US11489243B2 - Directional coupler - Google Patents
Directional coupler Download PDFInfo
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- US11489243B2 US11489243B2 US16/850,655 US202016850655A US11489243B2 US 11489243 B2 US11489243 B2 US 11489243B2 US 202016850655 A US202016850655 A US 202016850655A US 11489243 B2 US11489243 B2 US 11489243B2
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- line
- sub line
- directional coupler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
- H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
- H01P5/184—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/22—Attenuating devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/24—Terminating devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
- H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
- H01P5/184—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips
- H01P5/185—Edge coupled lines
Definitions
- a directional coupler is a basic element widely used in wireless equipment such as a portable terminal device or the like.
- Japanese Unexamined Patent Application Publication No. 2006-238063 discloses a directional coupler in which a main line and a sub line are provided on a dielectric substrate with an interval therebetween and so as to be at least partially parallel to each other.
- a directional coupler includes: a dielectric having a first main surface and a second main surface facing each other; a main line provided on a side of the first main surface in contact with the dielectric; and a sub line provided on the side of the first main surface in contact with the dielectric, in which the dielectric has a first portion in contact with the main line and a second portion in contact with the sub line, and when the first main surface is viewed in a plan view, between the first portion and the second portion, a third portion having a relative dielectric constant changing along a direction intersecting with the main line and the sub line is located.
- FIG. 1A is a top view illustrating an example of a structure of a directional coupler according to a first embodiment
- FIG. 1B is a side view illustrating the example of the structure of the directional coupler according to the first embodiment
- FIG. 2A is a top view illustrating an example of a structure of a directional coupler according to a second embodiment
- FIG. 2B is a side view illustrating a first example of the structure of the directional coupler according to the second embodiment
- FIG. 2C is a side view illustrating a second example of the structure of the directional coupler according to the second embodiment
- FIG. 3 is a top view illustrating an example of a structure of a directional coupler according to a third embodiment
- FIG. 5A is a top view illustrating an example of a structure of a directional coupler according to a fifth embodiment
- FIG. 6 is a circuit diagram illustrating an example of a functional configuration of the directional coupler according to the fifth embodiment
- FIG. 7B is a circuit diagram illustrating an example of a configuration of a variable capacitor according to the fifth embodiment.
- FIG. 7C is a circuit diagram illustrating an example of a configuration of a variable resistance according to the fifth embodiment.
- a directional coupler according to a first embodiment will be described.
- FIG. 1A and FIG. 1B are a top view and a side view, respectively, illustrating an example of a structure of the directional coupler according to the first embodiment.
- FIG. 1B corresponds to a cross section indicated by the IB-IB line in FIG. 1A .
- a directional coupler 1 is constituted of a main line 11 , a sub line 12 , dielectrics 13 , 14 , and 15 , and ground electrodes 16 and 17 .
- the main line 11 is formed on the main surface of the dielectric 13 on the ground electrode 17 side
- the sub line 12 is formed on the main surface of the dielectric 14 on the ground electrode 17 side
- the main line 11 and the sub line 12 are electromagnetically coupled to each other. That is, when the dielectrics 13 and 14 are considered as one dielectric, both the main line 11 and the sub line 12 are provided in contact with the one dielectric on the first main surface side of the one dielectric.
- the main line 11 and the sub line 12 may be formed on the same surface.
- the main line 11 , the sub line 12 , and the dielectrics 13 and 14 are covered by the dielectric 15 .
- the dielectrics 13 , 14 , and 15 are sandwiched between the ground electrodes 16 and 17 .
- the main line 11 and the sub line 12 are electromagnetically coupled to each other.
- a part of a main signal in a forward direction which is a main signal propagating in the main line 11 from a first end portion T 3 to a second end portion T 4 is outputted from a first end portion T 1 of the sub line 12 as a detection signal in the forward direction in a state where a second end portion T 2 of the sub line 12 is terminated.
- a part of a main signal in a reverse direction which is a main signal propagating in the main line 11 from the second end portion T 4 to the first end portion T 3 is outputted from the second end portion T 2 of the sub line 12 as a detection signal in the reverse direction in a state where the first end portion T 1 of the sub line 12 is terminated.
- the second end portion T 2 of the sub line 12 is an end portion for termination, and the first end portion T 1 is an end portion for signal output. Furthermore, when the detection signal for the main signal in the reverse direction is obtained, the first end portion T 1 of the sub line 12 is an end portion for termination, and the second end portion T 2 is an end portion for signal output.
- the end portions T 1 to T 4 may be respectively connected to the corresponding external terminals (not illustrated).
- the directional coupler 1 may be configured as a four-terminal element.
- the end portion for termination may be terminated inside the directional coupler 1 , and the end portion for signal output may be connected to a functional circuit provided inside the directional coupler 1 .
- the third portion C is a boundary point among material constants (that is, various physical property values correlated with the relative dielectric constants of the materials) of the dielectrics 13 , 14 , and 15 , between the main line 11 and the sub line 12 .
- the degree of coupling and directivity of the directional coupler 1 can be adjusted.
- the degree of coupling and directivity since the distance between the main line 11 and the sub line 12 and the width of each line are not changed, the influence on characteristics, such as the impedance or the like of the main line 11 and the sub line 12 , other than the degree of coupling and directivity, is easily reduced in comparison with a case where the distance between the lines and the width of each line are changed.
- the degree of freedom in adjustment of coupling and directivity is improved, the degree of coupling and directivity can be adjusted more precisely.
- the degree of freedom in design for obtaining the desired characteristics is improved.
- a directional coupler according to a second embodiment will be described.
- FIG. 2A is a top view illustrating an example of a structure of the directional coupler according to the second embodiment.
- FIG. 2B and FIG. 2C are side views illustrating a first example and a second example, respectively, of a structure of a directional coupler 2 illustrated in FIG. 2A .
- FIG. 2B and FIG. 2C correspond to cross sections indicated by the IIB, IIC-IIB, IIC line in FIG. 2A .
- the directional coupler 2 is referred to as directional couplers 2 a and 2 b , respectively.
- the directional coupler 2 includes a dielectric substrate 24 on which a main line 21 and a sub line 22 are formed, and a dielectric layer 23 arranged on the dielectric substrate 24 and covering only the sub line 22 among the main line 21 and the sub line 22 .
- the dielectric substrate 24 is, for example, an external terminal substrate constituted of a printed wiring board for high frequency. External connection terminals 29 are provided on a main surface of the dielectric substrate 24 on the opposite side to a main surface on which the main line 21 and the sub line 22 are formed.
- the main surface on which the main line 21 and the sub line 22 are formed in the dielectric substrate 24 is an example of a “first main surface”
- the main surface on which the external connection terminals 29 are formed in the dielectric substrate 24 is an example of a “second main surface”. That is, both of the main line 21 and the sub line 22 are provided in contact with the dielectric substrate 24 on the first main surface side of the dielectric substrate 24 .
- main line 21 and the sub line 22 do not necessarily have to be in contact with the dielectric substrate 24 .
- another film or layer may be provided in at least one space of the spaces between the dielectric substrate 24 and the main line 21 and between the dielectric substrate 24 and the sub line 22 .
- the dielectric substrate 24 may be a multilayer body in which one or more dielectric layers are laminated on various substrates such as a semiconductor substrate or the like.
- a main surface on which the main line 21 and the sub line 22 are formed is taken as a “first main surface”
- a main surface which faces the “first main surface” and is farthest from the “first main surface” of main surfaces of the semiconductor substrate is taken as a “second main surface”.
- the dielectric layer 23 is formed of, for example, a polyimide-based photosensitive resin. By being formed of the photosensitive resin, patterning of the dielectric layer 23 can be carried out with high accuracy by photolithography. Note that the dielectric layer 23 is not limited to being formed of a photosensitive resin, and may be formed of, for example, a resin ink which makes it possible to perform ink jet printing. A dielectric filler may be added to the photosensitive resin and the resin ink.
- the directional coupler 2 a illustrated in FIG. 2B further includes a metal cap 26 which covers the dielectric substrate 24 and forms a space 25 for housing the main line 21 , the sub line 22 , and the dielectric layer 23 .
- the main line 21 is exposed to the space 25 .
- the directional coupler 2 a is an example of the directional coupler 2 mounted in a metal cap type package, and the metal cap 26 is an example of a conductor shield.
- the directional coupler 2 b illustrated in FIG. 2C further includes a mold layer 27 covering the main line 21 , the sub line 22 , and the dielectric layer 23 .
- the mold layer 27 is formed of a polyimide-based thermosetting resin, for example, and is arranged on the dielectric substrate 24 .
- the relative dielectric constant of the dielectric layer 23 and the relative dielectric constant of the mold layer 27 are different from each other.
- the mold layer 27 may be provided so as to have the same outer shape as that of the dielectric substrate 24 in a plan view.
- the directional coupler 2 b is an example of the directional coupler 2 mounted in a mold type package.
- a metal film 28 may be formed on the surface of the mold layer 27 .
- the metal film 28 is a thin film formed of, for example, one or more metals selected from titanium, copper, and nickel, or an alloy thereof, and may be film-formed on the surface of the mold layer 27 by sputtering.
- the metal film 28 is film-formed from the surface of the mold layer 27 to the side surface of the dielectric substrate 24 , is connected to a ground electrode at the side surface of the dielectric substrate 24 (not illustrated), for example, and functions as a shield.
- the dielectric substrate 24 has the first portion A which is in contact with the main line 21 , and the second portion B which is in contact with the sub line 22 . Furthermore, when the directional couplers 2 , 2 a , and 2 b are viewed in a plan view, between the first portion A and the second portion B, the third portion C is located in which the relative dielectric constant is changed along a direction intersecting with the main line 21 and the sub line 22 .
- the degree of coupling and directivity of the directional couplers 2 , 2 a , and 2 b can be adjusted.
- the loss of the main line 21 can be reduced.
- the main line 21 is not covered with the dielectric layer 23 , by a low dielectric loss tangent material constituting the dielectric substrate 24 and a wide line width with a low effective dielectric constant, the loss of the main line 21 is reduced.
- the directional couplers 2 , 2 a , and 2 b since forming the dielectric layer 23 after forming the main line 21 and the sub line 22 makes it possible to adjust the position of the third portion C and adjust the electric field distribution between the main line 21 and the sub line 22 , it is possible to easily correct the deviation of the degree of coupling and directivity due to the variation in the mass production of the directional coupler without re-forming the dielectric substrate 24 .
- a directional coupler according to a third embodiment will be described.
- FIG. 3 is a top view illustrating an example of a structure of the directional coupler according to the third embodiment.
- a directional coupler 3 includes a dielectric substrate 34 on which a main line 31 and a sub line 32 are formed, and a dielectric layer 33 arranged on the dielectric substrate 34 and covering only the sub line 32 among the main line 31 and the sub line 32 .
- the main line 31 , the sub line 32 , the dielectric layer 33 , and the dielectric substrate 34 of the directional coupler 3 correspond to the main line 21 , the sub line 22 , the dielectric layer 23 , and the dielectric substrate 24 of the directional coupler 2 described in the second embodiment, respectively.
- the directional coupler 3 is, in comparison with the directional coupler 2 in FIG. 2A , identical thereto in materials forming the corresponding elements, and is different therefrom in the arrangement of the main line 31 and the sub line 32 and the shape of the dielectric layer 33 .
- distances d 1 and d 2 from the sub line 32 to the end portion of the dielectric layer 33 between the main line 31 and the sub line 32 are different from each other in two portions 32 a and 32 b in the lengthwise direction of the sub line 32 .
- the distance from the sub line 32 to the end portion of the dielectric layer 33 means the shortest distance from the end portion of the sub line 32 to the end portion of the dielectric layer 33 , and means, in a section in which the end portion of the sub line 32 and the end portion of the dielectric layer 33 are represented by substantially parallel line segments, an interval between the line segments.
- the electric field distributions between the main line 31 and the sub line 32 are different from each other.
- the degree of coupling and directivity can be optimized by adjusting the distances d 1 and d 2 .
- the end portion of the dielectric layer 33 is processed into a shape shifted toward the sub line 32 .
- the electric field distribution is weakened and the electric field coupling decreases between the main line 31 and the sub line 32 , whereby the directivity of the directional coupler 3 is adjusted.
- the effective relative dielectric constants of the dielectric layer 33 and the dielectric substrate 34 which are in contact with the sub line 32 do not largely change in the entire sub line 32 including the portion 32 a . Accordingly, it is not necessary to change the line width and the line length of the sub line 32 , and it is possible to adjust only the directivity in actual.
- the dielectric layer 33 may be formed in a desired shape by photolithography or ink jet printing, or after the dielectric layer 33 is formed, the undesired portion may be removed by Leutor or a laser beam.
- a directional coupler according to a fourth embodiment will be described.
- FIG. 4 is a top view illustrating an example of a structure of the directional coupler according to the fourth embodiment.
- a directional coupler 4 includes a dielectric substrate 44 on which a main line 41 and sub lines 42 a and 42 b are formed, and a dielectric layer 43 arranged on the dielectric substrate 44 and covering only the sub line 42 a among the main line 41 and the sub lines 42 a and 42 b .
- the sub lines 42 a and 42 b are formed on the opposite sides to each other with the main line 41 interposed therebetween.
- the main line 41 , the sub lines 42 a and 42 b , the dielectric layer 43 , and the dielectric substrate 44 of the directional coupler 4 correspond to the main line 21 , the sub line 22 , the dielectric layer 23 , and the dielectric substrate 24 of the directional coupler 2 described in the second embodiment, respectively.
- the directional coupler 4 is, in comparison with the directional coupler 2 in FIG. 2A , identical thereto in materials forming the corresponding elements, and is different therefrom in that the sub line 42 a which is covered and the sub line 42 b which is not covered, by the dielectric layer 43 , are included.
- the sub line 42 a covered with the dielectric layer 43 has an increased electric length and a reduced line width.
- the sub line 42 a is optimized for the detection of a lower frequency signal in comparison with the sub line 42 b having the same physical line length.
- Increase in loss due to the dielectric loss tangent of the dielectric layer 43 and increase in loss derived from copper loss due to line-thinning can be counted in part of a coupling coefficient and are not disadvantageous.
- the sub lines 42 a and 42 b are formed on the opposite sides to each other with the main line 41 interposed therebetween.
- the degree of coupling between the sub line 42 a and the main line 41 and the degree of coupling between the sub line 42 b and the main line 41 can both be favorably maintained.
- the degree of coupling between the sub line arranged on the side farther from the main line 41 of the sub lines 42 a and 42 b and the main line becomes much smaller than the degree of coupling between the sub line arranged on the side closer to the main line 41 and the main line.
- both the sub lines 42 a and 42 b are easy to be arranged close to the main line 41 , which makes it easy to favorably maintain both the degree of coupling between the sub line 42 a and the main line 41 and the degree of coupling between the sub line 42 b and the main line 41 .
- a directional coupler according to a fifth embodiment will be described.
- FIG. 5A is a top view illustrating an example of a structure of the directional coupler according to the fifth embodiment.
- FIG. 5A and FIG. 5B are a top view and a side view, respectively, illustrating an example of the structure of the directional coupler according to the fifth embodiment.
- FIG. 5B corresponds to a cross section indicated by the VB-VB line in FIG. 5A .
- a directional coupler 5 includes a dielectric substrate 54 on which a main line 51 and sub lines 52 a and 52 b are formed, and a dielectric layer 53 arranged on the dielectric substrate 54 and covering only the sub line 52 a among the main line 51 and the sub lines 52 a and 52 b . Additionally, the directional coupler 5 includes a semiconductor chip 60 in which various functional circuits are formed, a mold layer 57 which covers the main line 51 , the sub lines 52 a and 52 b , the dielectric layer 53 , and the semiconductor chip 60 , and external connection terminals 59 . A metal film 58 may be formed on the surface of the mold layer 57 .
- the main line 51 , the sub lines 52 a and 52 b , the dielectric layer 53 , and the dielectric substrate 54 of the directional coupler 5 correspond to the main line 41 , the sub lines 42 a and 42 b , the dielectric layer 43 , and the dielectric substrate 44 of the directional coupler 4 described in the fourth embodiment, respectively.
- the mold layer 57 , the metal film 58 , and the external connection terminal 59 of the directional coupler 5 correspond to the mold layer 27 , the metal film 28 , and the external connection terminal 29 of the directional coupler 2 b described in the second embodiment, respectively.
- the semiconductor chip 60 may be a chip size package which is flip-chip mounted on the dielectric substrate 54 , and a space between the semiconductor chip 60 and the dielectric substrate 54 may be filled with an underfill resin (not illustrated).
- a switch circuit for switching a detection direction of the main signal and various variable impedance circuits for adjusting the characteristics of the directional coupler are formed.
- FIG. 6 is a circuit diagram illustrating an example of a functional configuration of the directional coupler 5 .
- a switch circuit 61 together with the main line 51 and the sub lines 52 a and 52 b , a switch circuit 61 , a variable terminator 62 , a variable matching circuit 63 , a variable attenuator 64 , a variable filter 65 , and a control circuit 68 , which are functional circuits formed in the semiconductor chip 60 , are illustrated.
- an input port IN and an output port OUT respectively connected to the first end portion T 3 and the second end portion T 4 of the main line 51 , and a coupling port CPL for outputting a detection signal are illustrated.
- the input port IN, the output port OUT, and the coupling port CPL are each constituted of the external connection terminal 59 .
- the switch circuit 61 switches four states of (1) a state in which, of the sub line 52 a , a first end portion T 1 a is connected to a first node N 1 and a second end portion T 2 a is connected to a second node N 2 , (2) a state in which, of the sub line 52 a , the first end portion T 1 a is connected to the second node N 2 and the second end portion T 2 a is connected to the first node N 1 , (3) a state in which, of the sub line 52 b , a first end portion T 1 b is connected to the first node N 1 and a second end portion T 2 b is connected to the second node N 2 , and (4) a state in which, of the sub line 52 b , the first end portion T 1 b is connected to the second node N 2 and the second end portion T 2 b is connected to the first node N 1 .
- the switch circuit 61 functions as a first switch circuit for switching which sub line of the sub lines 52 a and 52 b is used as a sub line connected to the first node N 1 and the second node N 2 .
- the switch circuit 61 functions, at the sub line to be used, as a second switch circuit for switching whether to connect the first end portion to the first node N 1 and connect the second end portion to the second node N 2 , or to connect the first end portion to the second node N 2 and connect the first end portion to the first node N 1 .
- the first node N 1 is a node for outputting a detection signal
- the second node N 2 is a node for termination.
- the control circuit 68 receives a data signal indicating the state of each switch included in the switch circuit 61 (not illustrated), and switches each switch included in the switch circuit 61 to a state indicated by the received data signal.
- the detection signal in accordance with the switching of the switch circuit 61 , even if the detection signal is for a main signal propagating in the main line 51 in the forward direction or in the reverse direction, the detection signal can be guided to the first node N 1 for outputting the detection signal.
- the variable terminator 62 is a terminating circuit in which resistance and reactance can be adjusted for terminating the end portions for the termination of the sub lines 52 a and 52 b , and is mainly used for optimizing the directivity of the directional coupler 5 .
- the variable terminator 62 is constituted of, for example, a circuit in which a variable capacitor C 1 and a variable resistance R 1 are connected in parallel, and is connected between the second node N 2 and the ground.
- the variable matching circuit 63 is a circuit for bringing impedance at the end portion for signal output of the sub lines 52 a and 52 b close to a reference impedance (so-called characteristic impedance) of the circuit, and is mainly used for optimizing the directivity of the directional coupler 5 .
- the variable matching circuit 63 is provided, for example, in a signal path connecting the first node N 1 and the coupling port CPL, and includes a variable inductor L 1 constituting a part of the signal path, and a variable resistance R 2 connected between one end of the variable inductor L 1 and the ground.
- the variable attenuator 64 is a circuit for adjusting the passing loss of the detection signal obtained from the end portion for signal output of the sub lines 52 a and 52 b , and is mainly used for optimizing the degree of coupling of the directional coupler 5 .
- the variable attenuator 64 is provided, for example, in a signal path connecting the first node N 1 and the coupling port CPL, and includes a variable resistance R 3 constituting part of the signal path, a variable resistance R 4 connected between one end of the variable resistance R 3 and the ground, and a variable resistance R 5 connected between the other end of the variable resistance R 3 and the ground.
- the variable filter 65 is a circuit for adjusting the frequency characteristics of the detection signal obtained from the end portion for signal output of the sub lines 52 a and 52 b , and is mainly used for optimizing the frequency characteristics of the degree of coupling of the directional coupler 5 .
- the variable filter 65 is provided, for example, in a signal path connecting the first node N 1 and the coupling port CPL, and includes a variable inductor L 2 constituting a part of the signal path, a variable capacitor C 2 connected in parallel to the variable inductor L 2 , a variable capacitor C 3 connected between one end of the variable inductor L 2 and the ground, and a variable capacitor C 4 connected between the other end of the variable inductor L 2 and the ground.
- variable inductor the variable capacitor, and the variable resistance used for these variable elements are obtained as described below as an example.
- FIG. 7A , FIG. 7B , and FIG. 7C are circuit diagrams illustrating examples of the configurations of a variable inductor, a variable capacitor, and a variable resistance, respectively.
- the variable inductor, the variable capacitor, and the variable resistance illustrated in FIG. 7A , FIG. 7B , and FIG. 7C are all obtained by selecting a plurality of elements or a portion of an element having a fixed constant using the switch.
- variable terminator 62 the variable matching circuit 63 , the variable attenuator 64 , and the variable filter 65 using the variable inductor, the variable capacitor, and the variable resistance, which are obtained as described above, it is possible to change the circuit constant with ease in accordance with control by the control circuit 68 .
- the directional coupler 5 in addition to adjusting the electric field distribution between the main line and the sub line in accordance with the position of the boundary point of the material constant in the dielectric in which the main line and the sub lines are arranged, changing the circuit constants of the variable terminator 62 , the variable matching circuit 63 , the variable attenuator 64 , and the variable filter 65 also makes it possible to adjust the degree of coupling and directivity of the directional coupler 5 . This further improves the degree of freedom in the adjustment of the degree of coupling and directivity, and makes it possible to obtain the directional coupler in which the degree of coupling and directivity can be more precisely adjusted.
- a directional coupler by using a third portion in which a relative dielectric constant is changed between a main line and a sub line, by adjusting electric field distribution between the main line and the sub line, it is possible to adjust the degree of coupling and directivity of the directional coupler.
- the present disclosure can be widely used in wireless equipment such as a portable terminal device, as a directional coupler in which the degree of coupling and directivity can be more precisely adjusted.
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JPJP2019-078594 | 2019-04-17 | ||
JP2019078594A JP2020178210A (en) | 2019-04-17 | 2019-04-17 | Directional coupler |
JP2019-078594 | 2019-04-17 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07336117A (en) | 1994-06-13 | 1995-12-22 | Murata Mfg Co Ltd | Directional coupler |
JP2006238063A (en) | 2005-02-25 | 2006-09-07 | Nec Corp | Directional coupler |
JP2015162729A (en) | 2014-02-26 | 2015-09-07 | 京セラ株式会社 | Directional coupler and high frequency module |
-
2019
- 2019-04-17 JP JP2019078594A patent/JP2020178210A/en active Pending
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2020
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07336117A (en) | 1994-06-13 | 1995-12-22 | Murata Mfg Co Ltd | Directional coupler |
JP2006238063A (en) | 2005-02-25 | 2006-09-07 | Nec Corp | Directional coupler |
JP2015162729A (en) | 2014-02-26 | 2015-09-07 | 京セラ株式会社 | Directional coupler and high frequency module |
Non-Patent Citations (1)
Title |
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JPH07336117A Translation (Year: 1995). * |
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US20200335846A1 (en) | 2020-10-22 |
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