US11689173B2 - Filter module - Google Patents
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- US11689173B2 US11689173B2 US16/896,542 US202016896542A US11689173B2 US 11689173 B2 US11689173 B2 US 11689173B2 US 202016896542 A US202016896542 A US 202016896542A US 11689173 B2 US11689173 B2 US 11689173B2
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/09—Filters comprising mutual inductance
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/17—Structural details of sub-circuits of frequency selective networks
- H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
- H03H7/1766—Parallel LC in series path
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/17—Structural details of sub-circuits of frequency selective networks
- H03H7/1708—Comprising bridging elements, i.e. elements in a series path without own reference to ground and spanning branching nodes of another series path
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/17—Structural details of sub-circuits of frequency selective networks
- H03H7/1716—Comprising foot-point elements
- H03H7/1725—Element to ground being common to different shunt paths, i.e. Y-structure
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/17—Structural details of sub-circuits of frequency selective networks
- H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
- H03H7/1775—Parallel LC in shunt or branch path
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/17—Structural details of sub-circuits of frequency selective networks
- H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
- H03H7/1783—Combined LC in series path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09336—Signal conductors in same plane as power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1006—Non-printed filter
Definitions
- the present disclosure relates to a filter module.
- RF filters have been used in radio equipment, such as cellular phones.
- An RF filter has a function of passing only signals of a desired frequency band, thereby reducing an influence of signals outside the pass band on an RF circuit, for example, degradation of the signal-to-noise ratio.
- International Publication No. WO/2011/114851 discloses a multilayer RF filter.
- the multilayer RF filter has a multilayer structure including a plurality of dielectric layers laminated one on top of another, each of which has a conductor pattern.
- the multilayer RF filter disclosed in International Publication No. WO/2011/114851 includes a ground impedance adjusting circuit for reducing the parasitic inductance of a conductor (wiring line) that connects a circuit function section implementing a filter function and a ground electrode.
- the ground impedance adjusting circuit prevents degradation of attenuation characteristics in an RF band.
- the ground electrode of the multilayer RF filter and the ground of a module substrate on which the multilayer RF filter is mounted are strongly connected to each other so that an additional parasitic inductance does not occur between the ground electrode and the ground.
- the attenuation characteristics outside the pass band are requested to be finely adjusted in accordance with the frequency environment in actual use, the frequency characteristics of other components, and the like.
- the attenuation characteristics can be finely adjusted by finely adjusting the shape or size of the conductor pattern of each conductor layer. In other words, the shape or size of the conductor pattern is to be changed according to the attenuation characteristics to be obtained, and thus the cost of development or mass production increases.
- An object of the present disclosure is to provide a filter module capable of easily adjusting attenuation characteristics.
- a filter module including a module substrate and a filter element mounted on the module substrate.
- the filter element includes a ground terminal and a pair of signal terminals.
- the module substrate includes a ground plane, a ground land, and an inductance adjusting line that connects the ground land to the ground plane.
- the ground terminal of the filter element is connected to the ground land of the module substrate.
- the inductance adjusting line includes an in-plane extending portion that extends in an in-plane direction of the module substrate.
- the attenuation characteristics of the filter module can be adjusted without changing the attenuation characteristics of the filter element.
- FIG. 1 A is a block diagram of a filter module serving as a simulation target
- FIG. 1 B , FIG. 1 C , and FIG. 1 D are diagrams each illustrating the disposition in a plan view of a first signal land, a ground land, a second signal land, and a via conductor or via conductors of a sample serving as a simulation target;
- FIG. 2 is a graph illustrating the simulation results of a transmission coefficient
- FIG. 3 is an equivalent circuit diagram of a filter element and a module substrate included in a filter module according to a first embodiment
- FIG. 4 is a block diagram of the filter module according to the first embodiment
- FIG. 5 A is a plan view of a surface conductor layer in which a first signal land, a second signal land, and a ground land are disposed, of the module substrate;
- FIG. 5 B is a plan view of a conductor layer in which a ground plane is disposed, of the module substrate;
- FIG. 5 C is a cross-sectional view taken along a chain line 5 C- 5 C in each of FIG. 5 A and FIG. 5 B ;
- FIG. 6 A and FIG. 6 B are diagrams each illustrating the relationship in size among the filter element, an in-plane extending portion, an opening, and so forth;
- FIG. 6 C and FIG. 6 D are diagrams each illustrating another example configuration of the in-plane extending portion
- FIG. 7 A is a plan view of a surface conductor layer in which a first signal land, a second signal land, and a ground land are disposed, of a module substrate of a filter module according to a second embodiment;
- FIG. 7 B is a plan view of a conductor layer in which a ground plane is disposed, of the module substrate;
- FIG. 8 A and FIG. 8 B are graphs illustrating simulation results of a transmission coefficient from an input port of a filter element to an output port of a low-noise amplifier in a case where the number of via conductors is one and in a case where the number of via conductors is two, respectively;
- FIG. 9 is a plan view of a conductor layer in which a ground plane is disposed, of a filter module according to a modification example of the second embodiment
- FIG. 10 is a cross-sectional view of a filter module according to a third embodiment
- FIG. 11 A is a plan view of a surface conductor layer formed on a module substrate of a filter module according to a fourth embodiment
- FIG. 11 B is a plan view of a surface conductor layer formed on a module substrate of a filter module according to a modification example of the fourth embodiment.
- FIG. 12 is an equivalent circuit diagram of a filter module according to a fifth embodiment.
- FIG. 1 A is a block diagram of a filter module serving as a simulation target.
- a filter element 20 and a low-noise amplifier 21 are mounted on a module substrate 22 .
- An input terminal, a ground terminal, and an output terminal of the filter element 20 are connected to a first signal land 23 , a ground land 24 , and a second signal land 25 of the module substrate 22 , respectively.
- An input terminal and an output terminal of the low-noise amplifier 21 are connected to a third signal land 26 and a fourth signal land 27 of the module substrate 22 , respectively.
- the ground land 24 is connected to a ground plane 29 in the module substrate 22 via a via conductor 28 .
- the second signal land 25 and the third signal land 26 are connected to each other by a transmission line in the module substrate 22 .
- a transmission coefficient S 21 from the first signal land 23 to the fourth signal land 27 is calculated by using an electromagnetic field simulator.
- FIG. 1 B , FIG. 1 C , and FIG. 1 D are diagrams each illustrating the disposition in a plan view of the first signal land 23 , the ground land 24 , the second signal land 25 , and the via conductor 28 or via conductors 28 of a sample serving as a simulation target.
- the first signal land 23 , the ground land 24 , and the second signal land 25 are arranged in a line in this order.
- the numbers of via conductors 28 disposed are 15, 2, and 1, respectively.
- FIG. 2 is a graph illustrating the simulation results of the transmission coefficient S 21 .
- the horizontal axis represents frequency in “GHz”, and the vertical axis represents transmission coefficient S 21 in “dB”.
- the broken line, the thin solid line, and the bold solid line represent the simulation results of the samples illustrated in FIG. 1 B , FIG. 1 C , and FIG. 1 D , respectively.
- Each sample has a pass band ranging from about 3.3 GHz to about 4.2 GHz corresponding to Band n77 of the fifth-generation mobile communication system (5G).
- 5G fifth-generation mobile communication system
- the sample in FIG. 1 D there are two attenuation poles AD 1 and AD 2 on a higher-frequency side than the pass band. Also, in the sample in FIG. 1 C , there are two attenuation poles AC 1 and AC 2 on a higher-frequency side than the pass band. In the sample in FIG. 1 B , there is an attenuation pole AB 1 on a higher-frequency side than the pass band. The second attenuation pole of the sample in FIG. 1 B is in the region of frequencies of about 10 GHz and higher.
- the attenuation poles AD 1 , AC 1 , and AB 1 on the lower-frequency side are located on a higher-frequency side as the number of via conductors 28 decreases.
- the attenuation poles AD 2 and AC 2 on the higher-frequency side are located on a lower-frequency side as the number of via conductors 28 decreases.
- the number of via conductors 28 has an influence on the parasitic inductance between the ground land 24 ( FIG. 1 A ) and the ground plane 29 ( FIG. 1 A ).
- the parasitic inductance increases as the number of via conductors 28 decreases.
- the difference in attenuation characteristics among the samples illustrated in FIG. 2 results from the difference in parasitic inductance. This implies that adjusting of the parasitic inductance between the ground land 24 and the ground plane 29 makes it possible to adjust the attenuation characteristics in a state where the filter element 20 is mounted on the module substrate 22 .
- FIG. 3 is an equivalent circuit diagram of a filter element 30 and a module substrate 40 included in the filter module according to the first embodiment.
- the filter element 30 includes a first signal terminal 31 , a second signal terminal 32 , a ground terminal 33 , and two parallel resonance circuits PR 1 and PR 2 .
- the parallel resonance circuit PR 1 is constituted by an inductor L 1 and a capacitor C 1 connected in parallel to each other
- the parallel resonance circuit PR 2 is constituted by an inductor L 2 and a capacitor C 2 connected in parallel to each other.
- the first signal terminal 31 and one end of the parallel resonance circuit PR 1 are coupled to each other via a capacitor C 4 , and the other end of the parallel resonance circuit PR 1 is connected to the ground terminal 33 .
- the second signal terminal 32 and one end of the parallel resonance circuit PR 2 are coupled to each other via a capacitor C 5 , and the other end of the parallel resonance circuit PR 2 is connected to the ground terminal 33 .
- the parallel resonance circuits PR 1 and PR 2 are coupled to each other via a capacitor C 3 .
- the inductors L 1 and L 2 are coupled to each other by a mutual inductance M 12 .
- the first signal terminal 31 and the second signal terminal 32 are coupled to each other via a capacitor C 6 .
- a first signal land 41 , a second signal land 42 , and a ground land 43 are disposed on a surface of the module substrate 40 .
- the module substrate 40 includes therein a ground plane 44 .
- the ground land 43 and the ground plane 44 are connected to each other via an inductance adjusting line 60 .
- the first signal terminal 31 , the second signal terminal 32 , and the ground terminal 33 of the filter element 30 are connected to the first signal land 41 , the second signal land 42 , and the ground land 43 of the module substrate 40 , respectively.
- FIG. 4 is a block diagram of a filter module 50 according to the first embodiment.
- the filter module 50 according to the first embodiment includes two antenna terminals 51 and 52 and two output terminals 53 and 54 .
- the two antenna terminals 51 and 52 are connected to two filter elements 30 and 35 via a radio-frequency (RF) switch 55 .
- the filter element 30 is a band pass filter that passes signals of the frequency band of Band n77 of 5G
- the filter element 35 is a band pass filter that passes signals of the frequency band of Band n79 of 5G.
- the signals passed through the filter elements 30 and 35 are inputted to low-noise amplifiers 56 and 57 , respectively.
- the signals amplified by the low-noise amplifiers 56 and 57 are outputted to the outside from the output terminals 53 and 54 , respectively, via an RF switch 58 .
- FIG. 5 A is a plan view of a surface conductor layer in which the first signal land 41 , the second signal land 42 , and the ground land 43 are disposed, of the module substrate 40 ( FIG. 3 ).
- FIG. 5 B is a plan view of a conductor layer in which the ground plane 44 is disposed, of the module substrate 40 ( FIG. 3 ).
- conductor portions are hatched.
- FIG. 5 C is a cross-sectional view taken along a chain line 5 C- 5 C in each of FIG. 5 A and FIG. 5 B .
- the ground land 43 is disposed between the first signal land 41 and the second signal land 42 .
- the first signal terminal 31 , the second signal terminal 32 , and the ground terminal 33 of the filter element 30 are connected to the first signal land 41 , the second signal land 42 , and the ground land 43 of the module substrate 40 , respectively, via solder 70 .
- the ground plane 44 is disposed at a position different from the ground land 43 in the thickness direction of the module substrate 40 .
- the ground land 43 is disposed on a surface of a dielectric portion constituting the module substrate 40 , whereas the ground plane 44 is disposed inside the dielectric portion.
- the ground plane 44 is sufficiently larger than the ground land 43 and functions as ground of an RF circuit formed of the filter elements 30 and 35 , the low-noise amplifiers 56 and 57 ( FIG. 4 ), and so forth.
- the ground plane 44 is disposed over almost the entire area of the module substrate 40 in a plan view.
- the ground plane 44 has a substantially circular opening 63 . The opening 63 partially overlaps the ground land 43 in a plan view.
- the inductance adjusting line 60 connects the ground land 43 and the ground plane 44 .
- the inductance adjusting line 60 includes one in-plane extending portion 62 that extends in an in-plane direction from the edge of the opening 63 toward the inside of the opening 63 , and one via conductor 61 that connects the in-plane extending portion 62 and the ground land 43 .
- the in-plane extending portion 62 that extends in the in-plane direction is connected in series to the via conductor 61 that extends in the thickness direction of the module substrate 40 , thereby constituting the inductance adjusting line 60 .
- the inductance of the inductance adjusting line 60 can be increased compared to a case where the inductance adjusting line 60 is constituted only by the via conductor 61 .
- a length H of the via conductor 61 may be increased by increasing the thickness of the dielectric layer disposed between the ground land 43 and the ground plane 44 .
- the thickness of the dielectric layer has an influence on the characteristic impedance or the like of a transmission line, and thus the degree of freedom in adjusting the thickness of the dielectric layer is low.
- an increase in the thickness of the dielectric layer causes an increase in the thickness of the module substrate 40 , and thus the filter module is restricted in the height direction.
- the degree of freedom in adjusting the length of the in-plane extending portion 62 is higher than the degree of freedom in adjusting the length of the via conductor 61 .
- FIG. 6 A and FIG. 6 B are diagrams each illustrating the relationship in size among the filter element 30 , the in-plane extending portion 62 , the opening 63 , and so forth.
- the in-plane extending portion 62 is longer in the example illustrated in FIG. 6 B than in the example illustrated in FIG. 6 A .
- the inductance of the inductance adjusting line 60 is different between the example illustrated in FIG. 6 A and the example illustrated in FIG. 6 B .
- changing of the pattern of the ground plane 44 makes it possible to change the inductance of the inductance adjusting line 60 .
- Changing of the pattern of the ground plane 44 disposed in the module substrate 40 makes it possible to form various filter modules having different attenuation characteristics without changing the filter element 30 .
- the in-plane extending portion 62 may be substantially meander-shaped as illustrated in FIG. 6 C or substantially spiral-shaped as illustrated in FIG. 6 D so as to elongate the in-plane extending portion 62 .
- FIG. 7 A to FIG. 8 B The description of the same components as those of the filter module 50 according to the first embodiment will be omitted.
- FIG. 7 A is a plan view of a surface conductor layer in which the first signal land 41 , the second signal land 42 , and the ground land 43 are disposed, of the module substrate 40 ( FIG. 3 ) of the filter module according to the second embodiment.
- FIG. 7 B is a plan view of a conductor layer in which the ground plane 44 is disposed, of the module substrate 40 ( FIG. 3 ).
- the inductance adjusting line 60 includes one via conductor 61 , and the in-plane extending portion 62 is connected to the ground plane 44 at one portion of the edge of the opening 63 .
- the inductance adjusting line 60 includes two via conductors 61 , and the in-plane extending portions 62 is connected to the ground plane 44 at two portions of the edge of the opening 63 .
- the in-plane extending portion 62 has two sections that extend from two different portions of the edge of the opening 63 toward the inside of the opening 63 and communicate with each other in the inside of the opening 63 .
- the length H of the via conductor 61 ( FIG. 5 C ) depends on the thickness of the dielectric layer. It is difficult to eliminate variations in thickness among individual dielectric layers, and thus variations in length occur among individual via conductors 61 .
- the inductance adjusting line 60 includes the two via conductors 61 connected in parallel to each other, which makes it possible to reduce an influence of variations in length among via conductors 61 on the inductance of the inductance adjusting line 60 .
- a simulation is performed to evaluate an influence of variations in length among via conductors 61 on the transmission coefficient S 21 in a case where the number of via conductors 61 is one and in a case where the number of via conductors 61 is two.
- FIG. 8 A and FIG. 8 B are graphs illustrating simulation results of the transmission coefficient S 21 from the input port of the filter element 30 ( FIG. 4 ) to the output port of the low-noise amplifier 56 ( FIG. 4 ) in a case where the number of via conductors 61 is one and in a case where the number of via conductors 61 is two, respectively.
- the horizontal axis represents frequency in “GHz”, and the vertical axis represents transmission coefficient S 21 in “dB”.
- the bold solid line, the broken line, and the thin solid line represent the transmission coefficients S 21 when the length H of the via conductor 61 is 20 ⁇ m, 25 ⁇ m, and 30 ⁇ m, respectively.
- a band pass filter for Band n77 of 5G is used.
- the length H of the via conductor 61 is 25 ⁇ m, there are two attenuation poles AL and AH near a range from about 6 GHz to about 7 GHz higher than the pass band both in FIG. 8 A and FIG. 8 B .
- the attenuation pole AH on the higher-frequency side shifts to a higher-frequency side
- the attenuation pole AL on the lower-frequency side shifts to a lower-frequency side.
- the amount of shift of the attenuation pole AL on the lower-frequency side is substantially equal in FIG. 8 A and FIG.
- the amount of shift of the attenuation pole AH on the higher-frequency side is about 850 MHz in FIG. 8 A and is about 650 MHz in FIG. 8 B .
- an increase in the number of via conductors 61 causes a decrease in the amount of shift of the attenuation pole AH when the length H of the via conductors 61 varies.
- the two attenuation poles AL and AH are combined into one attenuation pole both in FIG. 8 A and FIG. 8 B , and the transmission coefficient S 21 increases at the vicinity of 6 GHz.
- the amount of increase in the transmission coefficient S 21 at the vicinity of 6 GHz is smaller in FIG. 8 B than in FIG. 8 A . In this way, an increase in the number of via conductors 61 causes a decrease in the amount of fluctuation of the transmission coefficient S 21 when the length H of the via conductors 61 varies.
- FIG. 9 is a plan view of a conductor layer in which the ground plane 44 is disposed, of a filter module according to the modification example of the second embodiment.
- the in-plane extending portion 62 of the inductance adjusting line 60 is connected to the ground plane 44 at two portions of the edge of the opening 63 .
- the in-plane extending portion 62 is connected to the ground plane 44 at three portions of the edge of the opening 63 . In this way, the in-plane extending portion 62 may be connected to the ground plane 44 at three portions, or four or more portions.
- the opening 63 is substantially circular.
- the opening 63 may have another shape, for example, the opening 63 may be substantially racetrack-shaped, substantially oval-shaped, or the like.
- a filter module according to a third embodiment will be described with reference to FIG. 10 .
- the description of the same components as those of the filter module 50 according to the first embodiment will be omitted.
- FIG. 10 is a cross-sectional view of the filter module according to the third embodiment.
- the inductance adjusting line 60 is connected to the ground plane 44 disposed in the conductor layer that is the first layer viewed in the thickness direction from the mount surface provided with the filter element 30 .
- the inductance adjusting line 60 is connected to the ground plane 44 disposed in the conductor layer that is the third layer.
- a ground plane 45 is disposed in the conductor layer serving as the first layer
- a transmission line 46 is disposed in the conductor layer serving as the second layer.
- the via conductor 61 extends from the ground land 43 through an opening provided in the ground plane 45 in the first layer to reach the ground plane 44 in the third layer.
- the via conductor 61 is longer than in the first embodiment.
- the inductance of the inductance adjusting line 60 is larger.
- the structure according to the third embodiment is effective at increasing the inductance of the inductance adjusting line 60 .
- FIG. 11 A The description of the same components as those of the filter module 50 according to the first embodiment will be omitted.
- FIG. 11 A is a plan view of a surface conductor layer formed on the module substrate 40 ( FIG. 3 ) of the filter module according to the fourth embodiment.
- the ground plane 44 ( FIG. 5 C ) connected to the inductance adjusting line 60 is disposed in the conductor layer serving as the first layer.
- the inductance adjusting line 60 is connected to the ground plane 44 disposed in the surface conductor layer.
- the inductance adjusting line 60 does not include a via conductor for connecting different conductor layers, but includes only the in-plane extending portion 62 disposed in the surface conductor layer.
- a via conductor for connecting to the ground plane 44 is not connected to the ground land 43 .
- the structure according to the fourth embodiment can be adopted in a case where the ground plane 44 is disposed in the surface conductor layer of the module substrate 40 . Also, in the fourth embodiment, the inductance of the inductance adjusting line 60 can be adjusted by adjusting the length of the in-plane extending portion 62 .
- FIG. 11 B is a plan view of a surface conductor layer formed on the module substrate 40 ( FIG. 3 ) of a filter module according to the modification example of the fourth embodiment.
- the ground plane 44 formed in the surface conductor layer has a notch portion 47 extending from the edge toward the inside.
- the inductance adjusting line 60 is connected to the edge of the deepest portion of the notch portion 47 .
- the length of the inductance adjusting line 60 can be adjusted by adjusting the depth of the notch portion 47 without depending on the distance between the ground land 43 and the ground plane 44 .
- the inductance adjusting line 60 may be substantially meander-shaped or substantially spiral-shaped.
- a filter module according to a fifth embodiment will be described with reference to FIG. 12 .
- the description of the same components as those of the filter module 50 according to the first embodiment will be omitted.
- FIG. 12 is an equivalent circuit diagram of the filter module according to the fifth embodiment.
- the configuration of the module substrate 40 is identical to the configuration of the module substrate 40 according to the first embodiment.
- the filter element 30 includes four parallel resonance circuits PR 1 , PR 2 , PR 3 , and PR 4 in the first to four stages.
- the parallel resonance circuit PR 1 in the first stage includes an inductor L 1 and a capacitor C 1 connected in parallel to each other.
- the parallel resonance circuit PR 2 in the second stage includes an inductor L 2 and a capacitor C 2 connected in parallel to each other.
- the parallel resonance circuit PR 3 in the third stage includes an inductor L 3 and a capacitor C 3 connected in parallel to each other.
- the parallel resonance circuit PR 4 in the fourth stage includes an inductor L 4 and a capacitor C 4 connected in parallel to each other.
- the filter element 30 is, for example, a band pass filter for Band n77 of 5G.
- ground-side terminals One terminals (hereinafter referred to as ground-side terminals) of the four parallel resonance circuits PR 1 , PR 2 , PR 3 , and PR 4 are connected to the ground terminal 33 via a common inductor Lg.
- the terminals on the opposite side of the ground-side terminals of the parallel resonance circuits PR 1 , PR 2 , PR 3 , and PR 4 are referred to as signal-side terminals.
- the signal-side terminal of the parallel resonance circuit PR 1 in the first stage is connected to the first signal terminal 31 .
- a capacitor C 12 is connected between the signal-side terminal of the parallel resonance circuit PR 1 in the first stage and the signal-side terminal of the parallel resonance circuit PR 2 in the second stage.
- the signal-side terminal of the parallel resonance circuit PR 4 in the fourth stage is connected to the second signal terminal 32 .
- a capacitor C 34 is connected between the signal-side terminal of the parallel resonance circuit PR 3 in the third stage and the signal-side terminal of the parallel resonance circuit PR 4 in the fourth stage.
- a capacitor C 14 is connected between the first signal terminal 31 and the second signal terminal 32 .
- the inductors L 1 , L 2 , L 3 , and L 4 of the four parallel resonance circuits PR 1 , PR 2 , PR 3 , and PR 4 are inductively coupled to each other.
- the inductance adjusting line 60 of the module substrate 40 is inserted in series to the inductor Lg.
- the inductance inserted between the ground plane 44 of the module substrate 40 and the ground-side terminals of the parallel resonance circuits PR 1 , PR 2 , PR 3 , and PR 4 can be adjusted by adjusting the inductance of the inductance adjusting line 60 of the module substrate 40 .
- the attenuation characteristics of the transmission coefficient S 21 from the first signal terminal 31 to the second signal terminal 32 can be adjusted without changing the design of the filter element 30 .
- a filter element including a filter circuit other than the filter circuit according to the first embodiment illustrated in FIG. 3 or the filter circuit according to the fifth embodiment illustrated in FIG. 12 may be used. Also, in this case, the attenuation characteristics of the filter element 30 can be adjusted by adjusting the inductance of the inductance adjusting line 60 of the module substrate 40 .
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Filters And Equalizers (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Separation By Low-Temperature Treatments (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
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JP2019107984A JP2020202484A (en) | 2019-06-10 | 2019-06-10 | Filter module |
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US11689173B2 true US11689173B2 (en) | 2023-06-27 |
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JP (1) | JP2020202484A (en) |
KR (1) | KR102443977B1 (en) |
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Citations (6)
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KR20050046618A (en) | 2003-11-14 | 2005-05-18 | 후지쓰 메디아 데바이스 가부시키가이샤 | Acoustic wave device and method of fabricating the same |
US20090108958A1 (en) * | 2006-07-27 | 2009-04-30 | Murata Manufacturing Co., Ltd. | Noise filter array |
WO2011114851A1 (en) | 2010-03-18 | 2011-09-22 | 株式会社村田製作所 | High-frequency laminated component and laminated type high-frequency filter |
WO2014192431A1 (en) | 2013-05-29 | 2014-12-04 | 株式会社村田製作所 | High-frequency module component |
KR20150038261A (en) | 2012-08-30 | 2015-04-08 | 가부시키가이샤 무라타 세이사쿠쇼 | Filter device |
US9807882B1 (en) | 2016-08-17 | 2017-10-31 | Qualcomm Incorporated | Density-optimized module-level inductor ground structure |
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JP3491561B2 (en) * | 1999-06-04 | 2004-01-26 | 株式会社村田製作所 | Frequency multiplier |
JP2003258587A (en) * | 2001-12-25 | 2003-09-12 | Ngk Spark Plug Co Ltd | Multilayer lc filter |
JP2009021725A (en) * | 2007-07-11 | 2009-01-29 | Sharp Corp | Filter device |
JP6406266B2 (en) * | 2014-01-10 | 2018-10-17 | 株式会社村田製作所 | High frequency module |
JP6020780B1 (en) * | 2015-02-25 | 2016-11-02 | 株式会社村田製作所 | High frequency module |
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KR20050046618A (en) | 2003-11-14 | 2005-05-18 | 후지쓰 메디아 데바이스 가부시키가이샤 | Acoustic wave device and method of fabricating the same |
US20050116352A1 (en) | 2003-11-14 | 2005-06-02 | Suguru Warashina | Acoustic wave device and method of fabricating the same |
US20090108958A1 (en) * | 2006-07-27 | 2009-04-30 | Murata Manufacturing Co., Ltd. | Noise filter array |
WO2011114851A1 (en) | 2010-03-18 | 2011-09-22 | 株式会社村田製作所 | High-frequency laminated component and laminated type high-frequency filter |
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US20150137909A1 (en) | 2012-08-30 | 2015-05-21 | Murata Manufacturing Co., Ltd. | Filter device |
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US20160079952A1 (en) | 2013-05-29 | 2016-03-17 | Murata Manufacturing Co., Ltd. | Radio-frequency module component |
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US20200389144A1 (en) | 2020-12-10 |
CN112073020A (en) | 2020-12-11 |
TWI793423B (en) | 2023-02-21 |
CN112073020B (en) | 2024-08-16 |
KR102443977B1 (en) | 2022-09-16 |
JP2020202484A (en) | 2020-12-17 |
KR20200141380A (en) | 2020-12-18 |
TW202101904A (en) | 2021-01-01 |
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