US20030073756A1 - Radiation curable compositions with enhanced adhesion - Google Patents

Radiation curable compositions with enhanced adhesion Download PDF

Info

Publication number
US20030073756A1
US20030073756A1 US10/243,013 US24301302A US2003073756A1 US 20030073756 A1 US20030073756 A1 US 20030073756A1 US 24301302 A US24301302 A US 24301302A US 2003073756 A1 US2003073756 A1 US 2003073756A1
Authority
US
United States
Prior art keywords
acrylate
meth
composition
poly
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US10/243,013
Other versions
US6809127B2 (en
Inventor
Miguel Dones
Anbazhagan Natesh
Daniel Haile
Ramesh Narayan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IGM Group BV
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US10/243,013 priority Critical patent/US6809127B2/en
Priority to ES02776100T priority patent/ES2312628T3/en
Priority to DE60228745T priority patent/DE60228745D1/en
Priority to AT02776100T priority patent/ATE407002T1/en
Priority to EP02776100A priority patent/EP1439951B1/en
Priority to PCT/US2002/031532 priority patent/WO2003028992A1/en
Priority to TW91122820A priority patent/TWI273119B/en
Assigned to COGNIS CORPORATION (COGNIS CORP.) reassignment COGNIS CORPORATION (COGNIS CORP.) ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DONES, MIGUEL A., HAILE, DANIEL, NARAYAN, RAMESH L., NATESH, ANBAZHAGAN
Publication of US20030073756A1 publication Critical patent/US20030073756A1/en
Application granted granted Critical
Publication of US6809127B2 publication Critical patent/US6809127B2/en
Assigned to COGNIS IP MANAGEMENT GMBH reassignment COGNIS IP MANAGEMENT GMBH PATENT AND TRADEMARK TRANSFER AGREEMENT Assignors: COGNIS CORPORATION
Assigned to IGM GROUP B.V. reassignment IGM GROUP B.V. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: COGNIS IP MANAGEMENT GMBH
Adjusted expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G81/00Macromolecular compounds obtained by interreacting polymers in the absence of monomers, e.g. block polymers
    • C08G81/02Macromolecular compounds obtained by interreacting polymers in the absence of monomers, e.g. block polymers at least one of the polymers being obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C08G81/024Block or graft polymers containing sequences of polymers of C08C or C08F and of polymers of C08G
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • C08F290/065Polyamides; Polyesteramides; Polyimides
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31551Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31623Next to polyamide or polyimide
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal
    • Y10T428/31681Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31725Of polyamide
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31725Of polyamide
    • Y10T428/31768Natural source-type polyamide [e.g., casein, gelatin, etc.]
    • Y10T428/31772Next to cellulosic
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31725Of polyamide
    • Y10T428/31768Natural source-type polyamide [e.g., casein, gelatin, etc.]
    • Y10T428/31772Next to cellulosic
    • Y10T428/31775Paper

Definitions

  • the present invention relates to a radiation-curable composition
  • a radiation-curable composition comprising the reaction product of an amine-terminated (poly)aminoamide and a mono-(meth)acrylate or a poly-(meth)acrylate.
  • the compositions according to the invention are liquids at room temperature.
  • the invention also pertains to a method of producing a coated substrate comprising contacting a substrate with the composition according to the invention and subjecting the composition to high energy electrons or ultraviolet light.
  • the compositions according to the invention can also be cured via thermal polymerization using well known free radical initiators such as organic peroxides.
  • Radiation cured compositions according to the invention deposited on a substrate exhibit excellent adhesion characteristics to the substrate.
  • (meth)acrylate means a mono-acrylate or a methacrylate ester.
  • poly-(meth)acrylate means a compound having two or more acrylate or methacrylate ester groups.
  • (poly)aminoamide includes a mono-aminoamide or a polyaminoamide.
  • the amine-terminated (poly)aminoamide s according to the invention can be made by the reaction between a di- or poly basic carboxylic acids and excess polyfunctional amines to produce amine-terminated (poly)aminoamides.
  • the acids can be saturated, unsaturated fatty acids or a combination thereof and/or its dimers of unsaturated fatty acids such as a C 36 dimer acid.
  • the polyfunctional amines can be linear polyalkylene polyamine examples of which include, but are not limited to, ethylene diamine, 1,6-hexamethylene diamine, trimethylpentanediamine, diethylene triamine, triethylene tetramine, tetraethylene teraamine; cyclic polyamines such as piperazine, isophorone diamine, meta-xylene diamine, norbornane diamine, 1,3-diaminomethyl cyclohexane and polyether based polyamines available commercially as JEFFAMINE® D-230, T-403 and D-2000.
  • the (meth)acrylates according to the invention can be any di- or polyfunctional (meth)acrylates. Such compounds include compounds having both acrylate and methacrylate groups.
  • Examples of the (meth)acrylates according to the invention include, but are not limited to, (a) the reaction product of the diglycidyl ethers of aliphatic diols and (meth)acrylate acid such as butanedioldiglycidyl ether and (meth)acrylate acid, the mono-glycidyl ether of (meth)acrylate acid and (meth)acrylate acid; a mixed acrylate-methacrylate ester of butanedioldiglycidyl ether; (b) (meth)acrylate-terminated urethanes made by the reaction of a diisocyanate and 2-hydroxyethyl (meth)acrylate, of a diisocyanate and the reaction product of succinic anhydride and (meth)acrylate acid.
  • the ratio of (meth)acrylate to amine-terminated (poly)aminoamide can vary from about 100 to about 1 (meth)acrylate equivalence to amine hydrogen equivalence, preferably from about 15 to about 1 and most preferably about 8 to about 1 ratio in terms of (meth)acrylate to amine hydrogen equivalence.
  • compositions according to the invention can optionally contain acid functional (meth)acrylates.
  • the acid functional (meth)acrylate according to the invention can be made by the reaction between dicarboxylic acid anhydrides and hydroxyalkyl (meth)acrylates.
  • anhydrides that can be used include, but are not limited to, succinic anhydride, maleic anhydride, alkenyl succinic anhydrides such as dodecenyl succinic anhydride and octenyl succinic anhydride, trimellitic and phthalic anhydrides.
  • hydroxyalkyl (meth)acrylates includes hydroxyethyl acrylate and methacrylate, hydroxypropyl acrylate and methacrylate, hydroxybutyl acrylate and methacrylate and caprolactone or polycaprolactone esterified with above hydroxyalkyl acrylate and methacrylates.
  • compositions according to the invention can optionally contain photoinitiators such as benzophenone, ⁇ , ⁇ -dimethoxy- ⁇ -phenylacetophenone, ⁇ , ⁇ -diethoxyacetophenone and alkyl benzoin ethers.
  • photoinitiators such as benzophenone, ⁇ , ⁇ -dimethoxy- ⁇ -phenylacetophenone, ⁇ , ⁇ -diethoxyacetophenone and alkyl benzoin ethers.
  • compositions according to the invention can be applied to any type of substrate such as, for example, non porous substrates, such as glass, plastics and metals, and porous substrates, such as wood, paper and leather by any means known to those skilled in the art such as by spraying, dipping, brushing, etc.
  • the compositions according to the invention can be cured by any type of radiation that is typically used such as high energy electrons (electron beams) and ultraviolet light.
  • the compositions according to the invention can also be cured thermally in the presence of a free radical initiator such as benzoyl peroxide or azo-bisisobutyronitrile.
  • the above mixture is combined with 5 parts of trimethylolpropane triacrylate, 1 part of ⁇ , ⁇ -dimethoxy- ⁇ -phenylacetophenone and 5 parts of benzophenone to give a uniform composition with a viscosity of 160 cps.
  • a 3 mil draw down of the above composition was applied over steel substrate and cured with UV light having energy of 0.668 joules/cm 2 .
  • the UV cured film was hard and slippery with excellent adhesion to the substrate.
  • Dimerized fatty acid and piperazine are added in a reaction kettle and heated to 227° C. for one hour and a vacuum of 15 mm Hg is applied for three hours to remove the water of reaction.
  • a reaction carried out in this manner should produce a polyamide resin having an amine value of about 67 mg KOH/gm.
  • Butanediol diglycidylether, triphenylphosphine and hydroquinone monomethyl ether is charged in a resin kettle and heated to 45° C. Acrylic acid is added over time by maintaining the reaction temperature below 80° C. The above reaction mixture is kept at 80-90° C. until the acid value is below 5 and all of the epoxide is reacted. The resulting diacrylate is cooled to 45° C. and added with charge 2. Once the exotherm is subsided, the reaction mixture is heated to 80° C. and kept at this temperature until all of the polyamide is reacted. A reaction carried out in this manner should produce a polyamide-acrylate resin that is a liquid at room temperature.
  • Polyamide resin, triphenylphosphine and hydroquinone monomethylether are added in a reaction kettle and heated to 60° C.
  • GMA is added to the kettle over time by keeping the temperature below 80° C.
  • Reaction mixture is kept at 80° C. until all of the epoxide group from GMA is reacted.
  • the resulting polyamide-methacrylate resin solution is cooled to 60° C. and poured out. A reaction carried out in this manner should produce a polyamide-methacrylate resin that is a liquid at room temperature.
  • Charge 1 is reacted using conditions as in example 5 to produce mono methacrylate of butanedioldiglycidylether.
  • the monomethacrylate is reacted with the Polyamide.
  • a reaction carried out in this manner should produce a polyamide-methacrylate resin that is a liquid at room temperature.
  • Urethane diacrylate is made by heating the charge 1 in a reaction kettle to 80° C. and holding the reaction mixture at that temp. until all of the isocyanates are reacted. The resulting product, urethane diacrylate is cooled to 60° C. and added and reacted with Polyamide. A reaction carried out in this manner should produce a polyamide-acrylate resin that is a liquid at room temperature.
  • a polyamide resin is prepared in a resin kettle from a mixture of 81.09% by weight EMPOL® 1025 Dimer Acid (hydrogenated dimerized fatty acid mixture available from Cognis Corporation), and 18.91% by weight piperazine. The mixture was refluxed for one hour before heating to 227° C. (440° F.) while collecting distillate. Material was held at 227° C. for one hour under nitrogen flow and then three hours at the same temperature under a vacuum of 15 mm Hg. The resulting product was a viscous liquid with an Mn value of 1570 and a Mw value of 3660. The product titrated with HCl to bromocresol green end-point to show an amine value of 67 mg KOH/gram
  • a polyamide resin is prepared in a resin kettle from a mixture of 78.65% by weight EMPOL® 1025 Dimer Acid (hydrogenated dimerized fatty acid mixture available from Cognis Corporation), 12.18% 1,2-cyclohexanediamine, and 9.17% by weight piperazine. The mixture was refluxed for one hour before heating to 227° C. (440° F.) while collecting distillate. Material was held at 227° C. for one hour under nitrogen flow and then three hours at the same temperature under a vacuum of 15 mm Hg. The resulting product was a viscous liquid. The product titrated with HCI to bromocresol green end-point to show an amine value of 56 mg KOH/gram.
  • a polyamide resin is prepared in a resin kettle from a mixture of 82.88% by weight EMPOL® 1061 (distilled dimerized fatty acid mixture available from Cognis Corporation), 5.46% ethylenediamine, and 11.66% by weight piperazine. The mixture was refluxed for one hour before heating to 227° C. (440° F.) while collecting distillate. Material was held at 227° C. for one hour under nitrogen flow and then three hours at the same temperature under a vacuum of 15 mm Hg. The resulting product was a slightly tacky solid. The product titrated with HCl to bromocresol green end-point to show an amine value of 49.2 mg KOH/gram. The amid-amine resin had an Mn of 1930 and an Mw of 4030 by GPC. A solution was prepared containing 50% resin solids, 1% water, and 49% 2-propanol.
  • a polyamide resin is prepared in a resin kettle from a mixture of 76.02% by weight EMPOL® 1061 Dimer Acid (distilled dimerized fatty acid mixture available from Cognis Corporation), 7.62% ethylenediamine, and 16.36% by weight aminoethyl-piperazine. The mixture was refluxed for one hour before heating to 227° C. (440° F.) while collecting distillate. Material was held at 227° C. for one hour under nitrogen flow and then three hours at the same temperature under a vacuum of 15 mm Hg. The resulting product was a slightly tacky solid. The product titrated with HCI to bromocresol green end-point to show an amine value of 112 mg KOH/gram.
  • the amido-amine resin had an Mn of 1410 and an Mw of 2000 by GPC.
  • a solution was prepared containing 64.3% resin solids and 35.7% 2-propanol.
  • a polyamide resin is prepared in a resin kettle from a mixture of 63.88% by weight EMPOL® 1061 (distilled dimerized fatty acid mixture available from Cognis Corporation) and 36.12% by weight isophorone diamine. The mixture was refluxed for one hour before heating to 227° C. (440° F.) while collecting distillate. Material was held at 227° C. for one hour under nitrogen flow and then three hours at the same temperature under a vacuum of 15 mm Hg. The resulting product was an amber solid. The product titrated with HCl to bromocresol green end-point to show an amine value of 79.2 mg KOH/gram.
  • the amido-amine resin had an Mn of 1770 and an Mw of 2680 by GPC.
  • a solution was prepared containing 74% resin.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

A radiation-curable composition is comprised of the reaction product of an amine-terminated (poly)aminoamide and a mono-(meth)acrylate or a poly-(meth)acrylate. The radiation-curable composition is a liquid at room temperature and does not undergo substantial volume contraction upon curing and exhibit excellent adhesion to porous and non porous substrates alike.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • This application claims the benefit of copending provisional application serial No. 60/326,978, filed on Oct. 4, 2001, the entire contents of which are incorporated herein by reference. [0001]
  • BACKGROUND OF THE INVENTION
  • Use of Ultra-Violet/Electron Beam curable compositions in the coatings and inks industries has been growing tremendously in the last few years due to their ability to cure instantaneously with optimal film properties such as chemical, stain and abrasion resistance. Since vinyl polymerization occurs with substantial volume contraction, adhesion of radiation curable compositions to non porous substrates, such as glass, plastics and metals, and porous substrates, such as wood, paper and leather, remains a challenging problem to formulators. [0002]
  • BRIEF SUMMARY OF THE INVENTION
  • The present invention relates to a radiation-curable composition comprising the reaction product of an amine-terminated (poly)aminoamide and a mono-(meth)acrylate or a poly-(meth)acrylate. The compositions according to the invention are liquids at room temperature. The invention also pertains to a method of producing a coated substrate comprising contacting a substrate with the composition according to the invention and subjecting the composition to high energy electrons or ultraviolet light. The compositions according to the invention can also be cured via thermal polymerization using well known free radical initiators such as organic peroxides. [0003]
  • Radiation cured compositions according to the invention deposited on a substrate exhibit excellent adhesion characteristics to the substrate. [0004]
  • DETAILED DESCRIPTION OF THE INVENTION
  • The term (meth)acrylate means a mono-acrylate or a methacrylate ester. The term poly-(meth)acrylate means a compound having two or more acrylate or methacrylate ester groups. The term (poly)aminoamide includes a mono-aminoamide or a polyaminoamide. [0005]
  • The amine-terminated (poly)aminoamide s according to the invention can be made by the reaction between a di- or poly basic carboxylic acids and excess polyfunctional amines to produce amine-terminated (poly)aminoamides. The acids can be saturated, unsaturated fatty acids or a combination thereof and/or its dimers of unsaturated fatty acids such as a C[0006] 36 dimer acid. The polyfunctional amines can be linear polyalkylene polyamine examples of which include, but are not limited to, ethylene diamine, 1,6-hexamethylene diamine, trimethylpentanediamine, diethylene triamine, triethylene tetramine, tetraethylene teraamine; cyclic polyamines such as piperazine, isophorone diamine, meta-xylene diamine, norbornane diamine, 1,3-diaminomethyl cyclohexane and polyether based polyamines available commercially as JEFFAMINE® D-230, T-403 and D-2000.
  • The (meth)acrylates according to the invention can be any di- or polyfunctional (meth)acrylates. Such compounds include compounds having both acrylate and methacrylate groups. Examples of the (meth)acrylates according to the invention include, but are not limited to, (a) the reaction product of the diglycidyl ethers of aliphatic diols and (meth)acrylate acid such as butanedioldiglycidyl ether and (meth)acrylate acid, the mono-glycidyl ether of (meth)acrylate acid and (meth)acrylate acid; a mixed acrylate-methacrylate ester of butanedioldiglycidyl ether; (b) (meth)acrylate-terminated urethanes made by the reaction of a diisocyanate and 2-hydroxyethyl (meth)acrylate, of a diisocyanate and the reaction product of succinic anhydride and (meth)acrylate acid. [0007]
  • The ratio of (meth)acrylate to amine-terminated (poly)aminoamide can vary from about 100 to about 1 (meth)acrylate equivalence to amine hydrogen equivalence, preferably from about 15 to about 1 and most preferably about 8 to about 1 ratio in terms of (meth)acrylate to amine hydrogen equivalence. [0008]
  • The compositions according to the invention can optionally contain acid functional (meth)acrylates. The acid functional (meth)acrylate according to the invention can be made by the reaction between dicarboxylic acid anhydrides and hydroxyalkyl (meth)acrylates. Examples of anhydrides that can be used include, but are not limited to, succinic anhydride, maleic anhydride, alkenyl succinic anhydrides such as dodecenyl succinic anhydride and octenyl succinic anhydride, trimellitic and phthalic anhydrides. Examples of hydroxyalkyl (meth)acrylates includes hydroxyethyl acrylate and methacrylate, hydroxypropyl acrylate and methacrylate, hydroxybutyl acrylate and methacrylate and caprolactone or polycaprolactone esterified with above hydroxyalkyl acrylate and methacrylates. [0009]
  • The compositions according to the invention can optionally contain photoinitiators such as benzophenone, α, α-dimethoxy-α-phenylacetophenone, α, α-diethoxyacetophenone and alkyl benzoin ethers. [0010]
  • The compositions according to the invention can be applied to any type of substrate such as, for example, non porous substrates, such as glass, plastics and metals, and porous substrates, such as wood, paper and leather by any means known to those skilled in the art such as by spraying, dipping, brushing, etc. The compositions according to the invention can be cured by any type of radiation that is typically used such as high energy electrons (electron beams) and ultraviolet light. The compositions according to the invention can also be cured thermally in the presence of a free radical initiator such as benzoyl peroxide or azo-bisisobutyronitrile.[0011]
  • EXAMPLE 1
  • In a clean container weigh 61.0 parts (0.4066 equiv.) of tripropylene glycol diacrylate with an acrylate equivalent weight of 150 and add 7 parts (0.0722 equiv.) of VERSAMID® 140 (polyaminoamide based on Tallow oil fatty acid and its dimer polymer with triethylene tetramine) with an amine hydrogen equivalent of 97, with stirring. The resulting product mixture is added with 14 parts of mono[2-[(1-oxo-2-propenyl)oxy]ethyl]ester of butanedioic acid (made by addition reaction of one mole of succinic anhydride with one mole of hydroxyethylacrylate) and mixed thoroughly. The above mixture is combined with 5 parts of trimethylolpropane triacrylate, 1 part of α, α-dimethoxy-α-phenylacetophenone and 5 parts of benzophenone to give a uniform composition with a viscosity of 160 cps. A 3 mil draw down of the above composition was applied over steel substrate and cured with UV light having energy of 0.668 joules/cm[0012] 2. The UV cured film was hard and slippery with excellent adhesion to the substrate.
  • EXAMPLE 2
  • [0013]
    Preparation of Liquid Polyaminoamide
    Charge:
    Dimerized fatty acid (EMPOL ® 10251) 580.6 gm(2.0 eq.)
    Piperazine 135.4 gm(3.2 eq.).
  • Dimerized fatty acid and piperazine are added in a reaction kettle and heated to 227° C. for one hour and a vacuum of 15 mm Hg is applied for three hours to remove the water of reaction. A reaction carried out in this manner should produce a polyamide resin having an amine value of about 67 mg KOH/gm. [0014]
  • EXAMPLE 3
  • [0015]
    Reaction of Polyamide with diacrylate of butanedioldiglycidylether
    Charge
    1. Butanediololdiglycidylether 20.2 gm(0.2 eq.)
    Acrylic acid 14.4 gm(0.2 eq.)
    Triphenylphosphine  0.1 gm
    Hydroquinone monomethylether  0.1 gm
    2. Polyamide from Example 1 83.7 gm(0.1 eq.)
  • Butanediol diglycidylether, triphenylphosphine and hydroquinone monomethyl ether is charged in a resin kettle and heated to 45° C. Acrylic acid is added over time by maintaining the reaction temperature below 80° C. The above reaction mixture is kept at 80-90° C. until the acid value is below 5 and all of the epoxide is reacted. The resulting diacrylate is cooled to 45° C. and added with charge 2. Once the exotherm is subsided, the reaction mixture is heated to 80° C. and kept at this temperature until all of the polyamide is reacted. A reaction carried out in this manner should produce a polyamide-acrylate resin that is a liquid at room temperature. [0016]
  • EXAMPLE 4
  • [0017]
    Reaction of Polyamide with acrylic acid-methacrylic acid adduct of
    butanedioldiglycidylether
    Charge
    1. Butanedioldiglycidylether 20.2 gm(0.2 eq.)
    Acrylic acid  7.2 gm(0.1 eq.)
    Methacrylic acid  8.4 gm(0.1 eq.)
    Triphenylphosphine  0.1 gm
    Hydroquinone monomethylether  0.1 gm
    2. Polyamide from Example 1 83.7 gm(0.1 eq.)
  • Charge 1 is added to the reaction kettle and reacted to produce the adducts of butanedioldiglycidylether containing both acrylate and methacrylate functionalities using conditions described in example 3. The above adduct is reacted with the Polyamide. A reaction carried out in this manner should produce a polyamide-methacrylate resin that is a liquid at room temperature. [0018]
  • EXAMPLE 5
  • [0019]
    Reaction of Polyamide with GMA-Acrylic acid adduct
    Charge:
    1. Glycidylmethacrylate 14.2 gm(0.1 eq.)
    Triphenyl phosphine  0.1 gm
    Hydroquinone monomethylether  0.1 gm
    2. Acrylic acid  7.2 gm(0.1 eq.)
    3. Polyamide from Example 1 83.7 gm(0.1 eq.)
  • Charge 1 is added to a reaction kettle and heated to 40-45° C. Charge 2 is added over time by keeping the reaction temperature below 80° C. due to exotherm. Reaction is continued at 80-90° C. until all of GMA is reacted. The resulting GMA-acrylic acid adduct is cooled to 40-50° C. and added with charge 3 over time by keeping the reaction mixture below 80° C. After the addition of charge 3, the reaction mixture is kept at 80-90° C. to complete the amine-acrylate addition reaction. A reaction carried out in this manner should produce a polyamide-acrylate resin that is a liquid at room temperature. [0020]
  • EXAMPLE 6
  • [0021]
    Reaction of Polyamide with glycidyl methacrylate
    Charge:
    Glycidyl methacrye(GMA)1 14.2 gm(0.1 eq.)
    Polyamide from Example 1 83.7 gm(0.1 eq.)
    Triphenylphosphine  0.1 gm
    Hydroquinone monomethylether  0.1 gm
  • Polyamide resin, triphenylphosphine and hydroquinone monomethylether are added in a reaction kettle and heated to 60° C. GMA is added to the kettle over time by keeping the temperature below 80° C. Reaction mixture is kept at 80° C. until all of the epoxide group from GMA is reacted. The resulting polyamide-methacrylate resin solution is cooled to 60° C. and poured out. A reaction carried out in this manner should produce a polyamide-methacrylate resin that is a liquid at room temperature. [0022]
  • EXAMPLE 7
  • [0023]
    Reaction of Polyamide with monomethacrylate of
    butanedioldiglycidylether
    Charge
    1. Butanedioldiglycidylether 20.2(0.2 eq.)
    Methacrylic acid  8.4(0.1 eq.)
    Triphenylphosphine  0.1 gm
    Hydroquinone monomethylether  0.1 gm
    2. Polyamide from Example 1 83.7 gm(0.1 eq.)
  • Charge 1 is reacted using conditions as in example 5 to produce mono methacrylate of butanedioldiglycidylether. The monomethacrylate is reacted with the Polyamide. A reaction carried out in this manner should produce a polyamide-methacrylate resin that is a liquid at room temperature. [0024]
  • EXAMPLE 8
  • [0025]
    Reaction of Polyamide with urethane diacrylate
    Charge
    1. Isophorone diisocyanate1 22.2. gm(0.2 eq.)
    Tone M-1002 (hydroxy functional acrylate) 68.8 gm(0.2 eq)
    Dibutytindilaurate  0.1 gm
    Hydroquinone monomethylether  0.1 gm
    2. Polyamide from Example 1 83.7 gm(0.1 eq.)
  • Urethane diacrylate is made by heating the charge 1 in a reaction kettle to 80° C. and holding the reaction mixture at that temp. until all of the isocyanates are reacted. The resulting product, urethane diacrylate is cooled to 60° C. and added and reacted with Polyamide. A reaction carried out in this manner should produce a polyamide-acrylate resin that is a liquid at room temperature. [0026]
  • EXAMPLE 9
  • [0027]
    Reaction of polyamide with isocyanate functional methacrylate monomer
    Charge
    1. Isophorone diisocyanate 22.2 gm(0.2eq)
    Hydroxyethyl methacrylate 13.0(0.1 eq.)
    Dibutyltindilaurate  0.1 gm
    Hydroquinone monomethylether  0.1 gm
    2. Polyamide from Example 1 83.7 gm(0.1 eq.)
  • First half of the isocyanate in Isophorone diisocyanate is reacted with hydroxyethyl methacrylate using conditions described in Example 8. The resulting isocyanate functional urethane methacrylate is reacted with Polyamide to produce polyamide-methacrylate resin. [0028]
  • EXAMPLE 10
  • A polyamide resin is prepared in a resin kettle from a mixture of 81.09% by weight EMPOL® 1025 Dimer Acid (hydrogenated dimerized fatty acid mixture available from Cognis Corporation), and 18.91% by weight piperazine. The mixture was refluxed for one hour before heating to 227° C. (440° F.) while collecting distillate. Material was held at 227° C. for one hour under nitrogen flow and then three hours at the same temperature under a vacuum of 15 mm Hg. The resulting product was a viscous liquid with an Mn value of 1570 and a Mw value of 3660. The product titrated with HCl to bromocresol green end-point to show an amine value of 67 mg KOH/gram [0029]
  • EXAMPLE 11
  • A polyamide resin is prepared in a resin kettle from a mixture of 78.65% by weight EMPOL® 1025 Dimer Acid (hydrogenated dimerized fatty acid mixture available from Cognis Corporation), 12.18% 1,2-cyclohexanediamine, and 9.17% by weight piperazine. The mixture was refluxed for one hour before heating to 227° C. (440° F.) while collecting distillate. Material was held at 227° C. for one hour under nitrogen flow and then three hours at the same temperature under a vacuum of 15 mm Hg. The resulting product was a viscous liquid. The product titrated with HCI to bromocresol green end-point to show an amine value of 56 mg KOH/gram. [0030]
  • EXAMPLE 12
  • A polyamide resin is prepared in a resin kettle from a mixture of 82.88% by weight EMPOL® 1061 (distilled dimerized fatty acid mixture available from Cognis Corporation), 5.46% ethylenediamine, and 11.66% by weight piperazine. The mixture was refluxed for one hour before heating to 227° C. (440° F.) while collecting distillate. Material was held at 227° C. for one hour under nitrogen flow and then three hours at the same temperature under a vacuum of 15 mm Hg. The resulting product was a slightly tacky solid. The product titrated with HCl to bromocresol green end-point to show an amine value of 49.2 mg KOH/gram. The amid-amine resin had an Mn of 1930 and an Mw of 4030 by GPC. A solution was prepared containing 50% resin solids, 1% water, and 49% 2-propanol. [0031]
  • EXAMPLE 13
  • A polyamide resin is prepared in a resin kettle from a mixture of 76.02% by weight EMPOL® 1061 Dimer Acid (distilled dimerized fatty acid mixture available from Cognis Corporation), 7.62% ethylenediamine, and 16.36% by weight aminoethyl-piperazine. The mixture was refluxed for one hour before heating to 227° C. (440° F.) while collecting distillate. Material was held at 227° C. for one hour under nitrogen flow and then three hours at the same temperature under a vacuum of 15 mm Hg. The resulting product was a slightly tacky solid. The product titrated with HCI to bromocresol green end-point to show an amine value of 112 mg KOH/gram. The amido-amine resin had an Mn of 1410 and an Mw of 2000 by GPC. A solution was prepared containing 64.3% resin solids and 35.7% 2-propanol. [0032]
  • EXAMPLE 14
  • A polyamide resin is prepared in a resin kettle from a mixture of 63.88% by weight EMPOL® 1061 (distilled dimerized fatty acid mixture available from Cognis Corporation) and 36.12% by weight isophorone diamine. The mixture was refluxed for one hour before heating to 227° C. (440° F.) while collecting distillate. Material was held at 227° C. for one hour under nitrogen flow and then three hours at the same temperature under a vacuum of 15 mm Hg. The resulting product was an amber solid. The product titrated with HCl to bromocresol green end-point to show an amine value of 79.2 mg KOH/gram. The amido-amine resin had an Mn of 1770 and an Mw of 2680 by GPC. A solution was prepared containing 74% resin. [0033]
  • EXAMPLE 15
  • 81.6 grams of resin/2-propanol solution from example 14 was mixed with 7.99 grams maleic anhydride and 12.75 grams toluene. The product titrated with HCI to bromocresol green end-point to show an amine value of <0.2 mg KOH/gram. The resin solution was titrated with ethanolic KOH to a phenophthalein end-point to show an acid value of 68.2 mg KOH/gram based on resin solids. The resulting maleic amide-acid terminated resin had an Mn of 1700 and an Mw of 2770 by GPC. [0034]
  • EXAMPLE 16
  • 81.6 grams of resin/2-propanol solution from example 14 was mixed with 7.99 grams maleic anhydride and 12.75 grams toluene. The product titrated with HCl to bromocresol green end-point to show an amine value of <0.2 mg KOH/gram. The resin solution was titrated with ethanolic KOH to a phenophthalein end-point to show an acid value of 68.2 mg KOH/gram. The resulting maleic amide-acid terminated resin had an Mn of 1700 and an Mw of 2770 by GPC. [0035]
  • EXAMPLE 17
  • 92.74 grams of viscous liquid resin from Example 11 was dissolved in 30 grams toluene and then mixed with 9.05 grams maleic anhydride. [0036]
  • EXAMPLE 18
  • 73.92 grams of resin/2-propanol solution from Example 13 was mixed with 16.35 grams glycidyl methacrylate (from Dow Chemical Co). The resin solution was heated to 50° C. for 5 hours. [0037]
  • EXAMPLE 19
  • 99.84 grams of resin/2-propanol solution from Example 14 was mixed with 18.25 grams glycidyl methacrylate (from Dow Chemical Co). The resin solution was heated to 50° C. for 5 hours. [0038]
  • EXAMPLE 20
  • 81.79 grams of resin/2-propanol solution from Example 12 was mixed with 5.10 grams glycidyl methacrylate (from Dow Chemical Co). The resin solution was heated to 50° C. for 5 hours. [0039]
  • EXAMPLE 21
  • 106.56 grams of viscous liquid resin from Example 11 was dissolved in 30.50 grams toluene and then mixed with 15.10 grams glycidyl methacrylate (from Dow Chemical Co). The resin solution was heated to 50° C. for 5 hours. [0040]

Claims (12)

What is claimed is:
1. A liquid radiation-curable composition comprising the reaction product of an amine-terminated (poly)aminoamide and a mono-(meth)acrylate or a poly-(meth)acrylate.
2. The composition of claim 1 wherein the polyaminoamide is the reaction product a C36 dimer acid and triethylene tetramine.
3. The composition of claim 1 wherein the poly-(meth)acrylate is the diacrylate ester of butanedioldiglycidyl ether.
4. The composition of claim 1 wherein the poly-(meth)acrylate is an acrylate-methacrylate ester of butanedioldiglycidyl ether.
5. The composition of claim 1 wherein the poly-(meth)acrylate is the reaction product of acrylic acid and glycidylmethacrylate.
6. The composition of claim 1 wherein the mono-(meth)acrylate is glycidylmethacrylate.
7. The composition of claim 1 wherein the mono-(meth)acrylate is the monomethacrylate of butanedioldiglycidyl ether.
8. The composition of claim 1 wherein the poly-(meth)acrylate is a (meth)acrylate-terminated urethane.
9. The composition of claim 1 further comprising an acid functional (meth)acrylate.
10. The composition of claim 9 wherein the acid functional (meth)acrylate is the reaction product of a dicarboxylic acid anhydride and acrylic or methacrylic acid.
11. A composition comprised of a substrate and a composition of claim 1.
12. The composition of claim 10 wherein the substrate is selected from the group consisting of glass, plastic, metal, wood, paper and leather.
US10/243,013 2001-10-04 2002-09-13 Radiation curable compositions with enhanced adhesion Expired - Lifetime US6809127B2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
US10/243,013 US6809127B2 (en) 2001-10-04 2002-09-13 Radiation curable compositions with enhanced adhesion
DE60228745T DE60228745D1 (en) 2001-10-04 2002-10-02 BY IRRADIATION HARDENABLE COMPOSITIONS WITH IMPROVED ADHESION
AT02776100T ATE407002T1 (en) 2001-10-04 2002-10-02 RADIATION-CURABLE COMPOSITIONS WITH IMPROVED ADHESION
EP02776100A EP1439951B1 (en) 2001-10-04 2002-10-02 Radiation curable compositions with enhanced adhesion
PCT/US2002/031532 WO2003028992A1 (en) 2001-10-04 2002-10-02 Radiation curable compositions with enhanced adhesion
ES02776100T ES2312628T3 (en) 2001-10-04 2002-10-02 CURABLE COMPOSITIONS BY RADIATION WITH IMPROVED ADHESION.
TW91122820A TWI273119B (en) 2001-10-04 2002-10-03 Radiation curable compositions with enhanced adhesion

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US32697801P 2001-10-04 2001-10-04
US10/243,013 US6809127B2 (en) 2001-10-04 2002-09-13 Radiation curable compositions with enhanced adhesion

Publications (2)

Publication Number Publication Date
US20030073756A1 true US20030073756A1 (en) 2003-04-17
US6809127B2 US6809127B2 (en) 2004-10-26

Family

ID=26935514

Family Applications (1)

Application Number Title Priority Date Filing Date
US10/243,013 Expired - Lifetime US6809127B2 (en) 2001-10-04 2002-09-13 Radiation curable compositions with enhanced adhesion

Country Status (7)

Country Link
US (1) US6809127B2 (en)
EP (1) EP1439951B1 (en)
AT (1) ATE407002T1 (en)
DE (1) DE60228745D1 (en)
ES (1) ES2312628T3 (en)
TW (1) TWI273119B (en)
WO (1) WO2003028992A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040152239A1 (en) * 2003-01-21 2004-08-05 Taiwan Semiconductor Manufacturing Co., Ltd. Interface improvement by electron beam process
WO2006067639A2 (en) * 2004-12-10 2006-06-29 Sun Chemical Limited Acrylated polyamides,their preparation and uses

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7871685B2 (en) * 2004-04-08 2011-01-18 Tdk Corporation Methods for producing optical recording medium and optical recording medium
US9623631B2 (en) * 2005-06-22 2017-04-18 Henkel IP & Holding GmbH Radiation-curable laminating adhesives
GB2429977A (en) * 2005-09-07 2007-03-14 Sun Chemical Ltd Acrylated polyamide containing printing inks
US20070269658A1 (en) * 2006-05-05 2007-11-22 Kondos Constantine A Solvent-borne coating compositions, related methods and substrates
WO2009049781A2 (en) * 2007-10-15 2009-04-23 Cognis Ip Management Gmbh Acrylated polyaminoamides (ii)
US11972948B2 (en) 2018-06-13 2024-04-30 Brewer Science, Inc. Adhesion layers for EUV lithography
FR3111902B1 (en) 2020-06-30 2023-03-10 Arkema France (METH)ACRYLATE FUNCTIONALIZED AMIDE-CONTAINING OLIGOMERS

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4141867A (en) * 1976-08-17 1979-02-27 Deutsche Texaco Aktiengesellschaft Cold cross-linking dispersion adhesive
US5019608A (en) * 1987-07-30 1991-05-28 Lord Corporation Rubber-modified epoxy adhesive compositions
US5180792A (en) * 1990-02-21 1993-01-19 Koei Chemical Co., Ltd. Amine-cured epoxy resin with phenoxyethyl (meth) acrylates

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4975498A (en) * 1988-12-14 1990-12-04 Union Camp Corporation Thermally-curable aminoamide acrylate polymer
US4987160A (en) 1989-01-31 1991-01-22 Union Camp Corporation Radiation-curable aminoamide acrylate polymer
DE4130834A1 (en) 1991-09-17 1993-03-18 Roehm Gmbh PLASTISOL SYSTEMS WITH IMPROVED LIABILITY
DE4134081A1 (en) 1991-10-15 1993-04-22 Schering Ag METHOD FOR PRODUCING LATENT HARDENERS FOR EPOXY RESINS AND THE USE THEREOF
IT1277088B1 (en) * 1995-12-14 1997-11-04 Roofing Italiana S R L PROCEDURE FOR THE RAPID REMOVING OF PLASTIC PRODUCTS OBTAINED BY MOLDING
US5889076A (en) 1996-04-08 1999-03-30 Henkel Corporation Radiation curable rheology modifiers
US5804671A (en) 1996-04-08 1998-09-08 Henkel Corporation Radiation curable rheology modifiers

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4141867A (en) * 1976-08-17 1979-02-27 Deutsche Texaco Aktiengesellschaft Cold cross-linking dispersion adhesive
US5019608A (en) * 1987-07-30 1991-05-28 Lord Corporation Rubber-modified epoxy adhesive compositions
US5180792A (en) * 1990-02-21 1993-01-19 Koei Chemical Co., Ltd. Amine-cured epoxy resin with phenoxyethyl (meth) acrylates

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040152239A1 (en) * 2003-01-21 2004-08-05 Taiwan Semiconductor Manufacturing Co., Ltd. Interface improvement by electron beam process
WO2006067639A2 (en) * 2004-12-10 2006-06-29 Sun Chemical Limited Acrylated polyamides,their preparation and uses
WO2006067639A3 (en) * 2004-12-10 2006-08-24 Sun Chemical Ltd Acrylated polyamides,their preparation and uses
US20090306242A1 (en) * 2004-12-10 2009-12-10 Derek Ronald Illsley Acrylated polyamides
US8476334B2 (en) * 2004-12-10 2013-07-02 Sun Chemical Corporation Acrylated polyamides

Also Published As

Publication number Publication date
EP1439951A1 (en) 2004-07-28
US6809127B2 (en) 2004-10-26
EP1439951A4 (en) 2005-07-27
WO2003028992A1 (en) 2003-04-10
EP1439951B1 (en) 2008-09-03
ES2312628T3 (en) 2009-03-01
ATE407002T1 (en) 2008-09-15
TWI273119B (en) 2007-02-11
DE60228745D1 (en) 2008-10-16

Similar Documents

Publication Publication Date Title
US5334455A (en) Free-radical curable compositions
US6239189B1 (en) Radiation-polymerizable composition and printing inks containing same
US11396491B2 (en) Monofunctional or multifunctional urethane acrylate oligomers without isocyanates
US5418016A (en) Coating process using radiation curable compositions
EP0007747B1 (en) Radiation-curable coating compositions and method of coating metal substrates therewith
US5281682A (en) Radiation curable compositions and method of use
US6809127B2 (en) Radiation curable compositions with enhanced adhesion
JPH07278242A (en) Radiation-curable aqueous binder dispersion
EP0235704A2 (en) Carboxyl-terminated lactone acrylates
EP0735076B1 (en) Process for the production of star-like or comb-like branched aliphatic polyamino compound and curable resin composition
US4581436A (en) Heat-curable composition
CA3054199A1 (en) Compounds containing cyclic structural elements, urethane / ureido linkages and a free radical-polymerizable functional group
US8334352B2 (en) Branched polyesteramine acrylate
US5011560A (en) Method of adhesion and composition therefor
US4183796A (en) Radiation curable oligomers based on tris(2-hydroxyethyl) isocyanurate
FI69090C (en) MED UV-LJUS HAERDBARA BELAEGGNINGSKOMPOSITIONER
US5900472A (en) Copolymerizable benzophenone photoinitiators
JP3400452B2 (en) Addition products, radiation-curable coating compositions based on the addition products, and their use for wood and paper coatings
NO156205B (en) UV-CARDABLE COATING AGENT.
GB2131026A (en) Modified epoxy (meth) acrylate resin and hardenable resin composition containing the same
WO1999010409A1 (en) Radiation-polymerizable composition and printing inks containing same
US5340653A (en) Free-radical curable compositions comprising vinyl ether and urethane malenate compounds
US4579931A (en) Heat-curable composition
CA2032977A1 (en) Photo-curable urethane-containing compositions
JP2842899B2 (en) Photocurable resin composition

Legal Events

Date Code Title Description
AS Assignment

Owner name: COGNIS CORPORATION (COGNIS CORP.), PENNSYLVANIA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:DONES, MIGUEL A.;NATESH, ANBAZHAGAN;HAILE, DANIEL;AND OTHERS;REEL/FRAME:013299/0876

Effective date: 20021206

STCF Information on status: patent grant

Free format text: PATENTED CASE

FPAY Fee payment

Year of fee payment: 4

AS Assignment

Owner name: COGNIS IP MANAGEMENT GMBH,GERMANY

Free format text: PATENT AND TRADEMARK TRANSFER AGREEMENT;ASSIGNOR:COGNIS CORPORATION;REEL/FRAME:024023/0366

Effective date: 20041231

Owner name: COGNIS IP MANAGEMENT GMBH, GERMANY

Free format text: PATENT AND TRADEMARK TRANSFER AGREEMENT;ASSIGNOR:COGNIS CORPORATION;REEL/FRAME:024023/0366

Effective date: 20041231

AS Assignment

Owner name: IGM GROUP B.V., NETHERLANDS

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:COGNIS IP MANAGEMENT GMBH;REEL/FRAME:025794/0736

Effective date: 20110127

FPAY Fee payment

Year of fee payment: 8

SULP Surcharge for late payment

Year of fee payment: 7

FPAY Fee payment

Year of fee payment: 12