US20010046718A1 - Method and apparatus for reducing process-induced charge buildup - Google Patents
Method and apparatus for reducing process-induced charge buildup Download PDFInfo
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- US20010046718A1 US20010046718A1 US08/829,772 US82977297A US2001046718A1 US 20010046718 A1 US20010046718 A1 US 20010046718A1 US 82977297 A US82977297 A US 82977297A US 2001046718 A1 US2001046718 A1 US 2001046718A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0255—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using diodes as protective elements
Definitions
- This application relates to methods and apparatus for reduction of charge collection in semiconductor processing; and more particularly relates to the reduction of damage caused by process-induced charge collection in cell based arrays.
- the present invention substantially overcomes the limitations of the prior art by providing an extremely compact structure which dissipates charge collected during processing steps of semiconductor structures.
- the present invention is particularly suited to cell-based arrays, although it is also suited to other semiconductor devices.
- the present invention involves modification of the fabrication process to include providing a means for discharging the charge-collection structures identified in the prior art, while at the same time minimizing the amount of die area needed to achieve such results. More specifically, for a substrate of a first type, an area of a second type is deposited in a location suitable for connection to a charge collection structure to be fabricated in subsequent steps.
- the charge collector structure may be, for example, a polysilicon or metal run connected to a first gate and intended ultimately to connect to other structures, but left unconnected for a portion of the processing steps.
- the combination of a substrate of a first type and a deposition area of a second type can be seen to create a diode.
- the two structures may be connected by means of any of a plurality of local interconnect techniques.
- the diode permits charge to be dissipated during processing, but essentially has negligible effect on the operation of the finally-constructed circuit. In this way the antenna effect is minimized or eliminated, and yield is improved.
- the diode of the present invention is placed in a location which will eventually be a connecting pad.
- substantially the entire die area may be utilized for semiconductor structures implementing the overall circuit, while at the same time eliminating the antenna effect.
- the invention is particularly well-suited to complex integrated circuits such as cell-based arrays, but may be successfully implemented in a wide variety of circuit designs.
- FIG. 1 shows a transistor structure in which a gate is formed over an active area.
- FIG. 2 shows an implanted area positioned sufficiently near the transistor structure of FIG. 1 to minimize the antenna effect.
- FIG. 3A shows a first arrangement for connection of the implanted area to the transistor structure.
- FIG. 3B shows an alternative arrangement for connection of the implanted area to the transistor structure.
- FIG. 4 shows, in cross-section, a first form of local interconnect for connecting the implanted area to the charge collector structure.
- FIG. 5 shows in cross-section a second form of local interconnect for connecting the implanted area to the charge collector structure.
- FIG. 6 shows in cross-section a variation on the local interconnect technique shown in FIG. 5.
- FIG. 7 shows in plan view the implementation of the present invention in he drive and compute cells of a cell-based array.
- an active area 10 of a field effect transistor shown generally as 15 is shown positioned on a substrate 20 .
- the substrate 20 is formed of p-type silicon, while the active area 10 is formed by n+ implantation.
- the active area 10 is formed by n+ implantation.
- overlying the active area 10 is a thin gate structure 25 connecting a source and a drain.
- the gate structure 25 will, in many embodiments, essential bisect the active area 10 and is formed of a thin oxide.
- the thickness of the gate oxide may be less than 10 nm, and in at least some embodiments may be on the order of 7 nm.
- a connecting structure 30 for connecting the gate 20 of the transistor 15 to other structures in the circuit, for example other transistors.
- the connecting structure 30 is, in an exemplary embodiment, formed of polysilicon, although metal may also be used for such connecting structures.
- the connecting structure 30 may extend across multiple transistors and represents a relatively long run, thus providing the possibility of collection of charge during intermediate processing steps of the device. This collection of charge is commonly referred to as the antenna effect.
- FIGS. 2, 3A and 3 B show in plan view the new charge dissipation structure both before connection to the polysilicon (FIG. 2) and after (FIGS. 3A and 3B).
- an n+ area 35 (still assuming the substrate is p-type) is formed along the anticipated run of structure 30 at a point suitably close to the transistor 15 to dissipate any charge buildup on the structure 30 which might endanger the gate oxide 25 .
- the formation of this structure 35 must occur in the proper sequence during fabrication of the overall circuit of which transistor 15 is a part.
- the relevant processing steps can be described generally as follows, with particular reference to FIGS. 3 A- 3 B: the active areas 10 are formed initially, followed by formation of n-wells (for PMOS) and p-wells (for NMOS) which form the protection structures 35 of the present invention. Gate oxide is then formed, followed by removing the gate oxide from the structures 35 . The layer of polysilicon 30 is then deposited and doped to n+ conductivity, after which patterning and etching is completed.
- the structure 35 is positioned to minimize the impact of the present invention on the die area available for the intended circuit, and is connected to the gate 25 through a local interconnect portion 30 ′ which at least abuts the polysilicon 30 .
- the structure 35 may, for example, be formed at a location which will, when processing is completed, be directly beneath a connecting pad. This can be particularly appreciated from FIG. 3B, wherein the polysilicon is essentially congruent with the structure 35 .
- the polysilicon need not cover the entire structure 35 , as shown in FIG. 3A, and the polysilicon may be smaller or larger than the structure 35 with the primary goal being an optimization of reliability together with minimum wastage of the die area.
- Other locations will be acceptable in at least some embodiments, such as directly beneath the run 30 , for example is an open area not otherwise utilized by the circuit design.
- a first embodiment for connecting the structure 35 which is an n-well in this example, to the gate through a local interconnect technique.
- the active area 10 is shown in the p-type substrate 20 .
- Field oxide 40 is shown to isolate the active area 10 from an n-well 35 , with the actual distance between the two being determined by the circuit layout.
- a gate oxide 25 is grown over the active area 10 and n-well 35 by conventional processing steps. The oxide 25 is then removed from the n-well 35 , after which the polysilicon structure 30 is laid down over the gate oxide 25 and also connected to the n-well 35 by any suitable local interconnect technique, again indicated at 30 ′.
- the local interconnect may include extending the polysilicon run over the n-well 35 .
- the polysilicon 30 is typically doped n+ in an exemplary arrangement, and then patterned and etched by conventional methods.
- the polysilicon 30 can thus be seen to connect to the n+ implant 35 , thereby cooperating with the p-type substrate to form a diode for dissipation of charge from the polysilicon 30 until additional processing steps connect the polysilicon 30 to other transistor structures in the circuit.
- FIG. 5A shows the essential structure prior to addition of the local interconnect, including the substrate 15 , active area 10 , gate oxide 25 , n well 35 and field oxide 40 , with the polysilicon 30 extending over the gate oxide 25 in a conventional manner.
- the polysilicon gate structure 30 and n+ diode area 35 have both been patterned and formed.
- the polysilicon 30 is used only to form the gate.
- a layer of titanium silicide is shown formed over both the polysilicon 30 and the n well 35 , thereby forming a local interconnection for dissipation of charge on the polysilicon 30 .
- the formation of the titanium silicide actually occurs in multiple steps including, for example, the deposition of a layer of titanium and —Si, followed by an anneal step to form the titanium silicide.
- This technique permits construction of the protection diode with no extra mask steps.
- this technique suffers from the disadvantage that no charge dissipation is provided during the step of etching the polysilicon.
- FIG. 6 shows a variation on the technique of FIG. 5, in which an oxide layer 50 is grown over the entire structure (instead of titanium silicide), including the n well 35 and polysilicon 30 .
- the polysilicon 30 is again used only to form the gate structure.
- the oxide 50 is then etched in a subsequent step to uncover both the n-well 35 and an adjacent portion of the polysilicon 30 .
- a deposition of aluminum or other connective material 55 is made over the n-well 35 and the uncovered portion of the polysilicon 30 .
- this technique need not require additional mask steps, it does not provide charge dissipation during the polysilicon etch step.
- the charge protection diode of the present invention is shown (in simplified form) implemented in the compute and drive cells of a cell-based array.
- a drive cell 65 is shown on the left, while a compute cell 70 is shown on the right.
- a lower section 75 of both the drive and compute cells is fabricated in PMOS, while an upper section 80 of both cells is fabricated in NMOS. It will be appreciated that various connecting structures have been simplified for clarity.
- a plurality of transistors 15 can be seen to be formed with shared polysilicon gates 85 .
- the polysilicon gates 85 can be seen to extend nearly to n+ wells 35 , and connected thereto by local interconnect portions 90 and 90 ′.
- the n+ wells 35 which cooperate with the substrate 20 to form the diodes of the present invention, are located underneath subsequently-formed pads 95 .
- the PMOS portion 75 of the drive cell 65 can be seen to include a similar transistor structure 100 with shared polysilicon gates 105 and 110 , and can be seen to be similarly connected via local interconnects 90 and 90 ′ to the diodes formed at the n+ wells 35 beneath the pads 95 .
- NMOS portion 80 of the compute cell 70 a pair of diode structures 35 are shown formed in close proximity to polysilicon runs 125 and 130 , and connected thereto by local interconnect portions 135 and 140 . As before, pads 95 are formed in subsequent steps atop the n+ wells 35 .
- transistors 160 include shared gates 165 and 170 .
- the polysilicon runs which are formed over the gate oxides 25 extend to the same local interconnect portions 135 and 140 as the NMOS portion 80 , and thus connect to the n-wells 35 .
- the polysilicon runs overlying each gate oxide typically will be connected to a charge dissipation structure 35 to minimize the risks associated with process-induced collection of charge, thereby improving yield and process reliability. It will also be appreciated that, by placing the structures 35 in the same location as pads will subsequently be placed, substantially no die area is wasted. The present invention can therefore be seen to be an efficient, cost-effective and flexible method of improving yield while maintaining high circuit densities.
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Abstract
Description
- This application relates to methods and apparatus for reduction of charge collection in semiconductor processing; and more particularly relates to the reduction of damage caused by process-induced charge collection in cell based arrays.
- It has become well known that certain processes used in semiconductor fabrication can induce collection of charge in some polysilicon or metal structures during the fabrication of a semiconductor device. More specifically, use of a plasma ambient during processing has been shown to induce charge in polysilicon or metal structures sometimes referred to as “antenna” or “charge collector” structures. This collection of charge has been shown capable of causing damage to thin gate oxides in at least some instances, and thus to reduce yield significantly. The problem is exacerbated as critical device dimensions are reduced, for example one-quarter m, with the concomitant reduction in the thickness of gate oxides to, for example, ten nm or less, and in at least some instances on the order of seven nanometers.
- The damage possible from such processing steps has been described in the literature. One article, entitled “Plasma-Parameter Dependence of Thin-Oxide Damage from Wafer Charging During Electron-Cyclotron-Resonance Plasma Processing” is found in the February 1997 issue ofIEEE Transactions on Semiconductor Manufacturing, Vol. 10, No. 1, p. 154. A related article, entitled “Plasma Etching Charge-Up Damage to Thin Oxides,” can be found in the August 1993 issue of Solid State Technology, at page 29. Both articles make clear that process-induced present significant risks to yields.
- Although the adverse results due to the antenna effect are well known in the current art, it is much less certain how best to counteract the problem. Although a diode has been mentioned abstractly in the literature, no successful implementation has been demonstrated. More particularly, the implementation of a diode has heretofore involved significant loss of area. This loss of area makes implementation of a diode substantially less desirable, since die area is critical to modern complex designs.
- There has therefore been a need to develop a circuit design which minimizes or eliminates the antenna effect while at the same time minimizing the mount of area lost.
- The present invention substantially overcomes the limitations of the prior art by providing an extremely compact structure which dissipates charge collected during processing steps of semiconductor structures. The present invention is particularly suited to cell-based arrays, although it is also suited to other semiconductor devices.
- In particular, the present invention involves modification of the fabrication process to include providing a means for discharging the charge-collection structures identified in the prior art, while at the same time minimizing the amount of die area needed to achieve such results. More specifically, for a substrate of a first type, an area of a second type is deposited in a location suitable for connection to a charge collection structure to be fabricated in subsequent steps. The charge collector structure may be, for example, a polysilicon or metal run connected to a first gate and intended ultimately to connect to other structures, but left unconnected for a portion of the processing steps.
- The combination of a substrate of a first type and a deposition area of a second type can be seen to create a diode. By positioning the diode in close proximity to the charge collector structure, the two structures may be connected by means of any of a plurality of local interconnect techniques. The diode permits charge to be dissipated during processing, but essentially has negligible effect on the operation of the finally-constructed circuit. In this way the antenna effect is minimized or eliminated, and yield is improved.
- In a presently preferred embodiment, the diode of the present invention is placed in a location which will eventually be a connecting pad. In this manner, substantially the entire die area may be utilized for semiconductor structures implementing the overall circuit, while at the same time eliminating the antenna effect. The invention is particularly well-suited to complex integrated circuits such as cell-based arrays, but may be successfully implemented in a wide variety of circuit designs.
- The present invention will be better understood from the following Detailed Description of the Invention, taken together with the appended drawings. Although the invention is explained in the context of a cell-based array, it is to be understood that such an embodiment is exemplary only and not limiting.
- FIG. 1 shows a transistor structure in which a gate is formed over an active area.
- FIG. 2 shows an implanted area positioned sufficiently near the transistor structure of FIG. 1 to minimize the antenna effect.
- FIG. 3A shows a first arrangement for connection of the implanted area to the transistor structure.
- FIG. 3B shows an alternative arrangement for connection of the implanted area to the transistor structure.
- FIG. 4 shows, in cross-section, a first form of local interconnect for connecting the implanted area to the charge collector structure.
- FIG. 5 shows in cross-section a second form of local interconnect for connecting the implanted area to the charge collector structure.
- FIG. 6 shows in cross-section a variation on the local interconnect technique shown in FIG. 5.
- FIG. 7 shows in plan view the implementation of the present invention in he drive and compute cells of a cell-based array.
- Referring first to FIG. 1, an
active area 10 of a field effect transistor shown generally as 15 is shown positioned on asubstrate 20. In a typical embodiment, thesubstrate 20 is formed of p-type silicon, while theactive area 10 is formed by n+ implantation. As will be appreciated by those skilled in the art and shown in FIG. 4 (discussed hereinafter), overlying theactive area 10 is a thin gate structure 25 connecting a source and a drain. The gate structure 25 will, in many embodiments, essential bisect theactive area 10 and is formed of a thin oxide. The thickness of the gate oxide may be less than 10 nm, and in at least some embodiments may be on the order of 7 nm. - Overlying the gate structure25 is, in an exemplary embodiment, a connecting
structure 30 for connecting thegate 20 of thetransistor 15 to other structures in the circuit, for example other transistors. The connectingstructure 30 is, in an exemplary embodiment, formed of polysilicon, although metal may also be used for such connecting structures. The connectingstructure 30 may extend across multiple transistors and represents a relatively long run, thus providing the possibility of collection of charge during intermediate processing steps of the device. This collection of charge is commonly referred to as the antenna effect. - Referring next to FIGS. 2, 3A and3B, the charge dissipation structure of the present invention may be better appreciated. FIGS. 2, 3A and 3B show in plan view the new charge dissipation structure both before connection to the polysilicon (FIG. 2) and after (FIGS. 3A and 3B). In particular, an n+ area 35 (still assuming the substrate is p-type) is formed along the anticipated run of
structure 30 at a point suitably close to thetransistor 15 to dissipate any charge buildup on thestructure 30 which might endanger the gate oxide 25. The formation of thisstructure 35 must occur in the proper sequence during fabrication of the overall circuit of whichtransistor 15 is a part. In an exemplary embodiment, the relevant processing steps can be described generally as follows, with particular reference to FIGS. 3A-3B: theactive areas 10 are formed initially, followed by formation of n-wells (for PMOS) and p-wells (for NMOS) which form theprotection structures 35 of the present invention. Gate oxide is then formed, followed by removing the gate oxide from thestructures 35. The layer ofpolysilicon 30 is then deposited and doped to n+ conductivity, after which patterning and etching is completed. In a feature which is important in at least some embodiments, thestructure 35 is positioned to minimize the impact of the present invention on the die area available for the intended circuit, and is connected to the gate 25 through alocal interconnect portion 30′ which at least abuts thepolysilicon 30. To accomplish this, thestructure 35 may, for example, be formed at a location which will, when processing is completed, be directly beneath a connecting pad. This can be particularly appreciated from FIG. 3B, wherein the polysilicon is essentially congruent with thestructure 35. The polysilicon need not cover theentire structure 35, as shown in FIG. 3A, and the polysilicon may be smaller or larger than thestructure 35 with the primary goal being an optimization of reliability together with minimum wastage of the die area. Other locations will be acceptable in at least some embodiments, such as directly beneath therun 30, for example is an open area not otherwise utilized by the circuit design. - Referring particularly to the cross-sectional view of FIG. 4, a first embodiment for connecting the
structure 35, which is an n-well in this example, to the gate through a local interconnect technique. In particular, theactive area 10 is shown in the p-type substrate 20.Field oxide 40 is shown to isolate theactive area 10 from an n-well 35, with the actual distance between the two being determined by the circuit layout. A gate oxide 25 is grown over theactive area 10 and n-well 35 by conventional processing steps. The oxide 25 is then removed from the n-well 35, after which thepolysilicon structure 30 is laid down over the gate oxide 25 and also connected to the n-well 35 by any suitable local interconnect technique, again indicated at 30′. The local interconnect may include extending the polysilicon run over the n-well 35. As noted previously, thereafter thepolysilicon 30 is typically doped n+ in an exemplary arrangement, and then patterned and etched by conventional methods. Thepolysilicon 30 can thus be seen to connect to then+ implant 35, thereby cooperating with the p-type substrate to form a diode for dissipation of charge from thepolysilicon 30 until additional processing steps connect thepolysilicon 30 to other transistor structures in the circuit. - It will be appreciated that, while the simplified fabrication process described herein in connection with FIG. 4 requires additional processing steps, it provides protection against charge buildup even during the step of etching the polysilicon. It will also be appreciated that, if the configuration of FIG. 3B is used, the step of doping the
polysilicon 30 to n+ will also dope thestructure 35 to n+. - Referring next to FIGS. 5 and 6, a second local interconnect technique is described for connecting the n-well35 to the
polysilicon 30. In particular, FIG. 5A shows the essential structure prior to addition of the local interconnect, including thesubstrate 15,active area 10, gate oxide 25, n well 35 andfield oxide 40, with thepolysilicon 30 extending over the gate oxide 25 in a conventional manner. As noted previously in connection with FIG. 4, thepolysilicon gate structure 30 andn+ diode area 35 have both been patterned and formed. However, unlike FIG. 4, for the structure in FIG. 5 thepolysilicon 30 is used only to form the gate. Thereafter, a layer of titanium silicide is shown formed over both thepolysilicon 30 and the n well 35, thereby forming a local interconnection for dissipation of charge on thepolysilicon 30. The formation of the titanium silicide actually occurs in multiple steps including, for example, the deposition of a layer of titanium and —Si, followed by an anneal step to form the titanium silicide. This technique permits construction of the protection diode with no extra mask steps. However, this technique suffers from the disadvantage that no charge dissipation is provided during the step of etching the polysilicon. - FIG. 6 shows a variation on the technique of FIG. 5, in which an oxide layer50 is grown over the entire structure (instead of titanium silicide), including the n well 35 and
polysilicon 30. Thepolysilicon 30 is again used only to form the gate structure. The oxide 50 is then etched in a subsequent step to uncover both the n-well 35 and an adjacent portion of thepolysilicon 30. Thereafter, a deposition of aluminum or other connective material 55 is made over the n-well 35 and the uncovered portion of thepolysilicon 30. Again, while this technique need not require additional mask steps, it does not provide charge dissipation during the polysilicon etch step. - Referring next to FIG. 7, the charge protection diode of the present invention is shown (in simplified form) implemented in the compute and drive cells of a cell-based array. In particular, a
drive cell 65 is shown on the left, while acompute cell 70 is shown on the right. Alower section 75 of both the drive and compute cells is fabricated in PMOS, while anupper section 80 of both cells is fabricated in NMOS. It will be appreciated that various connecting structures have been simplified for clarity. - Referring first to the
NMOS portion 80 of thedrive cell 65, a plurality oftransistors 15 can be seen to be formed with shared polysilicon gates 85. The polysilicon gates 85 can be seen to extend nearly to n+wells 35, and connected thereto bylocal interconnect portions n+ wells 35, which cooperate with thesubstrate 20 to form the diodes of the present invention, are located underneath subsequently-formedpads 95. ThePMOS portion 75 of thedrive cell 65 can be seen to include asimilar transistor structure 100 with sharedpolysilicon gates 105 and 110, and can be seen to be similarly connected vialocal interconnects n+ wells 35 beneath thepads 95. - Similarly, in the
NMOS portion 80 of thecompute cell 70, a pair ofdiode structures 35 are shown formed in close proximity to polysilicon runs 125 and 130, and connected thereto bylocal interconnect portions 135 and 140. As before,pads 95 are formed in subsequent steps atop then+ wells 35. Likewise, in thePMOS portion 75 of thecompute cell 70, transistors 160 include shared gates 165 and 170. The polysilicon runs which are formed over the gate oxides 25 extend to the samelocal interconnect portions 135 and 140 as theNMOS portion 80, and thus connect to the n-wells 35. It will be understood that, in a presently preferred arrangement, the polysilicon runs overlying each gate oxide typically will be connected to acharge dissipation structure 35 to minimize the risks associated with process-induced collection of charge, thereby improving yield and process reliability. It will also be appreciated that, by placing thestructures 35 in the same location as pads will subsequently be placed, substantially no die area is wasted. The present invention can therefore be seen to be an efficient, cost-effective and flexible method of improving yield while maintaining high circuit densities. - From the foregoing, it can be appreciated that a new and novel technique for reducing or eliminating the antenna effect has been disclosed. The technique also has the advantage of preserving a maximum amount of the die area for implementation of the circuit design. Having fully described one embodiment of the present invention, it will be apparent to those of ordinary skill in the art that numerous alternatives and equivalents exist which do not depart from the invention set forth above. It is therefore to be understood that the invention is not to be limited by the foregoing description, but only by the appended claims.
Claims (8)
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US10/191,931 US6639286B2 (en) | 1997-03-31 | 2002-07-08 | Method and apparatus for reducing process-induced charge buildup |
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US20050093072A1 (en) * | 2003-11-04 | 2005-05-05 | International Business Machines Corporation | Method of assessing potential for charging damage in soi designs and structures for eliminating potential for damage |
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US8445966B2 (en) * | 2006-12-20 | 2013-05-21 | Spansion Llc | Method and apparatus for protection against process-induced charging |
US7977218B2 (en) * | 2006-12-26 | 2011-07-12 | Spansion Llc | Thin oxide dummy tiling as charge protection |
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GB2289371B (en) * | 1994-05-05 | 1997-11-19 | Fuji Electric Co Ltd | A semiconductor device and control method |
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JPH08181284A (en) * | 1994-09-13 | 1996-07-12 | Hewlett Packard Co <Hp> | Protective element and manufacture thereof |
FR2734429B1 (en) * | 1995-05-19 | 1997-08-01 | Sgs Thomson Microelectronics | SWITCH AND SUPPLY-APPLICATION MODULE FOR STARTING A FLUORESCENT TUBE |
US5903031A (en) * | 1995-07-04 | 1999-05-11 | Matsushita Electric Industrial Co., Ltd. | MIS device, method of manufacturing the same, and method of diagnosing the same |
US5691234A (en) * | 1995-08-03 | 1997-11-25 | United Microelectronics Corporation | Buried contact method to release plasma-induced charging damage on device |
US5654860A (en) * | 1995-08-16 | 1997-08-05 | Micron Technology, Inc. | Well resistor for ESD protection of CMOS circuits |
KR0163928B1 (en) * | 1995-10-25 | 1998-12-01 | 김광호 | Emitter switch thrystor |
US5811869A (en) * | 1996-01-04 | 1998-09-22 | Micron Technology, Inc. | Laser antifuse using gate capacitor |
US5910452A (en) * | 1996-05-13 | 1999-06-08 | Winbond Electronics Corporation | Method for reducing antenna effect during plasma etching procedure for semiconductor device fabrication |
-
1997
- 1997-03-31 US US08/829,772 patent/US6432726B2/en not_active Expired - Lifetime
-
1998
- 1998-05-06 TW TW087106984A patent/TW388066B/en not_active IP Right Cessation
-
2002
- 2002-07-08 US US10/191,931 patent/US6639286B2/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US20030178652A1 (en) * | 2002-03-20 | 2003-09-25 | Tung-Cheng Kuo | Non-volatile memory device and fabrication method thereof |
US6680227B2 (en) * | 2002-03-20 | 2004-01-20 | Macronix International Co., Ltd. | Non-volatile memory device and fabrication method thereof |
US20050093072A1 (en) * | 2003-11-04 | 2005-05-05 | International Business Machines Corporation | Method of assessing potential for charging damage in soi designs and structures for eliminating potential for damage |
US7067886B2 (en) | 2003-11-04 | 2006-06-27 | International Business Machines Corporation | Method of assessing potential for charging damage in SOI designs and structures for eliminating potential for damage |
US7132318B2 (en) | 2003-11-04 | 2006-11-07 | International Business Machines Corporation | Method of assessing potential for charging damage in SOI designs and structures for eliminating potential for damage |
Also Published As
Publication number | Publication date |
---|---|
US6432726B2 (en) | 2002-08-13 |
TW388066B (en) | 2000-04-21 |
US6639286B2 (en) | 2003-10-28 |
US20030027399A1 (en) | 2003-02-06 |
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