US1033604A - Art of electrotyping. - Google Patents

Art of electrotyping. Download PDF

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Publication number
US1033604A
US1033604A US603297A US1911603297A US1033604A US 1033604 A US1033604 A US 1033604A US 603297 A US603297 A US 603297A US 1911603297 A US1911603297 A US 1911603297A US 1033604 A US1033604 A US 1033604A
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United States
Prior art keywords
shell
portions
mold
copper
art
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Expired - Lifetime
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US603297A
Inventor
Milton A Mckee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CB Cottrell and Sons Co
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Individual
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Filing date
Publication date
Priority claimed from US59326910A external-priority patent/US1033435A/en
Application filed by Individual filed Critical Individual
Priority to US603297A priority Critical patent/US1033604A/en
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Expired - Lifetime legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/12—Printing plates or foils; Materials therefor non-metallic other than stone, e.g. printing plates or foils comprising inorganic materials in an organic matrix

Definitions

  • This invention relates to the art of electrotyping and has for itsobject to provide an electrotype plate the shell of which has its high or printing portions formed thicker than its low portions, whereby the low portions of the shell which make no printing impression may be made very thin and thus effect a large saving of copper, while the high or printing portions may be made thick for materially strengthening the shell and thereby the plate at such points.
  • This result may be accomplished by depositing an additional amount of copper on to the backs of the raised or printing portions of the electrotype plate.
  • the -method of producing the electrotype plate is illustrated inthe accompanying drawings, in which,
  • Figure 1 illustrates an ordinary electrodeposit bath tank in section.
  • Fig. 2 is a face view of a mold after a thin coating of copper has been applied thereto in the bath.
  • Fig. 3 is a longitudinal section taken in the plane of the line A-A of Fig. 2.
  • Fig. 4 is a face view of the mold after a coating has been applied thereto on that portion upon which no further deposit of co 'per is desired,
  • Fig. 5 is a longitudinal section through the same in the plane of the 'line HB---B of Fig. 4, Fig.
  • Fig. 6 is asimilar section showing the mold after the same has been subjected to a further treatment in the bath ytank for depositing an additional amount of copper on the back of the raised rvprinting surface of the shell
  • Fig. 7V is a section similar to Fig. 6,' with the mold removed from the shell
  • Figa 8 is a view of the printing face of the completed plate
  • Fig. 9 is a longitudinal section taken in the plane of the -line C-C of Fig. 8.
  • the mold l on its board 2 is iirst immersed in the liquid 3 contained in the bath tank 4 a suiiicient time to permit the deposit of a copper coating of a .desired thickness thereon.
  • the mold is then removed from its bath and those portions of the shell 5 upon which it is desired to prevent a further deposit of copper are coated with a deposit resisting materlal 6, such, for instance, as lithographers ink.l
  • a deposit resisting materlal 6 such, for instance, as lithographers ink.l
  • the mold, with its partially completed shell 5, is then again immersed in the liquid bath 3, and a Afurther deposit of the copper is permitted onl the uncoated portions of the shell, which, in the present instance, would be upon the backs or under the raised or printing portions of the shell.
  • the mold is again removed from its liquid bath and the shell removed in the usual manner from the mold.
  • the shell may then have cast thereon the usual backing of metal 7, to complete the plate.

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  • Printing Plates And Materials Therefor (AREA)
  • Printing Methods (AREA)

Description

M. A. MOKEE.
ART 0F ELBGTROTYPING.
APPLIOATION FILED 11111.18, 1911.
1,033,604. Patented July 23, 1912.
UNITED sTATEs PATENT oFFicE.
MILTON A. MOKEE, OF WESTERIY, RHODE ISLAND, ASSIG-NOR TO C. B. COTTRELL & SONS COMPANY, OF NETT YORK, N. Y., A CORPORATION OF NEW JERSEY.
ART OF ELEGTROTYPING.
-Specication of Letters Patent.
Patented July 23, 1912.
Original application filed November 19, 1910, Serial No. 593,269. Divided and this application filed January 18, 1911. Serial No. 603,297.
To all whom it may concern:
Be it known that I, MILTON A. MCKEE, a citizen of the United States, and resident of Westerly in the county of Washington and Y State of Rhode Island, have invented a new and useful Improvement in the Art of Electrotyping, of which the following is a specication.-
This invention relates to the art of electrotyping and has for itsobject to provide an electrotype plate the shell of which has its high or printing portions formed thicker than its low portions, whereby the low portions of the shell which make no printing impression may be made very thin and thus effect a large saving of copper, while the high or printing portions may be made thick for materially strengthening the shell and thereby the plate at such points. This result may be accomplished by depositing an additional amount of copper on to the backs of the raised or printing portions of the electrotype plate. The -method of producing the electrotype plate is illustrated inthe accompanying drawings, in which,
Figure 1 illustrates an ordinary electrodeposit bath tank in section., Fig. 2 is a face view of a mold after a thin coating of copper has been applied thereto in the bath. Fig. 3 is a longitudinal section taken in the plane of the line A-A of Fig. 2. Fig. 4 is a face view of the mold after a coating has been applied thereto on that portion upon which no further deposit of co 'per is desired, Fig. 5 is a longitudinal section through the same in the plane of the 'line HB---B of Fig. 4, Fig. 6 is asimilar section showing the mold after the same has been subjected to a further treatment in the bath ytank for depositing an additional amount of copper on the back of the raised rvprinting surface of the shell, Fig. 7V is a section similar to Fig. 6,' with the mold removed from the shell, Figa 8 is a view of the printing face of the completed plate, and Fig. 9 is a longitudinal section taken in the plane of the -line C-C of Fig. 8.
In producing my improved `plate by the` method herein disclosed, the mold l on its board 2 is iirst immersed in the liquid 3 contained in the bath tank 4 a suiiicient time to permit the deposit of a copper coating of a .desired thickness thereon. The mold is then removed from its bath and those portions of the shell 5 upon which it is desired to prevent a further deposit of copper are coated with a deposit resisting materlal 6, such, for instance, as lithographers ink.l The mold, with its partially completed shell 5, is then again immersed in the liquid bath 3, and a Afurther deposit of the copper is permitted onl the uncoated portions of the shell, which, in the present instance, would be upon the backs or under the raised or printing portions of the shell. After a requisite amount of copper has been deposited on these uncoated portions of the shell, the mold is again removed from its liquid bath and the shell removed in the usual manner from the mold. The shell may then have cast thereon the usual backing of metal 7, to complete the plate.
In a plate formed according to this present invention the low portions of the shell high or printmg. portions of which are.
formed thicker than the low or non-printing vportions by the electrodeposit of an additional amount of copper on to the back of the shell in said high or printing portions.
In'testimony, that I claim the foregoing as my invention, `I have signed my name in presence of two witnesses, this 16th day of January 1911.'v
, MILTON A. MCKEE.
Witnesses:
F. GEORGE BARRY, HENRY C. THIEME.
US603297A 1910-11-19 1911-01-18 Art of electrotyping. Expired - Lifetime US1033604A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US603297A US1033604A (en) 1910-11-19 1911-01-18 Art of electrotyping.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59326910A US1033435A (en) 1910-11-19 1910-11-19 Art of electrotyping.
US603297A US1033604A (en) 1910-11-19 1911-01-18 Art of electrotyping.

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US1033604A true US1033604A (en) 1912-07-23

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