US20010043463A1 - Structure of tower-type personal computer - Google Patents
Structure of tower-type personal computer Download PDFInfo
- Publication number
- US20010043463A1 US20010043463A1 US09/281,827 US28182799A US2001043463A1 US 20010043463 A1 US20010043463 A1 US 20010043463A1 US 28182799 A US28182799 A US 28182799A US 2001043463 A1 US2001043463 A1 US 2001043463A1
- Authority
- US
- United States
- Prior art keywords
- frame
- upper portion
- lower portion
- power supply
- device drive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Definitions
- the present invention relates to a tower-type personal computer, and in particular to a structure of a tower-type personal computer which minimizes its main body in size, improves an aesthetic property, and increases reliability of products by efficiently performing a cooling process on a heat generated from its main body.
- FIG. 1 is a structure view illustrating an inside structure of a general tower-type personal computer.
- the general tower-type personal computer that consists of a hexahedron, includes: a frame 20 having its rear portion provided with a rear panel 10 having a plurality of connectors (not shown) for connection with peripheral devices, and having its one side formed for components to be installed; a front panel 30 installed at a front portion of the frame 20 so that disc and the like are inserted thereinto; a bottom panel 40 forming a bottom portion of the frame 20 ; and a cover 50 covering the frame 20 and forming an outline.
- a system for driving the computer is provided in the frame 20 .
- device driver modules 60 such as an FDD module 61 , an HDD module 62 and a CD-ROM module 63 .
- a power switch At the lower portion thereof are provided a power switch, a reset switch and an indicator.
- a mother board 64 where various interface circuit boards are installed is provided at one side portion of the frame 20 for sharing a signal cable and a power wire.
- a central processing unit (CPU) 65 controlling an operation of the system is provided at an upper portion of the mother board 64 .
- a plurality of option cards 66 improving system performance are positioned at a lower portion of the mother board 64 .
- a power supply 67 supplying a power to the system is provided at an upper portion of the rear panel 10 .
- a fan 67 a is installed at the power supply 67 toward a hole 10 a of the rear panel 10 , thereby externally discharging a heat generated from the power supply 67 .
- a fan 65 a is also provided at the CPU 65 , and thus serves to cool a heat generated therefrom.
- FIGS. 2 and 3 are side views respectively illustrating installing positions of components in accordance with the conventional technique.
- a module installing space (A) is provided at a front upper portion in the frame 20 for installing the device drive module 60 , such as the FDD module 61 , the HDD module 62 and the CD-ROM module 63 .
- a spare space (B) is provided at a lower portion thereof for obtaining an installing space for other components.
- a space for installing the power supply 67 and the CPU 65 is provided at an upper portion in the frame 20 , and a space for installing the plurality of option cards 66 is provided at a lower portion thereof.
- the positions of the module installing space (A) and the spare space (B) are exchangeable. Accordingly, the positions of the space for installing the power supply 67 and the CPU 65 and the space for installing the option cards 66 are exchanged.
- the personal computer As described above, in the general tower-type personal computer, a great deal of heat is generated from the CPU 65 and power supply 67 in operation, and as a result a temperature inside the system is increased. Accordingly, the personal computer must have a structure for minimizing an influence from the heat, when installing each component. Spaces must be efficiently utilized when arranging the components.
- a structure of a tower-type personal computer including: a frame having its rear portion provided with a rear panel having a plurality of connectors for connection with peripheral devices, its front lower portion provided with a device drive module installing space so that a disk and the like are inserted thereinto, its front upper portion formed in a round shape curved toward a rear direction, and its one side formed in order for computer components to be installed; a front panel provided at the front portion of the frame, having its lower portion formed for device drive modules to be installed, and having its upper portion formed in a round shape curved toward a rear direction identically to the upper portion of the frame, a plurality of vent holes being formed at the round-shaped portion; a bottom panel forming a bottom portion of the frame; a cover forming an outline by covering the frame; device drive modules installed at the lower portion of the front panel in the frame; a mother board installed at one side portion of the frame; a central processing unit installed
- FIG. 1 is a structure view illustrating an inside structure of a conventional tower-type personal computer
- FIG. 2 is a side-sectional view illustrating a structure of the conventional tower-type personal computer
- FIG. 3 is a side-sectional view illustrating a modified structure of the conventional tower-type personal computer
- FIG. 4 is a perspective view illustrating a tower-type personal computer according to the present invention.
- FIG. 5 is a side-sectional view illustrating a structure of the tower-type personal computer according to the present invention.
- FIG. 4 is a perspective view illustrating the tower-type personal computer according to the present invention.
- FIG. 5 is a side-sectional view illustrating the structure of the tower-type personal computer according to the present invention.
- the structure of the tower-type personal computer includes: a frame 100 having its rear portion provided with a rear panel 110 , its front lower portion provided with a device drive module installing space (C) so that a disk and the like are inserted thereinto, its front upper portion formed in a round shape curved toward a rear direction, and its one side formed in order for computer components to be installed; a front panel 200 provided at the front portion of the frame 100 , having its lower portion formed for device drive modules to be installed, and having its upper portion formed in a round shape curved toward a rear direction identically to the upper portion of the frame 100 , a plurality of vent holes 210 being formed at the round-shaped portion; a bottom panel 120 forming a bottom portion of the frame 100 ; and a cover 300 forming an outline by covering the frame 100 .
- C device drive module installing space
- a system driving the computer described above is provided in the computer.
- Device modules 500 such as an FDD module 510 , an HDD module 520 and a CD-ROM module 530 are installed at the installing space (C) of the front lower portion of the frame 100 .
- a mother board 540 is provided at one side portion of the frame 100 .
- Various interface circuit boards are arranged on the mother board in order to share a signal cable or a power wire.
- a power supply 550 supplying a power to the system is provided at the rear upper portion of the frame 100 .
- a central processing unit 560 is installed adjacent to the power supply 550 on the mother board. That is, in profile, the CPU 560 is partly overlapped with the power supply 550 . It is also possible to position the CPU 560 at the lower portion of the power supply 550 .
- a plurality of option cards 570 providing additional functions to the system are installed at the lower portion of the mother board.
- the plurality of option cards 570 are alternately positioned with the device drive modules 500 so that the option cards 570 may utilize a region of the module installing space (C) according to length thereof.
- a cooling fan 550 a affixed to the power supply 550 is positioned toward the central processing unit 560 .
- a plurality of holes 110 a are formed at the rear panel 110 which is adjacent to the power supply 550 , and thus an air can be easily passed.
- the module installing space (C) for installing the device drive modules is provided at the front lower portion in the frame 100 .
- a space for installing the power supply 550 and the central processing unit 560 is provided at the rear upper portion of the frame 100 .
- a space for installing the plurality of option cards 570 is provided at the lower portion thereof.
- the installing position of the power supply 550 and the central processing unit 560 can be exchanged with the installing position of the option cards 570 . That is, the power supply 550 and the CPU 560 may be positioned at the lower portion of the frame 110 , and the option card 570 may be positioned at the upper portion of the frame 110 . Also in this case, the cooling fan 550 a of the power supply 550 is positioned toward the central processing unit 560 .
- a heat generated from the central processing unit 560 in operation is cooled by the cooling fan 550 a of the power supply 550 that is positioned toward the central processing unit 560 .
- the power supply 550 and CPU 560 generating a lot of heat are arranged at the upper portion of the frame 100 , and an air heated by the heat rises. Thereafter, the heat is not transmitted to the module installing space (C), but externally discharged through the vent holes 210 formed at the round-shaped portion of the front panel 200 .
- the structure of the tower-type personal computer in accordance with the present invention is provided with the round-shaped front panel, thereby reducing an unnecessary space, minimizing the product in size, and improving an aesthetic sense of the outline design.
- the heat generated from the system is externally discharged through the vent holes by the cooling fan, and thus cooling is rapidly carried out.
- a mis-operation of the system is prevented, a lifespan of the product is increased, and a competitive power in cost is improved due to reduction in production cost by decreasing additional components for cooling.
Abstract
Description
- 1. Field of the Invention
- The present invention relates to a tower-type personal computer, and in particular to a structure of a tower-type personal computer which minimizes its main body in size, improves an aesthetic property, and increases reliability of products by efficiently performing a cooling process on a heat generated from its main body.
- 2. Description of the Background Art
- FIG. 1 is a structure view illustrating an inside structure of a general tower-type personal computer. As shown therein, the general tower-type personal computer that consists of a hexahedron, includes: a
frame 20 having its rear portion provided with arear panel 10 having a plurality of connectors (not shown) for connection with peripheral devices, and having its one side formed for components to be installed; afront panel 30 installed at a front portion of theframe 20 so that disc and the like are inserted thereinto; abottom panel 40 forming a bottom portion of theframe 20; and acover 50 covering theframe 20 and forming an outline. - On the other hand, a system for driving the computer is provided in the
frame 20. At the upper portion of thefront panel 30 are installeddevice driver modules 60, such as anFDD module 61, anHDD module 62 and a CD-ROM module 63. At the lower portion thereof are provided a power switch, a reset switch and an indicator. Amother board 64 where various interface circuit boards are installed is provided at one side portion of theframe 20 for sharing a signal cable and a power wire. - Further, a central processing unit (CPU)65 controlling an operation of the system is provided at an upper portion of the
mother board 64. A plurality ofoption cards 66 improving system performance are positioned at a lower portion of themother board 64. Apower supply 67 supplying a power to the system is provided at an upper portion of therear panel 10. - Here, a
fan 67 a is installed at thepower supply 67 toward ahole 10 a of therear panel 10, thereby externally discharging a heat generated from thepower supply 67. Afan 65 a is also provided at theCPU 65, and thus serves to cool a heat generated therefrom. - FIGS. 2 and 3 are side views respectively illustrating installing positions of components in accordance with the conventional technique.
- Referring to FIG. 2, a module installing space (A) is provided at a front upper portion in the
frame 20 for installing thedevice drive module 60, such as theFDD module 61, theHDD module 62 and the CD-ROM module 63. A spare space (B) is provided at a lower portion thereof for obtaining an installing space for other components. - In addition, a space for installing the
power supply 67 and theCPU 65 is provided at an upper portion in theframe 20, and a space for installing the plurality ofoption cards 66 is provided at a lower portion thereof. - As a modified embodiment of the constitution in FIG. 2, as illustrated in FIG. 3, the positions of the module installing space (A) and the spare space (B) are exchangeable. Accordingly, the positions of the space for installing the
power supply 67 and theCPU 65 and the space for installing theoption cards 66 are exchanged. - As described above, in the general tower-type personal computer, a great deal of heat is generated from the
CPU 65 andpower supply 67 in operation, and as a result a temperature inside the system is increased. Accordingly, the personal computer must have a structure for minimizing an influence from the heat, when installing each component. Spaces must be efficiently utilized when arranging the components. - However, in the conventional personal computer shape and system installing structure, only the heat generated from the power supply can be externally discharged. Accordingly, the heat generated from the CPU and components are transmitted to the module installing space, thus influencing on the device drive modules. As a result, a mis-operation of the system takes place, and a lifespan thereof is decreased.
- In addition, when the power supply is positioned at the lower portion of the personal computer, a heat generated from the power supply rises by a convection process. Accordingly, the components of the personal computer, such as the CPU are heated, and thus lifespan thereof is decreased.
- In order to overcome the above-mentioned disadvantages, an special cooling fan is further provided at the CPU. However, it incurs more expenses and causes much noise.
- In addition, it is difficult to minimize the computer in size and to improve an aesthetic property due to the spare space for installing other components.
- It is therefore an object of the present invention to provide a structure of a tower-type personal computer which minimizes the computer in size and improves an aesthetic property by forming a front upper portion of a computer main body in a round shape with a plurality of vent holes, and which increases cooling efficiency of a system.
- In order to achieve the above-mentioned object of the present invention, there is provided a structure of a tower-type personal computer including: a frame having its rear portion provided with a rear panel having a plurality of connectors for connection with peripheral devices, its front lower portion provided with a device drive module installing space so that a disk and the like are inserted thereinto, its front upper portion formed in a round shape curved toward a rear direction, and its one side formed in order for computer components to be installed; a front panel provided at the front portion of the frame, having its lower portion formed for device drive modules to be installed, and having its upper portion formed in a round shape curved toward a rear direction identically to the upper portion of the frame, a plurality of vent holes being formed at the round-shaped portion; a bottom panel forming a bottom portion of the frame; a cover forming an outline by covering the frame; device drive modules installed at the lower portion of the front panel in the frame; a mother board installed at one side portion of the frame; a central processing unit installed at the upper portion of the mother board; a power supply installed at the rear panel on an identical horizontal line to the central processing unit; and a plurality of option cards installed at the lower portion of the mother board.
- The present invention will become better understood with reference to the accompanying drawings which are given only by way of illustration and thus are not limitative of the present invention, wherein:
- FIG. 1 is a structure view illustrating an inside structure of a conventional tower-type personal computer;
- FIG. 2 is a side-sectional view illustrating a structure of the conventional tower-type personal computer;
- FIG. 3 is a side-sectional view illustrating a modified structure of the conventional tower-type personal computer;
- FIG. 4 is a perspective view illustrating a tower-type personal computer according to the present invention; and
- FIG. 5 is a side-sectional view illustrating a structure of the tower-type personal computer according to the present invention.
- A structure of a tower-type personal computer in accordance with the present invention will now be described with reference to the accompanying drawings.
- FIG. 4 is a perspective view illustrating the tower-type personal computer according to the present invention. FIG. 5 is a side-sectional view illustrating the structure of the tower-type personal computer according to the present invention.
- Referring to FIGS. 4 and 5, the structure of the tower-type personal computer includes: a
frame 100 having its rear portion provided with arear panel 110, its front lower portion provided with a device drive module installing space (C) so that a disk and the like are inserted thereinto, its front upper portion formed in a round shape curved toward a rear direction, and its one side formed in order for computer components to be installed; afront panel 200 provided at the front portion of theframe 100, having its lower portion formed for device drive modules to be installed, and having its upper portion formed in a round shape curved toward a rear direction identically to the upper portion of theframe 100, a plurality ofvent holes 210 being formed at the round-shaped portion; abottom panel 120 forming a bottom portion of theframe 100; and acover 300 forming an outline by covering theframe 100. - A system driving the computer described above is provided in the computer.
Device modules 500 such as anFDD module 510, anHDD module 520 and a CD-ROM module 530 are installed at the installing space (C) of the front lower portion of theframe 100. Amother board 540 is provided at one side portion of theframe 100. Various interface circuit boards are arranged on the mother board in order to share a signal cable or a power wire. - Further, a
power supply 550 supplying a power to the system is provided at the rear upper portion of theframe 100. Acentral processing unit 560 is installed adjacent to thepower supply 550 on the mother board. That is, in profile, theCPU 560 is partly overlapped with thepower supply 550. It is also possible to position theCPU 560 at the lower portion of thepower supply 550. A plurality ofoption cards 570 providing additional functions to the system are installed at the lower portion of the mother board. - Here, the plurality of
option cards 570 are alternately positioned with thedevice drive modules 500 so that theoption cards 570 may utilize a region of the module installing space (C) according to length thereof. - In addition, a
cooling fan 550 a affixed to thepower supply 550 is positioned toward thecentral processing unit 560. A plurality of holes 110 a are formed at therear panel 110 which is adjacent to thepower supply 550, and thus an air can be easily passed. - According to the present invention, the module installing space (C) for installing the device drive modules is provided at the front lower portion in the
frame 100. A space for installing thepower supply 550 and thecentral processing unit 560 is provided at the rear upper portion of theframe 100. Also, a space for installing the plurality ofoption cards 570 is provided at the lower portion thereof. - Here, the installing position of the
power supply 550 and thecentral processing unit 560 can be exchanged with the installing position of theoption cards 570. That is, thepower supply 550 and theCPU 560 may be positioned at the lower portion of theframe 110, and theoption card 570 may be positioned at the upper portion of theframe 110. Also in this case, the coolingfan 550 a of thepower supply 550 is positioned toward thecentral processing unit 560. - In accordance with the structure of the tower-type personal computer of the present invention, a heat generated from the
central processing unit 560 in operation is cooled by the coolingfan 550 a of thepower supply 550 that is positioned toward thecentral processing unit 560. Thepower supply 550 andCPU 560 generating a lot of heat are arranged at the upper portion of theframe 100, and an air heated by the heat rises. Thereafter, the heat is not transmitted to the module installing space (C), but externally discharged through the vent holes 210 formed at the round-shaped portion of thefront panel 200. - As discussed earlier, the structure of the tower-type personal computer in accordance with the present invention is provided with the round-shaped front panel, thereby reducing an unnecessary space, minimizing the product in size, and improving an aesthetic sense of the outline design.
- In addition, in accordance with the present invention, the heat generated from the system is externally discharged through the vent holes by the cooling fan, and thus cooling is rapidly carried out. As a result, a mis-operation of the system is prevented, a lifespan of the product is increased, and a competitive power in cost is improved due to reduction in production cost by decreasing additional components for cooling.
- As the present invention may be embodied in several forms without departing from the spirit or essential characteristics thereof, it should also be understood that the above-described embodiment is not limited by any of the details of the foregoing description, unless otherwise specified, but rather should be construed broadly within its spirit and scope as defined in the appended claims, and therefore all changes and modifications that fall within the meets and bounds of the claims, or equivalences of such meets and bounds are therefore intended to be embraced by the appended claims.
Claims (8)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019980012799A KR100360446B1 (en) | 1998-04-10 | 1998-04-10 | Structure of tower type pc |
KR12799/1998 | 1998-04-10 | ||
KR1998-12799 | 1998-04-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
US20010043463A1 true US20010043463A1 (en) | 2001-11-22 |
US6396684B2 US6396684B2 (en) | 2002-05-28 |
Family
ID=19536084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/281,827 Expired - Fee Related US6396684B2 (en) | 1998-04-10 | 1999-04-05 | Structure of tower-type personal computer |
Country Status (2)
Country | Link |
---|---|
US (1) | US6396684B2 (en) |
KR (1) | KR100360446B1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1585012A1 (en) * | 2004-04-05 | 2005-10-12 | Shuttle Inc. | Internal arrangement of computer case |
US20090127988A1 (en) * | 2007-11-20 | 2009-05-21 | Sergejs Lucuks | Device for a computer case cover |
US20120069520A1 (en) * | 2010-09-22 | 2012-03-22 | Panasonic Corporation | Electronic device with cooling capability |
CN103616938A (en) * | 2013-12-09 | 2014-03-05 | 中山爱科数字科技股份有限公司 | Household medical interactive terminal |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7426328B2 (en) * | 2002-08-28 | 2008-09-16 | Phosistor Technologies, Inc. | Varying refractive index optical medium using at least two materials with thicknesses less than a wavelength |
DE10251541B3 (en) * | 2002-11-05 | 2004-05-27 | Medion Ag | Housing for electrical device, especially computer, has housing wall(s) with inward-facing recess with ventilation opening(s) covered on outside with at least one cover close to ventilation opening |
KR100490158B1 (en) * | 2002-12-14 | 2005-05-16 | 엘지전자 주식회사 | back cover structure of refrigeration fan |
US20050237723A1 (en) * | 2004-04-21 | 2005-10-27 | Yin-Hung Chen | Computer casing |
JP4518097B2 (en) * | 2007-04-13 | 2010-08-04 | ソニー株式会社 | Front structure of information processing equipment |
US20090154091A1 (en) | 2007-12-17 | 2009-06-18 | Yatskov Alexander I | Cooling systems and heat exchangers for cooling computer components |
US8170724B2 (en) | 2008-02-11 | 2012-05-01 | Cray Inc. | Systems and associated methods for controllably cooling computer components |
US7898799B2 (en) | 2008-04-01 | 2011-03-01 | Cray Inc. | Airflow management apparatus for computer cabinets and associated methods |
US8081459B2 (en) | 2008-10-17 | 2011-12-20 | Cray Inc. | Air conditioning systems for computer systems and associated methods |
US7903403B2 (en) * | 2008-10-17 | 2011-03-08 | Cray Inc. | Airflow intake systems and associated methods for use with computer cabinets |
US8472181B2 (en) | 2010-04-20 | 2013-06-25 | Cray Inc. | Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use |
USD1012050S1 (en) * | 2019-06-21 | 2024-01-23 | Raspberry Pi (Trading) Limited | Computer |
KR102368438B1 (en) | 2020-02-24 | 2022-02-28 | 주식회사 공간 | Prefabricated border edge with height adjustment structure |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD363479S (en) * | 1993-09-10 | 1995-10-24 | Compuadd Corporation | Computer housing front panel |
KR950023817U (en) * | 1994-01-31 | 1995-08-23 | Desktop personal computer | |
US5432674A (en) * | 1994-03-02 | 1995-07-11 | Compaq Computer Corporation | Computer tower unit having internal air flow control baffle structure |
USD363707S (en) * | 1994-03-11 | 1995-10-31 | The Panda Project | Computer cabinet |
USD369923S (en) * | 1994-03-11 | 1996-05-21 | The Panda Project | Computer cabinet |
US5527104A (en) * | 1994-04-06 | 1996-06-18 | Dell Usa, L. P. | Computer chassis cover alignment apparatus |
US5547272A (en) * | 1995-04-24 | 1996-08-20 | At&T Global Information Solutions Company | Modular cabinet bezel |
USD382255S (en) * | 1996-02-26 | 1997-08-12 | International Business Machines Corporation | Infra-red transmitter/receiver for a desktop personal computer |
US5917696A (en) * | 1997-09-16 | 1999-06-29 | Enlight Corporation | Structure for connecting seat of PC mainboard and interface cards and for computer housing |
-
1998
- 1998-04-10 KR KR1019980012799A patent/KR100360446B1/en not_active IP Right Cessation
-
1999
- 1999-04-05 US US09/281,827 patent/US6396684B2/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1585012A1 (en) * | 2004-04-05 | 2005-10-12 | Shuttle Inc. | Internal arrangement of computer case |
US20090127988A1 (en) * | 2007-11-20 | 2009-05-21 | Sergejs Lucuks | Device for a computer case cover |
US20120069520A1 (en) * | 2010-09-22 | 2012-03-22 | Panasonic Corporation | Electronic device with cooling capability |
US8934241B2 (en) * | 2010-09-22 | 2015-01-13 | Panasonic Corporation | Electronic device with cooling capability |
CN103616938A (en) * | 2013-12-09 | 2014-03-05 | 中山爱科数字科技股份有限公司 | Household medical interactive terminal |
Also Published As
Publication number | Publication date |
---|---|
US6396684B2 (en) | 2002-05-28 |
KR19990079908A (en) | 1999-11-05 |
KR100360446B1 (en) | 2003-01-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6396684B2 (en) | Structure of tower-type personal computer | |
US5936836A (en) | Computer with an improved internal cooling system | |
US6392872B1 (en) | Computer system | |
US6061237A (en) | Computer with an improved cooling system and a method for cooling a computer | |
JP3058389U (en) | Radiator for electronic products | |
EP2106206B1 (en) | Cooling device for accomodated printed circuit board in a chassis | |
US20070217139A1 (en) | Compartmented computer case | |
US20050276015A1 (en) | Computing device | |
US8472184B2 (en) | Industrial computer capable of dust prevention and resistant to vibration | |
US7522413B2 (en) | Heat dissipating system | |
US20010027132A1 (en) | Electronic equipment and television game machine having heat radiation structure | |
EP2525635A2 (en) | Server chassis | |
US20060279926A1 (en) | Computer having a heat discharging unit | |
US20030112598A1 (en) | Disk array unit | |
US6661665B2 (en) | Method and apparatus for removing heat from an electronic device | |
US20080298035A1 (en) | Printed circuit board unit | |
US6967837B2 (en) | Computer apparatus assembled wirelessly | |
US5751550A (en) | Ultra-quiet, thermally efficient cooling system for forced air cooled electronics | |
US20050018388A1 (en) | Redundant power supply wirelessly connected to motherboard | |
EP1333359B1 (en) | Housing for a passively cooled computer | |
US5953209A (en) | Push and pull dual-fan heat sink design | |
US8780554B2 (en) | Electronic device | |
US7929288B1 (en) | Computer | |
US7359193B2 (en) | Electronic equipment | |
CN101158879A (en) | Electronic apparatus and cooling method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: LG ELECTRONICS INC., KOREA, REPUBLIC OF Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LEE, HYUN HO;REEL/FRAME:009889/0131 Effective date: 19990324 |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees | ||
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20140528 |