TWM654723U - Isolator and its electronic subassembly - Google Patents
Isolator and its electronic subassembly Download PDFInfo
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- TWM654723U TWM654723U TW111213851U TW111213851U TWM654723U TW M654723 U TWM654723 U TW M654723U TW 111213851 U TW111213851 U TW 111213851U TW 111213851 U TW111213851 U TW 111213851U TW M654723 U TWM654723 U TW M654723U
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Abstract
Description
本新型是有關於一種訊號隔離裝置與其次組件,尤指一種在高頻波段具有良好電訊隔離效果的隔離器及其電子電路次組件。 This new type is related to a signal isolation device and its sub-assembly, especially an isolator with good telecommunication isolation effect in high-frequency band and its electronic circuit sub-assembly.
參閱圖1、2,習知一種信號隔離器9可用於傳輸和切換從系統端到用戶端的有線電視信號(射頻信號),所述信號隔離器9具有殼體90、輸入端口91和輸出端口92,輸入端口91和輸出端口92均穿過殼體90。射頻信號是從輸入端口91輸入,經由殼體90內的電路模組93處理後再由輸出端口92輸出。電路模組93包括第一電路板931、第二電路板(圖未示)和隔離單元94。第一電路板931和第二電路板均位於殼體90內,為了得到更好的信號隔離效果,可透過隔板95將殼體90內部空間分為上半部951與下半部952,藉此分別供第一電路板931與第二電路板設置;第一電路板931和第二電路板分別連接輸入端口91和輸出端口92,第一電路板931與第二電路板透過導線(圖未示)呈電性連接,所述導線穿過
隔板95上的貫孔953。隔離單元94與第一電路板931電性連接,隔離單元94具有信號隔離的功能模塊(functional block),所述功能模塊包括多個電容941和多個電感942,藉此提供隔離信號雜訊之作用。習知信號隔離器9雖然具有隔離信號雜訊的作用,但需要較大的容置空間來安置第一電路板931、第二電路板和隔離單元94。此外,所述隔離器在高頻下的阻抗匹配不理想,這導致高頻信號的損耗較大。
Referring to Figs. 1 and 2, it is known that a
是以,如何針對前述問題進行改良,以提供使用者更為滿意且方便使用之產品,即成為本創作在此亟欲解決的重要問題。 Therefore, how to improve the above-mentioned problems to provide users with more satisfactory and convenient products has become an important issue that this creation is eager to solve.
因此,本新型之目的,即在提供一種可改善先前技術至少一缺點的隔離器。 Therefore, the purpose of the present invention is to provide an isolator that can improve at least one disadvantage of the prior art.
於是,本新型隔離器包括一座體、一第一電路模組,及一第二電路模組。該座體包括一第一連接端口、一第二連接端口,及設置於該第一連接端口的一絕緣墊片。該第一電路模組鄰近設置於該第一連接端口並包括一第一整合電路板、環繞該第一整合電路板的一第一殼體、貫穿該第一整合電路板的一第一導通電路,及套設於該絕緣墊片內且部分環繞該第一導通電路的一接頭,該第一導通電路的一第一端部與一第一接觸件電性連接。該 第二電路模組鄰近設置於該第二連接端口並包括一第二整合電路板、環繞該第二整合電路板的一第二殼體,及沿該第二整合電路板之長度方向延伸的一第二導通電路。該第二導通電路具有一第一接觸點與一第二接觸點,該第二導通電路的該第一接觸點與該第一導通電路的一第二端部電性連接,該第二導通電路的該第二接觸點與一第二接觸件電性連接。 Therefore, the novel isolator includes a base, a first circuit module, and a second circuit module. The base includes a first connection port, a second connection port, and an insulating pad disposed on the first connection port. The first circuit module is disposed adjacent to the first connection port and includes a first integrated circuit board, a first housing surrounding the first integrated circuit board, a first conductive circuit penetrating the first integrated circuit board, and a connector sleeved in the insulating pad and partially surrounding the first conductive circuit. A first end of the first conductive circuit is electrically connected to a first contact. The second circuit module is disposed adjacent to the second connection port and includes a second integrated circuit board, a second housing surrounding the second integrated circuit board, and a second conductive circuit extending along the length direction of the second integrated circuit board. The second conductive circuit has a first contact point and a second contact point, the first contact point of the second conductive circuit is electrically connected to a second end of the first conductive circuit, and the second contact point of the second conductive circuit is electrically connected to a second contact member.
本新型另提供一種電子電路次組件,其適用安裝於一座體,該座體包括一第一連接端口及一第二連接端口。該電子電路次組件包含一第一電路模組、一第二電路模組,及一連接元件。 The present invention also provides an electronic circuit subassembly suitable for installation on a base, the base including a first connection port and a second connection port. The electronic circuit subassembly includes a first circuit module, a second circuit module, and a connection element.
該第一電路模組鄰近設置於該第一連接端口,該第一電路模組包括一第一整合電路板,及環繞該第一整合電路板的一第一殼體,該第一整合電路板具有一第一功能模塊。該第二電路模組鄰近設置於該第二連接端口,該第二電路模組包括一第二整合電路板,及環繞該第二整合電路板的一第二殼體,該第二整合電路板具有一第二功能模塊。該連接元件電性連接該第一整合電路板與該第二整合電路板,其中,電信號自該第一連接端口內的一第一接觸件經該第一整合電路板的該第一功能模塊、該連接元件、該第二整合電路板的該第二功能模塊後,再通過位於該第二連接端口內的一第二接觸件向外輸出。 The first circuit module is disposed adjacent to the first connection port, the first circuit module includes a first integrated circuit board, and a first shell surrounding the first integrated circuit board, the first integrated circuit board has a first functional module. The second circuit module is disposed adjacent to the second connection port, the second circuit module includes a second integrated circuit board, and a second shell surrounding the second integrated circuit board, the second integrated circuit board has a second functional module. The connecting element electrically connects the first integrated circuit board and the second integrated circuit board, wherein the electrical signal is outputted from a first contact in the first connection port through the first functional module of the first integrated circuit board, the connecting element, and the second functional module of the second integrated circuit board through a second contact in the second connection port.
本新型還提供另一種電子電路次組件,其適用安裝於一座體,該座體包括一第一連接端口及一第二連接端口。該電子電路次組件包含一第一電路模組,及一第二電路模組。 The present invention also provides another electronic circuit subassembly, which is suitable for installation on a base, and the base includes a first connection port and a second connection port. The electronic circuit subassembly includes a first circuit module and a second circuit module.
該第一電路模組鄰近設置於該第一連接端口,該第一電路模組包括一第一整合電路板,及一連接元件,該連接元件貫穿該第一整合電路板,該連接元件的一第一端部與一第一接觸件電性連接。該第二電路模組鄰近設置於該第二連接端口,該第二電路模組包括一第二整合電路板,及一導通電路,該導通電路沿該第二整合電路板之長度方向延伸,該導通電路具有一第一接觸點與一第二接觸點,該導通電路的該第一接觸點與該連接元件的一第二端部電性連接,該導通電路的該第二接觸點與一第二接觸件電性連接。 The first circuit module is disposed adjacent to the first connection port, and includes a first integrated circuit board and a connection element, the connection element penetrates the first integrated circuit board, and a first end of the connection element is electrically connected to a first contact. The second circuit module is disposed adjacent to the second connection port, and includes a second integrated circuit board and a conductive circuit, the conductive circuit extends along the length direction of the second integrated circuit board, the conductive circuit has a first contact point and a second contact point, the first contact point of the conductive circuit is electrically connected to a second end of the connection element, and the second contact point of the conductive circuit is electrically connected to a second contact.
現將經由對說明性實施例、隨附圖式及申請專利範圍之以下詳細描述的評述,使本創作之此等以及其他組件、步驟、特徵、效益及優勢變得明朗。 These and other components, steps, features, benefits and advantages of the present invention will now become apparent through a review of the following detailed description of illustrative embodiments, the accompanying drawings and the scope of the claims.
10:座體 10: Seat
101:第一連接端口 101: First connection port
102:第二連接端口 102: Second connection port
103:絕緣墊片 103: Insulation gasket
104:第一環壁 104: First Ring Wall
105:第二環壁 105: Second ring wall
11:絕緣材料 11: Insulation materials
20:座體 20: Seat
201:基壁 201: Base wall
202:直立壁 202: Vertical wall
203:第一連接端口 203: First connection port
204:第二連接端口 204: Second connection port
205:第一環壁 205: First Ring Wall
206:第二環壁 206: Second ring wall
30:座體 30: Seat
301:直立壁 301: Vertical wall
302:第一連接端口 302: First connection port
303:第二連接端口 303: Second connection port
304:第一環壁 304: First Ring Wall
305:第二環壁 305: Second ring wall
2:第一電路模組 2: First circuit module
21:第一整合電路板 21: First integrated circuit board
211:第一環形電路板 211: First ring circuit board
313:第二導通電路 313: Second conducting circuit
314:接地導電部 314: Grounding conductive part
315:第一接觸點 315: First contact point
316:第二接觸點 316: Second contact point
32:第二殼體 32: Second shell
321:上半部 321: Upper part
322:下半部 322: Lower half
33:第二接觸件 33: Second contact piece
34:第二絕緣件 34: Second insulation component
4:連接元件 4: Connecting components
41:第一導通電路 41: First conduction circuit
411:第一端部 411: First end
412:第二端部 412: Second end
42:接地電路 42: Ground circuit
43:接地彈片 43: Grounding Shrapnel
5:第一電路模組 5: First circuit module
51:第一整合電路板 51: First integrated circuit board
511:基板 511: Substrate
52:第一殼體 52: First shell
53:第一接頭 53: First joint
54:第一連接套筒 54: First connecting sleeve
55:第一絕緣墊片 55: First insulation gasket
56:第一功能模塊 56: First functional module
212:第二環形電路板 212: Second ring circuit board
213:第一電容 213: First capacitor
214:第二電容 214: Second capacitor
215:副鐵粉芯 215: Secondary iron powder core
216:接地端 216: Ground terminal
217:接地端 217: Ground terminal
22:第一殼體 22: First shell
23:接頭 23: Connector
231:頭段 231: Header
232:尾段 232: Tail section
233:延伸部 233: Extension
234:小徑部 234: Trail section
24:絕緣環狀件 24: Insulation ring
241:凹槽 241: Groove
25:主鐵粉芯 25: Main iron powder core
26:絕緣套筒 26: Insulation sleeve
27:第一接觸件 27: First contact
28:第一絕緣件 28: First insulation component
3:第二電路模組 3: Second circuit module
31:第二整合電路板 31: Second integrated circuit board
311:基板 311: Substrate
312:避雷組件 312: Lightning protection components
561:電容 561:Capacitor
562:副鐵粉芯 562: Secondary iron powder core
6:第二電路模組 6: Second circuit module
61:第二整合電路板 61: Second integrated circuit board
62:第二殼體 62: Second shell
63:第二接頭 63: Second joint
64:第二連接套筒 64: Second connecting sleeve
65:第二絕緣墊片 65: Second insulation gasket
66:第二功能模塊 66: Second functional module
7:連接元件 7: Connecting components
71:第一導通電路 71: First conduction circuit
711:第一端部 711: First end
712:第二端部 712: Second end
70:電子電路次組件 70: Electronic circuit subassemblies
80:電子電路次組件 80: Electronic circuit subassemblies
90:電子電路次組件 90: Electronic circuit subassemblies
100:隔離器 100: Isolator
200:隔離器 200: Isolator
300:隔離器 300: Isolator
L1:中心軸 L1: Center axis
D1:第一延伸長度 D1: First extension length
D2:第二延伸長度 D2: Second extension length
本新型之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中:圖1是習知信號隔離器的一立體圖;圖2是習知信號隔離器的一座體的一剖面圖; 圖3是本新型隔離器的一第一實施例的一立體圖;圖4是本新型隔離器的該第一實施例的一前視圖;圖5是沿圖4中V-V直線的一剖面圖;圖6是本新型電子電路次組件的一實施例的一立體圖;圖7是本新型電子電路次組件的該實施例的一第一電路模組的一剖面圖;圖8是圖7圓圈處的一局部放大圖;圖9是圖5旋轉一角度的一剖面圖;圖10是本新型電子電路次組件的該實施例的一第一變化例的一立體圖;圖11是本新型電子電路次組件的該實施例的該第一變化例安裝於一座體的一剖面圖;圖12是本新型電子電路次組件的該實施例的一第二變化例的一立體圖;圖13是本新型電子電路次組件的該實施例的該第二變化例安裝於一座體的一側視圖;圖14是本新型隔離器的一第二實施例的一立體圖;及圖15是本新型隔離器的一第三實施例的一立體圖。 Other features and functions of the present invention will be clearly presented in the implementation method with reference to the drawings, wherein: FIG1 is a three-dimensional diagram of a learned signal isolator; FIG2 is a cross-sectional diagram of a seat of the learned signal isolator; FIG3 is a three-dimensional diagram of a first embodiment of the present isolator; FIG4 is a front view of the first embodiment of the present isolator; FIG5 is a cross-sectional diagram along the V-V line in FIG4; FIG6 is a three-dimensional diagram of an embodiment of the present electronic circuit subassembly; FIG7 is a cross-sectional diagram of a first circuit module of the embodiment of the present electronic circuit subassembly; FIG8 is a partial enlarged diagram of the circle in FIG7 ; FIG. 9 is a cross-sectional view of FIG. 5 rotated at an angle; FIG. 10 is a three-dimensional view of a first variation of the embodiment of the novel electronic circuit subassembly; FIG. 11 is a cross-sectional view of the first variation of the embodiment of the novel electronic circuit subassembly installed on a base; FIG. 12 is a three-dimensional view of a second variation of the embodiment of the novel electronic circuit subassembly; FIG. 13 is a side view of the second variation of the embodiment of the novel electronic circuit subassembly installed on a base; FIG. 14 is a three-dimensional view of a second embodiment of the novel isolator; and FIG. 15 is a three-dimensional view of a third embodiment of the novel isolator.
在本新型被詳細描述之前,應當注意在以下的說明內容中,類似的元件是以相同的編號來表示,此外圖式中元件的形狀、尺寸、厚度、以及角度等相關參數並未依照比例繪製,其簡化用意僅為方便清楚說明。 Before the present invention is described in detail, it should be noted that similar components are represented by the same numbers in the following description. In addition, the shapes, sizes, thicknesses, angles and other related parameters of the components in the drawings are not drawn in proportion. The simplification is intended only for the convenience of clear description.
參閱圖3、4、5,本新型隔離器100的第一實施例,其包含座體10,及安裝於座體10的電子電路次組件90。較佳地,座體10外表面能被絕緣材料11包覆,所述絕緣材料可以是塑膠、矽膠或橡膠等。座體10包括第一連接端口101、第二連接端口102,及設置於第一連接端口101的絕緣墊片103。在本實施例中,座體10呈中空狀並還包括第一環壁104,及第二環壁105,第一環壁104與第二環壁105分別連接第一連接端口101與第二連接端口102且均向座體10內部延伸。
Referring to Figures 3, 4, and 5, the first embodiment of the
參閱圖6、7、8,電子電路次組件90包括第一電路模組2、第二電路模組3,及連接元件4。第一電路模組2包括第一整合電路板21、第一殼體22、接頭23、絕緣環狀件24、主鐵粉芯25、絕緣套筒26、第一接觸件27,及第一絕緣件28。
Referring to Figures 6, 7, and 8, the
第一整合電路板21包括均環繞一中心軸L1的第一環形電路板211與第二環形電路板212、多個第一電容213、多個第二電容214,及環繞所述中心軸L1的副鐵粉芯215。所述第一電容213以所述中心軸L1為對稱中心均勻地分布在第一環形電路板
211,類似地,所述第二電容214以所述中心軸L1為對稱中心均勻地分布在第二環形電路板212,所述第一電容213與所述第二電容214的外觀可以但不須為限地呈片狀,且其等電容值舉例來說各自可以是4700pF或是5600pF或是10000pF也可以與其他電容值混合搭配使用。副鐵粉芯215位於第一環形電路板211與第二環形電路板212之間。
The first
第一殼體22為金屬材質且環繞接觸第一整合電路板21,第一殼體22電性連接於第一環形電路板211的接地端216,較佳地,第一殼體22還進一步電性連接於第二環形電路板212的接地端217。
The
參閱圖5、7、8,接頭23為金屬材質且套設於座體10的絕緣墊片103內。接頭23具有頭段231、尾段232與二延伸部233。頭段231的部分外周面與絕緣墊片103內表面緊密接觸。尾段232具有小徑部234,其內徑是小於頭段231之內徑。所述延伸部233自尾段232的端緣向外延伸且相對設置。接頭23的每一延伸部233其在軸向上具有第一延伸長度D1。
Referring to Figures 5, 7, and 8, the
絕緣環狀件24緊配合地設置於第一殼體22與接頭23之間,使得第一殼體22不會直接接觸於接頭23。絕緣環狀件24的外周面形成供接頭23的所述延伸部233容設的二凹槽241,每一凹槽241其在軸向上具有第二延伸長度D2,所述第一延伸長度D1是
短於所述第二延伸長度D2(如圖8所示)。在一些實施例中,接頭23是只具有一個延伸部233,絕緣環狀件24的外周面也只形成一個凹槽241,如此,也可以達成接頭23與絕緣環狀件24彼此嵌合成為一體的作用。
The insulating
主鐵粉芯25套設於絕緣環狀件24且環繞所述連接元件4。絕緣套筒26套設於接頭23的尾段232,且絕緣套筒26的外表面與座體10的第一環壁104的內周面形狀相配合。絕緣套筒26是用以隔離接頭23與座體10兩者間的電性導通,與此同時絕緣套筒26之外形是與座體10的第一連接端口101之形狀相配合,舉例來說為六角形或其他多邊形,藉此增加多個平面結構的對配以增強扭力。
The main
參閱圖5、6,第二電路模組3鄰近設置於第二連接端口102並包括第二整合電路板31、第二殼體32、第二接觸件33,及第二絕緣件34。第二整合電路板31具有基板311,及避雷組件312。基板311上形成第二導通電路313,及位於第二導通電路313兩側的二接地導電部314,每一接地導電部314具有二接地導電層分別形成於基板311相反兩表面,第二導通電路313是沿第二整合電路板31之長度方向延伸且具有第一接觸點315與第二接觸點316,第二導通電路313的第二接觸點316與第二接觸件33電性連接。避雷組件312電性連接於第二接觸件33與第二導通電路
313,避雷組件312是包括避雷管(Protecting Tube)、抗流器(Choke)及高通濾波器(High Pass Filter)的其中一個。
Referring to FIGS. 5 and 6 , the
第二殼體32不完全環繞第二整合電路板31,在本實施例中,第二殼體32包括相對應設置於基板311的上半部321與下半部322,第二殼體32電性連接於第二整合電路板31的基板311的所述接地導電部314。
The
參閱圖5、6、7,所述連接元件4電性連接第一整合電路板21與第二整合電路板31。在本實施例中,所述連接元件4貫穿第一整合電路板21且具有位於其內部的第一導通電路41及接地電路42。所述連接元件4的第一導通電路41的第一端部411是被部分接頭23環繞,第一導通電路41的第一端部411與第一接觸件27電性連接,第一導通電路41的第二端部412與第二導通電路313的第一接觸點315電性連接。
Referring to Figures 5, 6, and 7, the
詳細說明,在本實施例中所述連接元件4為同軸電纜,所述同軸電纜在徑向方向上由內而外依序包括一中心導體、一絕緣層、一編織層,及一塑膠皮層,其中,中心導體之材質為銅、鐡、銀、鎳、金、銅金合金、銅錫合金、銅鎳合金或其它導電性良好之聚合物或非金屬類之導體等,另外編織層之材質為含鋁之金屬層、含銅之金屬層或含有導電物質之導電層,例如一鋁線包覆層或銅線包覆層,其中編織層具有電性遮蔽功效,可減少
干擾,而編織層之形式包括二層編織(Standard)、三層編織(Tri-shield)及四層編織(Quad)等不同包覆形式。在本實施例中,所述連接元件4的第一導通電路41為所述同軸電纜的中心導體,其是用以傳輸電信號;所述連接元件4的接地電路42為所述同軸電纜的編織層,補充說明,所述同軸電纜的編織層可以是以焊接方式與第一環形電路板211及第二環形電路板212連接,此外所述同軸電纜與接頭23的小徑部234之間設有接地彈片43,接地彈片43的一末端接觸於所述連接元件4的接地電路42(即所述同軸電纜的編織層),另一端接觸於接頭23的小徑部234,如此,透過三者之間的良好接觸性,來提供良好的電性連接,其中電性連接為接地(ground)。
In detail, in this embodiment, the connecting
參閱圖5、6,以下透過將本新型電子電路次組件90安裝於座體10之步驟來說明本新型隔離器100之優點:首先,將第一電路模組2套設於座體10的第一環壁104內,且將接頭23穿過於座體10的第一連接端口101,藉此使第一電路模組2鄰近設置於第一連接端口101,其中,第一環壁104環繞接觸於第一殼體22,第一電路模組2的接頭23之小徑部234與所述連接元件4的接地電路42電性連接;然後再將絕緣墊片103塞設於第一連接端口101,以阻止接頭23與座體10兩者之間的電性導通。在一些實施例中,座體10可以是在與接頭23接觸之表面
上,預先塗佈一層絕緣材料而形成絕緣部,如此,即使省略絕緣墊片103,亦能達成防止接頭23與座體10兩者電性導通的目的,也就是接頭23透過絕緣部而與座體10的第一連接端口101呈絕緣設置。
Referring to FIGS. 5 and 6 , the advantages of the
接著,再將第二電路模組3套設於座體10的第二環壁105內,使第二電路模組3鄰近設置於第二連接端口102後便可完成組裝而獲得本新型隔離器100。
Next, the
參閱圖5、9,本新型隔離器100在使用上,電信號傳輸方向是自第一接觸件27經所述連接元件4的第一導通電路41、第二整合電路板31的第二導通電路313後,再通過位於第二連接端口102內的第二接觸件33向外輸出,電信號傳輸路徑如圖9中第一箭頭A1所示;值得一提,所述電信號在傳輸過程中是會通過主鐵粉芯25、第一整合電路板21的副鐵粉芯215,及所述第一電容213與所述第二電容214,如此,可去除異常電壓而避免傳輸過程中的電信號伴隨有異常訊號,本創作在第二整合電路板31上設有避雷組件312,故可有效保護本創作隔離器100不受雷擊影響而損壞。
Referring to FIGS. 5 and 9 , in the use of the
此外,圖9中第二箭頭A2行經路線為等電位的接地端,其是依序經過接頭23的小徑部234、接地彈片43、所述連接元件4(同軸電纜)的接地電路42(編織層)、第一環形電路板211的接地端216(如圖7所示)、第一殼體22、座體10的第一環壁104,
及座體10的第二連接端口102,從而使本新型隔離器100在使用上還具有良好接地效應,可確保收訊品質。
In addition, the second arrow A2 in FIG. 9 passes through the
參閱圖10、11,本新型電子電路次組件80的第一變化實施例,一樣可安裝於具有第一連接端口101與第二連接端口102的座體10。本新型電子電路次組件80包括第一電路模組5、第二電路模組6與連接元件7。
Referring to Figures 10 and 11, the first variant embodiment of the novel
第一電路模組5包括第一整合電路板51,及環繞第一整合電路板51的第一殼體52,第一整合電路板51具有基板511及第一功能模塊56,所述第一功能模塊56包括多個電容561及至少一個副鐵粉芯562,第一功能模塊56的所述電容561是設置於基板511且對稱位於基板511的兩相反表面,副鐵粉芯562是位於所述電容561之間,所述第一功能模塊56藉此提供隔離信號雜訊及避雷功能之作用。
The
第二電路模組6包括第二整合電路板61,及環繞第二整合電路板61的第二殼體62。第二整合電路板61具有第二功能模塊66,所述第二功能模塊66包括避雷管、抗流器及高通濾波器的其中一個,或是其他可以達成避雷功能的電路設計。值得一提,所述第一功能模塊56與所述第二功能模塊66可視實際需求被設計成其中一個具有信號隔離功能,另一個具有避雷功能,或是同時具有信號隔離功能及避雷功能,亦或是放大信號等其他功能。
The
第一電路模組5的第一殼體52與第一接頭53透過第一連接套筒54連接在一起。第一接頭53穿過座體10的第一連接端口101,第一絕緣墊片55塞設於第一連接端口101以阻止第一接頭53與座體10兩者之間的電性導通。類似地,第二電路模組6的第二殼體62與第二接頭63透過第二連接套筒64連接在一起。第二接頭63穿過座體10的第二連接端口102,第二絕緣墊片65塞設於第二連接端口102以阻止第二接頭63與座體10兩者之間的電性導通。所述連接元件7包括位於其內部的第一導通電路71,第一導通電路71具有與第一整合電路板51電性連接的第一端部711,及與第二整合電路板61電性連接的第二端部712。補充說明,本新型電子電路次組件80的第一電路模組5其安裝在座體10中的方向與第二電路模組6其安裝在座體10中的方向可以是相同但位於不同的水平面上,又或者是第一電路模組5與第二電路模組6是位於同一水平面但各自朝不同的安裝方向(如圖11所示),其中,所述連接元件7在自由狀態下,其第一端部711與第二端部712彼此是相反設置。補充說明,在座體10所界定的容置空間中,第一電路模組5與第二電路模組6兩者之間距可以是非常靠近,第一電路模組5與第二電路模組6甚至可透過隔板而被分開於不同空間中,也就是說,本新型座體之形狀及其內部結構,可視實際應用而設計成不同形狀或不同內部結構,並無須特別限制。
The
圖11所揭露的隔離器在使用上,電信號傳輸方向是自第一連接端口101內的第一接觸件27經第一整合電路板51的第一功能模塊56、所述連接元件7、第二整合電路板61的第二功能模塊66後,再通過位於第二連接端口102內的第二接觸件33向外輸出。
In the use of the isolator disclosed in FIG. 11 , the direction of electrical signal transmission is from the
在一些實施例中,所述連接元件可以為軟性印刷電路板(Flexible Printing Circuit Board,FPC),第一導通電路位於所述軟性印刷電路板內,所述軟性印刷電路板具有相反設置的第一端部與第二端部。此外,所述連接元件也可以但不限制為電線或電纜。 In some embodiments, the connecting element may be a flexible printed circuit board (FPC), the first conductive circuit is located in the flexible printed circuit board, and the flexible printed circuit board has a first end and a second end that are oppositely arranged. In addition, the connecting element may also be, but is not limited to, a wire or a cable.
在一些實施例中,當位於第一整合電路板上的第一功能模塊或位於第二整合電路板上的第二功能模塊是不具有信號隔離功能時,第一電路模組或第二電路模組甚至可以省略其所對應的第一殼體與第二殼體。 In some embodiments, when the first functional module located on the first integrated circuit board or the second functional module located on the second integrated circuit board does not have a signal isolation function, the first circuit module or the second circuit module may even omit the corresponding first housing and second housing.
參閱圖12、13,本新型電子電路次組件70的第二變化實施例,其是在第一電路模組5或第二電路模組6之數量上有所變化,舉例來說,本新型隔離器的電子電路次組件70進一步包括一個或多個第一電路模組5或第二電路模組6。每一個第一電路模組5與每一個第二電路模組6,其等在XYZ座標係中可視應用需求而任意地朝不同安裝方向來設置於座體10上。
Referring to Figures 12 and 13, the second variation of the
經由以上的說明,可再將本新型隔離器及其電子電路次組件的優點歸納如下: Based on the above description, the advantages of the new isolator and its electronic circuit subassembly can be summarized as follows:
一、本新型電子電路次組件可適用安裝於各種形狀的座體而深具實用性,而且組裝步驟少、簡單還具有快速安裝的優點。 1. This new electronic circuit subassembly can be installed on various shapes of bases and is very practical. It has the advantages of few assembly steps, simplicity and quick installation.
二、本新型電子電路次組件結構精巧,毋須使用體積龐大的安裝座體,可有效縮小隔離器整體體積,從而改善習知信號隔離器其體積龐大耗費空間的缺點。 Second, the new electronic circuit subassembly has a sophisticated structure and does not require a bulky mounting base, which can effectively reduce the overall size of the isolator, thereby improving the shortcomings of the known signal isolator, which is bulky and consumes space.
三、本新型隔離器具有良好電信號隔離效果,不僅適用於0至1.8GHz頻段,也可用於更高頻段。 3. This new isolator has good electrical signal isolation effect and is not only applicable to the 0 to 1.8 GHz frequency band, but also to higher frequency bands.
參閱圖14,為本新型隔離器200的第二實施例,第二實施例是類似於第一實施例,其主要差異在於:座體20呈L型並還包括基壁201及直立壁202。第一連接端口203與第二連接端口204是形成於直立壁202。座體20還包括連接第一連接端口203的第一環壁205,及連接第二連接端口204的第二環壁206,第一電路模組2與第二電路模組3分別設置於第一環壁205與第二環壁206內,而且基壁201是電性連接第一電路模組2的第一殼體22。
Referring to FIG. 14 , it is a second embodiment of the novel isolator 200. The second embodiment is similar to the first embodiment, and the main difference is that the base 20 is L-shaped and further includes a base wall 201 and a vertical wall 202. The first connection port 203 and the second connection port 204 are formed on the vertical wall 202. The base 20 also includes a first annular wall 205 connected to the first connection port 203, and a second annular wall 206 connected to the second connection port 204. The
如此,第二實施例也能達成相同於第一實施例的功效與目的。 In this way, the second embodiment can also achieve the same effect and purpose as the first embodiment.
參閱圖15,為本新型隔離器300的第三實施例,第三實施例是類似於第一實施例,其主要差異在於:座體30呈片狀並還具有直立壁301、第一環壁304,及第二環壁305。第一連接端口302與第二連接端口303是形成於直立壁301。第一環壁304自第一連接端口302向外延伸,第二環壁305自第二連接端口303向外延伸。第一電路模組2與第二電路模組3分別設置於第一環壁304與第二環壁305內。
Referring to FIG. 15 , it is a third embodiment of the
如此,第三實施例也能達成相同於第一實施例的功效與目的。 In this way, the third embodiment can also achieve the same effect and purpose as the first embodiment.
綜上所述,本新型隔離器及其電子電路次組件,是利用同軸設計概念,一端於第一電路模組的第一整合電路板中使用多個電容及副鐵粉芯來達到異常信號隔離的效果,另一端於第二電路模組的第二整合電路板中使用避雷管或其他零件來達到防雷擊效果,另說明的是,所述避雷管或其他具防雷擊功能零件並非一定要整合於第二電路模組的第二整合電路板中,也可以是整合於第一電路模組的第一整合電路板中使用。本新型隔離器及其電子電路次組件結構精巧,可有效縮減整體體積,故確實能達成本新型之目的。 In summary, the novel isolator and its electronic circuit subassembly utilize the coaxial design concept. One end uses multiple capacitors and auxiliary iron powder cores in the first integrated circuit board of the first circuit module to achieve the effect of abnormal signal isolation, and the other end uses lightning arresters or other parts in the second integrated circuit board of the second circuit module to achieve the lightning protection effect. It is also explained that the lightning arrester or other parts with lightning protection function do not have to be integrated in the second integrated circuit board of the second circuit module, but can also be integrated in the first integrated circuit board of the first circuit module. The novel isolator and its electronic circuit subassembly have a sophisticated structure and can effectively reduce the overall volume, so they can indeed achieve the purpose of the novel.
本創作所揭露之技術內容並不限於上述之實施例,凡是與本創作所揭露之創作概念及原則相同者,皆落入本創作之申 請專利範圍。需注意的是,元件的定義,例如“第一”和“第二”並不是限定之文字,而是區別性的用語。而本案所用之“包括”或“包含”涵蓋“包括”和“具有”的概念,並表示元件、操作步驟及/或組或上述的組合,並不代表排除或增加的意思。又,除非有特別說明,否則操作之步驟順序並不代表絕對順序。更,除非有特別說明,否則以單數形式提及元件時(例如使用冠詞“一”或“一個”)並不代表“一個且只有一個”而是“一個或多個”。本案所使用的“及/或”是指“及”或“或”,以及“及”和“或”。本案所使用的範圍相關用語係包含全部及/或範圍限定,例如“至少”、“大於”、“小於”、“不超過”等,是指範圍的上限或下限。 The technical content disclosed in this invention is not limited to the above-mentioned embodiments. All the concepts and principles of the invention disclosed in this invention fall within the scope of the patent application of this invention. It should be noted that the definitions of components, such as "first" and "second", are not limiting words, but distinguishing terms. The "include" or "comprising" used in this case covers the concepts of "including" and "having", and indicates components, operation steps and/or groups or the above combinations, and does not mean exclusion or addition. In addition, unless otherwise specified, the order of operation steps does not represent an absolute order. Moreover, unless otherwise specified, when referring to a component in the singular form (for example, using the article "one" or "an"), it does not mean "one and only one" but "one or more". The "and/or" used in this case means "and" or "or", as well as "and" and "or". The scope-related terms used in this case include all and/or scope limitations, such as "at least", "greater than", "less than", "not exceeding", etc., which refer to the upper or lower limit of the range.
惟以上所述者,僅為本新型之實施例而已,當不能以此限定本新型實施之範圍,凡是依本新型申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本新型專利涵蓋之範圍內。 However, the above is only an example of the implementation of this new model, and it cannot be used to limit the scope of the implementation of this new model. All simple equivalent changes and modifications made according to the scope of the patent application of this new model and the content of the patent specification are still within the scope of this new patent.
10:座體 10: Seat
101:第一連接端口 101: First connection port
102:第二連接端口 102: Second connection port
103:絕緣墊片 103: Insulation gasket
104:第一環壁 104: First Ring Wall
105:第二環壁 105: Second ring wall
11:絕緣材料 11: Insulation materials
2:第一電路模組 2: First circuit module
22:第一殼體 22: First shell
23:接頭 23: Connector
231:頭段 231: Header
232:尾段 232: Tail section
31:第二整合電路板 31: Second integrated circuit board
311:基板 311: Substrate
312:避雷組件 312: Lightning protection components
313:第二導通電路 313: Second conducting circuit
315:第一接觸點 315: First contact point
316:第二接觸點 316: Second contact point
32:第二殼體 32: Second shell
321:上半部 321: Upper part
322:下半部 322: Lower half
33:第二接觸件 33: Second contact piece
34:第二絕緣件 34: Second insulation component
4:連接元件 4: Connecting components
234:小徑部 234: Trail section
24:絕緣環狀件 24: Insulation ring
241:凹槽 241: Groove
26:絕緣套筒 26: Insulation sleeve
27:第一接觸件 27: First contact
3:第二電路模組 3: Second circuit module
41:第一導通電路 41: First conduction circuit
411:第一端部 411: First end
412:第二端部 412: Second end
42:接地電路 42: Ground circuit
90:電子電路次組件 90: Electronic circuit subassemblies
100:隔離器 100: Isolator
Claims (20)
Publications (1)
Publication Number | Publication Date |
---|---|
TWM654723U true TWM654723U (en) | 2024-05-01 |
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