US11278878B2 - Method for preparing catalyst having conductive oxide protective layer and catalyst prepared thereby - Google Patents
Method for preparing catalyst having conductive oxide protective layer and catalyst prepared thereby Download PDFInfo
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- US11278878B2 US11278878B2 US16/800,498 US202016800498A US11278878B2 US 11278878 B2 US11278878 B2 US 11278878B2 US 202016800498 A US202016800498 A US 202016800498A US 11278878 B2 US11278878 B2 US 11278878B2
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- ZNPLYJKRKMATLG-UHFFFAOYSA-J CC(C)[O-].Cl[Sn](Cl)(Cl)Cl.[Ti+4] Chemical compound CC(C)[O-].Cl[Sn](Cl)(Cl)Cl.[Ti+4] ZNPLYJKRKMATLG-UHFFFAOYSA-J 0.000 description 1
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- H01M4/8647—Inert electrodes with catalytic activity, e.g. for fuel cells consisting of more than one material, e.g. consisting of composites
- H01M4/8657—Inert electrodes with catalytic activity, e.g. for fuel cells consisting of more than one material, e.g. consisting of composites layered
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- B01J37/02—Impregnation, coating or precipitation
- B01J37/0215—Coating
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/405—Oxides of refractory metals or yttrium
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- B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
- B01J23/38—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
- B01J23/40—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals of the platinum group metals
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- B01J37/00—Processes, in general, for preparing catalysts; Processes, in general, for activation of catalysts
- B01J37/34—Irradiation by, or application of, electric, magnetic or wave energy, e.g. ultrasonic waves ; Ionic sputtering; Flame or plasma spraying; Particle radiation
- B01J37/349—Irradiation by, or application of, electric, magnetic or wave energy, e.g. ultrasonic waves ; Ionic sputtering; Flame or plasma spraying; Particle radiation making use of flames, plasmas or lasers
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- B01J8/18—Chemical or physical processes in general, conducted in the presence of fluids and solid particles; Apparatus for such processes with fluidised particles
- B01J8/24—Chemical or physical processes in general, conducted in the presence of fluids and solid particles; Apparatus for such processes with fluidised particles according to "fluidised-bed" technique
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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- C23C16/407—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/442—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using fluidised bed process
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45553—Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/45523—Pulsed gas flow or change of composition over time
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- C23C16/45555—Atomic layer deposition [ALD] applied in non-semiconductor technology
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- H01M4/86—Inert electrodes with catalytic activity, e.g. for fuel cells
- H01M4/8663—Selection of inactive substances as ingredients for catalytic active masses, e.g. binders, fillers
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- H01M4/86—Inert electrodes with catalytic activity, e.g. for fuel cells
- H01M4/88—Processes of manufacture
- H01M4/8878—Treatment steps after deposition of the catalytic active composition or after shaping of the electrode being free-standing body
- H01M4/8892—Impregnation or coating of the catalyst layer, e.g. by an ionomer
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- H01M4/86—Inert electrodes with catalytic activity, e.g. for fuel cells
- H01M4/90—Selection of catalytic material
- H01M4/92—Metals of platinum group
- H01M4/925—Metals of platinum group supported on carriers, e.g. powder carriers
- H01M4/926—Metals of platinum group supported on carriers, e.g. powder carriers on carbon or graphite
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- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/10—Fuel cells with solid electrolytes
- H01M8/1004—Fuel cells with solid electrolytes characterised by membrane-electrode assemblies [MEA]
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- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J21/00—Catalysts comprising the elements, oxides, or hydroxides of magnesium, boron, aluminium, carbon, silicon, titanium, zirconium, or hafnium
- B01J21/18—Carbon
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- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
Definitions
- the present invention relates to a method for preparing a catalyst having a conductive oxide protective layer and a catalyst prepared thereby.
- Polymer electrolyte membrane fuel cells are high-current density high-power fuel cells, which may provide a high power of at least several tens of kW or more under a variety of operating conditions for application to vehicles.
- PEMFCs need to stably operate within a wide current density range, to be free from water leakage problems and to be rapidly driven.
- MEA membrane-electrode assembly
- a catalyst is generally incorporated in the electrodes in order to enhance the performance of the electrodes for PEMFCs.
- a catalyst in which platinum (Pt) nanoparticles are dispersed in a support made of a carbon (C) material, may be mainly used as a catalyst for fuel cells for the electrochemical reaction.
- platinum (Pt) nanoparticles are dispersed in a support made of a carbon (C) material
- C carbon
- studies are underway to improve the activity of catalysts by adjusting the size of platinum (Pt) particles to a small level of several nanometers (nm).
- a coarsening phenomenon for example, Ostwald ripening
- metal catalysts contained in a carbon support agglomerate together occurs.
- FIGS. 1A and 1B show changes in catalyst distribution in a fuel cell during an initial operation and after long-term operation of a conventional fuel cell, respectively.
- the catalysts present in the fuel cell are uniformly distributed in an initial stage in a relatively homogeneous size (mainly 3 to 5 nm).
- a phenomenon that is, coarsening
- the catalyst particles agglomerate into particles 6 nm or greater in size, and that a large amount of catalyst particles agglomerate into particles 10 nm or greater in size.
- catalyst particles that may be agglomerated and contained in a fuel cell so as to enhance the durability of the catalyst by forming a catalyst provided with a conductive oxide protective layer using atomic layer deposition (ALD).
- ALD atomic layer deposition
- a conductive oxide protective layer uniformly formed on a catalyst having a large surface area and a support by performing atomic layer deposition (ALD).
- catalyst particles that may be prevented from agglomeration by forming conductive oxide controlled over an atomic basis as a network structure using atomic layer deposition (ALD).
- ALD atomic layer deposition
- a method of preparing a catalyst including a conductive oxide protective layer may include providing, e.g., supplying, a carbon support including a metal catalyst supported thereon to (into) a fluidized bed reactor, and forming a conductive oxide protective layer using atomic layer deposition (ALD).
- ALD atomic layer deposition
- the conductive oxide protective layer suitably may be formed on or around the carbon support and the metal catalyst as provided in the fluidized bed reactor.
- atomic layer deposition refers to deposition technique forming a surficial structure (e.g., thin-film or a net-like surface), for example, having a thickness at atomic level.
- the ALD may include sequential use of a gas phase chemical process, for example, by using two chemicals or precursors.
- these precursors may react on a surface of a substrate (e.g., carbon support), one at a time in a sequential manner.
- separate and/or different precursors may be sequentially and/or alternately exposed to the surface for the reaction so as to form a net-like surface.
- the atomic layer deposition may suitably include supplying a conductive oxide precursor to the fluidized bed reactor, conducting a first purging by supplying an inert gas to the fluidized bed reactor, converting the conductive oxide precursor to conductive oxide by supplying a reactive gas to the fluidized bed reactor, and conducting a second purging by supplying an inert gas to (into) the fluidized bed reactor.
- the metal catalyst may include platinum (Pt).
- the method may further include adjusting an internal pressure, by pumping, of the fluidized bed reactor to about 0.1 Torr to 0.5 Torr, after the providing the carbon support to the fluidized bed reactor and before the forming the conductive oxide protective layer.
- the conductive oxide precursor may include titanium (IV) isopropoxide (Ti[OCH(CH 3 ) 2 ] 4 , tin (IV) chloride (SnCl 4 ) and a combination thereof.
- a deposition operation pressure of the conductive oxide precursor may suitably be about 1 Torr to 5 Torr.
- the conductive oxide precursor may be suitably supplied to the fluidized bed reactor for about 20 to 100 seconds.
- the reaction gas may include water vapor (H 2 O).
- the reaction gas may be supplied to the fluidized bed reactor at a flow rate from about 10 sccm to about 200 sccm.
- the conductive oxide may include titanium dioxide (TiO 2 ), tin dioxide (SnO 2 ) and a combination thereof.
- the inert gas may suitably be purged at a flow rate from about 50 sccm to about 200 sccm.
- the inert gas may be purged for about 60 to 120 seconds.
- the atomic layer deposition as described herein may be set as one cycle and repeatedly conducted.
- the cycle of the atomic layer deposition may suitably be repeatedly conducted about 1 to 20 times.
- a catalyst including a conductive oxide protective layer prepared by the method described above.
- the catalyst may include a carbon support, metal catalyst particles supported on the carbon support, and a conductive oxide protective layer formed on surfaces of the metal catalyst particles and having a network structure.
- network structure refers to a structure having geometrically connected points (e.g., dots), which do not substantially or entirely cover the structure.
- points e.g., dots
- the connecting parts between the points and the connected points may constitute a net-like structure.
- the conductive oxide protective layer may suitably have a thickness of about 0.05 nm to 10 nm.
- the metal catalyst particles may suitably include platinum (Pt).
- the conductive oxide protective layer may include a conductive oxide including titanium dioxide (TiO 2 ), tin dioxide (SnO 2 ) and a combination thereof.
- a polymer electrolyte membrane for a fuel cell that may include the catalyst as described herein.
- a fuel cell including the polymer electrolyte membrane as described herein.
- FIGS. 1A and 1B show changes in catalyst distribution in a conventional fuel cell during an initial operation and after long-term operation of a conventional fuel cell, respectively;
- FIG. 2 is a flowchart illustrating an exemplary method of preparing an exemplary catalyst provided with an exemplary conductive oxide protective layer according to exemplary embodiments of the present invention
- FIG. 3 is a flowchart illustrating an exemplary method of preparing an exemplary catalyst provided with an exemplary conductive oxide protective layer according to an exemplary embodiment of the present invention
- FIG. 4 is a schematic diagram illustrating an exemplary apparatus used for an exemplary method of preparing the catalyst provided with an exemplary conductive oxide protective layer according to exemplary embodiments of the present invention
- FIGS. 5A and 5B are conceptual diagrams showing changes of a conventional fuel cell and catalyst composites according to exemplary embodiments of the present invention, as the fuel cell operating time increases, respectively;
- FIG. 6 is a transmission electron microscopy (TEM) and an energy-dispersive X-ray spectroscopy (EDS) image of Example 1;
- TEM transmission electron microscopy
- EDS energy-dispersive X-ray spectroscopy
- FIG. 7 shows TEM and EDS images of Example 2.
- FIG. 8 shows TEM and EDS images depending on a change in the number of cycles in Example 1;
- FIG. 9 shows TEM and EDS images depending on a change in the number of cycles in Example 2.
- FIG. 10 shows evaluation results of catalyst durability depending on a change in the number of cycles in Example 1.
- FIG. 11 shows evaluation results of catalyst durability depending on a change in the number of cycles in Example 2.
- FIGS. 2 and 3 are flowcharts illustrating an exemplary method of preparing an exemplary catalyst provided with an exemplary conductive oxide protective layer according to exemplary embodiments of the present invention.
- the method of preparing a catalyst provided with a conductive oxide protective layer may include preparing a carbon support having a metal catalyst supported thereon S 10 and forming a conductive oxide protective layer using atomic layer deposition (ALD) S 30 .
- ALD atomic layer deposition
- the method of preparing an exemplary catalyst provided with the conductive oxide protective layer may include providing, e.g., supplying, a carbon support having a metal catalyst supported thereon to a fluidized bed reactor S 11 and forming a conductive oxide protective layer using atomic layer deposition (ALD) S 31 to S 37 .
- ALD atomic layer deposition
- the atomic layer deposition may include supplying a conductive oxide precursor to a fluidized bed reactor S 31 , conducting first purging by supplying an inert gas to the fluidized bed reactor S 33 , converting the conductive oxide precursor to conductive oxide by supplying a reactive gas to the fluidized bed reactor S 35 , and conducting second purging by supplying an inert gas to the fluidized bed reactor S 37 .
- the metal catalyst may include platinum (Pt), but the present invention is not limited thereto.
- the conductive oxide precursor may be, for example, selected from the group consisting of titanium (IV) isopropoxide ((Ti[OCH(CH 3 ) 2 ] 4 , refer to the following Formula 1, tin (IV) chloride (SnCl 4 ), refer to the following Formula 2), and a combination thereof.
- the deposition operation pressure of the conductive oxide precursor may be preferably about 1 Torr to 5 Torr. That is, the deposition pressure may be maintained at about 1 Torr to 5 Torr.
- such a conductive oxide precursor may be supplied to the fluidized bed reactor for about 20 to 100 seconds.
- the step S 33 of first purging may be performed after step S 31 of supplying the conductive oxide precursor and before step S 35 of supplying the reaction gas.
- This purging step S 33 may include purging inert gas at a flow rate from about 50 sccm to about 200 sccm.
- the inert gas is preferably purged for about 60 to 120 seconds.
- the purging step S 33 enables the removal of unreacted residual radicals.
- the reaction gas may include, for example, water (H 2 O), particularly, water vapor. Also, such a reaction gas may be supplied to the fluidized bed reactor at a flow rate from about 10 sccm to about 200 sccm.
- the conductive oxide precursor may be converted to conductive oxide, and this conductive oxide may suitably include, for example, titanium dioxide (TiO 2 ), tin dioxide (SnO 2 ) and a combination thereof.
- second purging S 37 may be performed.
- This purging step S 37 may include purging the inert gas at a flow rate from about 50 sccm to about 200 sccm.
- the inert gas may preferably be purged for about 60 to 120 seconds. This purging step S 37 may enable the removal of unreacted residual radicals.
- sequentially performing a series of steps (e.g., S 31 to S 37 ) of the atomic layer deposition described above may beset as one cycle and repeatedly conducted.
- This cycle may be preferably performed repeatedly about one to twenty times. Meanwhile, as the number of cycles increases, the thickness of the formed conductive oxide protective layer may increase.
- the conductive oxide protective layer contains titanium dioxide (TiO 2 )
- the effect of improving the catalyst durability may be most excellent when the above-described cycle is performed repeatedly, preferably about 10 times or greater.
- the conductive oxide protective layer contains tin dioxide (SnO 2 )
- the effect of improving the catalyst durability may be excellent when the above-described cycle is performed repeatedly, preferably about five times or greater.
- a conductive oxide protective layer may be formed in a structure (for example, network structure) not covering the entire surface of the metal oxide supported on the carbon support. Further, the conductive oxide protective layer thus formed may prevent catalyst particles (for example, precious metal nanoparticles) from being eluted or agglomerating (coarsening).
- catalyst particles for example, precious metal nanoparticles
- the desired conductive oxide protective layer may be formed as a layer and applied to the entire surface of the catalyst particles, so there is a risk of deterioration of catalyst activity.
- a conductive oxide protective layer may be evenly formed on catalyst particles, such that the conductive oxide protective layer may have a structure that does not interfere with contact of the catalyst particles with oxygen (O 2 ) or hydrogen (H 2 ).
- O 2 oxygen
- H 2 hydrogen
- FIG. 4 is a schematic diagram illustrating an exemplary apparatus used for the method of preparing an exemplary catalyst provided with an exemplary conductive oxide protective layer according to exemplary embodiments of the present invention.
- a fluidized bed reactor for atomic layer deposition used for some embodiments of the present invention may include a fluidized bed reactor 100 , a rotary pump (or vacuum pump) 200 for controlling the internal pressure of the fluidized bed reactor 100 , a container 300 containing a conductive oxide precursor for introducing the conductive oxide precursor into the fluidized bed reactor 100 , an inert gas tank 400 for introducing a purge gas into the fluidized bed reactor 100 , and a reaction gas tank 500 for introducing a reaction gas into the fluidized bed reactor 100 .
- each of the gas tanks 400 and 500 may include a mass flow controller (MFC).
- MFC mass flow controller
- the fluidized bed reactor 100 may also serve as a chamber for atomic layer deposition (ALD), and thus may be initially vacuumized with the rotary pump 200 , and the strength of the vacuum, for example, the operation pressure, may be maintained constant even during the process. Accordingly, a carbon support, on which a metal catalyst (for example, platinum (Pt)) may be supported, may be introduced into the fluidized bed reactor 100 (see S 11 in FIG. 3 ).
- ALD atomic layer deposition
- a conductive oxide precursor for example, titanium (IV) isopropoxide (Ti[OCH(CH 3 ) 2 ) or tin (IV) chloride (SnCl 4 )
- a conductive oxide protective layer for example, titanium dioxide (TiO 2 ) or tin dioxide(SnO 2 )
- An inert gas for example, argon (Ar)
- a reactive gas for example, water vapor (H 2 O)
- MFC mass flow controller
- purging using the inert gas tank 400 may be performed at a flow rate from about 50 sccm to about 200 sccm, as described above.
- argon (Ar) which is an inert gas
- MFC mass flow controller
- the fluidized bed reactor 100 may initially be pumped at an internal pressure of about 0.1 Torr to 0.5 Torr, preferably 0.4 Torr.
- platinum-supported carbon support (Pt/C) particles may be fed to the fluidized bed reactor 100 and then pumped at the above-described base pressure.
- the method may further include pumping so as to adjust the internal pressure of the fluidized bed reactor 100 to about 0.1 Torr to 0.5 Torr, after step S 11 of supplying the carbon support having a metal catalyst supported thereon to the fluidized bed reactor 100 and before the step of supplying the conductive oxide precursor (see S 31 in FIG. 3 ).
- the internal reaction temperature of the fluidized bed reactor 100 may be maintained at about 300° C.
- the temperature of each channel may be maintained at about 100° C.
- the internal temperature of the container 300 may be maintained from room temperature to about 50° C.
- the internal temperature of a container having a conductive oxide precursor containing titanium (Ti) may be maintained at about 50° C.
- the internal temperature of a container having a conductive oxide precursor containing tin (Sn) may be maintained at room temperature.
- an inert gas e.g., argon (Ar) contained in the inert gas tank 400 during the process may be introduced into the fluidized bed reactor 100 at a flow rate of about 100 sccm through a mass flow controller (MFC).
- MFC mass flow controller
- a metal catalyst-supported carbon support for example, a platinum-supported carbon support (Pt/C)
- Pt/C platinum-supported carbon support
- the conductive oxide precursor may contact catalyst particles so as to be attached in a dot form to a catalyst composite, and the catalyst composite may include both a metal catalyst and a carbon support.
- Argon (Ar) gas as a purge gas, may be fed into the fluidized bed reactor 100 , and water vapor (H 2 O), as a reaction gas, may be fed thereto to adhere the conductive oxide to carbon black of the catalyst composite in a dot form, and an argon (Ar) gas may be fed thereto again and purged.
- argon (Ar) gas may serve to remove unreacted residual radicals.
- the operating pressure may be maintained at about 1 Torr to 5 Torr, and the flow rate of the gas may be about 50 sccm to 200 sccm for argon (Ar) and about 10 sccm to 200 sccm for water vapor (H 2 O).
- the time during which the conductive oxide precursor is supplied into the fluidized bed reactor 100 (S 31 ) may range from about 40 seconds to about 100 seconds
- the time during which argon (Ar) is purged (S 33 ) may range from about 60 seconds to about 120 seconds
- the time during which water vapor (H 2 O) is purged e.g., S 35 in FIG.
- S 3 may range from about 40 seconds to about 100 seconds, and the time during which argon (Ar) is purged (S 37 ) may range from about 60 seconds to about 120 seconds.
- a unit cycle including S 31 , S 33 , S 35 and S 37 as described above may be repeatedly performed several times.
- FIGS. 5A and 5B are conceptual diagrams respectively showing changes in a conventional fuel cell and catalyst composites according to exemplary embodiments of the present invention as the fuel cell operation time increases.
- the catalyst composite may include a carbon support 10 and metal catalyst particles 20 supported on the carbon support 10 .
- adjacent metal catalyst particles 20 may agglomerate (in other words, be coarsened).
- Ostwald ripening occurs between the metal catalyst particles 20 , the size of the metal catalyst particles 20 may increase.
- the surface area where the metal catalyst particles 20 may contact hydrogen (H 2 ) or oxygen (O 2 ) during the fuel cell reaction can be reduced, so the catalytic activity may be reduced.
- the catalyst composite according to exemplary embodiments of the present invention may be prepared by the above-described method (see FIG. 1 or 3 ), and thus the conductive oxide protective layer 30 may also be formed.
- such a catalyst composite may be formed on the surfaces of the carbon support 10 , the metal catalyst particles 20 supported on the carbon support 10 , and the metal catalyst particles 20 , and may include a conductive oxide protection layer 30 having a network structure.
- the metal catalyst particles 20 may include, for example, platinum (Pt).
- the mechanism of forming the conductive oxide protective layer 30 through atomic layer deposition will be described.
- the conductive oxide precursor When the conductive oxide precursor is introduced into the carbon support 10 having the metal catalyst particles 20 supported thereon, the conductive oxide precursor may be adsorbed on metal catalyst particles (particularly, precious metal particles) 20 having a surface energy higher than that of the carbon support 10 .
- the conductive oxide precursor may be adsorbed more on the surface of the metal catalyst particles 20 than on the surface of the carbon support 10 (see S 31 in FIG. 3 ).
- the conductive oxide precursor when contacting the reactive gas, may be converted to a conductive oxide protective layer 30 including a conductive oxide selected from the group consisting of titanium dioxide (TiO 2 ), tin dioxide (SnO 2 ), and a combination thereof, (e.g., S 35 in FIG. 3 ).
- the conductive oxide such as titanium dioxide (TiO 2 ) or tin dioxide (SnO 2 ) may be deposited through atomic layer deposition (ALD).
- ALD atomic layer deposition
- the conductive oxide may be deposited in a dot form and gradually may grow and meet adjacent conductive oxide in the form of dots to form a network structure. Then, the network structures gradually may grow to form a layer and thereby realize a conductive oxide protective layer 30 .
- a conductive oxide network structure may be first formed on the surface of the metal catalyst particles 20 , and then conductive oxide may be present in the form of nano-sized dots on the carbon support 10 .
- the conductive oxide protective layer 30 having a network structure thus formed may prevent the nano-sized metal catalyst particles 20 from agglomerating together (coarsening).
- the conductive oxide protective layer 30 may be uniformly formed to have a network structure that does not completely cover the metal catalyst particles 20 .
- these catalyst particles may be effectively prevented from agglomeration without interfering with contact between the catalyst particles and oxygen (O 2 ) or hydrogen (H 2 ), thereby maintaining and improving catalytic activity and improving durability despite operation of a fuel cell.
- the thickness of such a conductive oxide protective layer 30 may be about 0.05 nm to 10 nm.
- the thickness of the conductive oxide protective layer 30 is about 10 nm or less, the effect of improving durability may be maximized while maintaining catalytic activity.
- TiO 2 Conductive Oxide Protective Layer Containing Titanium Dioxide
- ALD-FBR fluidized bed reactor
- Platinum-supported carbon support (Pt/C) particles were fed to a fluidized bed reactor and pumped such that the base pressure of the fluidized bed reactor was 0.4 Torr. At this time, the internal temperature of the fluidized bed reactor was maintained at a temperature of 300° C., and the temperature of the channel was maintained at about 100° C.
- An inert gas tank containing a Ti precursor was maintained at an internal temperature of 50° C., and the Ti precursor was injected from the inert gas tank into the fluidized bed reactor for 40 to 100 seconds.
- Argon (Ar) gas was purged from the inert gas tank through a mass flow controller (MFC) at a flow rate of 100 sccm for 60 to 120 seconds.
- MFC mass flow controller
- the platinum-supported carbon support (Pt/C) in the fluidized bed reactor was fluidized and floated.
- purging was conducted by injecting an argon (Ar) gas into the fluidized bed reactor at a flow rate of 50 sccm to 200 sccm for 60 seconds to 120 seconds to remove unreacted residual radicals.
- Ar argon
- ALD-FBR fluidized bed reactor
- Platinum-supported carbon support (Pt/C) particles were fed to a fluidized bed reactor and pumped such that the base pressure of the fluidized bed reactor was 0.4 Torr. At this time, the internal temperature of the fluidized bed reactor was maintained at a temperature of 300° C., and the temperature of the channel was maintained at a temperature of 100° C.
- An inert gas tank containing a Sn precursor can be maintained at an internal temperature of room temperature and the Sn precursor was injected from the inert gas tank into the fluidized bed reactor for 20 to 80 seconds.
- Argon (Ar) gas was purged from the inert gas tank through a mass flow controller (MFC) at a flow rate of 100 sccm for 60 to 120 seconds.
- MFC mass flow controller
- the platinum-supported carbon support (Pt/C) in the fluidized bed reactor was fluidized and floated.
- purging was conducted by injecting an argon (Ar) gas into the fluidized bed reactor at a flow rate of 50 sccm to 200 sccm for 60 seconds to 120 seconds to remove unreacted residual radicals.
- Ar argon
- TEM Transmission Electron Microscopy
- EDS Energy-Dispersive X-Ray Spectroscopy
- FIG. 6 shows TEM and EDS images of Example 1.
- FIG. 7 shows TEM and EDS images of Example 2.
- titanium dioxide (TiO 2 ) and tin dioxide (SnO 2 ) as respective conductive oxides are particularly uniformly deposited on platinum (Pt) catalyst particles due to the high surface energy of the platinum (Pt).
- the loading ratio of titanium dioxide (TiO 2 ) increases as the number of cycles of atomic layer deposition (ALD) increases in Example 1. Also, it can be seen that as the number of cycles of atomic layer deposition (ALD) increases, the thickness of the titanium dioxide (TiO 2 ) protective layer increases.
- FIGS. 10 and 11 show the evaluation results of catalyst durability depending on a change in the number of cycles in Examples 1 and 2, respectively.
- the deposition rate of titanium dioxide (TiO 2 ) that is most suitable for improving the durability of a fuel cell catalyst (i.e., catalyst composite) can be determined through the measurement of a Q H change depending on the number of CV cycles, as the number of cycles of atomic layer deposition (ALD) of titanium dioxide (TiO 2 ) increases. It can be seen that, as the number of cycles of atomic layer deposition (ALD) increases, the thickness of the TiO 2 protective layer increases. In particular, durability is found to be the best at 10 times (see TiO 2 10-Pt 15).
- the deposition rate of tin dioxide (SnO 2 ) that is most suitable for improving the durability of a fuel cell catalyst (i.e. the catalyst composite) can be determined through the measurement of a Q H change depending on the number of CV cycles, as the number of cycles of atomic layer deposition (ALD) of tin dioxide (SnO 2 ) increases in Example 2. It can be seen that, as the number of cycles of atomic layer deposition (ALD) increases, the thickness of the SnO 2 protective layer increases. In particular, durability is found to be the best at 5 times (see SnO 2 5-Pt 15).
- the conductive oxide protective layer may be formed as a protective film having a network structure, so that agglomeration of the nano-sized catalyst particles may be prevented without reducing the catalytically active surface area, and thus the performance of fuel cells may be maintained and the durability of the fuel cells is improved.
- the protective layer formed as a layer for applying the entire surface of catalyst particles when performing a wet process or other vapor deposition process such as PVD or CVD
- the protective layer having a network structure i.e., conductive oxide protective layer
- the protective layer having a network structure may be formed through atomic-level deposition, so catalytic activity may be maintained and improved, while preventing coarsening of the catalyst particles.
- a conductive oxide protective layer may be uniformly formed on a catalyst having a large surface area and a support using atomic layer deposition (ALD).
- ALD atomic layer deposition
- a conductive oxide protective layer may be formed in a network structure not covering the entire surface of catalyst particles.
- coarsening of the catalyst particles may be effectively prevented, without interfering with contact of the catalyst particles with oxygen (O 2 ) or hydrogen (H 2 ).
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