US12431164B2 - Storage mediums and methods of making the same - Google Patents

Storage mediums and methods of making the same

Info

Publication number
US12431164B2
US12431164B2 US18/626,433 US202418626433A US12431164B2 US 12431164 B2 US12431164 B2 US 12431164B2 US 202418626433 A US202418626433 A US 202418626433A US 12431164 B2 US12431164 B2 US 12431164B2
Authority
US
United States
Prior art keywords
metallic layer
pattern
cover substrate
storage medium
base substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US18/626,433
Other versions
US20240347075A1 (en
Inventor
Timothy James Orsley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Inc
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Priority to US18/626,433 priority Critical patent/US12431164B2/en
Assigned to CORNING INCORPORATED reassignment CORNING INCORPORATED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ORSLEY, TIMOTHY JAMES
Publication of US20240347075A1 publication Critical patent/US20240347075A1/en
Application granted granted Critical
Publication of US12431164B2 publication Critical patent/US12431164B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/241—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material
    • G11B7/242—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of recording layers
    • G11B7/243—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of recording layers comprising inorganic materials only, e.g. ablative layers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/004—Recording, reproducing or erasing methods; Read, write or erase circuits therefor
    • G11B7/0045—Recording
    • G11B7/00451—Recording involving ablation of the recording layer
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/2403—Layers; Shape, structure or physical properties thereof
    • G11B7/24047—Substrates
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/241—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material
    • G11B7/252—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers
    • G11B7/253—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of substrates
    • G11B7/2531—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of substrates comprising glass
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • G11B7/261—Preparing a master, e.g. exposing photoresist, electroforming
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/241—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material
    • G11B7/242—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of recording layers
    • G11B7/243—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of recording layers comprising inorganic materials only, e.g. ablative layers
    • G11B2007/24302—Metals or metalloids
    • G11B2007/2431—Metals or metalloids group 13 elements (B, Al, Ga, In)

Definitions

  • the present disclosure generally relates to data storage. More specifically, the present disclosure generally relates to storage mediums.
  • a storage medium includes a base substrate, a first metallic layer, a first border region, and a first cover substrate.
  • the base substrate includes a first side and a second side. The first side and the second side oppose one another.
  • the first metallic layer defines a first pattern.
  • the first metallic layer directly abuts the first side of the base substrate.
  • the first border region extends about the first pattern.
  • the first cover substrate is positioned against an exposed surface of the first metallic layer such that the first metallic layer is positioned between the first side of the base substrate and the first cover substrate.
  • the first cover substrate is coupled to the first border region.
  • a storage medium includes a base substrate, a first metallic layer, a first border region, a first cover substrate, a second metallic layer, a second border region, and a second cover substrate.
  • the base substrate includes a first side and a second side. The first side and the second side oppose one another.
  • the base substrate may absorb light at each wavelength within the visible light spectrum.
  • the base substrate includes at least one material chosen from, a glass material, a ceramic material, and a glass-ceramic material.
  • the first metallic layer defines a first pattern. The first metallic layer directly abuts the first side of the base substrate. The first border region that extends about the first pattern.
  • the first cover substrate is positioned against an exposed surface of the first metallic layer such that the first metallic layer is positioned between the first side of the base substrate and the first cover substrate.
  • the first cover substrate is coupled to the first border region.
  • the first cover substrate includes at least one material chosen from, a glass material, a ceramic material, and a glass-ceramic material.
  • the first cover substrate may be transparent at each wavelength within the visible light spectrum.
  • the second metallic layer defines a second pattern.
  • the second metallic layer directly abuts the second side of the base substrate.
  • the first pattern and the second pattern can be different from one another.
  • the second border region extends about the second pattern.
  • the second cover substrate is positioned against an exposed surface of the second metallic layer such that the second metallic layer is positioned between the second side of the base substrate and the second cover substrate.
  • the second cover substrate is coupled to the second border region.
  • the second cover substrate may be transparent at each wavelength within the visible light spectrum.
  • the second cover substrate includes at least one material chosen from, a
  • a method of storing information can include depositing a first metallic layer on a first side of a base substrate.
  • the base substrate may absorb light at each wavelength within the visible light spectrum.
  • the method of storing information can also include depositing a first photoresist layer onto an exposed surface of the first metallic layer such that the first metallic layer is positioned between the first side of the base substrate and the first photoresist layer.
  • the method of storing information can further include applying a first pattern to the first photoresist layer. The first pattern exposes regions of the first metallic layer that are positioned directly below the first pattern. Additionally, the method of storing information can include removing a portion of the regions of the first metallic layer that are exposed by the first pattern such that the first pattern is imprinted onto the first metallic layer.
  • the method of storing information can include removing the first photoresist layer.
  • the method of storing information can also include positioning a first cover substrate over the first metallic layer such that the first metallic layer is positioned between the first side of the base substrate and the first cover substrate.
  • the first cover substrate may be transparent at each wavelength of the visible light spectrum.
  • the method of storing information can further include coupling the first cover substrate to the first metallic layer such that information conveyed by the first pattern is stored.
  • FIG. 1 is a top perspective view of a storage medium, illustrating a first side thereof, according to one example
  • FIG. 2 is a top perspective view of the storage medium, illustrating a second side thereof, according to one example
  • FIG. 3 is a side perspective view of a storage medium precursor, illustrating various components thereof, according to one example
  • FIG. 4 is a top perspective view of the storage medium precursor, illustrating a patterned portion and an unpatterned portion, according to one example
  • FIG. 5 is a top perspective view of the storage medium precursor, illustrating the patterned portion of the storage medium precursor separated from the unpatterned portion of the storage medium precursor, according to one example.
  • FIG. 6 is a flow diagram illustrating a method of storing information, according to one example.
  • the present disclosure provides storage mediums that are capable of economical and efficient data transfer and/or data storage. Additionally, the present disclosure provides storage mediums that are durable and resistant to environmental degradation. Furthermore, the present disclosure provides methods for making the storage mediums discussed herein.
  • the materials employed to form the base substrate 14 may be the same as the materials employed to form the first cover substrate 26 .
  • the base substrate 14 and the first cover substrate 26 may differ in at least one physical property and/or may differ in at least one chemical property.
  • the base substrate 14 may absorb light at each wavelength within the visible light spectrum.
  • the first cover substrate 26 may be transparent to light at each wavelength within the visible light spectrum.
  • the first cover substrate 26 may be transparent at a wavelength of light at which data stored upon the storage medium 10 is to be read and the base substrate 14 may not be transparent at the wavelength of light at which the data stored upon the storage medium 10 is to be read.
  • the base substrate 14 may be at least partially absorb the wavelength of light at which the data stored upon the storage medium 10 is to be read.
  • an absorbing layer may be applied to the second side 34 of the base substrate 14 and the base substrate 14 may be transparent at the wavelength of light at which the data stored upon the storage medium 10 is to be read.
  • the wavelength(s) of light that are utilized to read data stored upon the storage medium 10 may be, but are not limited to, ultraviolet light, visible light, and/or infrared light.
  • the base substrate 14 may absorb at least one wavelength of light whereas it may be preferable for the second cover substrate 66 to be transparent to the same wavelength of light that the base substrate 14 absorbs.
  • the base substrate 14 may absorb light at each wavelength within the visible light spectrum.
  • the second cover substrate 66 may be transparent to light at each wavelength within the visible light spectrum.
  • the base substrate 14 may absorb as much light as possible within a wavelength range that the first pattern 38 and/or the second pattern 58 is intended to be read within.
  • the base substrate 14 may be beneficial for the base substrate 14 to absorb as much light within the visible spectrum as practicable (e.g., for the base substrate 14 to be black in color).
  • Such an arrangement can increase a contrast ratio between the base substrate 14 , the first pattern 38 , and/or the second pattern 58 .
  • Such an arrangement can also be beneficial in preventing interference between regions of the opposing metallic layer that had not been etched and the given side of the storage medium 10 being read.
  • portions of the unpatterned second metallic layer 58 that are in contact with the second side 34 of the base substrate 14 can reflect the light being used to read the first pattern 38 and ultimately decrease a resolution and/or a contrast of the reading of the first pattern 38 .
  • the first cover substrate 26 and the second cover substrate 66 may be identical in composition, identical in chemical properties, and/or identical in physical properties. Alternatively, in various examples, the first cover substrate 26 and the second cover substrate 66 may differ in composition, differ in at least one chemical property, and/or differ in at least one physical property. For example, the first cover substrate 26 and the second cover substrate 66 may be transparent to different wavelength(s) of light. Such an approach may aid in simultaneous reading of data encoded on the first metallic layer 18 (e.g., the first pattern 38 ) and data encoded on the second metallic layer 54 (e.g., the second pattern 58 ).
  • the transparency of the first cover substrate 26 and the second cover substrate 66 may be described by a transmission (%) of a wavelength of visible light through the first cover substrate 26 or the second cover substrate 66 .
  • the first cover substrate 26 and/or the second cover substrate 66 is considered transparent when the transmission for a wavelength of visible light is about 50% or greater.
  • the first cover substrate 26 and/or the second cover substrate 66 may exhibit a transmission for a wavelength of visible light of about 55% or greater, about 60% or greater, about 65% or greater, about 70% or greater, about 75% or greater, about 80% or greater, about 85% or greater, about 86% or greater, about 87% or greater, about 88% or greater, about 89% or greater, about 90% or greater, about 91% or greater, or about 92% or greater, when measured at a thickness of about 1 millimeter.
  • visible light includes the wavelengths of light visible to the human eye and includes the wavelengths ranging from about 330 nm to 800 nm.
  • a storage medium precursor 78 is generated and subjected to a formation process that results in storage of information upon the storage medium 10 .
  • generation of the storage medium precursor 78 can begin by coating a substrate, such as the first metallic layer 18 and/or the second metallic layer 54 , with a light-sensitive organic material (e.g., a photoresist). A pattern is then directly applied to a surface of the light-sensitive organic material by selectively exposing regions of the light-sensitive organic material to light. A solvent, called a developer, is then applied to the light-sensitive organic material.
  • a light-sensitive organic material e.g., a photoresist
  • the light-sensitive organic material is degraded by light and the developer dissolves away the regions that were exposed to light, leaving behind regions of the photoresist where the photoresist was not exposed to light.
  • the light-sensitive organic material is strengthened (either polymerized or cross-linked) by light, and the developer dissolves away only the regions that were not exposed to light.
  • a positive photoresist or a negative photoresist may be employed in the execution of the concepts discussed here.
  • the base substrate 14 is provided with the first metallic layer 18 coupled to the first side 30 thereof and the second metallic layer 54 coupled to the second side 34 thereof.
  • a first photoresist layer 82 is applied to the exposed surface of the first metallic layer 18 such that the first metallic layer 18 is positioned between the first side 30 of the base substrate 14 and the first photoresist layer 82 .
  • a second photoresist layer 86 is applied to the exposed surface of the second metallic layer 54 such that the second metallic layer 54 is positioned between the second side 34 of the base substrate 14 and the second photoresist layer 86 .
  • the resulting arrangement may be referred to as the storage medium precursor 78 .
  • the storage medium precursor 78 may be any arrangement that is ready to undergo the formation process that results in storage of information being imparted thereto.
  • the storage medium precursor 78 may alternatively be referred to as a storage medium blank.
  • the storage medium precursor 78 is ready to receive marking(s) that will correspond to information that will be stored on the finished storage medium 10 .
  • the first photoresist layer 82 may be removed from a portion of the storage medium precursor 78 such that a precursor 90 to the first pattern 38 is defined by the first photoresist layer 82 .
  • the first photoresist layer 82 may be removed from a portion of the storage medium precursor 78 by a combination of irradiation (e.g., an electron beam or a laser beam) and application of a chemical (e.g., a developer).
  • the first photoresist layer 82 when the first photoresist layer 82 is a positive photoresist, the first photoresist layer 82 may be selectively degraded by application of irradiation to define the precursor 90 to the first pattern 38 .
  • the degraded portion(s) of the first photoresist layer 82 may be removed from the portion of the storage medium precursor 78 by application of a chemical that removes the degraded portion(s) of the first photoresist layer 82 (e.g., a developer).
  • the precursor 90 to the first pattern 38 can be applied by direct write lithography, which is also known as maskless lithography. Use of maskless lithography can enable on-the-fly patterning of the first photoresist layer 82 and/or the second photoresist layer 86 as one or more data streams are received.
  • the exposed portion(s) of the first metallic layer 18 may define the precursor 90 to the first pattern 38 .
  • the exposed portion(s) of the first metallic layer 18 are subjected to a process that decreases a thickness of the first metallic layer 18 at the exposed portion(s). For example, a chemical may be applied to the exposed portion(s) of the first metallic layer 18 to decrease the thickness of the first metallic layer 18 .
  • the chemical applied to the exposed portion(s) of the first metallic layer 18 may be an acid etchant, an alkali metal hydroxide, and/or a dilute mineral acid.
  • the first metallic layer 18 may be entirely removed from the base substrate 14 at the exposed portion(s) such that the exposed portion(s) of the first metallic layer 18 are converted into apertures defined by the first metallic layer 18 .
  • the base substrate 14 may be visible through the apertures now defined by the first metallic layer 18 .
  • the first pattern 38 has been applied to the first metallic layer 18 .
  • the first metallic layer 18 may be made of aluminum and the chemical applied to the exposed portion(s) of the first metallic layer 18 may be an aluminum etchant.
  • the storage medium precursor 78 may be separated from adjacent stored information at a termination line 94 in examples where the storage medium precursor 78 is not a single unit.
  • the storage medium precursor 78 may be cut along the termination line 94 after a first stream of data has been imparted to the storage medium precursor 78 when the storage medium precursor 78 has a greater surface area than the first stream of data required.
  • the remaining unmarked storage medium precursor 78 can subsequently be utilized for imparting a second stream of data after separation along the termination line 94 .
  • the storage medium precursor 78 may be separated along the termination line 94 prior to removal of the first photoresist layer 82 .
  • the storage medium precursor 78 may be separated along the termination line 94 after removal of the first photoresist layer 82 .
  • the first photoresist layer 82 may be chemically removed from the first metallic layer 18 , thereby exposing the remainder of the first metallic layer 18 that was not patterned.
  • the chemical used to remove the first photoresist layer 82 can differ from the developer discussed above. Said another way, the portion of the first photoresist layer 82 that is removed after application of the first pattern 38 to the first metallic layer 18 may require a different chemical for such removal than the removal of the first photoresist layer 82 when the first pattern 38 was initially applied to the first photoresist layer 82 .
  • the chemicals suitable for removal of the first photoresist layer 82 after application of the first pattern 38 to the first metallic layer 18 may be generally referred to as strippers.
  • the process discussed above for imparting the precursor 90 of the first pattern 38 , applying the first pattern 38 , and completing the storage medium on the first side 30 of the base substrate 14 can be similarly carried out on the second side 34 of the base substrate 14 .
  • the first and second photoresist layers 82 , 86 may be simultaneously marked.
  • the first and second metallic layers 18 , 54 may be simultaneously etched. It is further contemplated that the remainder of the first and second photoresist layers 82 , 86 may be removed simultaneously following the application of the first pattern 38 and the second pattern 58 .
  • the first pattern 38 and/or the second pattern 58 may depict any storable form of information.
  • the first pattern 38 and/or the second pattern 58 may depict image data, alphanumeric data, and/or indicia.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Recording Or Reproduction (AREA)

Abstract

A storage medium includes a base substrate, a first metallic layer, a first border region, and a first cover substrate. The base substrate includes a first side and a second side. The first side and the second side oppose one another. The first metallic layer defines a first pattern. The first metallic layer directly abuts the first side of the base substrate. The first border region extends about the first pattern. The first cover substrate is positioned against an exposed surface of the first metallic layer such that the first metallic layer is positioned between the first side of the base substrate and the first cover substrate. The first cover substrate is coupled to the first border region.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS
This application claims the benefit of priority under 35 U.S.C. § 119 of U.S. Provisional Application Ser. No. 63/458,709 filed on Apr. 12, 2023, the content of which is relied upon and incorporated herein by reference in its entirety.
BACKGROUND
The present disclosure generally relates to data storage. More specifically, the present disclosure generally relates to storage mediums.
SUMMARY
According to various examples, a storage medium includes a base substrate, a first metallic layer, a first border region, and a first cover substrate. The base substrate includes a first side and a second side. The first side and the second side oppose one another. The first metallic layer defines a first pattern. The first metallic layer directly abuts the first side of the base substrate. The first border region extends about the first pattern. The first cover substrate is positioned against an exposed surface of the first metallic layer such that the first metallic layer is positioned between the first side of the base substrate and the first cover substrate. The first cover substrate is coupled to the first border region.
According to some examples, a storage medium includes a base substrate, a first metallic layer, a first border region, a first cover substrate, a second metallic layer, a second border region, and a second cover substrate. The base substrate includes a first side and a second side. The first side and the second side oppose one another. The base substrate may absorb light at each wavelength within the visible light spectrum. The base substrate includes at least one material chosen from, a glass material, a ceramic material, and a glass-ceramic material. The first metallic layer defines a first pattern. The first metallic layer directly abuts the first side of the base substrate. The first border region that extends about the first pattern. The first cover substrate is positioned against an exposed surface of the first metallic layer such that the first metallic layer is positioned between the first side of the base substrate and the first cover substrate. The first cover substrate is coupled to the first border region. The first cover substrate includes at least one material chosen from, a glass material, a ceramic material, and a glass-ceramic material. The first cover substrate may be transparent at each wavelength within the visible light spectrum. The second metallic layer defines a second pattern. The second metallic layer directly abuts the second side of the base substrate. The first pattern and the second pattern can be different from one another. The second border region extends about the second pattern. The second cover substrate is positioned against an exposed surface of the second metallic layer such that the second metallic layer is positioned between the second side of the base substrate and the second cover substrate. The second cover substrate is coupled to the second border region. The second cover substrate may be transparent at each wavelength within the visible light spectrum. The second cover substrate includes at least one material chosen from, a glass material, a ceramic material, and a glass-ceramic material.
In examples, a method of storing information can include depositing a first metallic layer on a first side of a base substrate. The base substrate may absorb light at each wavelength within the visible light spectrum. The method of storing information can also include depositing a first photoresist layer onto an exposed surface of the first metallic layer such that the first metallic layer is positioned between the first side of the base substrate and the first photoresist layer. The method of storing information can further include applying a first pattern to the first photoresist layer. The first pattern exposes regions of the first metallic layer that are positioned directly below the first pattern. Additionally, the method of storing information can include removing a portion of the regions of the first metallic layer that are exposed by the first pattern such that the first pattern is imprinted onto the first metallic layer. Further, the method of storing information can include removing the first photoresist layer. The method of storing information can also include positioning a first cover substrate over the first metallic layer such that the first metallic layer is positioned between the first side of the base substrate and the first cover substrate. The first cover substrate may be transparent at each wavelength of the visible light spectrum. The method of storing information can further include coupling the first cover substrate to the first metallic layer such that information conveyed by the first pattern is stored.
Additional features and advantages will be set forth in the detailed description which follows, and in part will be readily apparent to those skilled in the art from that description or recognized by practicing the embodiments as described herein, including the detailed description which follows, the claims, as well as the appended drawings.
It is to be understood that both the foregoing general description and the following detailed description are merely exemplary, and are intended to provide an overview or framework to understanding the nature and character of the claims. The accompanying drawings are included to provide a further understanding, and are incorporated in and constitute a part of this specification. The drawings illustrate one or more embodiments, and together with the description serve to explain principles and operation of the various embodiments.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a top perspective view of a storage medium, illustrating a first side thereof, according to one example;
FIG. 2 is a top perspective view of the storage medium, illustrating a second side thereof, according to one example;
FIG. 3 is a side perspective view of a storage medium precursor, illustrating various components thereof, according to one example;
FIG. 4 is a top perspective view of the storage medium precursor, illustrating a patterned portion and an unpatterned portion, according to one example;
FIG. 5 is a top perspective view of the storage medium precursor, illustrating the patterned portion of the storage medium precursor separated from the unpatterned portion of the storage medium precursor, according to one example; and
FIG. 6 is a flow diagram illustrating a method of storing information, according to one example.
 DETAILED DESCRIPTION
Reference will now be made in detail to the present preferred embodiments, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals will be used throughout the drawings to refer to the same or like parts.
In today's society, individuals are generating increasing amounts of data to be stored. Due to the volume of data being generated, economical and efficient data storage systems are needed. Additionally, information storage systems are needed that are durable and resistant to environmental degradation. The present disclosure provides storage mediums that are capable of economical and efficient data transfer and/or data storage. Additionally, the present disclosure provides storage mediums that are durable and resistant to environmental degradation. Furthermore, the present disclosure provides methods for making the storage mediums discussed herein.
Referring to FIGS. 1-5 , reference numeral 10 generally designates a storage medium. The storage medium 10 includes a base substrate 14, a first metallic layer 18, a first border region 22, and a first cover substrate 26. The base substrate 14 includes a first side 30 and a second side 34. The first side 30 and the second side 34 oppose one another. The first metallic layer 18 defines a first pattern 38. The first metallic layer 18 directly abuts the first side 30 of the base substrate 14. In various example, the first metallic layer 18 may be applied to the base substrate 14 by vapor deposition. The first border region 22 extends about the first pattern 38. In some examples, the first border region 22 may surround the first pattern 38. The first cover substrate 26 is positioned against an exposed surface of the first metallic layer 18 such that the first metallic layer 18 is positioned between the first side 30 of the base substrate 14 and the first cover substrate 26. In some examples, the first metallic layer 18 may be made from aluminum. However, the present disclosure is not so limited. Rather, alternative metals may be employed in the first metallic layer 18. For example, the first metallic layer 18 may be made from silver.
Referring again to FIGS. 1-5 , the exposed surface of the first metallic layer 18 is a side of the first metallic layer 18 that is opposite to a side of the first metallic layer 18 that is in direct physical contact with the first side 30 of the base substrate 14. For example, if a bottom surface of the first metallic layer 18 is in direct physical contact with the first side 30 of the base substrate 14, then the exposed surface of the first metallic layer 18 may be a top surface of the first metallic layer 18. The first cover substrate 26 may be coupled to the first border region 22. For example, the first cover substrate 26 may be coupled to the first border region 22 by laser welding. In some examples, the first border region 22 may be an unpatterned region of the first metallic layer 18. In such examples, an edge 42 of the first metallic layer 18 may be aligned with an edge 46 of the base substrate 14. Similarly, in such examples, the edge 42 of the first metallic layer 18 may be aligned with an edge 50 of the first cover substrate 26. Accordingly, in such an example, the edge 42 of the first metallic layer 18, the edge 46 of the base substrate 14, and the edge 50 of the first cover substrate 26 may be coplanar with one another. In alternative examples, the first border region 22 may be a region of the base substrate 14. In such examples, the edge 42 of the first metallic layer 18 may be sealed by the coupling between the first cover substrate 26 and the base substrate 14 such that the first metallic layer 18 is encased between the base substrate 14 and the first cover substrate 26.
Referring now to FIGS. 1 and 2 , the second side 34 of the base substrate 14 can be arranged in a similar manner to the first side 30. For example, a second metallic layer 54 may directly abut the second side 34 of the base substrate 14. The second metallic layer 54 can define a second pattern 58. In some examples, the first pattern 38 and the second pattern 58 may differ from one another. In various examples, a second border region 62 extends about the second pattern 58. In such examples, the second border region 62 may surround the second pattern 58. A second cover substrate 66 may be positioned against an exposed surface of the second metallic layer 54 such that the second metallic layer 54 is positioned between the second side 34 of the base substrate 14 and the second cover substrate 66. In various examples, the second metallic layer 54 may be made of aluminum. However, the present disclosure is not so limited. Rather, alternative metals may be employed in the second metallic layer 54. For example, the second metallic layer 54 may be made from silver.
Referring again to FIGS. 1 and 2 , an exposed surface of the second metallic layer 54 is a side of the second metallic layer 54 that is opposite to a side of the second metallic layer 54 that is in direct physical contact with the second side 34 of the base substrate 14. For example, if a bottom surface of the second metallic layer 54 is in direct physical contact with the second side 34 of the base substrate 14, then the exposed surface of the second metallic layer 54 may be a top surface of the second metallic layer 54. The second cover substrate 66 may be coupled to the second border region 62. For example, the second cover substrate 66 may be coupled to the second border region 62 by laser welding. In some examples, the second border region 62 may be an unpatterned region of the second metallic layer 54. In such examples, an edge 70 of the second metallic layer 54 may be aligned with the edge 46 of the base substrate 14. Similarly, in such examples, the edge 70 of the second metallic layer 54 may be aligned with an edge 74 of the second cover substrate 66. Accordingly, in such an example, the edge 70 of the second metallic layer 54, the edge 46 of the base substrate 14, and the edge 74 of the second cover substrate 66 may be coplanar with one another. In alternative examples, the second border region 62 may be a region of the base substrate 14. In such examples, the edge of the second metallic layer 54 may be sealed by the coupling between the second cover substrate 66 and the base substrate 14 such that the second metallic layer 54 is encased between the base substrate 14 and the second cover substrate 66.
Referring further to FIGS. 1 and 2 , the base substrate 14 may include at least one material chosen from a glass material, a ceramic material, and a glass-ceramic material. Said another way, the base substrate 14 may include a glass material, a ceramic material, and/or a glass-ceramic material. In some examples, the first cover substrate 26 may include at least one material chosen from a glass material, a ceramic material, and a glass-ceramic material. Said another way, the first cover substrate 26 may include a glass material, a ceramic material, and/or a glass-ceramic material. The materials employed to form the base substrate 14 may differ from the materials employed to form the first cover substrate 26. Alternatively, the materials employed to form the base substrate 14 may be the same as the materials employed to form the first cover substrate 26. In various examples, the base substrate 14 and the first cover substrate 26 may differ in at least one physical property and/or may differ in at least one chemical property. For example, it may be preferable for the base substrate 14 to absorb at least one wavelength of visible light whereas it may be preferable for the first cover substrate 26 to be transparent to at least one wavelength of visible light. In some examples, the base substrate 14 may absorb light at each wavelength within the visible light spectrum. In various examples, the first cover substrate 26 may be transparent to light at each wavelength within the visible light spectrum. More generally, it may be beneficial for the first cover substrate 26 to be transparent at a wavelength of light at which data stored upon the storage medium 10 is to be read and the base substrate 14 may not be transparent at the wavelength of light at which the data stored upon the storage medium 10 is to be read. For example, the base substrate 14 may be at least partially absorb the wavelength of light at which the data stored upon the storage medium 10 is to be read. In some examples, rather than the base substrate 14 at least partially absorbing the wavelength of light at which the data stored upon the storage medium 10 is to be read, an absorbing layer may be applied to the second side 34 of the base substrate 14 and the base substrate 14 may be transparent at the wavelength of light at which the data stored upon the storage medium 10 is to be read. The wavelength(s) of light that are utilized to read data stored upon the storage medium 10 may be, but are not limited to, ultraviolet light, visible light, and/or infrared light.
Referring still further to FIGS. 1 and 2 , the second cover substrate 66, when employed, may include at least one material chosen from a glass material, a ceramic material, and a glass-ceramic material. Said another way, the second cover substrate 66 may include a glass material, a ceramic material, and/or a glass-ceramic material. The materials employed to form the base substrate 14 may differ from the materials employed to form the second cover substrate 66. Alternatively, the materials employed to form the base substrate 14 may be the same as the materials employed to form the second cover substrate 66. In various examples, the base substrate 14 and the second cover substrate 66 may differ in at least one physical property and/or may differ in at least one chemical property. For example, it may be preferable for the base substrate 14 to absorb at least one wavelength of light whereas it may be preferable for the second cover substrate 66 to be transparent to the same wavelength of light that the base substrate 14 absorbs. In some examples, the base substrate 14 may absorb light at each wavelength within the visible light spectrum. In various examples, the second cover substrate 66 may be transparent to light at each wavelength within the visible light spectrum.
Referring again to FIGS. 1 and 2 , it may be preferable for the base substrate 14 to absorb as much light as possible within a wavelength range that the first pattern 38 and/or the second pattern 58 is intended to be read within. For example, when the first pattern 38 and/or the second pattern 58 is intended to be read within the visible spectrum, it may be beneficial for the base substrate 14 to absorb as much light within the visible spectrum as practicable (e.g., for the base substrate 14 to be black in color). Such an arrangement can increase a contrast ratio between the base substrate 14, the first pattern 38, and/or the second pattern 58. Such an arrangement can also be beneficial in preventing interference between regions of the opposing metallic layer that had not been etched and the given side of the storage medium 10 being read. For example, if the base substrate 14 were transparent at the wavelength(s) of light that the storage medium 10 were read at, then portions of the unpatterned second metallic layer 58 that are in contact with the second side 34 of the base substrate 14 can reflect the light being used to read the first pattern 38 and ultimately decrease a resolution and/or a contrast of the reading of the first pattern 38.
Referring yet again to FIGS. 1 and 2 , in some examples, the first cover substrate 26 and the second cover substrate 66 may be identical in composition, identical in chemical properties, and/or identical in physical properties. Alternatively, in various examples, the first cover substrate 26 and the second cover substrate 66 may differ in composition, differ in at least one chemical property, and/or differ in at least one physical property. For example, the first cover substrate 26 and the second cover substrate 66 may be transparent to different wavelength(s) of light. Such an approach may aid in simultaneous reading of data encoded on the first metallic layer 18 (e.g., the first pattern 38) and data encoded on the second metallic layer 54 (e.g., the second pattern 58). For example, by reading the data encoded on the first metallic layer 18 with a different wavelength of light than the data encoded on the second metallic layer 54 is read with, it may be possible to filter out wavelength(s) of light that are attributed to the opposing side of the storage medium 10. Such an approach may decrease background noise (e.g., cross-talk) between the data stream coming from the first metallic layer 18 and the data stream coming from the second metallic layer 54 when the data is being read while also increasing a possible read speed for the storage medium 10.
The transparency of the first cover substrate 26 and the second cover substrate 66 may be described by a transmission (%) of a wavelength of visible light through the first cover substrate 26 or the second cover substrate 66. The first cover substrate 26 and/or the second cover substrate 66 is considered transparent when the transmission for a wavelength of visible light is about 50% or greater. In various embodiments, the first cover substrate 26 and/or the second cover substrate 66 may exhibit a transmission for a wavelength of visible light of about 55% or greater, about 60% or greater, about 65% or greater, about 70% or greater, about 75% or greater, about 80% or greater, about 85% or greater, about 86% or greater, about 87% or greater, about 88% or greater, about 89% or greater, about 90% or greater, about 91% or greater, or about 92% or greater, when measured at a thickness of about 1 millimeter. As used herein, “visible light” includes the wavelengths of light visible to the human eye and includes the wavelengths ranging from about 330 nm to 800 nm.
Referring now to FIGS. 3-5 , in the process of creating the storage medium 10, a storage medium precursor 78 is generated and subjected to a formation process that results in storage of information upon the storage medium 10. In general, generation of the storage medium precursor 78 can begin by coating a substrate, such as the first metallic layer 18 and/or the second metallic layer 54, with a light-sensitive organic material (e.g., a photoresist). A pattern is then directly applied to a surface of the light-sensitive organic material by selectively exposing regions of the light-sensitive organic material to light. A solvent, called a developer, is then applied to the light-sensitive organic material. In the case of a positive photoresist, the light-sensitive organic material is degraded by light and the developer dissolves away the regions that were exposed to light, leaving behind regions of the photoresist where the photoresist was not exposed to light. In the case of a negative photoresist, the light-sensitive organic material is strengthened (either polymerized or cross-linked) by light, and the developer dissolves away only the regions that were not exposed to light. A positive photoresist or a negative photoresist may be employed in the execution of the concepts discussed here.
In the example depicted in FIG. 3 , the base substrate 14 is provided with the first metallic layer 18 coupled to the first side 30 thereof and the second metallic layer 54 coupled to the second side 34 thereof. Additionally, a first photoresist layer 82 is applied to the exposed surface of the first metallic layer 18 such that the first metallic layer 18 is positioned between the first side 30 of the base substrate 14 and the first photoresist layer 82. Similarly, a second photoresist layer 86 is applied to the exposed surface of the second metallic layer 54 such that the second metallic layer 54 is positioned between the second side 34 of the base substrate 14 and the second photoresist layer 86. In some examples, once the base substrate 14 is provided with at least one metallic layer and at least one photoresist layer, the resulting arrangement may be referred to as the storage medium precursor 78. However, the present disclosure is not so limited. Rather, the storage medium precursor 78 may be any arrangement that is ready to undergo the formation process that results in storage of information being imparted thereto. In various examples, the storage medium precursor 78 may alternatively be referred to as a storage medium blank.
With specific reference to FIG. 4 , after the metallic layer(s) and the photoresist layer(s) have been applied to the base substrate 14, the storage medium precursor 78 is ready to receive marking(s) that will correspond to information that will be stored on the finished storage medium 10. For example, the first photoresist layer 82 may be removed from a portion of the storage medium precursor 78 such that a precursor 90 to the first pattern 38 is defined by the first photoresist layer 82. In various examples, the first photoresist layer 82 may be removed from a portion of the storage medium precursor 78 by a combination of irradiation (e.g., an electron beam or a laser beam) and application of a chemical (e.g., a developer). For example, when the first photoresist layer 82 is a positive photoresist, the first photoresist layer 82 may be selectively degraded by application of irradiation to define the precursor 90 to the first pattern 38. Next, the degraded portion(s) of the first photoresist layer 82 may be removed from the portion of the storage medium precursor 78 by application of a chemical that removes the degraded portion(s) of the first photoresist layer 82 (e.g., a developer). In one specific example, the precursor 90 to the first pattern 38 can be applied by direct write lithography, which is also known as maskless lithography. Use of maskless lithography can enable on-the-fly patterning of the first photoresist layer 82 and/or the second photoresist layer 86 as one or more data streams are received.
Referring again to FIG. 4 , removal of the first photoresist layer 82 from a portion of the first metallic layer 18 results in exposure of that portion of the first metallic layer 18 while the remainder of the first metallic layer 18 remains covered by the first photoresist layer 82. The exposed portion(s) of the first metallic layer 18 may define the precursor 90 to the first pattern 38. Once the precursor 90 is defined by the first photoresist layer 82, the exposed portion(s) of the first metallic layer 18 are subjected to a process that decreases a thickness of the first metallic layer 18 at the exposed portion(s). For example, a chemical may be applied to the exposed portion(s) of the first metallic layer 18 to decrease the thickness of the first metallic layer 18. The chemical applied to the exposed portion(s) of the first metallic layer 18 may be an acid etchant, an alkali metal hydroxide, and/or a dilute mineral acid. In some examples, the first metallic layer 18 may be entirely removed from the base substrate 14 at the exposed portion(s) such that the exposed portion(s) of the first metallic layer 18 are converted into apertures defined by the first metallic layer 18. In such an example, the base substrate 14 may be visible through the apertures now defined by the first metallic layer 18. Once the thickness of the first metallic layer 18 has been decreased at the exposed portion(s), the first pattern 38 has been applied to the first metallic layer 18. In one specific example, the first metallic layer 18 may be made of aluminum and the chemical applied to the exposed portion(s) of the first metallic layer 18 may be an aluminum etchant.
Referring now to FIGS. 4 and 5 , after the first pattern 38 has been applied to the first metallic layer 18, the storage medium precursor 78 may be separated from adjacent stored information at a termination line 94 in examples where the storage medium precursor 78 is not a single unit. For example, the storage medium precursor 78 may be cut along the termination line 94 after a first stream of data has been imparted to the storage medium precursor 78 when the storage medium precursor 78 has a greater surface area than the first stream of data required. The remaining unmarked storage medium precursor 78 can subsequently be utilized for imparting a second stream of data after separation along the termination line 94. The storage medium precursor 78 may be separated along the termination line 94 prior to removal of the first photoresist layer 82. Alternatively, the storage medium precursor 78 may be separated along the termination line 94 after removal of the first photoresist layer 82. The first photoresist layer 82 may be chemically removed from the first metallic layer 18, thereby exposing the remainder of the first metallic layer 18 that was not patterned. The chemical used to remove the first photoresist layer 82 can differ from the developer discussed above. Said another way, the portion of the first photoresist layer 82 that is removed after application of the first pattern 38 to the first metallic layer 18 may require a different chemical for such removal than the removal of the first photoresist layer 82 when the first pattern 38 was initially applied to the first photoresist layer 82. The chemicals suitable for removal of the first photoresist layer 82 after application of the first pattern 38 to the first metallic layer 18 may be generally referred to as strippers.
Referring again to FIGS. 4 and 5 , once the first photoresist layer 82 has been removed, the first cover substrate 26 (see FIGS. 1 and 2 ) can be positioned in direct contact with the first metallic layer 18 and/or the base substrate 14. After the first cover substrate 26 has been so positioned, the first cover substrate 26 can be coupled to the first border region 22, thereby completing the storage medium 10 on the first side 30 of the base substrate 14. In various examples, the coupling of the first cover substrate 26 to the first border region 22 may be carried out in an inert atmosphere in an effort to prevent oxidation of the first metallic layer 18. In some examples, the storage medium 10 may be configured as a thin film assembly that is capable of being wound onto rolls. In one specific example, the thin film assembly may utilize a thin glass as the base substrate 14, a thin glass as the first cover substrate 26, a thin glass as the second cover substrate 66, a thin layer of the first metallic layer 18, and/or a thin layer of the second metallic layer 54. In various examples, the storage medium precursor 78 may be capable of being wound onto rolls while the finished storage medium 10 may be configured as a thin film assembly that is segmented and stored as individual data sets rather than as a portion of a roll. For example, after the storage medium precursor 78 has been marked with the first pattern 38 and/or the second pattern 58, the first cover substrate 26 and/or the second substrate 66 are secured to the storage medium precursor 78 in the final stages of manufacture. Once the first cover substrate 26 and/or the second cover substrate 66 have been coupled to the storage medium precursor 78, a rigidity of the device can increase. Accordingly, a rigidity of the storage medium 10 may be greater than a rigidity of the storage medium precursor 78. Segmentation of the storage medium precursor 78 (e.g., along the termination line 94) can occur either before or after securing the first cover substrate 26 and/or the second cover substrate 66 to the storage medium precursor 78. Segmentation, as used herein, refers to separating a first data set from a second data set by, for example, physically cutting the storage medium precursor 78 or the final storage medium 10.
The process discussed above for imparting the precursor 90 of the first pattern 38, applying the first pattern 38, and completing the storage medium on the first side 30 of the base substrate 14 can be similarly carried out on the second side 34 of the base substrate 14. In examples where the first photoresist layer 82 and the second photoresist layer 86 are each present, the first and second photoresist layers 82, 86 may be simultaneously marked. Similarly, the first and second metallic layers 18, 54 may be simultaneously etched. It is further contemplated that the remainder of the first and second photoresist layers 82, 86 may be removed simultaneously following the application of the first pattern 38 and the second pattern 58. The first pattern 38 and/or the second pattern 58 may depict any storable form of information. For example, and without limitation, the first pattern 38 and/or the second pattern 58 may depict image data, alphanumeric data, and/or indicia.
Referring to FIG. 6 , a method 200 of storing information is schematically depicted. The method 200 includes step 204 of depositing the first metallic layer 18 on the first side 30 of the base substrate 14. In various examples, the base substrate 14 may absorb light at one or more wavelength of light (e.g., ultraviolet light, visible light, and/or infrared light). The method 200 also includes step 208 of depositing the first photoresist layer 82 onto an exposed surface of the first metallic layer 18 such that the first metallic layer is positioned between the first side 30 of the base substrate 14 and the first photoresist layer 82. Additionally, the method 200 includes step 212 of applying the first pattern 38 to the first photoresist layer 82. The application of the first pattern 38 to the first photoresist layer 82 followed by development of the first photoresist layer 82 exposes regions of the first metallic layer 18 that are positioned directly below the first pattern 38. The method 200 further includes step 216 of removing a portion of the regions of the first metallic layer 18 that are exposed by the first pattern 38 such that the first pattern 38 is imprinted onto the first metallic layer 18. Said another way, a thickness of the first metallic layer 18 is decreased at the region(s) that are exposed by the first pattern 38 such that the first pattern 38 is replicated in the first metallic layer 18. In various examples, the thickness of the first metallic layer 18 may be decreased by an etchant that is capable of removing at least some of the first metallic layer 18. The etchant utilized and/or the duration of time that the first metallic layer 18 is exposed to the etchant may dictate the extent of removal of material from the exposed region(s) of the first metallic layer 18. In some examples, an entirety of the thickness of the first metallic layer 18 may be removed from the region(s) exposed by the first pattern 38 such that the base substrate 14 is visible through the first metallic layer 18 at such region(s).
Referring again to FIG. 6 , the method 200 also includes step 220 of removing the first photoresist layer 82. The step 220 of removing the first photoresist layer 82 can be executed after the step 216 of removing a portion of the region(s) of the first metallic layer 18 that are exposed by the first pattern 38. Additionally, the method 200 includes step 224 of positioning the first cover substrate 26 over the first metallic layer 18 such that the first metallic layer 18 is positioned between the first side 30 of the base substrate 14 and the first cover substrate 26. In various examples, the step 224 of positioning the first cover substrate 26 over the first metallic layer 18 may be performed after the step 220 of removing the first photoresist layer 82. The first cover substrate 26 may be transparent at one or more wavelengths of the visible light spectrum. The method 200 further includes step 228 of coupling the first cover substrate 26 to the first metallic layer 18 such that information conveyed by the first pattern 38 is stored. Alternatively, the method 200 may include a step of coupling the first cover substrate 26 to the base substrate 14 such that information conveyed by the first pattern 38 is stored. In either example, the first cover substrate 26 may be coupled to the first border region 22 such that information conveyed by the first pattern 38 is stored in a protected state—(e.g., protected from external environmental influence).
Referring further to FIG. 6 , in various examples, the step 216 of removing a portion of the region(s) of the first metallic layer 18 that are exposed by the first pattern 38 such that the first pattern 38 is imprinted onto the first metallic layer 18 can include applying an etchant to the exposed region(s) of the first metallic layer 18. In some examples, the step 228 of coupling the first cover substrate 26 to the first metallic layer 18 such that information conveyed by the first pattern 38 is stored can include laser welding the first cover substrate 26 and the first metallic layer 18 together. For example, the first cover substrate 26 may be coupled to the first metallic layer 18 at the first border region 22.
Referring still further to FIG. 6 , the method 200 can include the execution on the second side 34 of the base substrate 14 of similar steps to those performed on the first side 30. For example, the method 200 can include a step of depositing the second metallic layer 54 on the second side 34 of the base substrate 14. The method 200 can also include a step of depositing the second photoresist layer 86 onto the exposed surface of the second metallic layer 54 such that the second metallic layer 54 is positioned between the second side 34 of the base substrate 14 and the second photoresist layer 86. Additionally, the method 200 can include a step of applying the second pattern 58 to the second photoresist layer 86. In such an example, similar to the first pattern 38, the second pattern 58 exposes regions of the second metallic layer 54 that are positioned directly below the second pattern 58. The method 200 can further include a step of removing a portion of the region(s) of the second metallic layer 18 that are exposed by the second pattern 58 such that the second pattern 58 is imprinted onto the second metallic layer 54. For example, the step of removing a portion of the region(s) of the second metallic layer 18 that are exposed by the second pattern 58 such that the second pattern 58 is imprinted onto the second metallic layer 54 can include applying an etchant to the exposed region(s) of the second metallic layer 54.
Referring again to FIG. 6 , the method 200 can include a step of removing the second photoresist layer 86. The step of removing the second photoresist layer 86 can be executed after the step of removing a portion of the region(s) of the second metallic layer 54 that are exposed by the second pattern 58. The method 200 can also include a step of positioning the second cover substrate 66 over the second metallic layer 54 such that the second metallic layer 54 is positioned between the second side 34 of the base substrate 14 and the second cover substrate 66. In various examples, the second cover substrate 66 may be transparent at one or more wavelengths of light (e.g., ultraviolet light, visible light, and/or infrared light). The method 200 can further include a step of coupling the second cover substrate 66 to the second border region 62 such that information conveyed by the second pattern 58 is stored. In some examples, the second border region 62 is defined by the base substrate 14. In alternative examples, the second border region 62 is defined by the second metallic layer 54.
Referring further to FIG. 6 , in various examples, the step of coupling the second cover substrate 66 to the second border region 62 such that information conveyed by the second pattern 58 is stored can include laser welding the second cover substrate 66 to the second border region 62. For example, the second cover substrate 66 may be coupled to the base substrate 14 by laser welding. Alternatively, the second cover substrate 66 may be coupled to the second metallic layer 54 by laser welding. It is contemplated the one or more steps of the method 200 may be performed simultaneously. For example, when the second photoresist layer 86 is present, it may be beneficial to simultaneously perform the step 212 of applying the first pattern 38 to the first photoresist layer 82 and the step of applying the second pattern 58 to the second photoresist layer 86. Similarly, when the second photoresist layer 86 is present, it may be beneficial to simultaneously perform the step 220 of removing the first photoresist layer 82 and the step of removing the second photoresist layer 86.
It will be apparent to those skilled in the art that various modifications and variations can be made without departing from the spirit or scope of the claims.

Claims (28)

What is claimed is:
1. A storage medium, comprising:
a base substrate having a first side and a second side, wherein the first side and the second side oppose one another;
a first metallic layer that defines a first pattern, wherein the first metallic layer directly abuts the first side of the base substrate;
a first border region that extends about the first pattern; and
a first cover substrate, wherein the first cover substrate is positioned against an exposed surface of the first metallic layer such that the first metallic layer is positioned between the first side of the base substrate and the first cover substrate, and wherein the first cover substrate is coupled to the first border region, wherein the base substrate absorbs at least one wavelength of visible light.
2. The storage medium of claim 1, wherein the first border region is an unpatterned region of the first metallic layer.
3. The storage medium of claim 1, wherein the first border region is a region of the base substrate.
4. The storage medium of claim 1, wherein the first cover substrate comprises at least one material chosen from, a glass material, a ceramic material, and a glass-ceramic material.
5. The storage medium of claim 1, wherein the first cover substrate is transparent to at least one wavelength of visible light.
6. The storage medium of claim 5, wherein the first cover substrate is transparent at each wavelength within the visible light spectrum.
7. The storage medium of claim 1, wherein the first cover substrate is coupled to the first border region by laser welding.
8. The storage medium of claim 1, wherein the base substrate absorbs light at each wavelength within the visible light spectrum.
9. The storage medium of claim 1, further comprising:
a second metallic layer that defines a second pattern, wherein the second metallic layer directly abuts the second side of the base substrate;
a second border region that extends about the second pattern; and
a second cover substrate, wherein the second cover substrate is positioned against an exposed surface of the second metallic layer such that the second metallic layer is positioned between the second side of the base substrate and the second cover substrate, and wherein the second cover substrate is coupled to the second border region.
10. The storage medium of claim 9, wherein the second cover substrate is transparent to at least one wavelength of visible light.
11. The storage medium of claim 10, wherein the second cover substrate is transparent at each wavelength within the visible light spectrum.
12. The storage medium of claim 9, wherein the first metallic layer and the second metallic layer are each made of aluminum.
13. The storage medium of claim 9, wherein the first pattern and the second pattern are different from one another.
14. The storage medium of claim 9, wherein the second border region is an unpatterned region of the second metallic layer.
15. The storage medium of claim 9, wherein the second border region is a region of the base substrate.
16. The storage medium of claim 9, wherein the second cover substrate comprises at least one material chosen from, a glass material, a ceramic material, and a glass-ceramic material.
17. The storage medium of claim 1, wherein the base substrate comprises at least one material chosen from, a glass material, a ceramic material, and a glass-ceramic material.
18. A storage medium, comprising:
a base substrate having a first side and a second side, wherein the first side and the second side oppose one another, wherein the base substrate absorbs light at each wavelength within the visible light spectrum, and wherein the base substrate comprises at least one material chosen from, a glass material, a ceramic material, and a glass-ceramic material;
a first metallic layer that defines a first pattern, wherein the first metallic layer directly abuts the first side of the base substrate;
a first border region that extends about the first pattern;
a first cover substrate, wherein the first cover substrate is positioned against an exposed surface of the first metallic layer such that the first metallic layer is positioned between the first side of the base substrate and the first cover substrate, wherein the first cover substrate is coupled to the first border region, wherein the first cover substrate comprises at least one material chosen from, a glass material, a ceramic material, and a glass-ceramic material, and wherein the first cover substrate is transparent at each wavelength within the visible light spectrum;
a second metallic layer that defines a second pattern, wherein the second metallic layer directly abuts the second side of the base substrate, and wherein the first pattern and the second pattern are different from one another;
a second border region that extends about the second pattern; and
a second cover substrate, wherein the second cover substrate is positioned against an exposed surface of the second metallic layer such that the second metallic layer is positioned between the second side of the base substrate and the second cover substrate, wherein the second cover substrate is coupled to the second border region, wherein the second cover substrate is transparent at each wavelength within the visible light spectrum, and wherein the second cover substrate comprises at least one material chosen from, a glass material, a ceramic material, and a glass-ceramic material.
19. The storage medium of claim 18, wherein the first border region is an unpatterned region of the first metallic layer.
20. The storage medium of claim 18, wherein the first border region is a region of the base substrate.
21. The storage medium of claim 18, wherein the first cover substrate is coupled to the first border region by laser welding.
22. The storage medium of claim 18, wherein the first metallic layer and the second metallic layer are each made of aluminum.
23. The storage medium of claim 18, wherein the second border region is an unpatterned region of the second metallic layer.
24. The storage medium of claim 18, wherein the second border region is a region of the base substrate.
25. A method of storing information, comprising the steps of:
depositing a first metallic layer on a first side of a base substrate, wherein the base substrate absorbs light at each wavelength within the visible light spectrum;
depositing a first photoresist layer onto an exposed surface of the first metallic layer such that the first metallic layer is: (i) positioned between the first side of the base substrate and the first photoresist layer and (ii) directly abuts the first side of the base substrate;
applying a first pattern to the first photoresist layer, wherein the first pattern exposes regions of the first metallic layer that are positioned directly below the first pattern;
removing a portion of the regions of the first metallic layer that are exposed by the first pattern such that the first pattern is imprinted onto the first metallic layer;
removing the first photoresist layer;
positioning a first cover substrate over the first metallic layer such that the first metallic layer is positioned between the first side of the base substrate and the first cover substrate, wherein the first cover substrate is transparent at each wavelength of the visible light spectrum; and
coupling the first cover substrate to the first metallic layer through a first border region that extends about the first pattern, such that the first cover substrate is coupled to the first border region and information conveyed by the first pattern is stored.
26. The method of storing information of claim 25, wherein the step of removing a portion of the regions of the first metallic layer that are exposed by the first pattern such that the first pattern is imprinted onto the first metallic layer comprises applying an etchant to the exposed regions of the first metallic layer.
27. The method of storing information of claim 25, wherein the step of coupling the first cover substrate to the first metallic layer such that information conveyed by the first pattern is stored comprises laser welding the first cover substrate and the first metallic layer together.
28. The method of storing information of claim 25, further comprising the steps of:
depositing a second metallic layer on a second side of a base substrate;
depositing a second photoresist layer onto an exposed surface of the second metallic layer such that the second metallic layer is positioned between the second side of the base substrate and the second photoresist layer;
applying a second pattern to the second photoresist layer, wherein the second pattern exposes regions of the second metallic layer that are positioned directly below the second pattern;
removing a portion of the regions of the second metallic layer that are exposed by the second pattern such that the second pattern is imprinted onto the second metallic layer;
removing the second photoresist layer;
positioning a second cover substrate over the second metallic layer such that the second metallic layer is positioned between the second side of the base substrate and the second cover substrate, wherein the second cover substrate is transparent at each wavelength of the visible light spectrum; and
coupling the second cover substrate to the second metallic substrate such that information conveyed by the second pattern is stored.
US18/626,433 2023-04-12 2024-04-04 Storage mediums and methods of making the same Active US12431164B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US18/626,433 US12431164B2 (en) 2023-04-12 2024-04-04 Storage mediums and methods of making the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202363458709P 2023-04-12 2023-04-12
US18/626,433 US12431164B2 (en) 2023-04-12 2024-04-04 Storage mediums and methods of making the same

Publications (2)

Publication Number Publication Date
US20240347075A1 US20240347075A1 (en) 2024-10-17
US12431164B2 true US12431164B2 (en) 2025-09-30

Family

ID=93016841

Family Applications (1)

Application Number Title Priority Date Filing Date
US18/626,433 Active US12431164B2 (en) 2023-04-12 2024-04-04 Storage mediums and methods of making the same

Country Status (1)

Country Link
US (1) US12431164B2 (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0288073A2 (en) * 1987-04-24 1988-10-26 Nippon Paint Co., Ltd. Production of multicolor display
US5224090A (en) * 1987-01-24 1993-06-29 Dai Nippon Insatsu Kabushiki Kaisha Optical recording members and method for production thereof
US5272326A (en) * 1988-06-21 1993-12-21 Kyodo Printing Co., Ltd. Optical card having light absorbing layer
US6023451A (en) * 1997-03-25 2000-02-08 Sony Corporation Optical recording medium and optical disk apparatus
US8155427B2 (en) 2007-01-12 2012-04-10 Nanoark Corporation Wafer-scale image archiving and receiving system
US11007606B2 (en) 2019-08-14 2021-05-18 Ceramic Data Solution GmbH Method for long-term storage of information and storage medium therefor
US20220002418A1 (en) 2019-04-01 2022-01-06 Huabo Biopharm (Shanghai) Co., Ltd. Anti-pd-l1/vegf bifunctional antibody and use thereof
WO2022171522A1 (en) 2021-02-12 2022-08-18 Ceramic Data Solutions GmbH Ultra-thin data carrier and method of read-out
WO2022194354A1 (en) 2021-03-16 2022-09-22 Ceramic Data Solutions GmbH Data carrier, reading method and system utilizing super resolution techniques

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5224090A (en) * 1987-01-24 1993-06-29 Dai Nippon Insatsu Kabushiki Kaisha Optical recording members and method for production thereof
EP0288073A2 (en) * 1987-04-24 1988-10-26 Nippon Paint Co., Ltd. Production of multicolor display
US5272326A (en) * 1988-06-21 1993-12-21 Kyodo Printing Co., Ltd. Optical card having light absorbing layer
US6023451A (en) * 1997-03-25 2000-02-08 Sony Corporation Optical recording medium and optical disk apparatus
US8155427B2 (en) 2007-01-12 2012-04-10 Nanoark Corporation Wafer-scale image archiving and receiving system
US20220002418A1 (en) 2019-04-01 2022-01-06 Huabo Biopharm (Shanghai) Co., Ltd. Anti-pd-l1/vegf bifunctional antibody and use thereof
US11007606B2 (en) 2019-08-14 2021-05-18 Ceramic Data Solution GmbH Method for long-term storage of information and storage medium therefor
WO2022171522A1 (en) 2021-02-12 2022-08-18 Ceramic Data Solutions GmbH Ultra-thin data carrier and method of read-out
WO2022194354A1 (en) 2021-03-16 2022-09-22 Ceramic Data Solutions GmbH Data carrier, reading method and system utilizing super resolution techniques

Also Published As

Publication number Publication date
US20240347075A1 (en) 2024-10-17

Similar Documents

Publication Publication Date Title
KR101140027B1 (en) Method of producing phase shift masks
US20060266916A1 (en) Imprint lithography template having a coating to reflect and/or absorb actinic energy
DE2500907A1 (en) PRESENSITIZED PRINTING PLATE WITH PICTURE MASK CREATED IN SITU BY LASER RAYS
JPH09205081A (en) Method for forming fine pattern of semiconductor device
EP0075756B1 (en) Method of developing relief images in a photoresist layer
US20100273098A1 (en) Mask blank, production method of mask blank and production method of mask
US7115355B2 (en) Fabrication of sub-wavelength structures
US12431164B2 (en) Storage mediums and methods of making the same
EP1119782A1 (en) Production of optical recording media having plural luminescent recording layers by embossing the recording layer
US20080254633A1 (en) Multiple exposure lithography method incorporating intermediate layer patterning
US20100021850A1 (en) Pattern forming method
JPS60230650A (en) Fine pattern manufacturing method
WO1989009990A1 (en) Fabrication method of mask for rom type optical recording card and inspection method of mask
US20030063553A1 (en) Manufacturing method of stamper for optical information medium, photoresist master therefor, stamper for optical information medium and optical information medium
JPH10197712A (en) Manufacturing method of color filter
US20020164495A1 (en) Ablatable direct write imaging medium
JP2942818B2 (en) Method for manufacturing phase shift mask
JP2519970B2 (en) Method for manufacturing mask for ROM-type optical recording card, method for manufacturing ROM-type optical recording card, inspection method therefor, mask inspection apparatus, and inspection apparatus for ROM-type optical recording card
JPS59214856A (en) Lithographic mask and manufacture thereof
JP2653072B2 (en) Pattern formation method
JPS59124728A (en) Formation of pattern
JP3301711B2 (en) Optical recording inspection disk and manufacturing method thereof
JP4539955B2 (en) Phase shift mask, manufacturing method thereof, and exposure method
JPS63214742A (en) Resist pattern forming method
US20030044695A1 (en) Attenuating phase shift mask for photolithography

Legal Events

Date Code Title Description
AS Assignment

Owner name: CORNING INCORPORATED, NEW YORK

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ORSLEY, TIMOTHY JAMES;REEL/FRAME:067002/0264

Effective date: 20240127

FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS

STPP Information on status: patent application and granting procedure in general

Free format text: PUBLICATIONS -- ISSUE FEE PAYMENT RECEIVED

STPP Information on status: patent application and granting procedure in general

Free format text: PUBLICATIONS -- ISSUE FEE PAYMENT VERIFIED

STCF Information on status: patent grant

Free format text: PATENTED CASE