TWM673256U - Package structure - Google Patents

Abstract

This invention proposes a package structure comprising an antenna substrate, a package module, and an antenna chip module. The package module is mounted on the antenna substrate and integrates the components of multiple wireless modules. The antenna chip module is mounted directly on the antenna substrate and includes a main antenna electrically connected to the package module. By integrating the components of multiple wireless modules into a package module, mounting it on the antenna substrate, and mounting an antenna chip module directly on the antenna substrate to complement the package module, this invention achieves a miniaturized package structure while simultaneously providing multi-band wireless communication capabilities.

Description

Package structure

This work is about the field of semiconductor packaging technology, specifically a packaging structure.

Traditional multi-band wireless modules are packaged from multiple independent wireless modules, such as wireless local area network (WLAN or WIFI) modules, Bluetooth (BT) modules, near-field communication (NFC) modules, and ultra-wideband (UWB) modules.

Figures 1 and 2 illustrate the product structure of a prior art multi-band wireless module, in which multiple wireless modules 91 are mounted on the back of a motherboard 90, while multiple antennas 92, compatible with these modules, are mounted on the front of the motherboard 90 and/or connected to the product's housing via data cables. Figures 3 and 4 illustrate two other prior art multi-band wireless module product structures, both of which utilize a structure in which multiple wireless modules 91 are mounted on the back of the motherboard 90. In these cases, multiple wireless modules 91 are arranged on the same side of the motherboard 90, occupying a significant amount of space. This results in a bulky product and makes miniaturization difficult.

The purpose of this invention is to provide a packaging structure for miniaturizing the packaging structure.

This invention proposes a package structure comprising: an antenna substrate; a package module disposed on the antenna substrate, the package module integrating components of multiple wireless modules; an antenna chip module disposed directly on the antenna substrate, the antenna chip module including a main antenna electrically connected to the package module.

In some optional embodiments, the antenna chip module is electrically connected to the packaging module through the antenna substrate.

In some optional embodiments, the package module includes a chip.

In some optional embodiments, the packaging module further includes a sub-substrate, and the chip is arranged on the sub-substrate.

In some optional embodiments, the packaging module further includes a passive component, and the passive component is disposed on the sub-substrate.

In some optional embodiments, the packaging module further includes an electrical connection structure, and the electrical connection structure is exposed on the upper surface of the packaging module.

In some optional embodiments, the packaging module further includes a packaging layer, which packages the chip, the submount and the passive component, and the packaging layer exposes the electrical connection structure.

In some optional embodiments, the chip is a microcontroller unit.

In some optional implementations, the main antenna is an antenna designed to be multi-band compatible.

In some optional embodiments, the antenna chip module further includes an insulating substrate supporting the main antenna.

In some optional embodiments, the package structure further includes: a near-field communication antenna printed on the antenna substrate.

In some optional embodiments, the package structure further includes: a near-field communication antenna, disposed on a flexible circuit board, and the flexible circuit board is electrically connected to the antenna substrate.

In some optional embodiments, the antenna chip module and the packaging module are located on the same side surface of the antenna substrate.

In some optional embodiments, the antenna chip module and the packaging module are respectively located on the upper surface and the lower surface of the antenna substrate.

In some optional embodiments, the sub-substrate in the packaging module is electrically connected to the antenna substrate through solder.

In some optional implementations, the main antenna and the near-field communication antenna do not overlap in the horizontal direction or the vertical direction.

In some optional implementations, the main antenna and the near-field communication antenna overlap in the horizontal direction.

To address the difficulties in miniaturizing traditional multi-band wireless modules, this invention proposes a packaging structure that integrates the components of multiple wireless modules into a single package, mounts it on an antenna substrate, and directly mounts an antenna chip module that matches the package module on the antenna substrate. This achieves the goal of miniaturizing the package structure while simultaneously providing multi-band wireless communication capabilities.

The following describes the specific implementations of this invention using diagrams and examples. Through this description, those skilled in the art will readily understand the technical problems solved by this invention and the technical effects it produces. It should be understood that the specific examples described herein are intended solely to illustrate the invention and are not intended to limit it. Furthermore, for ease of description, the diagrams only illustrate portions relevant to the invention.

It should be readily understood that the meanings of “on,” “over,” and “above” in this application should be interpreted in the broadest possible manner, such that “on” means not only “directly on something,” but also “on something” including intermediate components or layers existing between the two.

Furthermore, for ease of description, spatially relative terms such as "below," "beneath," "lower," "above," and "upper" may be used herein to describe one element or component's relationship to another element or component illustrated in the drawings. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90° or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

As used herein, the term "layer" refers to a portion of a material comprising an area having a certain thickness. A layer may extend over the entire underlying or overlying structure, or may have an extent less than the extent of the underlying or overlying structure. Furthermore, a layer may be a region of a homogeneous or inhomogeneous continuous structure having a thickness less than the thickness of the continuous structure. For example, a layer may be located between the top and bottom surfaces of the continuous structure, or between any pair of horizontal planes therebetween. A layer may extend horizontally, vertically, and/or along a tapered surface. A substrate may be a layer, may include one or more layers therein, and/or may have one or more layers thereon, above, and/or below. A layer may include multiple layers. For example, the semiconductor layer may include one or more doped or undoped semiconductor layers and may have the same or different materials.

As used herein, the term "substrate" refers to the material onto which subsequent layers of material are added. The substrate itself can be patterned. The material added on top of the substrate can be patterned or remain unpatterned. Furthermore, the substrate can comprise a variety of semiconductor materials, such as silicon, silicon carbide, gallium nitride, germanium, gallium arsenide, indium phosphide, and others. Alternatively, the substrate can be made of non-conductive materials, such as glass, plastic, or a sapphire wafer. Further alternatively, the substrate can have semiconductor devices or circuits formed therein.

It should be noted that the structures, proportions, sizes, etc. depicted in the figures in this specification are intended solely to facilitate understanding and reading of the contents described in this specification, and are not intended to limit the conditions under which this invention can be implemented. Therefore, they have no substantive technical significance. Any structural modifications, changes in proportional relationships, or adjustments in size, as long as they do not affect the efficacy and objectives that can be achieved by this invention, should still fall within the scope of the technical content disclosed in this invention. At the same time, terms such as "on", "first", "second" and "one" cited in this manual are only for the convenience of description and are not used to limit the scope of implementation of this creation. Changes or adjustments to their relative relationships, without substantially changing the technical content, should also be regarded as the scope of implementation of this creation.

It should also be noted that the longitudinal section corresponding to the embodiment of the present invention can be the section corresponding to the front view direction, the transverse section can be the section corresponding to the right view direction, and the horizontal section can be the section corresponding to the top view direction.

In addition, the embodiments and features of the present invention may be combined with each other without conflict. The present invention will be described in detail below with reference to the drawings and in conjunction with the embodiments.

Refer to Figure 5, which is a schematic longitudinal cross-sectional view of a package structure 100 according to an embodiment of the present invention. As shown in Figure 5, package structure 100 of the present invention includes: An antenna substrate 10; A package module 20, mounted on antenna substrate 10, integrates components of multiple wireless modules and provides multiple wireless module functions; An antenna chip module 30, mounted directly on antenna substrate 10, includes a main antenna 31 electrically connected to package module 20.

Here, the antenna substrate 10 can be composed of conductive and dielectric materials. The dielectric material can include organic and/or inorganic materials. Examples of organic materials include polyamide (PA) fiber, polyimide (PI), epoxy, poly-p-phenylene benzobisoxazole (PBO) fiber, FR-4 epoxy glass cloth laminate, PP (Prepreg) or prepreg, and ABF (Ajinomoto Build-up Film). Examples of inorganic materials include silicon (Si), glass, ceramic, silicon oxide, silicon nitride, and tantalum oxide. The conductive material can include a seed layer and a metal layer. Here, the seed layer may be, for example, titanium (Ti), tungsten (W), nickel (Ni), etc., and the metal layer may be, for example, gold (Au), silver (Ag), aluminum (Al), nickel (Ni), palladium (Pd), copper (Cu), or an alloy thereof.

Here, package module 20 integrates the components and functions of multiple wireless modules. These multiple wireless modules include, but are not limited to, at least two of the following: a wireless local area network (WLAN or WIFI) module, a Bluetooth (BT) module, a near-field communication (NFC) module, and an ultra-wideband (UWB) module, thereby providing multi-band wireless communication capabilities. The wireless local area network module may include a 2.4/5 GHz module.

Here, the antenna chip module 30 includes a main antenna 31, which is electrically connected to the package module 20 and provides antenna functions for the multiple wireless module functions integrated into the package module 20.

In some optional embodiments, the antenna chip module 30 may include multiple main antennas 31, thereby providing independent antennas for the multiple wireless module functions of the package module 20.

In some optional embodiments, the main antenna 31 can be a multi-band compatible antenna. Thus, the multiple wireless modules in the package module 20 can use the same main antenna 31. A multi-band compatible antenna can cover multiple frequency bands, such as supporting both the 2.4 GHz and 5 GHz bands, or a wider frequency range, such as 3.2 GHz to 6 GHz.

In some optional embodiments, the antenna chip module 30 further includes an insulating substrate 32 that supports the main antenna 31. Here, the insulating substrate 32 includes, but is not limited to, a wafer material, a substrate material, or a molding material, such as epoxy molding compound (EMC). The main antenna 31 can be fabricated on the insulating substrate 32 to form the antenna chip module 30.

In some optional embodiments, the antenna chip module 30 is electrically connected to the package module 20 through the antenna substrate 10 .

In some optional embodiments, the package module 20 includes a chip 21. Here, the chip 21 includes but is not limited to a microcontroller unit (MCU).

In some optional embodiments, the package module 20 further includes a submount 22, and the chip 21 is disposed on the submount 22. The submount 22 is the supporting part of the entire package module 20.

In some optional embodiments, the package module 20 further includes a passive component 23, which is disposed on the submount 22. The passive component 23 includes but is not limited to a capacitor, a resistor, and an inductor.

In some optional embodiments, package module 20 further includes an electrical connection structure 24 exposed on the top surface of package module 20. Here, electrical connection structure 24 includes, but is not limited to, solder balls (e.g., solder balls). Electrical connection structure 24 is configured to electrically connect to an external device, thereby shortening the electrical path between the external device and components within package module 20, such as chip 21, and improving electrical performance.

In some optional embodiments, package module 20 further includes a packaging layer 25, which encapsulates chip 21, submount 22, and passive component 23, and exposes electrical connection structure 24. Various molding materials can be used for packaging layer 25. Exemplarily, packaging layer 25 encapsulates chip 21, passive component 23, and electrical connection structure 24 on the top surface of submount 22, with the top surface of electrical connection structure 24 exposed (or protruding from) the top surface of submount 22.

In some optional embodiments, the submount 22 in the package module 20 is electrically connected to the antenna substrate 10 via solder 11.

In some optional embodiments, the antenna chip module 30 and the packaging module 20 can be disposed on the same side surface (upper surface or lower surface) of the antenna substrate 10, or can be located on the upper surface and lower surface of the antenna substrate 10 respectively.

In some optional embodiments, the package structure 100 of the present invention further includes: a near-field communication antenna 33 printed on the antenna substrate 10.

In some optional embodiments, the package module 20 and the antenna chip module 30 are disposed on the same side surface of the antenna substrate 10, such as the upper surface, and the near field communication antenna 33 is printed on the other side surface of the antenna substrate 10, such as the lower surface.

In some optional embodiments, the main antenna 31 and the near-field communication antenna 33 do not overlap in the horizontal direction or the vertical direction.

As described above, the package structure 100 disclosed in this invention integrates the components and functions of multiple wireless modules into a package module 20, which is then mounted on an antenna substrate 10. Furthermore, an antenna chip module 30 is mounted on the antenna substrate 10, and a near-field communication antenna 33 is printed directly on the antenna substrate 10. This achieves multi-band wireless communication functionality and miniaturization of the package structure 100.

Refer to Figure 6, which is a schematic longitudinal cross-sectional view of a package structure 200 according to an embodiment of the present invention. The package structure 200 shown in Figure 6 is similar to the package structure 100 shown in Figure 5, except that: The package structure 200 further includes a near-field communication antenna 33 disposed on a flexible circuit board 40, which is electrically connected to the antenna substrate 10.

Here, the NFC antenna 33 is no longer mounted on the antenna substrate 10, but is instead externally mounted on a flexible circuit board 40. Furthermore, the flexible circuit board 40 housing the NFC antenna 33 can be connected to the product's housing. This allows the NFC antenna 33 to have even stronger sensing capabilities.

In some optional implementations, the main antenna 31 and the near-field communication antenna 33 may overlap in the horizontal direction but may not overlap in the vertical direction.

By placing the near-field communication antenna 33 on a flexible circuit board 40 outside the antenna substrate 10, the package structure 200 of this invention is no longer restricted by the layout of the antenna substrate 10. This allows for greater design flexibility, better signal optimization, improved heat dissipation, and more stable operation.

Refer to Figure 7, which is a schematic longitudinal cross-sectional view of a package structure 300 according to an embodiment of the present invention. Package structure 300 shown in Figure 7 is similar to package structure 100 shown in Figure 5, with the following differences: In package structure 300, antenna chip module 30 and package module 20 are located on the upper and lower surfaces of antenna substrate 10, respectively.

Furthermore, the chip 21, passive component 23, and electrical connection structure 24 in the package module 20 are directly disposed on the antenna substrate 10 and encapsulated by the package layer 25. Compared to the package structure 100 shown in FIG5 , the submount 22 is not provided.

Within package structure 300, antenna chip module 30 can be implemented in various ways. Referring to Figure 8 , a schematic diagram of the structure of antenna chip module 30 according to one embodiment of this invention is shown. As shown in Figure 8 , a main antenna 31 and a near-field communication antenna 33 can be mounted on an insulating substrate 32 of antenna chip module 30. The main antenna 31 can be shaped like a "[" and positioned on the left side, while the near-field communication antenna 33 can be spiral-shaped and positioned on the right side.

Refer to Figure 9, which is a schematic diagram of the structure of an antenna chip module 30 according to another embodiment of this invention. The antenna chip module 30 shown in Figure 9 differs from the one in Figure 8 in that the main antenna 31 is L-shaped, with a portion located on the left side of the insulating substrate 32 and another portion extending to the right.

In some optional embodiments, in the package structure 300, the main antenna 31 can be a Bluetooth Low Energy (BLE) antenna or a wireless local area network (WIFI) antenna manufactured using Laser Direct Structuring (LDS) technology, abbreviated as LDS BLT/WIFI ANT.

In some optional embodiments, in the package structure 300, the near field communication antenna 33 can be a near field communication antenna manufactured using laser direct structuring (LDS) technology, referred to as LDS NFC ANT.

This invention's package structure 300 places the antenna chip module 30 and package module 20 on either side of the antenna substrate 10, without a sub-substrate 22. The LDS BLT/WIFI ANT and LDS NFC ANT integrated in the antenna chip module 30 work in conjunction with the chip 21 (which can be a microcontroller) in the package module 20 to achieve multi-band wireless communication. Compared to package structure 100, package structure 300 offers a higher level of integration and a smaller footprint, making it more suitable for electronic products requiring even greater miniaturization.

Referring to Figure 10, Figure 10 is a schematic diagram of the manufacturing steps of the package structure 300 of an embodiment of the present invention. Combined with Figures 7 and 10, the manufacturing process of the package structure 300 of the present invention includes the following steps.

1. Substrate Incoming (SBS Incoming): Receive raw materials of the antenna substrate 10 , which can be, for example, a surface mount substrate (SBS).

2. Solder printing: Print solder paste as solder 11 on the antenna substrate 10 to prepare for component placement.

3. Backside SMT (Surface Mount Technology): Components such as the chip 21 and passive components 23 are mounted on the backside (lower surface) of the antenna substrate using surface mount technology (SMT).

4. Reflow: The reflow process melts the solder 11, completing the soldering of the mounted components to the antenna substrate 10.

5. Flux clean: Clean and remove the residual flux left during the soldering process.

6. Visual inspection: Check the soldering quality and component placement by visual inspection.

7. Ball Planting (SBBP): Solder balls are placed on the bottom surface of the antenna substrate 10 as electrical connection structures 24.

8. Reflow: Reflow is performed again to solder the electrical connection structure 24.

9. Flux clean: Remove residual flux to ensure a clean soldering area.

10. Plasma Cleaning (BE Plasma Clean): Use plasma technology to clean the surface of the antenna substrate 10 to remove organic matter and oxide layers.

11. Mold: The lower surface of the antenna substrate 10 is molded to form a packaging layer 25. The packaging layer 25 encapsulates the chip 21 and the passive component 23 and exposes the electrical connector structure 24.

12. Baking (PMC): The packaging layer 25 is cured by high temperature baking.

13. Strip grinding: Grinding the packaging layer 25.

14. Laser marking: Use laser technology to mark the antenna substrate 10.

15. Laser Ablation: Use laser to remove specific materials or areas on the antenna substrate 10.

16. Solder printing: Print solder paste as solder 11 on the upper surface of the antenna substrate 10 .

17. Front SMT: The antenna chip module 30 is mounted on the top surface of the antenna substrate 10 using surface mount technology (SMT).

18. Reflow: Reflow the components mounted on the surface.

19. Flux clean: Clean and remove the residual flux left during the soldering process.

20. Visual inspection: Perform another visual inspection to ensure soldering quality and correct component placement.

21. Singulation Saw: Use a saw to separate the antenna substrate 10 into individual units.

22. Visual Inspection (RVSI): Perform visual inspection to ensure product quality.

23. Shipping: After completing all production steps, the product is ready for shipment.

Above, this invention introduces the package structure 100, package structure 200 and package structure 300 proposed in this invention respectively in combination with Figures 5 to 7, and introduces the manufacturing steps of the package structure 300 in combination with Figure 10. As for the manufacturing steps of the package structure 100 and the package structure 200, please refer to Figure 10 and will not be repeated in this article.

This innovation, through innovative design optimizations such as structural design and material selection, provides a more compact and efficient wireless communication solution, enabling multi-band wireless communication while also miniaturizing the product. By improving communication performance and reducing interference, this innovation supports a wider range of application scenarios.

This product is suitable for wireless modules such as WIFI (Wireless Local Area Network)/UWB (Ultra-Wideband)/NFC (Near Field Communication)/BT (Bluetooth), or communication products and devices that require multi-band wireless communication, such as AP (Access Point) routers. For example, it can be applied to the following wireless module integration applications: UWB AOP/AIP/SIP (Ultra-Wideband Antenna-on-Package/Antenna-in-Package/System-in-Package); BT AOP/AIP/SIP (Bluetooth Antenna-on-Package/Antenna-in-Package/System-in-Package); WIFI AOP/AIP/SIP (Wireless LAN Antenna-on-Package/Antenna-in-Package/System-in-Package); NFC AOP/SIP (Near-Field Communication Antenna-on-Package/System-in-Package); Multi-Band/Tri-Band AOP/SIP (Multi-Band/Tri-Band Antenna-on-Package/System-in-Package); Directional Antenna.

The above multiple embodiments disclosed in this invention can be applied to different application scenarios.

Package Structure 300: Main Applications: Mobile phones, watches, and other portable devices; Features: Integrates the LDS NFC ANT and LDS BLT/WIFI ANT; Function: Provides a compact multi-band wireless communication solution, particularly suitable for portable devices with limited space.

Package Structure 100: Primary Applications: Desktop or Home Wireless Communication Devices; Features: Near-field communication antennas can be manufactured directly on antenna substrates using a printing process; Function: Allows near-field communication antennas to be tightly integrated with other electronic components while maintaining design flexibility and cost-effectiveness.

Package Structure 200: Primary Applications: Desktop or Home Wireless Communication Devices; Features: The NFC antenna extends through a flexible circuit board and can be attached to the device housing; Function: Provides greater design flexibility, allowing the NFC antenna to be placed anywhere in the housing while maintaining connectivity to the electronic components.

Furthermore, the present invention's package structure 100/200/300 allows different devices to sense each other through their respective near-field communication antennas 33, allowing them to connect to each other via the main antenna 31. When two devices are close together, their near-field communication antennas 33 sense each other. Once this sense occurs, it triggers the main antenna 31 to establish a connection, enabling wireless communication between the two devices.

Although the present invention has been described and illustrated with reference to specific embodiments thereof, such descriptions and illustrations do not limit the present invention. It will be clearly understood by those skilled in the art that various changes may be made and that equivalent elements may be substituted within the embodiments without departing from the true spirit and scope of the present invention as defined by the appended patent claims. The illustrations may not necessarily be drawn to scale. Due to variables in the manufacturing process, among other things, there may be differences between the technical reproduction of the present invention and the actual implementation. There may be other embodiments of the present invention that are not specifically described. The specification and drawings should be regarded as illustrative, not restrictive. Modifications may be made to adapt a particular situation, material, composition of matter, method, or process to the objectives, spirit, and scope of the present invention. All such modifications fall within the scope of the appended patent claims. Although the methods disclosed herein have been described with reference to specific operations performed in a specific order, it should be understood that these operations can be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of the present invention. Therefore, unless specifically indicated herein, the order and grouping of operations do not limit the present invention.

10: Antenna substrate 11: Solder 20: Package module 21: Chip 22: Substrate 23: Passive component 24: Electrical connection structure 25: Package layer 30: Antenna chip module 31: Main antenna 32: Insulation substrate 33: Near-field communication antenna 40: Flexible circuit board 90: Motherboard 91: Wireless module 92: Antenna 100, 200, 300: Package structure

Other features, objectives, and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments with reference to the following figures: Figures 1 and 2 are schematic diagrams of the front and back structures of a multi-band wireless module known in the prior art; Figure 3 is a schematic diagram of the back structure of another multi-band wireless module known in the prior art; Figure 4 is a schematic diagram of the back structure of yet another multi-band wireless module known in the prior art; Figure 5 is a schematic diagram of the longitudinal cross-section of the package structure of one embodiment of the present invention; Figure 6 is a schematic diagram of the longitudinal cross-section of the package structure of one embodiment of the present invention; Figure 7 is a schematic diagram of the longitudinal cross-section of the package structure of one embodiment of the present invention; Figure 8 is a schematic diagram of the structure of an antenna chip module according to one embodiment of this invention; Figure 9 is a schematic diagram of the structure of an antenna chip module according to another embodiment of this invention; Figure 10 is a schematic diagram illustrating the manufacturing steps of a package structure according to one embodiment of this invention.

10: Antenna substrate

11: Solder

20: Packaging module

21: Chip

22:Subbase

23: Passive components

24: Electrical connection structure

25: Packaging layer

30: Antenna chip module

31: Main Antenna

32: Insulation base material

33: Near Field Communication Antenna

100:Packaging structure

Claims (17)

A package structure includes: an antenna substrate; a package module disposed on the antenna substrate, the package module integrating components of multiple wireless modules; and an antenna chip module disposed directly on the antenna substrate, the antenna chip module including a main antenna electrically connected to the package module. The package structure as described in claim 1, wherein the antenna chip module is electrically connected to the package module through the antenna substrate. The packaging structure as described in claim 1, wherein the packaging module includes a chip. The packaging structure as described in claim 3, wherein the packaging module further includes a sub-substrate, and the chip is arranged on the sub-substrate. The packaging structure as described in claim 4, wherein the packaging module further includes a passive component, and the passive component is arranged on the sub-substrate. The packaging structure as described in claim 5, wherein the packaging module further includes an electrical connection structure, and the electrical connection structure is exposed on the upper surface of the packaging module. The packaging structure as described in claim 6, wherein the packaging module further includes a packaging layer, the packaging layer encapsulates the chip, the submount and the passive component, and the packaging layer exposes the electrical connection structure. The package structure as described in claim 7, wherein the chip is a micro control unit. The package structure as described in claim 1, wherein the main antenna is an antenna with a multi-band compatible design. The package structure as described in claim 1, wherein the antenna chip module further includes an insulating substrate supporting the main antenna. The package structure as described in claim 1, wherein the package structure further includes: a near field communication antenna printed on the antenna substrate. The package structure as described in claim 1, wherein the package structure further includes: a near-field communication antenna, which is arranged on a flexible circuit board, and the flexible circuit board is electrically connected to the antenna substrate. The package structure as described in claim 1, wherein the antenna chip module and the package module are located on the same side surface of the antenna substrate. The packaging structure as described in claim 1, wherein the antenna chip module and the packaging module are respectively located on the upper surface and the lower surface of the antenna substrate. The packaging structure as described in claim 7, wherein the sub-substrate in the packaging module is electrically connected to the antenna substrate through solder. The package structure as described in claim 11, wherein the main antenna and the near-field communication antenna do not overlap in the horizontal direction and the vertical direction. The package structure as described in claim 12, wherein the main antenna and the near-field communication antenna overlap in the horizontal direction.