US11137253B2 - Method for measuring a behavior of a MEMS device - Google Patents
Method for measuring a behavior of a MEMS device Download PDFInfo
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- US11137253B2 US11137253B2 US16/500,908 US201816500908A US11137253B2 US 11137253 B2 US11137253 B2 US 11137253B2 US 201816500908 A US201816500908 A US 201816500908A US 11137253 B2 US11137253 B2 US 11137253B2
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0035—Testing
- B81C99/0045—End test of the packaged device
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5705—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis
- G01C19/5712—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P21/00—Testing or calibrating of apparatus or devices covered by the preceding groups
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0242—Gyroscopes
Definitions
- the present invention relates to a method for measuring a behavior of a MEMS device comprising an inertial sensor.
- the behavior of the MEMS device that is measured by this method may be a mechanical attenuation behavior in response to a vibration being applied to the MEMS device.
- an inertial sensor for example, a gyroscope
- a disturbance e.g., vibration
- a MEMS device comprising a damping structure
- the damping structure is spring and air-based and requires almost no additional volume. It provides a fast attenuation of a vibration applied to a MEMS device.
- the need has arisen to measure the performance of the damping structure.
- Embodiments provide a method that allows measuring the behavior of a MEMS device in a response to a vibration applied to the device.
- the method is particularly relevant for MEMS devices comprising a damping structure.
- the method can also be performed to evaluate other MEMS devices.
- Embodiments provide a method for measuring a behavior of an MEMS device comprising a 6-axis or 9-axis inertial sensor is proposed which comprises the steps of:
- the method can further comprise the step D. Reading output data provided by the inertial sensor and calculating a frequency response curve of the inertial sensor.
- the method allows evaluating the accuracy of the data recorded by the inertial sensor when a vibration is applied to the MEMS device.
- the method may help to evaluate if an inertial sensor is able to provide reliable data even when a vibration is applied to the MEMS device.
- the method may also help to evaluate a performance of a damping of the MEMS device.
- a 6-axis inertial sensor can comprise a 3-axis gyroscope and a 3-axis accelerometer. Accordingly, the 6-axis inertial sensor can be configured to measure rotations and accelerations into three dimensions.
- a 9-axis inertial sensor can comprise a 3-axis gyroscope, a 3-axis accelerometer and a 3-axis compass.
- the 9-axis inertial sensor can be configured to measure rotations and accelerations into three dimensions and, additionally, to measure an absolute position in three dimensions.
- the inertial sensor may be part of an inertial measurement unit (IMU).
- IMU inertial measurement unit
- An inertial measurement unit is an electronic device that measures and reports a body's specific force, angular rate, and sometimes the magnetic field surrounding the body, using a combination of accelerometers and gyroscopes, sometimes also magnetometers.
- An inertial measurement unit works by detecting linear acceleration using one or more accelerometers and rotational rate using one or more gyroscopes.
- the terms “pitch”, “roll” and “yaw” are used in this context as common in flight dynamics which is the science of air-vehicle orientation and control in three dimensions.
- the angles of rotation in three dimensions about the vehicle's center of mass are known as roll, pitch and yaw.
- the inertial measurement unit may be configured for inertial measurements with respect to six or nine axes.
- the inertial sensor may be any sensor suitable for measuring a linear or rotational movement or a linear or rotational acceleration.
- the inertial sensor may be a gyroscope.
- the inertial sensor may comprise multiple sensors.
- step A the MEMS device is mounted to the testing apparatus.
- mounting may be defined as a temporary fixing.
- the MEMS device may be removed from the testing apparatus.
- multiple MEMS devices may be mounted to the testing apparatus simultaneously. Further, multiple MEMS devices may be measured simultaneously.
- the method is suitable for mass production wherein multiple MEMS devices are tested at the same time.
- the testing apparatus may be any surface to which the MEMS device can be mounted.
- the testing apparatus may be a printed circuit board or a measurement table.
- the testing apparatus may be moveable, in particular tiltable.
- the testing apparatus may be configured to be tilted with respect to more than one axis.
- the vibration source may be a piezoelectric vibration source or an electromagnetic exciter.
- the vibration source may be configured to apply a continuous or a discontinuous vibration.
- the vibration source may be configured to apply a vibration with a well-known amplitude and frequency.
- the vibration source may be configured such that the amplitude and/or the frequency of the vibration can be amended during the measurement.
- step B the MEMS device is moved according to a predefined movement pattern.
- the movement pattern may comprise a sequence of defined movements of the testing apparatus.
- the predefined movement pattern may comprise tilting movements of the testing apparatus.
- the testing apparatus may be tilted in different directions and with different angular rates.
- step C it is possible, in step C, to compare the movements calculated based on the output data provided by the inertial sensor with the actual movement which is known from the predefined movement pattern.
- step C may allow calculating an error by which the data provided by the inertial sensor deviate from the actual position.
- Step C may be performed by an evaluation unit outside of the MEMS device.
- a frequency response curve of the inertial sensor is calculated based on output data provided by the inertial sensor.
- the frequency response curve describes the response of the inertial sensor to vibrations of different frequencies.
- the frequency response curve may provide information concerning the frequency dependency of deviations of a measurement provided by the inertial sensor from a correct value, wherein the deviation is caused by the vibration.
- the method provides the advantage that it can be performed with an encapsulated MEMS device. Thus, no further manufacturing steps may be necessary after the measurement of the behavior. Instead, the measurement can be performed in a last step of a final testing after the manufacturing process is completed.
- the method can be performed simultaneously for many MEMS devices. Moreover, the method can be performed very fast. Thus, the method is adapted for a mass production of MEMS devices.
- the testing apparatus may comprises a 3-axis accelerometer configured to measure a frequency of a vibration applied to the MEMS device, wherein, in step B, the frequency of the applied vibration is varied, and wherein, in step D, the frequency response curve is calculated based on the output data by the inertial sensor ( 2 ) and the data provided by the 3-axis accelerometer.
- the 3-axis accelerometer may have a resonance frequency which differs from the resonance frequency of a 3-axis gyroscope of the inertial sensor.
- the 3-axis accelerometer may not be significantly affected by a vibration having a frequency which corresponds to the resonance frequency of the 3-axis gyroscope.
- a software algorithm may determine whether the difference between the output data provided by the inertial sensor and the predefined movement pattern is within a predetermined acceptance limit.
- the testing apparatus may be tilted at a defined angular rate in different directions during step B, wherein a roll angle and a pitch angle may be calculated based on the output data provided by the inertial sensor in step C.
- the roll angle and the pitch angle may define the orientation of a rotation axis.
- the output data provided by the inertial sensor may be evaluated using a sensor fusion algorithm comprising a Kalman filter before comparing the output data to the predefined movement pattern.
- the sensor fusion algorithm may be suitable for removing an error in the measurement of the inertial sensor.
- the Kalman filter may be a digital Kalman filter. Using a sensor fusion algorithm comprising a Kalman filter may significantly increase the accuracy in the measurement results determined by the inertial sensor. In particular, for vibrations having a rather small amplitude, the sensor fusion algorithm may be able to remove the effect of the vibration almost completely.
- the inertial sensor may comprise a gyroscope.
- Gyroscopes tend to be sensitive to disturbances that appear in a frequency close to the gyroscopes resonance frequency.
- the gyroscope may have different resonance frequencies with respect to different axes.
- the inertial sensor may be resiliently mounted on a carrier by means of a spring element wherein an airgap is provided between a top surface of the carrier and a bottom surface of the inertial sensor, wherein a damping structure is applied to at least one surface chosen from a first surface located on the carrier and a second surface located on the inertial sensor.
- a damping of the inertial sensor may be spring and air-based.
- the spring element may comprise a metal, e.g., copper, or a silicon material.
- the MEMS device may comprise a damping structure as disclosed in WO 2017/054868 A1.
- the method is particularly suitable for MEMS devices comprising a damping structure as the method may allow evaluating the quality of the damping. However, it may also be interesting to measure the effect of a vibration applied to a MEMS device which does not comprise a damping structure.
- the damping structure may be applied as a layer between the inertial sensor and the carrier on one of the first and second surface, wherein the layer comprises recesses and wherein the recesses are at least measured to accommodate the spring elements.
- the spring elements may comprise an elongated structure that is linear, bent or angled, a first end of the extended structure being coupled to a first anchor point on the carrier and a second end of the extended structure being coupled to a second anchor point on the sensor system, wherein the height of the airgap normal to the surface is smaller than the distance normal to the surface between first and second anchor point.
- the damping structure may be arranged to reduce the width of the airgap.
- the inertial sensor may be encapsulated in a sealed package.
- the method can be performed with an encapsulated MEMS device. No opening in the package is required for performing the measurement of the behavior. Thus, no further manufacturing steps may be necessary after the method has been performed. Instead, the method can be performed after a manufacturing process has been completed.
- Multiple MEMS devices can be mounted to the testing apparatus in step A, wherein the behavior of the multiple MEMS devices is measured simultaneously in steps B and C.
- the method is suitable for a mass production.
- the vibration applied in step B may be continuous or discontinuous.
- the vibration When the vibration is applied discontinuously, it can be measured how fast the MEMS device returns to its normal operation mode, i.e., how effective a damping structure can attenuate a vibration of the MEMS device. If the vibration is applied continuously, it can be evaluated if the MEMS device is functional even under vibration. Thus, the tolerance of the device to vibration can be determined.
- the testing apparatus can be rotated at an angular rate in the range of 0.001 degrees/second to 1000 degrees/second during step B.
- the rate can be changed during step B.
- the vibration source may vibrate with a frequency in the range of 0.1 kHz to 1000 kHz during step B, preferably in the range of 19 to 80 kHz and more particularly in the range of 20 to 35 kHz.
- This frequency range is typical for the resonance frequency of an inertial sensor. Measurements with a vibration having a frequency close to the resonance frequency of the sensor are particularly relevant.
- the frequency of the vibration can also be adapted to higher frequencies, like an integer multiple of the resonance frequency of one gyroscope or different gyroscopes in one package so as to reach the range of special harmonics of the MEMS device or multiple devices in one package.
- the vibration source can vibrate with an amplitude in the range of 1 nm to 10 ⁇ m during step B.
- the amplitude and the frequency of the vibration may change during step B.
- the testing apparatus is moved during step B such that the g-rate in the range of 0.01 g to 100 g is applied to the MEMS device.
- the rate is between 0.5 g to 10 g.
- a g-rate of more than 100 should not be applied as; otherwise, the inertial sensor may be damaged by the g-force.
- a g-rate below 0.01 should not be applied as it may be difficult to measure such low g-forces with a sufficient accuracy.
- the method may be performed to evaluate MEMS devices intended for all kinds of purposes.
- the MEMS device may be used in consumer products, e.g., a smart cellphone or a civilian drone.
- inertial sensors are used to determine an orientation of the respective device.
- Smart cellphones often comprise powerful vibration sources, e.g., speakers.
- Civilian drones may be used in environments with acoustic noise which may result in vibrations of the drone.
- the MEMS device may also be used in an electronic component used for an automotive application.
- a gyroscope may be used for movement tracking in an automotive application.
- Ultrasound haptic feedback may occur in the automotive application which may result in a vibration of the MEMS device.
- Inertial sensors for example gyroscopes, may be used for detecting acoustically caused vibrations, for example, speech.
- the MEMS device may also be used in a high value device, for example, in a rocket, an airplane, a drone for military or aerospace purposes. In such high value devices, it is also important to know how the MEMS device responds to a vibration.
- the MEMS device may comprise a cap which seals the inertial sensor, wherein the cap is transparent for a laser beam used in the laser Doppler vibrometer.
- the MEMS device may comprise a cap which covers the inertial sensor, wherein the cap has one or more holes, wherein a laser beam is applied to the inertial sensor through one of the holes, wherein the one or more holes are sealed after measuring the attenuation of the vibration.
- FIGS. 1 and 2 show MEMS devices comprising a damping structure
- FIG. 3 shows a setup for performing a measurement of a behavior of a MEMS device
- FIGS. 4 to 8 show results of different measurements
- FIG. 9 shows another method of measuring the behavior of a MEMS device.
- a method for measuring a behavior of a MEMS device 1 comprising an inertial sensor 2 is disclosed.
- the behavior may, in particular, be a mechanical attenuation behavior in response to a vibration applied to the MEMS device 1 .
- Such a measurement is particularly relevant for a MEMS device 1 which comprises a damping structure 3 configured to attenuate a vibration of the inertial sensor 2 .
- FIGS. 1 and 2 show such a MEMS device 1 .
- the measurement is designed to determine if the inertial sensor 2 can provide reliable information even if a vibration is applied to the MEMS device 1 .
- the measurement is designed to determine an attenuation of a vibration of the MEMS device 1 .
- the measurement setup is designed to determine how long it takes, after the disappearance of a disturbance in form of a vibration, until the inertial sensor 2 provides reliable data again.
- these measurements may allow evaluating the performance of the damping structure 3 and/or of a sensor fusion algorithm.
- FIG. 1 shows a cross section through the MEMS device 1 .
- the device 1 comprises an inertial measurement unit 4 that comprises the inertial sensor 2 .
- the MEMS device 1 may also comprise a pressure sensor or a microphone.
- the inertial measurement unit 4 is resiliently mounted onto a carrier 5 via spring elements 6 .
- the spring elements 6 may comprise a stand-off 7 on the carrier 5 and a free standing end laterally extending therefrom.
- the inertial measurement unit 4 is bonded to the free standing end by means of bumps 8 . Via the spring element 6 , stand-off 7 and bump 8 electrical contact between second electrical contacts P 2 on a bottom surface 10 of the inertial measurement unit 4 and first electrical contacts P 1 on the carrier 5 is achieved.
- the carrier 5 may be a multilayer printed circuited board that may have a multilayer structure comprising at least one wiring layer and other internal wiring connecting the first electrical contacts P 1 to external contacts P 3 of the MEMS device 1 on a bottom surface of the carrier.
- a cap 9 is bonded to a top surface 12 of the carrier 5 via a glue or solder. Between cap 9 and carrier 5 a volume is enclosed accommodating at least the inertial measurement unit 4 .
- the volume may be necessary for the function of the MEMS device 1 and may provide protection against chemical and mechanical impact from the environment. For clarity reasons only the inertial measurement unit 4 comprising the inertial sensor 2 is shown. But other components of the MEMS device 1 like an ASIC, for example, may be accommodated too under the cap 9 .
- the MEMS device 1 comprises a damping structure 3 .
- the damping structure 3 is applied to the bottom surface 10 of the inertial measurement unit 4 .
- the damping structure 3 comprises recesses to accommodate the spring elements 6 . Thereby the airgap 11 between the bottom surface 10 of the inertial measurement unit 4 and the top surface 12 of the carrier 5 is reduced.
- the maximum mutual movement of inertial measurement unit 4 versus carrier 5 is limited by the air gap 11 between top surface 12 of carrier 5 and a bottom surface of the damping structure 3 .
- the air gap 11 is reduced with regard to a device which does not comprise a damping structure 3 .
- the height of the air gap 11 is set to a value small enough that squeeze film damping occurs.
- FIG. 2 shows a cross section of a MEMS device 1 according to a second embodiment of the invention.
- the damping structure 3 is applied to the top surface 12 of the carrier 5 .
- the thus reduced air gap 11 is formed between a top surface on the damping structure 3 and the bottom surface 10 of the inertial measurement unit 4 .
- the same effect is achieved by this embodiment as the same squeeze film damping occurs at this air gap 11 .
- FIG. 3 shows a measurement setup which enables a measuring of the mechanical attenuation behavior of a MEMS device 1 .
- the measurement setup comprises a testing apparatus 13 .
- the testing apparatus 13 may be a measurement table or a printed circuit board.
- the MEMS device 1 is mounted to surface of the testing apparatus 13 , for example, to a top surface.
- the measurement setup comprises a vibration source 14 which is fixed to the testing apparatus 13 .
- the vibration source 14 is mounted to a bottom surface opposite to the top surface of the testing apparatus 13 .
- the vibration source 14 may also be mounted to the top surface of the testing apparatus 13 .
- the vibration source 14 is configured to apply a vibration to the testing apparatus 13 .
- the vibration source 14 may be an electromechanical exciter or a piezoelectric vibration source.
- the testing apparatus 13 is configured to be moved according to a predefined movement pattern.
- the testing apparatus 13 is configured to be tilted relative to one axis or to be tilted relative to multiple axis.
- the testing apparatus 13 is tilted at a defined angular rate in different directions. This predefined movement pattern is well-known with a high precision.
- the MEMS device 1 comprises the inertial sensor 2 .
- the MEMS device 1 may comprise the inertial measurement unit 4 configured to measure inertial movements with respect to six or nine axes.
- the inertial sensor 2 may comprise one or more gyroscopes.
- the MEMS device 1 may be the device shown in FIG. 1 or the device shown in FIG. 2 .
- a vibration is applied to the testing apparatus 13 and, thereby, to the MEMS device 1 by the vibration source 14 .
- the MEMS device 1 is moved according to the predefined movement pattern.
- the output data provided by the inertial sensor 2 are read out and compared to the predefined movement pattern. This allows determining an error which results from the vibration being applied to the MEMS device 1 .
- the output data provided by the inertial sensor 2 are analyzed and a software algorithm determines whether the deviation of the output data from the predefined movement pattern is within a predefined acceptance limit. This allows determining whether the MEMS device 1 has an attenuation behavior that is within given customer specifications.
- the output data provided by the inertial sensor 2 may first be evaluated in a sensor fusion algorithm comprising a Kalman filter.
- the sensor fusion algorithm may be carried out in the ASIC inside the MEMS device 1 .
- raw output data provided by the inertial sensor 2 may be applied to an evaluation unit outside of the MEMS device 1 and the sensor fusion algorithm may be performed in the evaluation unit outside of the MEMS device 1 .
- the testing apparatus 13 further comprises a 3-axis accelerometer 20 .
- FIG. 4 shows an example of the output data provided by the MEMS device 1 in response to a movement of the testing apparatus 13 and a simultaneous vibration being applied by the vibration source 14 .
- the output data shown in FIG. 4 are the output data provided by the sensor fusion algorithm wherein the raw data provided by the inertial sensor 2 have been evaluated using a Kalman filter.
- On the horizontal axis a time after the start of the measurement in seconds is shown.
- On the vertical axis the angle of rotation as calculated from the output data is shown wherein the output data have been evaluated using a sensor fusion algorithm.
- FIG. 5 shows the result of another measurement. On the horizontal axis, a time after the start of the measurement in seconds is shown. On the vertical axis, the angle of rotation as calculated from the output data is shown wherein the raw output data are shown which have not been evaluated using a sensor fusion algorithm.
- the inertial sensor 2 is a gyroscope. It is clearly visible in the data shown in FIG. 5 that a vibration has been applied with the resonance frequency of the inertial sensor 2 at the time of 0.0 seconds. Due to the resonance behavior of the gyroscope, the raw data provided by the inertial sensor 2 shown a large error and cannot be considered as being reliable.
- FIG. 6 shows the result of another measurement wherein a MEMS device 1 has been moved according to a predefined movement pattern and, simultaneously, vibrated.
- a time after the start of the measurement in seconds is shown.
- a difference between the roll angle of the testing apparatus 13 which is known in the predefined movement pattern and the roll angle as calculated by a sensor fusion algorithm is shown. It is shown in FIG. 6 that the roll angle as calculated by the sensor fusion algorithm deviates from the actual roll angle up to ⁇ 7°. This deviation is due to resonance effects.
- this measurement shows that a damping provided by the damping structure was not strong enough to guarantee reliable data in this case.
- FIGS. 7 and 8 show the result of another measurement of this kind.
- the same measurement is shown; only the scale of the respective vertical axis differs.
- a time after the start of the measurement in seconds is shown on the respective horizontal axis.
- On the vertical axis a difference between the roll angle of the measurement table which is known in the predefined movement pattern and the roll angle as calculated by a sensor fusion algorithm is shown.
- a vibration has been applied form the start of the measurement at 0.0 seconds until 8.5 seconds. It can be seen in both figures that, after the vibration stops, the inertial sensor is damped very fast and provides reliable data less than 0.1 seconds after the end of the vibration. Thus, the measurement allows determining the performance of the damping structure.
- the above-described measurement can be performed simultaneously for multiple MEMS devices 1 .
- multiple MEMS devices 1 can be mounted onto the testing apparatus 13 and evaluated simultaneously.
- the measurement is suitable for a mass production of a multitude of MEMS devices 1 .
- the measurement may be performed after a manufacturing process of the multitude of MEMS devices 1 has been completed as part of a performance and reliability test of the MEMS devices 1 .
- the measurement can be performed after the MEMS device 1 has been encapsulated with the cap 9 . Accordingly, no further production steps have to be performed after the measurement which could, otherwise, influence the damping behavior.
- the measurement can be performed and evaluated very fast. This also helps to enable the measurement for mass production of multiple MEMS devices 1 .
- FIG. 9 shows another method of measuring the behavior of the MEMS device 1 .
- a vibration is applied to the MEMS device 1 .
- a laser beam 15 is applied to the inertial sensor 2 .
- the vibration of the inertial sensor 2 is determined by a laser Doppler vibrometer using the laser beam 15 .
- the cap 9 comprises a hole 16 wherein the laser beam 15 can access the inertial sensor 2 through the hole 16 .
- the cap 9 is transparent for the laser beam 15 .
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DE102017115667.4 | 2017-07-12 | ||
DE102017115667.4A DE102017115667A1 (en) | 2017-07-12 | 2017-07-12 | Method for measuring a behavior of a MEMS device |
PCT/EP2018/068649 WO2019011909A1 (en) | 2017-07-12 | 2018-07-10 | Method for measuring a behaviour of a mems device |
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DE102020214102A1 (en) * | 2020-03-19 | 2021-09-23 | Robert Bosch Gesellschaft mit beschränkter Haftung | Device for characterizing, checking and / or testing a component, in particular a microelectromechanical system, system, method |
Citations (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3044292A (en) * | 1958-12-17 | 1962-07-17 | Lyle E Matthews | Vibration table |
US3180131A (en) * | 1961-12-04 | 1965-04-27 | Norman W Thompson | Calibrating and testing centrifuge |
US3557628A (en) * | 1967-12-27 | 1971-01-26 | Toyoda Chuo Kenkyusho Kk | Accelerometer |
US3659456A (en) * | 1968-03-22 | 1972-05-02 | Marshall Research And Dev Corp | Shock spectrum analysis and synthesis method and apparatus |
US3693400A (en) * | 1970-05-20 | 1972-09-26 | Western Geophysical Co | Method for measuring the characteristics of mechanical-to-electrical transducers |
US4188816A (en) * | 1974-11-29 | 1980-02-19 | Sanders Associates, Inc. | Apparatus and method for performing inertial measurements using translational acceleration transducers and for calibrating translational acceleration transducers |
US4199990A (en) * | 1977-07-01 | 1980-04-29 | Thomson-Csf | Elastic surface wave accelerometer |
US4385524A (en) * | 1981-10-13 | 1983-05-31 | Wyle Laboratories | Compact shake mechanism |
US4495433A (en) * | 1983-11-22 | 1985-01-22 | The United States Of America As Represented By The Secretary Of The Navy | Dual capability piezoelectric shaker |
US5224380A (en) * | 1990-05-21 | 1993-07-06 | The University Of Maryland | Superconducting six-axis accelerometer |
US5353642A (en) * | 1991-02-01 | 1994-10-11 | Kyowa Electronic Instruments, Ltd. | Centrifugal type acceleration measuring device |
US5355716A (en) * | 1990-06-01 | 1994-10-18 | Automotive Technologies International, Inc. | Generalized rotary shock and impact testing machine |
US5435168A (en) * | 1993-08-17 | 1995-07-25 | Scientific-Atlanta, Inc. | Transducer testing system for low frequency vibrations |
US5644087A (en) * | 1996-06-20 | 1997-07-01 | Liu; Hong S. | Rotational shock vibration fixture |
US5895858A (en) * | 1995-05-22 | 1999-04-20 | Analog Devices, Inc. | Integrated accelerometer test system |
US6190032B1 (en) * | 1998-04-21 | 2001-02-20 | Eyela-Chino Inc. | Shaking machine with rotation regulating coupling |
US6310605B1 (en) * | 1997-04-14 | 2001-10-30 | Immersion Corporation | Force feedback interface with selective disturbance filter |
US6443013B1 (en) * | 2000-08-04 | 2002-09-03 | Samsung Electronics Co., Ltd. | Rotary test fixture |
US20030084704A1 (en) * | 2001-11-06 | 2003-05-08 | Hanse Joel G | Self-calibrating inertial measurement system method and apparatus |
US20050160785A1 (en) * | 2002-03-29 | 2005-07-28 | Akira Umeda | Method and device for measuring dynamic linearity of acceleration sensor |
US7066004B1 (en) * | 2004-09-02 | 2006-06-27 | Sandia Corporation | Inertial measurement unit using rotatable MEMS sensors |
US20060195305A1 (en) * | 2005-02-28 | 2006-08-31 | Honeywell International, Inc. | Low vibration rectification in a closed-loop, in-plane MEMS device |
US20060243023A1 (en) * | 2005-03-30 | 2006-11-02 | Wong Wai K | System and method for Micro Electro Mechanical System (MEMS) device characterization |
US20070024581A1 (en) * | 2005-08-01 | 2007-02-01 | Samsung Electronics Co., Ltd. | Apparatus and method for detecting motion with low power consumption in inertia sensor |
US20070073502A1 (en) | 2003-04-28 | 2007-03-29 | National Inst. Of Adv. Industrial Science & Tech. | Dynamic matrix sensitivity measuring instrument for inertial sensors, and measuring method therefor |
US20070240486A1 (en) * | 2005-03-04 | 2007-10-18 | Moore Robert H | Inertial measurement system and method with bias cancellation |
US20080028823A1 (en) * | 2006-08-01 | 2008-02-07 | Howard Samuels | Sensor Self-Test Transfer Standard |
US20080173092A1 (en) | 2007-01-24 | 2008-07-24 | Yamaha Corporation | Motion sensor, accelerometer, inclination sensor, pressure sensor, and tactile controller |
US20090078044A1 (en) * | 2007-09-26 | 2009-03-26 | Li-Peng Wang | Ultra-low noise MEMS piezoelectric accelerometers |
US20090182521A1 (en) * | 2007-11-20 | 2009-07-16 | The Modal Shop, Inc. | Reference sensor method for calibration of dynamic motion sensors |
US20090272189A1 (en) * | 2006-01-25 | 2009-11-05 | The Regents Of The University Of California | Robust Six Degree-of-Freedom Micromachined Gyroscope with Anti-Phase Drive Scheme and Mehtod of Operation of the Same |
US20090288485A1 (en) * | 2008-05-22 | 2009-11-26 | Rosemount Aerospace Inc. | High bandwidth inertial measurement unit |
US20110000275A1 (en) * | 2008-02-04 | 2011-01-06 | Gary Froman | System and Method for Testing of Transducers |
US20110260734A1 (en) | 2010-04-23 | 2011-10-27 | AFA Micro Co. | Integrated circuit device test apparatus |
US20110308296A1 (en) * | 2010-06-17 | 2011-12-22 | The Aerospace Corporation | High-frequency, hexapod six degree-of-freedom shaker |
US20120139175A1 (en) | 2010-12-07 | 2012-06-07 | Samsung Electro-Mechanics Co., Ltd. | Apparatus for applying multi-axial inertial force |
US8256265B2 (en) * | 2007-12-25 | 2012-09-04 | Denso Corporation | Apparatus and method for inspecting sensor module |
US8464571B1 (en) * | 2009-03-20 | 2013-06-18 | Analog Devices, Inc. | Systems and methods for determining resonant frequency and quality factor of overdamped systems |
US20130239692A1 (en) * | 2012-03-19 | 2013-09-19 | Analog Devices, Inc. | Microelectronic Device Testing Apparatus and Method |
US20140052401A1 (en) * | 2012-08-15 | 2014-02-20 | Qualcomm Incorporated | Device driven inertial interference compensation |
US20140083160A1 (en) * | 2011-05-10 | 2014-03-27 | Bae Systems Plc | Calibrating rotational accelerometers |
CN104019830A (en) | 2014-06-17 | 2014-09-03 | 中国航空工业集团公司北京长城计量测试技术研究所 | Standard combined acceleration output device |
US20150033848A1 (en) * | 2012-03-16 | 2015-02-05 | Oxsensis Ltd | Optical sensor |
US20150260519A1 (en) * | 2013-08-02 | 2015-09-17 | Motion Engine Inc. | Mems motion sensor and method of manufacturing |
WO2016034940A1 (en) | 2014-09-05 | 2016-03-10 | King Abdullah University Of Science And Technology | Multi-frequency excitation |
US20160219719A1 (en) * | 2015-01-28 | 2016-07-28 | Analog Devices Global | Method of trimming a component and a component trimmed by such a method |
CN205691137U (en) | 2016-06-02 | 2016-11-16 | 中国工程物理研究院总体工程研究所 | Vibration centrifugal composite test device for inertia type instrument calibration |
US20160370403A1 (en) * | 2015-06-22 | 2016-12-22 | Adel Merdassi | Capacitive accelerometer devices and wafer level vacuum encapsulation methods |
WO2017054868A1 (en) | 2015-09-30 | 2017-04-06 | Tdk Corporation | Resiliently mounted sensor system with damping |
US20170328712A1 (en) * | 2016-05-11 | 2017-11-16 | Murata Manufacturing Co., Ltd. | Digital controller for a mems gyroscope |
US9829374B2 (en) * | 2012-10-12 | 2017-11-28 | Advanced Systems & Technologies, Inc. | Method and system for conformal imaging vibrometry |
US20180120126A1 (en) * | 2016-10-27 | 2018-05-03 | Freescale Semiconductor, Inc. | Microelectromechanical systems device test system and method |
US20180257688A1 (en) * | 2017-03-08 | 2018-09-13 | Gatekeeper Systems, Inc. | Navigation systems for wheeled carts |
-
2017
- 2017-07-12 DE DE102017115667.4A patent/DE102017115667A1/en active Pending
-
2018
- 2018-07-10 US US16/500,908 patent/US11137253B2/en active Active
- 2018-07-10 WO PCT/EP2018/068649 patent/WO2019011909A1/en active Application Filing
Patent Citations (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3044292A (en) * | 1958-12-17 | 1962-07-17 | Lyle E Matthews | Vibration table |
US3180131A (en) * | 1961-12-04 | 1965-04-27 | Norman W Thompson | Calibrating and testing centrifuge |
US3557628A (en) * | 1967-12-27 | 1971-01-26 | Toyoda Chuo Kenkyusho Kk | Accelerometer |
US3659456A (en) * | 1968-03-22 | 1972-05-02 | Marshall Research And Dev Corp | Shock spectrum analysis and synthesis method and apparatus |
US3693400A (en) * | 1970-05-20 | 1972-09-26 | Western Geophysical Co | Method for measuring the characteristics of mechanical-to-electrical transducers |
US4188816A (en) * | 1974-11-29 | 1980-02-19 | Sanders Associates, Inc. | Apparatus and method for performing inertial measurements using translational acceleration transducers and for calibrating translational acceleration transducers |
US4199990A (en) * | 1977-07-01 | 1980-04-29 | Thomson-Csf | Elastic surface wave accelerometer |
US4385524A (en) * | 1981-10-13 | 1983-05-31 | Wyle Laboratories | Compact shake mechanism |
US4495433A (en) * | 1983-11-22 | 1985-01-22 | The United States Of America As Represented By The Secretary Of The Navy | Dual capability piezoelectric shaker |
US5224380A (en) * | 1990-05-21 | 1993-07-06 | The University Of Maryland | Superconducting six-axis accelerometer |
US5355716A (en) * | 1990-06-01 | 1994-10-18 | Automotive Technologies International, Inc. | Generalized rotary shock and impact testing machine |
US5353642A (en) * | 1991-02-01 | 1994-10-11 | Kyowa Electronic Instruments, Ltd. | Centrifugal type acceleration measuring device |
US5435168A (en) * | 1993-08-17 | 1995-07-25 | Scientific-Atlanta, Inc. | Transducer testing system for low frequency vibrations |
US5895858A (en) * | 1995-05-22 | 1999-04-20 | Analog Devices, Inc. | Integrated accelerometer test system |
US5644087A (en) * | 1996-06-20 | 1997-07-01 | Liu; Hong S. | Rotational shock vibration fixture |
US6310605B1 (en) * | 1997-04-14 | 2001-10-30 | Immersion Corporation | Force feedback interface with selective disturbance filter |
US6190032B1 (en) * | 1998-04-21 | 2001-02-20 | Eyela-Chino Inc. | Shaking machine with rotation regulating coupling |
US6443013B1 (en) * | 2000-08-04 | 2002-09-03 | Samsung Electronics Co., Ltd. | Rotary test fixture |
US20030084704A1 (en) * | 2001-11-06 | 2003-05-08 | Hanse Joel G | Self-calibrating inertial measurement system method and apparatus |
US20050160785A1 (en) * | 2002-03-29 | 2005-07-28 | Akira Umeda | Method and device for measuring dynamic linearity of acceleration sensor |
US20070073502A1 (en) | 2003-04-28 | 2007-03-29 | National Inst. Of Adv. Industrial Science & Tech. | Dynamic matrix sensitivity measuring instrument for inertial sensors, and measuring method therefor |
US7066004B1 (en) * | 2004-09-02 | 2006-06-27 | Sandia Corporation | Inertial measurement unit using rotatable MEMS sensors |
US20060195305A1 (en) * | 2005-02-28 | 2006-08-31 | Honeywell International, Inc. | Low vibration rectification in a closed-loop, in-plane MEMS device |
US20070240486A1 (en) * | 2005-03-04 | 2007-10-18 | Moore Robert H | Inertial measurement system and method with bias cancellation |
US20060243023A1 (en) * | 2005-03-30 | 2006-11-02 | Wong Wai K | System and method for Micro Electro Mechanical System (MEMS) device characterization |
US20070024581A1 (en) * | 2005-08-01 | 2007-02-01 | Samsung Electronics Co., Ltd. | Apparatus and method for detecting motion with low power consumption in inertia sensor |
US20090272189A1 (en) * | 2006-01-25 | 2009-11-05 | The Regents Of The University Of California | Robust Six Degree-of-Freedom Micromachined Gyroscope with Anti-Phase Drive Scheme and Mehtod of Operation of the Same |
US20080028823A1 (en) * | 2006-08-01 | 2008-02-07 | Howard Samuels | Sensor Self-Test Transfer Standard |
US20080173092A1 (en) | 2007-01-24 | 2008-07-24 | Yamaha Corporation | Motion sensor, accelerometer, inclination sensor, pressure sensor, and tactile controller |
US20090078044A1 (en) * | 2007-09-26 | 2009-03-26 | Li-Peng Wang | Ultra-low noise MEMS piezoelectric accelerometers |
US20090182521A1 (en) * | 2007-11-20 | 2009-07-16 | The Modal Shop, Inc. | Reference sensor method for calibration of dynamic motion sensors |
US8256265B2 (en) * | 2007-12-25 | 2012-09-04 | Denso Corporation | Apparatus and method for inspecting sensor module |
US20110000275A1 (en) * | 2008-02-04 | 2011-01-06 | Gary Froman | System and Method for Testing of Transducers |
US20090288485A1 (en) * | 2008-05-22 | 2009-11-26 | Rosemount Aerospace Inc. | High bandwidth inertial measurement unit |
US8464571B1 (en) * | 2009-03-20 | 2013-06-18 | Analog Devices, Inc. | Systems and methods for determining resonant frequency and quality factor of overdamped systems |
US20110260734A1 (en) | 2010-04-23 | 2011-10-27 | AFA Micro Co. | Integrated circuit device test apparatus |
US20110308296A1 (en) * | 2010-06-17 | 2011-12-22 | The Aerospace Corporation | High-frequency, hexapod six degree-of-freedom shaker |
US20120139175A1 (en) | 2010-12-07 | 2012-06-07 | Samsung Electro-Mechanics Co., Ltd. | Apparatus for applying multi-axial inertial force |
US20140083160A1 (en) * | 2011-05-10 | 2014-03-27 | Bae Systems Plc | Calibrating rotational accelerometers |
US20150033848A1 (en) * | 2012-03-16 | 2015-02-05 | Oxsensis Ltd | Optical sensor |
US20130239692A1 (en) * | 2012-03-19 | 2013-09-19 | Analog Devices, Inc. | Microelectronic Device Testing Apparatus and Method |
US20140052401A1 (en) * | 2012-08-15 | 2014-02-20 | Qualcomm Incorporated | Device driven inertial interference compensation |
US9829374B2 (en) * | 2012-10-12 | 2017-11-28 | Advanced Systems & Technologies, Inc. | Method and system for conformal imaging vibrometry |
US20150260519A1 (en) * | 2013-08-02 | 2015-09-17 | Motion Engine Inc. | Mems motion sensor and method of manufacturing |
CN104019830A (en) | 2014-06-17 | 2014-09-03 | 中国航空工业集团公司北京长城计量测试技术研究所 | Standard combined acceleration output device |
WO2016034940A1 (en) | 2014-09-05 | 2016-03-10 | King Abdullah University Of Science And Technology | Multi-frequency excitation |
US9887687B2 (en) | 2015-01-28 | 2018-02-06 | Analog Devices Global | Method of trimming a component and a component trimmed by such a method |
DE102016100821A1 (en) | 2015-01-28 | 2016-07-28 | Analog Devices Global | Method for adapting a component and component adapted by means of such a method |
US20160219719A1 (en) * | 2015-01-28 | 2016-07-28 | Analog Devices Global | Method of trimming a component and a component trimmed by such a method |
US20160370403A1 (en) * | 2015-06-22 | 2016-12-22 | Adel Merdassi | Capacitive accelerometer devices and wafer level vacuum encapsulation methods |
WO2017054868A1 (en) | 2015-09-30 | 2017-04-06 | Tdk Corporation | Resiliently mounted sensor system with damping |
US20180244515A1 (en) * | 2015-09-30 | 2018-08-30 | Tdk Corporation | Resiliently mounted sensor system with damping |
US20170328712A1 (en) * | 2016-05-11 | 2017-11-16 | Murata Manufacturing Co., Ltd. | Digital controller for a mems gyroscope |
CN205691137U (en) | 2016-06-02 | 2016-11-16 | 中国工程物理研究院总体工程研究所 | Vibration centrifugal composite test device for inertia type instrument calibration |
US20180120126A1 (en) * | 2016-10-27 | 2018-05-03 | Freescale Semiconductor, Inc. | Microelectromechanical systems device test system and method |
US20180257688A1 (en) * | 2017-03-08 | 2018-09-13 | Gatekeeper Systems, Inc. | Navigation systems for wheeled carts |
Non-Patent Citations (3)
Title |
---|
Giacci, F. et al., "Signal Integrity in Capacitive and Piezoresistive Single- and Multi-Axis MEMS Gyroscopes under Vibrations," Microelectronics Reliability, vol. 75, Jun. 20, 2017, 10 pages. |
Nekrasov, Y.A. et al., "MEMS Gyro Vibration Immunity and its Measurement with TIRA Shaker," 2015 IEEE International Instrumentation and Measurement Technology Conference Proceedings, May 11, 2015, 6 pages. |
Roy, N. et al., "Listening through a Vibration Motor," University of Illinois at Urbana-Champaign; downloaded from http://synrg.csl.illinois.edu/vibraphone/paperdocs/VibraPhone_mobisys 16.pdf on Sep. 25, 2019, 14 pages. |
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