US20020079307A1 - Alignment apparatus of the substrate for lcd - Google Patents

Alignment apparatus of the substrate for lcd Download PDF

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Publication number
US20020079307A1
US20020079307A1 US09/740,832 US74083200A US2002079307A1 US 20020079307 A1 US20020079307 A1 US 20020079307A1 US 74083200 A US74083200 A US 74083200A US 2002079307 A1 US2002079307 A1 US 2002079307A1
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Prior art keywords
substrate
pins
lift
acceptance
guide
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US09/740,832
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US6437296B1 (en
Inventor
Hyun-Kue Choi
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LG Display Co Ltd
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LG Philips LCD Co Ltd
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Priority to US09/740,832 priority Critical patent/US6437296B1/en
Assigned to LG. PHILIPS LCD CO. LTD. reassignment LG. PHILIPS LCD CO. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHOI, HYUN KUE
Publication of US20020079307A1 publication Critical patent/US20020079307A1/en
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Assigned to LG DISPLAY CO., LTD. reassignment LG DISPLAY CO., LTD. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: LG.PHILIPS LCD CO., LTD.
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Expired - Lifetime legal-status Critical Current

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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133354Arrangements for aligning or assembling substrates

Definitions

  • the present invention relates to an alignment apparatus for use in a manufacturing process of a liquid crystal display (LCD) device, and more particularly, for the substrate.
  • LCD liquid crystal display
  • a manufacturing process of the LCD device includes many steps (such as a cleaning process, a layer-depositing process and a developing process) to fabricate various elements on the substrate After the above-mentioned processes drying processes are needed individually. Robot arms move a substrate in each process-to-process stage and then the substrate is aligned into the alignment apparatus.
  • FIG. 1 is a plan view of a conventional alignment apparatus.
  • a substrate 5 is positioned over a table 2 of the alignment apparatus.
  • a couple of guide pins 1 are located on the peripheral portion of the table 2 near each corner of the substrate 5 to set the substrate 5 in the alignment apparatus.
  • FIGS. 2A and 2B are cross-sectional views taken, along line II-II of FIG. 1.
  • the substrate 5 is located on the lift pins 3 by the robot arm (not shown).
  • the substrate 5 is aligned in the determined area defined by the guide pins 1 .
  • Proximity pins 4 for holding the substrate above the table 2 is positioned between the substrate 5 and the table 2 .
  • the proximity pins 4 have the length of about 0.2 mm from the surface of the table 2 .
  • the substrate 5 when descending the substrate 5 in the conventional alignment apparatus, the substrate 5 can be misaligned owing to the guide pins 1 . Namely, the substrate 5 is not positioned properly in the determined area defined by the guide pins 1 .
  • the reason of the misalignment between the substrate 5 and the table 2 is not only that the dynamic error occurs when the robot arm carries the substrate 5 on the lift pins 3 but also that the lift pins 3 descend the substrate 5 without compensating for the dynamic error.
  • the substrate 5 can be damaged or become stained in its contact surface to the guide pins 1 .
  • a preferred embodiment of the present invention provides an alignment apparatus for use in manufacturing process of an LCD device, which has plural alignment pins.
  • Another object of the present invention provides an alignment apparatus that prevents a misalignment between the substrate and the table so as to avoid the damage and the inferiority of the substrate.
  • the preferred embodiment of the present invention provides an alignment apparatus, including: a table; guide means positioned on a peripheral portion of the table; acceptance means surrounded by the guide means; lift means positioned on the table and moving between under the acceptance means and over the end portion of the guide means; transport means carrying a substrate on the lift means when the lift means are projected over the end portion of the guide means; means for shifting the lift means into the acceptance means and for setting the substrate into the acceptance means; and position-compensating means preventing the substrate from being positioned on the guide means.
  • the position-compensating means moves through reciprocation by the determined distance in a tranverss direction parallel to the table plane. And the position-compensating means is projected through the table and perpendicular to the table, and is driven by a cylinder. The position-compensating means also moves from the peripheral portion to the edge of the acceptance means to align the substrate when the lift means is positioned over the end portion of the guide means.
  • An alignment apparatus wherein the acceptance means includes the protruded portion on its surface.
  • FIG. 1 is a plan view of a conventional alignment apparatus
  • FIGS. 2A and 2B are cross-sectional views taken along line II-II of FIG. 1 and illustrate an alignment step
  • FIG. 3 is a cross-sectional view illustrating the misalignment of the substrate on the table according to the conventional art
  • FIG., 4 is a plan view of an alignment apparatus according to an embodiment of the present invention.
  • FIG. 5 is a cross-sectional view taken line V-V of FIG. 4 and illustrates an operating state of the alignment apparatus according to the embodiment of the present invention.
  • FIG. 6 is a cross-sectional view taken line V-V of FIG. 4 and illustrates another operating state of the alignment apparatus according to the embodiment of the present invention.
  • FIG. 4 is a plan view of an alignment apparatus according to an embodiment of the present invention
  • a couple of guide pins 101 are located on a table 102 of the alignment apparatus at each corner of a determined area 110 .
  • the determined area 110 is defined by the guide pins 101 as a central portion of the table and will align a substrate thereinto.
  • a plurality of the alignment pins 106 is located in peripheral portion of the table 102 .
  • the table 102 has a plurality of passages 109 in the peripheral portion thereof; through which the alignment pins 106 can move.
  • proximity pins 104 for holding a substrate 5 above the table 102 is positioned on the table 2 between the substrate 5 and the table 102 .
  • the proximity pins 104 have the length of about 0.2 mm and are protruded from the surface of the table 102 .
  • the table 102 includes the hot-plate (not shown) having a high temperature.
  • a plurality of lift pins 103 are positioned on the table 102 while holding the substrate 5 .
  • the lift pins 103 can move through reciprocation between the inner part of the table 102 and the height of over the guide pins 101 (see FIG. 4).
  • a cylinder 107 is installed under the table 102 to drive a pluriality of, movable arms 105 .
  • the alignment pins 106 are perpendicularly connected to the movable arms 105 .
  • the alignment pins 106 can move in a transverse direction through the passages 109 when the cylinder 107 drives the movable arms 105 .
  • the distance “d” in which the alignment pins 106 can move is defined by the passage 109 , i.e., from, the edge 108 of the determined area 110 (see FIG. 4) to the peripheral portion of the table 102 .
  • the reciprocation range of the alignment pins 106 can be defined by the distance “d”.
  • the substrate 5 is located on the lift pins 103 by the robot arm (not shown) when the lift pins 103 are projected from the inner part of the table 102 in a height of over the guide pins 101 (see FIG. 4). If the substrate 5 is misaligned, it can be adjusted into the determined area 110 (see FIG. 4) by the alignment pins 106 which are connected to the movable arms 105 and driven by the cylinder 107 .
  • the substrate 5 is pushed onto the lift pins 103 by the alignment pins 106 when the lift pins 103 are in a state of projection. And then the substrate 5 is adjusted on the proximity pins 104 by the descent of the lift pins 103 .
  • the alignment apparatus can set the substrate 5 in the determined area 110 defined by the guide pins 101 .
  • the substrate 5 then becomes dry by using the drying process. After the drying process, the lift pins 103 lift up the substrate 5 and the robot arm (not shown) can carry the substrate 5 for another process.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention discloses an alignment apparatus, including: a table; a plurality of guide pins positioned on a peripheral protion of the table; a determined area defined by the guide pins in the table; a plurality of lift pins positioned in the table and moving from the table to the height of over the guide pins; a plurality of proximity pins located on the table to hold the substrate when the lift pins are descended; a cylinder positioned under the table and driving a plurality of movable arms in a transverse direction; and a plurality of alignment pins extended from the movable arms in a longitudinal direction.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the invention [0001]
  • The present invention relates to an alignment apparatus for use in a manufacturing process of a liquid crystal display (LCD) device, and more particularly, for the substrate. [0002]
  • 2. Description of Related Art [0003]
  • In general, a manufacturing process of the LCD device includes many steps (such as a cleaning process, a layer-depositing process and a developing process) to fabricate various elements on the substrate After the above-mentioned processes drying processes are needed individually. Robot arms move a substrate in each process-to-process stage and then the substrate is aligned into the alignment apparatus. [0004]
  • A conventional alignment apparatus employed in, a drying process will be explained hereinafter as one example with the accompanying drawings. [0005]
  • FIG. 1 is a plan view of a conventional alignment apparatus. A [0006] substrate 5 is positioned over a table 2 of the alignment apparatus. A couple of guide pins 1 are located on the peripheral portion of the table 2 near each corner of the substrate 5 to set the substrate 5 in the alignment apparatus.
  • FIGS. 2A and 2B are cross-sectional views taken, along line II-II of FIG. 1. As shown in FIG. 2A, the [0007] substrate 5 is located on the lift pins 3 by the robot arm (not shown). When the lift pins 3 are going down to the table 2 of the alignment apparatus, as shown in FIG. 2B, the substrate 5 is aligned in the determined area defined by the guide pins 1. Proximity pins 4 for holding the substrate above the table 2 is positioned between the substrate 5 and the table 2. The proximity pins 4 have the length of about 0.2 mm from the surface of the table 2. When the substrate 5 is in contact with and positioned on the proximity pins 4 by a descent of the lift pins 3, the substrate 5 becomes dry by a hot-plate (not shown) having a high temperature.
  • However, as shown in FIG. 3, when descending the [0008] substrate 5 in the conventional alignment apparatus, the substrate 5 can be misaligned owing to the guide pins 1. Namely, the substrate 5 is not positioned properly in the determined area defined by the guide pins 1.
  • The reason of the misalignment between the [0009] substrate 5 and the table 2 is not only that the dynamic error occurs when the robot arm carries the substrate 5 on the lift pins 3 but also that the lift pins 3 descend the substrate 5 without compensating for the dynamic error. In the case of misalignment, the substrate 5 can be damaged or become stained in its contact surface to the guide pins 1.
  • SUMMARY OF THE INVENTION
  • In order to overcome the problems described above, a preferred embodiment of the present invention provides an alignment apparatus for use in manufacturing process of an LCD device, which has plural alignment pins. [0010]
  • Another object of the present invention provides an alignment apparatus that prevents a misalignment between the substrate and the table so as to avoid the damage and the inferiority of the substrate. [0011]
  • In order to achieve the above objects, the preferred embodiment of the present invention provides an alignment apparatus, including: a table; guide means positioned on a peripheral portion of the table; acceptance means surrounded by the guide means; lift means positioned on the table and moving between under the acceptance means and over the end portion of the guide means; transport means carrying a substrate on the lift means when the lift means are projected over the end portion of the guide means; means for shifting the lift means into the acceptance means and for setting the substrate into the acceptance means; and position-compensating means preventing the substrate from being positioned on the guide means. [0012]
  • The position-compensating means moves through reciprocation by the determined distance in a tranverss direction parallel to the table plane. And the position-compensating means is projected through the table and perpendicular to the table, and is driven by a cylinder. The position-compensating means also moves from the peripheral portion to the edge of the acceptance means to align the substrate when the lift means is positioned over the end portion of the guide means. [0013]
  • An alignment apparatus, wherein the acceptance means includes the protruded portion on its surface. [0014]
  • It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.[0015]
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • For a more complete understanding of the present invention and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which: [0016]
  • FIG. 1 is a plan view of a conventional alignment apparatus; [0017]
  • FIGS. 2A and 2B are cross-sectional views taken along line II-II of FIG. 1 and illustrate an alignment step; [0018]
  • FIG. 3 is a cross-sectional view illustrating the misalignment of the substrate on the table according to the conventional art; [0019]
  • FIG., [0020] 4 is a plan view of an alignment apparatus according to an embodiment of the present invention;
  • FIG. 5 is a cross-sectional view taken line V-V of FIG. 4 and illustrates an operating state of the alignment apparatus according to the embodiment of the present invention; and [0021]
  • FIG. 6 is a cross-sectional view taken line V-V of FIG. 4 and illustrates another operating state of the alignment apparatus according to the embodiment of the present invention.[0022]
  • DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
  • Reference will now be made in detail to the preferred embodiment of the present invention, example of which is illustrated in the accompanying drawings. [0023]
  • FIG. 4 is a plan view of an alignment apparatus according to an embodiment of the present invention, A couple of [0024] guide pins 101 are located on a table 102 of the alignment apparatus at each corner of a determined area 110. The determined area 110 is defined by the guide pins 101 as a central portion of the table and will align a substrate thereinto. And a plurality of the alignment pins 106 is located in peripheral portion of the table 102. The table 102 has a plurality of passages 109 in the peripheral portion thereof; through which the alignment pins 106 can move.
  • As shown in FIGS. 5 and 6, [0025] proximity pins 104 for holding a substrate 5 above the table 102 is positioned on the table 2 between the substrate 5 and the table 102. The proximity pins 104 have the length of about 0.2 mm and are protruded from the surface of the table 102. The table 102 includes the hot-plate (not shown) having a high temperature. A plurality of lift pins 103 are positioned on the table 102 while holding the substrate 5. The lift pins 103 can move through reciprocation between the inner part of the table 102 and the height of over the guide pins 101 (see FIG. 4). Meanwhile, a cylinder 107 is installed under the table 102 to drive a pluriality of, movable arms 105. And the lower end portions of the alignment pins 106 are perpendicularly connected to the movable arms 105. Thus, the alignment pins 106 can move in a transverse direction through the passages 109 when the cylinder 107 drives the movable arms 105.
  • The distance “d” in which the [0026] alignment pins 106 can move is defined by the passage 109, i.e., from, the edge 108 of the determined area 110 (see FIG. 4) to the peripheral portion of the table 102. Hence, the reciprocation range of the alignment pins 106 can be defined by the distance “d”.
  • Meanwhile, the [0027] substrate 5 is located on the lift pins 103 by the robot arm (not shown) when the lift pins 103 are projected from the inner part of the table 102 in a height of over the guide pins 101 (see FIG. 4). If the substrate 5 is misaligned, it can be adjusted into the determined area 110 (see FIG. 4) by the alignment pins 106 which are connected to the movable arms 105 and driven by the cylinder 107.
  • As described above, the [0028] substrate 5 is pushed onto the lift pins 103 by the alignment pins 106 when the lift pins 103 are in a state of projection. And then the substrate 5 is adjusted on the proximity pins 104 by the descent of the lift pins 103. Thus, the alignment apparatus can set the substrate 5 in the determined area 110 defined by the guide pins 101. The substrate 5 then becomes dry by using the drying process. After the drying process, the lift pins 103 lift up the substrate 5 and the robot arm (not shown) can carry the substrate 5 for another process.
  • As described herein before, using the alignment pins of the alignment apparatus according to the preferred embodiment of the present invention, the damage of the substrate caused by the misalignment and the stain in the substrate can be prevented. Accordingly, the manufacturing yields increase. [0029]
  • While the invention has been particularly shown and described with reference to first preferred embodiment thereof, it will be understood by those skilled in the art that the foregoing and other changes in form and details may be made therein without departing from the spirit and scope of the invention. [0030]

Claims (11)

What is claimed is:
1. An alignment apparatus, comprising:
a table;
guide means on a peripheral portion of the table;
acceptance means surrounded by the guide means;
lift means on the table, the lift means moving a lower part of the acceptance means or an upper part of the acceptance means;
transport means carrying a substrate on the lift means when the lift means is positioned on an upper part of the guide means;
means for shifting the lift means into the lower part of the acceptance means and setting the substrate into the acceptance means; and
position-compensating means preventing the substrate from the guide means.
2. An apparatus of claim 1, wherein the position-compensating means moves in a tranverse direction parallel to the table.
3. An apparatus of claim 1, wherein the position-compensating means moves an alternation motion.
4. the apparatus of claim 1, wherein the position-compensating means is projected perpendicular to the table.
5. The apparatus of claim 1, wherein the position-compensating means is driven by a cylinder.
6. The apparatus of claim 1, wherein the position-compensating means moves from the peripheral portion to the edge of the acceptance means when the list means is positioned over the end portion of the guide means.
7. An apparatus of claim 1, wherein the acceptance means includes an protruded portion on the surface.
8. The apparatus of claim 1, wherein the transport means includes a robot arms.
9. The apparatus of claim 1, wherein the table includes a hot-plates type.
10. The apparatus of claim 1, further comprising proximity pins holding the substrate.
11. The apparatus of claim 10, wherein the proximity pins maintain a gap between the table and the substrate.
US09/740,832 2000-12-21 2000-12-21 Alignment apparatus of the substrate for LCD Expired - Lifetime US6437296B1 (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090181593A1 (en) * 2004-06-29 2009-07-16 Kim Deuk Soo Robot for transfer of glass
CN102134004A (en) * 2011-01-18 2011-07-27 东莞宏威数码机械有限公司 Screw-rod positioning mechanism
US20120227666A1 (en) * 2011-03-09 2012-09-13 Applied Materials, Inc. Processing chamber and method for centering a substrate therein
KR20140055056A (en) * 2012-10-30 2014-05-09 엘지디스플레이 주식회사 Apparatus for attaching substrate and method for manufacturing attached substrate using the same
WO2016145806A1 (en) * 2015-03-17 2016-09-22 京东方科技集团股份有限公司 Substrate support pin, substrate support device and substrate picking and placing system
CN108089378A (en) * 2018-01-03 2018-05-29 惠科股份有限公司 A kind of baking method, device and oven
CN110291465A (en) * 2017-02-14 2019-09-27 Vat控股公司 Pneumatic pin lifting device and pneumatic load lifting cylinder

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JP3989384B2 (en) * 2003-02-07 2007-10-10 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
KR101026935B1 (en) * 2003-12-10 2011-04-04 엘지디스플레이 주식회사 Apparatus for aligning dispenser and method thereof
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TWI281833B (en) * 2004-10-28 2007-05-21 Kyocera Corp Heater, wafer heating apparatus and method for manufacturing heater
CN101086508B (en) * 2006-06-07 2010-05-12 瀚斯宝丽股份有限公司 Checking apparatus and its connector and checking method
CN101221045A (en) * 2007-01-12 2008-07-16 深圳富泰宏精密工业有限公司 Flexible positioning system
KR200472760Y1 (en) * 2012-07-26 2014-05-27 세메스 주식회사 Apparatus for supporting a tray
KR20140120641A (en) * 2013-04-04 2014-10-14 삼성디스플레이 주식회사 Film align device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4518848A (en) * 1981-05-15 1985-05-21 Gca Corporation Apparatus for baking resist on semiconductor wafers
US5854468A (en) * 1996-01-25 1998-12-29 Brooks Automation, Inc. Substrate heating apparatus with cantilevered lifting arm
US6051815A (en) * 1998-03-05 2000-04-18 Nec Corporation Apparatus for heat-treating substrate and method for separating the substrate from the apparatus
US6087632A (en) * 1999-01-11 2000-07-11 Tokyo Electron Limited Heat processing device with hot plate and associated reflector
US6315878B1 (en) * 1998-05-21 2001-11-13 Applied Materials, Inc. Substrate support and lift apparatus and method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4518848A (en) * 1981-05-15 1985-05-21 Gca Corporation Apparatus for baking resist on semiconductor wafers
US5854468A (en) * 1996-01-25 1998-12-29 Brooks Automation, Inc. Substrate heating apparatus with cantilevered lifting arm
US6051815A (en) * 1998-03-05 2000-04-18 Nec Corporation Apparatus for heat-treating substrate and method for separating the substrate from the apparatus
US6315878B1 (en) * 1998-05-21 2001-11-13 Applied Materials, Inc. Substrate support and lift apparatus and method
US6087632A (en) * 1999-01-11 2000-07-11 Tokyo Electron Limited Heat processing device with hot plate and associated reflector

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090181593A1 (en) * 2004-06-29 2009-07-16 Kim Deuk Soo Robot for transfer of glass
US8236587B2 (en) * 2004-06-29 2012-08-07 Lg Display Co., Ltd. Method of manufacturing a liquid crystal display module
CN102134004A (en) * 2011-01-18 2011-07-27 东莞宏威数码机械有限公司 Screw-rod positioning mechanism
US20120227666A1 (en) * 2011-03-09 2012-09-13 Applied Materials, Inc. Processing chamber and method for centering a substrate therein
US9371584B2 (en) * 2011-03-09 2016-06-21 Applied Materials, Inc. Processing chamber and method for centering a substrate therein
KR20140055056A (en) * 2012-10-30 2014-05-09 엘지디스플레이 주식회사 Apparatus for attaching substrate and method for manufacturing attached substrate using the same
KR101963578B1 (en) * 2012-10-30 2019-03-29 엘지디스플레이 주식회사 Apparatus for Attaching Substrate and Method for Manufacturing Attached Substrate using the same
WO2016145806A1 (en) * 2015-03-17 2016-09-22 京东方科技集团股份有限公司 Substrate support pin, substrate support device and substrate picking and placing system
CN110291465A (en) * 2017-02-14 2019-09-27 Vat控股公司 Pneumatic pin lifting device and pneumatic load lifting cylinder
US11373896B2 (en) 2017-02-14 2022-06-28 Vat Holding Ag Pneumatic pin lifting device and pneumatic lift cylinder
CN108089378A (en) * 2018-01-03 2018-05-29 惠科股份有限公司 A kind of baking method, device and oven

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