US12274131B2 - Organic light emitting device having first and second banks extended to a dummy area - Google Patents
Organic light emitting device having first and second banks extended to a dummy area Download PDFInfo
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- US12274131B2 US12274131B2 US17/084,459 US202017084459A US12274131B2 US 12274131 B2 US12274131 B2 US 12274131B2 US 202017084459 A US202017084459 A US 202017084459A US 12274131 B2 US12274131 B2 US 12274131B2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/88—Dummy elements, i.e. elements having non-functional features
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
Definitions
- the present invention relates to an organic light-emitting display device.
- LCDs liquid crystal displays
- PDPs plasma display panels
- FEDs field emission displays
- organic light-emitting display devices etc.
- the second bank has a first width in the first direction in an area corresponding to a stepped portion formed on one edge of the overcoat layer and a second width in the first direction in an area corresponding to the display area.
- the first width is greater than the second width.
- a difference between the (1-1)th width and the (2-1)th width is equal to a difference between the (2-1)th width and the (2-2)th width.
- the second openings extend into a dummy area of the non-display area where the overcoat layers are absent.
- FIGS. 6 A and 6 B shows cross-sectional views taken along the lines I-I′ and II-II′ in FIG. 5 , respectively;
- FIG. 7 shows a cross-sectional view taken along the line in FIG. 5 .
- FIGS. 10 A and 10 B show cross-sectional views taken along the lines IV-IV′ and V-V′ in FIG. 9 , respectively;
- FIG. 11 is a schematic view of an organic light-emitting display device according to a third exemplary embodiment of the present invention, which is an enlarged top plan view of the AR area of FIG. 2 ;
- FIG. 12 is a view for explaining the problem of crack formation in a bank due to a step difference on an overcoat layer
- FIGS. 13 A and 13 B show cross-sectional views taken along the line VI-VI′ in FIG. 11 ;
- FIG. 15 is a schematic view of an organic light-emitting display device according to a fourth exemplary embodiment of the present invention, which is an enlarged top plan view of the AR area of FIG. 2 ;
- FIG. 1 is a view for explaining the problems of a solution process.
- forming an organic light-emitting layer using a solution process has the problem of deteriorating the light emission characteristics of organic light-emitting display devices due to pileup.
- an organic light-emitting material 1 is dropped by inkjet equipment 2 or the like onto a first electrode 4 divided up by a bank 3 .
- the dropped organic light-emitting material 1 has a thickness deviation depending on the position, due to differences in hardening rate in the hardening process. That is, a non-uniform organic light-emitting layer 7 is formed which is thick at the edge 5 adjoining the bank and thin at the center 6 .
- the formation of the non-uniform organic light-emitting layer 7 can bring about the problem of deterioration in display quality because brightness varies with position.
- the lifetime of the device can degrade due to differences in current density within the organic light-emitting layer 7 , or the process yield can be lowered due to formation of dark spots. In view of this, it is advantageous to reduce the pile-up area as much as possible when forming the emission layer by using the solution process.
- the image processor 110 outputs a data enable signal DE, etc., along with an externally supplied data signal DATA.
- the image processor 110 may output one or more among a vertical synchronization signal, horizontal synchronization signal, and clock signal, in addition to the data enable signal DE, but these signals are not shown in the drawings for convenience of explanation.
- the image processor 110 is provided in the form of an IC (integrated circuit) on a system circuit board.
- the timing controller 120 receives the data signal DATA from the image processor 110 , along with the data enable signal DE or driving signals including the vertical synchronization signal, horizontal synchronization signal, and clock signal.
- the timing controller 120 Based on the driving signals, the timing controller 120 outputs a gate timing control signal GDC for controlling the operation timing of the gate driver 140 and a timing control signal DDC for controlling the operation timing of the data driver 130 .
- the timing controller 120 is provided in the form of an IC on a control circuit board.
- the data driver 130 In response to the data timing control signal DDC supplied from the timing controller 120 , the data driver 130 samples and latches the data signal DATA supplied form the timing controller 120 , converts it to a gamma reference voltage, and outputs the gamma reference voltage.
- the data driver 130 outputs the data signal DATA through data lines DL 1 to DLn.
- the data driver 130 may be formed on a data circuit substrate in the form of an IC and bonded onto the display panel 150 .
- the gate driver 140 In response to the gate timing control signal GDC supplied from the timing controller 120 , the gate driver 140 outputs a gate signal while shifting the level of a gate voltage.
- the gate driver 140 outputs the gate signal through gate lines GL 1 to GLm.
- the gate driver 140 may be formed on a gate circuit substrate in the form of an IC, or may be formed on the display panel 150 by a gate-in-panel (GIP) technology.
- GIP gate-in-panel
- the display panel 150 displays an image, corresponding to the data signal DATA and gate signal respectively supplied from the data driver 130 and gate driver 140 .
- the non-display area NA comprises pads and link lines.
- the pad is bonded to a circuit substrate and receives signals form the circuit substrate.
- the link lines connected to the pads and transfer the signals to the sub-pixels SP in the display area AA.
- each sub-pixel comprises a switching transistor SW, a driving transistor DR, a compensation circuit CC, and an organic light-emitting diode OLED.
- the organic light-emitting diode OLED operates to emit light in response to a drive current provided by the driving transistor DR.
- the switching transistor SW switches so that a data signal supplied through the first data line DL 1 is stored as a data voltage in a capacitor Cst.
- the driving transistor DR operates so that a driving current flows between a high-level power supply line VDD and a low-level power supply line GND in response to the data voltage stored in the capacitor Cst.
- the compensation circuit CC is a circuit for compensating for the threshold voltage, etc. of the driving transistor DR.
- the capacitor connected to the switching transistor SW or driving transistor DR may be positioned within the compensation circuit CC.
- FIGS. 3 and 4 illustrate a sub-pixel comprising a compensation circuit CC by way of example.
- each sub-pixel may have a 2T(transistor)1C(capacitor) structure comprising a switching transistor SW, a driving transistor DR, a capacitor, and an organic light-emitting diode OLED, or may have various structures like 3T1C, 4T2C, 5T2C, 6T2C, 7T2C, etc., if the compensation circuit CC is added to the sub-pixel.
- FIG. 5 is a schematic view of an organic light-emitting display device according to a first exemplary embodiment of the present invention, which is an enlarged top plan view of the AR area of FIG. 2 .
- FIGS. 6 A and 6 B shows cross-sectional views taken along the lines I-I′ and II-IP in FIG. 5 , respectively.
- the organic light-emitting display device comprises a substrate 10 having a display area AA where sub-pixels SP are arranged and a non-display area NA surrounding the display area AA.
- the substrate 10 may have various planar shapes, for example, all planar shapes such as square, circular, and elliptical, as well as the rectangular shape shown in the drawings.
- a first direction for example, X-axis direction or row direction
- a second direction for example, Y-axis direction or column direction
- the positions and arrangements of subpixels and/or openings to be described later may be defined by the first direction and second direction.
- Signal lines and electrodes for applying driving signals to the organic light-emitting diodes may be arranged on the circuit unit 20 , and the signal lines and the electrodes may be placed separately with at least one insulating layer between them if necessary.
- the circuit unit 20 may further comprise a transistor 21 allocated for each sub-pixel SP.
- a passivation film 27 and an overcoat layer 28 are interposed between the transistor 21 and the organic light-emitting diode.
- the passivation film 27 comprises inorganic material and protects internal elements.
- the overcoat layer 28 comprises predetermined organic material, and may have a predetermined thickness to compensate for step differences caused by the underlying transistors 21 and signal lines.
- the organic light-emitting diode comprises a first electrode 30 , a second electrode 60 , and an organic light-emitting layer 50 interposed between the first electrode 30 and the second electrode 60 .
- the first electrode 30 may be an anode
- the second electrode 60 may be a cathode.
- the first bank 41 may be made relatively thin so as to be covered by the organic light-emitting layer 40 .
- the first bank 41 may be hydrophilic.
- the first bank 41 may be formed of a hydrophilic, inorganic insulating material such as silicon oxide (SiO 2 ) or silicon nitride (SiNx).
- the second bank 43 is placed on the substrate 10 where the first bank 41 is formed.
- the second bank 43 is a barrier wall that separates adjacent lines (e.g. columns) of sub-pixels.
- the second bank 43 comprises second openings OA 2 exposing at least part of the first electrode 30 .
- a plurality of second openings OA 2 are arranged in parallel in the first direction, and extend in the second direction.
- the second opening OA 2 extending in the second direction expose a plurality of the first electrodes 30 arranged along the second direction.
- the second openings OA 2 extending in the second direction expose the first openings OA 1 arranged along the second direction.
- the second bank 43 may be hydrophobic. Alternatively, the second bank 43 may be hydrophobic on the top and hydrophilic on the side. In an example, the second bank 43 may be formed with a hydrophobic material coated on an insulating material or formed with an insulating material containing a hydrophobic material.
- the second bank 43 may be made of organic material. The hydrophobic nature of the second bank 43 may allow the organic light-emitting material constituting the organic light-emitting layer 50 to be pushed to and collected at the center of the light-emitting region. Also, the second bank 43 may function as a barrier that encloses the organic light-emitting material dropped into that region, so as to prevent organic light-emitting materials of different colors from being mixed together.
- the drawings illustrate that the second openings OA 2 are approximately rectangular, they are not limited to this shape. Also, the drawings illustrate that all of the second openings OA 2 have the same shape and area, but they are not limited to this and at least one second opening OA 2 may have a different shape and/or area from another second opening OA 2 . For example, the shape and/or area of the second openings OA 2 may be properly selected in view of the lifetime of organic light-emitting materials.
- the organic light-emitting layer 50 is placed on the substrate 10 where the second bank 43 is formed.
- the organic light-emitting layer 50 may be formed within the corresponding second openings OA 2 , along the direction in which the second openings OA 2 extend. That is, the organic light-emitting material dropped into one second opening OA 2 covers the first electrodes 30 and first banks 41 exposed by the second opening OA 2 , and are not physically separated by the first bank 41 .
- Organic light-emitting materials of different colors may be dropped in an alternating fashion into the corresponding second openings OA 2 .
- the organic light-emitting materials of different colors may comprise organic light-emitting materials that emit red (R), green (G), and blue (B) light, and if necessary, may further comprise an organic light-emitting material that emits white (W) light.
- a plurality of sub-pixels SP may be allocated within one second opening OA 2 , and a plurality of nozzles corresponding to the number of sub-pixels SP may be allocated within it. This compensates for the varying spray rates between the nozzles, and therefore the organic light-emitting materials dropped into the second openings OA 2 may have uniform thickness.
- the area of the sub-pixels SP is relatively reduced.
- organic light-emitting material not dropped to its proper position may cause mixing of different colors of the organic light-emitting layer 50 resulting in a color mixing defect.
- the present invention has the advantage of improving such a color mixing defect, because organic light-emitting material is dropped onto a sufficiently large area in the second openings OA 2 corresponding to the sub-pixels SP.
- FIG. 7 shows a cross-sectional view taken along the line in FIG. 5 .
- the circuit unit 20 and the organic light-emitting diodes placed on the circuit unit 20 are placed on the substrate 10 .
- the circuit unit 20 may comprise transistors 21 electrically connected to the organic light-emitting diodes.
- a light shielding layer 22 is placed on the substrate 10 .
- the light shielding layer 22 shields light coming from the outside and prevents sensitized photocurrent from being generated in the transistors 21 .
- a buffer layer 23 is placed on the light shielding layer 22 .
- the buffer layer 23 serves to protect thin-film transistors formed in a subsequent process from impurities such as alkali ions leaking out of the first substrate SUB 1 .
- the buffer layer 23 may be a silicon oxide (SiOx), a silicon nitride (SiNx), or multiple layers of these compounds.
- a semiconductor layer 212 of the transistors 21 is placed on the buffer layer 23 , and a capacitor lower electrode 24 is located apart from it.
- the semiconductor layer 212 and the capacitor lower electrode 24 may be formed of silicon semiconductor or oxide semiconductor.
- the silicon semiconductor may comprise amorphous silicon or crystallized polycrystalline silicon.
- the semiconductor layer 212 comprises a drain region and a source region each including p-type or n-type impurities, and also comprises a channel between the drain region and the source region.
- the capacitor lower electrode 24 may become conductive by being doped with impurities.
- An interlayer insulating film 26 for insulating the gate electrode 211 is placed on the gate electrode 211 .
- the interlayer insulating film 26 may be a silicon oxide film (SiOx), a silicon nitride film (SiNx), or multiple layers of these compounds.
- a drain electrode 213 and a source electrode 214 are placed on the interlayer insulating film 26 .
- the drain electrode 213 and the source electrode 214 are connected to the semiconductor layer 212 via contact holes exposing the source region of the semiconductor layer 212 .
- the source electrode 213 and the drain electrode 214 may consist of a single layer or multiple layers.
- the source electrode 213 and the drain electrode 214 consist of multiple layers, they may be made up of two layers of molybdenum/aluminum-neodymium or three layers of titanium/aluminum/titanium, molybdenum/aluminum/molybdenum, or molybdenum/aluminum-neodymium/molybdenum.
- a transistor 21 comprising the semiconductor layer 212 , the gate electrode 211 , the drain electrode 213 , and the source electrode 214 is formed.
- the drain electrode 214 which serves as a capacitor upper electrode, and the capacitor lower electrode 24 constitute a capacitor Cst.
- a passivation film 27 is placed on the substrate 10 comprising the transistors 21 and the capacitor Cst.
- the passivation film 27 is an insulating film that protects the underlying elements, and may be a silicon oxide film (SiOx), a silicon nitride film (SiNx), or multiple layers of these compounds.
- An overcoat layer 28 is placed on the passivation film 27 .
- the overcoat layer 28 may be a planarization film for smoothing out step differences on the underlying structure, and is made of an organic material such as polyimide, benzocyclobutene-based resin, acrylate, etc.
- Sub-pixel contact holes 29 are located in some region of the overcoat layer 28 , which expose the source electrode 213 by exposing the passivation film 27 .
- Each organic light-emitting diode comprises a first electrode 30 connected to a transistor, a second electrode 60 facing the first electrode 30 , and the organic light-emitting layer 50 interposed between the first electrode 30 and the second electrode 60 .
- the first electrode 30 may be an anode
- the second electrode 60 may be a cathode.
- a bank 40 is placed on the substrate 10 where the first electrodes 30 are formed.
- the bank 40 comprises a first bank 41 and a second bank 43 .
- the first bank 41 and the second bank 43 comprise openings that expose most of the first electrodes 30 .
- the first bank 41 comprises first openings OA 1 that expose a plurality of first electrodes 30 arranged in the first direction.
- the second bank 43 comprises second openings OA 2 that expose a plurality of first electrodes 30 arranged in a second direction.
- Signal lines 300 may be placed in the area where the first bank 41 is placed and the area where the second bank 43 is placed.
- the signal lines 300 are connected to the transistors 21 and apply driving signals to the corresponding sub-pixels.
- the signal lines 300 may comprise gate lines for applying gate signals to the sub-pixels, data lines for applying data signals to the sub-pixels, high-level power supply lines for applying high-level power to the sub-pixels, and low-level power supply lines for applying low-level power to the sub-pixels.
- the signal lines 300 may further comprise sensing lines for sensing the electrical characteristics of the sub-pixels.
- the signal lines 300 may be formed on different layers, with at least one insulating layer 23 , 26 , 27 , and 28 in between, in the regions corresponding to the first bank 41 and/or second bank 43 .
- the gate lines may be placed on the same layer as the gate electrodes 211 .
- the data lines, high-level power supply lines, and low-level power supply lines may be placed on the same layer as the source/drain electrodes 213 and 214 .
- the sensing lines may be placed on the same layer as the source/drain electrodes 213 and 214 or on the same layer as the light shielding layer 22 . If necessary, any one of the signal lines 300 may be segmented into a plurality of lines placed on different layers, and these line segments may be electrically connected through contact holes penetrating the insulating layer placed between them.
- FIG. 8 is a view for explaining problems that may occur due to difference in the drying speed of organic light-emitting material with respect to position.
- organic light-emitting material is dropped into the second openings OA 2 .
- the dropped organic light-emitting material may spread widely so that its thickness is relatively uniform in a wide region.
- the organic light-emitting material may be concentrated at the edge portions of the second openings OA 2 due to differences in drying speed in the hardening process.
- the edge portions refer to opposite ends of the second openings OA 2 aligned in the second direction.
- the internal rate of flow of organic light-emitting material may differ with position, due to the differences in the drying speed of the organic light-emitting material at the edge portions and center portion of the second openings OA 2 . Due to this, the organic light-emitting layer 50 formed after the drying process is not uniform in thickness in some parts, and may be made thick at the edge portions where the drying speed is relatively high, causing a thickness defect.
- the high drying speed of the organic light-emitting material at the edges may cause solid content to be moved toward the edges and concentrated there due to the differences in internal rate of flow. Therefore, the organic light-emitting layer 50 has non-uniform thickness at the edges, which is seen as edge blurring to the user and results in a deterioration in display quality.
- FIG. 9 is a schematic view of an organic light-emitting display device according to a second exemplary embodiment of the present invention, which is an enlarged top plan view of the AR area of FIG. 2 .
- FIGS. 10 A and 10 B show cross-sectional views taken along the lines IV-IV′ and V-V′ in FIG. 9 , respectively.
- the organic light-emitting display device comprises a substrate 10 having a display area AA where sub-pixels SP are arranged and a non-display area NA surrounding the display area AA.
- the substrate 10 may have various planar shapes, for example, all planar shapes such as square, circular, and elliptical, as well as the rectangular shape shown in the drawings.
- a first direction for example, X-axis direction
- a second direction for example, Y-axis direction
- the positions and arrangements of subpixels and/or openings to be described later may be defined by the first direction and second direction.
- a circuit unit 20 and organic light-emitting diodes are placed on the substrate 10 .
- the circuit unit 20 comprises elements for driving organic light-emitting diodes.
- Signal lines and electrodes for applying driving signals to the organic light-emitting diodes may be arranged on the circuit unit 20 , and the signal lines and the electrodes may be placed separately with at least one insulating layer between them if necessary.
- the circuit unit 20 may further comprise a transistor 21 allocated for each sub-pixel SP.
- a passivation film 27 and an overcoat layer 28 are interposed between the transistor 21 and the organic light-emitting diode.
- the passivation film 27 comprises inorganic material and protects internal elements.
- the overcoat layer 28 comprises predetermined organic material, and may have a predetermined thickness to compensate for step differences caused by the underlying transistors 21 and signal lines.
- the overcoat layer 28 may be patterned at the boundary between the display area AA and the non-display area NA. That is, the overcoat layer 28 may be left in the display area AA and removed from the non-display area NA.
- the overcoat layer 28 may produce an out-gas at a high temperature.
- the out-gas can be a problem because it may deteriorate the organic light-emitting diodes.
- the overcoat layer 28 in the non-display area NA may be removed by patterning.
- the overcoat layer 28 which is made of an organic material, may serve as a path through which oxygen and moisture coming from outside the substrate 10 are introduced.
- the introduced oxygen and moisture can be a problem because they may deteriorate the internal elements in the display area AA.
- the path of moisture and oxygen may be blocked by removing the overcoat layer 28 in the non-display area NA.
- the organic light-emitting diode comprises a first electrode 30 , a second electrode 60 , and an organic light-emitting layer 50 interposed between the first electrode 30 and the second electrode 60 .
- the first electrode 30 may be an anode
- the second electrode 60 may be a cathode.
- the sub-pixels SP may be arranged along first and second directions.
- the sub-pixels SP located adjacent to each other in the first direction may emit light of different colors, and the sub-pixels SP located adjacent to each other in the second direction may emit light of the same color.
- the first electrodes 30 of the organic light-emitting diodes are placed on the sub-pixels SP.
- One first electrode 30 may be allocated for each sub-pixel SP.
- a bank 40 is placed on the first electrodes 30 .
- the bank 40 comprises a first bank 41 and a second bank 43 .
- the first bank 41 may be made relatively thin so as to be covered by the organic light-emitting layer 40 .
- the first bank 41 may be hydrophilic.
- the first bank 41 may be formed of a hydrophilic, inorganic insulating material such as silicon oxide (SiO2) or silicon nitride (SiNx).
- the second bank 43 may be hydrophobic. Alternatively, the second bank 43 may be hydrophobic on the top and hydrophilic on the side. In an example, the second bank 43 may be formed with a hydrophobic material coated on an insulating material or formed with an insulating material containing a hydrophobic material.
- the second bank 43 may be made of organic material. The hydrophobic nature of the second bank 43 may allow the organic light-emitting material constituting the organic light-emitting layer 50 to be pushed to and collected at the center of the light-emitting region. Also, the second bank 43 may function as a barrier that encloses the organic light-emitting material dropped into that region, so as to prevent organic light-emitting materials of different colors from being mixed together.
- the drawings illustrate that the second openings OA 2 are approximately rectangular, they are not limited to this shape. Also, the drawings illustrate that all of the second openings OA 2 have the same shape and area, but they are not limited to this and at least one second opening OA 2 may have a different shape and/or area from another second opening OA 2 . For example, the shape and/or area of the second openings OA 2 may be properly selected in view of the lifetime of organic light-emitting materials.
- the organic light-emitting layer 50 is placed on the substrate 10 where the second bank 43 is formed.
- the organic light-emitting layer 50 may be formed within the corresponding second openings OA 2 , along the direction in which the second openings OA 2 extend. That is, the organic light-emitting material dropped into one second opening OA 2 covers the first electrodes 30 and first banks 41 exposed by the second opening OA 2 , and are not physically separated by the first bank 41 .
- Organic light-emitting material of the same color is dropped onto the first electrodes 30 exposed by one second opening OA 2 .
- the planar shape of the organic light-emitting layer 50 may correspond to the planar shape of the second openings OA 2 .
- the second bank 43 is located between the first electrodes 30 adjacent to each other in the first direction, so that the organic light-emitting materials of different colors, dropped into the corresponding second openings OA 2 adjacent to each other in the first direction, are prevented from being mixed together. That is, the organic light-emitting materials of different colors dropped into different second openings OA 2 are physically separated by the second bank 43 .
- the organic light-emitting layer 50 may have non-uniform thickness due to differences in the drying speed of organic light-emitting material at the edge portions of the second openings OA 2 .
- the edge portions of the second openings OA 2 may be positioned in the non-display area NA in which input images are not displayed, by adding the dummy area DA.
- the organic light emitting layer 50 has a mound MD or a valley (not shown) at a location adjacent to the second bank 43 in the dummy area DA.
- the organic light-emitting layer 50 may have uniform thickness in the display area AA. Accordingly, the second exemplary embodiment of the present invention has the advantage of significantly improving the decrease in display quality due to the thickness deviation of the organic light-emitting layer 50 .
- FIG. 11 is a schematic view of an organic light-emitting display device according to a third exemplary embodiment of the present invention, which is an enlarged top plan view of the AR area of FIG. 2 .
- FIG. 12 is a view for explaining the problem of crack formation in a bank due to a step difference on an overcoat layer.
- FIG. 13 shows cross-sectional views taken along the line VI-VI′ in FIG. 11 .
- FIGS. 14 A and 14 B show cross-sectional views taken along the lines VII-VII′ and VIII-VIII′ in FIG. 11 , respectively.
- a description of components that are substantially the same as those in the second exemplary embodiment will be omitted.
- Signal lines and electrodes for applying driving signals to the organic light-emitting diodes may be arranged on the circuit unit 20 , and the signal lines and the electrodes may be placed separately with at least one insulating layer between them if necessary.
- the circuit unit 20 may further comprise a transistor allocated for each sub-pixel SP.
- a passivation film 27 and an overcoat layer 28 are interposed between the transistor and the organic light-emitting diode.
- the passivation film 27 comprises inorganic material and protects internal elements.
- the overcoat layer 28 comprises predetermined organic material, and may have a predetermined thickness to compensate for step differences caused by the underlying transistors and signal lines.
- the overcoat layer 28 may be patterned at the boundary between the display area AA and the non-display area NA. That is, the overcoat layer 28 may be left in the display area AA and removed from the non-display area NA.
- the organic light-emitting display device comprises a substrate 10 having a display area AA where sub-pixels SP are arranged and a non-display area NA surrounding the display area AA.
- the substrate 10 may have various planar shapes, for example, all planar shapes such as square, circular, and elliptical, as well as the rectangular shape shown in the drawings.
- a first direction for example, X-axis direction
- a second direction for example, Y-axis direction
- the positions and arrangements of subpixels and/or openings to be described later may be defined by the first direction and second direction.
- a circuit unit 20 and organic light-emitting diodes are placed on the substrate 10 .
- the circuit unit 20 comprises elements for driving organic light-emitting diodes.
- Signal lines and electrodes for applying driving signals to the organic light-emitting diodes may be arranged on the circuit unit 20 , and the signal lines and the electrodes may be placed separately with at least one insulating layer between them if necessary.
- the circuit unit 20 may further comprise a transistor 21 allocated for each sub-pixel SP.
- a passivation film 27 and an overcoat layer 28 are interposed between the transistor 21 and the organic light-emitting diode.
- the passivation film 27 comprises inorganic material and protects internal elements.
- the overcoat layer 28 comprises predetermined organic material, and may have a predetermined thickness to compensate for step differences caused by the underlying transistors 21 and signal lines.
- the organic light-emitting diode comprises a first electrode 30 , a second electrode 60 , and an organic light-emitting layer 50 interposed between the first electrode 30 and the second electrode 60 .
- the first electrode 30 may be an anode
- the second electrode 60 may be a cathode.
- the first bank 41 is located on the first electrodes 30 .
- the first bank 41 comprises first openings OA 1 exposing at least part of the first electrodes 30 .
- One first opening OA 1 exposes one first electrode 30 .
- the number of first openings OA 1 and the number of first electrodes 30 may be equal.
- the non-display area NA may further comprise a dummy area DA.
- the dummy area DA is an area adjacent from the display area AA in the second direction.
- the first bank 41 is placed in the display area AA, and extends as far as the dummy area DA.
- the overcoat layer 21 may not be interposed between the first bank 41 and the substrate 10 .
- the second bank 43 is placed on the substrate 10 where the first bank 41 is formed.
- the second bank 43 comprises second openings OA 2 exposing at least part of the first electrode 30 .
- a plurality of second openings OA 2 are arranged in parallel in the first direction, and extend in the second direction.
- the second opening OA 2 extending in the second direction expose a plurality of the first electrodes 30 arranged along the second direction.
- the second openings OA 2 extending in the second direction expose the first openings OA 1 arranged along the second direction.
- the second bank 43 is placed in the display area AA, and extends as far as the dummy area DA.
- the second openings OA 2 expose the first electrodes 30 arranged in the display area AA, and expose the first bank 43 that extends as far as the dummy area DA and are placed in the dummy area DA.
- the dummy area DA is a non-display area NA in which the transistors and the organic light-emitting diodes are not placed. Accordingly, the second openings OA 2 expose only the first bank 41 in the dummy area DA.
- the edge portions of the second openings OA 2 may be allocated to the non-display area NA by providing the dummy area DA.
- the organic light-emitting layer 50 is placed on the substrate 10 where the second bank 43 is formed.
- the organic light-emitting layer 50 may be formed within the corresponding second openings OA 2 , along the direction in which the second openings OA 2 extend. That is, the organic light-emitting material dropped into one second opening OA 2 covers the first electrodes 30 and first banks 41 exposed by the second opening OA 2 , and are not physically separated by the first bank 41 .
- the second bank 43 is located between the first electrodes 30 adjacent to each other in the first direction, so that the organic light-emitting materials of different colors, dropped into the corresponding second openings OA 2 adjacent to each other in the first direction, are kept from being mixed together. That is, the organic light-emitting materials of different colors dropped into different second openings OA 2 are physically separated by the second bank 43 .
- the organic light-emitting materials dropped into the second openings OA 2 may vary in flow.
- organic light-emitting material is repulsive to the hydrophobic, second bank 43 , so that it may not have a smooth flow but limited flow in the second openings OA 2 with a relatively small width.
- the flow of organic light-emitting material in the second openings OA with a relatively small width may be limited even if the dummy area DA is added, thereby making it hard to expect the above-stated advantages.
- the organic light-emitting layer 50 may comprise a first organic light-emitting layer 50 - 1 that emits a first color, a second organic light-emitting layer 50 - 2 that emits a second color, and a third organic light-emitting layer 50 - 3 that emits a third color.
- first color is blue (B)
- second color is green (G)
- third color is red (R)
- present invention is not limited to this.
- the width of one among a (2-1)th opening OA 2 - 1 where the first organic light-emitting layer 50 - 1 is formed, a (2-2)th opening OA 2 - 2 where the second organic light-emitting layer 50 - 2 is formed, and a (2-3)th opening OA 2 - 3 where the first organic light-emitting layer 50 - 1 is formed may be different from the width of another of them.
- width refers to distance in the first direction.
- the width W 1 of the (2-1)th opening OA 2 - 1 is greater than the width W 2 of the (2-2)th opening OA 2 - 2
- the width W 2 of the (2-2)th opening OA 2 - 2 is greater than the width W 3 of the (2-3)th opening OA 2 - 3 .
- the second openings OA 2 - 1 , OA 2 - 2 , and OA 2 - 3 may have different widths W 1 ′, W 2 ′, and W 3 ′ depending on their position in the dummy area DA.
- the (2-3)th opening OA 2 - 3 may have a relatively large width W 3 ′ in the dummy area DA, as shown in FIG. 16 B .
- the present invention is not limited to this, and if necessary, the width W 2 ′ of the (2-2)th opening OA 2 - 2 as well may be adjusted.
- the amounts of increase and decrease in the widths of the (2-1)th, (2-2)th, and (2-3)th openings OA 2 - 1 , OA 2 - 2 , and OA 2 - 3 in the dummy area DA may correspond to each other.
- the organic light-emitting material dropped onto the display area AA may spread well as far as the dummy area DA by controlling the width of the second openings OA 2 in the dummy area DA. Accordingly, it is possible to overcome the problem of concentration of solid content of organic light-emitting material at one side in the display area AA, thereby significantly improving the deterioration in display quality due to differences in the thickness of the organic light-emitting layer 50 .
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- Optics & Photonics (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| US17/084,459 US12274131B2 (en) | 2018-12-18 | 2020-10-29 | Organic light emitting device having first and second banks extended to a dummy area |
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| KR10-2018-0164468 | 2018-12-18 | ||
| KR1020180164468A KR102772063B1 (en) | 2018-12-18 | 2018-12-18 | Organic light emitting display device |
| US16/400,977 US10854694B2 (en) | 2018-12-18 | 2019-05-01 | Organic light emitting display device |
| US17/084,459 US12274131B2 (en) | 2018-12-18 | 2020-10-29 | Organic light emitting device having first and second banks extended to a dummy area |
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| Application Number | Title | Priority Date | Filing Date |
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| US16/400,977 Continuation US10854694B2 (en) | 2018-12-18 | 2019-05-01 | Organic light emitting display device |
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| US20210050396A1 US20210050396A1 (en) | 2021-02-18 |
| US12274131B2 true US12274131B2 (en) | 2025-04-08 |
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| US17/084,459 Active 2041-04-10 US12274131B2 (en) | 2018-12-18 | 2020-10-29 | Organic light emitting device having first and second banks extended to a dummy area |
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| KR (1) | KR102772063B1 (en) |
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| CN108735791A (en) * | 2018-07-05 | 2018-11-02 | 云谷(固安)科技有限公司 | Display panel and its manufacturing method and display terminal |
| DE102019116103B4 (en) * | 2019-06-13 | 2021-04-22 | Notion Systems GmbH | Method for labeling a printed circuit board by creating shading in a functional lacquer layer |
| KR20210055524A (en) * | 2019-11-07 | 2021-05-17 | 엘지디스플레이 주식회사 | Organic light emitting display device |
| CN113035905B (en) * | 2019-12-09 | 2025-05-30 | 乐金显示有限公司 | Electroluminescent display device |
| KR20210073199A (en) | 2019-12-10 | 2021-06-18 | 엘지디스플레이 주식회사 | Organic light emitting display device |
| KR20210074060A (en) | 2019-12-11 | 2021-06-21 | 엘지디스플레이 주식회사 | Organic light emitting display device |
| US11980046B2 (en) * | 2020-05-27 | 2024-05-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for forming an isolation structure having multiple thicknesses to mitigate damage to a display device |
| CN115606331A (en) * | 2021-03-30 | 2023-01-13 | 京东方科技集团股份有限公司(Cn) | Display substrate and display device |
| WO2022204918A1 (en) | 2021-03-30 | 2022-10-06 | 京东方科技集团股份有限公司 | Display substrate and preparation method therefor, and display apparatus |
| KR20220140935A (en) | 2021-04-09 | 2022-10-19 | 삼성디스플레이 주식회사 | Display panel |
| TWI765788B (en) * | 2021-07-28 | 2022-05-21 | 友達光電股份有限公司 | Display panel and manufacturing method thereof |
| CN113990903A (en) * | 2021-10-25 | 2022-01-28 | 合肥京东方卓印科技有限公司 | A display substrate and a display panel |
| CN116828916A (en) * | 2022-03-21 | 2023-09-29 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
| CN121001529B (en) * | 2025-10-15 | 2026-01-02 | 武汉华星光电技术有限公司 | Display panel and display device |
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Also Published As
| Publication number | Publication date |
|---|---|
| US10854694B2 (en) | 2020-12-01 |
| KR20200075607A (en) | 2020-06-26 |
| US20210050396A1 (en) | 2021-02-18 |
| US20200194518A1 (en) | 2020-06-18 |
| DE102019132804A1 (en) | 2020-07-09 |
| CN111341925A (en) | 2020-06-26 |
| CN117222263A (en) | 2023-12-12 |
| KR102772063B1 (en) | 2025-02-21 |
| CN111341925B (en) | 2023-11-07 |
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