US20010021102A1 - Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof - Google Patents

Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof Download PDF

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Publication number
US20010021102A1
US20010021102A1 US20879098A US2001021102A1 US 20010021102 A1 US20010021102 A1 US 20010021102A1 US 20879098 A US20879098 A US 20879098A US 2001021102 A1 US2001021102 A1 US 2001021102A1
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US
United States
Prior art keywords
chip
transfer media
thermal paste
heat transfer
heat sink
Prior art date
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Pending
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Inventor
David L Edwards
Glenn G Daves
Shaji Farooq
Sushumna Iruvanti
Frank L Pompeo
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Individual
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Individual
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Filing date
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Application filed by Individual filed Critical Individual
Priority to US09/208,790 priority Critical patent/US6275381B1/en
Priority to US09/619,886 priority patent/US6444496B1/en
Application granted granted Critical
Publication of US6275381B1 publication Critical patent/US6275381B1/en
Publication of US20010021102A1 publication Critical patent/US20010021102A1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US09/208,790 1998-12-10 1998-12-10 Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof Expired - Lifetime US6275381B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US09/208,790 US6275381B1 (en) 1998-12-10 1998-12-10 Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof
US09/619,886 US6444496B1 (en) 1998-12-10 2000-07-20 Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/208,790 US6275381B1 (en) 1998-12-10 1998-12-10 Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US09/619,886 Division US6444496B1 (en) 1998-12-10 2000-07-20 Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof

Publications (2)

Publication Number Publication Date
US6275381B1 US6275381B1 (en) 2001-08-14
US20010021102A1 true US20010021102A1 (en) 2001-09-13

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
US09/208,790 Expired - Lifetime US6275381B1 (en) 1998-12-10 1998-12-10 Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof
US09/619,886 Expired - Fee Related US6444496B1 (en) 1998-12-10 2000-07-20 Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof

Family Applications After (1)

Application Number Title Priority Date Filing Date
US09/619,886 Expired - Fee Related US6444496B1 (en) 1998-12-10 2000-07-20 Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040123981A1 (en) * 2002-12-31 2004-07-01 Frank Wang Heat-dissicipating substrate
US20050099778A1 (en) * 2003-11-11 2005-05-12 Sumitomo Wiring Systems, Ltd. Circuit assembly and method for producing the same
US20100117222A1 (en) * 2006-06-07 2010-05-13 Seah Sun Too Void Reduction in Indium Thermal Interface Material

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Also Published As

Publication number Publication date
US6444496B1 (en) 2002-09-03
US6275381B1 (en) 2001-08-14

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