US20020079307A1 - Alignment apparatus of the substrate for lcd - Google Patents
Alignment apparatus of the substrate for lcd Download PDFInfo
- Publication number
- US20020079307A1 US20020079307A1 US09/740,832 US74083200A US2002079307A1 US 20020079307 A1 US20020079307 A1 US 20020079307A1 US 74083200 A US74083200 A US 74083200A US 2002079307 A1 US2002079307 A1 US 2002079307A1
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- US
- United States
- Prior art keywords
- substrate
- pins
- lift
- acceptance
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133354—Arrangements for aligning or assembling substrates
Definitions
- the present invention relates to an alignment apparatus for use in a manufacturing process of a liquid crystal display (LCD) device, and more particularly, for the substrate.
- LCD liquid crystal display
- a manufacturing process of the LCD device includes many steps (such as a cleaning process, a layer-depositing process and a developing process) to fabricate various elements on the substrate After the above-mentioned processes drying processes are needed individually. Robot arms move a substrate in each process-to-process stage and then the substrate is aligned into the alignment apparatus.
- FIG. 1 is a plan view of a conventional alignment apparatus.
- a substrate 5 is positioned over a table 2 of the alignment apparatus.
- a couple of guide pins 1 are located on the peripheral portion of the table 2 near each corner of the substrate 5 to set the substrate 5 in the alignment apparatus.
- FIGS. 2A and 2B are cross-sectional views taken, along line II-II of FIG. 1.
- the substrate 5 is located on the lift pins 3 by the robot arm (not shown).
- the substrate 5 is aligned in the determined area defined by the guide pins 1 .
- Proximity pins 4 for holding the substrate above the table 2 is positioned between the substrate 5 and the table 2 .
- the proximity pins 4 have the length of about 0.2 mm from the surface of the table 2 .
- the substrate 5 when descending the substrate 5 in the conventional alignment apparatus, the substrate 5 can be misaligned owing to the guide pins 1 . Namely, the substrate 5 is not positioned properly in the determined area defined by the guide pins 1 .
- the reason of the misalignment between the substrate 5 and the table 2 is not only that the dynamic error occurs when the robot arm carries the substrate 5 on the lift pins 3 but also that the lift pins 3 descend the substrate 5 without compensating for the dynamic error.
- the substrate 5 can be damaged or become stained in its contact surface to the guide pins 1 .
- a preferred embodiment of the present invention provides an alignment apparatus for use in manufacturing process of an LCD device, which has plural alignment pins.
- Another object of the present invention provides an alignment apparatus that prevents a misalignment between the substrate and the table so as to avoid the damage and the inferiority of the substrate.
- the preferred embodiment of the present invention provides an alignment apparatus, including: a table; guide means positioned on a peripheral portion of the table; acceptance means surrounded by the guide means; lift means positioned on the table and moving between under the acceptance means and over the end portion of the guide means; transport means carrying a substrate on the lift means when the lift means are projected over the end portion of the guide means; means for shifting the lift means into the acceptance means and for setting the substrate into the acceptance means; and position-compensating means preventing the substrate from being positioned on the guide means.
- the position-compensating means moves through reciprocation by the determined distance in a tranverss direction parallel to the table plane. And the position-compensating means is projected through the table and perpendicular to the table, and is driven by a cylinder. The position-compensating means also moves from the peripheral portion to the edge of the acceptance means to align the substrate when the lift means is positioned over the end portion of the guide means.
- An alignment apparatus wherein the acceptance means includes the protruded portion on its surface.
- FIG. 1 is a plan view of a conventional alignment apparatus
- FIGS. 2A and 2B are cross-sectional views taken along line II-II of FIG. 1 and illustrate an alignment step
- FIG. 3 is a cross-sectional view illustrating the misalignment of the substrate on the table according to the conventional art
- FIG., 4 is a plan view of an alignment apparatus according to an embodiment of the present invention.
- FIG. 5 is a cross-sectional view taken line V-V of FIG. 4 and illustrates an operating state of the alignment apparatus according to the embodiment of the present invention.
- FIG. 6 is a cross-sectional view taken line V-V of FIG. 4 and illustrates another operating state of the alignment apparatus according to the embodiment of the present invention.
- FIG. 4 is a plan view of an alignment apparatus according to an embodiment of the present invention
- a couple of guide pins 101 are located on a table 102 of the alignment apparatus at each corner of a determined area 110 .
- the determined area 110 is defined by the guide pins 101 as a central portion of the table and will align a substrate thereinto.
- a plurality of the alignment pins 106 is located in peripheral portion of the table 102 .
- the table 102 has a plurality of passages 109 in the peripheral portion thereof; through which the alignment pins 106 can move.
- proximity pins 104 for holding a substrate 5 above the table 102 is positioned on the table 2 between the substrate 5 and the table 102 .
- the proximity pins 104 have the length of about 0.2 mm and are protruded from the surface of the table 102 .
- the table 102 includes the hot-plate (not shown) having a high temperature.
- a plurality of lift pins 103 are positioned on the table 102 while holding the substrate 5 .
- the lift pins 103 can move through reciprocation between the inner part of the table 102 and the height of over the guide pins 101 (see FIG. 4).
- a cylinder 107 is installed under the table 102 to drive a pluriality of, movable arms 105 .
- the alignment pins 106 are perpendicularly connected to the movable arms 105 .
- the alignment pins 106 can move in a transverse direction through the passages 109 when the cylinder 107 drives the movable arms 105 .
- the distance “d” in which the alignment pins 106 can move is defined by the passage 109 , i.e., from, the edge 108 of the determined area 110 (see FIG. 4) to the peripheral portion of the table 102 .
- the reciprocation range of the alignment pins 106 can be defined by the distance “d”.
- the substrate 5 is located on the lift pins 103 by the robot arm (not shown) when the lift pins 103 are projected from the inner part of the table 102 in a height of over the guide pins 101 (see FIG. 4). If the substrate 5 is misaligned, it can be adjusted into the determined area 110 (see FIG. 4) by the alignment pins 106 which are connected to the movable arms 105 and driven by the cylinder 107 .
- the substrate 5 is pushed onto the lift pins 103 by the alignment pins 106 when the lift pins 103 are in a state of projection. And then the substrate 5 is adjusted on the proximity pins 104 by the descent of the lift pins 103 .
- the alignment apparatus can set the substrate 5 in the determined area 110 defined by the guide pins 101 .
- the substrate 5 then becomes dry by using the drying process. After the drying process, the lift pins 103 lift up the substrate 5 and the robot arm (not shown) can carry the substrate 5 for another process.
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
- 1. Field of the invention
- The present invention relates to an alignment apparatus for use in a manufacturing process of a liquid crystal display (LCD) device, and more particularly, for the substrate.
- 2. Description of Related Art
- In general, a manufacturing process of the LCD device includes many steps (such as a cleaning process, a layer-depositing process and a developing process) to fabricate various elements on the substrate After the above-mentioned processes drying processes are needed individually. Robot arms move a substrate in each process-to-process stage and then the substrate is aligned into the alignment apparatus.
- A conventional alignment apparatus employed in, a drying process will be explained hereinafter as one example with the accompanying drawings.
- FIG. 1 is a plan view of a conventional alignment apparatus. A
substrate 5 is positioned over a table 2 of the alignment apparatus. A couple ofguide pins 1 are located on the peripheral portion of the table 2 near each corner of thesubstrate 5 to set thesubstrate 5 in the alignment apparatus. - FIGS. 2A and 2B are cross-sectional views taken, along line II-II of FIG. 1. As shown in FIG. 2A, the
substrate 5 is located on thelift pins 3 by the robot arm (not shown). When thelift pins 3 are going down to the table 2 of the alignment apparatus, as shown in FIG. 2B, thesubstrate 5 is aligned in the determined area defined by theguide pins 1. Proximity pins 4 for holding the substrate above the table 2 is positioned between thesubstrate 5 and the table 2. The proximity pins 4 have the length of about 0.2 mm from the surface of the table 2. When thesubstrate 5 is in contact with and positioned on the proximity pins 4 by a descent of thelift pins 3, thesubstrate 5 becomes dry by a hot-plate (not shown) having a high temperature. - However, as shown in FIG. 3, when descending the
substrate 5 in the conventional alignment apparatus, thesubstrate 5 can be misaligned owing to theguide pins 1. Namely, thesubstrate 5 is not positioned properly in the determined area defined by theguide pins 1. - The reason of the misalignment between the
substrate 5 and the table 2 is not only that the dynamic error occurs when the robot arm carries thesubstrate 5 on thelift pins 3 but also that thelift pins 3 descend thesubstrate 5 without compensating for the dynamic error. In the case of misalignment, thesubstrate 5 can be damaged or become stained in its contact surface to theguide pins 1. - In order to overcome the problems described above, a preferred embodiment of the present invention provides an alignment apparatus for use in manufacturing process of an LCD device, which has plural alignment pins.
- Another object of the present invention provides an alignment apparatus that prevents a misalignment between the substrate and the table so as to avoid the damage and the inferiority of the substrate.
- In order to achieve the above objects, the preferred embodiment of the present invention provides an alignment apparatus, including: a table; guide means positioned on a peripheral portion of the table; acceptance means surrounded by the guide means; lift means positioned on the table and moving between under the acceptance means and over the end portion of the guide means; transport means carrying a substrate on the lift means when the lift means are projected over the end portion of the guide means; means for shifting the lift means into the acceptance means and for setting the substrate into the acceptance means; and position-compensating means preventing the substrate from being positioned on the guide means.
- The position-compensating means moves through reciprocation by the determined distance in a tranverss direction parallel to the table plane. And the position-compensating means is projected through the table and perpendicular to the table, and is driven by a cylinder. The position-compensating means also moves from the peripheral portion to the edge of the acceptance means to align the substrate when the lift means is positioned over the end portion of the guide means.
- An alignment apparatus, wherein the acceptance means includes the protruded portion on its surface.
- It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.
- For a more complete understanding of the present invention and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:
- FIG. 1 is a plan view of a conventional alignment apparatus;
- FIGS. 2A and 2B are cross-sectional views taken along line II-II of FIG. 1 and illustrate an alignment step;
- FIG. 3 is a cross-sectional view illustrating the misalignment of the substrate on the table according to the conventional art;
- FIG.,4 is a plan view of an alignment apparatus according to an embodiment of the present invention;
- FIG. 5 is a cross-sectional view taken line V-V of FIG. 4 and illustrates an operating state of the alignment apparatus according to the embodiment of the present invention; and
- FIG. 6 is a cross-sectional view taken line V-V of FIG. 4 and illustrates another operating state of the alignment apparatus according to the embodiment of the present invention.
- Reference will now be made in detail to the preferred embodiment of the present invention, example of which is illustrated in the accompanying drawings.
- FIG. 4 is a plan view of an alignment apparatus according to an embodiment of the present invention, A couple of
guide pins 101 are located on a table 102 of the alignment apparatus at each corner of adetermined area 110. Thedetermined area 110 is defined by theguide pins 101 as a central portion of the table and will align a substrate thereinto. And a plurality of thealignment pins 106 is located in peripheral portion of the table 102. The table 102 has a plurality ofpassages 109 in the peripheral portion thereof; through which thealignment pins 106 can move. - As shown in FIGS. 5 and 6,
proximity pins 104 for holding asubstrate 5 above the table 102 is positioned on the table 2 between thesubstrate 5 and the table 102. Theproximity pins 104 have the length of about 0.2 mm and are protruded from the surface of the table 102. The table 102 includes the hot-plate (not shown) having a high temperature. A plurality oflift pins 103 are positioned on the table 102 while holding thesubstrate 5. Thelift pins 103 can move through reciprocation between the inner part of the table 102 and the height of over the guide pins 101 (see FIG. 4). Meanwhile, acylinder 107 is installed under the table 102 to drive a pluriality of,movable arms 105. And the lower end portions of thealignment pins 106 are perpendicularly connected to themovable arms 105. Thus, thealignment pins 106 can move in a transverse direction through thepassages 109 when thecylinder 107 drives themovable arms 105. - The distance “d” in which the
alignment pins 106 can move is defined by thepassage 109, i.e., from, theedge 108 of the determined area 110 (see FIG. 4) to the peripheral portion of the table 102. Hence, the reciprocation range of thealignment pins 106 can be defined by the distance “d”. - Meanwhile, the
substrate 5 is located on thelift pins 103 by the robot arm (not shown) when thelift pins 103 are projected from the inner part of the table 102 in a height of over the guide pins 101 (see FIG. 4). If thesubstrate 5 is misaligned, it can be adjusted into the determined area 110 (see FIG. 4) by thealignment pins 106 which are connected to themovable arms 105 and driven by thecylinder 107. - As described above, the
substrate 5 is pushed onto thelift pins 103 by thealignment pins 106 when thelift pins 103 are in a state of projection. And then thesubstrate 5 is adjusted on theproximity pins 104 by the descent of thelift pins 103. Thus, the alignment apparatus can set thesubstrate 5 in thedetermined area 110 defined by theguide pins 101. Thesubstrate 5 then becomes dry by using the drying process. After the drying process, the lift pins 103 lift up thesubstrate 5 and the robot arm (not shown) can carry thesubstrate 5 for another process. - As described herein before, using the alignment pins of the alignment apparatus according to the preferred embodiment of the present invention, the damage of the substrate caused by the misalignment and the stain in the substrate can be prevented. Accordingly, the manufacturing yields increase.
- While the invention has been particularly shown and described with reference to first preferred embodiment thereof, it will be understood by those skilled in the art that the foregoing and other changes in form and details may be made therein without departing from the spirit and scope of the invention.
Claims (11)
Priority Applications (1)
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US09/740,832 US6437296B1 (en) | 2000-12-21 | 2000-12-21 | Alignment apparatus of the substrate for LCD |
Applications Claiming Priority (1)
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US09/740,832 US6437296B1 (en) | 2000-12-21 | 2000-12-21 | Alignment apparatus of the substrate for LCD |
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US20020079307A1 true US20020079307A1 (en) | 2002-06-27 |
US6437296B1 US6437296B1 (en) | 2002-08-20 |
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US09/740,832 Expired - Lifetime US6437296B1 (en) | 2000-12-21 | 2000-12-21 | Alignment apparatus of the substrate for LCD |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US20090181593A1 (en) * | 2004-06-29 | 2009-07-16 | Kim Deuk Soo | Robot for transfer of glass |
CN102134004A (en) * | 2011-01-18 | 2011-07-27 | 东莞宏威数码机械有限公司 | Screw-rod positioning mechanism |
US20120227666A1 (en) * | 2011-03-09 | 2012-09-13 | Applied Materials, Inc. | Processing chamber and method for centering a substrate therein |
KR20140055056A (en) * | 2012-10-30 | 2014-05-09 | 엘지디스플레이 주식회사 | Apparatus for attaching substrate and method for manufacturing attached substrate using the same |
WO2016145806A1 (en) * | 2015-03-17 | 2016-09-22 | 京东方科技集团股份有限公司 | Substrate support pin, substrate support device and substrate picking and placing system |
CN108089378A (en) * | 2018-01-03 | 2018-05-29 | 惠科股份有限公司 | A kind of baking method, device and oven |
CN110291465A (en) * | 2017-02-14 | 2019-09-27 | Vat控股公司 | Pneumatic pin lifting device and pneumatic load lifting cylinder |
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KR100618576B1 (en) * | 2002-11-13 | 2006-08-31 | 엘지.필립스 엘시디 주식회사 | Dispenser of liquid crystal display panel and dispensing method using the same |
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KR101026935B1 (en) * | 2003-12-10 | 2011-04-04 | 엘지디스플레이 주식회사 | Apparatus for aligning dispenser and method thereof |
KR101003666B1 (en) * | 2003-12-10 | 2010-12-23 | 엘지디스플레이 주식회사 | Aligning apparatus |
TWI281833B (en) * | 2004-10-28 | 2007-05-21 | Kyocera Corp | Heater, wafer heating apparatus and method for manufacturing heater |
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090181593A1 (en) * | 2004-06-29 | 2009-07-16 | Kim Deuk Soo | Robot for transfer of glass |
US8236587B2 (en) * | 2004-06-29 | 2012-08-07 | Lg Display Co., Ltd. | Method of manufacturing a liquid crystal display module |
CN102134004A (en) * | 2011-01-18 | 2011-07-27 | 东莞宏威数码机械有限公司 | Screw-rod positioning mechanism |
US20120227666A1 (en) * | 2011-03-09 | 2012-09-13 | Applied Materials, Inc. | Processing chamber and method for centering a substrate therein |
US9371584B2 (en) * | 2011-03-09 | 2016-06-21 | Applied Materials, Inc. | Processing chamber and method for centering a substrate therein |
KR20140055056A (en) * | 2012-10-30 | 2014-05-09 | 엘지디스플레이 주식회사 | Apparatus for attaching substrate and method for manufacturing attached substrate using the same |
KR101963578B1 (en) * | 2012-10-30 | 2019-03-29 | 엘지디스플레이 주식회사 | Apparatus for Attaching Substrate and Method for Manufacturing Attached Substrate using the same |
WO2016145806A1 (en) * | 2015-03-17 | 2016-09-22 | 京东方科技集团股份有限公司 | Substrate support pin, substrate support device and substrate picking and placing system |
CN110291465A (en) * | 2017-02-14 | 2019-09-27 | Vat控股公司 | Pneumatic pin lifting device and pneumatic load lifting cylinder |
US11373896B2 (en) | 2017-02-14 | 2022-06-28 | Vat Holding Ag | Pneumatic pin lifting device and pneumatic lift cylinder |
CN108089378A (en) * | 2018-01-03 | 2018-05-29 | 惠科股份有限公司 | A kind of baking method, device and oven |
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