UA40679C2 - Chip card module (versions) - Google Patents

Chip card module (versions)

Info

Publication number
UA40679C2
UA40679C2 UA99074039A UA99074039A UA40679C2 UA 40679 C2 UA40679 C2 UA 40679C2 UA 99074039 A UA99074039 A UA 99074039A UA 99074039 A UA99074039 A UA 99074039A UA 40679 C2 UA40679 C2 UA 40679C2
Authority
UA
Ukraine
Prior art keywords
chip card
card module
semiconductor chips
versions
gluing layer
Prior art date
Application number
UA99074039A
Other languages
Russian (ru)
Ukrainian (uk)
Inventor
Детлеф Удо
Штефан Еммерт
Штефан ЭММЕРТ
Ханс-Георг МЕНШ
Original Assignee
Сіменс Акцієнгезельшафт
Сименс Акциенгезельшафт
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Сіменс Акцієнгезельшафт, Сименс Акциенгезельшафт filed Critical Сіменс Акцієнгезельшафт
Publication of UA40679C2 publication Critical patent/UA40679C2/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06513—Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06517—Bump or bump-like direct electrical connections from device to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06575—Auxiliary carrier between devices, the carrier having no electrical connection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06582—Housing for the assembly, e.g. chip scale package [CSP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]

Abstract

The invention relates to a chip card module where one or several semiconductor chips and/or a bracing frame are fixed by means of special glue. The purpose of the invention is the development of a chip card module in which one or several semiconductor chips and/or bracing frames are pasted on a cushion with the maintenance of a preset and basically uniform in the entire area of cementing distance with the least possible thickness of a gluing layer. Moreover, the gluing layer has to compensate deformations of the chip card module within certain limits, by virtue of what the possibility of the damage of semiconductor chips and bracing frames is diminished.
UA99074039A 1997-01-15 1997-11-18 Chip card module (versions) UA40679C2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19701165A DE19701165C1 (en) 1997-01-15 1997-01-15 Chip card module
PCT/DE1997/002701 WO1998032098A1 (en) 1997-01-15 1997-11-18 Chip card module

Publications (1)

Publication Number Publication Date
UA40679C2 true UA40679C2 (en) 2001-08-15

Family

ID=7817439

Family Applications (1)

Application Number Title Priority Date Filing Date
UA99074039A UA40679C2 (en) 1997-01-15 1997-11-18 Chip card module (versions)

Country Status (12)

Country Link
US (1) US6421248B1 (en)
EP (1) EP0953186B1 (en)
JP (1) JP3428657B2 (en)
KR (1) KR20000070126A (en)
CN (1) CN1137515C (en)
AT (1) ATE213079T1 (en)
BR (1) BR9714203A (en)
DE (2) DE19701165C1 (en)
ES (1) ES2172821T3 (en)
RU (1) RU2189635C2 (en)
UA (1) UA40679C2 (en)
WO (1) WO1998032098A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2797075B1 (en) * 1999-07-26 2001-10-12 Gemplus Card Int METHOD FOR MANUFACTURING A PORTABLE DEVICE WITH INTEGRATED CIRCUITS, OF THE SMART CARD TYPE OF REDUCED FORMAT IN RELATION TO THE STANDARD FORMAT
DE10204959A1 (en) * 2002-02-06 2003-08-14 Endress & Hauser Gmbh & Co Kg Printed circuit board with one component
US20030160311A1 (en) * 2002-02-28 2003-08-28 Aminuddin Ismail Stacked die semiconductor device
US6806309B2 (en) * 2002-02-28 2004-10-19 Henkel Corporation Adhesive compositions containing organic spacers and methods for use thereof
US7387259B2 (en) * 2002-09-17 2008-06-17 Axalto S.A. Hybrid card
JP2005244189A (en) * 2004-01-27 2005-09-08 Sekisui Chem Co Ltd Adhesive resin sheet for bonding semiconductor chip and semiconductor device
US20060157866A1 (en) * 2005-01-20 2006-07-20 Le Thoai T Signal redistribution using bridge layer for multichip module
US20060202317A1 (en) * 2005-03-14 2006-09-14 Farid Barakat Method for MCP packaging for balanced performance
DE102006011734B4 (en) * 2006-03-14 2020-06-18 BSH Hausgeräte GmbH Household appliance with a tub
KR102469266B1 (en) 2020-12-23 2022-11-22 도림공업(주) Inspection device for steering column lower shroud

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2579799B1 (en) * 1985-03-28 1990-06-22 Flonic Sa METHOD FOR MANUFACTURING ELECTRONIC MEMORY CARDS AND CARDS OBTAINED ACCORDING TO SAID METHOD
US5124192A (en) * 1989-11-15 1992-06-23 General Electric Company Plastic mold structure and method of making
US5399903A (en) * 1990-08-15 1995-03-21 Lsi Logic Corporation Semiconductor device having an universal die size inner lead layout
JPH04166396A (en) 1990-10-30 1992-06-12 Hitachi Maxell Ltd Ic card module
JPH04269598A (en) 1991-02-25 1992-09-25 Matsushita Electric Ind Co Ltd Ic memory card
EP0511162A1 (en) * 1991-04-24 1992-10-28 Ciba-Geigy Ag Heat conducting adhesive films, laminates with heat conducting adhesive layers and their application
US5422435A (en) * 1992-05-22 1995-06-06 National Semiconductor Corporation Stacked multi-chip modules and method of manufacturing
KR0128251Y1 (en) * 1992-08-21 1998-10-15 문정환 Lead exposed type semiconductor device
JPH06132462A (en) 1992-10-15 1994-05-13 Mitsui High Tec Inc Lead frame and manufacture thereof
JPH06191184A (en) 1992-12-25 1994-07-12 Toshiba Corp Ic card
FR2701139B1 (en) * 1993-02-01 1995-04-21 Solaic Sa Method for implanting a micro-circuit on an intelligent card and / or memory card body, and card comprising a micro-circuit thus implanted.
DE69512137T2 (en) * 1994-06-15 2000-05-25 Rue Cartes Et Systemes Paris D Manufacturing process and assembly for IC card.
DE19500925C2 (en) * 1995-01-16 1999-04-08 Orga Kartensysteme Gmbh Method for producing a contactless chip card
US5610442A (en) * 1995-03-27 1997-03-11 Lsi Logic Corporation Semiconductor device package fabrication method and apparatus
DE19511775C1 (en) * 1995-03-30 1996-10-17 Siemens Ag Carrier module, especially for installation in a card-shaped data carrier, with protection against the examination of secret components
KR100273499B1 (en) * 1995-05-22 2001-01-15 우찌가사끼 이사오 Semiconductor device having a semiconductor chip electrically connected to a wiring substrate
US5839188A (en) * 1996-01-05 1998-11-24 Alliedsignal Inc. Method of manufacturing a printed circuit assembly
US5912316A (en) * 1996-11-08 1999-06-15 Johnson Matthey, Inc. Flexible interpenetrating networks formed by epoxy-cyanate ester compositions via a polyamide
US5781412A (en) * 1996-11-22 1998-07-14 Parker-Hannifin Corporation Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size
US6117797A (en) * 1998-09-03 2000-09-12 Micron Technology, Inc. Attachment method for heat sinks and devices involving removal of misplaced encapsulant

Also Published As

Publication number Publication date
WO1998032098A1 (en) 1998-07-23
BR9714203A (en) 2000-03-28
KR20000070126A (en) 2000-11-25
ES2172821T3 (en) 2002-10-01
CN1137515C (en) 2004-02-04
JP3428657B2 (en) 2003-07-22
CN1244935A (en) 2000-02-16
DE59706344D1 (en) 2002-03-21
JP2000509864A (en) 2000-08-02
ATE213079T1 (en) 2002-02-15
EP0953186A1 (en) 1999-11-03
EP0953186B1 (en) 2002-02-06
DE19701165C1 (en) 1998-04-09
US6421248B1 (en) 2002-07-16
RU2189635C2 (en) 2002-09-20

Similar Documents

Publication Publication Date Title
UA40679C2 (en) Chip card module (versions)
ATE164698T1 (en) COMPOSITE STAMP
UA41490C2 (en) Module of chip-card for biometrical indicators
MY127921A (en) Semiconductor module and a method for mounting the same
TW200644218A (en) Multi-chip module and method of manufacture
GB2322006B (en) Process for producing chip and pressure sensitive adhesive sheet therefor
AU6309998A (en) Ic card and ic chip module
TW200509334A (en) Integrated heat spreader lid
AR014192A1 (en) METHOD OF EXCHANGE OF INFORMATION, PROVISION AND ADMINISTRATOR USED IN THIS METHOD
ATE453170T1 (en) DISPLAY FOR INTEGRATION INTO CARD-SHAPED CARRIER MEDIA
HK1028833A1 (en) Electronic module for chip card.
DE69737905D1 (en) Certification of secret keys for chip cards
TW200506744A (en) A method of manufacturing a contactless ticket and a ticket produced from this method
EP1094512A4 (en) Semiconductor chip resin-sealing method and adhesive tape for pasting lead frames or the like
TW350101B (en) A semiconductor device grinding method
BR0104595A (en) Process and apparatus for bonding thin layer strips of material transversely
DE59502922D1 (en) SUPPORT ARRANGEMENT FOR INSTALLATION IN A CONTACTLESS CHIP CARD
AU2002364324A1 (en) Smart card with extended surface module
ES2171948T3 (en) PROCEDURE FOR THE MANUFACTURE OF A SUPPORT ELEMENT FOR SEMI-CONDUCTOR CHIPS.
FI964747A (en) Apparatus for applying chips, in particular long chips, in connection with the manufacture of chip-oriented chipboards
WO2002089176A3 (en) Method for separating electronic components from a composite
DE60019358D1 (en) Antenna frame for chip card
AU7430098A (en) Method for using chip card memory units
AU4575400A (en) Method for producing contact chip cards with a low-cost dielectric
IT1307431B1 (en) METHOD OF GLUING WOODEN STRIPS FOR THE CONSTRUCTION OF COMPOSITE STRIPS AND MACHINE SUITABLE TO REALIZE SUCH