US1028895A - Electrolytic deposition of metals. - Google Patents
Electrolytic deposition of metals. Download PDFInfo
- Publication number
- US1028895A US1028895A US67918212A US1912679182A US1028895A US 1028895 A US1028895 A US 1028895A US 67918212 A US67918212 A US 67918212A US 1912679182 A US1912679182 A US 1912679182A US 1028895 A US1028895 A US 1028895A
- Authority
- US
- United States
- Prior art keywords
- metals
- electrolytic deposition
- sodium
- metal
- borobenzoate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
Definitions
- T 0 all whom it may concern.
- This invention relates to the electrolytic deposition of old, silver, platinum, copper, zinc, nickel, tin and lead or alloys thereof upon metal surfaces, and more particularly to the deposition of said metals or alloys upon iron or steel surfaces.
- the electrolyte to be employed in the plating bath is prepared by dissolving the salt of the metal (or the salts of the metals as the case may be) to be deposited in an aqueous solution of sodium or potassium glyceroborobenzo-ate (by preference sodium glyceroborobenzoate)
- sodium biborate (borax) is extensively used in autogeneous or allogeneous soldering operations as a reducing agent or flux as it easily dissolves metallic oxids.
- the reducing agent present in an electrolyte will dissolve any oxid, present on the surface of the article, which would detrimentally affect the adherence of the electrolytic deposit and this without affecting the surface of the article.
- the electrolyte prepared in accordance with this invention, pickles the article (i. e. removes any scale or oxid present on its surface) .concurrently with the deposition thereon of the metal in solution in the electrolyte, from which it follows that the adherence of the metal coating deposited on the article is considerably increased.
- Sodium glyeero-borobenzoate may be prepared by mixing together equal parts (by weight) of sodium boroglycerid and sodium borobenzoate, both of which preparations are easily obtainable.
- the electrolyte for depositing a single metal may be prepared by dissolving a salt or salts of the metal in an aqueous solution of sodium glycero-borobenzoate (say in the proportion of two thirds of the former to the respective metals constituting the alloy.
- the step of preparing an electrolyte for the plating bath which consists in dissolving in an aqueous solution of sodium glycero-borobenzoate a salt of the metal to be deposited.
Description
UNITED STATES PATENT OFFICE.
PASCAL MARINO, OF REGENTS PARK, LONDON, ENGLAND.
ELECTROLYTIC DEPOSITION OF METALS.
No Drawing. I
T 0 all whom it may concern.
Be it known that I, PASCAL MARINo, a subject of the King of Italy, and resident of 129 Albert street, Park street, Regents Park, London, N. W., England, have in vented certain new and useful Improve ments in the Electrolytic Deposition of Metals, Particularly upon Iron and Steel Surfaces, of which the following is a specification.
This invention relates to the electrolytic deposition of old, silver, platinum, copper, zinc, nickel, tin and lead or alloys thereof upon metal surfaces, and more particularly to the deposition of said metals or alloys upon iron or steel surfaces.
According to the present invention the electrolyte to be employed in the plating bath is prepared by dissolving the salt of the metal (or the salts of the metals as the case may be) to be deposited in an aqueous solution of sodium or potassium glyceroborobenzo-ate (by preference sodium glyceroborobenzoate) Sodium biborate (borax) is extensively used in autogeneous or allogeneous soldering operations as a reducing agent or flux as it easily dissolves metallic oxids. Similarly, the reducing agent present in an electrolyte will dissolve any oxid, present on the surface of the article, which would detrimentally affect the adherence of the electrolytic deposit and this without affecting the surface of the article. Hence the electrolyte, prepared in accordance with this invention, pickles the article (i. e. removes any scale or oxid present on its surface) .concurrently with the deposition thereon of the metal in solution in the electrolyte, from which it follows that the adherence of the metal coating deposited on the article is considerably increased.
Specification of Letters Patent.
Application filed February 21, 1912. Serial No. 679,182.
Patented June 11, 1912.
Sodium glyeero-borobenzoate may be prepared by mixing together equal parts (by weight) of sodium boroglycerid and sodium borobenzoate, both of which preparations are easily obtainable.
The electrolyte for depositing a single metal may be prepared by dissolving a salt or salts of the metal in an aqueous solution of sodium glycero-borobenzoate (say in the proportion of two thirds of the former to the respective metals constituting the alloy.
When in the appended claim I speak of sodium glycero-borobenzoate, I desire to include also its well known equivalents, such as potassium glycero-borobenzoate. It will be further understood that when I speak of the metal to be deposited I mean to include a mixture of metals, as in the form of an alloy, and when I refer to a salt of the metal, I mean to include salts of the metals forming the mixture.
Claim.
In the process of electrolytically depositing metals, the step of preparing an electrolyte for the plating bath which consists in dissolving in an aqueous solution of sodium glycero-borobenzoate a salt of the metal to be deposited.
PASCAL MARINO.
Witnesses:
GEORGE Ennns'r MINTERN, BERTRAM Earn.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US67918212A US1028895A (en) | 1912-02-21 | 1912-02-21 | Electrolytic deposition of metals. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US67918212A US1028895A (en) | 1912-02-21 | 1912-02-21 | Electrolytic deposition of metals. |
Publications (1)
Publication Number | Publication Date |
---|---|
US1028895A true US1028895A (en) | 1912-06-11 |
Family
ID=3097188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US67918212A Expired - Lifetime US1028895A (en) | 1912-02-21 | 1912-02-21 | Electrolytic deposition of metals. |
Country Status (1)
Country | Link |
---|---|
US (1) | US1028895A (en) |
-
1912
- 1912-02-21 US US67918212A patent/US1028895A/en not_active Expired - Lifetime
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3032436A (en) | Method and composition for plating by chemical reduction | |
JPH11217690A (en) | Electroplating palladium alloy composition and electroplating method using the composition | |
WO2010009225A1 (en) | Cyanide free electrolyte composition for the galvanic deposition of a copper layer | |
US3230098A (en) | Immersion plating with noble metals | |
US20080138528A1 (en) | Method for Depositing Palladium Layers and Palladium Bath Therefor | |
JP2014519555A (en) | Electrolyte, its use for the deposition of black ruthenium coating and the coating so obtained | |
JPWO2014010662A1 (en) | Electroless gold plating method and gold plating coating material | |
US5391402A (en) | Immersion plating of tin-bismuth solder | |
JP3711141B1 (en) | Method for forming Sn-Ag-Cu ternary alloy thin film | |
GB1293356A (en) | Method for the electrolytic deposition of gold alloys and aqueous plating bath therefor | |
JP2009149965A (en) | Silver-plating method | |
TW538144B (en) | Tin-indium alloy electroplating solution | |
US1028895A (en) | Electrolytic deposition of metals. | |
Nakano et al. | Electrodeposition behavior of Zn–Co alloys from an alkaline zincate solution containing triethanolamine | |
US4167459A (en) | Electroplating with Ni-Cu alloy | |
JP4992434B2 (en) | Gold plating solution and gold plating method | |
KR102295180B1 (en) | Ag-Nano Alloy Plating Solution Compositions for Improving of Conductivity and Durability and Plating Methods Using Thereof | |
US3305389A (en) | Process of coating lead with tin | |
US1535339A (en) | Process for electrolytically depositing elemental chromium upon metals | |
JPH10330950A (en) | Modified double replacement-type plated metal material and its production | |
US2871172A (en) | Electro-plating of metals | |
US4470886A (en) | Gold alloy electroplating bath and process | |
JP5544617B2 (en) | Electroless plating method of alloy film and plating solution | |
US1042533A (en) | Method of electroplating. | |
JPS59133394A (en) | Palladium high speed plating bath and process |