TWM652336U - Automatic film peeling system - Google Patents
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- TWM652336U TWM652336U TW112212410U TW112212410U TWM652336U TW M652336 U TWM652336 U TW M652336U TW 112212410 U TW112212410 U TW 112212410U TW 112212410 U TW112212410 U TW 112212410U TW M652336 U TWM652336 U TW M652336U
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- 239000000758 substrate Substances 0.000 claims abstract description 59
- 230000001681 protective effect Effects 0.000 claims abstract description 48
- 238000003860 storage Methods 0.000 claims abstract description 33
- 238000004049 embossing Methods 0.000 claims description 30
- 238000007599 discharging Methods 0.000 claims description 27
- 239000011120 plywood Substances 0.000 claims description 6
- 230000032258 transport Effects 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 4
- 230000005856 abnormality Effects 0.000 claims description 2
- 238000012546 transfer Methods 0.000 claims description 2
- 238000005096 rolling process Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 143
- 238000000034 method Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 230000002159 abnormal effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Abstract
Description
本新型係有關於一種撕膜系統。特別是有關於一種自動撕膜系統。The new system relates to a film tearing system. Especially about an automatic film tearing system.
隨著科技日益的進步,電子工業也日漸蓬勃發展,印刷電路板(printed circuit board;PCB)也越來越廣泛的被應用。由於印刷電路板具有很多優點且組裝方便,因此,可以方便地應用於各種電子產品與設備,以進行標準化組裝,又可以進行自動化、規模化批量生產,進而廣泛地應用於各類的電子產品與設備之中。With the advancement of science and technology, the electronics industry is also booming, and printed circuit boards (PCBs) are becoming more and more widely used. Since printed circuit boards have many advantages and are easy to assemble, they can be easily used in various electronic products and equipment for standardized assembly. They can also be used for automated and large-scale mass production, and are widely used in various electronic products and equipment. among the equipment.
在印刷電路板生產製程中,基板在曝光之前,一般會在基板之上、下表面分別形成光阻層及黏附於光阻層表面之薄膜,在曝光之後,再將薄膜剝離以使光阻層外露,以進行後續之顯影及蝕刻程序。In the printed circuit board production process, before the substrate is exposed, a photoresist layer and a film adhered to the surface of the photoresist layer are generally formed on the upper and lower surfaces of the substrate. After exposure, the film is peeled off to remove the photoresist layer. Exposed for subsequent development and etching processes.
然而,以現有剝離薄膜之方式,仍有可能因為薄膜殘留,以致於造成後續製程的不良。如何能夠提供一種方便且快速的剝離薄膜的方式與設備,將有助於提升印刷電路板的生產品質以及降低生產成本。However, with the existing method of peeling off the film, there is still a possibility that the film remains, causing defects in subsequent processes. How to provide a convenient and fast method and equipment for peeling off films will help improve the production quality of printed circuit boards and reduce production costs.
新型內容旨在提供本揭示內容的簡化摘要,以使閱讀者對本揭示內容具備基本的理解。此新型內容並非本揭示內容的完整概述,且其用意並非在指出本新型實施例的重要/關鍵元件或界定本新型的範圍。The new content is intended to provide a simplified summary of the disclosure so that readers can have a basic understanding of the disclosure. This summary is not an extensive overview of the disclosure and is not intended to identify key/critical elements of the disclosure or to delineate the scope of the disclosure.
本新型內容之一目的是在提供一種自動撕膜系統,可方便與快速地將板材表面的保護薄膜撕除,且進行薄膜殘留的檢測,以提升印刷電路板的製造品質。One of the purposes of this new model is to provide an automatic film tearing system that can easily and quickly remove the protective film on the surface of the board and detect film residues to improve the manufacturing quality of printed circuit boards.
為達上述目的,本新型內容之一技術態樣係關於一種自動撕膜系統包含有一入料裝置、一撕膜裝置、一出料裝置以及一暫存裝置。入料裝置用以接收一基板,撕膜裝置連接於入料裝置,用以撕除基板表面的保護薄膜,出料裝置連接於撕膜裝置,以輸出已撕除保護薄膜的基板,而暫存裝置設置於出料裝置之中,以暫存未完全撕除保護薄膜的基板。In order to achieve the above purpose, one technical aspect of the present invention relates to an automatic film tearing system including a feeding device, a film tearing device, a discharging device and a temporary storage device. The feeding device is used to receive a substrate. The film tearing device is connected to the feeding device to tear off the protective film on the surface of the substrate. The discharge device is connected to the film tearing device to output the substrate with the protective film removed and temporarily store it. The device is installed in the discharging device to temporarily store substrates whose protective films have not been completely removed.
在一些實施例中,自動撕膜系統更包含有一上膜傳送裝置,設置於撕膜裝置的上方,以傳送基板的上表面的保護薄膜。In some embodiments, the automatic film tearing system further includes an upper film conveying device disposed above the film tearing device to convey the protective film on the upper surface of the substrate.
在一些實施例中,自動撕膜系統更包含有一上膜儲存器,位於撕膜裝置的一側。其中,上膜傳送裝置傳送基板的上表面的保護薄膜至上膜儲存器之中儲存。In some embodiments, the automatic film tearing system further includes an upper film storage located on one side of the film tearing device. The upper film transport device transports the protective film on the upper surface of the substrate to the upper film storage for storage.
在一些實施例中,自動撕膜系統更包含有一下膜儲存器,設置於撕膜裝置的下方,以收納基板的下表面的保護薄膜。In some embodiments, the automatic film tearing system further includes a lower film storage device disposed below the film tearing device to store the protective film on the lower surface of the substrate.
在一些實施例中,入料裝置包含有複數個入料滾輪,用以傳送基板至撕膜裝置。In some embodiments, the feeding device includes a plurality of feeding rollers for transporting the substrate to the film tearing device.
在一些實施例中,出料裝置包含有複數個出料滾輪,位於入料滾輪的後方,且與入料滾輪同步轉動。In some embodiments, the discharging device includes a plurality of discharging rollers, which are located behind the feeding roller and rotate synchronously with the feeding roller.
在一些實施例中,入料裝置包含有複數個夾板器,用以定位基板。In some embodiments, the feeding device includes a plurality of clampers for positioning the substrate.
在一些實施例中,撕膜裝置包含有一壓花夾板以及一壓花輪。壓花夾板用以壓住基板,而壓花輪設置於壓花夾板的後方,用以在基板上的保護薄膜上進行滾壓。In some embodiments, the film tearing device includes an embossing clamp and an embossing wheel. The embossing splint is used to press the substrate, and the embossing wheel is arranged behind the embossing splint to roll the protective film on the substrate.
在一些實施例中,撕膜裝置更包含有一起膜輪,設置於壓花輪的後方,以將基板上的保護薄膜剝離。In some embodiments, the film tearing device further includes a film wheel disposed behind the embossing wheel to peel off the protective film on the substrate.
在一些實施例中,撕膜裝置更包含有一清潔膠輪,設置於起膜輪的後方,以清潔起膜輪。In some embodiments, the film tearing device further includes a cleaning rubber wheel, which is disposed behind the film removing wheel to clean the film removing wheel.
在一些實施例中,撕膜裝置更包含有一導膜裝置,設置於起膜輪的上方,以將保護薄膜引導至上膜傳送裝置。In some embodiments, the film tearing device further includes a film guiding device disposed above the film taking wheel to guide the protective film to the upper film conveying device.
在一些實施例中,自動撕膜系統更包含有複數個撕膜異常感應器,設置於出料裝置之中,以偵測基板上是否有保護薄膜殘留。In some embodiments, the automatic film tearing system further includes a plurality of film tearing abnormal sensors arranged in the discharging device to detect whether there is any protective film remaining on the substrate.
因此,所述之自動撕膜系統,可以方便且快速地進行電路板的保護薄膜的撕除,並進行殘留保護薄膜的檢查,以避免殘留保護薄膜造成後續製程的缺陷,有效地提高電路板的生產效率與品質。Therefore, the automatic film tearing system can conveniently and quickly remove the protective film of the circuit board and inspect the residual protective film to avoid defects caused by the residual protective film in subsequent processes and effectively improve the quality of the circuit board. Production efficiency and quality.
下文係舉實施例配合所附圖式進行詳細說明,但所提供之實施例並非用以限制本揭露所涵蓋的範圍,而結構運作之描述非用以限制其執行之順序,任何由元件重新組合之結構,所產生具有均等功效的裝置,皆為本揭露所涵蓋的範圍。另外,圖式僅以說明為目的,並未依照原尺寸作圖。為使便於理解,下述說明中相同元件或相似元件將以相同之符號標示來說明。The following is a detailed description of the embodiments with the accompanying drawings. However, the embodiments provided are not intended to limit the scope of the present disclosure, and the description of the structural operation is not intended to limit the order of its execution. Any recombination of components The structures and devices with equal functions are all within the scope of this disclosure. In addition, the drawings are for illustrative purposes only and are not drawn to original size. To facilitate understanding, the same elements or similar elements will be designated with the same symbols in the following description.
另外,在全篇說明書與申請專利範圍所使用之用詞(terms),除有特別註明外,通常具有每個用詞使用在此領域中、在此揭露之內容中與特殊內容中的平常意義。某些用以描述本揭露之用詞將於下或在此說明書的別處討論,以提供本領域技術人員在有關本揭露之描述上額外的引導。In addition, unless otherwise noted, the terms used throughout the specification and patent application generally have their ordinary meanings when used in the field, in the disclosure and in the special content. . Certain terms used to describe the present disclosure are discussed below or elsewhere in this specification to provide those skilled in the art with additional guidance in describing the present disclosure.
於實施方式與申請專利範圍中,除非內文中對於冠詞有所特別限定,否則『一』與『該』可泛指單一個或複數個。而步驟中所使用之編號僅係用來標示步驟以便於說明,而非用來限制前後順序及實施方式。In the embodiments and the scope of the patent application, unless there is a special limitation on the article in the context, "a" and "the" can generally refer to a single one or a plurality. The numbers used in the steps are only used to mark the steps for ease of explanation, but are not used to limit the order and implementation manner.
其次,在本文中所使用的用詞『包含』、『包括』、『具有』、『含有』等等,均為開放性的用語,即意指包含但不限於。Secondly, the words "include", "include", "have", "contain", etc. used in this article are all open terms, which mean including but not limited to.
第1圖係繪示自動撕膜系統的立體示意圖,第2圖則係繪示自動撕膜系統的撕膜裝置的部分元件示意圖,而第3圖則係繪示自動撕膜系統的撕膜裝置的另一部分元件示意圖。此外,第4圖則係繪示自動撕膜系統的出料裝置以及暫存裝置的示意圖。Figure 1 is a three-dimensional schematic diagram of the automatic film tearing system, Figure 2 is a schematic diagram of some components of the film tearing device of the automatic film tearing system, and Figure 3 shows the film tearing device of the automatic film tearing system. Another part of the component diagram. In addition, Figure 4 is a schematic diagram showing the discharging device and temporary storage device of the automatic film tearing system.
首先參閱第1圖,如圖所示,自動撕膜系統100包含有一入料裝置110、一撕膜裝置120、一出料裝置160以及一暫存裝置170。入料裝置110上設置有複數個入料滾輪112,用以傳送一基板至撕膜裝置120。在一些實施例中,基板包含有印刷電路板的基板,其上覆蓋有保護薄膜,以用來保護基板上的光阻乾膜。撕膜裝置120連接於入料裝置110,用以撕除基板表面的保護薄膜。出料裝置160則連接於撕膜裝置120,以將已撕除保護薄膜的基板輸出至下一個工作站,以進行後續的製程。First referring to Figure 1, as shown in the figure, the automatic
此外,暫存裝置170則設置於出料裝置160之中,以可以交錯排列於出料裝置160之中,亦可由出料裝置160之中依需求升降,以用來暫存未完全撕除保護薄膜的基板或者其他需要暫存的印刷電路板的基板,以方便現場操作人員進行後續基板的處理,進而提升製程的良率與產出量。In addition, the
在一些實施例中,自動撕膜系統100更包含有一上膜傳送裝置130以及一上膜儲存器140。上膜傳送裝置130設置於撕膜裝置120的上方,以傳送由基板的上表面撕下的保護薄膜至上膜儲存器140之中。在一些實施例中,上膜儲存器140較佳地位於該撕膜裝置120的一側,以方便上膜傳送裝置130將上表面的保護薄膜輸送至上膜儲存器140之中進行儲存。In some embodiments, the automatic
在一些實施例中,自動撕膜系統100更包含有一下膜儲存器150,設置於撕膜裝置120的下方,以收納基板的下表面的保護薄膜。In some embodiments, the automatic
在一些實施例中,出料裝置160亦包含有複數個出料滾輪162,位於入料滾輪112的後方,且與入料滾輪112進行同步轉動,例如是利用同步輸送輪同步轉動入料滾輪112以及出料滾輪162。In some embodiments, the
在一些實施例中,入料裝置110包含有複數個夾板器114,位於基板的左右兩側,用以定位基板的左右方向,以使基板沿著入料滾輪112轉動的方向移動。In some embodiments, the
同時參閱第1圖與第2圖,如圖中所示,在一些實施例中,撕膜裝置120包含有一壓花夾板122以及一壓花輪232。壓花輪232設置於壓花夾板122的後方。壓花夾板122用以壓住基板,避免壓花時移動,而壓花輪232則可以沿著基板的邊緣水平移動,以在基板上的保護薄膜的邊緣進行滾壓,進而在保護薄膜產生壓花紋路。Referring to FIGS. 1 and 2 simultaneously, as shown in the figures, in some embodiments, the
此外,撕膜裝置120的壓花夾板122的後方更設置有一壓花夾板移動裝置210,以上下移動壓花夾板122,以夾緊或放鬆基板。在一些實施例中,壓花夾板122的後方更設置有一壓花輪升降裝置220以及一壓花輪水平移動裝置230,以提供壓花輪232上下移動以及左右移動的能力,進而在壓花夾板122夾住基板時,利用壓花輪232沿著基板的邊緣在保護薄膜上進行壓花,以利於後續撕膜製程的進行。In addition, an embossing clamping
同時參閱第3圖,在一些實施例中,撕膜裝置120更包含有一起膜輪310,設置於壓花輪232的後方,以將基板上的保護薄膜剝離。在一些實施例中,起膜輪310可以是一矽膠滾輪,其上亦可以設置有黏塵紙,以有效地將保護薄膜剝離。Referring to FIG. 3 , in some embodiments, the
在一些實施例中,撕膜裝置120更包含有一吹氣裝置,其可以將空氣吹入基板與保護薄膜之間,以增加撕膜的效率,並避免造成基板以及基板上的光阻乾膜的損壞。In some embodiments, the
在一些實施例中,撕膜裝置120更包含有一清潔膠輪320,設置於起膜輪310的後方,以用來清潔起膜輪310。In some embodiments, the
在一些實施例中,撕膜裝置120更包含有一導膜裝置330,設置於起膜輪310的上方,以將撕起的保護薄膜引導至上膜傳送裝置130,然後由上膜傳送裝置130輸送至上膜儲存器140之中進行儲存。In some embodiments, the
在一些實施例中,上膜傳送裝置130包含有一夾爪,以將撕起的保護薄膜輸送至上膜儲存器140的上方,然後夾爪鬆開保護薄膜,使其掉入上膜儲存器140之中進行儲存。In some embodiments, the upper
同時參閱第4圖,如圖中所示,在一些實施例中,自動撕膜系統100更包含有複數個撕膜異常感應器450,設置於出料裝置160之中,以偵測基板上是否有保護薄膜殘留,進而有效地避免基板上殘留保護薄膜,提升印刷電路板的生產品質與良率。Referring also to Figure 4, as shown in the figure, in some embodiments, the automatic
此外,暫存裝置170則包含有一升降座410、複數個承載支撐桿20排列而成的支撐陣列、一升降馬達430以及複數個位置感應器440。承載支撐桿20安裝於升降座410之上,並排列而成支撐陣列,其可與出料裝置160中的出料滾輪162交錯排列,故可以有效地容置於出料裝置160之中,並位於出料滾輪162之間隙之中。此外,暫存裝置170可以利用升降馬達430,進一步驅動升降座410上升或下降,以使同一水平面設置的承載支撐桿420形成一支撐平台,進而將被檢出有殘留保護薄膜的基板向上移動,以離開出料滾輪162的表面,並暫存於承載支撐桿420形成支撐平台之上,以待後續現場人員進行處理。In addition, the
在一些實施例中,複數個承載支撐桿420可以形成複數個支撐平台,以暫存複數個基板。而位置感應器440可以提供控制器180,目前升降座410以及承載支撐桿420所形成支撐平台的高度,進而控制升降馬達430,以驅動升降座410的上升或下降。In some embodiments, a plurality of load-
有鑑於此,所述之自動撕膜系統,可以方便且快速地進行電路板的保護薄膜的撕除,並進行殘留保護薄膜的檢查,以避免殘留保護薄膜造成後續製程的缺陷,有效地提高電路板的生產效率與品質。In view of this, the automatic film tearing system can easily and quickly remove the protective film of the circuit board and inspect the residual protective film to avoid defects caused by the residual protective film in subsequent processes and effectively improve the circuit quality. Board production efficiency and quality.
惟以上所述者,僅為本新型之較佳實施例而已,當不能以此限定本新型實施之範圍,即大凡依本新型申請專利範圍及新型說明內容所作之簡單的等效變化與修飾,皆仍屬本新型專利涵蓋之範圍內。另外,本新型的任一實施例或申請專利範圍不須達成本新型所揭露之全部目的或優點或特點。此外,摘要部分和標題僅是用來輔助專利文件搜尋之用,並非用來限制本新型之權利範圍。此外,本說明書或申請專利範圍中提及的”第一”、”第二”等用語僅用以命名元件(element)的名稱或區別不同實施例或範圍,而並非用來限制元件數量上的上限或下限。However, the above are only preferred embodiments of the present invention, and should not be used to limit the scope of the present invention. That is, any simple equivalent changes and modifications made in accordance with the patent scope of the present invention and the description of the new model, All are still within the scope of this new patent. In addition, any embodiment or patentable scope of the present invention does not need to achieve all the purposes, advantages or features disclosed in the present invention. In addition, the abstract part and title are only used to assist in searching patent documents and are not used to limit the scope of rights of the present invention. In addition, terms such as “first” and “second” mentioned in this specification or the scope of the patent application are only used to name elements or to distinguish different embodiments or scopes, and are not used to limit the number of elements. upper or lower limit.
雖然本揭露已以實施方式揭露如上,然其並非用以限定本揭露,任何本領域具通常知識者,在不脫離本揭露之精神和範圍內,當可作各種之更動與潤飾,因此本揭露之保護範圍當視後附之申請專利範圍所界定者為準。Although the disclosure has been disclosed in the above embodiments, it is not intended to limit the disclosure. Anyone with ordinary knowledge in the art can make various modifications and modifications without departing from the spirit and scope of the disclosure. Therefore, the disclosure The scope of protection shall be subject to the scope of the patent application attached.
100:自動撕膜系統 110:入料裝置 112:入料滾輪 114:夾板器 120:撕膜裝置 122:壓花夾板 130:上膜傳送裝置 140:上膜儲存器 150:下膜儲存器 160:出料裝置 162:出料滾輪 170:暫存裝置 180:控制器 210:壓花夾板移動裝置 220:壓花輪升降裝置 230:壓花輪水平移動裝置 232:壓花輪 310:起膜輪 320:清潔膠輪 330:導膜裝置 410:升降座 420:承載支撐桿 430:升降馬達 440:位置感應器 450:撕膜異常感應器 100: Automatic film tearing system 110: Feeding device 112: Feeding roller 114: splint 120: Film tearing device 122:Embossed plywood 130: Film conveying device 140: Upper film storage 150:Lower film storage 160: Discharging device 162: Discharge roller 170: Temporary storage device 180:Controller 210: Embossed plywood moving device 220: Embossing wheel lifting device 230: Embossing wheel horizontal moving device 232:Embossing wheel 310: Film forming wheel 320:Clean rubber wheels 330: Film guide device 410: Lift seat 420: Load bearing support rod 430: Lift motor 440: Position sensor 450: Film tearing abnormality sensor
為讓本揭露之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 第1圖為依照本新型一實施例所繪示的一種自動撕膜系統的立體示意圖。 第2圖為依照本新型一實施例所繪示的一種自動撕膜系統的撕膜裝置的部分元件示意圖。 第3圖為依照本新型一實施例所繪示的一種自動撕膜系統的撕膜裝置的另一部分元件示意圖。 第4圖為依照本新型一實施例所繪示的一種自動撕膜系統的出料裝置以及暫存裝置的示意圖。 In order to make the above and other objects, features, advantages and embodiments of the present disclosure more obvious and understandable, the accompanying drawings are described as follows: Figure 1 is a schematic three-dimensional view of an automatic film tearing system according to an embodiment of the present invention. Figure 2 is a schematic diagram of some components of a film tearing device of an automatic film tearing system according to an embodiment of the present invention. Figure 3 is a schematic diagram of another part of the film tearing device of an automatic film tearing system according to an embodiment of the present invention. Figure 4 is a schematic diagram of the discharging device and the temporary storage device of an automatic film tearing system according to an embodiment of the present invention.
100:自動撕膜系統 100: Automatic film tearing system
110:入料裝置 110: Feeding device
112:入料滾輪 112: Feeding roller
114:夾板器 114: splint
120:撕膜裝置 120: Film tearing device
122:壓花夾板 122:Embossed plywood
130:上膜傳送裝置 130: Film conveying device
140:上膜儲存器 140: Upper film storage
150:下膜儲存器 150:Lower film storage
160:出料裝置 160: Discharging device
162:出料滾輪 162: Discharge roller
170:暫存裝置 170: Temporary storage device
180:控制器 180:Controller
Claims (12)
Publications (1)
Publication Number | Publication Date |
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TWM652336U true TWM652336U (en) | 2024-03-01 |
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