US1097926A - Solder-solvent. - Google Patents

Solder-solvent. Download PDF

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Publication number
US1097926A
US1097926A US66069811A US1911660698A US1097926A US 1097926 A US1097926 A US 1097926A US 66069811 A US66069811 A US 66069811A US 1911660698 A US1911660698 A US 1911660698A US 1097926 A US1097926 A US 1097926A
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United States
Prior art keywords
solder
metal
solvent
molten
composition
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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US66069811A
Inventor
William Fredrick Koper
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Individual
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Individual
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Priority to US66069811A priority Critical patent/US1097926A/en
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Publication of US1097926A publication Critical patent/US1097926A/en
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B1/00—Preliminary treatment of ores or scrap
    • C22B1/14—Agglomerating; Briquetting; Binding; Granulating
    • C22B1/24—Binding; Briquetting ; Granulating
    • C22B1/2406—Binding; Briquetting ; Granulating pelletizing

Definitions

  • My invention relates to an improvement in solvents for solder, and the object is to provide a compound for removing all impurities and grit from solder, which would cause the solder to become useless for the purposes for which it is intended.
  • composition of matter consists of:
  • a tablet or water is dropped into the metal after the metal has been heated to a molten state.
  • the temperature of the molten metal should not be excessive but to a temperature suificient to char a piece of paper dark brown.
  • the molten metal is thoroughly agitated while the wafer is dissolving so as to bring all of the metal Specification of Letters Patent.
  • ammonium chlorid and rosin serve to prevent oxidation of the metals, and the tallow and paraffin assist in making a paste as well as acting as reducing agents, while the sulfur forms a molten flux on the surface of the bath to entrain the oxidized compounds floating thereon. If solder is being used, for instance, and some impurity or foreign sub stance should get into the metal, when it is ready for use, it would be useless, and would have to be thrown away, but by dissolving a wafer therein containing the composition above set forth, the impurities can be re moved, and thereby save the molten metal.
  • composition of matter for purifying metals in a molten state consisting of ammonium chlorid, sulfur, rosin, paraflin, mutton tallow, salt and red alkanet root.
  • composition of matter for purifying metals in a molten state consisting of ammonium chlorid 29%, sulfur 43%, rosin 2%, paraflin 9%, mutton tallow 11%, salt 5%, red alkanet root 1%.

Description

WILLIAM FREDRICK KOPER, OF CHILLICOTHE, OHIO.
SOLDER-SOLVENT.
noamaae.
N 0 Drawing.
To all whom it may concern:
Be it known that 1, WILLIAM F. Koren, a citizen of the United States, residing at Chillicothe, in the county of Ross and State of Ohio, have invented certain new and useful Improvements in Solder-Solvents, of which the following is a specification.
My invention relates to an improvement in solvents for solder, and the object is to provide a compound for removing all impurities and grit from solder, which would cause the solder to become useless for the purposes for which it is intended.
The composition of matter consists of:
Ammonium chlorid- 29 per cent. Sulfur 43 Rosin 2 Parai'lin 9 Mutton tallow l1 Salt 5 Red alkanet root l which are all commingled together and made preferably into tablet form.
When it is desired to clean or purify a pot of metal such as solder, Babbitt metal and the like, a tablet or water is dropped into the metal after the metal has been heated to a molten state. The temperature of the molten metal should not be excessive but to a temperature suificient to char a piece of paper dark brown. Then after the wafer is inserted into the molten metal, the molten metal is thoroughly agitated while the wafer is dissolving so as to bring all of the metal Specification of Letters Patent.
Application filed November 16, 1911.
Patented May 26, 1914.
Serial No. 860,698.
in contact with the composition, and thereby destroy all impurities in the molten metal. The ammonium chlorid and rosin serve to prevent oxidation of the metals, and the tallow and paraffin assist in making a paste as well as acting as reducing agents, while the sulfur forms a molten flux on the surface of the bath to entrain the oxidized compounds floating thereon. If solder is being used, for instance, and some impurity or foreign sub stance should get into the metal, when it is ready for use, it would be useless, and would have to be thrown away, but by dissolving a wafer therein containing the composition above set forth, the impurities can be re moved, and thereby save the molten metal.
Having fully described my invention, what I claim as new and desire to secure by Letters Patent, is
1. A composition of matter for purifying metals in a molten state, consisting of ammonium chlorid, sulfur, rosin, paraflin, mutton tallow, salt and red alkanet root.
2. A composition of matter for purifying metals in a molten state, consisting of ammonium chlorid 29%, sulfur 43%, rosin 2%, paraflin 9%, mutton tallow 11%, salt 5%, red alkanet root 1%.
In testimony whereof I aifix my signature, in the presence of two witnesses.
M. FREDRICK KOPER.
Witnesses:
JOHN FERDINAND BURDIGK, G120. P. OBERMEYER.
Copies of this patent may be obtained for five cents each, by addressing the Commissioner of Patents, Washington, I). 0.
US66069811A 1911-11-16 1911-11-16 Solder-solvent. Expired - Lifetime US1097926A (en)

Priority Applications (1)

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US66069811A US1097926A (en) 1911-11-16 1911-11-16 Solder-solvent.

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US66069811A US1097926A (en) 1911-11-16 1911-11-16 Solder-solvent.

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US1097926A true US1097926A (en) 1914-05-26

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US66069811A Expired - Lifetime US1097926A (en) 1911-11-16 1911-11-16 Solder-solvent.

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2467780A (en) * 1947-01-13 1949-04-19 Reinhold Otto Fred Method of making a metallic aluminum solder
US2694023A (en) * 1950-04-08 1954-11-09 Kellogg M W Co Metal treating flux
US2796345A (en) * 1952-03-31 1957-06-18 Sightmaster Of Califoruia Comp Process of producing lead-zinc alloys
US3607233A (en) * 1967-12-01 1971-09-21 Metallurgical Processes Ltd Purification of zinc

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2467780A (en) * 1947-01-13 1949-04-19 Reinhold Otto Fred Method of making a metallic aluminum solder
US2694023A (en) * 1950-04-08 1954-11-09 Kellogg M W Co Metal treating flux
US2796345A (en) * 1952-03-31 1957-06-18 Sightmaster Of Califoruia Comp Process of producing lead-zinc alloys
US3607233A (en) * 1967-12-01 1971-09-21 Metallurgical Processes Ltd Purification of zinc

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