US20010043867A1 - Pressure fluctuation dampening system - Google Patents
Pressure fluctuation dampening system Download PDFInfo
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- US20010043867A1 US20010043867A1 US09/860,724 US86072401A US2001043867A1 US 20010043867 A1 US20010043867 A1 US 20010043867A1 US 86072401 A US86072401 A US 86072401A US 2001043867 A1 US2001043867 A1 US 2001043867A1
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- regulator
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B49/00—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B11/00—Equalisation of pulses, e.g. by use of air vessels; Counteracting cavitation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B53/00—Component parts, details or accessories not provided for in, or of interest apart from, groups F04B1/00 - F04B23/00 or F04B39/00 - F04B47/00
- F04B53/001—Noise damping
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Control Of Fluid Pressure (AREA)
- Control Of Positive-Displacement Pumps (AREA)
- Pipeline Systems (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
A pressure booster and method for amplifying a water pressure that is supplied by a water facility is provided. The pressure booster is configured to be connected between the water facility and one or more semiconductor substrate cleaning systems. The pressure booster includes a pump having a pump input that connects to the water facility and a pump output that is configured to produce a fluctuating amplified water pressure that is greater than the water pressure that is supplied by the water facility. Further included is a pressure dampener having a dampener input for accepting the fluctuating amplified water pressure from the pump output. The pressure dampener is configured to partially reduce pressure fluctuations in the fluctuating amplified water pressure. The pressure dampener also has a dampener output. A pressure regulator having a regulator input for receiving the dampener output is also included as part of the pressure booster. The pressure regulator has a regulator output that is configured to supply an amplified water pressure having a substantially reduced pressure fluctuation, and an adjustment control that is connected to the pressure regulator. The adjustment control is provided to enable precision turning of the pressure fluctuations at the output of the pressure regulator, such that a substantially more stable water supply can be provided to the cleaning system(s) connected to the pressure booster.
Description
- 1. Field of the Invention
- This invention relates generally to water pressure regulating devices, and more particularly to systems for dampening water pressure fluctuations in pump systems used to supply fluids to wafer cleaning stations.
- 2. Description of the Related Art
- As is well known, semiconductor devices are fabricated from semiconductor wafers, which are subjected to numerous processing operations. These operations include, for example, impurity implants, gate oxide generation, inter-metal oxide depositions, metallization depositions, photolithography pattering, chemical mechanical polishing (CMP), etc. Although these processes are performed in ultra clean environments, the very nature of many of the process operations is to blame for the generation of surface particles. For instance, when CMP operations are performed, a film of particles and/or metal contaminants are commonly left behind.
- Because surface particles can detrimentally impact the performance of an integrated circuit device, wafer cleaning operations have become a standard procedural requirement after certain process steps. Although cleaning operations are rather procedural, the equipment and chemicals implemented to perform the actual cleaning are highly specialized. This specialization is important because each wafer, being at different stages of fabrication, represents a significant investment in terms of raw materials, equipment fabrication time, and associated research and development.
- To perform the cleaning operations in an automated manner, fabrication labs typically employ a cleaning system. A typical cleaning system may be, for example, a Synergy™ cleaning system from OnTrak™, of Fremont, Calif., which is a subsidiary of Lam Research Corporation, also of Fremont, California. A typical Synergy™ cleaning system employs two brush stations, where each brush station has a set of brushes for cleaning the top and bottom surfaces of a wafer. Each of the brushes are commonly configured to deliver chemicals and DI water Through-The-Brush, to enhance the cleaning ability of the system. The system typically also includes a spin-rinse station, where a wafer, after being cleaned in the brush stations is rinsed with DI water and dried before completing the cleaning cycle.
- As can be appreciated, it is very important that facility lines, which supply the DI water to the cleaning system supply the water at substantially steady water pressure levels. Unfortunately, the facility lines in different fabrication labs vary substantially. In some cases, the pressure levels are too high and in others too low. In those cases where the pressure level is too low, laboratory technicians sometimes connect a water pump between the facility lines supplying the DI water and the cleaning system. Although water pumps are able to increase pressure levels, a downside to water pumps is that large pressure fluctuations are also introduced and passed to the cleaning system. In view of the fact that cleaning systems are designed to carefully apply selected amounts of DI water to produce very specific chemical solutions, (i.e., mixture) pressure fluctuations can cause erratic changes in the concentration of applied solutions.
- In view of the foregoing, there is a need for pump systems and methods for implementing booster pump systems that minimize the degree of water pressure fluctuations communicated to wafer cleaning systems.
- Broadly speaking, the present invention fills these needs by providing a booster pump that can supply water pressure sensitive cleaning systems with a controlled water pressure flow that has a substantial reduction in pulsating water pressure fluctuations. It should be appreciated that the present invention can be implemented in numerous ways, including as a process, an apparatus, a system, a device, or a method. Several inventive embodiments of the present invention are described below.
- In one embodiment, a pressure booster for amplifying a water pressure that is supplied by a water facility is disclosed. The pressure booster includes a pump having a pump input that connects to the water facility and a pump output that is configured to produce a fluctuating amplified water pressure, which is greater than the water pressure that is supplied by the water facility. A pressure dampener having a dampener input for accepting the fluctuating amplified water pressure from the pump output is also included. The pressure dampener is configured to partially reduce pressure fluctuations in the fluctuating amplified water pressure, the pressure dampener also has a dampener output. The pressure booster further includes a pressure regulator having a regulator input for receiving the dampener output. The pressure regulator has a regulator output that is configured to supply a regulated water pressure having a substantially reduced pressure fluctuation. The regulated water pressure is then supplied to a wafer cleaning station, which is configured to perform precision controlled cleaning operations along with other cleaning chemicals.
- In another embodiment, a pressure booster for amplifying a water pressure that is supplied by a water facility is disclosed. The pressure booster is configured to be connected between the water facility and one or more semiconductor substrate cleaning systems. The pressure booster includes a pump having a pump input that connects to the water facility and a pump output that is configured to produce a fluctuating amplified water pressure that is greater than the water pressure that is supplied by the water facility. Further included is a pressure dampener having a dampener input for accepting the fluctuating amplified water pressure from the pump output. The pressure dampener is configured to partially reduce pressure fluctuations in the fluctuating amplified water pressure. The pressure dampener also has a dampener output. A pressure regulator having a regulator input for receiving the dampener output is also included as part of the pressure booster. The pressure regulator has a regulator output that is configured to supply an amplified water pressure having a substantially reduced pressure fluctuation, and an adjustment control that is connected to the pressure regulator. The adjustment control is provided to enable precision tuning of the pressure fluctuations at the output of the pressure regulator, such that a substantially more stable water supply can be provided to the cleaning system(s) connected to the pressure booster.
- In yet a further embodiment, a method for dampening a fluctuation in water pressure that is configured to be supplied to a wafer cleaning system is disclosed. The method includes: (a) providing a pump for amplifying a pressure level of water received from a facility connection; (b) connecting a pulse dampener to an output of the pump to partially reduce fluctuations in pressure produced by the pump; (c) connecting a pressure regulator to an output of the pressure regulator; (d) monitoring a pressure gauge at an output of the pressure regulator; and (e) adjusting the pressure regulator until an acceptable reduced pressure fluctuation is monitored at the pressure gauge.
- Other aspects and advantages of the invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the invention.
- The present invention will be readily understood by the following detailed description in conjunction with the accompanying drawings, and like reference numerals designate like structural elements.
- FIG. 1 illustrates a pair of cleaning systems that are connected to a water pressure amplifying system, in accordance with one embodiment of the present invention.
- FIGS. 2A and 2B show a side view and a top view, respectively, of a wafer cleaning system.
- FIG. 3 shows a more detailed block diagram of the booster pump, in accordance with one embodiment of the present invention.
- FIG. 4 shows a more detailed diagram of a pressure regulator implemented by the booster pump of FIG. 1, in accordance with one embodiment of the present invention.
- FIG. 5 is a flowchart diagram illustrating the method operations performed in reducing pressure fluctuation and pulsation in water lines connected to cleaning systems via a booster pump, in accordance with one embodiment of the present invention.
- An invention is described for a booster pump that can supply water pressure sensitive cleaning systems with a controlled water pressure flow that has a substantial reduction in pulsating water pressure fluctuations. It will be obvious, however, to one skilled in the art, that the present invention may be practiced without some or all of these specific details. In other instances, well known process operations have not been described in detail in order not to unnecessarily obscure the present invention.
- FIG. 1 illustrates a pair of cleaning systems being connected to a water pressure amplifying system, in accordance with one embodiment of the present invention. The system includes a
booster pump 102, which is connected between afacility water supply 106 andcleaning systems booster pump 102 is also configured to receive a controlling air pressure (Pv) that is provided from afacility air pressure 108. Therefore, in situations where thefacility water pressure 106 is below the pressure acceptable for running thecleaning systems booster pump 102 is provided to increase the water pressure in a controlled manner. - As shown, the
booster pump 102 is connected to thefacility water supply 106 via aconnection line 110. Theconnection line 110 is typically a tubing line that is configured to be connected to an appropriate connector at thefacility water supply 106. Thebooster pump 102 is then configured to produce an amplifiedpressure cleaning system pressure 112 is precision controlled internally to thebooster pump 102 to reduce water pressure fluctuations that are common in conventional water pressure amplifying systems. - Each
cleaning system 104, will preferably have agauge lines cleaning system 104 a and 140 b will also include apressure regulating valve pressure regulating valves booster pump 102 in order to obtain the optimum cleaning conditions for the system. However, if the water pressure is exhibiting erratic fluctuating swings in pressure, the regulatingvalves 116 alone are not capable of reducing the rate of fluctuations in the supplied water pressure. Thus, regulatingvalves 116 are primarily implemented to reduce or increase the pressure magnitude being passed into thecleaning systems 104. - Although the
booster pump 102 is shown supplying water to twodifferent cleaning systems 104, thebooster pump 102 can also be configured to supply water to a single cleaning system, or more than two cleaning systems, depending upon the booster pump specifications. - FIGS. 2A and 2B show a side view and a top view, respectively, of a
cleaning system 104. Thecleaning system 104 typically includes ainput station 150 where a plurality of wafers may be inserted for cleaning through the system. Once the wafers are inserted into theinput station 150, a wafer may be taken from theinput station 150 and moved into afirst brush station 152 a, where the wafer is scrubbed with selected chemicals and water (e.g., DI water), before being moved to asecond brush station 152 b of a double containeddual brush box 152. - After a wafer has been scrubbed in the double contained
dual brush box 150, the wafer is moved into aspin station 154 where de-ionized water is sprayed onto the surface of the wafer and spun to dry. After the wafer has been rinsed inspin station 154, an unloadhandler 155 takes the wafer and moves it into anoutput station 156. Thecleaning system 104 is configured to be programmed and controlled fromsystem electronics 158. Thecleaning system 104 also shows theinput water line 112, which is received from thebooster pump 102 as shown in FIG. 1. Thecleaning system 104 also shows thegauge 114 and theadjustment valve 116 at the backside of the cleaningstation 104. - FIG. 3 shows a more detailed block diagram of the
booster pump 102, in accordance with one embodiment of the present invention. Thebooster pump 102 is shown receiving theconnection line 110 that leads to aninput shutoff 130. Theinput shutoff 130 then leads to atee connection 132 that flows to apump 120 and through abypass line 121 that leads to acheck valve 128. In an exemplary embodiment, thepump 120 is a Yamada ¾″ NDP-20 Series Pump, wherein about 0.10 gallon is pumped per pump cycle. This exemplary NDP-20 Series Pump can be obtained from Yamada America, Inc., of Elgin, Ill. Of course, the pump may be obtained from other manufacturers and the pumping power can vary depending upon the needs of the cleaning system arrangement. Thepump 120 is also shown receiving a controlling air pressure P, from thefacility air pressure 108 of FIG. 1. In a preferred embodiment, the controlling air pressure is set to about 85 PSI, and it may range between about 20 and 100 PSI. - The
pump 120 is then configured to output an amplified water pressure to atee 134 that connects to thebypass line 121 and apulse dampener 122. The controlling air pressure Pv is also connected to thepulse dampener 122. An exemplary pulse dampener may be an AD-Series (e.g., an AD-25PT) pulsation dampener, which is also manufactured by Yamada America, Inc. Thepulse dampener 122 is configured to partially reduce pressure fluctuations produced by thepump 120. Once the water is passed through thepulse dampener 122, the water is passed to aline 123 that is communicated to apressure regulator 124. Thepressure regulator 124 is configured to be adjusted such that a desired pressure (P1) is achieved at the output of thebooster pump 102. Thepressure regulator 124 then flows the water through aline 125 to enter afilter 126 that filters the water before it is provided toline 112. - FIG. 4 shows a more detailed diagram of the
pressure regulator 124 in accordance with one embodiment of the present invention. Thepressure regulator 124 is shown receiving water having a fluctuating water pressure throughline 123. The pressure regulator is also provided with anadjustment control 144. Theadjustment control 144 enables precision control of the pressure level and tuning control over water pressure fluctuations between the water flowing throughline 123 and the water flowing out of thepressure regulator 124 inline 125. Thefilter 126 is shown connected betweenfilter isolation valves filter isolation valves filter 126 when replacement of the filter is desired. - Also shown is a
pressure gauge 146 which is connected to the output of thefilter 126 in order to measure the pressure (P1). Thegauge 146 is then connected to a tee that splits the line into thelines Output shutoffs lines booster pump 102. Theadjustment control 144 can be a manual control, a pressure control, or an electronic control which enables adjustment of thepressure regulator 124. In one exemplary embodiment, the pressure regulator can be a manually controlled UPR Pressure Regular, which can be obtained from Furon Co. of Los Alamitos, Calif. Theadjustment control 144 is therefore tuned while at the same time thepressure gauge 146 is monitored. The simultaneous monitoring therefore enables the user to tune thepressure regulator 124 to the most optimum setting, which will produce the best reduction in water pressure fluctuation. The pressure output from thepulse dampener 122 provided atline 123 is pictorially shown to have sporadic fluctuations inpressure 131 a, which may swing up to 20 PSI or greater. - By monitoring the
pressure gauge 146, an adjustment is made through theadjustment control 144 to thepressure regulator 124 until thepressure gauge 146 shows awaveform 131 b that exhibits lower magnitude swings, e.g., below about 5 PSI. The fluctuations will also preferably exhibit a wider period between fluctuating transitions. - In Tables A and B, which follow below, experimental data is provided to show how precision control of the pressure regular124, which is connected after the
pulse dampener 122, will provide significant reductions water pressure fluctuations. For ease of reference, when a system is in process mode (i.e., wafers are being cleaned), the system will be designated as “P.” When the system is in flush/purge mode, the system will be designated as “U.” When the system is in an idle state, the system will be designated as “I.” - In Tables A and B, the facility pressure level P0 will be tested at about 45 PSI (i.e., the facility water supply pressure), and the control pressure Pv will be set at 85 PSI. The desired and most optimum pressure that is to be delivered to the systems A and B, in this example, is 50 PSI. However, it is more important that the fluctuation and pulsation in water pressure be at a minimum, and if the pressure P2 (at system A) and P3 (at system B) are too high, another adjustment in pressure can be performed at the
pressure regulating valves pressure regulating valves - In Table A, the
connection line 110, which connects thebooster pump 102 to thewater facility 106, includes a Y adapter using 1″ ID and ¾″ tubing. The Y adapter is used when two facility water lines are provided to thebooster pump 102, and the Y adapter converts the two lines into a single line. The length of the two ¾″ lines between the Y adapter and thewater facility 106 is about 10 feet. A one foot ¾″ line is then connected between the Y adapter and thebooster pump 102. Thelines 112 connected between thebooster pump 102 and the systems A and B are set as 45 foot long ¾″ tubing and 9 foot long ¾″ tubing, respectively. Implementing these connection conditions, the results of Table A were observed when the systems were placed in the various operational conditions. It should be noticed that the measured pressure fluctuations exhibited less than a 5 PSI swing in each of the process combinations.TABLE A TEST SETUP A System A/ P0 P1 P2 P3 Pv System B (PSI) (PSI) (PSI) (PSI) (PSI) P/P ˜45 61-62 50-53 49-51 85 P/U ˜45 56-59 49-53 44-46 85 P/I ˜45 61-63 49-53 50-54 85 I/I ˜45 61-67 49-53 50-54 85 - In Table B, the
connection line 110, which connects thebooster pump 102 to thewater facility 106, includes a 10 foot long 1″ tube and a 1 foot long ¾″ piece of tubing that couples between the 1″ tubing and thebooster pump 102. Theline 112 is connected between thebooster pump 102 and the system A with a 45 foot long ¾″ tubing. No connection was made to the system B. Implementing these connection conditions, the results of Table B were observed when the system A was placed in various operational conditions. As shown, during process mode “P” and during idle mode “I”, the pressure swings were less than about 2 PSI. During flushing, which is less important in terms of precise wafer cleaning, the measured swing was about 6 PSI.TABLE B TEST SETUP B System A/ P0 P1 P2 P3 Pv System B (PSI) (PSI) (PSI) (PSI) (PSI) P/N/A ˜45 58-61 50-52 N/A 85 U/N/A ˜45 55-65 43-49 N/A 85 I/N/A ˜45 58-66 50-52 N/A 85 - FIG. 5 is a flowchart diagram200 illustrating the method operations performed in reducing pressure fluctuation and pulsation in water lines connected to cleaning systems via a booster pump, in accordance with one embodiment of the present invention. The method begins at an
operation 202 where a pump for amplifying a pressure level of water received from a facility connection is provided. The facility connection may be provided from a wall outlet connection or a floor outlet connection which are part of a room where the cleaning system(s) is to be installed. Upon providing the pump, the method will advance to anoperation 204 where a pulse dampener is connected to an output of the pump to partially reduce fluctuations in pressure produced by the pump. Once the pulse dampener has been connected, a pressure regulator is connected to an output of the pulse dampener. - Now, a pressure gauge (e.g., gauge146 for measuring P1) at an output of the pressure regulator is monitored to ascertain the fluctuations in pressure after passing through the pressure regulator. The method then moves to an
operation 210 where adjustments to the pressure regulator are made until an acceptable reduced pressure fluctuation is monitored at the pressure gauge. As mentioned above, the adjustment may be made by way of a manual adjustment to the pressure regulator, an air controlled adjustment mechanism, or an electronic controlled adjustment unit. - Once the appropriate adjustment to the pressure regulator has been performed in order to achieve the reduced pressure fluctuation, the booster pump including the pulse dampener, and the pressure regulator, are connected to an appropriate cleaning system for use in accordance with a particular cleaning process. At that point, the method will end.
- Although the foregoing invention has been described in some detail for purposes of clarity of understanding, it will be apparent that certain changes and modifications may be practiced within the scope of the appended claims. Accordingly, the present embodiments are to be considered as illustrative and not restrictive, and the invention is not to be limited to the details given herein, but may be modified within the scope and equivalents of the appended claims.
Claims (23)
1. A pressure booster for amplifying a water pressure that is supplied by a water facility, comprising:
a pump having a pump input that connects to the water facility and a pump output that is configured to produce a fluctuating amplified water pressure that is greater than the water pressure that is supplied by the water facility;
a pressure dampener having a dampener input for accepting the fluctuating amplified water pressure from the pump output, the pressure dampener being configured to partially reduce pressure fluctuations in the fluctuating amplified water pressure, the pressure dampener further having a dampener output; and
a pressure regulator having a regulator input for receiving the dampener output, the pressure regulator further having a regulator output that is configured to supply an amplified water pressure having a substantially reduced pressure fluctuation.
2. A pressure booster for amplifying a water pressure that is supplied by a water facility as recited in , further comprising:
claim 1
an adjustment control connected to the pressure regulator.
3. A pressure booster for amplifying a water pressure that is supplied by a water facility as recited in , wherein the adjustment control is selected from the group consisting of a manual control, a pressure driven control, and an electronic driven control.
claim 2
4. A pressure booster for amplifying a water pressure that is supplied by a water facility as recited in , further comprising:
claim 2
a pressure gauge being connected to the regulator output, the pressure gauge being configured to display a pressure reading and a fluctuation reading.
5. A pressure booster for amplifying a water pressure that is supplied by a water facility as recited in , further comprising:
claim 4
a filter, the filter being coupled between the regulator output and the pressure gauge.
6. A pressure booster for amplifying a water pressure that is supplied by a water facility as recited in , wherein the adjustment control that is connected to the pressure regulator is set to a position that causes the amplified water pressure to have the substantially reduced pressure fluctuation.
claim 4
7. A pressure booster for amplifying a water pressure that is supplied by a water facility as recited in , wherein the partially reduced pressure fluctuations in the fluctuating amplified water pressure can swing up to about 20 PSI.
claim 1
8. A pressure booster for amplifying a water pressure that is supplied by a water facility as recited in , wherein the substantially reduced pressure fluctuation swings less than about 10 PSI.
claim 7
9. A pressure booster for amplifying a water pressure that is supplied by a water facility as recited in , wherein the substantially reduced pressure fluctuation swings less than about 5 PSI.
claim 7
10. A pressure booster for amplifying a water pressure that is supplied by a water facility as recited in , wherein the regulator output is connected to one or more wafer cleaning stations.
claim 1
11. A pressure booster for amplifying a water pressure that is supplied by a water facility as recited in , wherein the water pressure is of a de-ionized water pressure.
claim 1
12. A pressure booster for amplifying a water pressure that is supplied by a water facility, the pressure booster is configured to be connected between the water facility and one or more semiconductor substrate cleaning systems, the pressure booster comprising:
a pump having a pump input that connects to the water facility and a pump output that is configured to produce a fluctuating amplified water pressure that is greater than the water pressure that is supplied by the water facility;
a pressure dampener having a dampener input for accepting the fluctuating amplified water pressure from the pump output, the pressure dampener being configured to partially reduce pressure fluctuations in the fluctuating amplified water pressure, the pressure dampener further having a dampener output;
a pressure regulator having a regulator input for receiving the dampener output, the pressure regulator further having a regulator output that is configured to supply an amplified water pressure having a substantially reduced pressure fluctuation; and
an adjustment control connected to the pressure regulator.
13. A pressure booster for amplifying a water pressure that is supplied by a water facility as recited in , wherein the adjustment control is selected from the group consisting of a manual control, a pressure driven control, and an electronic driven control.
claim 12
14. A pressure booster for amplifying a water pressure that is supplied by a water facility as recited in , further comprising:
claim 12
a pressure gauge being connected to the regulator output, the pressure gauge being configured to display a pressure reading and a fluctuation reading.
15. A pressure booster for amplifying a water pressure that is supplied by a water facility as recited in , further comprising:
claim 14
a filter, the filter being coupled between the regulator output and the pressure gauge.
16. A pressure booster for amplifying a water pressure that is supplied by a water facility as recited in , wherein the adjustment control that is connected to the pressure regulator is set to a position that causes the amplified water pressure to have the substantially reduced pressure fluctuation.
claim 14
17. A pressure booster for amplifying a water pressure that is supplied by a water facility as recited in , wherein the partially reduced pressure fluctuations in the fluctuating amplified water pressure can swing up to about 20 PSI.
claim 12
18. A pressure booster for amplifying a water pressure that is supplied by a water facility as recited in , wherein the substantially reduced pressure fluctuation swings less than about 10 PSI.
claim 17
19. A pressure booster for amplifying a water pressure that is supplied by a water facility as recited in , wherein the substantially reduced pressure fluctuation swings less than about 5 PSI.
claim 17
20. A method for dampening a fluctuation in water pressure that is configured to be supplied to a wafer cleaning system, the method comprises:
providing a pump for amplifying a pressure level of water received from a facility connection;
connecting a pulse dampener to an output of the pump to partially reduce fluctuations in pressure produced by the pump;
connecting a pressure regulator to an output of the pressure regulator;
monitoring a pressure gauge at an output of the pressure regulator; and
adjusting the pressure regulator until an acceptable reduced pressure fluctuation is monitored at the pressure gauge.
21. A method for dampening a fluctuation in water pressure that is configured to be supplied to a wafer cleaning system as recited in , wherein the acceptable reduced pressure fluctuation is below about 5 PSI swings.
claim 20
22. A method for dampening a fluctuation in water pressure that is configured to be supplied to a wafer cleaning system as recited in , further comprising:
claim 20
supplying a constant air pressure to the pump.
23. A method for dampening a fluctuation in water pressure that is configured to be supplied to a wafer cleaning system as recited in , wherein the wafer cleaning system includes a cleaning system pressure regulator that is configured to be adjusted to provide internal cleaning system parts a substantially constant water pressure.
claim 20
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US09/860,724 US6406273B2 (en) | 1999-03-26 | 2001-05-18 | Pressure fluctuation dampening system |
US10/141,563 US6685440B2 (en) | 2001-05-18 | 2002-05-07 | Methods of pressure fluctuation dampening |
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Application Number | Priority Date | Filing Date | Title |
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US09/277,712 US6247903B1 (en) | 1999-03-26 | 1999-03-26 | Pressure fluctuation dampening system |
US09/860,724 US6406273B2 (en) | 1999-03-26 | 2001-05-18 | Pressure fluctuation dampening system |
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US09/277,712 Continuation US6247903B1 (en) | 1999-03-26 | 1999-03-26 | Pressure fluctuation dampening system |
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US10/141,563 Division US6685440B2 (en) | 2001-05-18 | 2002-05-07 | Methods of pressure fluctuation dampening |
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US20010043867A1 true US20010043867A1 (en) | 2001-11-22 |
US6406273B2 US6406273B2 (en) | 2002-06-18 |
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US09/277,712 Expired - Lifetime US6247903B1 (en) | 1999-03-26 | 1999-03-26 | Pressure fluctuation dampening system |
US09/860,724 Expired - Lifetime US6406273B2 (en) | 1999-03-26 | 2001-05-18 | Pressure fluctuation dampening system |
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US09/277,712 Expired - Lifetime US6247903B1 (en) | 1999-03-26 | 1999-03-26 | Pressure fluctuation dampening system |
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US (2) | US6247903B1 (en) |
JP (1) | JP2002540518A (en) |
KR (1) | KR100603030B1 (en) |
AU (1) | AU3372100A (en) |
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US8015989B2 (en) * | 2008-06-09 | 2011-09-13 | Applied Materials, Inc. | Method and apparatus for dampening pressure fluctuations in a fluid delivery system |
KR100966218B1 (en) * | 2008-08-14 | 2010-06-24 | 김분희 | Hydrolic tester |
US9873940B2 (en) | 2013-12-31 | 2018-01-23 | Lam Research Corporation | Coating system and method for coating interior fluid wetted surfaces of a component of a semiconductor substrate processing apparatus |
KR101598956B1 (en) * | 2014-06-30 | 2016-03-02 | 전자부품연구원 | Dynamo system for testing micro water turbing generator |
KR20170001332A (en) | 2015-06-26 | 2017-01-04 | 현대중공업 주식회사 | Apparatus for reducing pressure fluctuation of pump |
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US2819835A (en) * | 1954-11-26 | 1958-01-14 | Harwood Engineering Co | System for delivering a continuous and steady flow of a compressible fluid at high pressure |
US3910462A (en) * | 1974-06-06 | 1975-10-07 | Flushing Plastics Corp | Apparatus for dispensing cleaning solution |
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US5038563A (en) * | 1990-08-07 | 1991-08-13 | The United States Of America As Represented By The Secretary Of The Navy | Seawater power source for seawater powered tools |
DE4310155C1 (en) | 1993-03-29 | 1994-06-30 | Helmut Stoeger | Regulation and control device for a liquid pressure booster system |
US5538396A (en) * | 1994-10-24 | 1996-07-23 | Meierhoefer; Ned S. | Water pumping system |
JPH08144960A (en) | 1994-11-16 | 1996-06-04 | Kawamoto Seisakusho:Kk | Pump device |
US5685851A (en) * | 1995-06-06 | 1997-11-11 | Eams Industries, Inc. | Irrigation syringe |
JPH09283477A (en) | 1996-04-10 | 1997-10-31 | Dainippon Screen Mfg Co Ltd | Substrate treating device |
US6247903B1 (en) * | 1999-03-26 | 2001-06-19 | Lam Research Corporation | Pressure fluctuation dampening system |
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1999
- 1999-03-26 US US09/277,712 patent/US6247903B1/en not_active Expired - Lifetime
-
2000
- 2000-02-22 KR KR1020017012042A patent/KR100603030B1/en not_active IP Right Cessation
- 2000-02-22 AU AU33721/00A patent/AU3372100A/en not_active Abandoned
- 2000-02-22 WO PCT/US2000/004434 patent/WO2000058036A1/en active IP Right Grant
- 2000-02-22 JP JP2000607777A patent/JP2002540518A/en active Pending
- 2000-03-20 TW TW089105183A patent/TW496784B/en not_active IP Right Cessation
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2001
- 2001-05-18 US US09/860,724 patent/US6406273B2/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005124464A2 (en) * | 2004-06-16 | 2005-12-29 | The Boc Group Plc | Vacuum system for immersion photolithography |
WO2005124464A3 (en) * | 2004-06-16 | 2006-06-08 | Boc Group Plc | Vacuum system for immersion photolithography |
CN110531794A (en) * | 2019-08-30 | 2019-12-03 | 北京北方华创微电子装备有限公司 | Fluid pressure control device and method, cleaning solution supplying mechanism |
Also Published As
Publication number | Publication date |
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US6406273B2 (en) | 2002-06-18 |
JP2002540518A (en) | 2002-11-26 |
AU3372100A (en) | 2000-10-16 |
WO2000058036A1 (en) | 2000-10-05 |
US6247903B1 (en) | 2001-06-19 |
TW496784B (en) | 2002-08-01 |
KR100603030B1 (en) | 2006-07-24 |
KR20020010587A (en) | 2002-02-04 |
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