TWM659441U - Storage array device and server equipment having the same - Google Patents

Storage array device and server equipment having the same Download PDF

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Publication number
TWM659441U
TWM659441U TW113205566U TW113205566U TWM659441U TW M659441 U TWM659441 U TW M659441U TW 113205566 U TW113205566 U TW 113205566U TW 113205566 U TW113205566 U TW 113205566U TW M659441 U TWM659441 U TW M659441U
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Taiwan
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hard disk
locking
storage array
slots
array device
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TW113205566U
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Chinese (zh)
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胡東暘
蔡錦茂
簡嘉毅
張志豪
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勤誠興業股份有限公司
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Priority to TW113205566U priority Critical patent/TWM659441U/en
Publication of TWM659441U publication Critical patent/TWM659441U/en

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Abstract

A storage array device includes a chassis and a plurality of hard disk module. The chassis is formed with a plurality of recesses, and the positions of the chassis corresponding to each recess has a first fixing portion and a second fixing portion, respectively. The first fixing portion and the second fixing portion have different locking specifications. Each of the hard drive modules includes a hard drive frame, a locking component, a backplane and a removable hard drive. The fixed component is located on the outer side of the hard drive frame. The removable hard drive is located within a slot of the hard drive frame and electrically connected to the backplane. When the locking specification of the fixing component matches the locking specification of the first fixing portion, the hard disk frame can be installed into the corresponding recess by locking the fixing component and the first fixing portion with each other. When the locking specification of the fixing component matches the locking specification of the second fixing portion, the hard disk frame can be installed into corresponding recess by locking the fixing component and the second fixing portion with each other.

Description

儲存陣列裝置及具有此儲存陣列裝置之伺服器設備Storage array device and server equipment having the storage array device

本創作有關於一種儲存陣列裝置及具有此儲存陣列裝置之伺服器設備,尤指一種其內可以組裝不同規格之硬碟模組的儲存陣列裝置及伺服器設備。This invention relates to a storage array device and a server device having the storage array device, and in particular to a storage array device and a server device in which hard disk modules of different specifications can be assembled.

基於雲端服務大量資料儲存與交換等需求日益提升,為了提供更好的網路服務,伺服器設備不免需要搭配大量的儲存硬碟,以提高伺服器設備的服務品質。舉例來說,伺服器設備之一側會全面地依序配置多數個硬碟裝置,從而為雲端服務提供更多的儲存性能。Based on the increasing demand for large amounts of data storage and exchange in cloud services, in order to provide better network services, server equipment inevitably needs to be equipped with a large number of storage hard drives to improve the service quality of server equipment. For example, one side of the server equipment will be fully configured with multiple hard drive devices in sequence to provide more storage performance for cloud services.

然而,傳統設備所配置之抽拉式硬碟架內之全部或至少特定區塊只能配置特定規格之硬碟裝置,無法配合需求或限制而靈活地設計成可兼容不同尺寸規格的硬碟裝置,從而降低版面配置之靈活度以及選擇性。However, all or at least certain areas of the pull-out hard disk racks configured in traditional devices can only be configured with hard disk devices of specific specifications, and cannot be flexibly designed to be compatible with hard disk devices of different sizes and specifications in accordance with needs or restrictions, thereby reducing the flexibility and selectivity of layout configuration.

由此可見,上述技術顯然仍存在不便與缺陷,而有待加以進一步改良。因此,如何能有效地解決上述不便與缺陷,實屬當前重要研發課題之一,亦成爲當前相關領域亟需改進的目標。It can be seen that the above technology still has inconveniences and defects, and needs to be further improved. Therefore, how to effectively solve the above inconveniences and defects is one of the important research and development topics at present, and has also become a goal that needs to be improved urgently in the current related fields.

本創作提出一種儲存陣列裝置及具有此儲存陣列裝置之伺服器設備,用以解決先前技術的問題。This invention proposes a storage array device and a server device having the storage array device to solve the problems of the prior art.

依據本創作之一實施方式,一種儲存陣列裝置包含一機殼及多個硬碟模組。機殼具有多個開槽。機殼對應每個開槽之位置分別具有一第一固定部與一第二固定部。第一固定部之鎖固規格不同於第二固定部之鎖固規格。每個硬碟模組包含一承載架、一固定部件、一第一電路背板與至少一硬碟單元。承載架具有一容置槽,固定部件設於承載架之外側面,硬碟單元位於容置槽內,且電連接第一電路背板。如此,當固定部件的一鎖固規格匹配第一固定部的鎖固規格時,透過固定部件與第一固定部相互固定,承載架能夠安裝至其中一開槽內。當固定部件的鎖固規格匹配第二固定部的鎖固規格時,透過固定部件與第二固定部相互固定,承載架能夠安裝至所述開槽內。According to one implementation method of the present invention, a storage array device includes a case and a plurality of hard disk modules. The case has a plurality of slots. The case has a first fixing portion and a second fixing portion at positions corresponding to each slot. The locking specification of the first fixing portion is different from the locking specification of the second fixing portion. Each hard disk module includes a carrier, a fixing component, a first circuit backplane and at least one hard disk unit. The carrier has a receiving slot, the fixing component is arranged on the outer side of the carrier, the hard disk unit is located in the receiving slot, and is electrically connected to the first circuit backplane. In this way, when a locking specification of the fixing component matches the locking specification of the first fixing portion, the carrier can be installed in one of the slots by fixing the fixing component and the first fixing portion to each other. When the locking specification of the fixing component matches the locking specification of the second fixing portion, the carrier can be installed in the slot by fixing the fixing component and the second fixing portion to each other.

依據本創作一或複數個實施例,在上述儲存陣列裝置中,承載架包含一罩蓋、一底板、一第一鎖固部及一第二鎖固部。底板之一部分覆蓋罩蓋,並與罩蓋共同定義出容置槽,其另一部分橫向伸出罩蓋,第一鎖固部位於罩蓋上,且第二鎖固部位於底板上。第一電路背板包含一第一配線板及一第三鎖固部。第三鎖固部位於第一配線板上,且鎖附至第一鎖固部及第二鎖固部其中之一。According to one or more embodiments of the invention, in the storage array device, the carrier includes a cover, a bottom plate, a first locking portion, and a second locking portion. A portion of the bottom plate covers the cover and defines a receiving slot together with the cover, and another portion thereof extends laterally out of the cover, the first locking portion is on the cover, and the second locking portion is on the bottom plate. The first circuit backplane includes a first wiring board and a third locking portion. The third locking portion is on the first wiring board and is locked to one of the first locking portion and the second locking portion.

依據本創作一或複數個實施例,在上述儲存陣列裝置中,透過第三鎖固部與第一鎖固部之相互鎖附,第一電路背板覆蓋罩蓋,且豎立於底板上。透過第三鎖固部與第二鎖固部之相互鎖附,第一電路背板平放且覆蓋底板。According to one or more embodiments of the invention, in the storage array device, the first circuit backplane covers the cover and stands upright on the bottom plate by locking the third locking portion with the first locking portion. The first circuit backplane lies flat and covers the bottom plate by locking the third locking portion with the second locking portion.

依據本創作一或複數個實施例,在上述儲存陣列裝置中,承載架更包含一分隔板。分隔板固定於罩蓋內,並將容置槽分隔為二分隔槽,這些分隔槽沿一垂直方向排列。硬碟單元包含多個硬碟單元。這些硬碟單元分別排列於這些分隔槽內,這些硬碟單元之一部份受承載於分隔板上,且這些硬碟單元之另一部份受承載於底板上。According to one or more embodiments of the invention, in the storage array device, the support frame further includes a partition plate. The partition plate is fixed in the cover and divides the receiving slot into two partition slots, and the partition slots are arranged in a vertical direction. The hard disk unit includes a plurality of hard disk units. The hard disk units are arranged in the partition slots respectively, a part of the hard disk units is supported on the partition plate, and another part of the hard disk units is supported on the bottom plate.

依據本創作一或複數個實施例,在上述儲存陣列裝置中,承載架更包含二側板、一載板及一第四鎖固部。此二側板相對地位於罩蓋上,自罩蓋沿同一方向共同延伸,且連接底板之另一部分。載板位於容置槽之外,覆蓋這些側板與底板之另一部分,並與底板之間具有一垂直間隔。第四鎖固部形成於載板上,且位於容置槽之外。According to one or more embodiments of the invention, in the storage array device, the support frame further includes two side plates, a carrier plate and a fourth locking portion. The two side plates are relatively located on the cover, extend from the cover in the same direction, and are connected to another portion of the bottom plate. The carrier plate is located outside the receiving groove, covers the side plates and another portion of the bottom plate, and has a vertical spacing with the bottom plate. The fourth locking portion is formed on the carrier plate and is located outside the receiving groove.

依據本創作一或複數個實施例,在上述儲存陣列裝置中,其中一硬碟模組更包含一第二電路背板。第二電路背板包含一第二配線板及一第五鎖固部。第二配線板位於容置槽之外,平放及覆蓋於載板上,且電連接這些硬碟單元。第五鎖固部位於第二配線板上,且鎖附至第四鎖固部上。According to one or more embodiments of the invention, in the storage array device, one of the hard disk modules further includes a second circuit backplane. The second circuit backplane includes a second wiring board and a fifth locking portion. The second wiring board is located outside the receiving slot, laid flat and covered on the carrier, and electrically connected to the hard disk units. The fifth locking portion is on the second wiring board and is locked to the fourth locking portion.

依據本創作一或複數個實施例,在上述儲存陣列裝置中,承載架更包含多個分隔部,這些分隔部固定於承載架內,將容置槽分隔為多個分隔槽,這些分隔槽沿一水平方向線性排列。硬碟單元包含多個硬碟單元,這些硬碟單元分別排列於這些分隔槽內。According to one or more embodiments of the invention, in the storage array device, the support frame further includes a plurality of partitions, which are fixed in the support frame and divide the receiving slot into a plurality of partition slots, which are linearly arranged along a horizontal direction. The hard disk unit includes a plurality of hard disk units, which are respectively arranged in the partition slots.

依據本創作一或複數個實施例,在上述儲存陣列裝置中,每個硬碟單元包含一磁碟本體、一把手端蓋及一前擋蓋。磁碟本體位於其中一分隔槽。把手端蓋固定於磁碟本體之前端面之一部分,且伸出此開槽。前擋蓋並排至把手端蓋之一側,固定至磁碟本體之前端面之另一部分,且從其中一開槽所外露。According to one or more embodiments of the invention, in the storage array device, each hard disk unit includes a disk body, a handle end cover and a front cover. The disk body is located in one of the partition slots. The handle end cover is fixed to a portion of the front end surface of the disk body and extends out of the slot. The front cover is arranged side by side with the handle end cover, fixed to another portion of the front end surface of the disk body, and exposed from one of the slots.

依據本創作一或複數個實施例,在上述儲存陣列裝置中,這些硬碟模組之一部分沿一水平方向排列於其中一開槽中,這些硬碟模組之另一部分沿一垂直方向排列於另一開槽中。According to one or more embodiments of the present invention, in the storage array device, a portion of the hard disk modules are arranged in one of the slots along a horizontal direction, and another portion of the hard disk modules are arranged in another slot along a vertical direction.

依據本創作一或複數個實施例,在上述儲存陣列裝置中,固定部件、第一固定部與第二固定部為一螺合配件組或一卡扣配件組。According to one or more embodiments of the present invention, in the storage array device, the fixing component, the first fixing portion and the second fixing portion are a screw-fitting accessory set or a snap-fitting accessory set.

依據本創作一或複數個實施例,在上述儲存陣列裝置中,硬碟單元包含一磁碟本體、一把手端蓋、一鰭片組及一前擋蓋。把手端蓋連接磁碟本體之一前端面,且露出所述開槽。鰭片組固定於磁碟本體之長側面。前擋蓋固定於把手端蓋之一側,且遮蔽鰭片組。According to one or more embodiments of the invention, in the storage array device, the hard disk unit includes a disk body, a handle end cover, a fin set and a front cover. The handle end cover is connected to a front end surface of the disk body and exposes the slot. The fin set is fixed to the long side of the disk body. The front cover is fixed to one side of the handle end cover and shields the fin set.

依據本創作之一實施方式,一種伺服器設備包含一機箱、一主板、一電源模組、一輸入輸出模組及上述儲存陣列裝置。主板位於機箱內。電源模組位於機箱內,且電連接主板。輸入輸出模組位於機箱之後端,且電連接主板。儲存陣列裝置位於機箱之前端,且電性連接主板。According to an implementation method of the present invention, a server device includes a chassis, a motherboard, a power module, an input-output module and the above-mentioned storage array device. The motherboard is located in the chassis. The power module is located in the chassis and is electrically connected to the motherboard. The input-output module is located at the rear end of the chassis and is electrically connected to the motherboard. The storage array device is located at the front end of the chassis and is electrically connected to the motherboard.

如此,透過以上架構,本創作之儲存陣列裝置能夠靈活地設計成可兼容不同尺寸規格的硬碟裝置,從而提高版面配置之靈活度以及選擇性。Thus, through the above structure, the storage array device of this creation can be flexibly designed to be compatible with hard disk devices of different sizes and specifications, thereby improving the flexibility and selectivity of the layout configuration.

以上所述僅係用以闡述本創作所欲解決的問題、解決問題的技術手段、及其產生的功效等等,本創作之具體細節將在下文的實施方式及相關圖式中詳細介紹。The above is only used to explain the problems that this creation is intended to solve, the technical means to solve the problems, and the effects produced, etc. The specific details of this creation will be introduced in detail in the implementation method and related diagrams below.

以下將以圖式揭露本創作之複數實施方式,為明以下將以圖式揭露本創作之複數實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,熟悉本領域之技術人員應當瞭解到,在本創作部分實施方式中,這些實務上的細節並非必要的,因此不應用以限制本創作。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。另外,為了便於讀者觀看,圖式中各元件的尺寸並非依實際比例繪示。The following will disclose multiple implementations of the present invention with drawings. For the sake of clarity, many practical details will be described together in the following description. However, those skilled in the art should understand that these practical details are not necessary in some implementations of the present invention and should not be used to limit the present invention. In addition, in order to simplify the drawings, some commonly used structures and components will be depicted in the drawings in a simple schematic manner. In addition, in order to facilitate the reader's viewing, the size of each component in the drawings is not drawn according to the actual scale.

第1圖為本創作一實施例之儲存陣列裝置10的立體圖。第2圖為第1圖之儲存陣列裝置10的分解圖。第3圖為第1圖之第一硬碟模組200的分解圖。在本實施例中,如第1圖至第3圖所示,此儲存陣列裝置10包含一機殼100及多個(如3個)硬碟模組(後稱第一硬碟模組200、第二硬碟模組300及第三硬碟模組400)。機殼100內具有多個間隔排列之隔間板101,使得機殼100及這些隔間板101因此定義出多個(如3個)開槽110,這些開槽110沿機殼100之長軸方向(如X軸方向)依序排列。機殼100對應於每個開槽110之位置具有多種固定部。舉例來說,固定部包含第一固定部120、第二固定部130與第三固定部140,且第一固定部120、第二固定部130與第三固定部140之鎖固規格彼此不同(如第2圖)。第一硬碟模組200、第二硬碟模組300及第三硬碟模組400沿機殼100之長軸方向(如X軸方向)依序安裝於這些開槽110內。FIG. 1 is a three-dimensional diagram of a storage array device 10 according to an embodiment of the present invention. FIG. 2 is an exploded view of the storage array device 10 of FIG. 1. FIG. 3 is an exploded view of the first hard disk module 200 of FIG. 1. In the present embodiment, as shown in FIG. 1 to FIG. 3, the storage array device 10 includes a housing 100 and a plurality of (e.g., 3) hard disk modules (hereinafter referred to as the first hard disk module 200, the second hard disk module 300, and the third hard disk module 400). The housing 100 has a plurality of partition plates 101 arranged at intervals, so that the housing 100 and these partition plates 101 define a plurality of (e.g., 3) slots 110, and these slots 110 are arranged in sequence along the long axis direction (e.g., the X-axis direction) of the housing 100. The housing 100 has a plurality of fixing parts corresponding to each slot 110. For example, the fixing parts include a first fixing part 120, a second fixing part 130 and a third fixing part 140, and the locking specifications of the first fixing part 120, the second fixing part 130 and the third fixing part 140 are different from each other (as shown in FIG. 2). The first hard disk module 200, the second hard disk module 300 and the third hard disk module 400 are sequentially installed in these slots 110 along the long axis direction (such as the X axis direction) of the housing 100.

如第3圖所示,第一硬碟模組200、第二硬碟模組300及第三硬碟模組400中任一者包含一承載架210、一第一電路背板260與多個硬碟單元280。承載架210具有一容置槽240,容置槽240分別連接承載架210之前緣211與後緣212。這些硬碟單元280並列於容置槽240內,第一電路背板260鎖固至承載架210之後緣212,且分別電連接這些硬碟單元280。更具體地,在本實施例中,第一電路背板260具有多個依序排列之連接部262。每個連接部262以供硬碟單元280插接。每個硬碟單元280能夠沿Y軸方向從承載架210之前緣211插入或抽出容置槽240。第一硬碟模組200更包含一固定部件251A,固定部件251A設於承載架210之外側面213,且固定部件251A的鎖固規格與上述固定部其中一種(例如第一固定部120)的鎖固規格相互匹配。同理,第二硬碟模組300更包含一固定部件251B,此固定部件251B的鎖固規格與上述第二固定部130的鎖固規格相互匹配,且第三硬碟模組400更包含一固定部件251C。固定部件251C的鎖固規格與上述第三固定部140的鎖固規格相互匹配。As shown in FIG. 3 , any one of the first hard disk module 200, the second hard disk module 300 and the third hard disk module 400 includes a carrier 210, a first circuit backplane 260 and a plurality of hard disk units 280. The carrier 210 has a receiving slot 240, and the receiving slot 240 is respectively connected to the front edge 211 and the rear edge 212 of the carrier 210. These hard disk units 280 are arranged side by side in the receiving slot 240, and the first circuit backplane 260 is locked to the rear edge 212 of the carrier 210 and is respectively electrically connected to these hard disk units 280. More specifically, in this embodiment, the first circuit backplane 260 has a plurality of connection portions 262 arranged in sequence. Each connection portion 262 is for plugging a hard disk unit 280. Each hard disk unit 280 can be inserted into or pulled out of the receiving slot 240 from the front edge 211 of the carrier 210 along the Y-axis direction. The first hard disk module 200 further includes a fixing component 251A, which is disposed on the outer side 213 of the carrier 210, and the locking specification of the fixing component 251A matches the locking specification of one of the above-mentioned fixing parts (for example, the first fixing part 120). Similarly, the second hard disk module 300 further includes a fixing component 251B, and the locking specification of this fixing component 251B matches the locking specification of the above-mentioned second fixing part 130, and the third hard disk module 400 further includes a fixing component 251C. The locking specification of the fixing component 251C matches the locking specification of the above-mentioned third fixing part 140.

在本實施例中,如第2圖及第3圖所示,當第一硬碟模組200之固定部件251A的鎖固規格匹配對應開槽110之第一固定部120的鎖固規格,但不匹配同區域之第二固定部130及第三固定部140的鎖固規格時,第一硬碟模組200之承載架210能夠透過固定部件251A與第一固定部120相互固定而安裝至開槽110內。反之,當第一硬碟模組200之固定部件251A的鎖固規格不匹配同區域之第二固定部130及第三固定部140的鎖固規格時,第一硬碟模組200之固定部件251A無法固定於同區域之第二固定部130及第三固定部140上。同理,第二硬碟模組300 (或其他硬碟模組,圖中未示)之固定部件251B的鎖固規格匹配對應開槽110之第二固定部130的鎖固規格,但不匹配同區域之第一固定部120及第三固定部140的鎖固規格,第三硬碟模組400 (或其他硬碟模組,圖中未示)之固定部件251C的鎖固規格匹配對應開槽110之第三固定部140的鎖固規格,但不匹配同區域之第一固定部120及第二固定部130的鎖固規格,第二硬碟模組300之承載架210能夠透過固定部件251B與第二固定部130相互固定而安裝至對應之開槽110內。第三硬碟模組400之承載架210能夠透過固定部件251C與第三固定部140相互固定而安裝至對應之開槽110內。In this embodiment, as shown in FIG. 2 and FIG. 3 , when the locking specification of the fixing member 251A of the first hard disk module 200 matches the locking specification of the first fixing portion 120 of the corresponding slot 110, but does not match the locking specifications of the second fixing portion 130 and the third fixing portion 140 in the same area, the carrier 210 of the first hard disk module 200 can be fixed to the first fixing portion 120 through the fixing member 251A and installed in the slot 110. On the contrary, when the locking specification of the fixing member 251A of the first hard disk module 200 does not match the locking specification of the second fixing portion 130 and the third fixing portion 140 in the same area, the fixing member 251A of the first hard disk module 200 cannot be fixed on the second fixing portion 130 and the third fixing portion 140 in the same area. Similarly, the locking specification of the fixing component 251B of the second hard disk module 300 (or other hard disk modules, not shown in the figure) matches the locking specification of the second fixing portion 130 of the corresponding slot 110, but does not match the locking specification of the first fixing portion 120 and the third fixing portion 140 in the same area. The locking specification of the fixing component 251C of the third hard disk module 400 (or other hard disk modules, not shown in the figure) matches the locking specification of the third fixing portion 140 of the corresponding slot 110, but does not match the locking specification of the first fixing portion 120 and the second fixing portion 130 in the same area. The carrier 210 of the second hard disk module 300 can be installed in the corresponding slot 110 by fixing the fixing component 251B and the second fixing portion 130 to each other. The carrier 210 of the third hard disk module 400 can be installed in the corresponding slot 110 by fixing the fixing member 251C and the third fixing portion 140 to each other.

須了解到,只要每個硬碟模組(如第一硬碟模組200、第二硬碟模組300或第三硬碟模組400)之固定部件251A、251B、251C之鎖固規格與機殼100之開槽110之任一固定部之鎖固規格相互匹配,每個開槽110都可能裝入不同種類之硬碟模組。It should be understood that as long as the locking specifications of the fixing components 251A, 251B, 251C of each hard disk module (such as the first hard disk module 200, the second hard disk module 300 or the third hard disk module 400) match the locking specifications of any fixing portion of the slot 110 of the housing 100, each slot 110 may be equipped with different types of hard disk modules.

舉例來說,由於每個開槽110都設有位置不同之第一固定部120、第二固定部130與第三固定部140,第一硬碟模組200、第二硬碟模組300及第三硬碟模組400任一者都可以被選擇安裝於任一開槽110內。For example, since each slot 110 is provided with the first fixing portion 120 , the second fixing portion 130 and the third fixing portion 140 at different positions, any one of the first hard disk module 200 , the second hard disk module 300 and the third hard disk module 400 can be selected and installed in any slot 110 .

在本實施例中,固定部件251A、251B、251C、機殼100之第一固定部120、第二固定部130與第三固定部140為螺合配件組,鎖固規格為螺合配件組之種類、方向與位置。舉例來說,第一固定部120為第一螺孔121、第二固定部130為第二螺孔131、第三固定部140為第三螺孔141,且固定部件251A、251B、251C分別為螺固孔S或內含螺固孔S之柱體。如此,舉例來說,當第一硬碟模組200之承載架210沿Y軸方向裝入其中一開槽110內,使得固定部件251A之螺固孔S對齊第一固定部120之第一螺孔121時,接著,將一螺栓B鎖入第一螺孔121及螺固孔S,從而讓螺栓B將第一硬碟模組200及機殼100相互固定。第二硬碟模組300與第三硬碟模組400之安裝方式與上述類似,在此不多贅述。In this embodiment, the fixing components 251A, 251B, 251C, the first fixing portion 120, the second fixing portion 130 and the third fixing portion 140 of the housing 100 are screw-fitting parts, and the locking specification is the type, direction and position of the screw-fitting parts. For example, the first fixing portion 120 is a first screw hole 121, the second fixing portion 130 is a second screw hole 131, and the third fixing portion 140 is a third screw hole 141, and the fixing components 251A, 251B, 251C are screw-fitting holes S or columns containing screw-fitting holes S, respectively. Thus, for example, when the carrier 210 of the first hard disk module 200 is installed into one of the slots 110 along the Y-axis direction, so that the screw hole S of the fixing member 251A is aligned with the first screw hole 121 of the first fixing portion 120, then a bolt B is locked into the first screw hole 121 and the screw hole S, so that the bolt B fixes the first hard disk module 200 and the housing 100 to each other. The installation method of the second hard disk module 300 and the third hard disk module 400 is similar to the above, and will not be described in detail here.

然而,本創作不限於此,其他實施例中,固定部件251A、251B或251C、機殼100之第一固定部120、第二固定部130與第三固定部140也可能為卡扣配件組或不同行程之葫蘆孔。However, the invention is not limited thereto, and in other embodiments, the fixing components 251A, 251B or 251C, the first fixing portion 120, the second fixing portion 130 and the third fixing portion 140 of the housing 100 may also be snap-fit accessory assemblies or gourd holes with different strokes.

第4A圖為第1圖依據一模式組合第二硬碟模組300與第一電路背板260的組合圖。第4B圖為第4A圖之第二硬碟模組300與第一電路背板260的局部分解圖。更具體地,如第4A圖與第4B圖所示,承載架210包含一罩蓋220及一底板230。底板230覆蓋罩蓋220,並與罩蓋220共同定義出所述容置槽240。底板230之一部分232連接罩蓋220,其另一部分233沿Y軸方向橫向地伸出罩蓋220。承載架210更包含一第一鎖固部252及一第二鎖固部253。第一鎖固部252位於罩蓋220上,且第二鎖固部253位於底板230上。第一電路背板260包含一第一配線板261及一第三鎖固部263,第三鎖固部263位於第一配線板261上。舉例來說,第一鎖固部252、第二鎖固部253及第三鎖固部263分別為螺合配件組,螺合配件組為螺固孔S與螺栓B之組合。FIG. 4A is a combined view of FIG. 1 in which the second hard disk module 300 and the first circuit backplane 260 are combined according to a mode. FIG. 4B is a partial exploded view of the second hard disk module 300 and the first circuit backplane 260 of FIG. 4A. More specifically, as shown in FIG. 4A and FIG. 4B, the support frame 210 includes a cover 220 and a bottom plate 230. The bottom plate 230 covers the cover 220 and defines the receiving groove 240 together with the cover 220. A portion 232 of the bottom plate 230 is connected to the cover 220, and another portion 233 thereof extends out of the cover 220 laterally along the Y-axis direction. The support frame 210 further includes a first locking portion 252 and a second locking portion 253. The first locking portion 252 is located on the cover 220, and the second locking portion 253 is located on the bottom plate 230. The first circuit backplane 260 includes a first wiring board 261 and a third locking portion 263, and the third locking portion 263 is located on the first wiring board 261. For example, the first locking portion 252, the second locking portion 253 and the third locking portion 263 are respectively screw-fitting parts, and the screw-fitting parts are a combination of screw holes S and bolts B.

在本實施例中,罩蓋220之剖面呈U字形,第一鎖固部252位於罩蓋220之後端面221上,第二鎖固部253位於底板230之頂面231,且第一鎖固部252與第二鎖固部253至少位置不同,本創作不限第一鎖固部252與第二鎖固部253之種類與方向是否相同。承載架210更包含多個止擋肋264。這些止擋肋264間隔分布於底板230之頂面231。In this embodiment, the cross section of the cover 220 is U-shaped, the first locking portion 252 is located on the rear end surface 221 of the cover 220, and the second locking portion 253 is located on the top surface 231 of the bottom plate 230, and the first locking portion 252 and the second locking portion 253 are at least in different positions. The invention does not limit whether the types and directions of the first locking portion 252 and the second locking portion 253 are the same. The support frame 210 further includes a plurality of stop ribs 264. These stop ribs 264 are spaced and distributed on the top surface 231 of the bottom plate 230.

如此,當操作人員欲使用垂直類型的電路背板,透過第一電路背板260受到這些止擋肋264所卡扣,且讓第三鎖固部263與第一鎖固部252之相互鎖附,使得第一電路背板260覆蓋罩蓋220之後端面221,且沿垂直方向(如Z軸方向)豎立於底板230上,從而讓硬碟單元280分別插接第一電路背板260之連接部262(第3圖)。In this way, when the operator wants to use the vertical type circuit backplane, the first circuit backplane 260 is locked by these stop ribs 264, and the third locking portion 263 and the first locking portion 252 are locked with each other, so that the first circuit backplane 260 covers the rear end surface 221 of the cover 220 and stands upright on the bottom plate 230 along the vertical direction (such as the Z-axis direction), so that the hard disk unit 280 can be respectively plugged into the connecting portion 262 of the first circuit backplane 260 (Figure 3).

第5A圖為第1圖依據另一模式組合第二硬碟模組300與第一電路背板260的組合圖。第5B圖為第5A圖之第二硬碟模組300與第一電路背板260的局部分解圖。更具體地,如第5A圖與第5B圖所示,當操作人員欲使用水平類型而非垂直類型的電路背板,操作人員透過第三鎖固部263與第二鎖固部253之相互鎖附,使得第一電路背板260沿XY軸方向平放且覆蓋底板230之頂面231,從而讓硬碟單元280分別插接電路背板之連接部262。FIG. 5A is a combined view of FIG. 1 according to another mode of combining the second hard disk module 300 and the first circuit backplane 260. FIG. 5B is a partial exploded view of the second hard disk module 300 and the first circuit backplane 260 of FIG. 5A. More specifically, as shown in FIG. 5A and FIG. 5B, when the operator wants to use a horizontal type circuit backplane instead of a vertical type, the operator locks the third locking portion 263 and the second locking portion 253 together, so that the first circuit backplane 260 is laid flat along the XY axis direction and covers the top surface 231 of the bottom plate 230, so that the hard disk units 280 are respectively plugged into the connection portions 262 of the circuit backplane.

第6A圖為本創作一實施例之儲存陣列裝置的第二硬碟模組300的正視圖。如第6A圖所示,除了罩蓋220及底板230之外,第二硬碟模組300的承載架210更包含多個分隔部310,這些分隔部310彼此間隔於承載架210內,並將容置槽240分隔為多個分隔槽311,這些分隔槽311沿水平方向(如X軸方向)線性排列。這些硬碟單元280分別並列於這些分隔槽311內。FIG. 6A is a front view of the second hard disk module 300 of the storage array device of the present invention. As shown in FIG. 6A, in addition to the cover 220 and the bottom plate 230, the support frame 210 of the second hard disk module 300 further includes a plurality of partitions 310. These partitions 310 are spaced apart from each other in the support frame 210 and divide the receiving slot 240 into a plurality of partition slots 311. These partition slots 311 are linearly arranged along the horizontal direction (such as the X-axis direction). These hard disk units 280 are respectively arranged in parallel in these partition slots 311.

第6B圖為第6A圖沿線段AA之局部剖視圖。如第6A圖與第6B圖所示,每個硬碟單元280包含一磁碟本體281、一把手端蓋282及一前擋蓋283。磁碟本體281位於其中一分隔槽311內。磁碟本體281具有一前端面281F。把手端蓋282鎖固至磁碟本體281之前端面281F之一部分,且露出開槽110。前擋蓋283並排至把手端蓋282之一側,固定至磁碟本體281之前端面281F之另一部分,且從開槽110所外露。在本實施例中,每個磁碟本體281之容量為2T,然而,其他實施例中,磁碟本體也可改為容量為1T且其厚度與把手端蓋282相近之硬碟,並且省略其前擋蓋。FIG. 6B is a partial cross-sectional view along line AA of FIG. 6A. As shown in FIG. 6A and FIG. 6B, each hard disk unit 280 includes a disk body 281, a handle end cover 282, and a front cover 283. The disk body 281 is located in one of the partition slots 311. The disk body 281 has a front end face 281F. The handle end cover 282 is locked to a portion of the front end face 281F of the disk body 281 and exposed from the slot 110. The front cover 283 is arranged side by side with the handle end cover 282, fixed to another portion of the front end face 281F of the disk body 281, and exposed from the slot 110. In this embodiment, the capacity of each disk body 281 is 2T. However, in other embodiments, the disk body can also be changed to a hard disk with a capacity of 1T and a thickness similar to the handle end cover 282, and its front cover is omitted.

第7A圖為第1圖之第三硬碟模組400於另一視角的組合圖。第7B圖為第7A圖之第三硬碟模組400的局部分解圖。更具體地,如第7A圖與第7B圖所示,除了罩蓋220及底板230之外,第三硬碟模組400的承載架210更包含一分隔板410、一載板420、一第四鎖固部430及二側板440。分隔板410固定至罩蓋220內,沿XY軸方向平放於罩蓋220內,且將容置槽240分隔為二分隔槽411,這些分隔槽411沿一垂直方向(如Z軸方向)排列。此些側板440相對地位於罩蓋220上,自罩蓋220沿同一方向(如Y軸方向)共同延伸,且連接底板230之另一部分233。更具體地,第一電路背板260完全位於底板230上。載板420位於容置槽240之外,且覆蓋這些側板440,並與底板230之間相隔有一垂直間隔G。第四鎖固部430形成於載板420上,且位於容置槽240之外。FIG. 7A is a combined view of the third hard disk module 400 of FIG. 1 at another viewing angle. FIG. 7B is a partial exploded view of the third hard disk module 400 of FIG. 7A. More specifically, as shown in FIG. 7A and FIG. 7B, in addition to the cover 220 and the bottom plate 230, the carrier 210 of the third hard disk module 400 further includes a partition plate 410, a carrier plate 420, a fourth locking portion 430 and two side plates 440. The partition plate 410 is fixed to the cover 220, placed flat in the cover 220 along the XY axis direction, and divides the accommodating groove 240 into two partition grooves 411, which are arranged along a vertical direction (such as the Z axis direction). The side panels 440 are relatively located on the cover 220, extend from the cover 220 in the same direction (such as the Y-axis direction), and are connected to the other portion 233 of the bottom plate 230. More specifically, the first circuit backplane 260 is completely located on the bottom plate 230. The carrier 420 is located outside the receiving groove 240, covers the side panels 440, and is separated from the bottom plate 230 by a vertical gap G. The fourth locking portion 430 is formed on the carrier 420 and is located outside the receiving groove 240.

第三硬碟模組400更包含一第二電路背板270,第二電路背板270包含一第二配線板271及一第五鎖固部272。第二配線板271位於容置槽240之外,且沿XY軸方向平放及覆蓋於載板420上。第五鎖固部272位於第二配線板271上,且鎖附至第四鎖固部430上。這些硬碟單元280分別排列於這些分隔槽411內。硬碟單元280之一部份受承載於分隔板410上,電連接第一配線板261,且其另一部份受承載於底板230上(第2圖),電連接第二配線板271。然而,本創作不限這些分隔槽411內都必須安裝硬碟單元280。The third hard disk module 400 further includes a second circuit backplane 270, and the second circuit backplane 270 includes a second wiring board 271 and a fifth locking portion 272. The second wiring board 271 is located outside the accommodating groove 240, and is laid flat and covers the carrier 420 along the XY axis direction. The fifth locking portion 272 is located on the second wiring board 271, and is locked to the fourth locking portion 430. These hard disk units 280 are arranged in these partition grooves 411 respectively. A part of the hard disk unit 280 is supported on the partition plate 410 and electrically connected to the first wiring board 261, and another part thereof is supported on the bottom plate 230 (Figure 2) and electrically connected to the second wiring board 271. However, the present invention is not limited to installing hard disk units 280 in these partition grooves 411.

第8圖為本創作一實施例之第三硬碟模組401的正視圖。在本實施例中,第8圖之第三硬碟模組401與上述之第三硬碟模組400大致相同,其差異在於,如第8圖所示,當第三硬碟模組401之其中一分隔槽411內並無安裝任何硬碟單元時,操作人員可以透過一網格板450覆蓋至對應之分隔槽411,以確保異物或人員手部不易伸入承載架210內。FIG. 8 is a front view of the third hard disk module 401 of the first embodiment of the present invention. In the present embodiment, the third hard disk module 401 of FIG. 8 is substantially the same as the third hard disk module 400 described above, except that, as shown in FIG. 8 , when no hard disk unit is installed in one of the partition slots 411 of the third hard disk module 401, the operator can cover the corresponding partition slot 411 with a grid plate 450 to ensure that foreign objects or human hands are not easily inserted into the carrier 210.

第9A圖為第8圖之第三硬碟模組401的硬碟單元290的立體圖。第9B圖為第9A圖之硬碟單元290的分解圖。更具體地,如第9A圖與第9B圖所示,每個硬碟單元290包含一磁碟本體291、一把手端蓋292、一前擋蓋293及一鰭片組294。磁碟本體291具有一前端面291F與一長側面291L,且前端面291F之面對方向(如Y軸方向)正交長側面291L之面對方向(如X軸方向)。把手端蓋292連接磁碟本體291之前端面291F,且露出對應之開槽110。鰭片組294固定於磁碟本體291之長側面291L。前擋蓋293固定於把手端蓋292之一側,且遮蔽鰭片組294。然而,本創作不限於磁碟本體291之厚度(如5.9、8.20、9.5、15及20毫米等)或鰭片組294之高度(如5.5及15.5毫米等)。在本實施例中,磁碟本體291之容量例如為2T,然而,本創作不限於此,其他實施例中,磁碟本體291之容量可以改為1T,並省略前擋蓋293。FIG. 9A is a three-dimensional view of the hard disk unit 290 of the third hard disk module 401 of FIG. 8. FIG. 9B is an exploded view of the hard disk unit 290 of FIG. 9A. More specifically, as shown in FIG. 9A and FIG. 9B, each hard disk unit 290 includes a disk body 291, a handle end cover 292, a front cover 293, and a fin assembly 294. The disk body 291 has a front end face 291F and a long side face 291L, and the facing direction of the front end face 291F (such as the Y-axis direction) is orthogonal to the facing direction of the long side face 291L (such as the X-axis direction). The handle end cover 292 is connected to the front end face 291F of the disk body 291, and exposes the corresponding slot 110. The fin assembly 294 is fixed to the long side 291L of the disk body 291. The front cover 293 is fixed to one side of the handle end cover 292 and covers the fin assembly 294. However, the invention is not limited to the thickness of the disk body 291 (such as 5.9, 8.20, 9.5, 15 and 20 mm, etc.) or the height of the fin assembly 294 (such as 5.5 and 15.5 mm, etc.). In this embodiment, the capacity of the disk body 291 is, for example, 2T, however, the invention is not limited thereto, and in other embodiments, the capacity of the disk body 291 can be changed to 1T, and the front cover 293 is omitted.

第10A圖為本創作一實施例之儲存陣列裝置11的立體圖。如第10A圖所示,在本實施例中,第10A圖之儲存陣列裝置11與上述之儲存陣列裝置10大致相同,其差異在於,儲存陣列裝置11之機殼100內依序安裝多個第四硬碟模組510,這些第四硬碟模組510之其中二個彼此疊合為一疊合結構511,這些疊合結構511沿機殼100之長軸方向(如X軸方向)依序並列,每個疊合結構511位於其中一開槽110內,且每個開槽110內之二個第四硬碟模組510沿垂直方向(如Z軸方向)相互疊合。在本實施例中,每個第四硬碟模組510之固定部件與機殼之固定部為卡合配件組,且每個第四硬碟模組510只有單一個硬碟單元280,且此單一個硬碟單元280為沒有載盤之裸碟。FIG. 10A is a three-dimensional diagram of a storage array device 11 according to an embodiment of the present invention. As shown in FIG. 10A , in the present embodiment, the storage array device 11 of FIG. 10A is substantially the same as the storage array device 10 described above, except that a plurality of fourth hard disk modules 510 are sequentially installed in the housing 100 of the storage array device 11 , and two of these fourth hard disk modules 510 are stacked together to form a stacked structure 511 , and these stacked structures 511 are sequentially arranged in parallel along the long axis direction (such as the X-axis direction) of the housing 100 , and each stacked structure 511 is located in one of the slots 110 , and the two fourth hard disk modules 510 in each slot 110 are stacked together along the vertical direction (such as the Z-axis direction). In this embodiment, the fixing component of each fourth hard disk module 510 and the fixing portion of the housing are a snap-fitting assembly, and each fourth hard disk module 510 has only a single hard disk unit 280, and this single hard disk unit 280 is a bare disk without a carrier.

第10B圖為本創作一實施例之儲存陣列裝置12的立體圖。如第10B圖所示,在本實施例中,第10B圖之儲存陣列裝置12與第10A圖之儲存陣列裝置11大致相同,其差異在於,這些開槽110內之這些硬碟模組不須具有相同種類或相同配置方向。舉例來說,儲存陣列裝置11之機殼100內更具有多個第五硬碟模組520。此些第五硬碟模組520於其中一開槽110內沿水平方向(如X軸方向)排列,且此些疊合結構511於其餘開槽110內沿水平方向(如X軸方向)排列。FIG. 10B is a three-dimensional diagram of a storage array device 12 of an embodiment of the present invention. As shown in FIG. 10B , in the present embodiment, the storage array device 12 of FIG. 10B is substantially the same as the storage array device 11 of FIG. 10A , except that the hard disk modules in the slots 110 do not need to be of the same type or arranged in the same direction. For example, the housing 100 of the storage array device 11 further includes a plurality of fifth hard disk modules 520. The fifth hard disk modules 520 are arranged in a horizontal direction (e.g., in the X-axis direction) in one of the slots 110, and the stacked structures 511 are arranged in a horizontal direction (e.g., in the X-axis direction) in the remaining slots 110.

此外,儲存陣列裝置12更包含一置物框530。置物框530固定於機殼100相對開槽110之外側,用以容置一電子裝置(圖中未示)。In addition, the storage array device 12 further includes a storage frame 530. The storage frame 530 is fixed to the outer side of the housing 100 opposite to the slot 110 to accommodate an electronic device (not shown).

綜上所述,上述各實施例中,這些硬碟模組彼此屬於相同硬碟種類;或者,這些硬碟模組其中二個屬於不同硬碟種類。舉例來說,這些硬碟單元280、290可以為傳統硬碟(HHD)、混合式硬碟(SSHD)或/及固態硬碟(SSD);這些硬碟單元280、290之尺寸也可以為2.5或3.5寸;或者,這些硬碟單元280、290之容量也可能為1T或2T;或者脫離硬碟架之裸碟,然而,本創作不限於此。In summary, in the above embodiments, these hard disk modules belong to the same hard disk type; or, two of these hard disk modules belong to different hard disk types. For example, these hard disk units 280, 290 can be traditional hard disks (HHD), hybrid hard disks (SSHD) or/and solid state drives (SSD); the size of these hard disk units 280, 290 can also be 2.5 or 3.5 inches; or, the capacity of these hard disk units 280, 290 can also be 1T or 2T; or they can be bare disks separated from the hard disk rack, however, the present invention is not limited thereto.

此外,在本實施例中,上述儲存陣列裝置10~12應用於一伺服器設備600內,從而為伺服器設備600提合適的儲存性能,且儲存陣列裝置10~12位於伺服器設備600之機箱610之前端位置,以供使用者在機箱610之抽取硬碟單元280。In addition, in this embodiment, the storage array devices 10-12 are applied in a server device 600 to provide the server device 600 with appropriate storage performance, and the storage array devices 10-12 are located at the front end of the chassis 610 of the server device 600 so that the user can extract the hard disk unit 280 in the chassis 610.

第11圖為本創作一實施例之伺服器設備600的立體圖。如第11圖所示,伺服器設備600包含一機箱610、一主板620、一電源模組630、一輸入輸出模組640及一儲存陣列裝置13。主板620位於機箱610內。電源模組630位於機箱610內,且電連接主板620。輸入輸出模組640位於機箱610之後端612,且電連接主板620。儲存陣列裝置13位於機箱610之前端611,且電性連接主板620。儲存陣列裝置13與上述儲存陣列裝置10~12其中之一相同。FIG. 11 is a three-dimensional diagram of a server device 600 of an embodiment of the present invention. As shown in FIG. 11, the server device 600 includes a chassis 610, a motherboard 620, a power module 630, an input-output module 640, and a storage array device 13. The motherboard 620 is located in the chassis 610. The power module 630 is located in the chassis 610 and is electrically connected to the motherboard 620. The input-output module 640 is located at the rear end 612 of the chassis 610 and is electrically connected to the motherboard 620. The storage array device 13 is located at the front end 611 of the chassis 610 and is electrically connected to the motherboard 620. The storage array device 13 is the same as one of the above-mentioned storage array devices 10-12.

如此,透過以上架構,本創作之儲存陣列裝置能夠靈活地設計成可兼容不同尺寸規格的硬碟裝置,從而提高版面配置之靈活度以及選擇性。Thus, through the above structure, the storage array device of this creation can be flexibly designed to be compatible with hard disk devices of different sizes and specifications, thereby improving the flexibility and selectivity of the layout configuration.

最後,上述所揭露之各實施例中,並非用以限定本創作,任何熟習此技藝者,在不脫離本創作之精神和範圍內,當可作各種之更動與潤飾,皆可被保護於本創作中。因此本創作之保護範圍當視後附之申請專利範圍所界定者為準。Finally, the above disclosed embodiments are not intended to limit the present invention. Anyone skilled in the art can make various changes and modifications within the spirit and scope of the present invention, and all of them can be protected in the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the patent application attached hereto.

10,11,12,13:儲存陣列裝置 100:機殼 101:隔間板 110:開槽 120:第一固定部 121:第一螺孔 130:第二固定部 131:第二螺孔 140:第三固定部 141:第三螺孔 200:第一硬碟模組 210:承載架 211:前緣 212:後緣 213:外側面 220:罩蓋 221:後端面 230:底板 231:頂面 232,233:部分 240:容置槽 251A,251B,251C:固定部件 252:第一鎖固部 253:第二鎖固部 260:第一電路背板 261:第一配線板 262:連接部 263:第三鎖固部 264:止擋肋 270:第二電路背板 271:第二配線板 272:第五鎖固部 280,290:硬碟單元 281,291:磁碟本體 281F,291F:前端面 291L:長側面 282,292:把手端蓋 283,293:前擋蓋 294:鰭片組 300:第二硬碟模組 310:分隔部 311:分隔槽 400,401:第三硬碟模組 410:分隔板 411:分隔槽 420:載板 430:第四鎖固部 440:側板 450:網格板 510:第四硬碟模組 511:疊合結構 520:第五硬碟模組 530:置物框 600:伺服器設備 610:機箱 611:前端 612:後端 620:主板 630:電源模組 640:輸入輸出模組 AA:線段 B:螺栓 G:垂直間隔 S:螺固孔 X,Y,Z:軸方向 10,11,12,13: storage array device 100: housing 101: partition plate 110: slot 120: first fixing portion 121: first screw hole 130: second fixing portion 131: second screw hole 140: third fixing portion 141: third screw hole 200: first hard disk module 210: carrier 211: front edge 212: rear edge 213: outer side 220: cover 221: rear end surface 230: bottom plate 231: top surface 232,233: part 240: receiving groove 251A,251B,251C: fixing member 252: first locking portion 253: Second locking part 260: First circuit backplane 261: First wiring board 262: Connecting part 263: Third locking part 264: Stop rib 270: Second circuit backplane 271: Second wiring board 272: Fifth locking part 280,290: Hard disk unit 281,291: Disk body 281F,291F: Front face 291L: Long side 282,292: Handle end cover 283,293: Front cover 294: Fin assembly 300: Second hard disk module 310: Partition part 311: Partition slot 400,401: Third hard disk module 410: Partition plate 411: partition slot 420: carrier board 430: fourth locking part 440: side panel 450: grid plate 510: fourth hard disk module 511: stacking structure 520: fifth hard disk module 530: storage box 600: server equipment 610: chassis 611: front end 612: rear end 620: motherboard 630: power module 640: input and output module AA: line segment B: bolt G: vertical interval S: screw hole X, Y, Z: axis direction

為讓本創作之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 第1圖為本創作一實施例之儲存陣列裝置的立體圖。 第2圖為第1圖之儲存陣列裝置的分解圖。 第3圖為第1圖之第一硬碟模組的分解圖。 第4A圖為第1圖依據一模式組合第二硬碟模組與第一電路背板的組合圖。 第4B圖為第4A圖之第二硬碟模組與第一電路背板的局部分解圖。 第5A圖為第1圖依據另一模式組合第二硬碟模組與第一電路背板的組合圖。 第5B圖為第5A圖之第二硬碟模組與第一電路背板的局部分解圖。 第6A圖為本創作一實施例之儲存陣列裝置的第二硬碟模組的正視圖。 第6B圖為第6A圖沿線段AA之局部剖視圖。 第7A圖為第1圖之第三硬碟模組於另一視角的組合圖。 第7B圖為第7A圖之第三硬碟模組的局部分解圖。 第8圖為本創作一實施例之第三硬碟模組的正視圖。 第9A圖為第8圖之第三硬碟模組的硬碟單元的立體圖。 第9B圖為第9A圖之硬碟單元的分解圖。 第10A圖為本創作一實施例之儲存陣列裝置的立體圖。 第10B圖為本創作一實施例之儲存陣列裝置的立體圖。 第11圖為本創作一實施例之伺服器設備的立體圖。 In order to make the above and other purposes, features, advantages and embodiments of the present invention more clearly understandable, the attached drawings are described as follows: Figure 1 is a three-dimensional diagram of a storage array device of an embodiment of the present invention. Figure 2 is an exploded diagram of the storage array device of Figure 1. Figure 3 is an exploded diagram of the first hard disk module of Figure 1. Figure 4A is a combination diagram of Figure 1 combining the second hard disk module and the first circuit backplane according to one mode. Figure 4B is a partial exploded diagram of the second hard disk module and the first circuit backplane of Figure 4A. Figure 5A is a combination diagram of Figure 1 combining the second hard disk module and the first circuit backplane according to another mode. Figure 5B is a partial exploded diagram of the second hard disk module and the first circuit backplane of Figure 5A. FIG. 6A is a front view of the second hard disk module of the storage array device of the first embodiment of the present invention. FIG. 6B is a partial cross-sectional view along the line segment AA of FIG. 6A. FIG. 7A is a combination view of the third hard disk module of FIG. 1 at another viewing angle. FIG. 7B is a partial exploded view of the third hard disk module of FIG. 7A. FIG. 8 is a front view of the third hard disk module of the first embodiment of the present invention. FIG. 9A is a three-dimensional view of the hard disk unit of the third hard disk module of FIG. 8. FIG. 9B is an exploded view of the hard disk unit of FIG. 9A. FIG. 10A is a three-dimensional view of the storage array device of the first embodiment of the present invention. FIG. 10B is a three-dimensional view of the storage array device of the first embodiment of the present invention. Figure 11 is a three-dimensional diagram of the server equipment of an embodiment of this invention.

10:儲存陣列裝置 10: Storage array device

100:機殼 100: Chassis

101:隔間板 101: Partition board

110:開槽 110: Slotting

120:第一固定部 120: First fixed part

121:第一螺孔 121: First screw hole

130:第二固定部 130: Second fixing part

131:第二螺孔 131: Second screw hole

140:第三固定部 140: Third fixing part

141:第三螺孔 141: The third screw hole

200:第一硬碟模組 200: First hard drive module

210:承載架 210:Carrier

220:罩蓋 220: Cover

230:底板 230: Base plate

251A,251B,251C:固定部件 251A, 251B, 251C: Fixed parts

280:硬碟單元 280: Hard disk unit

300:第二硬碟模組 300: Second hard drive module

400:第三硬碟模組 400: Third hard drive module

410:分隔板 410:Separator

B:螺栓 B: Bolts

S:螺固孔 S: Screw hole

X,Y,Z:軸方向 X,Y,Z: axis direction

Claims (12)

一種儲存陣列裝置,包含: 一機殼,具有複數個開槽,且該機殼對應該些開槽中每一者之位置分別具有一第一固定部與一第二固定部,該第一固定部之一鎖固規格不同於該第二固定部之一鎖固規格;以及 複數個硬碟模組,分別容置於該些開槽內,該些硬碟模組中每一者包含一承載架、一固定部件、一第一電路背板與至少一硬碟單元,該承載架具有一容置槽,該固定部件設於該承載架之外側面,該硬碟單元位於該容置槽內,且電連接該第一電路背板, 其中當該固定部件的一鎖固規格匹配該第一固定部的該鎖固規格時,透過該固定部件與該第一固定部相互固定,該承載架能夠安裝至該些開槽其中之一內, 當該固定部件的該鎖固規格匹配該第二固定部的該鎖固規格時,透過該固定部件與該第二固定部相互固定,該承載架能夠安裝至該其中一開槽內。 A storage array device comprises: a housing having a plurality of slots, and the housing has a first fixing portion and a second fixing portion at positions corresponding to each of the slots, wherein a locking specification of the first fixing portion is different from a locking specification of the second fixing portion; and a plurality of hard disk modules respectively accommodated in the slots, wherein each of the hard disk modules comprises a carrier, a fixing component, a first circuit backplane and at least one hard disk unit, wherein the carrier has a receiving slot, the fixing component is arranged on the outer side of the carrier, the hard disk unit is located in the receiving slot and is electrically connected to the first circuit backplane, When a locking specification of the fixing component matches the locking specification of the first fixing portion, the fixing component and the first fixing portion are fixed to each other, and the carrier can be installed in one of the slots. When the locking specification of the fixing component matches the locking specification of the second fixing portion, the fixing component and the second fixing portion are fixed to each other, and the carrier can be installed in one of the slots. 如請求項1所述之儲存陣列裝置,其中該承載架包含一罩蓋、一底板、一第一鎖固部及一第二鎖固部,該底板之一部分覆蓋該罩蓋,並與該罩蓋共同定義出該容置槽,其另一部分橫向伸出該罩蓋,該第一鎖固部位於該罩蓋上,且該第二鎖固部位於該底板上;以及 該第一電路背板包含一第一配線板及一第三鎖固部,該第三鎖固部位於該第一配線板上,且鎖附至該第一鎖固部及該第二鎖固部其中之一。 The storage array device as described in claim 1, wherein the carrier comprises a cover, a base plate, a first locking portion and a second locking portion, a portion of the base plate covers the cover and defines the receiving slot together with the cover, and another portion thereof extends laterally out of the cover, the first locking portion is on the cover, and the second locking portion is on the base plate; and the first circuit backplane comprises a first wiring board and a third locking portion, the third locking portion is on the first wiring board and is locked to one of the first locking portion and the second locking portion. 如請求項2所述之儲存陣列裝置,其中透過該第三鎖固部與該第一鎖固部之相互鎖附,該第一電路背板覆蓋該罩蓋,且豎立於該底板上,且透過該第三鎖固部與該第二鎖固部之相互鎖附,該第一電路背板平放且覆蓋該底板。A storage array device as described in claim 2, wherein the first circuit backplane covers the cover and stands upright on the base plate through the mutual locking of the third locking portion and the first locking portion, and the first circuit backplane is laid flat and covers the base plate through the mutual locking of the third locking portion and the second locking portion. 如請求項2所述之儲存陣列裝置,其中該承載架更包含一分隔板,該分隔板固定於該罩蓋內,並將該容置槽分隔為二分隔槽,該些分隔槽沿一垂直方向排列;以及 該硬碟單元包含複數個硬碟單元,該些硬碟單元分別排列於該些分隔槽內,該些硬碟單元之一部份受承載於該分隔板上,且該些硬碟單元之另一部份受承載於該底板上。 The storage array device as described in claim 2, wherein the support frame further includes a partition plate, the partition plate is fixed in the cover and divides the accommodating slot into two partition slots, and the partition slots are arranged along a vertical direction; and the hard disk unit includes a plurality of hard disk units, the hard disk units are arranged in the partition slots respectively, a part of the hard disk units is supported on the partition plate, and another part of the hard disk units is supported on the bottom plate. 如請求項4所述之儲存陣列裝置,其中該承載架更包含: 二側板,相對地位於該罩蓋上,自該罩蓋沿同一方向共同延伸,且連接該底板之該另一部分; 一載板,位於該容置槽之外,覆蓋該些側板與該底板之該另一部分,並與該底板之間具有一垂直間隔;以及 一第四鎖固部,形成於該載板上,且位於該容置槽之外。 The storage array device as described in claim 4, wherein the carrier further comprises: Two side plates, relatively disposed on the cover, extending from the cover in the same direction and connected to the other part of the bottom plate; A carrier plate, located outside the receiving slot, covering the side plates and the other part of the bottom plate, and having a vertical gap between the carrier plate and the bottom plate; and A fourth locking portion, formed on the carrier plate and located outside the receiving slot. 如請求項5所述之儲存陣列裝置,其中該些硬碟模組其中之一更包含一第二電路背板,該第二電路背板包含: 一第二配線板,位於該容置槽之外,平放及覆蓋於該載板上,且電連接該些硬碟單元;以及 一第五鎖固部,位於該第二配線板上,且鎖附至該第四鎖固部上。 The storage array device as described in claim 5, wherein one of the hard disk modules further comprises a second circuit backplane, the second circuit backplane comprising: a second wiring board, located outside the receiving slot, lying flat on and covering the carrier, and electrically connected to the hard disk units; and a fifth locking portion, located on the second wiring board, and locked to the fourth locking portion. 如請求項1所述之儲存陣列裝置,其中該承載架更包含複數個分隔部,該些分隔部固定於該承載架內,將該容置槽分隔為複數個分隔槽,該些分隔槽沿一水平方向線性排列;以及 該硬碟單元包含複數個硬碟單元,該些硬碟單元分別排列於該些分隔槽內。 The storage array device as described in claim 1, wherein the carrier further comprises a plurality of partitions, the partitions are fixed in the carrier, and the receiving slot is divided into a plurality of partition slots, and the partition slots are linearly arranged along a horizontal direction; and the hard disk unit comprises a plurality of hard disk units, and the hard disk units are respectively arranged in the partition slots. 如請求項7所述之儲存陣列裝置,其中該些硬碟單元中每一者包含: 一磁碟本體,位於該些分隔槽其中之一; 一把手端蓋,固定於該磁碟本體之一前端面之一部分,且伸出該其中一開槽;以及 一前擋蓋,並排至該把手端蓋之一側,固定至該磁碟本體之該前端面之另一部分,且從該其中一開槽所外露。 A storage array device as described in claim 7, wherein each of the hard disk units comprises: a disk body located in one of the partition slots; a handle end cover fixed to a portion of a front end surface of the disk body and extending out of one of the slots; and a front cover arranged on one side of the handle end cover, fixed to another portion of the front end surface of the disk body and exposed from one of the slots. 如請求項1所述之儲存陣列裝置,其中該些硬碟模組之一部分沿一水平方向排列於該些開槽其中之一中,該些硬碟模組之另一部分沿一垂直方向排列於另一個該些開槽中。The storage array device as described in claim 1, wherein a portion of the hard disk modules are arranged in one of the slots along a horizontal direction, and another portion of the hard disk modules are arranged in another of the slots along a vertical direction. 如請求項1所述之儲存陣列裝置,其中該固定部件、該第一固定部與該第二固定部為一螺合配件組或一卡扣配件組。The storage array device as described in claim 1, wherein the fixing component, the first fixing portion and the second fixing portion are a screw-fitting assembly or a snap-fitting assembly. 如請求項1所述之儲存陣列裝置,其中該硬碟單元包含: 一磁碟本體; 一把手端蓋,連接該磁碟本體之一前端面,且露出該其中一開槽; 一鰭片組,固定於該磁碟本體之一長側面;以及 一前擋蓋,固定於該把手端蓋之一側,且遮蔽該鰭片組。 The storage array device as described in claim 1, wherein the hard disk unit comprises: a disk body; a handle end cover connected to a front end surface of the disk body and exposing one of the slots; a fin assembly fixed to a long side of the disk body; and a front cover fixed to a side of the handle end cover and shielding the fin assembly. 一種伺服器設備,包含: 一機箱; 一主板,位於該機箱內; 一電源模組,位於該機箱內,且電連接該主板; 一輸入輸出模組,位於該機箱之後端,且電連接該主板;以及 一如請求項1所述之儲存陣列裝置,位於該機箱之前端,且電性連接該主板。 A server device comprises: a chassis; a motherboard located in the chassis; a power module located in the chassis and electrically connected to the motherboard; an input/output module located at the rear end of the chassis and electrically connected to the motherboard; and a storage array device as described in claim 1, located at the front end of the chassis and electrically connected to the motherboard.
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