US20010000304A1 - Semiconductor device socket, assembly and methods - Google Patents
Semiconductor device socket, assembly and methods Download PDFInfo
- Publication number
- US20010000304A1 US20010000304A1 US09/732,106 US73210600A US2001000304A1 US 20010000304 A1 US20010000304 A1 US 20010000304A1 US 73210600 A US73210600 A US 73210600A US 2001000304 A1 US2001000304 A1 US 2001000304A1
- Authority
- US
- United States
- Prior art keywords
- socket
- semiconductor device
- intermediate conductive
- biasing member
- conductive element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1007—Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/82—Coupling devices connected with low or zero insertion force
- H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
- H01R12/89—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by moving connector housing parts linearly, e.g. slider
Abstract
Description
- 1. This application is a continuation of application Ser. No. 09/461,992, filed Dec. 15, 1999, pending, which is a continuation of application Ser. No. 09/207,646, filed Dec. 8, 1998, now U.S. Pat. No. 6,088,237, issued Jul. 11, 2000, which is a continuation of application Ser. No. 09/001,300, filed Dec. 31, 1997, now U.S. Pat. No. 5,995,378, issued Nov. 30, 1999.
- 2. 1. Field of the Invention
- 3. The present invention relates to zero insertion force sockets which receive and operatively connect one or more semiconductor devices to a carrier substrate. Particularly, the present invention relates to zero insertion force sockets which receive bare or minimally packaged, vertically mountable semiconductor devices. The present invention also relates to semiconductor devices which are mountable substantially perpendicular relative to a carrier substrate and to devices which secure bare or minimally packaged semiconductor devices to a carrier substrate.
- 4. 2. Background of Related Art
- 5. Zero insertion force sockets which operatively attach packaged semiconductor devices to a carrier substrate are known in the art. Typical zero insertion force sockets include resilient contacts which bias against the leads of a package inserted therein. An electrical contact is established between each of the leads and its corresponding contact as the spring force of the contact biases the same against the lead. Exemplary zero insertion force sockets which include resilient contacts are disclosed in the following United States patents: U.S. Pat. No. 5,466,169, issued to Kuang-Chih Lai on Nov. 14, 1995; U.S. Pat. No. 5,358,421, issued to Kurt H. Petersen on Oct. 25, 1994; U.S. Pat. No. 4,889,499, issued to Jerzy Sochor on Dec. 26, 1989; U.S. Pat. No. 4,710,134, issued to Iosif Korunsky on Dec. 1, 1987; U.S. Pat. No. 4,527,850, issued to Clyde T. Carter on Jul. 9, 1985; U.S. Pat. No. 4,381,130, issued to George J. Sprenkle on Apr. 26, 1983; and U.S. Pat. No. 4,266,840, issued to Jack Seidler on May 12, 1981.
- 6. Such devices would not be useful for securing and operatively attaching bare or minimally packaged semiconductor devices to a carrier substrate since the resilient contacts of some such devices are adapted to establish electrical contact with the elongated leads of a packaged semiconductor device, rather than with the bond pads of bare and many minimally packaged semiconductor devices. Other zero insertion force sockets in the prior art include resilient contacts which abut the semiconductor device during insertion of the same into the socket. Thus, the friction generated by the contacts of such zero insertion force sockets would likely scratch or otherwise damage bare semiconductor devices and many minimally packaged semiconductor devices during insertion therein.
- 7. Moreover, zero insertion force sockets which include resilient contacts are somewhat undesirable from the standpoint that the contacts tend to lose their resiliency over time and with frequent removal and reinsertion of devices. Thus, the ability of many such zero insertion force socket resilient contacts to establish adequate electrical connections with their corresponding leads of the inserted packaged semiconductor device diminishes over time. Moreover, such resilient contacts may also be damaged while inserting a packaged semiconductor device into the socket.
- 8. Other zero insertion force sockets have been developed in order to overcome the above-identified shortcomings of resilient contacts. Many such zero insertion force sockets include contacts which are biased against the leads of a packaged semiconductor device inserted therein by a laterally sliding mechanical actuation device. Examples of such devices are disclosed in the following United States patents: Reissue 28,171, issued to John W. Anhalt; U.S. Pat. No. 4,501,461 on Sep. 24, 1974, issued to John W. Anhalt on Feb. 26, 1985; U.S. Pat. No. 4,397,512 issued to Michele Barraire et al. on Aug. 9, 1983; U.S. Pat. No. 4,391,408, issued to Richard J. Hanlon and Rudi O. H. Vetter on Jul. 5, 1983; and U.S. Pat. No. 4,314,736, issued to Eugene F. Demnianiuk on Feb. 9, 1982.
- 9. However, the contacts of many such devices are adapted to establish an electrical connection with the leads of a packaged semiconductor device rather than with the bond pads of a bare or minimally packaged semiconductor device.
- 10. Vertical surface mount packages are also known in the art. When compared with traditional, horizontally mountable semiconductor packages and horizontally oriented multi-chip packages, many vertical surface mount packages have a superior ability to transfer heat. Vertical surface mount packages also consume less area on a carrier substrate than a horizontally mounted package of the same size. Thus, many skilled individuals in the semiconductor industry are finding vertical surface mount packages more desirable than their traditional, horizontally mountable counterparts.
- 11. Exemplary vertical surface mount packages are disclosed in the following United States patents: Re. 34,794 (the “'794 patent”), issued to Warren M. Famworth on Nov. 22, 1994; U.S. Pat. No. 5,444,304 (the “'304 patent”), issued to Kouija Hara and Jun Tanabe on Aug. 22, 1995; U.S. Pat. No. 5,450,289, issued to Yooung D. Kweon and Min C. An on Sep. 12, 1995; U.S. Pat. No. 5,451,815, issued to Norio Taniguchi et al. on Sep. 19, 1995; U.S. Pat. No. 5,592,019, issued to Tetsuya Ueda et al. on Jan. 7, 1997; and U.S. Pat. No. 5,635,760, issued to Toru Ishikawa on Jun. 3, 1997.
- 12. The '794 patent discloses a vertical surface mount package having a gull-wing, zig-zag, in-line lead configuration and a mechanism for mounting the package to a printed circuit board (PCB) or other carrier substrate. The force with which the package mounts to the carrier substrate establishes a tight interference contact between the package's leads and their corresponding terminals on the carrier substrate.
- 13. The '304 patent describes a vertical surface mount package which has integrally formed fins radiating therefrom. The fins of that device facilitate the dissipation of heat away from the device. The semiconductor device is electrically connected to the package's leads by wire bonding. The leads of that vertical surface mount package, which extend therefrom in an in-line configuration, are mountable to the terminals of a carrier substrate by soldering.
- 14. However, many of the vertical surface mount packages in the prior art are somewhat undesirable from the standpoint that they permanently attach to a carrier substrate. Thus, those vertical surface mount packages are not readily user-upgradable. Moreover, many prior art vertical surface mount packages include relatively long leads, which tend to increase the impedance of the leads and reduce the overall speed of systems of which they are a part. Similarly, the wire bonding typically used in many vertical surface mount packages increases the impedance and reduces the overall speed of such devices. As the speed of operation of semiconductor devices increases, more heat is generated by the semiconductor device, requiring greater heat transfer. Similarly, as the speed of operation of semiconductor devices increases, decreasing the length of the leads regarding circuitry connecting the semiconductor device to other components and, thereby, decreasing the impedance of the leads to increase the responsiveness of the semiconductor device is important.
- 15. Thus, a need exists for a zero insertion force alignment device for bare or minimally packaged semiconductor devices which has low impedance and which facilitates the ready removal and reinstallation of the semiconductor devices relative to a carrier substrate. An alignment and attachment device which transfers heat away from the vertical surface mount package and establishes and maintains adequate electrical connections between a vertical surface mount package and a carrier substrate is also needed.
- 16. The zero insertion force socket of the present invention addresses each of the foregoing needs. The zero insertion force socket includes intermediate conductive elements which are configured to establish an interference-type electrical connection with the bond pads of a bare or minimally packaged semiconductor device. An actuator moves a plate in the socket to bias the intermediate conductive elements against the bond pads of a semiconductor device without rubbing against the semiconductor device during insertion of the same into the socket.
- 17. In a first embodiment of the zero insertion force socket, the actuator moves the plate transversely relative to the socket body to move the intermediate conductive elements into and out of contact with the bond pads of a semiconductor device that is interconnected with the socket.
- 18. In a second embodiment of the zero insertion force socket, the actuator moves the plate vertically relative to the socket body in order to actuate movement of the intermediate conductive elements toward and away from the bond pads.
- 19. A semiconductor device which is useful in connection with the zero insertion force socket of the present invention includes all of its bond pads along a single edge thereof.
- 20. The present invention also includes a method of securing a semiconductor device substantially perpendicularly relative to a carrier substrate, and methods of designing and manufacturing vertically mountable bare semiconductor devices that are useful with the zero insertion force socket of the present invention. A computer with which the zero insertion force socket and the socket-semiconductor device assembly are associated is also within the scope of the present invention.
- 21. Advantages of the present invention will become apparent to those of ordinary skill in the relevant art through a consideration of the appended drawings and the ensuing description.
- 22.FIG. 1 is a perspective assembly view of a zero insertion force socket and semiconductor device assembly according to the present invention;
- 23.FIG. 2 is a frontal perspective view of a first embodiment of a vertically mountable semiconductor device that is useful in the assembly of FIG. 1;
- 24.FIG. 3 is a partial perspective view of a first embodiment of a zero insertion force socket according to the present invention, illustrating a transversely moveable actuator and omitting upper portions of the socket;
- 25.FIG. 4a is an enlarged partial perspective view depicting the association of the transversely moveable actuator of FIG. 3 with the intermediate conductive elements of the zero insertion force socket, which are shown in a biased position;
- 26.FIG. 4b is an enlarged partial perspective view depicting the association of the transversely moveable actuator of FIG. 3 with the intermediate conductive elements of the zero insertion force socket, which are shown in an insertion position;
- 27.FIG. 5 is an enlarged partial perspective view depicting a variation of the transverse plate and intermediate conductive elements;
- 28.FIG. 6a is a partial perspective view depicting another variation of the transverse plate and intermediate conductive elements;
- 29.FIG. 6b is a cross-section taken along
line 6 b-6 b of FIG. 6a; - 30.FIG. 7 is a cross-section taken along line 7-7 of FIG. 3, which depicts the zero insertion force socket and a semiconductor device interconnected therewith;
- 31.FIG. 8 is a partial perspective view of a second embodiment of a zero insertion force socket according to the present invention, illustrating a vertically moveable plate and omitting upper portions of the socket;
- 32.FIG. 9 is an enlarged partial perspective view depicting the association of the vertically moveable actuator of FIG. 8 with the intermediate conductive elements of the zero insertion force socket;
- 33.FIG. 10 is an enlarged partial perspective view depicting a variation of the intermediate conductive elements of FIG. 8;
- 34.FIG. 11 is a cross-section taken along line 11-11 of FIG. 8, which depicts the zero insertion force socket and a semiconductor device interconnected therewith;
- 35.FIG. 12 is a cross-sectional view of a variation of the second embodiment of the zero insertion force socket;
- 36.FIG. 13 is a cross-sectional view of another variation of the second embodiment of the zero insertion force socket;
- 37.FIGS. 14a and 14 b are enlarged partial perspective views depicting another variation of the transverse plate and intermediate conductive elements;
- 38.FIG. 14c is a cross-section taken along
line 14 c-14 c of FIG. 14a, showing a socket which includes a plurality of cams; and - 39.FIG. 15 is a schematic representation of the zero insertion force socket and an interconnected semiconductor device in a computer.
- 40. Referring to FIG. 1, an assembly 1 is shown which includes a vertically
mountable semiconductor device 10 and a zeroinsertion force socket 30. The zero insertion force socket, which is also referred to assocket 30, is attachable to acarrier substrate 70, such as a printed circuit board (PCB).Semiconductor device 10 is insertable intosocket 30, which is also referred to as a minimal insertion force socket, a reduced insertion force socket, and is frequently referred to as a zero insertion force socket, which orients the semiconductor device substantially perpendicularly relative tocarrier substrate 70. - 41. With reference to FIG. 2,
semiconductor device 10 is a semiconductor device of the type known in the industry, which includes circuit traces and active elements. Thebond pads semiconductor device 10 are disposed on an active surface of the same, adjacent to asingle edge 15 of the semiconductor device. Preferably,bond pads Bond pads edge 15, or their lower edges may be flush with the edge. Thus, during fabrication ofsemiconductor device 10,bond pads proximate edge 15. Processes which are known to those of ordinary skill in the art are useful formanufacturing semiconductor devices 10 which are useful in the assembly according to the present invention. Such processes include the formation of circuit traces which lead toedge 15 and the fabrication ofbond pads bond pads - 42. A
preferred semiconductor device 10 has a standardized number ofbond pads center line 22 of the semiconductor device, or relative to any other landmark on the semiconductor device, such as a side thereof. Alternatively, the number and pitch ofbond pads bond pads proximate edge 15 impartssemiconductor device 10 with reduced impedance as the bond pads are electrically connected tocarrier substrate 70, relative to many vertical surface mount packages and other packaged semiconductor devices in the prior art. - 43.FIG. 3 illustrates a first embodiment of
socket 30, which includes abody 32 including one ormore receptacles 34 formed through the top thereof, abase 36, atransverse plate 38, which is also referred to as a member, positioned over the base and substantially parallel thereto, and intermediateconductive elements 60 extending upwardly throughbase 36 andtransverse plate 38. - 44. Each
receptacle 34 is an elongated opening that is defined bybody 32 and extends downwardly intosocket 30.Receptacles 34 are each configured to permit the insertion of a semiconductor device 10 (see FIG. 2) therethrough and align the same relative to carrier substrate 70 (see FIG. 1). Thus, in order to facilitate the insertion of asemiconductor device 10 intoreceptacle 34 and the proper alignment of the same relative to intermediateconductive elements 60, the dimensions of each receptacle are preferably slightly larger than the corresponding dimensions of the semiconductor device to be inserted therein. - 45. With continued reference to FIG. 3,
transverse plate 38 is disposed abovebase 36. Ends 39 and 41 oftransverse plate 38 are disposed inslots surfaces body 32.Slots transverse plate 38 relative tobody 32. Anactuator element 46 extends fromend 41 oftransverse plate 38, and through anelongated slot 44 formed throughbody 32. Thus, movement ofactuator element 46 alongslot 44 slides transverseplate 38 relative tobody 32.Slot 44 may also include member-position retention components 44 a and 44 b, which are referred to as retention components for simplicity, and which facilitate the retention of the position oftransverse plate 38 relative tobase 36. - 46.
Transverse plate 38 includes a series of mutually parallel members, which are referred to asarms sides 49 of thetransverse plate 38. Each pair ofadjacent arms die slot 55 therebetween. With reference to FIGS. 4a and 4 b,arms 47 each have acamming edge 51 a, which includes a series ofdistinct teeth 52 extending therefrom, and anopposite edge 51 b located opposite the camming edge. Eachtooth 52 is tapered to define aninsertion end 53 and a biasingend 54. Biasingend 54 is distanced further fromopposite edge 51 b thaninsertion end 53. Preferably, the number of teeth along eacharm 47 corresponds to the number of intermediateconductive elements 60 extending adjacent thereto. Similarly, the length ofteeth 52 alongarm 47 corresponds to the spacing between the laterally adjacent intermediateconductive elements 60 which correspond thereto. - 47. As illustrated by FIG. 7, intermediate
conductive elements 60 extend throughbase 36, intosocket 30, and upward throughdie slot 55. Each intermediateconductive element 60 is adjacent anarm 47 and proximate thereto. Each intermediateconductive element 60 is a resilient leaf spring which includes a bondpad contact end 61 that faces away from thecorresponding arm 47, asegment 62 that is fixedly retained bybase 36, and aterminal contact end 63adjacent segment 62 and exposed through the bottom of the base. As illustrated, bondpad contact end 61 is configured to establish an electrical connection with a bumped bond pad.Terminal contact end 63 is electrically connected to a correspondingterminal 72 oncarrier substrate 70. Each intermediateconductive element 60 is formed from a resilient, electrically conductive material, such as copper, nickel, or palladium. Preferably, each intermediateconductive element 60 has a length of about 1½mm or less. More preferably, each intermediateconductive element 60 has a length of about 1 mm or less. As those in the art are aware, longer, larger wires create greater impedance. Thus, less impedance is generated by shorter intermediateconductive elements 60. The total length of each intermediateconductive element 60 depends on the thickness of the base ofsocket 30, the length required to establish an electrical connection with a terminal on the carrier substrate, and the length required to establish an electrical connection with the bond pads of the semiconductor device. - 48. Turning now to FIG. 4a, the relationship between intermediate
conductive element 60 andarm 47 is shown.Camming edge 51 a ofarm 47 is biased against intermediateconductive element 60. Specifically, each intermediateconductive element 60 abuts a correspondingtooth 52. Since segment 62 (see FIG. 7) of each intermediateconductive element 60 is fixedly disposed within base 36 (see FIG. 7), asarm 47 is moved laterally alongslots 40 and 42 (see FIG. 3), movement of each intermediateconductive element 60 along its correspondingtooth 52 facilitates movement of the top end of the respective intermediateconductive element 60, which is referred to as a bondpad contact end 61, in a direction that is substantially transverse to the movement ofarm 47. Bondpad contact end 61 faces away from itscorresponding arm 47. As depicted in FIG. 4a,arm 47 is in a biased position, wherein intermediateconductive element 60 is positioned adjacent to biasingend 54 oftooth 52, which moves the intermediate conductive element away fromopposite edge 51 b. Thus, intermediateconductive element 60 has been forced outward relative toarm 47. - 49.FIG. 4b shows
arm 47 in an insertion position, wherein intermediateconductive element 60 is positioned adjacent to insertion end 53 oftooth 52, which permits the intermediate conductive element to move back towardopposite edge 51 b. Therefore, bondpad contact end 61 of intermediateconductive element 60 may move into a die insertion position (i.e., a position which facilitates the insertion of asemiconductor device 10 into socket 30). - 50. Turning now to FIG. 5, a variation of the present embodiment of the zero insertion force socket is shown, wherein each of the elements is substantially the same, with the following exceptions. Intermediate
conductive elements 60′ are leaf springs which each include a bondpad contact end 61′ that faces towardarm 47′. Eacharm 47′ includesteeth 52′ on acamming edge 51 a′ thereof, and anopposite edge 51 b′ which is located opposite the camming edge. Each ofteeth 52′ is tapered to define aninsertion end 53′ and a biasingend 54′. Biasingend 54′ of eachtooth 52′ is distanced further fromopposite edge 51 b′ thaninsertion end 53′.Arm 47′ is also configured to support a semiconductor device 10 (see FIG. 2). Thus, as intermediateconductive element 60′ moves alongtooth 52′ from biasingend 54′ to insertion end 53′, bondpad contact end 61′ moves towardopposite edge 51 b′ and toward asemiconductor device 10 supported byarm 47′. - 51.FIGS. 6a and 6 b depict another variation of the first embodiment of the zero
insertion force socket 30″, wherein the base 36″ of the socket, which is also referred to as a member, acts as the transverse plate and is, therefore, moveable transversely relative to the remainder of the socket. Ends 39″ ofbase 36″ are disposed withinslots 40″, respectively, that are formed in opposite sides ofbody 32″ and which facilitate the transverse movement ofbase 36″ relative tobody 32″. The arrows of FIG. 6b illustrate the directions that base 36″ moves relative tobody 32″.Actuator element 46″, which effects the movement ofbase 36″ alongslots 40″ and 42″, extends frombase 36″ and through aslot 44″ formed throughbody 32″. Intermediateconductive elements 60″ each include aterminal contact end 63″, which establishes an interference-type electrical contact with a correspondingterminal 72 ofcarrier substrate 70, asegment 62″ that is fixedly retained bybase 36″, and a bondpad contact end 61″. During transverse movement ofbase 36″ relative tosocket 30″, theterminal contact end 63″ of each intermediateconductive element 60″ slides along itsrespective terminal 72 to maintain its electrical contact therewith, and each bondpad contact end 61″ moves relative to itscorresponding bond pad 14 of asemiconductor device 10 inserted into thesocket 30″. Thus, each bondpad contact end 61″ may be oriented in either a biased position, whereby it abuts and establishes an interference-type electrical contact with itscorresponding bond pad 14, or an insertion position, whereby it is moved outward to facilitate insertion or removal of a semiconductor die 10 fromsocket 30″. - 52. With reference to FIG. 1, socket 30 (as well as
sockets 30′ and 30″ of FIGS. 5, 6a and 6 b) is manufactured from a material which maintains its shape and rigidity at the relatively high temperatures that are generated during the operation of a semiconductor device. A socket material which has good thermal conductivity properties and which may be formed into thin layers is also preferable. Materials including, without limitation, copper, aluminum, ceramic, glass, FR-4 board, and injection molded plastics are useful for manufacturingsocket 30. - 53. Referring again to FIG. 7, as an example of the use of
socket 30,actuator element 46 is positioned alongslot 44 such thattransverse plate 38 and, therefore, each intermediateconductive element 60, is moved into an insertion position. Asemiconductor device 10 is then inserted intoreceptacle 34 and throughdie insertion slot 55, so that it rests uponbase 36.Actuator element 46 is then positioned inslot 44 to movetransverse plate 38 and each intermediateconductive element 60 to a biased position against its correspondingbond pad 14, which establishes an electrical connection between thebond pad 14 and itsrespective terminal 72 ofcarrier substrate 70. - 54. With reference to FIG. 8, a second embodiment of a zero insertion force socket is shown, which is referred to as
socket 130.Socket 130 includes abody 132, one ormore receptacles 134 formed into the top of the body, abase 136, anejector plate 138, which is also referred to as a member, disposed within the body above the base, and intermediateconductive elements 160 extending upwardly throughbase 136 andejector plate 138. - 55. Each
receptacle 134 is an elongated opening that extends downwardly intobody 132. Eachreceptacle 134 is configured to receive a semiconductor device 10 (see FIG. 2) and align the same relative to a carrier substrate 70 (see FIG. 1). Therefore, the dimensions ofreceptacle 134 are slightly larger than the corresponding dimensions ofsemiconductor device 10 so as to facilitate the insertion of the semiconductor device thereinto and the proper alignment of the same with respect tocarrier substrate 70. - 56. Still referring to FIG. 8,
ejector plate 138 includes two ends 139 and 141 that each include a plurality offingers 139 a and 141 a (not shown), respectively, extending therefrom.Fingers 139 a and 141 a are disposed withinvertical guide slots 140 and 142 (not shown), respectively, that are formed inbody 132.Slots 140 and 142 engagefingers 139 a and 141 a in a manner which facilitates vertical sliding ofejector plate 138 relative tobody 132. Anactuator element 146 extends fromend 141 ofejector plate 138, and through an elongatedvertical slot 144 that is formed throughbody 132. Thus, movement ofactuator element 146 alongslot 144 slidesejector plate 138 vertically relative tobody 132.Slots position retention component 140 a, 142 a (not shown), and 145, respectively, which are each referred to as a retention component for simplicity, and each of which are configured to retainejector plate 138 in an upper, insertion position. As illustrated,actuator element 146,fingers 139 a, 141 a andejector plate 138 must be moved laterally relative tobody 132 to retain the actuator element inretention component 145, the fingers inretention components 140 a, 142 a, respectively, and the ejector plate in the insertion position. - 57.
Ejector plate 138 includes a plurality of mutually parallel members, which are referred to asarms sides 149 and 150 (not shown) of the ejector plate.Arms 147 are each configured to support a semiconductor device 10 (see FIG. 11) disposed thereon. Alternatively,semiconductor device 10 may extend through anelongated slot 155, defined by a pair ofadjacent arms base 136. Intermediateconductive elements 160 extend upward throughelongated slot 155. Eacharm 147 includes acamming edge 151, which abuts acamming section 164 of each of the corresponding intermediateconductive elements 160. - 58. Referring now to FIG. 11, intermediate
conductive element 160 is a leaf spring which includes a bondpad contact end 161 at the top thereof and adjacent acamming section 164, which is located above asegment 162 thereof that is fixedly retained withinbase 136. Intermediateconductive element 160 also includes aterminal contact end 163 that extends fromsegment 162 and is exposed through the bottom ofbase 136.Terminal contact end 163 is electrically connected to a correspondingterminal 72 oncarrier substrate 70. FIG. 9 illustrates an intermediateconductive element 160 which has a substantiallyflat camming section 164 that extends diagonally toward itscorresponding arm 147. Bondpad contact end 161 also extends toward thearm 147 that corresponds to intermediateconductive element 160. FIG. 10 illustrates a variation of the intermediateconductive element 160′, which includes acamming section 164′ that is concavely curved relative to thecorresponding arm 147. Thus,camming section 164′ extends upwardly towardarm 147. Bondpad contact end 161′ also extends towardarm 147. Preferably, each intermediateconductive element conductive element - 59. With continued reference to FIGS. 9 and 10, as ejector plate 138 (see FIG. 8) is moved upward relative to body 132 (see FIG. 8),
camming edge 151 slides upward along thecamming section conductive element pad contact end arm 147. Thus, upward movement ofejector plate 138 places intermediateconductive element ejector plate 138 is positioned downward relative tobody 132,camming edge 151 ofarm 147 slides downward alongcamming section pad contact end arm 147 and into electrical contact with a corresponding bond pad 14 (see FIG. 2) of a semiconductor device 10 (see FIG. 2) supported byarm 147. Thus, lowering ofejector plate 138 permits intermediateconductive elements - 60. With reference to FIG. 12, a variation of the second embodiment of the zero
insertion force socket 130″ is depicted with thetransverse plate 138″ and intermediateconductive elements 160″ in a biased position, wherein each of the elements are substantially the same, with the following exceptions. Intermediateconductive elements 160″ are leaf springs which each include acamming section 164″ and a bondpad contact end 161″, each of which extend away fromarm 147″.Camming edge 151″ abutscamming section 164″ and is positionable vertically relative thereto. Ascamming edge 151″ is moved upward alongcamming section 164″, bondpad contact end 161″ is biased away fromarm 147″ and toward asemiconductor device 10 disposed on theadjacent arm 147″. Upon movement ofejector plate 138″ into an upper, biased position, bondpad contact end 161″ abuts itscorresponding bond pad 14 to establish an interference-type electrical contact therewith. The arrows illustrate the direction of movement oftransverse plate 138″ to an insertion position to facilitate placement of the intermediateconductive elements 160″ into an insertion position. - 61.FIG. 13 illustrates another variation of the second embodiment of zero
insertion force socket 230 with thebase 236 and the intermediateconductive elements 260 in an insertion position, wherein thebase 236 of the socket, which is also referred to as a member, also serves as the ejector plate and is, therefore, moveable vertically relative tobody 232. The arrows illustrate the direction in which base 236 moves to place it and the intermediateconductive elements 260 into a biased position. Intermediateconductive elements 260 extend throughbase 236 and upwardly therefrom. Each intermediateconductive element 260 includes aterminal contact end 263 which establishes an interference-type electrical contact with a correspondingterminal 72 ofcarrier substrate 70, asegment 262 that is fixedly retained bybase 236, acamming section 264, and a bondpad contact end 261. - 62.
Socket 230 also includes one ormore bias components 259 that extend transversely acrossbody 232. Eachbias component 259 is positioned abovebase 236 and abuts thecamming sections 264 of each group of intermediateconductive elements 260. Thecamming sections 264 are resiliently biased againstbias component 259. Bondpad contact end 261 extends away frombias component 259 andcamming section 264 extends upwardly towardbias component 259. Asbase 236 is moved upward, into an insertion position, relative tobody 232 andbias component 259, intermediateconductive elements 260 spring back toward theircorresponding bias component 259 and away from a semiconductor device adjacent thereto. Thus, asbase 236 is moved downward relative tobody 232 and bias component 259 (i.e., into a biased position), the bias component forces bondpad contact end 261 away from the same and toward asemiconductor device 10 adjacent thereto. Upon lowering ofbase 236 to a biased position, theterminal contact end 263 of intermediateconductive element 260 contacts its correspondingterminal 72 to establish an electrically conductive connection therewith. Thus, asbase 236 is moved into the biased position, an electrical connection is created between each terminal 72 and acorresponding bond pad 14 of asemiconductor device 10 disposed withinsocket 230. - 63. With reference again to FIG. 8, socket 130 (as well as
sockets 130′ and 230 of FIGS. 12 and 13) is manufactured from a material which maintains its shape and rigidity at the relatively high temperatures that are generated during the operation of a semiconductor device. A socket material which has good thermal conductivity properties and which may be formed into thin layers is also preferable. Materials including, without limitation, copper, aluminum, ceramic, glass, FR-4 board, and injection molded plastics are useful formanufacturing socket 130. - 64. Referring again to FIG. 11, as an example of the use of
socket 130,actuator element 146 is positioned upward alongslot 144 such thatejector plate 138 and, therefore, intermediateconductive elements 160, are moved into an insertion position. Asemiconductor device 10 is then inserted intoreceptacle 134 so that it rests upon anarm 147 ofejector plate 138.Actuator element 146 is moved inslot 144 to placeejector plate 138 into a lowered, biased position (not shown). Thus, intermediateconductive elements 160 are also moved into a biased position to establish an electrical connection betweenbond pads 14 ofsemiconductor device 10 and theirrespective terminals 72 ofcarrier substrate 70. Subsequent placement ofejector plate 138 in an insertion position ejects at least a portion of eachsemiconductor device 10 from itscorresponding receptacle 134. - 65. Referring now to FIGS. 14a through 14 c, a third embodiment of a zero insertion force socket is shown, which is referred to as
socket 430.Socket 430 includes acam 402 which, when rotated along anaxis 404, actuates intermediateconductive elements 460 between a biased position (FIG. 14a) and an insertion position (FIG. 14b). As shown,cam 402 has a circular cross-section. Thus, in order forcam 402 to actuate intermediateconductive elements 460 between the insertion position and the biased position,axis 404 must be off-center. In variations ofcam 402 which have non-circular cross-sections, however,axis 404 may extend centrally through the cam.Cam 402 includes acamming surface 406 which biases against intermediateconductive elements 460 as the cam is rotated to a biased position. Whencam 402 is rotated to the insertion position,camming surface 406 rotates away from intermediateconductive elements 460, permitting them to spring back to the insertion position. - 66. Alternatively,
cam 402 may be positioned on the opposite side of intermediateconductive elements 460, such that when cammingsurface 406 biases against the intermediate conductive elements, they are forced away from thebond pads 14 of asemiconductor device 10 that is disposed withinsocket 430. Rotation ofcam 402 in the opposite direction permits intermediateconductive elements 460 to resiliently bias against thebond pads 14 ofsemiconductor device 10. - 67. In
sockets 430 which include a plurality ofcams 402, each of the cams may be interconnected, such that they rotate in unison. - 68.FIG. 15 illustrates a
computer 300 including acarrier substrate 310.Socket 30 is secured tocarrier substrate 310.Semiconductor device 10 is insertable intosocket 30, which establishes an electrical connection between the semiconductor device andcarrier substrate 310. Thus,semiconductor device 10 is operatively associated withcomputer 300. - 69. Although the foregoing description contains many specificities, these should not be construed as limiting the scope of the present invention, but merely as providing illustrations of some of the presently preferred embodiments. Similarly, other embodiments of the invention may be devised which do not depart from the spirit or scope of the present invention. The scope of the invention is, therefore, indicated and limited only by the appended claims and their legal equivalents, rather than by the foregoing description. All additions, deletions and modifications to the invention as disclosed herein which fall within the meaning and scope of the claims are embraced within their scope.
Claims (28)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/732,106 US6442044B2 (en) | 1997-12-31 | 2000-12-07 | Semiconductor device socket, assembly and methods |
US10/202,539 US6765803B2 (en) | 1997-12-31 | 2002-07-23 | Semiconductor device socket |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/001,300 US5995378A (en) | 1997-12-31 | 1997-12-31 | Semiconductor device socket, assembly and methods |
US09/207,646 US6088237A (en) | 1997-12-31 | 1998-12-08 | Semiconductor device socket, assembly and methods |
US09/461,992 US6198636B1 (en) | 1997-12-31 | 1999-12-15 | Semiconductor device socket, assembly and methods |
US09/732,106 US6442044B2 (en) | 1997-12-31 | 2000-12-07 | Semiconductor device socket, assembly and methods |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/461,992 Continuation US6198636B1 (en) | 1997-12-31 | 1999-12-15 | Semiconductor device socket, assembly and methods |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/202,539 Continuation US6765803B2 (en) | 1997-12-31 | 2002-07-23 | Semiconductor device socket |
Publications (2)
Publication Number | Publication Date |
---|---|
US20010000304A1 true US20010000304A1 (en) | 2001-04-19 |
US6442044B2 US6442044B2 (en) | 2002-08-27 |
Family
ID=21695333
Family Applications (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/001,300 Expired - Lifetime US5995378A (en) | 1997-12-31 | 1997-12-31 | Semiconductor device socket, assembly and methods |
US09/207,646 Expired - Lifetime US6088237A (en) | 1997-12-31 | 1998-12-08 | Semiconductor device socket, assembly and methods |
US09/309,331 Expired - Lifetime US6088238A (en) | 1997-12-31 | 1999-05-11 | Semiconductor device socket, assembly and methods |
US09/461,992 Expired - Lifetime US6198636B1 (en) | 1997-12-31 | 1999-12-15 | Semiconductor device socket, assembly and methods |
US09/732,106 Expired - Lifetime US6442044B2 (en) | 1997-12-31 | 2000-12-07 | Semiconductor device socket, assembly and methods |
US10/202,539 Expired - Fee Related US6765803B2 (en) | 1997-12-31 | 2002-07-23 | Semiconductor device socket |
Family Applications Before (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/001,300 Expired - Lifetime US5995378A (en) | 1997-12-31 | 1997-12-31 | Semiconductor device socket, assembly and methods |
US09/207,646 Expired - Lifetime US6088237A (en) | 1997-12-31 | 1998-12-08 | Semiconductor device socket, assembly and methods |
US09/309,331 Expired - Lifetime US6088238A (en) | 1997-12-31 | 1999-05-11 | Semiconductor device socket, assembly and methods |
US09/461,992 Expired - Lifetime US6198636B1 (en) | 1997-12-31 | 1999-12-15 | Semiconductor device socket, assembly and methods |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/202,539 Expired - Fee Related US6765803B2 (en) | 1997-12-31 | 2002-07-23 | Semiconductor device socket |
Country Status (1)
Country | Link |
---|---|
US (6) | US5995378A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110068880A1 (en) * | 2009-09-18 | 2011-03-24 | Gavin Ho | Micromechanical network |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6342731B1 (en) * | 1997-12-31 | 2002-01-29 | Micron Technology, Inc. | Vertically mountable semiconductor device, assembly, and methods |
US5995378A (en) * | 1997-12-31 | 1999-11-30 | Micron Technology, Inc. | Semiconductor device socket, assembly and methods |
US6140696A (en) * | 1998-01-27 | 2000-10-31 | Micron Technology, Inc. | Vertically mountable semiconductor device and methods |
JPH11251539A (en) * | 1998-03-06 | 1999-09-17 | Mitsubishi Electric Corp | Circuit module |
US6147411A (en) * | 1998-03-31 | 2000-11-14 | Micron Technology, Inc. | Vertical surface mount package utilizing a back-to-back semiconductor device module |
US5990566A (en) * | 1998-05-20 | 1999-11-23 | Micron Technology, Inc. | High density semiconductor package |
US6297542B1 (en) * | 1998-06-25 | 2001-10-02 | Micron Technology, Inc. | Connecting a die in an integrated circuit module |
US6153929A (en) | 1998-08-21 | 2000-11-28 | Micron Technology, Inc. | Low profile multi-IC package connector |
US6320253B1 (en) * | 1998-09-01 | 2001-11-20 | Micron Technology, Inc. | Semiconductor device comprising a socket and method for forming same |
SG87863A1 (en) * | 1998-12-10 | 2002-04-16 | Advantest Corp | Socket and connector |
US6416342B2 (en) | 1998-12-10 | 2002-07-09 | Advantest Corporation | Socket and connector therefor for connecting with an electrical component |
US6307754B1 (en) * | 1999-12-09 | 2001-10-23 | Gateway, Inc. | Circuit card guide |
US6628521B2 (en) | 2000-11-06 | 2003-09-30 | Adc Telecommunications, Inc. | Mechanical housing |
US6894907B2 (en) * | 2001-07-31 | 2005-05-17 | Adc Telecommunications, Inc. | Clamping case |
US6897377B2 (en) * | 2001-07-31 | 2005-05-24 | Adc Telecommunications, Inc. | Clamping receptacle |
US6995412B2 (en) * | 2002-04-12 | 2006-02-07 | International Business Machines Corporation | Integrated circuit with capacitors having a fin structure |
US6862180B2 (en) * | 2002-05-24 | 2005-03-01 | Adc Dsl Systems, Inc. | Housings for circuit cards |
US6977187B2 (en) | 2002-06-19 | 2005-12-20 | Foster-Miller, Inc. | Chip package sealing method |
DE10229117B4 (en) * | 2002-06-28 | 2004-05-19 | Infineon Technologies Ag | Zero plug-in socket for fastening and contacting switch assemblies on a substrate |
US6767817B2 (en) | 2002-07-11 | 2004-07-27 | Micron Technology, Inc. | Asymmetric plating |
US6781830B2 (en) * | 2002-11-05 | 2004-08-24 | Adc Dsl Systems, Inc. | Methods and systems of heat transfer for electronic enclosures |
US7612443B1 (en) | 2003-09-04 | 2009-11-03 | University Of Notre Dame Du Lac | Inter-chip communication |
US6865085B1 (en) | 2003-09-26 | 2005-03-08 | Adc Dsl Systems, Inc. | Heat dissipation for electronic enclosures |
JP2006221912A (en) * | 2005-02-09 | 2006-08-24 | Elpida Memory Inc | Semiconductor device |
US7075796B1 (en) * | 2005-09-06 | 2006-07-11 | Hewlett-Packard Development Company, L.P. | Cage for printed circuit board |
JP2007109932A (en) * | 2005-10-14 | 2007-04-26 | Toshiba Corp | Semiconductor device |
US7968989B2 (en) * | 2008-06-27 | 2011-06-28 | Integrated Device Technology, Inc | Multi-package slot array |
US8107233B2 (en) * | 2009-06-09 | 2012-01-31 | International Business Machines Corporation | Latching system for multiple nodes of a computer system |
US8004080B2 (en) * | 2009-09-04 | 2011-08-23 | Freescale Smeiconductor, Inc. | Edge mounted integrated circuits with heat sink |
US8897032B2 (en) * | 2011-05-24 | 2014-11-25 | Xirrus, Inc. | Surface mount antenna contacts |
US8500474B2 (en) * | 2011-08-09 | 2013-08-06 | Ck Technologies, Inc. | Cable/harness test connector |
US9620473B1 (en) | 2013-01-18 | 2017-04-11 | University Of Notre Dame Du Lac | Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment |
US9871019B2 (en) | 2015-07-17 | 2018-01-16 | Invensas Corporation | Flipped die stack assemblies with leadframe interconnects |
US9825002B2 (en) * | 2015-07-17 | 2017-11-21 | Invensas Corporation | Flipped die stack |
US9508691B1 (en) | 2015-12-16 | 2016-11-29 | Invensas Corporation | Flipped die stacks with multiple rows of leadframe interconnects |
US10566310B2 (en) | 2016-04-11 | 2020-02-18 | Invensas Corporation | Microelectronic packages having stacked die and wire bond interconnects |
US9728524B1 (en) | 2016-06-30 | 2017-08-08 | Invensas Corporation | Enhanced density assembly having microelectronic packages mounted at substantial angle to board |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US28171A (en) * | 1860-05-08 | Improvement in apparatus for evaporating sugar-juices | ||
US34794A (en) * | 1862-03-25 | Improvement in stump-extractors | ||
US3475717A (en) * | 1967-03-31 | 1969-10-28 | Itt | Zero force connector |
US3697929A (en) * | 1971-01-18 | 1972-10-10 | Bunker Ramo | Controlled insertion force receptacle for flat circuit bearing elements |
USRE28171E (en) * | 1973-01-17 | 1974-09-24 | Low insertion force connector assembly | |
US3982807A (en) * | 1975-03-27 | 1976-09-28 | International Telephone And Telegraph Corporation | Zero force printed circuit board connector |
US4085990A (en) * | 1977-03-25 | 1978-04-25 | Gte Sylvania, Incorporated | Longitudinally actuated zero force connector |
GB2095482B (en) * | 1978-05-31 | 1983-02-16 | Ferranti Ltd | Low insertion force electrical connector |
US4266840A (en) * | 1979-10-29 | 1981-05-12 | Jack Seidler | Circuit holder |
FR2476393A1 (en) * | 1980-02-19 | 1981-08-21 | Socapex | ZERO INSERTION FORCE CONNECTOR, IN PARTICULAR FOR INTEGRATED CIRCUIT |
US4314736A (en) * | 1980-03-24 | 1982-02-09 | Burroughs Corporation | Zero insertion force connector for a package with staggered leads |
US4391408A (en) * | 1980-09-05 | 1983-07-05 | Augat Inc. | Low insertion force connector |
US4381130A (en) * | 1980-09-29 | 1983-04-26 | Burroughs Corporation | Zero insertion force connector for integrated circuit packages |
US4392705A (en) * | 1981-09-08 | 1983-07-12 | Amp Incorporated | Zero insertion force connector system |
JPS59146955U (en) * | 1983-03-22 | 1984-10-01 | 山一電機工業株式会社 | Connector with connected device body removal device |
US4541678A (en) * | 1983-07-01 | 1985-09-17 | Trw Inc. | Printed circuit board indexing and locking device |
US4527850A (en) * | 1983-11-29 | 1985-07-09 | Sealectro Corp. | Zero insertion force socket |
US4781612A (en) * | 1983-12-14 | 1988-11-01 | Amp Incorporated | Socket for single in-line memory module |
US4501461A (en) * | 1983-12-27 | 1985-02-26 | International Telephone And Telegraph Corporation | Zero insertion force socket |
US4684194A (en) * | 1984-07-16 | 1987-08-04 | Trw Inc. | Zero insertion force connector |
US4720156A (en) * | 1984-08-13 | 1988-01-19 | Tritec, Inc. | Manually operated electrical connector for printed circuit boards |
US4779674A (en) * | 1986-05-07 | 1988-10-25 | United Technologies Corporation | Sawtooth card retainer |
US4721155A (en) * | 1986-05-07 | 1988-01-26 | United Technologies Corporation | Sawtooth card retainer |
US4648668A (en) * | 1986-06-26 | 1987-03-10 | Amp Incorporated | Zero insertion force card edge connector |
US4710134A (en) * | 1986-09-29 | 1987-12-01 | Amp Incorporated | Low insertion force chip carrier connector with movable housing |
US4889499A (en) * | 1988-05-20 | 1989-12-26 | Amdahl Corporation | Zero insertion force connector |
US4904197A (en) * | 1989-01-13 | 1990-02-27 | Itt Corporation | High density zif edge card connector |
US4967262A (en) * | 1989-11-06 | 1990-10-30 | Micron Technology, Inc. | Gull-wing zig-zag inline lead package having end-of-package anchoring pins |
US5334038A (en) * | 1992-03-27 | 1994-08-02 | International Business Machines Corp. | High density connector with sliding actuator |
JPH0677354A (en) * | 1992-08-24 | 1994-03-18 | Hitachi Ltd | Semiconductor device |
KR940022803A (en) * | 1993-03-05 | 1994-10-21 | 김광호 | Printed circuit board suitable for semiconductor package and its mounting |
US5380213A (en) * | 1993-05-21 | 1995-01-10 | Burndy Corporation | Electrical connector with improved ejectors and assembly |
JP3253765B2 (en) * | 1993-06-25 | 2002-02-04 | 富士通株式会社 | Semiconductor device |
JP2565091B2 (en) * | 1993-07-01 | 1996-12-18 | 日本電気株式会社 | Semiconductor device and manufacturing method thereof |
US5358421A (en) * | 1993-08-06 | 1994-10-25 | Minnesota Mining And Manufacturing Company | Zero-insertion-force socket for gull wing electronic devices |
JPH07288309A (en) * | 1994-04-19 | 1995-10-31 | Mitsubishi Electric Corp | Semiconductor device, manufacture thereof and semiconductor module |
US5466169A (en) * | 1994-08-03 | 1995-11-14 | Lai; Kuang-Chih | Zero insertion force socket |
US5995378A (en) * | 1997-12-31 | 1999-11-30 | Micron Technology, Inc. | Semiconductor device socket, assembly and methods |
-
1997
- 1997-12-31 US US09/001,300 patent/US5995378A/en not_active Expired - Lifetime
-
1998
- 1998-12-08 US US09/207,646 patent/US6088237A/en not_active Expired - Lifetime
-
1999
- 1999-05-11 US US09/309,331 patent/US6088238A/en not_active Expired - Lifetime
- 1999-12-15 US US09/461,992 patent/US6198636B1/en not_active Expired - Lifetime
-
2000
- 2000-12-07 US US09/732,106 patent/US6442044B2/en not_active Expired - Lifetime
-
2002
- 2002-07-23 US US10/202,539 patent/US6765803B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110068880A1 (en) * | 2009-09-18 | 2011-03-24 | Gavin Ho | Micromechanical network |
WO2011035200A1 (en) * | 2009-09-18 | 2011-03-24 | Gavin Ho | Micromechanical network |
Also Published As
Publication number | Publication date |
---|---|
US6088238A (en) | 2000-07-11 |
US20020182920A1 (en) | 2002-12-05 |
US5995378A (en) | 1999-11-30 |
US6198636B1 (en) | 2001-03-06 |
US6088237A (en) | 2000-07-11 |
US6442044B2 (en) | 2002-08-27 |
US6765803B2 (en) | 2004-07-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6442044B2 (en) | Semiconductor device socket, assembly and methods | |
US7569418B2 (en) | Methods for securing packaged semiconductor devices to carrier substrates | |
US20110101514A1 (en) | Vertical surface mount assembly and methods | |
US4268102A (en) | Low impedance electrical connecting means for spaced-apart conductors | |
US5805419A (en) | Low-profile socketed packaging system with land-grid array and thermally conductive slug | |
US7015063B2 (en) | Methods of utilizing a back to back semiconductor device module | |
GB2077050A (en) | Carrier socket for leadless integrated circuit | |
EP1072180A4 (en) | Integrated circuit intercoupling component with heat sink | |
US20030092304A1 (en) | Zero insertion force socket terminal | |
US6684493B2 (en) | Vertically mountable interposer, assembly and method | |
JP3999650B2 (en) | Electrical connector |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
CC | Certificate of correction | ||
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
FPAY | Fee payment |
Year of fee payment: 12 |
|
AS | Assignment |
Owner name: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT, CALIFORNIA Free format text: SECURITY INTEREST;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:038669/0001 Effective date: 20160426 Owner name: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGEN Free format text: SECURITY INTEREST;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:038669/0001 Effective date: 20160426 |
|
AS | Assignment |
Owner name: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT, MARYLAND Free format text: PATENT SECURITY AGREEMENT;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:038954/0001 Effective date: 20160426 Owner name: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL Free format text: PATENT SECURITY AGREEMENT;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:038954/0001 Effective date: 20160426 |
|
AS | Assignment |
Owner name: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT, CALIFORNIA Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:043079/0001 Effective date: 20160426 Owner name: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGEN Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST;ASSIGNOR:MICRON TECHNOLOGY, INC.;REEL/FRAME:043079/0001 Effective date: 20160426 |
|
AS | Assignment |
Owner name: MICRON TECHNOLOGY, INC., IDAHO Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT;REEL/FRAME:047243/0001 Effective date: 20180629 |
|
AS | Assignment |
Owner name: MICRON TECHNOLOGY, INC., IDAHO Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT;REEL/FRAME:050937/0001 Effective date: 20190731 |