US1109181A - Electrogalvanizing solution. - Google Patents

Description

UNITED sTAT s ra rnnr orrrcn.

GUIDO SACERDOTE, OF NEW YORK, N. Y., ASSIGNOR TO THE METAL TREATING & EQUIPMENT 00., ING, OF NEW YORK, N. Y.

x ELECTROGALVANIZING SOLUTION.

No Drawing.

To all whom it may concern:

Be it known that I, GiTIDo SAcEnDo'rn, a subject of the King of Italy, and a resident of the borough of Manhattan of the city of New York, in the county and State of New York. have invented certain new and useful mit the zinc to enter readily into solutionfrom a zinc anode and to be freely deposited upon the metal being coated at the cathode. 'lhe devolpment of gases around the anode and cathode respectively are particularly to be avoided in electro-galvanizing, for in the one case they interfere withv the free discharge of zinc from the anode into the electrolyte, and in the other case with the free and uniform deposition of the zinc at the cathode. The present improved solution has been devised with particular reference to checking the formation of such gases or to the taking care of them immediately as they are developed, so that the anode and cathode. may be. freely and directly exposed at all times to the electrolyte and the action of the electric current.

In compounding the improved solution, I take five parts of iron sulfate, for which either the ferric or ferrous salt may be used, and after dissolving the same in a sufficient quantity of water, I add thereto three parts of either zinc or aluminum acetate also dissolved in a suilicient quantity of water. Then I- add four hundred parts of zinc sulfate and six parts of aluminum sulfate, both of these salts being preferably dissolved in *ater before being compounded with the other ingredients. Thereafter, I add enough water to give the solution the requisite density which, of course, may be varied to suit different conditions. here an exceedingly smooth surface is required, inlithographic work forinstance, the density of the solution should not be over 20 degrees Baum, while for ordinary uses it. should generally be from about 28 degrees to 33 degrees In order to assist in the free deposition of the Zinc at the cathode, I may add to the foregoing solution from two to six parts of manganese sulfate, the same being prefer- Specification of Letters Patent.

Patented Sept. 1 1914.

Application filed July 21. 1909. Serial No. 508,822.

ably dissolved in a. sullicient quantiy of water. The finished solution should have substantially the following composition upon analysis: zinc 38.00 to 127.50 parts,

iron 1.40 to 7.70 parts. aluminum 0.80 to 5.05 parts, 93% sulfuric acid (55.00 to 222.50 parts, manganese 0.00 to 2.50 parts. glacial acetic acid 1.24 to 6.20 parts, water 803.50 to 027.65 parts, the proportions of each ingredient being so adjusted that a substantially neutral or only slightly acid mixture results.

It will be understood that a solution analyzing as above may be compounded otherwise than hereinbefore set forth and that therefore the invention is not limited to the stated manner of compounding. It will also be understood that the present. improved solution may be used for plating with other metals thanzinc, by substituting a suitable salt of the metal to be emploved for the zinc sulfate. Finally, it should be stated that in place of iron, the solution may contain chro mium or manganese compounded in the same manner.

Acetic property of acetates of improving the smoothness of the plating is a property of salts of organic acids. The absence of alkali salts in the plating solution, as shown by the formulae given above. is advantageous especially Where the solution does not contain manganese, since under such conditions there seems to be less tendency for aluminum to precipitate out than where alkali salts are present to any material extent. Better results are obtained in the absence of substantial quantities of alkali salts even when compounds of manganese are present, although with manganese compounds present the omission of alkali salts is not so important.

I claim as my invention:

1. An electroplating solution comprising, in water solution, a salt of the metal to be deposited, together with salts of iron, aluminum and manganese with acetic and sulfuric acids.

2. An electroplating solution comprising, in water solution, a salt of the metal to be deposited, together with salts of iron, aluminum and manganese with sulfuric acid and an organic acid.

3. An electroplating solution comprising, in water solution, a salt of the metal to be deposited, together with salts of iron and :llllllllllllll'l with sulfuric acid and an organic acid, said solution being substantially free of alkali salts.

4. Au electroplating solution comprising, in water solution, a salt of the metal to be deposited, together with a sulfate of iron and acetate of aluminum, said solution being substantially free of alkali salts.

5. An electroplating solution comprising, in water solution, salts of iron, aluminum and the metal to be deposited with sulfuric and acetic acids, said solution being substantially free of alkali salts.

(S, An electrogalvanizing solution comprising salts of iron, zinc, aluminum and manganese with acetic and sulfuric acids in *ater solution.

7. An electrogalvanizing solution com prising salts of iron, zinc, aluminum and manganese with sulfuric acid and an organic acid, dissolved in water.

8. An electrogalvanizing solution comprising salts of zinc, iron and aluminum with sulfuric acid and an organic acid in water solution, said solution being substantially free of alkali salts.

9. An electrogalvanizing solution comprising salts of zinc, iron and aluminum with sulfuric and acetic acids in Water solution, said solution being substantially free of alkali salts.

This specification signed and witnessed this 15th day of July, A. D., 1909.

GUIDO SAOERDOTE.

Signed in the presence of G. MoGnANN, Minus E. TARYEY.