UA73190U - Dermatome with sector mechanism for cutting thin meshed epidermis-translocalizing autodermograft with 1-3 ratio of area increase
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Dermatome with sector mechanism for cutting thin meshed epidermis-translocalizing autodermograft with 1-3 ratio of area increase
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Application filed by Валерий Васильевич КоптюхfiledCriticalВалерий Васильевич Коптюх
Priority to UAU201203841UpriorityCriticalpatent/UA73190U/en
Publication of UA73190UpublicationCriticalpatent/UA73190U/en
Perforating, Stamping-Out Or Severing By Means Other Than Cutting
(AREA)
Abstract
A dermatome with sector mechanism for cutting thin meshed epidermis-translocalizing autodermograft with 1-3 ratio of area increase contains half-cylinder, the operating surface of half-cylinder, the axis of frame, the flat knife installed in parallel to operating surface. The gap between the operating surface of half-cylinder and the knife is adjustable. The technological plate onto the semicircles of the dermatome generates half-cylinder on the operating surface. The operating surface contains the linear cusps in length with spacing of , in height, in width, with the distance between the cusps of . The cusps are displaced by 50 % relative to each other. The operating surface is made of plastic. An autodermograft is cut by over the base together with donor skin with the linear fragmented cusps.
UAU201203841U2012-03-292012-03-29Dermatome with sector mechanism for cutting thin meshed epidermis-translocalizing autodermograft with 1-3 ratio of area increase
UA73190U
(en)