US1950060A - Coating oh plastic - Google Patents

Coating oh plastic Download PDF

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US1950060A
US1950060A US1950060DA US1950060A US 1950060 A US1950060 A US 1950060A US 1950060D A US1950060D A US 1950060DA US 1950060 A US1950060 A US 1950060A
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adhesive
alkali
flour
glue
aldehyde compound
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J189/00—Adhesives based on proteins; Adhesives based on derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B28/00—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements
    • C04B28/24—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing alkyl, ammonium or metal silicates; containing silica sols
    • C04B28/26—Silicates of the alkali metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L89/00—Compositions of proteins; Compositions of derivatives thereof

Definitions

  • My invention relates more particularly to glues comprising ve etable seed meal bases and consists in modifying the usual glue formula: by addin thereto a small portion of an additive aldehyde compound which has the effect of pernnm reduction of the caustic soda and of increasing the lime and silicate of soda content.
  • my invention are to produce a glue which spreads further, sticks better, and reduces the panel staining which was formerly due to the large amount of caustic soda found to be necessary heretofore.
  • glues produced from sowimseed, linseed, and like see a emnmme time and have been successfully used, therefore no claim to the glue base nor the other usual materials found therein, is made.
  • the materials usually contained in such glues arez-Seed-residue flour or meal; caustic soda; salts (Wm weal? acids, such as soda ash, trisodign; pugsmsodium fluoride; sodium silicate; lime; Ehdcarbon isup 1 e.
  • a goo made is as follows:-
  • Meal flour (soya bean, peanut or other seed residue meal) Water Caustic soda Lime Silicate of so a Trisodium phosphate Sodium chloride 2 Carbon bisulphide 2 This glue will spread approximately 2900 square feet of three-ply panels.
  • I have found by experiment that I can produce a glue using the gbpygm egtmnedsbases, and chemicals, that spreads further, thus using less glue per thousand square feet of panels, is improved in its adhesive qualities, and is of greater water resistance, by adding thereto a small proportion of an additive aldehyde compound, thereby permitting the re notion of the caustic soda content therein and also permitting affincrease in the lirne and thesi ligat epj sgda content.
  • the additive aldehyde compounds which may be used in my new glue include formaldehyde bisoya bean or other Seed flour sulphite canon) (-o-som acetaldehyde bisulphite CHa-CHx'OH) (-OSOzNal benzaldehyde bisulphite CsH5-CH(OH (-O-SOzNa) aldehyde ammonia (CHsCHOzNHa):
  • the formaldehyde bisulphite is preparedfrom the fa owing orm a:-
  • the f melmahisnlphite thus pre may be shipped either as a liquid, separate from the glue powder, 'Qrit maTBe evaporated to a crystal and added to the dry glue mixture as a. 'dry powder but, in that-case, it is necessary to "ship the glue powder in air-tight containers.
  • the liquid form of the formaldehyde bisulphite two pounds thereof is used in a formula calling for 100 pounds of vegetable seed meal base, but if the dry form is used then hs of a pound of the powder is used for the same quantity of the glue base.
  • I have given the above quantities of the additive aldehyde compound I wish it to be understood that the amount may be varied from 0.5 to 5 pounds depending on the amount of water that it is desired to put in the glue.
  • ingredients used may be of the easily obtainable commercial type; for example, ordinary city or tap water commercial sodiurmacicLsulphite and the ordinary commercial 40% aqueous "solution of formaldehyde, which solution is known in the trade as formaldehyde.
  • An adhesive composition comprising the reaction-product of a vegetable seed residue meal or flour as its adhesive base, an aqueous alkaline medium and an additive aldehyde compound functioning to reduce the alkali requirement of the adhesive, the latter having increased spreading properties as compared to an adhesive without the additive aldehyde compound.
  • An adhesive composition comprising the reaction-product of soya bean meal or flour as its adhesive base, an aqueous alkaline medium and an additive aldehyde compound functioning to reduce the alkali requirement of the adhesive, the latter having increased spreading properties as compared to an adhesive without the additive aldehyde compound.
  • An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base; an aqueous alkaline medium, and an additive aldehyde bisulphite compound functioning to reduce the alkali requirement of the adhesive, the latter having increased spreading properties as compared to an adhesive without the additive aldehyde bisulphite compound.
  • An adhesive composition comprising the reaction-product of 100 parts vegetable seed residue flour, 4 parts caustic soda, 30 parts silicate of soda, 20 parts of lime, 2 parts of carbon bisulphide, and 2 parts of a liquid additive aldehyde compound functioning to reduce the alkali requirement of the adhesive, the latter having increased spreading properties as compared to an adhesive without the additive aldehyde compound.
  • An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base an aqueous alkaline medium, an alkali earth metal hydroxide, and an additive aldehyde compound functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde compound.
  • An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkaline medium, an alkali earth metal hydroxide, a soluble alkali metal silicate, and an additive aldehyde compound functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde compound.
  • An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkaline medium, an alkali earth metal hydroxide, a soluble alkali metal silicate, an alkali carbonate, an alkali phosphate, and an additive aldehyde compound functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde compound.
  • An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkaline medium, an alkaline earth metal hydroxide, a soluble alkali metal silicate, sodium carbonate, trisodium phosphate, and an additive aldehyde compound functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde compound.
  • An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqeous alkali medium, an alkali earth metal hydroxide, a soluble alkali metal silicate, an alkali carbonate, an alkali phosphate, carbon bisulphide, and an additive aldehyde compound functioning to reduce the alkali requirement of the adhesive and increase the adaptiveneess of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde compound.
  • An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkali medium, an alkali earth metal hydroxide, a soluble alkali metal silicate, sodium carbonate, trisodium phosphate, carbon bisulphide, and an additive aldehyde compound functioning to reduce the alkali requirement of the adhesive and increase the adaptiveneess of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde compound.
  • An adhesive composition comprising a reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkali medium, an alkali earth metal hydroxide, a soluble metal silicate, sodium carbonate, trisodium phosphate, carbon bisulphide, and an aldehyde bisulphite compound functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive VUl uumruol luuo,
  • An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkaline medium, and a proportion of an additive aldehyde compound equal to about /2% to 5% of seed meal or flour functioning to reduce the alkali requirement of the adhesive, the latter having increased spreading properties as compared to an adhesive without the additive aldehyde compound.
  • An adhesive composition comprising the reaction-product of soya bean meal or flour as its adhesive base, an aqueous alkaline medium, and a proportion of an additive aldehyde compound equal to about /2% to 5% of seed meal or flour functioning to reduce the alkali requirement of the adhesive, the latter having increased spreading properties as compared to an adhesive without the additive aldehyde compound.
  • An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkaline medium, and a proportion of a formaldehyde bisulphite compound equal to about /z% to 5% of said meal or flour, the formaldehyde bisulphite compound functioning to reduce the alkali requirement of the adhesive, the latter having increased spreading properties as compared to an adhesive without the formaldehyde bisulphite compound.
  • An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkaline medium, an alkali earth metal hydroxide, and a proportion of an additive aldehyde compound equal to about /2% to 5% of said meal or flour functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde compound.
  • An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkaline medium, an alkali earth metal hydroxide, a soluble alkali metal silicate, and aproportion of an additive aldehyde compound equal to about 5% to 5% of said meal or flour functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde compound.
  • An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkaline medium, an alkali earth metal hydroxide, a soluble alkali metal silicate, an alkali carbonate, an alkali phosphate, and a proportion of an additive aldehyde compound equal to about to 5% of said meal or flour functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde compound.
  • An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkaline medium, an alkaline earth metal hydroxide, a soluble alkali metal silicate, sodium carbonate, trisodium phosphate, and a proportion of an additive aldehyde compound equal to about to 5% of said meal or flour functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde compound.
  • An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkali medium, an alkali earth metal hydroxide, a soluble alkali metal silicate, an alkali carbonate, an alkali phosphate, carbon bisulphide, and a proportion of an additive aldehyde compound equal to about to 5% of said meal or flour functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde compound.
  • An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkali medium, an alkali earth metal hydroxide, a soluble alkali metal silicate, sodium carbonate, trisodium phosphate, carbon bisulphide, and a proportion of an additive aldehyde compound equal to about /2% to 5% of said meal or flour functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde 1530 compound.
  • An adhesive composition comprising a reaction-product of a vegeiable seed meal or flour as its adhesive base, an aqueous alkali medium, an alkali earth metal hydroxide, a soluble metal silicate, sodium carbonate, trisodium phosphate, carbon bisulphide, and a proportion of an aldehyde bisulphite compound equal to about /2% to 5% of said meal or flour functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde bisulphite compound.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Description

GROSS COATING 0R PLASTIC Patented Mar. 6, 1934 UNITED STATES REFERENGE PATENT OFFICE GLUE George H. Osgood, Tacoma, Wash.
No Drawing. Application May 15, 1983, Serial No. 671,202
21 Claims,
My invention relates more particularly to glues comprising ve etable seed meal bases and consists in modifying the usual glue formula: by addin thereto a small portion of an additive aldehyde compound which has the effect of pernnm reduction of the caustic soda and of increasing the lime and silicate of soda content.
f'l'i'e objects 0 my invention are to produce a glue which spreads further, sticks better, and reduces the panel staining which was formerly due to the large amount of caustic soda found to be necessary heretofore.
- Vegetable seed residue glues produced from sowimseed, linseed, and like see a emnmme time and have been successfully used, therefore no claim to the glue base nor the other usual materials found therein, is made. The materials usually contained in such glues arez-Seed-residue flour or meal; caustic soda; salts (Wm weal? acids, such as soda ash, trisodign; pugsmsodium fluoride; sodium silicate; lime; Ehdcarbon isup 1 e.
A goo made, is as follows:-
Meal flour (soya bean, peanut or other seed residue meal) Water Caustic soda Lime Silicate of so a Trisodium phosphate Sodium chloride 2 Carbon bisulphide 2 This glue will spread approximately 2900 square feet of three-ply panels.
I have found by experiment that I can produce a glue using the gbpygm egtmnedsbases, and chemicals, that spreads further, thus using less glue per thousand square feet of panels, is improved in its adhesive qualities, and is of greater water resistance, by adding thereto a small proportion of an additive aldehyde compound, thereby permitting the re notion of the caustic soda content therein and also permitting affincrease in the lirne and thesi ligat epj sgda content.
The additive aldehyde compounds which may be used in my new glue include formaldehyde bisoya bean or other Seed flour sulphite canon) (-o-som acetaldehyde bisulphite CHa-CHx'OH) (-OSOzNal benzaldehyde bisulphite CsH5-CH(OH (-O-SOzNa) aldehyde ammonia (CHsCHOzNHa):
orm a or such a glue, as formerly Walter 15 lbs only nine-ten or other additive aldehyde compounds. However, I prefer to use formaldehrdannnlnhite be cause of its ease of manufacture but other additive aldehyde compounds are equally effective.
By the addition of two parts of the additivgal: dehyde compound I find that I can cut the causjicjQQa, content down from eleven parts to fourand-a-half parts, and can increase the Lung content from three parts up to twenty parts and the gligate of sgda from twenty parts up to thirty parts and in this way I am able to lower the cost per pound of the glue and at the same time, and of still greater importance, the same weight of glue base which formerly would spread only 2900 square feet of three-ply panel will now spread 3600 square feet thereof while still retaining the same dry strength and water resistance; therefore, my improved glue reduces the cost of the glue line per thousand square feet of three-ply panel about 40 cents or about 20% of the glue user's ordinary glue cost.
The formaldehyde bisulphite is preparedfrom the fa owing orm a:-
The f melmahisnlphite thus pre may be shipped either as a liquid, separate from the glue powder, 'Qrit maTBe evaporated to a crystal and added to the dry glue mixture as a. 'dry powder but, in that-case, it is necessary to "ship the glue powder in air-tight containers. When the liquid form of the formaldehyde bisulphite is used, two pounds thereof is used in a formula calling for 100 pounds of vegetable seed meal base, but if the dry form is used then hs of a pound of the powder is used for the same quantity of the glue base. Though I have given the above quantities of the additive aldehyde compound, I wish it to be understood that the amount may be varied from 0.5 to 5 pounds depending on the amount of water that it is desired to put in the glue.
The formula of one of my glues, varying somewhat from that of the ordinary glue above quoted would be as follows:-
Parts Examiner Sodium acid sul hite 12 lbs. 15 oz. Pounds Formaldehyde 8 lbs. 7 oz.
Heretofore from ten to twelve pounds of caustic soda was necessary to bring 100 pounds of 'the flour glue base to a suitable degree of fluidity and ach'iesiveness, but this large amount of caustic soda caused considerable trouble by staining the panel faces. A reduction of the quantity of caustic soda, as provided in my improved glue. is, therefore, greatly to be desired in the veneer panel industry. Also, the most lime that could be used without detracting frommrength of the glue has been about seven pounds to a mixture with 100 pounds of the flour glue base, so that an increase in the quantity of lime and'of sodium silicate, as provided in my improved glue, is also highly desirable because of their cheapness, thus reducing the glue cost, wd because they naturally increase the water resistance of the glue line.
The ingredients used may be of the easily obtainable commercial type; for example, ordinary city or tap water commercial sodiurmacicLsulphite and the ordinary commercial 40% aqueous "solution of formaldehyde, which solution is known in the trade as formaldehyde.
I have referred to specific embodiments of my invention but have done so merely by way of illustration and not as a limitation of the invention the scope of which is defined in the appended claims.
Having described my invention, what I claim, and desire to secure by Letters Patent, is:
1. An adhesive composition comprising the reaction-product of a vegetable seed residue meal or flour as its adhesive base, an aqueous alkaline medium and an additive aldehyde compound functioning to reduce the alkali requirement of the adhesive, the latter having increased spreading properties as compared to an adhesive without the additive aldehyde compound.
2. An adhesive composition comprising the reaction-product of soya bean meal or flour as its adhesive base, an aqueous alkaline medium and an additive aldehyde compound functioning to reduce the alkali requirement of the adhesive, the latter having increased spreading properties as compared to an adhesive without the additive aldehyde compound.
3. An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base; an aqueous alkaline medium, and an additive aldehyde bisulphite compound functioning to reduce the alkali requirement of the adhesive, the latter having increased spreading properties as compared to an adhesive without the additive aldehyde bisulphite compound.
4. An adhesive composition comprising the reaction-product of 100 parts vegetable seed residue flour, 4 parts caustic soda, 30 parts silicate of soda, 20 parts of lime, 2 parts of carbon bisulphide, and 2 parts of a liquid additive aldehyde compound functioning to reduce the alkali requirement of the adhesive, the latter having increased spreading properties as compared to an adhesive without the additive aldehyde compound.
5. An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base an aqueous alkaline medium, an alkali earth metal hydroxide, and an additive aldehyde compound functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde compound.
6. An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkaline medium, an alkali earth metal hydroxide, a soluble alkali metal silicate, and an additive aldehyde compound functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde compound.
7. An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkaline medium, an alkali earth metal hydroxide, a soluble alkali metal silicate, an alkali carbonate, an alkali phosphate, and an additive aldehyde compound functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde compound.
8. An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkaline medium, an alkaline earth metal hydroxide, a soluble alkali metal silicate, sodium carbonate, trisodium phosphate, and an additive aldehyde compound functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde compound.
9. An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqeous alkali medium, an alkali earth metal hydroxide, a soluble alkali metal silicate, an alkali carbonate, an alkali phosphate, carbon bisulphide, and an additive aldehyde compound functioning to reduce the alkali requirement of the adhesive and increase the adaptiveneess of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde compound.
10. An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkali medium, an alkali earth metal hydroxide, a soluble alkali metal silicate, sodium carbonate, trisodium phosphate, carbon bisulphide, and an additive aldehyde compound functioning to reduce the alkali requirement of the adhesive and increase the adaptiveneess of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde compound. a
11. An adhesive composition comprising a reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkali medium, an alkali earth metal hydroxide, a soluble metal silicate, sodium carbonate, trisodium phosphate, carbon bisulphide, and an aldehyde bisulphite compound functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive VUl uumruol luuo,
COATING OR PLAST'C without the additive aldehyde bisulphite compound.
12. An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkaline medium, and a proportion of an additive aldehyde compound equal to about /2% to 5% of seed meal or flour functioning to reduce the alkali requirement of the adhesive, the latter having increased spreading properties as compared to an adhesive without the additive aldehyde compound.
13. An adhesive composition comprising the reaction-product of soya bean meal or flour as its adhesive base, an aqueous alkaline medium, and a proportion of an additive aldehyde compound equal to about /2% to 5% of seed meal or flour functioning to reduce the alkali requirement of the adhesive, the latter having increased spreading properties as compared to an adhesive without the additive aldehyde compound.
14. An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkaline medium, and a proportion of a formaldehyde bisulphite compound equal to about /z% to 5% of said meal or flour, the formaldehyde bisulphite compound functioning to reduce the alkali requirement of the adhesive, the latter having increased spreading properties as compared to an adhesive without the formaldehyde bisulphite compound.
' 15. An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkaline medium, an alkali earth metal hydroxide, and a proportion of an additive aldehyde compound equal to about /2% to 5% of said meal or flour functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde compound.
16; An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkaline medium, an alkali earth metal hydroxide, a soluble alkali metal silicate, and aproportion of an additive aldehyde compound equal to about 5% to 5% of said meal or flour functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde compound.
1'7. An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkaline medium, an alkali earth metal hydroxide, a soluble alkali metal silicate, an alkali carbonate, an alkali phosphate, and a proportion of an additive aldehyde compound equal to about to 5% of said meal or flour functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde compound.
18. An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkaline medium, an alkaline earth metal hydroxide, a soluble alkali metal silicate, sodium carbonate, trisodium phosphate, and a proportion of an additive aldehyde compound equal to about to 5% of said meal or flour functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde compound.
19. An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkali medium, an alkali earth metal hydroxide, a soluble alkali metal silicate, an alkali carbonate, an alkali phosphate, carbon bisulphide, and a proportion of an additive aldehyde compound equal to about to 5% of said meal or flour functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde compound.
20. An adhesive composition comprising the reaction-product of a vegetable seed meal or flour as its adhesive base, an aqueous alkali medium, an alkali earth metal hydroxide, a soluble alkali metal silicate, sodium carbonate, trisodium phosphate, carbon bisulphide, and a proportion of an additive aldehyde compound equal to about /2% to 5% of said meal or flour functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde 1530 compound.
21. An adhesive composition comprising a reaction-product of a vegeiable seed meal or flour as its adhesive base, an aqueous alkali medium, an alkali earth metal hydroxide, a soluble metal silicate, sodium carbonate, trisodium phosphate, carbon bisulphide, and a proportion of an aldehyde bisulphite compound equal to about /2% to 5% of said meal or flour functioning to reduce the alkali requirement of the adhesive and increase the adaptiveness of the adhesive to said alkali metal hydroxide, said adhesive having increased spreading properties as compared to a similar adhesive without the additive aldehyde bisulphite compound.
.GEORGE H. OSGOOD.
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2681290A (en) * 1952-01-03 1954-06-15 Philadelphia Quartz Co Water-resistant silicate adhesives for the machine fabrication of paper board
US3104704A (en) * 1959-08-17 1963-09-24 Dow Chemical Co Fluid loss control in hydraulic cement slurries
US3206321A (en) * 1963-10-30 1965-09-14 Edna D Davidson "long pot-life" soya flour/cs2 glue substantially free of carbon bisulfide thickening
US3206320A (en) * 1961-06-13 1965-09-14 Edna D Davidson Method of preparing a soya protein adhesive composition
US3392038A (en) * 1964-09-08 1968-07-09 Diamond Shamrock Corp Protein and alkali metal silicate adhesive

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2681290A (en) * 1952-01-03 1954-06-15 Philadelphia Quartz Co Water-resistant silicate adhesives for the machine fabrication of paper board
US3104704A (en) * 1959-08-17 1963-09-24 Dow Chemical Co Fluid loss control in hydraulic cement slurries
US3206320A (en) * 1961-06-13 1965-09-14 Edna D Davidson Method of preparing a soya protein adhesive composition
US3206321A (en) * 1963-10-30 1965-09-14 Edna D Davidson "long pot-life" soya flour/cs2 glue substantially free of carbon bisulfide thickening
US3392038A (en) * 1964-09-08 1968-07-09 Diamond Shamrock Corp Protein and alkali metal silicate adhesive

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