TWM679084U - Metal sensor card with contactless sensing chip - Google Patents

Metal sensor card with contactless sensing chip

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Publication number
TWM679084U
TWM679084U TW114208824U TW114208824U TWM679084U TW M679084 U TWM679084 U TW M679084U TW 114208824 U TW114208824 U TW 114208824U TW 114208824 U TW114208824 U TW 114208824U TW M679084 U TWM679084 U TW M679084U
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TW
Taiwan
Prior art keywords
layered component
sensing chip
chip
contact sensing
metal
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TW114208824U
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Chinese (zh)
Inventor
鍾允治
Original Assignee
台灣銘板股份有限公司
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Publication date
Application filed by 台灣銘板股份有限公司 filed Critical 台灣銘板股份有限公司
Publication of TWM679084U publication Critical patent/TWM679084U/en

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Abstract

本創作提供一種具有非接觸式感應晶片的金屬感應卡,其包含一卡片本體、一非接觸式感應晶片及一晶片感應天線。卡片本體包含一第一層狀構件及一第二層狀構件;第一層狀構件耦合至第二層狀構件,第二層狀構件設置有一晶片凹槽。非接觸式感應晶片設置於晶片凹槽中。晶片感應天線設置於第一層狀構件或第二層狀構件,且電性連接非接觸式感應晶片,並在感應後供應感應電流至非接觸式感應晶片。其中,第一層狀構件或第二層狀構件由金屬材料製成,且第一層狀構件以遮蔽方式覆蓋非接觸式感應晶片,使非接觸式感應晶片不自外部裸露。 This invention provides a metal sensing card with a contactless sensing chip, comprising a card body, a contactless sensing chip, and a chip sensing antenna. The card body includes a first layered component and a second layered component; the first layered component is coupled to the second layered component, and the second layered component has a chip recess. The contactless sensing chip is disposed in the chip recess. The chip sensing antenna is disposed on the first layered component or the second layered component and electrically connected to the contactless sensing chip, and supplies a sensed current to the contactless sensing chip after sensing. The first layered component or the second layered component is made of a metal material, and the first layered component covers the contactless sensing chip in a shielding manner, preventing the contactless sensing chip from being exposed externally.

Description

具有非接觸式感應晶片的金屬感應卡Metal sensor card with contactless sensing chip

本創作是關於一種感應卡的技術領域,特別是關於一種具有非接觸式感應晶片的金屬感應卡。This work relates to the technical field of a sensor card, and more particularly to a metal sensor card with a contactless sensing chip.

近年來,非接觸式感應卡片被廣泛應用於門禁控制、金融交易、身分識別等多種場合。此類非接觸式感應卡片通常包含非接觸式晶片模組及天線結構,透過感應電流進行資料交換或身份驗證。傳統感應卡片大多採用塑膠卡體製成,其非接觸式晶片多設置於卡片內部的凹槽中,再由外部開孔對應晶片位置,以利感應功能發揮。然而,晶片位置若有明顯外露,則可能遭到破壞或非法拆取,對卡片安全性造成潛在風險。In recent years, contactless sensor cards have been widely used in various applications such as access control, financial transactions, and identity verification. These contactless sensor cards typically include a contactless chip module and an antenna structure, exchanging data or verifying identity through sensed current. Traditional sensor cards are mostly made of plastic, with their contactless chips typically housed in recesses inside the card, and external openings corresponding to the chip's position to facilitate sensing functionality. However, if the chip is visibly exposed, it may be damaged or illegally removed, posing a potential risk to card security.

此外,儘管無線感應卡的應用範圍廣泛,但其也受到許多限制,例如,卡片材質的選擇十分有限。因為無線感應卡的天線在產生感應電流時,如果卡片材質是金屬等導電材質時,感應電流會受到干擾或是逸散,因而無法產生足夠的電流驅動晶片。因此,無線感應卡通常會採用PVC等塑膠的不導電材質來做成卡片。但是PVC等塑膠的物理強度不足,很容易因為彎折、碰撞而折損破裂,也較為容易變型,因此,需要具有更高強度的卡片材質來避免損壞。因此,現有技術亦未完全解決「金屬卡體難以與感應元件整合」的課題。Furthermore, despite the wide range of applications for wireless sensor cards, they are also subject to many limitations, such as a very limited choice of card material. When the antenna of a wireless sensor card generates induced current, if the card material is a conductive material such as metal, the induced current will be interfered with or dissipated, thus failing to generate sufficient current to drive the chip. Therefore, wireless sensor cards are usually made of non-conductive materials such as PVC. However, PVC and other plastics lack sufficient physical strength and are easily broken or deformed due to bending or impact. Therefore, card materials with higher strength are needed to prevent damage. Thus, current technology has not completely solved the problem of "difficulty in integrating metal card bodies with sensing elements."

再者,雖然卡片在圖樣、顏色等設計上能不斷的改變,在對消費者而言,感應卡片僅為進行消費或識別的工具,在使用時並不會與其他類型的卡片有明顯的區隔。為了提升使用者的使用意願或樂趣,感應裝置設計對應的外型來做為與卡片型感應裝置差異的特殊設計,且進一步增加聲音、燈光等效果來提升使用樂趣。然而,為驅動這些額外的提示元件時,對於感應裝置本身感應晶片的設計上常會產生衝突,例如電源變化上的差異,使得感應裝置在感應操作及聲光操作上無法兼顧,難以達到預期的效果。Furthermore, although the designs of cards, such as patterns and colors, can be continuously changed, for consumers, sensor cards are merely tools for consumption or identification, and are not significantly different from other types of cards in use. To enhance user willingness and enjoyment, sensor devices are designed with corresponding shapes to differentiate them from card-type sensor devices, and further enhance the user experience with sound and light effects. However, driving these additional prompting elements often creates conflicts in the design of the sensor chip itself, such as differences in power supply variations. This makes it difficult for the sensor device to simultaneously handle sensor operation and sound/light operation, failing to achieve the desired effect.

綜上所述,傳統感應卡或替代性感應載具雖已具備基本功能性,但在「晶片不可見化」、「感應模組與金屬材料整合」及「整體外觀設計」等面向仍有改進空間,尤以防止晶片遭非法破壞或複製為關鍵安全需求。In conclusion, while traditional sensor cards or alternative sensor carriers have basic functionality, there is still room for improvement in areas such as "chip invisibility," "integration of sensor modules with metal materials," and "overall appearance design," especially in preventing the chip from being illegally damaged or copied, which is a key security requirement.

有鑒於上述習知技術的問題,本創作的目的就是在提供一種具有非接觸式感應晶片的金屬感應卡,以解決上述習知所待改善的問題。In view of the problems of the prior art described above, the purpose of this invention is to provide a metal sensing card with a non-contact sensing chip to solve the problems that need to be improved in the prior art.

基於上述目的,本創作係提供一種具有非接觸式感應晶片的金屬感應卡,其包含一卡片本體、一非接觸式感應晶片及一晶片感應天線。卡片本體係包含一第一層狀構件及一第二層狀構件;該第一層狀構件耦合至該第二層狀構件,該第二層狀構件設置有一晶片凹槽。非接觸式感應晶片係設置於該晶片凹槽中。晶片感應天線係設置於該第一層狀構件或該第二層狀構件,且電性連接該非接觸式感應晶片,並在感應後供應感應電流至該非接觸式感應晶片。其中,其中,第一層狀構件或第二層狀構件由金屬材料製成,且第一層狀構件以遮蔽方式覆蓋非接觸式感應晶片,使非接觸式感應晶片不自外部裸露。To achieve the above objectives, this invention provides a metal sensing card with a contactless sensing chip, comprising a card body, a contactless sensing chip, and a chip sensing antenna. The card body includes a first layered structure and a second layered structure; the first layered structure is coupled to the second layered structure, and the second layered structure has a chip recess. The contactless sensing chip is disposed in the chip recess. The chip sensing antenna is disposed on the first layered structure or the second layered structure and electrically connected to the contactless sensing chip, and supplies a sensed current to the contactless sensing chip after sensing. The first layered component or the second layered component is made of metal, and the first layered component covers the non-contact sensing chip in a shielding manner so that the non-contact sensing chip is not exposed from the outside.

較佳地,該具有非接觸式感應晶片的金屬感應卡包含一保護層,該保護層係設置於該第一層狀構件的一面且相對於該第二層狀構件。Preferably, the metal sensor card with a non-contact sensing chip includes a protective layer disposed on one side of the first layered structure and opposite to the second layered structure.

較佳地,該保護層係為印刷層。Preferably, the protective layer is a printed layer.

較佳地,該第二層狀構件包含一提示元件凹槽;該具有非接觸式感應晶片的金屬感應卡包含一提示元件及一提示元件天線;該提示元件係設置於該提示元件凹槽;該提示元件天線係設置於該第一層狀構件或該第二層狀構件,且該晶片感應天線與該提示元件天線各自獨立配置;該提示元件天線電性連接該提示元件天線,並在感應後供應感應電流至該提示元件;該第一層狀構件對應於該提示元件的位置設有一開口。Preferably, the second layered structure includes a prompting element recess; the metal sensor card with a non-contact sensing chip includes a prompting element and a prompting element antenna; the prompting element is disposed in the prompting element recess; the prompting element antenna is disposed in the first layered structure or the second layered structure, and the chip sensing antenna and the prompting element antenna are each independently configured; the prompting element antenna is electrically connected to the prompting element antenna and supplies a sensing current to the prompting element after sensing; the first layered structure has an opening corresponding to the position of the prompting element.

較佳地,該開口設有一透光填充層;該具有非接觸式感應晶片的金屬感應卡包含一圖案印刷層;該圖案印刷層對應於該開口的位置設有一透光區域。Preferably, the opening is provided with a light-transmitting filling layer; the metal sensor card with a non-contact sensing chip includes a pattern printing layer; the pattern printing layer has a light-transmitting area corresponding to the position of the opening.

較佳地,該非接觸式感應晶片的操作電源差小於或大於該提示元件的操作電源差。Preferably, the operating power difference of the non-contact sensing chip is less than or greater than the operating power difference of the indication element.

較佳地,該第一層狀構件的金屬材料為鋁、銅、不鏽鋼、銀、金、鉑或其合金中的一種;該第二層狀構件係為金屬材料或塑膠材料,塑膠材料包含PVC、PE、ABS、PA、PEI、PET、PETG或PS。Preferably, the first layered component is made of aluminum, copper, stainless steel, silver, gold, platinum, or an alloy thereof; the second layered component is made of a metal or plastic material, the plastic material including PVC, PE, ABS, PA, PEI, PET, PETG, or PS.

較佳地,該第一層狀構件或該第二層狀構件為金屬材料時,該第一層狀構件或該第二層狀構件包含一破口。Preferably, when the first layered component or the second layered component is a metallic material, the first layered component or the second layered component includes a break.

較佳地,感應天線與為金屬材料的該第一層狀構件或該第二層狀構件間設置一吸波層;該吸波層以吸波材料製成,吸波材料包含石墨烯、石墨、碳纖維、奈米碳管、鐵氧體或碳化矽。Preferably, an absorbing layer is disposed between the induction antenna and the first or second layered component, which is made of a metallic material; the absorbing layer is made of an absorbing material, including graphene, graphite, carbon fiber, carbon nanotubes, ferrite or silicon carbide.

較佳地,該吸波層以吸波材料製成,吸波材料包含石墨烯、石墨、碳纖維、奈米碳管、鐵氧體或碳化矽。Preferably, the microwave absorbing layer is made of a microwave absorbing material, including graphene, graphite, carbon fiber, carbon nanotubes, ferrite or silicon carbide.

較佳地,該破口為鋸齒形狀或直線形狀。該破口自該卡片本體的長邊向內延伸,且長度小於短邊的1/2或大於短邊的1/2。該破口為鋸齒形狀或直線形狀。該破口自該卡片本體的短邊向內延伸,且長度小於長邊的1/3或大於長邊的1/3。Preferably, the tear is serrated or straight. The tear extends inward from the long side of the card body, and its length is less than or greater than half the length of the short side. Alternatively, the tear is serrated or straight. Or, the tear extends inward from the short side of the card body, and its length is less than or greater than one-third of the length of the long side.

較佳地,該破口的寬度為0.5mm至2mm。該卡片本體的厚度為0.5mm至2mm。Preferably, the width of the tear is 0.5 mm to 2 mm. The thickness of the card body is 0.5 mm to 2 mm.

以下將以具體的實施例配合所附的圖式詳加說明本創作的技術特徵,以令本創作所屬技術領域具有通常知識者可易於理解本創作的目的、技術特徵、及其優點。The following detailed description of the technical features of this invention, with specific examples and accompanying diagrams, will make it easy for those skilled in the art to understand the purpose, technical features, and advantages of this invention.

本創作的優點、特徵以及達到的技術方法將參照例示性實施例及所附圖式進行更詳細地描述而更容易理解,且本創作可以不同形式來實現,故不應被理解僅限於此處所陳述的實施例,相反地,對所屬技術領域中具有通常知識者而言,所提供的實施例將使本揭露更加透徹與全面且完整地傳達本創作的範疇,且本創作將僅為所附加的申請專利範圍所定義。The advantages, features, and technical methods of this invention will be described in more detail and made easier to understand with reference to the exemplary embodiments and accompanying drawings. This invention can be implemented in different forms and should not be construed as limited to the embodiments set forth herein. Rather, the embodiments provided will make this disclosure more thorough, comprehensive, and complete in conveying the scope of this invention to those skilled in the art. This invention will be defined only by the appended claims.

應當理解的是,儘管術語「第一」、「第二」等在本創作中可用於描述各種元件、部件、區域、區段、層及/或部分,但是這些元件、部件、區域、區段、層及/或部分不應受這些術語的限制。這些術語僅用於將一個元件、部件、區域、區段、層及/或部分與另一個元件、部件、區域、區段、層及/或部分區分開。It should be understood that although the terms "first," "second," etc., may be used in this work to describe various elements, components, regions, sections, layers, and/or parts, these elements, components, regions, sections, layers, and/or parts should not be limited by these terms. These terms are used only to distinguish one element, component, region, section, layer, and/or part from another element, component, region, section, layer, and/or part.

在說明書中,術語「包括」、「包含」或者其任何其他變體意在涵蓋非排他性的包含,從而使得包括一系列要素的過程、方法、物品或者裝置不僅包括那些要素,而且還包括沒有明確列出的其他要素,或者是還包括為這種過程、方法、物品或者裝置所固有的要素。在沒有更多限制的情況下,由語句「包括一個…」限定的要素,並不排除在包括該要素的過程、方法、物品或者裝置中還存在另外的相同要素。In this specification, the terms "comprising," "including," or any other variation thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising a…" does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

除非另有定義,本創作所使用的所有術語(包括技術和科學術語)具有與本創作所屬技術領域的通常知識者通常理解的相同含義。將進一步理解的是,諸如在通常使用的字典中定義的那些術語應當被解釋為具有與它們在相關技術和本創作的上下文中的含義一致的定義,並且將不被解釋為理想化或過度正式的意義,除非本文中明確地這樣定義。Unless otherwise defined, all terms used in this work (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the field to which this work pertains. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the relevant technical and contextual context of this work, and will not be interpreted as having an idealized or overly formal meaning unless expressly defined herein.

還應當理解,在本創作中所使用的術語僅僅是出於描述特定實施例的目的而並不意在限制本創作。如在本創作說明書及/或所附申請專利範圍中所使用的那樣,除非上下文清楚地指明其它情況,否則單數形式的「一」及「該」,其意在包括複數形式。It should also be understood that the terminology used in this work is for the purpose of describing particular embodiments only and is not intended to limit the work. As used in this specification and/or the scope of the appended patent applications, the singular forms of "a" and "the" are intended to include the plural forms unless the context clearly indicates otherwise.

請一併參閱圖1至圖3。圖1係為本創作的具有非接觸式感應晶片的金屬感應卡的第一實施例的分解示意圖。圖2係為本創作的具有非接觸式感應晶片的金屬感應卡的第一實施例的組合示意圖。圖3係為本創作的具有非接觸式感應晶片的金屬感應卡的第一實施例的層狀結構示意圖。本創作的具有非接觸式感應晶片的金屬感應卡,其主要可應用於如識別卡、信用卡、一般金融卡、簽帳金融卡或悠遊卡、一卡通等電子票證。如圖所示,本創作的具有非接觸式感應晶片的金屬感應卡1,其主要包含一卡片本體2、一非接觸式感應晶片3及一晶片感應天線51。Please refer to Figures 1 through 3. Figure 1 is an exploded view of the first embodiment of the metal sensor card with a contactless sensing chip of this invention. Figure 2 is an assembled view of the first embodiment of the metal sensor card with a contactless sensing chip of this invention. Figure 3 is a layered structure view of the first embodiment of the metal sensor card with a contactless sensing chip of this invention. The metal sensor card with a contactless sensing chip of this invention can be mainly applied to electronic tickets such as identification cards, credit cards, general debit cards, debit cards, EasyCards, and iPasses. As shown in the figures, the metal sensor card 1 with a contactless sensing chip of this invention mainly includes a card body 2, a contactless sensing chip 3, and a chip sensing antenna 51.

卡片本體2係包含一第一層狀構件21及一第二層狀構件22。第一層狀構件21耦合至第二層狀構件22;其中,耦合係指黏合、融合、壓合等方式。第二層狀構件22設置有一晶片凹槽23;其中,凹槽係指未貫穿或未貫通第二層狀構件的容置空間。第一層狀構件21或第二層狀構件22可設有一個天線凹槽,例如第一層狀構件21設有天線凹槽,或者是,第二層狀構件22設有天線凹槽。The card body 2 includes a first layered component 21 and a second layered component 22. The first layered component 21 is coupled to the second layered component 22; where coupling refers to methods such as bonding, fusion, or pressing. The second layered component 22 is provided with a chip recess 23; where recess refers to an accommodating space that does not penetrate or pass through the second layered component. The first layered component 21 or the second layered component 22 may be provided with an antenna recess, for example, the first layered component 21 is provided with an antenna recess, or the second layered component 22 is provided with an antenna recess.

為避免晶片3外露,本實施例中,第一層狀構件21係以遮蔽方式覆蓋於非接觸式感應晶片3上方,使晶片不自卡片外部裸露,藉此提升其外觀完整性與抗破壞安全性。To prevent the chip 3 from being exposed, in this embodiment, the first layered component 21 covers the non-contact sensing chip 3 in a shielding manner, so that the chip is not exposed from the outside of the card, thereby improving its appearance integrity and damage resistance.

非接觸式感應晶片3為非接觸式的控制晶片,其經由近場通訊感應一電子裝置,以進行識別或交易程序。非接觸式感應晶片3係設置於晶片凹槽23中。晶片感應天線51係設置於該第一層狀構件21或該第二層狀構件22的其中一個天線凹槽中,且電性連接非接觸式感應晶片3,並在感應後供應感應電流至非接觸式感應晶片3。The contactless sensing chip 3 is a contactless control chip that senses an electronic device via near-field communication for identification or transaction procedures. The contactless sensing chip 3 is disposed in a chip recess 23. The chip sensing antenna 51 is disposed in one of the antenna recesses of the first layered component 21 or the second layered component 22, and is electrically connected to the contactless sensing chip 3, and supplies a sensed current to the contactless sensing chip 3 after sensing.

值得一提的是,第一層狀構件21或第一層狀構件21及第二層狀構件22可由金屬材料製成。習知的晶片感應卡為了生產成本及重量等原因,多半會採用PVC等塑膠作為材料,也因此捨棄了卡片的強度及美觀上的質感。本創作則採用至少一層的金屬卡面來提升強度及美感。在本實施例中,第一層狀構件21為金屬材料所製成,第二層狀構件22為塑膠材料所製成。金屬材料為鋁、銅、不鏽鋼、銀、金、鉑或其合金中的一種。塑膠材料包含PVC、PE、ABS、PA、PEI、PET、PETG或PS。It is worth mentioning that the first layer component 21 or both the first layer component 21 and the second layer component 22 can be made of metal. Conventional chip-based contactless cards, for reasons such as production cost and weight reduction, mostly use plastics such as PVC as the material, thus sacrificing card strength and aesthetic appeal. This invention uses at least one layer of metal to enhance both strength and aesthetics. In this embodiment, the first layer component 21 is made of metal, and the second layer component 22 is made of plastic. The metal material is one of aluminum, copper, stainless steel, silver, gold, platinum, or their alloys. The plastic material includes PVC, PE, ABS, PA, PEI, PET, PETG, or PS.

其中,由金屬材料所製成的第一層狀構件21可具有一破口26。第一層狀構件21從正面可看到破口26,甚至於看到晶片感應天線51。由於本創作的金屬感應卡1包含破口26,從而在感應的磁場變化時,金屬製的第一層狀構件21不會影響天線產生感應電流,所以仍可產生感應電流,以驅動非接觸式感應晶片3而讀取晶片中的資訊。非接觸式感應晶片3的位置係配合習知之晶片讀取器設置於固定位置,而破口26則可為任意之配置方式。例如,破口26設置在第一層狀構件21的長邊時,其長度可小於短邊的1/2,或是大於短邊的1/2。而當破口26設置於第一層狀構件21的短邊時,其長度可小於長邊的1/3,或是大於長邊的1/3。破口26可以任意方式設置,惟其延伸方式需跨越天線凹槽,以使天線能正常使用。破口26的寬度可以為0.5mm至2mm,較佳地可為0.5mm至1mm。The first layered component 21, made of metal, may have a notch 26. The notch 26 is visible from the front of the first layered component 21, and even the chip sensing antenna 51 is visible. Because the metal sensing card 1 of this invention includes the notch 26, the first layered component 21, made of metal, will not affect the antenna's generation of induced current when the sensed magnetic field changes. Therefore, it can still generate induced current to drive the non-contact sensing chip 3 to read information from the chip. The non-contact sensing chip 3 is positioned in a fixed location to match a conventional chip reader, while the notch 26 can be configured arbitrarily. For example, when the notch 26 is located on the long side of the first layered component 21, its length can be less than half or greater than half the short side. When the opening 26 is located on the short side of the first layered component 21, its length can be less than 1/3 or greater than 1/3 of the long side. The opening 26 can be located in any manner, but its extension must cross the antenna groove so that the antenna can be used normally. The width of the opening 26 can be from 0.5mm to 2mm, preferably from 0.5mm to 1mm.

順帶一提的是,第一層狀構件21或第二層狀構件22均可以透過雷射雕刻、沖壓或是任意方式在其表面形成凹槽、圖案、花紋,以增加本創作的金屬感應卡的美觀性。而第一層狀構件21及第二層狀構件22疊合後的厚度可為0.5mm至2mm,較佳地可為0.5mm至1mm。藉此,可以提升本創作的金屬感應卡的質感,也能同時兼顧本創作的金屬感應卡的物理強度。Incidentally, either the first layer component 21 or the second layer component 22 can have grooves, patterns, or designs formed on their surfaces through laser engraving, stamping, or any other method to enhance the aesthetics of the metal-sensor card. The thickness of the first layer component 21 and the second layer component 22 after being stacked can be from 0.5mm to 2mm, preferably from 0.5mm to 1mm. This improves the texture of the metal-sensor card while maintaining its physical strength.

較佳地,本創作的具有非接觸式感應晶片的金屬感應卡1可包含一保護層61;保護層61係設置於第一層狀構件21的一面且相對於第二層狀構件22。保護層61可避免水氣或異物接觸天線,以保護天線並可增加結構強度。保護層61可為印刷層,其印刷有預定圖案或特定圖案。破口26可以被保護層61所覆蓋或是以直線狀或鋸齒狀等任意形式對應於預定圖案或特定圖案,以降低破口26在視覺上的突兀感。另外,破口26的設置方式也可以做為額外的美學設計,本創作不限於此。Preferably, the metal sensor card 1 with a non-contact sensing chip of this invention may include a protective layer 61; the protective layer 61 is disposed on one side of the first layered component 21 and opposite to the second layered component 22. The protective layer 61 can prevent moisture or foreign objects from contacting the antenna, thereby protecting the antenna and increasing structural strength. The protective layer 61 may be a printed layer, on which a predetermined pattern or a specific pattern is printed. The opening 26 may be covered by the protective layer 61 or correspond to the predetermined pattern or the specific pattern in any form such as straight lines or serrations, to reduce the visual abruptness of the opening 26. In addition, the arrangement of the opening 26 can also be used as an additional aesthetic design, and this invention is not limited to this.

藉由上述結構配置,本實施例可有效實現感應功能、晶片遮蔽、安全防護與金屬外觀整合,適用於高階門禁卡、身分識別卡或金融卡等需求。With the above structural configuration, this embodiment can effectively integrate sensing function, chip shielding, security protection and metal appearance, and is suitable for high-end access cards, identity cards or financial cards.

請一併參閱圖4、5、6,其係為本創作的具有非接觸式感應晶片的金屬感應卡的第二實施例的相關示意圖。在本實施例中,相同元件符號的元件,其配置與運作係與前述之實施例相同或類似,其相同或類似處,於此便不再加以贅述。Please also refer to Figures 4, 5, and 6, which are related schematic diagrams of a second embodiment of the metal sensor card with a non-contact sensing chip of this invention. In this embodiment, the components with the same component symbols are configured and operated in the same or similar manner as in the aforementioned embodiments, and the similarities will not be described again here.

如圖所示,第二實施例除包含上述第一實施例的所有元件與結構外,進一步包含一提示元件4與對應的提示元件感應天線52,提示元件4例如可以是發光二極體或蜂鳴器,其用以提供感應時的回饋效果,例如發光或發聲。As shown in the figure, the second embodiment includes all the elements and structures of the first embodiment described above, and further includes a prompting element 4 and a corresponding prompting element sensing antenna 52. The prompting element 4 may be, for example, a light-emitting diode or a buzzer, which is used to provide feedback effects when sensing, such as emitting light or sound.

在結構上,第二層狀構件22上額外設有一提示元件凹槽24,提示元件4嵌設於其中,可為LED、蜂鳴器等不具資料處理功能的提示裝置。第一層狀構件21或第二層狀構件22可設有二個天線凹槽,例如第一層狀構件21設有二個天線凹槽,或者是,第二層狀構件22設有二個天線凹槽,或者是,第一層狀構件21及第二層狀構件22分別設有一個天線凹槽。因此,晶片感應天線51及提示元件感應天線52可同時設置於第一層狀構件21或第二層狀構件22;或者是,晶片感應天線51及提示元件感應天線52可分別設置於第一層狀構件21及第二層狀構件22。Structurally, the second layered component 22 is additionally provided with a prompting element groove 24, in which the prompting element 4 is embedded. This can be a prompting device without data processing functions, such as an LED or a buzzer. The first layered component 21 or the second layered component 22 may have two antenna grooves. For example, the first layered component 21 may have two antenna grooves, or the second layered component 22 may have two antenna grooves, or both the first layered component 21 and the second layered component 22 may each have one antenna groove. Therefore, the chip sensing antenna 51 and the prompting element sensing antenna 52 can be simultaneously disposed in the first layered component 21 or the second layered component 22; or, the chip sensing antenna 51 and the prompting element sensing antenna 52 can be respectively disposed in the first layered component 21 and the second layered component 22.

值得一提的是,提示元件感應天線52與晶片感應天線51為各自獨立配置,在感應磁場上對於彼此的影響較小,有助於獨立控制所需電源的提供,讓電子裝置在非接觸式感應晶片3的操作及提示元件4的操作上更有效率。於使用時,當讀卡設備發出感應能量時,晶片感應天線51與提示元件感應天線52可同時接收該感應能量,前者驅動非接觸式感應晶片3執行通訊,後者則驅動提示元件4發光或發聲,提供使用者辨識讀卡是否成功的感應提示。It is worth mentioning that the indicator antenna 52 and the chip antenna 51 are configured independently, resulting in less interference between them in the sensing magnetic field. This facilitates independent control of the required power supply, making the operation of the contactless sensing chip 3 and the indicator antenna 4 more efficient. In use, when the card reader emits sensing energy, the chip antenna 51 and the indicator antenna 52 can simultaneously receive the sensing energy. The former drives the contactless sensing chip 3 to perform communication, while the latter drives the indicator antenna 4 to emit light or sound, providing the user with a sensory prompt to identify whether the card reading was successful.

為使提示元件4發光可見,第一層狀構件21對應該提示元件的位置設有一開口25,並可於該開口25中設置一透光填充層7,用以填補該開口並導出光線,同時提供物理保護。另可於保護層61或圖案印刷層62上設置一透光區域63,對應該開口25位置,提供更佳的視覺穿透效果。在不同實施例中,開口25亦可直接被圖案印刷層62所覆蓋。值得一提的是,提示元件4、開口25及透光區域63的位置,其可對應於預定圖案或特定圖案而配置,例如設置於祥龍吐珠的珠上、人物或動物或神獸的眼睛等位置。破口26可以被保護層61所覆蓋或是以直線狀或鋸齒狀等任意形式對應於預定圖案或特定圖案,以降低破口26在視覺上的突兀感。另外,破口26的設置方式也可以做為額外的美學設計,本創作不限於此To ensure the illumination of the indicator element 4, the first layered component 21 has an opening 25 corresponding to the position of the indicator element. A light-transmitting filling layer 7 can be provided in the opening 25 to fill the opening and guide light while providing physical protection. Alternatively, a light-transmitting area 63 can be provided on the protective layer 61 or the pattern printing layer 62, corresponding to the position of the opening 25, to provide better visual penetration. In different embodiments, the opening 25 can also be directly covered by the pattern printing layer 62. It is worth mentioning that the positions of the indicator element 4, the opening 25, and the light-transmitting area 63 can be configured to correspond to a predetermined pattern or a specific pattern, such as on the pearl of a dragon spitting out a pearl, or in the eyes of a person, animal, or mythical beast. The opening 26 can be covered by the protective layer 61 or correspond to a predetermined or specific pattern in any form, such as a straight line or a serrated edge, to reduce the visual abruptness of the opening 26. Furthermore, the arrangement of the opening 26 can also serve as additional aesthetic design; this work is not limited to this.

此外,非接觸式感應晶片3與提示元件4的驅動電源電壓可為不同設計,例如感應晶片操作於1.8V,提示元件需達2.5V以上才會動作,可避免低強度感應誤觸發提示元件。此種電源差異設計有助於提高系統整體穩定性與讀卡準確性。Furthermore, the driving power supply voltages for the contactless sensing chip 3 and the indicator element 4 can be designed differently. For example, the sensing chip can operate at 1.8V, while the indicator element requires a voltage of 2.5V or higher to activate, thus preventing false triggering of the indicator element due to low-intensity sensing. This differential power supply design helps improve the overall stability of the system and the accuracy of card reading.

在不同實施例中,第一層狀構件21及第二層狀構件22可皆由金屬材料所製成。其中,第一層狀構件21及第二層狀構件22皆設有破口26。由於本創作的具有非接觸式感應晶片的金屬感應卡1包含破口26,從而在感應的磁場變化時,金屬材料製的第一層狀構件21及第二層狀構件22不會影響天線產生感應電流,所以仍可產生感應電流,以驅動非接觸式感應晶片3而讀取晶片中的資訊,以及驅動提示元件4發出光。In different embodiments, both the first layered component 21 and the second layered component 22 may be made of metal. Both the first layered component 21 and the second layered component 22 are provided with a notch 26. Because the metal sensor card 1 with a non-contact sensing chip of this invention includes the notch 26, when the sensed magnetic field changes, the first layered component 21 and the second layered component 22 made of metal will not affect the antenna generating an induced current. Therefore, an induced current can still be generated to drive the non-contact sensing chip 3 to read information from the chip and to drive the indicator element 4 to emit light.

透過以上設計,本實施例除兼具第一實施例之隱蔽性與感應功能外,更提供即時提示回饋,適用於需強化使用者回應體驗之應用場景,例如金融交易卡、通勤交通卡等,提升整體操作便利性與識別清楚度。Through the above design, this embodiment not only has the concealment and sensing function of the first embodiment, but also provides real-time prompts and feedback, which is suitable for application scenarios that need to enhance the user response experience, such as financial transaction cards, commuter transportation cards, etc., and improves the overall ease of operation and recognition clarity.

請參閱圖7,係為本創作的具有提示元件的金屬感應卡的第三實施例的層狀結構示意圖。在本實施例中,相同元件符號的元件,其配置與運作係與前述之實施例相同或類似,其相同或類似處,於此便不再加以贅述。Please refer to Figure 7, which is a schematic diagram of the layered structure of the third embodiment of the metal sensor card with prompting elements of this invention. In this embodiment, the elements with the same element symbols are arranged and operated in the same or similar manner as in the aforementioned embodiments, and the similarities will not be described again here.

如圖所示,本實施中,第一層狀構件21由金屬材料所製成,而第二層狀構件22由塑膠材料所製成。與前述實施例的主要不同處在於,該晶片感應天線51和該提示元件感應天線52與為金屬材料製成的該第一層狀構件21或第二層狀構件22間設置一吸波層8,在本實施例中,以第一層狀構件21與天線之間具有吸波層8。該吸波層8以吸波材料製成,吸波材料包含石墨烯、石墨、碳纖維、奈米碳管、鐵氧體或碳化矽。藉由吸波層8,可以消除金屬感應卡1面對射頻感應的干擾,使金屬感應卡1可以正常運作。As shown in the figure, in this embodiment, the first layered component 21 is made of metal, while the second layered component 22 is made of plastic. The main difference from the previous embodiment is that an absorbing layer 8 is provided between the chip sensing antenna 51 and the prompting element sensing antenna 52 and the first or second layered component 21 (made of metal). In this embodiment, the absorbing layer 8 is located between the first layered component 21 and the antenna. The absorbing layer 8 is made of absorbing materials, including graphene, graphite, carbon fiber, carbon nanotubes, ferrite, or silicon carbide. The absorbing layer 8 eliminates interference from the radio frequency sensing of the metal sensor card 1, allowing the metal sensor card 1 to operate normally.

不同實施中,第一層狀構件21及第二層狀構件22皆由金屬材料所製成。該晶片感應天線51和該提示元件感應天線52與為金屬材料製成的該第一層狀構件21及第二層狀構件22間設置一吸波層8。In different embodiments, both the first layered component 21 and the second layered component 22 are made of metal. An absorbing layer 8 is disposed between the chip sensing antenna 51 and the prompting element sensing antenna 52 and the first layered component 21 and the second layered component 22 made of metal.

透過以上設計,本實施例除兼具第一實施例之隱蔽性與感應功能外,更提供即時提示回饋,適用於需強化使用者回應體驗之應用場景,例如金融交易卡、通勤交通卡等,提升整體操作便利性與識別清楚度。Through the above design, this embodiment not only has the concealment and sensing function of the first embodiment, but also provides real-time prompts and feedback, which is suitable for application scenarios that need to enhance the user response experience, such as financial transaction cards, commuter transportation cards, etc., and improves the overall ease of operation and recognition clarity.

綜上所述,本創作提供一種具有非接觸式感應晶片的金屬感應卡,藉由將感應晶片嵌設於金屬卡體的層狀結構中,並以遮蔽方式覆蓋晶片位置,使晶片不自外部裸露,有效提升感應卡的安全性與結構完整性。相較於傳統晶片外露或需設孔對應之設計,本創作可實現無孔化外觀,並維持穩定感應效能。此外,本創作的具有非接觸式感應晶片的金屬感應卡,其係採用金屬材質作為卡片本體,可以提供感應卡更高的物理強度,避免受到彎折時損壞。並且,藉由使用金屬卡片本體,可以在卡面進行打磨、雕刻,提升整體美感。另外,本創作的具有非接觸式感應晶片的金屬感應卡,其通過雙天線的設置,能各自提供非接觸式感應晶片及提示元件所需的感應電流,避免不同電子元件在電源變化不同的情況下,造成金屬感應卡在感應操作及發光操作上無法兼顧的問題。In summary, this invention provides a metal sensor card with a non-contact sensing chip. By embedding the sensing chip within the layered structure of the metal card body and covering the chip location in a shielding manner, the chip is not exposed externally, effectively improving the security and structural integrity of the sensor card. Compared to traditional designs with exposed chips or requiring corresponding holes, this invention achieves a hole-free appearance while maintaining stable sensing performance. Furthermore, this metal sensor card with a non-contact sensing chip uses metal as its card body, providing higher physical strength and preventing damage upon bending. Moreover, the use of a metal card body allows for polishing and engraving on the card surface, enhancing the overall aesthetics. In addition, the metal sensor card with non-contact sensing chip in this invention can provide the sensing current required by the non-contact sensing chip and the prompting element respectively through the dual antenna configuration, so as to avoid the problem that the metal sensor card cannot simultaneously perform sensing and light emission operations when different electronic components are subjected to different power supply conditions.

在本創作所提供的幾個實施例中,應該理解到,所揭露的裝置,可藉由其它的方式實現。例如上述實施例在不相衝突的基礎下,可任意搭配組合進行應用;例如,以上所描述的裝置實施例僅僅是示意性的,例如所述模組的劃分,僅僅為一種邏輯功能劃分,實際實現時可以有另外的劃分方式;例如多個模組或元件可以結合或者可以集成到另一個系統,或一些特徵可以忽略,或不執行。In the embodiments provided in this work, it should be understood that the disclosed devices can be implemented in other ways. For example, the above embodiments can be arbitrarily combined and applied without conflict; for example, the device embodiments described above are merely illustrative, and the division of the modules is merely a logical functional division, and other division methods may be used in actual implementation; for example, multiple modules or components can be combined or integrated into another system, or some features can be ignored or not executed.

所述作為分離部件說明的模組可以是或者也可以不是物理上分開的,作為模組顯示的部件可以是或者也可以不是物理模組,即可以位於一個地方,或者也可以分佈到多個網路模組上。可以根據實際的需要選擇其中的部分或者全部模組來實現實施例方案的目的。The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical modules; that is, they may be located in one place or distributed across multiple network modules. Some or all of the modules can be selected to achieve the purpose of the embodiment according to actual needs.

另外,在本創作的各個實施例中的各功能模組可以集成在一個處理器中,也可以是各個模組單獨物理存在,也可以兩個或兩個以上模組集成在一個模組中。上述集成的模組既可以採用硬體的形式實現,也可以採用軟體功能模組的形式實現。Furthermore, in the various embodiments of this invention, the functional modules can be integrated into a single processor, or each module can exist as a separate physical entity, or two or more modules can be integrated into a single module. The integrated modules described above can be implemented in hardware or as software functional modules.

以上所述,以上實施例僅用以說明本創作的技術方案,而非對其限制;儘管參照前述實施例對本創作進行了詳細的說明,本領域的普通技術人員應當理解:其依然可以對前述各實施例所記載的技術方案進行修改,或者對其中部分技術特徵進行等同替換;而這些修改或者替換,並不使相應技術方案的本質脫離本創作各實施例技術方案的範圍。The above-described embodiments are merely illustrative of the technical solutions of this invention and are not intended to limit it. Although the invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this invention.

1:具有非接觸式感應晶片的金屬感應卡 2:卡片本體 21:第一層狀構件 22:第二層狀構件 23:晶片凹槽 24:提示元件凹槽 25:開口 26:破口 3:非接觸式感應晶片 4:提示元件 51:晶片感應天線 52:提示元件感應天線 61:保護層 62:圖案印刷層 63:透光區域 7:透光填充層 8:吸波層1: Metal sensor card with non-contact sensing chip 2: Card body 21: First layer structure 22: Second layer structure 23: Chip recess 24: Indicator element recess 25: Opening 26: Split 3: Non-contact sensing chip 4: Indicator element 51: Chip sensing antenna 52: Indicator element sensing antenna 61: Protective layer 62: Pattern printing layer 63: Light-transmitting area 7: Light-transmitting filling layer 8: Wave-absorbing layer

為了更清楚地說明本創作實施例的技術方案,下面將對本創作實施例描述中所需要使用的附圖作簡單地介紹,顯而易見地,下面所描述的附圖僅僅是本創作的一些實施例,對於本創作所屬技術領域中的具有通常知識者來講,還可以根據這些附圖獲得其他的附圖。To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art to which the present invention pertains, other accompanying drawings can be obtained based on these accompanying drawings.

圖1係為本創作的具有非接觸式感應晶片的金屬感應卡的第一實施例的分解示意圖。Figure 1 is an exploded schematic diagram of a first embodiment of the metal sensor card with a non-contact sensing chip of the present invention.

圖2係為本創作的具有非接觸式感應晶片的金屬感應卡的第一實施例的組合示意圖。Figure 2 is a schematic diagram of a first embodiment of the metal sensor card with a non-contact sensing chip of the present invention.

圖3係為本創作的具有非接觸式感應晶片的金屬感應卡的第一實施例的層狀結構示意圖。Figure 3 is a schematic diagram of the layered structure of a first embodiment of the metal sensor card with a non-contact sensing chip of the present invention.

圖4係為本創作的具有非接觸式感應晶片的金屬感應卡的第二實施例的分解示意圖。Figure 4 is an exploded schematic diagram of a second embodiment of the metal sensor card with a non-contact sensing chip of the present invention.

圖5係為本創作的具有非接觸式感應晶片的金屬感應卡的第二實施例的層狀結構示意圖。Figure 5 is a schematic diagram of the layered structure of a second embodiment of the metal sensor card with a non-contact sensing chip of the present invention.

圖6係為本創作的具有非接觸式感應晶片的金屬感應卡的第一實施例的層狀結構示意圖。Figure 6 is a schematic diagram of the layered structure of a first embodiment of the metal sensor card with a non-contact sensing chip of the present invention.

圖7係為本創作的具有非接觸式感應晶片的金屬感應卡的第三實施例的層狀結構示意圖。Figure 7 is a schematic diagram of the layered structure of a third embodiment of the metal sensor card with a non-contact sensing chip of the present invention.

1:具有非接觸式感應晶片的金屬感應卡 1: Metal sensor card with contactless sensing chip

2:卡片本體 2: The Card Itself

21:第一層狀構件 21: First layered structure

22:第二層狀構件 22: Second layered structure

23:晶片凹槽 23: Wafer Groove

26:破口 26: Breach

3:非接觸式感應晶片 3: Non-contact sensing chip

51:晶片感應天線 51: Chip-based sensor antenna

61:保護層 61: Protective Layer

Claims (12)

一種具有非接觸式感應晶片的金屬感應卡,其包含: 一卡片本體,包含一第一層狀構件及一第二層狀構件;該第一層狀構件貼合至該第二層狀構件;其中,該第二層狀構件設置有一晶片凹槽; 一非接觸式感應晶片,設置於該晶片凹槽中;以及 一晶片感應天線,係設置於該第一層狀構件或該第二層狀構件,且電性連接該非接觸式感應晶片,並在感應後供應感應電流至該非接觸式感應晶片; 其中,該第一層狀構件或該第二層狀構件係由金屬材料製成,且該第一層狀構件係以遮蔽方式覆蓋該非接觸式感應晶片,使該非接觸式感應晶片不自外部裸露。A metal sensing card with a non-contact sensing chip includes: a card body comprising a first layered component and a second layered component; the first layered component being attached to the second layered component; wherein the second layered component has a chip recess; a non-contact sensing chip disposed in the chip recess; and a chip sensing antenna disposed on the first layered component or the second layered component and electrically connected to the non-contact sensing chip, and supplying a sensing current to the non-contact sensing chip after sensing. The first layered component or the second layered component is made of metal, and the first layered component covers the non-contact sensing chip in a shielding manner so that the non-contact sensing chip is not exposed from the outside. 如請求項1所述的具有非接觸式感應晶片的金屬感應卡,其中該具有非接觸式感應晶片的金屬感應卡包含一保護層;該保護層係設置於該第一層狀構件的一面且相對於該第二層狀構件。The metal sensor card with a non-contact sensing chip as described in claim 1, wherein the metal sensor card with a non-contact sensing chip includes a protective layer disposed on one side of the first layered structure and opposite to the second layered structure. 如請求項2所述的具有非接觸式感應晶片的金屬感應卡,其中該保護層係為印刷層。The metal sensor card with a non-contact sensing chip as described in claim 2, wherein the protective layer is a printed layer. 如請求項1所述的具有非接觸式感應晶片的金屬感應卡,其中該第二層狀構件包含一提示元件凹槽;該具有非接觸式感應晶片的金屬感應卡包含一提示元件及一提示元件天線;該提示元件係設置於該提示元件凹槽;該提示元件天線係設置於該第一層狀構件或該第二層狀構件,且該晶片感應天線與該提示元件天線各自獨立配置;該提示元件天線電性連接該提示元件天線,並在感應後供應感應電流至該提示元件;該第一層狀構件對應於該提示元件的位置設有一開口。The metal sensor card with a non-contact sensing chip as described in claim 1, wherein the second layered component includes a prompting element recess; the metal sensor card with a non-contact sensing chip includes a prompting element and a prompting element antenna; the prompting element is disposed in the prompting element recess; the prompting element antenna is disposed in the first layered component or the second layered component, and the chip sensing antenna and the prompting element antenna are each independently configured; the prompting element antenna is electrically connected to the prompting element antenna and supplies a sensing current to the prompting element after sensing; the first layered component has an opening corresponding to the position of the prompting element. 如請求項4所述的具有非接觸式感應晶片的金屬感應卡,其中該開口設有一透光填充層;該具有非接觸式感應晶片的金屬感應卡包含一圖案印刷層;該圖案印刷層對應於該開口的位置設有一透光區域。The metal sensor card with a non-contact sensing chip as described in claim 4, wherein the opening is provided with a light-transmitting filling layer; the metal sensor card with a non-contact sensing chip includes a pattern printing layer; the pattern printing layer is provided with a light-transmitting area corresponding to the opening. 如請求項5所述的具有非接觸式感應晶片的金屬感應卡,其中該非接觸式感應晶片的操作電源差小於或大於該提示元件的操作電源差。The metal sensor card with a non-contact sensing chip as described in claim 5, wherein the operating power difference of the non-contact sensing chip is less than or greater than the operating power difference of the indicator element. 如請求項1至6中任一項所述的具有非接觸式感應晶片的金屬感應卡,其中該第一層狀構件的金屬材料為鋁、銅、不鏽鋼、銀、金、鉑或其合金中的一種;該第二層狀構件係為金屬材料或塑膠材料,塑膠材料包含PVC、PE、ABS、PA、PEI、PET、PETG或PS。The metal sensor card with a non-contact sensing chip as described in any of claims 1 to 6, wherein the metal material of the first layer is one of aluminum, copper, stainless steel, silver, gold, platinum or an alloy thereof; and the second layer is a metal material or a plastic material, wherein the plastic material includes PVC, PE, ABS, PA, PEI, PET, PETG or PS. 如請求項7所述的具有非接觸式感應晶片的金屬感應卡,其中該第一層狀構件或該第二層狀構件為金屬材料時,該第一層狀構件或該第二層狀構件包含一破口。The metal sensor card with a non-contact sensing chip as described in claim 7, wherein when the first layered component or the second layered component is a metal material, the first layered component or the second layered component includes a break. 如請求項8所述的具有非接觸式感應晶片的金屬感應卡,其中感應天線與為金屬材料的該第一層狀構件或該第二層狀構件間設置一吸波層;該吸波層以吸波材料製成,吸波材料包含石墨烯、石墨、碳纖維、奈米碳管、鐵氧體或碳化矽。The metal sensor card with a non-contact sensing chip as described in claim 8, wherein an absorbing layer is disposed between the sensing antenna and the first layered component or the second layered component, which is made of metal; the absorbing layer is made of an absorbing material, including graphene, graphite, carbon fiber, carbon nanotubes, ferrite or silicon carbide. 如請求項9所述的具有非接觸式感應晶片的金屬感應卡,其中該吸波層以吸波材料製成,吸波材料包含石墨烯、石墨、碳纖維、奈米碳管、鐵氧體或碳化矽。The metal sensor card with a non-contact sensing chip as described in claim 9, wherein the absorbing layer is made of a microwave absorbing material, including graphene, graphite, carbon fiber, carbon nanotubes, ferrite, or silicon carbide. 如請求項10所述的具有非接觸式感應晶片的金屬感應卡,其中該破口為鋸齒形狀或直線形狀;該破口自該卡片本體的長邊向內延伸,且長度小於短邊的1/2或大於短邊的1/2;該破口為鋸齒形狀或直線形狀;該破口自該卡片本體的短邊向內延伸,且長度小於長邊的1/3或大於長邊的1/3。The metal sensing card with a non-contact sensing chip as described in claim 10, wherein the nick is serrated or straight; the nick extends inward from the long side of the card body and its length is less than 1/2 or greater than 1/2 of the short side; the nick is serrated or straight; the nick extends inward from the short side of the card body and its length is less than 1/3 or greater than 1/3 of the long side. 如請求項11所述的具有非接觸式感應晶片的金屬感應卡,其中該破口的寬度為0.5mm至2mm;該卡片本體的厚度為0.5mm至2mm。The metal sensing card with a non-contact sensing chip as described in claim 11, wherein the width of the opening is 0.5 mm to 2 mm; and the thickness of the card body is 0.5 mm to 2 mm.
TW114208824U 2025-08-21 Metal sensor card with contactless sensing chip TWM679084U (en)

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