US11112511B2 - Radiation detector and compton camera - Google Patents
Radiation detector and compton camera Download PDFInfo
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- US11112511B2 US11112511B2 US16/514,285 US201916514285A US11112511B2 US 11112511 B2 US11112511 B2 US 11112511B2 US 201916514285 A US201916514285 A US 201916514285A US 11112511 B2 US11112511 B2 US 11112511B2
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- 230000005855 radiation Effects 0.000 title claims abstract description 91
- 239000004065 semiconductor Substances 0.000 claims abstract description 61
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 238000009825 accumulation Methods 0.000 claims abstract description 33
- 230000005251 gamma ray Effects 0.000 claims description 44
- 238000005259 measurement Methods 0.000 claims description 13
- 239000003990 capacitor Substances 0.000 description 16
- 238000001514 detection method Methods 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000003993 interaction Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 2
- XQPRBTXUXXVTKB-UHFFFAOYSA-M caesium iodide Chemical compound [I-].[Cs+] XQPRBTXUXXVTKB-UHFFFAOYSA-M 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/17—Circuit arrangements not adapted to a particular type of detector
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/24—Measuring radiation intensity with semiconductor detectors
- G01T1/241—Electrode arrangements, e.g. continuous or parallel strips or the like
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/24—Measuring radiation intensity with semiconductor detectors
- G01T1/247—Detector read-out circuitry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/29—Measurement performed on radiation beams, e.g. position or section of the beam; Measurement of spatial distribution of radiation
- G01T1/2914—Measurement of spatial distribution of radiation
- G01T1/2921—Static instruments for imaging the distribution of radioactivity in one or two dimensions; Radio-isotope cameras
- G01T1/2928—Static instruments for imaging the distribution of radioactivity in one or two dimensions; Radio-isotope cameras using solid state detectors
Definitions
- the present disclosure relates to a radiation detector that detects radiation as an observation target by detecting photoelectrons generated by a photoelectric effect and recoil electrons generated by Compton scattering, and to a Compton camera.
- Japanese Patent Application Laid-Open No. 2014-185852 discusses a radiation detection apparatus including first and second detection units.
- the first detection unit detects a position at which a first interaction occurs due to incident radiation and a track of a recoil electron generated by the first interaction, with use of a first photoelectric conversion device.
- the second detection unit detects a position at which a second interaction occurs due to scattered radiation.
- a position of a radiation source in an observation target space is calculated with use of the positions at which the first and second interactions occur and the track of the recoil electron.
- Japanese Patent Application Laid-Open No. 2017-026524 discusses a radiation measurement apparatus including a scatter detector, an absorber detector, and a processing unit. Pixel electrodes of the scatter detector and the absorber detector are arranged such that a distance between centers of two adjacent pixel electrodes is smaller than a mean free path of a recoil electron generated by Compton scattering with electromagnetic radiation.
- a charge-accumulation two-dimensional semiconductor device charges generated by the recoil electrons are accumulated in a capacitor inside a detector, and the charges are transferred outside as image signals.
- the time when the transferred charges are accumulated cannot be specified, so that a reading time period of the image signals becomes a dead time period and an incident time from a radiation source cannot be specified.
- a signal line is disposed for respective pixel electrodes arranged in a matrix, which allows for specification of the accumulation time of the transferred charges; however, in order to improve accuracy of position measurement, the pixel electrodes are miniaturized and the number of signal lines is increased.
- the existing radiation detector using the charge-accumulation two-dimensional semiconductor device cannot specify the incident time and energy of the radiation from the transferred image signals.
- Some embodiments comprise a radiation detector that includes a charge-accumulation two-dimensional semiconductor device and that can specify an incident time and energy of radiation after transfer of an image signal, and a Compton camera including the radiation detector.
- a radiation detector includes a semiconductor substrate and electrodes disposed on both sides of the semiconductor substrate, and includes a plurality of charge accumulation units inside the semiconductor substrate.
- the plurality of charge accumulation units is each configured to accumulate charges generated by radiation incident on the semiconductor substrate.
- the charges accumulated in the charge accumulation units are readable to outside through at least one of the electrodes.
- FIG. 1 is a schematic diagram illustrating a configuration of an X-ray detector according to a first exemplary embodiment.
- FIG. 2 is a plan view of the X-ray detector according to the first exemplary embodiment.
- FIG. 3 is a schematic diagram illustrating a configuration of an X-ray detector according to a second exemplary embodiment.
- FIG. 4 is a plan view of an X-ray detector according to a third exemplary embodiment.
- FIG. 5 is a schematic diagram illustrating a configuration of an X-ray detector according to a fourth exemplary embodiment.
- FIG. 6 is a schematic diagram illustrating a configuration of a Compton camera according to a fifth exemplary embodiment.
- FIG. 7 is a timing chart of operation by the Compton camera according to the fifth exemplary embodiment.
- the X-ray detector 1 includes a semiconductor substrate 3 that is a layer that is sensitive to an X-ray, as illustrated by X-rays 2 ( 2 a and 2 b ) in FIG. 1 , and front-surface electrodes 4 a and 4 b (both may collectively referred to as front-surface electrode 4 ) and a back-surface electrode 9 formed on front and back surfaces of the semiconductor substrate 3 , respectively.
- the plurality of front-surface electrodes 4 a and 4 b is provided on the surface of the semiconductor substrate 3 on which an X-ray is incident (radiation incident side).
- the X-ray detector 1 is a two-dimensional semiconductor device using a silicon (Si) substrate, such as a complementary metal-oxide semiconductor (CMOS) and a charge coupled device (CCD).
- CMOS complementary metal-oxide semiconductor
- CCD charge coupled device
- the front-surface electrodes 4 a and 4 b are grounded through ammeters 5 a and 5 b (both may collectively referred to as ammeter 5 ) and voltage sources 6 a and 6 b (both may collectively referred to as voltage source 5 ), respectively.
- the voltage sources 6 a and 6 b may be commonized.
- the photoelectrons 7 move inside the semiconductor substrate 3 while generating electrons 11 and electron holes 12 , lose energy, and then stop.
- the number of generated electrons 11 and the number of generated electron holes 12 are each proportional to the energy of the photoelectrons 7 .
- An electric field is formed in the semiconductor substrate 3 through the voltage source 6 .
- the electron holes 12 move to the surface on which the X-ray 2 a is incident and flow to the ground through the ammeter 5 a , and a time Ta and a current Ia detected by the ammeter 5 a are recorded.
- the electrons 11 move to the surface opposite to the surface on which the X-ray 2 a is incident, and are accumulated in capacitors (charge accumulation units) 8 that are arranged in a matrix.
- the back-surface electrode 9 is provided on the surface opposite to the incident surface for the X-ray 2 (side opposite to radiation incident side), and is grounded.
- the same number of electron holes as that of electrons accumulated in the capacitors 8 is supplied from the ground to the back-surface electrode 9 .
- the number of electrons accumulated in the capacitors 8 is equal to the number of electron holes flowing to the front-surface electrode 4 a .
- the number of electrons accumulated in the capacitors 8 is measured from an amount of the current Ia.
- the X-ray 2 b is incident on the semiconductor substrate 3 before the X-ray 2 a is incident on the semiconductor substrate 3 and the electrons are accumulated in a capacitor 8 b , and an incident time Tb and a current Ib of the X-ray 2 b are recorded by the ammeter 5 b as with the X-ray 2 a.
- FIG. 2 is a plan view of the X-ray detector 1 as viewed from the X-ray incident surface.
- the capacitors 8 in which the charges have been accumulated are illustrated with hatched lines.
- the hatched capacitors 8 indicate a track of the photoelectrons, and a total charge accumulation amount of the capacitors corresponds to the energy of the incident X-ray.
- the charge accumulation amount of each of the capacitors 8 is read through a signal line 10 after the X-ray is measured for a predetermined time, the track of the photoelectrons is imaged and an incident position of the X-ray is specified.
- a charge accumulation time of each of the capacitors 8 cannot be specified from the image. Therefore, an incident time for the X-ray also cannot be specified.
- the time at which the X-ray is incident on the respective front-surface electrodes 4 a and 4 b is specified through measurement of the times Ta and Tb when the current flows through the respective electrodes 4 a and 4 b , since the front-surface electrode 4 includes the plurality of front-surface electrodes 4 a and 4 b , and the front-surface electrodes 4 a and 4 b are each associated with the corresponding positions of the capacitors 8 .
- the X-ray detector 1 has the following advantages in addition to specification of the incident time for each of the X-rays.
- a plurality of stripe shaped front-surface electrodes 4 and a plurality of stripe shaped back-surface electrodes 9 are disposed to be orthogonal to each other in a longitudinal direction, as illustrated in FIG. 3 . Incidence of the X-ray on each of intersections between the front-surface electrodes 4 and the back-surface electrodes 9 can be detected by measuring the current flowing through the front-surface electrodes 4 and the current flowing through the back-surface electrodes 9 . This enables the specification of the incident position of the X-ray with high accuracy in real time.
- a resistor layer 13 having four corners is disposed in place of the front-surface electrode 4 , as illustrated in FIG. 4 .
- the resistor layer 13 is a position sensitive device (PSD).
- Currents (I x1 , I x2 , I y1 , and I y2 ) flowing through signal lines connected to the respective corners of the resistor layer 13 vary based on the incident position of the X-ray. The use of this change enables the measurement of the incident position of the X-ray.
- the two-dimensional PSD is illustrated in FIG. 4 , terminals may be provided to one of two pairs of opposite sides to form a one-dimensional PSD.
- a fourth exemplary embodiment will be described below.
- the first to third exemplary embodiments have been described on the premise that the detector is of a direct conversion type, an indirect-conversion detector may be used.
- a front-surface electrode 4 that allows visible light to pass therethrough is provided on the surface on which the X-ray 2 is incident, and the X-ray 2 is converted into visible light by a scintillator 25 disposed on a surface of the front-surface electrode 4 .
- a scintillator 25 a columnar crystal, such as cesium iodide (CsI), or a scintillation fiber is suitable.
- CsI cesium iodide
- a fifth exemplary embodiment will be described below.
- a Compton camera including a radiation detector according to any of the above-described exemplary embodiments is described.
- a first detector 1 functions as a scatter that scatters a gamma ray and that measures a scattering position at which the gamma ray is scattered and energy (energy of recoil electrons) lost in the scattering.
- a second detector 21 measures an absorption position and energy of the scattered gamma ray.
- the second detector 21 is disposed on the back-surface electrode side of the first detector 1 .
- the radiation detector according to any of the above-described exemplary embodiments is applied to the first detector 1 .
- a recoil electron 22 and a scattered gamma ray 23 are generated.
- the recoil electron 22 generates electron holes and electrons, the electrons are accumulated in a capacitor 8 a , and the electron holes flow to the ground through an ammeter 5 a .
- the time Ta and the current Ia therefor are recorded.
- the energy and the position of the recoil electron 22 are determined from the amount of charges accumulated in the capacitor 8 a.
- the scattered gamma ray 23 is absorbed in a scintillator 25 of the second detector 21 , and scintillator light 26 is emitted.
- the scintillator light 26 is detected by a photomultiplier tube array 27 disposed on the back side of the scintillator 25 .
- the photomultiplier tube array 27 includes minute photomultiplier tubes arranged in a matrix, and can obtain signals each proportional to the intensity of the scintillator light from signal lines 28 each connected to the corresponding one of the photomultiplier tubes.
- the absorption position for the scattered gamma ray 23 is detected from these signals with a method such as centroid detection.
- an absorption time, the position, and the energy for the scattered gamma ray 23 are determined through measurement of a current of the signal lines 28 .
- FIG. 7 is a timing chart of the operation by the first detector 1 and the operation by the second detector 21 .
- a gamma ray 2 a incident on the first detector 1 undergoes Compton scattering in the first detector 1
- the scattered gamma ray 23 is incident on the second detector 21 and is detected by the second detector 21 .
- the current Ia and the time Ta are recorded by the ammeter 5 a through a front-surface electrode 4 a .
- energy Ea of the scattered gamma ray is recorded at the time Ta.
- Recording of the track of the recoil electron 22 as an image in the first detector 1 is detected from a signal of the ammeter 5 a .
- Image signals are read through a signal line 10 , and accurate energy of the recoil electron and a position of the recoil electron can be determined. It is unnecessary to read the entire area of the image signals, and it is sufficient to read only an area A corresponding to the front-surface electrode 4 a .
- the incident gamma ray 2 a As described above, as for the incident gamma ray 2 a , the energy of the recoil electron and the position of the Compton scattering point are detected by the first detector 1 , and the energy Ea of the scattered gamma ray and the absorption position of the scattered gamma ray are measured by the second detector 21 .
- This configuration enables the incident direction of the gamma ray 2 a to be determined.
- the occurrence time of the recoil electrons recorded in the image can be determined from the correspondence between the energy of the recoil electrons obtained from the image and the currents in the ammeter.
- the recoil electrons and the scattered gamma rays measured by the first detector 1 and the second detector 2 are associated with each of the gamma rays 2 b 1 and 2 b 2 . This makes it possible to determine the incident direction of each of the gamma rays.
- the scattered gamma ray 23 has been described to be photoelectrically absorbed by the scintillator 25 ; however, the scattered gamma ray 23 may undergo Compton scattering in the scintillator 25 .
- the recoil electron and the scattered gamma ray are generated in the scintillator 25 , and the energy of the recoil electron is received by the photomultiplier tube and signals obtained therefrom are recorded.
- the energy of the scattered gamma ray is released to outside.
- the recoil electron generated when Compton scattering occurs in the first detector 1 may go out of the first detector 1 without stopping inside the first detector 1 .
- the incident direction of the gamma ray cannot be accurately determined because the measured energy of the recoil electron or the scattered gamma ray is inaccurate.
- a sum of energy E e of the recoil electron and energy E g of the scattered gamma ray obtained by the first detector 1 and the second detector 21 is not equal to the energy E 0 of the incident gamma ray within a measurement error range, namely, in a case where the following expression (1) is established, the data is discarded to maintain high detection accuracy of the incident gamma ray:
- FIG. 6 it is assumed that, among the four incident gamma rays, a fourth gamma ray 2 b 3 does not undergoes Compton scattering in the first detector 1 , and is detected by the second detector 21 without losing its energy.
- the energy of the scattered gamma ray has a wide distribution but does not have a sharp peak.
- the distribution of energy Eb 3 of the gamma ray obtained by the second detector 21 is determined based on energy resolution of the second detector 21 and has a peak.
- the energy E 0 of the incident gamma ray is not known in advance, the energy E 0 can be estimated, which makes it possible to discard the data pair based on the expression (1).
- the incidence of the radiation is detected in real time, thus enabling the acquisition of the image signal at the same time as the incidence of the radiation.
- the image signal amount is reduced, resulting in reduction in the transfer time period.
- the exposure amount can be appropriately managed.
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- Life Sciences & Earth Sciences (AREA)
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- High Energy & Nuclear Physics (AREA)
- Molecular Biology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Measurement Of Radiation (AREA)
Abstract
Description
- [1] Since the image of only the area on which the X-ray has been incident can be read, it is possible to reduce a reading time period, and to continuously perform measurement on a pixel not subjected to reading during the reading.
- [2] Since incidence of the X-ray is detected in real time, it is possible to determine the incident position of the X-ray immediately after the incidence, and to eliminate unnecessary image reading.
- [3] Since it can be determined whether an exposure amount has reached a necessary exposure amount by integrating the current flowing through the front-surface electrode 4, it is possible to determine an exposure time period in real time.
|E 0−(E e +E g)|>measurement error. (1)
- (1) Variations of the first to fourth exemplary embodiments include the following embodiments.
- [1] When a current flowing through an electrode or a voltage applied to an electrode exceeds a predetermined value, the exposure is terminated or the two-dimensional image is read. As a result, in a case of a signal having a value equal to or lower than a predetermined value, a two-dimensional image can be read when the number of recoil electrons reaches a predetermined value, and it is possible to avoid unnecessary reading. Further, it is possible to ignore a signal having a value equal to or lower than a noise level.
- [2] It is sufficient to measure a current with the front-surface electrode 4 not being divided, and the incident time for respective X-rays can be determined from the current Ia and the amount of charges accumulated in capacitors.
- [3] The current flowing through the back-
surface electrode 9 and the time thereof may be measured in place of the front-surface electrode 4. - [4] The voltage may be measured to measure a current flowing through an electrode. Further, in a case where the image is read after incidence of a predetermined X-ray dosage, the voltage values generated by respective X-rays may be integrated and the image may be read after the integrated voltage value reaches a predetermined voltage value as with a preamplifier of the radiation detector, since the energy of each of the X-rays is small.
- (2) In a case where the energy of the photoelectrons is high in the first exemplary embodiment, the photoelectrons may not stop only with a
single X-ray detector 1 and leave from the back-surface of theX-ray detector 1. As a result, the energy of the photoelectrons cannot be determined accurately. In such a case, whenmultiple X-ray detectors 1 are stacked, the photoelectrons left from afirst X-ray detector 1 enter anext X-ray detector 1, lose energy, and then stop. It can be regarded that the electrons and the electron holes are generated at the same time among theseX-ray detectors 1 because the velocity of the photoelectrons is close to the velocity of light. Thus, the energy of the photoelectrons is accurately determined by summing the energy of the photoelectrons that is generated at the same time and is recorded in the ammeter in each of theX-ray detectors 1 or the energy of the photoelectrons calculated from the image in each of theX-ray detectors 1. - (3) Although the combination of the scintillator and the photomultiplier tube array is described as the
second detector 21 in the fifth exemplary embodiment, the radiation detector according to any of the exemplary embodiments may be used.
Claims (11)
|E 0−(E e +E g)|>measurement error,
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| Application Number | Priority Date | Filing Date | Title |
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| JP2018-138768 | 2018-07-24 | ||
| JP2018138768A JP7182930B2 (en) | 2018-07-24 | 2018-07-24 | radiation detector |
| JPJP2018-138768 | 2018-07-24 |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US4641165A (en) * | 1982-04-28 | 1987-02-03 | Tokyo Shibaura Denki Kabushiki Kaisha | Dynamic memory device with an RC circuit for inhibiting the effects of alpha particle radiation |
| US5138415A (en) * | 1988-11-07 | 1992-08-11 | Kabushiki Kaisha Toshiba | Photo-semiconductor device with a zero-cross function |
| JPH08148712A (en) | 1994-11-25 | 1996-06-07 | Hitachi Ltd | Light and charged particle detector |
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| US7459688B2 (en) | 2005-03-11 | 2008-12-02 | Sumitomo Heavy Industries, Ltd. | Radiation detection circuit and apparatus for radiographic examination |
| US20140284488A1 (en) | 2013-03-21 | 2014-09-25 | Kabushiki Kaisha Toshiba | Radiation detector, radiation detection module and radiation detection method |
| US20160326927A1 (en) * | 2015-05-08 | 2016-11-10 | Toyota Jidosha Kabushiki Kaisha | Exhaust gas purification apparatus of internal combustion engine |
| JP2017026524A (en) | 2015-07-24 | 2017-02-02 | 三菱重工業株式会社 | Radiation measurement apparatus and radiation measurement method |
| US20170146480A1 (en) * | 2015-11-24 | 2017-05-25 | Toyota Jidosha Kabushiki Kaisha | Sulfur oxides detection system |
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| JP3923186B2 (en) * | 1998-07-21 | 2007-05-30 | 三菱電機株式会社 | Radiation detector |
| JP4452838B2 (en) * | 2006-11-01 | 2010-04-21 | 国立大学法人東北大学 | Semiconductor detector block and positron emission tomography apparatus using the same |
| JP2010012056A (en) * | 2008-07-04 | 2010-01-21 | Hitachi Ltd | Charged particle beam irradiation system |
| JP5657491B2 (en) * | 2011-08-31 | 2015-01-21 | 富士フイルム株式会社 | Radiation image capturing apparatus, radiation image capturing system, radiation image capturing program, and radiation image capturing method |
| US9784857B2 (en) * | 2014-09-05 | 2017-10-10 | Riken | Imaging device and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4641165A (en) * | 1982-04-28 | 1987-02-03 | Tokyo Shibaura Denki Kabushiki Kaisha | Dynamic memory device with an RC circuit for inhibiting the effects of alpha particle radiation |
| US5138415A (en) * | 1988-11-07 | 1992-08-11 | Kabushiki Kaisha Toshiba | Photo-semiconductor device with a zero-cross function |
| JPH08148712A (en) | 1994-11-25 | 1996-06-07 | Hitachi Ltd | Light and charged particle detector |
| JP2000111651A (en) | 1998-09-30 | 2000-04-21 | Shimadzu Corp | Radiation two-dimensional detector |
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| JP7182930B2 (en) | 2022-12-05 |
| US20200033487A1 (en) | 2020-01-30 |
| JP2020016508A (en) | 2020-01-30 |
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