base
case
bonding wire
sidewall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/268,710
Inventor
Chang You
Jung Back
Hun Lim
So Chung
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WC Heraus GmbH and Co KG
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WC Heraus GmbH and Co KG
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Filing date
Publication date
Application filed by WC Heraus GmbH and Co KG filed Critical WC Heraus GmbH and Co KG
Assigned to W.C. HERAEUS GMBH & CO. KG reassignment W.C. HERAEUS GMBH & CO. KG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BACK, JUNG WOOD, CHUNG, SO YOUNG, LIM, HUN, YOU, CHANG MAN
Publication of US20030098253A1 publication Critical patent/US20030098253A1/en
Abandoned legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004Wire welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/02Containers, packaging elements or packages, specially adapted for particular articles or materials for annular articles
    • B65D85/04Containers, packaging elements or packages, specially adapted for particular articles or materials for annular articles for coils of wire, rope or hose
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H49/00Unwinding or paying-out filamentary material; Supporting, storing or transporting packages from which filamentary material is to be withdrawn or paid-out
    • B65H49/38Skips, cages, racks, or containers, adapted solely for the transport or storage of bobbins, cops, or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04Kinds or types
    • B65H75/08Kinds or types of circular or polygonal cross-section
    • B65H75/14Kinds or types of circular or polygonal cross-section with two end flanges
    • B65H75/141Kinds or types of circular or polygonal cross-section with two end flanges covers therefor
    • HELECTRICITY
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00Handled material; Storage means
    • B65H2701/30Handled filamentary material
    • B65H2701/36Wires
    • B65H2701/361Semiconductor bonding wires
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    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124Aluminium (Al) as principal constituent
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    • H01L2224/45163Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/45169Platinum (Pt) as principal constituent
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    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/45599Material
    • H01L2224/456Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45663Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/45669Platinum (Pt) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/786Means for supplying the connector to be connected in the bonding apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
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    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01004Beryllium [Be]
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    • H01L2924/01033Arsenic [As]
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    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19042Component type being an inductor

Definitions

  • the present invention relates to a spool case for storing and carrying a bonding wire of a wire bonding assembly used in manufacturing a semiconductor chip package and a method of handling a spool using the same. More particularly, the invention relates to a bonding wire spool case and a method of handling a spool using the same which can effectively prevent the durability and the holding of the spool from being deteriorated due to the repeated coupling and decoupling operations of the spool with respect to the spool holder, and prevent the bonding wire from being contaminated and damaged due to the carelessness of the worker.
  • a wire bonding assembly is a device for electrically connecting a lead of a lead frame to a bonding pad of a semiconductor chip bearing an electrical characteristic by way of a conductive wire such as a high purity platinum Pt wire or an aluminum wire.
  • the wire bonding assembly is usually provided with a spool, a spool holder, a wire feed guider, a wire clamp, and a capillary.
  • a conductive wire is wound on the spool, and the spool is fitted to the spool holder.
  • the conductive wire is fused by way of the capillary and a torch bar, and welded to the bonding pad of the semiconductor chip and the lead.
  • the spool wound with a conductive metal wire thereon is usually placed within a spool case, and in that state, it is stored and carried while preventing the contamination and damage thereof.
  • Various kinds of spool cases are used for that purpose.
  • Japanese Utility Model Publication Number Sho58-41188 discloses a spool case having a base with a protrusion onto which a cylindrical spool is inserted, and a cover coupled to the base to prevent a foreign material such as dust from being introduced.
  • the cover is provided with a spool case, which has a depressed portion for receiving the spool in correspondence with the protrusion of the base.
  • Japanese Patent Publication Laid-open No. 2000-112599 discloses a bonding wire spool case having an interfacial coupling member externally fitted around the spool flange to hold the spool, and a base capable of being elastically transformed. The worker presses both lateral sides of the base while elastically transforming the base to remove the spool from the spool case.
  • the base is formed with a material capable of being elastically transformed such that the spool can be separated from the spool case by way of the interfacial coupling member.
  • the interfacial coupling member which is connected to the base in a body to substantially hold the spool, is formed with an elastic plastic material. With the repeated uses, the interfacial coupling member becomes worn out or blunt, and this deteriorates reliability in the spool holding operation.
  • the worker picks out the cover from the base, and grips the base to mount the spool to the spool holder of the bonding machine. At this time, the worker may carelessly grip both sides of the base. In this case, the spool holding state of the interfacial coupling member is released so that the spool is separated from the base. Consequently, the bonding wire is contaminated, and damaged.
  • the bonding wire spool case includes a base having a bottom portion and a sidewall protruding from the bottom portion.
  • the base mounts a spool wound with a bonding wire thereon.
  • a cover is coupled to the base at the outer surface of the sidewall of the base to prevent foreign material such as dust from being introduced.
  • the sidewall of the base is partially provided with an opening portion.
  • a slide coupling member is internally formed at the base such that the slide coupling member is fitted to the flange portion of the spool when the spool slides inward through the opening portion.
  • the slide coupling member has a guide rail for spacing the spool from the bottom portion of the base by a predetermined distance, and a coupling protrusion protruded form the inner surface of the sidewall to hold the flange portion of the spool together with the guide rail.
  • the slide coupling member may have two or more coupling protrusions. Preferably, three coupling protrusions are provided at the slide coupling member while being positioned at the portions of the sidewall placed at both sides of the opening portion, and at the portion of the sidewall facing the opening portion.
  • the spool is fitted to the base by way of the guide rail and the coupling protrusions formed at the sidewall of the base. Accordingly, the spool can be handled without directly touching it by hand. The coupling state of the spool is not released unless it is intentionally separated from the base. Furthermore, the spool can be coupled to the base or decoupled from the base without elastically transforming the base. Accordingly, the durability of the spool and the reliability in the spool holding can be prevented from being deteriorated.
  • the coupling protrusions may be formed with various shapes while being protruded from the sidewall. Furthermore, the coupling protrusions may be integrated into one while being spatially extended.
  • the portion of the sidewall facing the opening portion is formed with a curvature identical to the spool flange.
  • the cover has a protrusion inserted into the inner diameter portion of the spool mounted to the base such that the central axis of the spool is maintained to be in the horizontal direction.
  • the bonding wire wound on the spool deals well with its own load, vibration in its movement and other impacts over its entire length so that the unintended winding or releasing of the wire can be effectively prevented.
  • a prominent portion may be formed at one or more sides of the cover to keep the central axis of the spool in the horizontal direction.
  • Both ends of the bonding wire wound on the spool are attached to the flange portion of the spool by way of a tape.
  • a notch is formed at the flange portion to pass the bonding wire.
  • the notch may be formed at the one-sided flange portion, or at the both-sided flange portions.
  • the spool can be coupled to, or decoupled from the spool holder through sliding the base in the direction perpendicular to the spool holder. In this way, the coupling or decoupling of the spool can be made without directly touching the spool by hand.
  • FIG. 1 is an exploded perspective view of a spool case with a cover and a base according to a preferred embodiment of the present invention
  • FIG. 2 is a perspective view of the base shown in FIG. 1 mounting a spool therein;
  • FIG. 3 is a partial sectional view of the spool case shown in FIG. 1 illustrating the storage thereof;
  • FIG. 4 is a perspective view of the spool case shown in FIG. 1 illustrating the usage thereof.
  • FIG. 1 is an exploded perspective view of a spool case with a cover and a base according to a preferred embodiment of the present invention
  • FIG. 2 is a perspective view of the base shown in FIG. 1 mounting a spool therein.
  • the spool 10 As shown in the drawings, the spool 10 , well known in the art, has a cylinder portion (not shown) for winding the bonding wire W thereon, and a pair of flange portions 10 ′ provided at both ends of the cylinder portion. A notch 10 ′′ is formed at the flange portion 10 ′ to hold the end portion of the bonding wire W. The bonding wire W passed the notch 10 ′′ is fastened to the outer surface of the flange portion 10 ′ by way of a tape (not shown).
  • the spool case 20 for receiving the spool 10 is provided with a base 22 and a cover 24 .
  • the spool case 20 is formed with a material based on synthetic resin such as acryl, polyolefin and styrene.
  • the base 22 has a bottom portion 22 a , and a sidewall 22 b protruded from the bottom portion 22 a .
  • An opening portion 22 c is partially formed at the sidewall 22 b .
  • the opening portion 22 c makes the spool 10 be slide-inserted into the base 22 through a lateral side thereof.
  • the portion of the sidewall 22 b facing the opening portion 22 c is formed with a curvature identical to the spool 10 .
  • a slide coupling member 26 is provided at the sidewall 22 b . When the spool 10 slides inward through the opening portion 22 c , the slide coupling member 26 is coupled to the flange portion 10 ′ of the spool 10 .
  • the slide coupling member 26 has a guide rail 26 a for guiding the sliding of the spool 10 in such a state that the spool 10 is spaced apart from the bottom portion 22 a of the base 22 by a predetermined distance, and a coupling protrusion 26 b for holding the flange portion 10 ′ of the spool 10 together with the guide rail 26 a up and down.
  • the coupling protrusion 26 b is formed at the inner surface of the sidewall 22 b over the guide rail 26 a .
  • the distance between the coupling protrusion 26 b and the guide rail 26 a is identical to or similar to the thickness of the flange portion 10 ′ of the spool 10 .
  • Plural numbers of coupling protrusions 26 b may be provided depending upon the kind of the spool 10 and the weight of the bonding wire W wound on the spool 10 .
  • the number of coupling protrusions 26 b may be established to be two to six.
  • three coupling protrusions 26 b are formed at the portions of the sidewall placed at both sides of the opening portion 22 c and at the portion thereof facing the opening portion 22 c , respectively. As the spool 10 is held by the coupling protrusions 26 b at three points, the spool holding can be made in a stable manner.
  • the coupling protrusions 26 b may be integrated into one while being spatially extended.
  • the spool 10 may be held by way of the association of the bottom portion 22 a and the coupling protrusions 26 b .
  • the spool holding structure is preferably provided with the guide rail 26 a.
  • the coupling protrusion 26 b protruded from the inner surface of the sidewall 22 b may be formed with various shapes such as a circle and a rectangle.
  • the spool 10 is fitted to the base 22 by way of the guide rail 26 a and the coupling protrusions 26 b formed at the sidewall 22 b of the base 22 . Accordingly, the spool 10 can be handled without directly touching it by hand. The coupling state of the spool 10 is not released unless it is intentionally separated from the base 22 . Furthermore, the spool 10 can be coupled to the base 22 or decoupled from the base 22 without elastically transforming or deforming the base 22 . Accordingly, the durability of the spool and the reliability in the spool holding can be prevented from being deteriorated.
  • the cover 24 is fitted to the outer surface of the sidewall 22 b from the top of the base 22 to prevent the bonding wire W from being contaminated due to a foreign material such as dust.
  • the cover 24 has a top portion 24 a , and a protrusion 24 b is formed at the center of the top portion 24 a .
  • the protrusion 24 b is inserted into the inner diameter portion of the spool 10 such that the central axis of the spool 10 can be kept to be in the horizontal direction.
  • the protrusion 24 b is formed with a plane shape of a circle while bearing a diameter identical to or slightly smaller than the spool 10 .
  • the length of the protrusion 24 b is established to be the same as the height of the sidewall 22 b formed at the base 22 .
  • a lateral portion 24 c is bent from the top portion 24 a .
  • the lateral portion 24 c of the cover 24 is cone-shaped while being gradually tapered toward the top portion 24 a .
  • a prominent portion 24 d is formed at the lateral portion 24 c such that it makes the central axis of the spool 10 be maintained to be in the horizontal direction.
  • the prominent portion 24 d may be formed at a lateral side of the cover 24 standing with the opening portion 22 c of the sidewall 22 b .
  • the prominent portion 24 d may be formed at two lateral sides of the cover 10 perpendicular to the opening portion 22 c.
  • the spool 10 wound with the bonding wire W thereon slides into the base 22 through the opening portion 22 c such that the flange portion 10 ′ of the spool 10 is fitted between the guide rail 26 a and the coupling protrusions 26 b .
  • the cover 24 is coupled to the base 22 from the top such that the protrusion 24 b of the cover 24 is inserted into the inner diameter portion of the spool 10 .
  • the spool case 20 is put on a table T such that the prominent portion 24 d is directed toward the bottom.
  • FIG. 3 illustrates the storage of the spool case 20
  • FIG. 4 illustrates the usage of the spool case 20 .
  • the base 22 is pulled downward in the direction perpendicular to the spool mounting direction (indicated by the arrow) to thereby release the coupling of the spool 10 to the base 22 .
  • the spool is mounted to the base while smoothly sliding in the horizontal direction through the opening portion of the sidewall of the base so that the stress concentration is not made at any portion of the base.
  • the conventional spool case is vibrated in the weighted direction of the spool.
  • the bonding wire wound on the spool is a extremely minute wire of about 20 ⁇ m. Such a minute wire is correctly wound on the spool according to the programmed procedure of the computer. Therefore, the state of the bonding wire wound on the spool can be maintained in a stable manner.
  • the spool case is extensively used in various kinds of wire bonding assemblies irrespective of the length of the spool holder or the presence of the spool fixation member.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)

Abstract

A bonding wire spool case, and a method of handling a spool using the spool case has a structure capable of effectively preventing the durability and the holding of the spool from being deteriorated due to the repeated coupling and decoupling operations of the spool with respect to the spool holder while preventing the bonding wire from being contaminated and damaged due to the carelessness of the worker. The bonding wire spool case includes a base having a bottom portion and a sidewall protruded from the bottom portion. The base mounts a spool wound with a bonding wire thereon. A cover is coupled to the base at the outer surface of the sidewall of the base to prevent an alien material such as dust from being introduced. The sidewall of the base is partially provided with an opening portion. A slide coupling member is internally formed at the base such that the slide coupling member is fitted to the flange portion of the spool when the spool slides inward through the opening portion.

Description

    BACKGROUND OF THE INVENTION
  • (a) Field of the Invention [0001]
  • The present invention relates to a spool case for storing and carrying a bonding wire of a wire bonding assembly used in manufacturing a semiconductor chip package and a method of handling a spool using the same. More particularly, the invention relates to a bonding wire spool case and a method of handling a spool using the same which can effectively prevent the durability and the holding of the spool from being deteriorated due to the repeated coupling and decoupling operations of the spool with respect to the spool holder, and prevent the bonding wire from being contaminated and damaged due to the carelessness of the worker. [0002]
  • (b) Description of the Related Art [0003]
  • Generally, a wire bonding assembly is a device for electrically connecting a lead of a lead frame to a bonding pad of a semiconductor chip bearing an electrical characteristic by way of a conductive wire such as a high purity platinum Pt wire or an aluminum wire. [0004]
  • The wire bonding assembly is usually provided with a spool, a spool holder, a wire feed guider, a wire clamp, and a capillary. A conductive wire is wound on the spool, and the spool is fitted to the spool holder. The conductive wire is fused by way of the capillary and a torch bar, and welded to the bonding pad of the semiconductor chip and the lead. [0005]
  • In the wire bonding assembly, the spool wound with a conductive metal wire thereon is usually placed within a spool case, and in that state, it is stored and carried while preventing the contamination and damage thereof. Various kinds of spool cases are used for that purpose. [0006]
  • For instance, Japanese Utility Model Publication Number Sho58-41188 discloses a spool case having a base with a protrusion onto which a cylindrical spool is inserted, and a cover coupled to the base to prevent a foreign material such as dust from being introduced. The cover is provided with a spool case, which has a depressed portion for receiving the spool in correspondence with the protrusion of the base. [0007]
  • The worker grips the flange portion of the spool by hand, and fits it to the spool holder to bring out the spool from the spool case. [0008]
  • Accordingly, with the handling of the spool, the fingers of the worker contact the surface of the conductive wire. In this case, the wire is contaminated and damaged, and this induces serious device failures during the wire bonding process. [0009]
  • Japanese Patent Publication Laid-open No. 2000-112599 discloses a bonding wire spool case having an interfacial coupling member externally fitted around the spool flange to hold the spool, and a base capable of being elastically transformed. The worker presses both lateral sides of the base while elastically transforming the base to remove the spool from the spool case. [0010]
  • However, with the spool case disclosed in Japanese Patent Publication Laid-open No. 2000-112599, the base is formed with a material capable of being elastically transformed such that the spool can be separated from the spool case by way of the interfacial coupling member. [0011]
  • Accordingly, in case the base repeatedly suffers the elastic transformation to make coupling or decoupling of the spool, stress is concentrated at a predetermined region of the base due to the elastic transformation. Consequently, the base is stress-damaged while being deteriorated in its durability. [0012]
  • The interfacial coupling member, which is connected to the base in a body to substantially hold the spool, is formed with an elastic plastic material. With the repeated uses, the interfacial coupling member becomes worn out or blunt, and this deteriorates reliability in the spool holding operation. [0013]
  • Furthermore, with the handling of the spool, the worker picks out the cover from the base, and grips the base to mount the spool to the spool holder of the bonding machine. At this time, the worker may carelessly grip both sides of the base. In this case, the spool holding state of the interfacial coupling member is released so that the spool is separated from the base. Consequently, the bonding wire is contaminated, and damaged. [0014]
  • SUMMARY OF THE INVENTION
  • It is an object of the present invention to provide a bonding wire spool case and a method of handing a spool using the spool case which can effectively prevent the durability and the holding of the spool from being deteriorated due to the repeated coupling and decoupling operations of the spool with respect to the spool holder, and prevent the bonding wire from being contaminated and damaged due to the carelessness of the worker. [0015]
  • This and other objects may be achieved by a bonding wire spool case and a method of handling a spool using the spool case with the following features. [0016]
  • The bonding wire spool case includes a base having a bottom portion and a sidewall protruding from the bottom portion. The base mounts a spool wound with a bonding wire thereon. A cover is coupled to the base at the outer surface of the sidewall of the base to prevent foreign material such as dust from being introduced. The sidewall of the base is partially provided with an opening portion. A slide coupling member is internally formed at the base such that the slide coupling member is fitted to the flange portion of the spool when the spool slides inward through the opening portion. [0017]
  • The slide coupling member has a guide rail for spacing the spool from the bottom portion of the base by a predetermined distance, and a coupling protrusion protruded form the inner surface of the sidewall to hold the flange portion of the spool together with the guide rail. The slide coupling member may have two or more coupling protrusions. Preferably, three coupling protrusions are provided at the slide coupling member while being positioned at the portions of the sidewall placed at both sides of the opening portion, and at the portion of the sidewall facing the opening portion. [0018]
  • The spool is fitted to the base by way of the guide rail and the coupling protrusions formed at the sidewall of the base. Accordingly, the spool can be handled without directly touching it by hand. The coupling state of the spool is not released unless it is intentionally separated from the base. Furthermore, the spool can be coupled to the base or decoupled from the base without elastically transforming the base. Accordingly, the durability of the spool and the reliability in the spool holding can be prevented from being deteriorated. [0019]
  • The coupling protrusions may be formed with various shapes while being protruded from the sidewall. Furthermore, the coupling protrusions may be integrated into one while being spatially extended. [0020]
  • The portion of the sidewall facing the opening portion is formed with a curvature identical to the spool flange. The cover has a protrusion inserted into the inner diameter portion of the spool mounted to the base such that the central axis of the spool is maintained to be in the horizontal direction. [0021]
  • As the central axis of the spool is maintained to be in the horizontal direction, the bonding wire wound on the spool deals well with its own load, vibration in its movement and other impacts over its entire length so that the unintended winding or releasing of the wire can be effectively prevented. [0022]
  • A prominent portion may be formed at one or more sides of the cover to keep the central axis of the spool in the horizontal direction. [0023]
  • Both ends of the bonding wire wound on the spool are attached to the flange portion of the spool by way of a tape. In case the end portion of the bonding wire is attached to the outer surface of the flange portion, a notch is formed at the flange portion to pass the bonding wire. The notch may be formed at the one-sided flange portion, or at the both-sided flange portions. [0024]
  • With the inventive spool case, the spool can be coupled to, or decoupled from the spool holder through sliding the base in the direction perpendicular to the spool holder. In this way, the coupling or decoupling of the spool can be made without directly touching the spool by hand. [0025]
  • Furthermore, separation of the spool from the base due to the carelessness of the worker can be prevented. [0026]
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • A more complete appreciation of the invention, and many of the attendant advantages thereof, will be readily apparent as the same becomes better understood by reference to the following detailed description when considered in conjunction with the accompanying drawings in which like reference symbols indicate the same or the similar components, wherein: [0027]
  • FIG. 1 is an exploded perspective view of a spool case with a cover and a base according to a preferred embodiment of the present invention; [0028]
  • FIG. 2 is a perspective view of the base shown in FIG. 1 mounting a spool therein; [0029]
  • FIG. 3 is a partial sectional view of the spool case shown in FIG. 1 illustrating the storage thereof; and [0030]
  • FIG. 4 is a perspective view of the spool case shown in FIG. 1 illustrating the usage thereof. [0031]
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Preferred embodiments of this invention will be explained with reference to the accompanying drawings. [0032]
  • FIG. 1 is an exploded perspective view of a spool case with a cover and a base according to a preferred embodiment of the present invention, and FIG. 2 is a perspective view of the base shown in FIG. 1 mounting a spool therein. [0033]
  • As shown in the drawings, the [0034] spool 10, well known in the art, has a cylinder portion (not shown) for winding the bonding wire W thereon, and a pair of flange portions 10′ provided at both ends of the cylinder portion. A notch 10″ is formed at the flange portion 10′ to hold the end portion of the bonding wire W. The bonding wire W passed the notch 10″ is fastened to the outer surface of the flange portion 10′ by way of a tape (not shown).
  • The [0035] spool case 20 for receiving the spool 10 is provided with a base 22 and a cover 24. The spool case 20 is formed with a material based on synthetic resin such as acryl, polyolefin and styrene.
  • The [0036] base 22 has a bottom portion 22 a, and a sidewall 22 b protruded from the bottom portion 22 a. An opening portion 22 c is partially formed at the sidewall 22 b. The opening portion 22 c makes the spool 10 be slide-inserted into the base 22 through a lateral side thereof.
  • The portion of the [0037] sidewall 22 b facing the opening portion 22 c is formed with a curvature identical to the spool 10. A slide coupling member 26 is provided at the sidewall 22 b. When the spool 10 slides inward through the opening portion 22 c, the slide coupling member 26 is coupled to the flange portion 10′ of the spool 10. In this preferred embodiment, the slide coupling member 26 has a guide rail 26 a for guiding the sliding of the spool 10 in such a state that the spool 10 is spaced apart from the bottom portion 22 a of the base 22 by a predetermined distance, and a coupling protrusion 26 b for holding the flange portion 10′ of the spool 10 together with the guide rail 26 a up and down.
  • The [0038] coupling protrusion 26 b is formed at the inner surface of the sidewall 22 b over the guide rail 26 a. The distance between the coupling protrusion 26 b and the guide rail 26 a is identical to or similar to the thickness of the flange portion 10′ of the spool 10. When the spool 10 slides through the opening portion 22 c, the flange portion 10′ of the spool 10 is fitted between the guide rail 26 a and the coupling protrusion 26 b, thereby holding the spool 10.
  • Plural numbers of [0039] coupling protrusions 26 b may be provided depending upon the kind of the spool 10 and the weight of the bonding wire W wound on the spool 10. The number of coupling protrusions 26 b may be established to be two to six.
  • In this preferred embodiment, three [0040] coupling protrusions 26 b are formed at the portions of the sidewall placed at both sides of the opening portion 22 c and at the portion thereof facing the opening portion 22 c, respectively. As the spool 10 is held by the coupling protrusions 26 b at three points, the spool holding can be made in a stable manner.
  • Alternatively, the [0041] coupling protrusions 26 b may be integrated into one while being spatially extended.
  • Furthermore, in the absence of the [0042] guide rail 26 a, the spool 10 may be held by way of the association of the bottom portion 22 a and the coupling protrusions 26 b. However, with this structure, as the sliding of the flange portion 10′ of the spool 10 is made in contact with the bottom portion 22 a, shortcomings may be made due to increase in the contact area. Therefore, the spool holding structure is preferably provided with the guide rail 26 a.
  • Meanwhile, the [0043] coupling protrusion 26 b protruded from the inner surface of the sidewall 22 b may be formed with various shapes such as a circle and a rectangle.
  • The [0044] spool 10 is fitted to the base 22 by way of the guide rail 26 a and the coupling protrusions 26 b formed at the sidewall 22 b of the base 22. Accordingly, the spool 10 can be handled without directly touching it by hand. The coupling state of the spool 10 is not released unless it is intentionally separated from the base 22. Furthermore, the spool 10 can be coupled to the base 22 or decoupled from the base 22 without elastically transforming or deforming the base 22. Accordingly, the durability of the spool and the reliability in the spool holding can be prevented from being deteriorated.
  • The [0045] cover 24 is fitted to the outer surface of the sidewall 22 b from the top of the base 22 to prevent the bonding wire W from being contaminated due to a foreign material such as dust. The cover 24 has a top portion 24 a, and a protrusion 24 b is formed at the center of the top portion 24 a. The protrusion 24 b is inserted into the inner diameter portion of the spool 10 such that the central axis of the spool 10 can be kept to be in the horizontal direction.
  • The [0046] protrusion 24 b is formed with a plane shape of a circle while bearing a diameter identical to or slightly smaller than the spool 10. The length of the protrusion 24 b is established to be the same as the height of the sidewall 22 b formed at the base 22.
  • Furthermore, a [0047] lateral portion 24 c is bent from the top portion 24 a. The lateral portion 24 c of the cover 24 is cone-shaped while being gradually tapered toward the top portion 24 a. A prominent portion 24 d is formed at the lateral portion 24 c such that it makes the central axis of the spool 10 be maintained to be in the horizontal direction.
  • The [0048] prominent portion 24 d may be formed at a lateral side of the cover 24 standing with the opening portion 22 c of the sidewall 22 b. Alternatively, as indicated by the dotted line in FIG. 1, the prominent portion 24 d may be formed at two lateral sides of the cover 10 perpendicular to the opening portion 22 c.
  • Accordingly, the [0049] spool 10 wound with the bonding wire W thereon slides into the base 22 through the opening portion 22 c such that the flange portion 10′ of the spool 10 is fitted between the guide rail 26 a and the coupling protrusions 26 b. The cover 24 is coupled to the base 22 from the top such that the protrusion 24 b of the cover 24 is inserted into the inner diameter portion of the spool 10.
  • In this state, the [0050] spool case 20 is put on a table T such that the prominent portion 24 d is directed toward the bottom.
  • Consequently, as the central axis of the [0051] spool 10 is maintained to be in the horizontal direction, the bonding wire W wound on the spool 10 deals well with its own load, vibration in its movement and other impacts over its entire length so that the unintended winding or releasing of the wire can be effectively prevented while prohibiting the rolling of the spool case 20.
  • FIG. 3 illustrates the storage of the [0052] spool case 20, and FIG. 4 illustrates the usage of the spool case 20.
  • As shown in FIG. 4, in case the [0053] spool 10 is mounted to a spool holder 30 of a wire bonding assembly (not shown), one hand laterally grips the bottom portion 22 a of the base 22 and, in that state, the other hand grips the lateral portion of the cover 24. Thereafter, the cover 24 is lifted upward to thereby separate the cover 24 from the base 22. When the opening portion 22 c of the base 22 is directed upward, the spool 10 moves in the arrow (solid line) direction, and is fitted to the spool holder 30. At this time, the spool 10 is fixed by a spool fixation member 32 of the spool holder 30.
  • Thereafter, the [0054] base 22 is pulled downward in the direction perpendicular to the spool mounting direction (indicated by the arrow) to thereby release the coupling of the spool 10 to the base 22.
  • It is possible to pull the base [0055] 22 in any one direction perpendicular to the spool holder 30.
  • With the inventive spool case, the spool is mounted to the base while smoothly sliding in the horizontal direction through the opening portion of the sidewall of the base so that the stress concentration is not made at any portion of the base. [0056]
  • Accordingly, the durability deterioration with the conventional spool case where the coupling or decoupling of the spool is made through elastically transforming or deforming the coupling member and the base is prevented. [0057]
  • As any portion is not worn out or stunt at the coupling or decoupling of the spool, reliability in the spool holding can be enhanced. [0058]
  • When the spool is mounted to the base, the conventional spool case is vibrated in the weighted direction of the spool. With the inventive spool case, such a vibration can be prevented. The bonding wire wound on the spool is a extremely minute wire of about 20 μm. Such a minute wire is correctly wound on the spool according to the programmed procedure of the computer. Therefore, the state of the bonding wire wound on the spool can be maintained in a stable manner. [0059]
  • The spool case is extensively used in various kinds of wire bonding assemblies irrespective of the length of the spool holder or the presence of the spool fixation member. [0060]
  • With the inventive spool case, when the worker grips the base to separate the cover form the base or to mount the spool to the spool holder of the wire bonding assembly, the spool holding of the slide coupling member is not released due to the carelessness of the worker. Accordingly, the contamination of and damage to the bonding wire pursuant to the separation of the spool from the base can be prevented. [0061]
  • While the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art will appreciate that various modifications and substitutions can be made thereto without departing from the spirit and scope of the present invention as set forth in the appended claims. [0062]

Claims (9)

We claim:
1. A bonding wire spool case, comprising:
a base having a bottom portion and a sidewall that protrudes from the bottom portion, a spool wound with a bonding wire being mountable on the base;
a cover coupled to the base at an outer surface of the sidewall of the base so as to prevent foreign material from being introduced into the case, the sidewall of the base being partially provided with an opening portion; and
a slide coupling member internally formed at the base so that the slide coupling member is fitted to a flange portion of the spool when the spool slides inward through the opening portion.
2. The bonding wire spool case of claim 1, wherein the slide coupling member has a guide rail arranged so as to space the spool from the bottom portion of the base by a predetermined distance, and a coupling protrusion arranged to protrude from an inner surface of the sidewall so as to hold the flange portion of the spool together with the guide rail.
3. The bonding wire spool case of claim 2, wherein the slide coupling member has at least two coupling protrusions.
4. The bonding wire spool case of claim 3, wherein the slide coupling member has three coupling protrusions arranged so as to hold the spool at three points.
5. The bonding wire spool case of claim 4, wherein the three coupling protrusions are positioned at portions of the sidewall placed at both sides of the opening portion, and at a portion of the sidewall facing the opening portion.
6. The bonding wire spool case of claim 5, wherein the portion of the sidewall facing the opening portion is formed with a curvature identical to the spool flange.
7. The bonding wire spool case of claim 1, wherein the cover has a protrusion configured to be insertable into an inner diameter portion of the spool when the spool is mounted to the base so that a central axis of the spool is maintainable in a horizontal direction.
8. A method of handling a spool using a spool case having a base with a bottom portion and a sidewall that protrudes from the bottom portion, a spool wound with a bonding wire being mountable on the base, a cover coupled to the base at an outer surface of the sidewall of the base so as to prevent foreign material from being introduced into the case, the sidewall of the base being partially provided with an opening portion, and a slide coupling member internally formed at the base so that the slide coupling member is fitted to a flange portion of the spool when the spool slides inward through the opening portion, the method comprising the steps of selectively coupling and decoupling the spool from a spool holder by sliding the base of the spool case in a direction perpendicular to the spool holder without directly touching the spool by hand.
9. The method of claim 8, including sliding the base downward in a direction perpendicular to the spool holder.
US10/268,710 2001-10-12 2002-10-10 Spool case for bonding wire, and method of handling spool using same Abandoned US20030098253A1 (en)

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KR10-2001-0063053A KR100398831B1 (en) 2001-10-12 2001-10-12 Spool case for bonding wire and method for handling spool using the case
KR63053/2001 2001-10-12

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040251160A1 (en) * 2003-06-11 2004-12-16 Ronald Schauer Non-contact protective packaging for surface-sensitive articles
US20040262187A1 (en) * 2003-06-26 2004-12-30 Applied Materials, Inc. Clean room transportation package for process chamber kit
US20060273217A1 (en) * 2005-06-07 2006-12-07 James Wilkinson Dispenser for elongate material
EP2093008A1 (en) 2008-02-19 2009-08-26 Markus Bräm Dispenser for a tin soldering roller with sideplates slidable relative to a base and protrusions for receiving the tin soldering roller
US10556769B2 (en) 2017-06-16 2020-02-11 Lincoln Global, Inc. Storage device for spooled wire

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100422986B1 (en) * 2002-04-22 2004-03-12 엠케이전자 주식회사 Case for casing the spool of bonding wire with magnetic attraction method
CN105314261B (en) * 2015-11-17 2018-10-02 武汉汉麻生物科技有限公司 A kind of yarn barrier packaging
GB2595721B (en) * 2020-06-05 2022-12-21 Iatbm Ltd A device for storing and dispensing an item

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3631971A (en) * 1970-05-04 1972-01-04 Ibm Snap-open magnetic tape cartridge
US4420079A (en) * 1980-02-23 1983-12-13 Basf Aktiengesellschaft Container for tape-like material
US5738209A (en) * 1996-12-23 1998-04-14 General Motors Corporation Cable storage container
US6241094B1 (en) * 1997-08-08 2001-06-05 Tanaka Denshi Kogyo Kabushiki Kaisha Spool case of bonding wire

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07161754A (en) * 1993-12-06 1995-06-23 Mitsubishi Materials Corp Spool case for semiconductor bonding wire
JP2679697B2 (en) * 1995-11-29 1997-11-19 株式会社日鉄マイクロメタル Spool case
JP3794601B2 (en) * 1998-03-26 2006-07-05 田中電子工業株式会社 Spool case for bonding wire
JPH11228025A (en) * 1997-12-12 1999-08-24 Tanaka Electronics Ind Co Ltd Spool winding form of extra fine wire and spool case
JP3533658B2 (en) * 1998-03-27 2004-05-31 住友金属鉱山株式会社 Spool case for bonding wire
JPH11321953A (en) * 1998-05-20 1999-11-24 Mitsubishi Materials Corp Spool case
JP2001210670A (en) * 2000-01-24 2001-08-03 Nittetsu Micro Metal:Kk Spool case of semiconductor bonding wire

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3631971A (en) * 1970-05-04 1972-01-04 Ibm Snap-open magnetic tape cartridge
US4420079A (en) * 1980-02-23 1983-12-13 Basf Aktiengesellschaft Container for tape-like material
US5738209A (en) * 1996-12-23 1998-04-14 General Motors Corporation Cable storage container
US6241094B1 (en) * 1997-08-08 2001-06-05 Tanaka Denshi Kogyo Kabushiki Kaisha Spool case of bonding wire

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040251160A1 (en) * 2003-06-11 2004-12-16 Ronald Schauer Non-contact protective packaging for surface-sensitive articles
US7185760B2 (en) * 2003-06-11 2007-03-06 Applied Materials, Inc. Non-contact protective packaging for surface-sensitive articles
US20040262187A1 (en) * 2003-06-26 2004-12-30 Applied Materials, Inc. Clean room transportation package for process chamber kit
US20060273217A1 (en) * 2005-06-07 2006-12-07 James Wilkinson Dispenser for elongate material
US7204452B2 (en) 2005-06-07 2007-04-17 Sonoco Development, Inc. Dispenser for elongate material
EP2093008A1 (en) 2008-02-19 2009-08-26 Markus Bräm Dispenser for a tin soldering roller with sideplates slidable relative to a base and protrusions for receiving the tin soldering roller
US10556769B2 (en) 2017-06-16 2020-02-11 Lincoln Global, Inc. Storage device for spooled wire

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CN1413899A (en) 2003-04-30
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EP1302980A1 (en) 2003-04-16
KR100398831B1 (en) 2003-09-19

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