US20010003606A1 - Method for improving stability of anti-coating layer - Google Patents

Method for improving stability of anti-coating layer Download PDF

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Publication number
US20010003606A1
US20010003606A1 US09/325,365 US32536599A US2001003606A1 US 20010003606 A1 US20010003606 A1 US 20010003606A1 US 32536599 A US32536599 A US 32536599A US 2001003606 A1 US2001003606 A1 US 2001003606A1
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layer
sio
oxidizer
arc
treatment step
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US09/325,365
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Hung-Yu Kou
Brian Wang
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United Microelectronics Corp
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United Microelectronics Corp
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Assigned to UNITED MICROELECTRONICS CORP. reassignment UNITED MICROELECTRONICS CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: UNITED SEMICONDUCTOR CORP.
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/56—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/308—Oxynitrides
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement

Definitions

  • the present invention relates to a method for treating an anti-reflection coating (ARC) layer. More particularly, the present invention relates to a method for improving the stability of an ARC layer.
  • ARC anti-reflection coating
  • Multilevel interconnections are used to connect metallic layers.
  • the multilevel interconnections are utilized for the purpose of connecting the metallic layers in order to transfer signals.
  • inter-metal dielectric layers are formed between the metallic layers.
  • the multilevel interconnection fabrication process is complicated. Since a variety of steps, such as metallic sputtering, dielectric material deposition, or photolithography and etching are involved in the multilevel interconnection fabrication process, there are strict parameters for the performance of every step.
  • materials of the inter-metal dielectric layer and the metallic layer affect exposure focus.
  • an ARC layer such as a SiO x N y layer, is formed on the metallic layer.
  • the reflectivity of the ARC layer is very important since it greatly affects the exposure intensity and focus of the subsequent step.
  • the conventional method forms a cap layer on the ARC layer in order to reduce the decay rate of the reflectivity of the ARC layer.
  • this causes difficulty in determining the thickness of the ARC layer. Since the thickness of the ARC layer also affects the reflectivity of the ARC layer, it is important to control the thickness of the ARC layer.
  • FIG. 1 shows a comparison diagram of different decay rates for several ARC layers, each having different cap layers.
  • SiO x N y is used as an exemplary ARC layer.
  • a horizontal axis represents time, measured in hours.
  • the vertical axis is reflectivity, measured as a percentage.
  • the curve comprising black diamonds represents a SiO x N y layer with no cap layer covering.
  • the curve comprising black triangles represents a SiO x N y layer covered by a cap layer having a thickness of 50 angstroms.
  • the curve comprising black squares represents a SiO x N y layer covered by a cap layer having a thickness of 100 angstroms.
  • the SiO x N y layer with no cap layer covering has a continuously decaying reflectivity, even after the second or the third day. Therefore, it is necessary to consider the decay of the SiO x N y layer while performing an exposure step. This, in turn, causes difficulty in determining the exposure parameters with consideration for decay of the SiO x N y layer.
  • forming a cap layer covering a SiO x N y layer slightly reduces the decay of the SiO x N y layer.
  • the conventional method is not optimal.
  • the reflectivity of the SiO x N y layer covered by a cap layer that is about 50 angstroms thick is about 1.1 times higher than the reflectivity of the SiO x N y layer covered by a cap layer that is about 100 angstroms thick. Therefore, if the thickness of the cap layer is not controlled, it is difficult to obtain a reflectivity of the SiO x N y layer. The quality SiO x N y layer cannot be ensured.
  • the invention provides a method for improving stability of an anti-reflection coating (ARC) layer.
  • An anti-reflection coating layer covered by a SiO x N y layer is provided.
  • the SiO x N y layer comprises a plurality of dangling bonds.
  • a surface treatment step with an oxidizer-based plasma on the SiO x N y layer is performed to bond completely the dangling bonds.
  • the present invention also provides a method of fabricating an anti-reflection coating layer.
  • a surface treatment step with an oxidizer-based plasma is performed on a SiO x N y layer for about 2 seconds to form an oxide layer on the SiO x N y layer.
  • the oxide layer is preferably about 50 angstroms thick.
  • the oxidizer-based plasma preferably comprises O 2 , N 2 O, or a combination thereof.
  • the surface treatment step is an in-situ step. Thus, it is unnecessary to transfer the chip into another reaction chamber after the deposition of the SiO x N y layer.
  • the plasma treatment step can be instantly performed on the ARC layer in the same reaction chamber.
  • the thickness of the ARC layer does not changed with the passage of time.
  • the reflectivity of the ARC layer does not changed as the time passes either. Therefore, there is no need to adjust constantly the exposure parameters while performing an exposure step on the dielectric layer over the ARC layer.
  • the invention forms the thin oxide layer by bonding the dangling bonds of the SiO x N y layer surface during the surface treatment step.
  • the quality of the ARC layer is effectively controlled and the stability of the ARC layer is improved, as well.
  • FIG. 1 is a comparison diagram showing decays of several anti-reflection layers, each having a different cap layer formed thereon according to a conventional method
  • FIG. 2 is a schematic diagram showing a molecular structure of a SiO x N y layer according to one preferred embodiment of the invention.
  • FIG. 3 is a schematic diagram showing an oxide layer formed on a SiO x N y layer according to one preferred embodiment of the invention.
  • an ARC layer is formed on a conductive layer.
  • a dielectric layer is formed on the ARC layer.
  • An exposure step is performed in the subsequent step in order to pattern the dielectric layer. In the exposure step, the ARC layer is used to decreases the light reflection.
  • the ARC layer is a single SiO x N y layer.
  • the ARC layer can also be a stacked layer comprises a SiO x N y layer thereon.
  • FIG. 2 shows dangling bonds 102 of the SiO x N y layer 100 .
  • the dangling bonds 102 connect to Si atoms of the SiO x N y layer 100 and causes unstable SiO x N y layer 100 .
  • this unstable SiO x N y layer 100 usually occurs on an ARC layer.
  • the present invention at least comprises performing a surface treatment step.
  • the surface treatment step is preferably performed on the SiO x N y layer 100 with an oxidizer-based plasma, in order to bond completely the dangling bonds.
  • the oxidizer-based plasma preferably comprises O 2 , N 2 O, or a combination thereof.
  • the energy of the oxidizer-based plasma is preferably about 70 W.
  • the surface treatment step forms an oxide layer 104 having a thickness of about 50 angstroms on the SiO x N y layer 100 . Such thickness is sufficient to bond completely the dangling bonds.
  • the surface treatment is preferably performed for about 2 seconds with an environment pressure of about 2.5 Torr. According to experiment results, the thickness of the oxide layer 104 is almost the same at between about 2 seconds to about 10 seconds.
  • the preferred embodiment takes the SiO x N y layer 100 as the ARC layer for example.
  • the ARC layer can also be a stacked layer, which at least comprises the SiO x N y layer 100 thereon.
  • the surface treatment step is an in-situ step. Thus, it is unnecessary to transfer the chip into another reaction chamber after the deposition of the SiO x N y layer 100 .
  • the plasma treatment step can be instantly performed on the ARC layer in the same reaction chamber.
  • the present invention provides an instant plasma treatment step to form the oxide layer 104 on the SiO x N y layer 100 .
  • the oxide layer 104 is formed on the ARC layer, the thickness of the ARC layer does not changed with the passage of time. The reflectivity of the ARC layer does not changed as the time passes either. Therefore, there is no need to adjust constantly the exposure parameters while performing an exposure step on the dielectric layer over the ARC layer.
  • the surface treatment step does not provide any reactor.
  • the present invention forms the thin oxide layer 104 only by bonding the dangling bonds of the SiO x N y layer 100 surface during the surface treatment step.
  • the quality of the ARC layer is effectively controlled and the stability of the ARC layer is improved, as well.

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

A method for improving the stability of an anti-reflection coating layer is provided. The anti-reflection coating layer covered by a SiOxNy layer is provided. A surface treatment step is performed with an oxidizer-based plasma on the SiOxNy layer to form an oxide layer. The oxidizer-based plasma comprises O2, and N2O.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0001]
  • The present invention relates to a method for treating an anti-reflection coating (ARC) layer. More particularly, the present invention relates to a method for improving the stability of an ARC layer. [0002]
  • 2. Description of the Related Art [0003]
  • Multilevel interconnections are used to connect metallic layers. The multilevel interconnections are utilized for the purpose of connecting the metallic layers in order to transfer signals. In order to prevent the metallic layers from making contact with each other, inter-metal dielectric layers are formed between the metallic layers. The multilevel interconnection fabrication process is complicated. Since a variety of steps, such as metallic sputtering, dielectric material deposition, or photolithography and etching are involved in the multilevel interconnection fabrication process, there are strict parameters for the performance of every step. [0004]
  • Additionally, materials of the inter-metal dielectric layer and the metallic layer affect exposure focus. In order to prevent the exposure focus from being affected by the reflected light from the metallic layer, an ARC layer, such as a SiO[0005] xNy layer, is formed on the metallic layer. The reflectivity of the ARC layer is very important since it greatly affects the exposure intensity and focus of the subsequent step.
  • Unfortunately, the reflectivity of the ARC layer decays with the passage of time. Thus, it is necessary to adjust constantly the parameters of the exposure step according to the decay of the ARC layer. This makes the exposure step cumbersome and slow. [0006]
  • To solve the decay problem of the ARC layer, the conventional method forms a cap layer on the ARC layer in order to reduce the decay rate of the reflectivity of the ARC layer. However, this causes difficulty in determining the thickness of the ARC layer. Since the thickness of the ARC layer also affects the reflectivity of the ARC layer, it is important to control the thickness of the ARC layer. [0007]
  • Reference is made to FIG. 1, which shows a comparison diagram of different decay rates for several ARC layers, each having different cap layers. In FIG. 1, SiO[0008] xNy is used as an exemplary ARC layer. A horizontal axis represents time, measured in hours. The vertical axis is reflectivity, measured as a percentage. The curve comprising black diamonds represents a SiOxNy layer with no cap layer covering. The curve comprising black triangles represents a SiOxNy layer covered by a cap layer having a thickness of 50 angstroms. The curve comprising black squares represents a SiOxNy layer covered by a cap layer having a thickness of 100 angstroms.
  • As shown in the diagram, the SiO[0009] xNy layer with no cap layer covering has a continuously decaying reflectivity, even after the second or the third day. Therefore, it is necessary to consider the decay of the SiOxNy layer while performing an exposure step. This, in turn, causes difficulty in determining the exposure parameters with consideration for decay of the SiOxNy layer.
  • In the conventional method, forming a cap layer covering a SiO[0010] xNy layer slightly reduces the decay of the SiOxNy layer. However it is difficult to control the thickness of the cap layer formed by, for example, thermal oxidation or other suitable steps, especially when the cap layer is required to be thinner than 100 angstroms. Thus, the conventional method is not optimal.
  • As shown in FIG. 1, the reflectivity of the SiO[0011] xNy layer covered by a cap layer that is about 50 angstroms thick, is about 1.1 times higher than the reflectivity of the SiOxNy layer covered by a cap layer that is about 100 angstroms thick. Therefore, if the thickness of the cap layer is not controlled, it is difficult to obtain a reflectivity of the SiOxNy layer. The quality SiOxNy layer cannot be ensured.
    • SUMMARY OF THE INVENTION
  • The invention provides a method for improving stability of an anti-reflection coating (ARC) layer. An anti-reflection coating layer covered by a SiO[0012] xNy layer is provided. The SiOxNy layer comprises a plurality of dangling bonds. A surface treatment step with an oxidizer-based plasma on the SiOxNy layer is performed to bond completely the dangling bonds.
  • The present invention also provides a method of fabricating an anti-reflection coating layer. A surface treatment step with an oxidizer-based plasma is performed on a SiO[0013] xNy layer for about 2 seconds to form an oxide layer on the SiOxNy layer. The oxide layer is preferably about 50 angstroms thick.
  • In the invention, the oxidizer-based plasma preferably comprises O[0014] 2, N2O, or a combination thereof.
  • The surface treatment step is an in-situ step. Thus, it is unnecessary to transfer the chip into another reaction chamber after the deposition of the SiO[0015] xNy layer. The plasma treatment step can be instantly performed on the ARC layer in the same reaction chamber.
  • Because the oxide layer is formed on the ARC layer, the thickness of the ARC layer does not changed with the passage of time. The reflectivity of the ARC layer does not changed as the time passes either. Therefore, there is no need to adjust constantly the exposure parameters while performing an exposure step on the dielectric layer over the ARC layer. [0016]
  • Moreover, since the surface treatment step does not provide any reactor, the invention forms the thin oxide layer by bonding the dangling bonds of the SiO[0017] xNy layer surface during the surface treatment step. Thus, the quality of the ARC layer is effectively controlled and the stability of the ARC layer is improved, as well.
  • It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed. [0018]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The accompanying drawing is included to provide a further understanding of the invention, and is incorporated in and constitutes a part of this specification. The drawing illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. In the drawing, [0019]
  • FIG. 1 is a comparison diagram showing decays of several anti-reflection layers, each having a different cap layer formed thereon according to a conventional method; [0020]
  • FIG. 2 is a schematic diagram showing a molecular structure of a SiO[0021] xNy layer according to one preferred embodiment of the invention; and
  • FIG. 3 is a schematic diagram showing an oxide layer formed on a SiO[0022] xNy layer according to one preferred embodiment of the invention.
    • DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts. [0023]
  • Typically, an ARC layer is formed on a conductive layer. A dielectric layer is formed on the ARC layer. An exposure step is performed in the subsequent step in order to pattern the dielectric layer. In the exposure step, the ARC layer is used to decreases the light reflection. [0024]
  • In the following preferred embodiment, the ARC layer is a single SiO[0025] xNy layer. However, the ARC layer can also be a stacked layer comprises a SiOxNy layer thereon. Reference is made to FIG. 2, which shows dangling bonds 102 of the SiOxNy layer 100. The dangling bonds 102 connect to Si atoms of the SiOxNy layer 100 and causes unstable SiOxNy layer 100. Commonly, this unstable SiOxNy layer 100 usually occurs on an ARC layer.
  • The present invention at least comprises performing a surface treatment step. The surface treatment step is preferably performed on the SiO[0026] xNy layer 100 with an oxidizer-based plasma, in order to bond completely the dangling bonds. The oxidizer-based plasma preferably comprises O2, N2O, or a combination thereof. The energy of the oxidizer-based plasma is preferably about 70 W.
  • In FIG. 3, the surface treatment step forms an [0027] oxide layer 104 having a thickness of about 50 angstroms on the SiOxNy layer 100. Such thickness is sufficient to bond completely the dangling bonds. The surface treatment is preferably performed for about 2 seconds with an environment pressure of about 2.5 Torr. According to experiment results, the thickness of the oxide layer 104 is almost the same at between about 2 seconds to about 10 seconds. As shown in FIG, 3, the preferred embodiment takes the SiOxNy layer 100 as the ARC layer for example. However, the ARC layer can also be a stacked layer, which at least comprises the SiOxNy layer 100 thereon.
  • The surface treatment step is an in-situ step. Thus, it is unnecessary to transfer the chip into another reaction chamber after the deposition of the SiO[0028] xNy layer 100. The plasma treatment step can be instantly performed on the ARC layer in the same reaction chamber.
  • In other words, the present invention provides an instant plasma treatment step to form the [0029] oxide layer 104 on the SiOxNy layer 100.
  • Because the [0030] oxide layer 104 is formed on the ARC layer, the thickness of the ARC layer does not changed with the passage of time. The reflectivity of the ARC layer does not changed as the time passes either. Therefore, there is no need to adjust constantly the exposure parameters while performing an exposure step on the dielectric layer over the ARC layer.
  • In the preferred embodiment, the surface treatment step does not provide any reactor. The present invention forms the [0031] thin oxide layer 104 only by bonding the dangling bonds of the SiOxNy layer 100 surface during the surface treatment step. Thus, the quality of the ARC layer is effectively controlled and the stability of the ARC layer is improved, as well.
  • It will be apparent to those skilled in the art that various modifications and variations can be made to the structure and the method of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents. [0032]

Claims (12)

What is claimed is:
1. A method for improving stability of an anti-reflection coating layer, comprising:
providing an anti-reflection coating layer covered by a SiOxNy layer, wherein the SiOxNy layer comprises a plurality of dangling bonds; and
performing a surface treatment step with an oxidizer-based plasma on the SiOxNy layer to bond completely the dangling bonds.
2. The method of
claim 1
, wherein the surface treatment step is performed for about 2 seconds.
3. The method of
claim 1
, wherein the oxidizer-based plasma comprises O2.
4. The method of
claim 1
, wherein the oxidizer-based plasma comprises N2O.
5. A method for improving stability of an anti-reflection coating layer, comprising:
providing the anti-reflection coating layer covered by a SiOxNy layer, wherein the SiOxNy layer comprises a plurality of dangling bonds; and
performing a surface treatment step with an oxidizer-based plasma on the SiOxNy layer to form an oxide layer, wherein the thickness of the oxide layer is sufficient enough to bond completely the dangling bonds.
6. The method of
claim 5
, wherein the thickness of the oxide layer is about 50 angstroms.
7. The method of
claim 5
, wherein the oxidizer plasma comprises O2.
8. The method of
claim 5
, wherein the oxidizer-based plasma comprises N2O.
9. The method of
claim 5
, wherein the surface treatment step is performed for about 2 seconds.
10. A method of fabricating an anti-reflection coating layer, comprises:
providing a SiOxNy layer; and
performing a surface treatment step with an oxidizer-based plasma on the SiOxNy layer for about 2 seconds to form an oxide layer on the SiOxNy layer, wherein the oxide layer is about 50 angstroms thick.
11. The method of
claim 10
, wherein the oxidizer-based plasma comprises O2.
12. The method of
claim 10
, wherein the oxidizer-based plasma comprises N2O.
US09/325,365 1999-05-04 1999-06-04 Method for improving stability of anti-coating layer Abandoned US20010003606A1 (en)

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TW088107217A TW408383B (en) 1999-05-04 1999-05-04 The method of improving the degree of stability of the anti-reflection coating (ARC) film layer
TW88107217 1999-05-04

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1816489A3 (en) * 2006-02-01 2008-09-10 Seiko Epson Corporation Optical article and manufacturing method of the same
US20110308602A1 (en) * 2010-06-18 2011-12-22 Q-Cells Se Solar cell, solar cell manufacturing method and testing method
US11243465B2 (en) * 2017-12-18 2022-02-08 Tokyo Electron Limited Plasma treatment method to enhance surface adhesion for lithography

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1816489A3 (en) * 2006-02-01 2008-09-10 Seiko Epson Corporation Optical article and manufacturing method of the same
US20100328605A1 (en) * 2006-02-01 2010-12-30 Seiko Epson Corporation Optical article including a layer siox as main component and manufacturing method of the same
US7880966B2 (en) 2006-02-01 2011-02-01 Seiko Epson Corporation Optical article including a layer siox as main component and manufacturing method of the same
US20110308602A1 (en) * 2010-06-18 2011-12-22 Q-Cells Se Solar cell, solar cell manufacturing method and testing method
US11243465B2 (en) * 2017-12-18 2022-02-08 Tokyo Electron Limited Plasma treatment method to enhance surface adhesion for lithography

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