TWM650912U - Composite heat dissipating structure - Google Patents

Abstract

A composite heat dissipation structure includes: a uniform temperature plate and at least one heat pipe; the uniform temperature plate There is an airtight chamber filled with working liquid inside. The upper and lower walls inside the vaporization plate are provided with a first capillary structure and a second capillary structure; the upper wall of the vaporization plate is provided with at least one channel communicating with the air. a through hole of the airtight chamber; the airtight chamber is provided with at least one annular body corresponding to the through hole and connected to the first and second capillary structures at both ends; the heat pipe has a ring inserted into the through hole; The open end of the airtight chamber connected to the first capillary structure is axially supported and positioned by the ring body. In this invention, the ring body is positioned exactly corresponding to the open end of the heat pipe, which can greatly shorten the temperature distribution. The return path of the working liquid between the plate and the heat pipe prevents dry burning and improves the efficiency of the two-phase flow cycle.

Description

Composite heat dissipation structure

A composite heat dissipation structure, especially a composite heat dissipation structure that can increase the return efficiency of working liquid and enhance the structural strength.

As customers' requirements for heat dissipation in electronic equipment (such as computers or servers) increase, a 3D vapor chamber (3D VC) structure has been developed. Compared with the traditional 2D (two-dimensional) vapor chamber, this 3D VC The board has higher integration, higher vapor diffusion efficiency, smaller thermal resistance and higher heat dissipation limit. However, as the integration level of electronic devices such as chips increases, the heat dissipation demand increases, so that conventional heat pipes and/or vapor chambers can no longer meet the heat dissipation needs of such high heat flux, and 3D vapor chambers gradually replace single heat pipes. and/or vapor chamber, and are widely used in the field of electronic heat dissipation.

Please refer to Figure 1. The existing 3D vapor chamber 1 is composed of a plurality of tube bodies 11 and a vapor chamber 12. The vapor chamber 12 is composed of an upper plate 121 and a lower plate 122 that are covered and combined to define a filling layer. For the chamber 124 of the working fluid (not shown in the figure), the upper plate 121 is provided with at least one opening 123, and the opening 123 penetrates the upper plate 121 and communicates with the chamber 124, and extends around the opening 123. A ring neck 123a, a first capillary structure 125 and a second capillary structure 126 are respectively provided inside the upper and lower plates 121, 122. The chamber 124 is also provided with a plurality of support structures 127 for supporting the chamber 124. , the support structures 127 are far away from and misaligned with the aforementioned openings 123 .

The two ends of the tube body 11 respectively have a closed end 111 and an open end 112. The closed end 111 and the open end 112 jointly define a tubular chamber 114. The open end 112 passes through the opening of the upper plate 121. 123 is connected to the upper plate 121 and is located between the ring neck 123a of the upper plate 121 and the outer edge of the open end 112 of the heat pipe 11 The contact parts are fixed by welding. The tubular chamber 114 of the heat pipe 11 is connected to the chamber 124 through the open end 112. The inner wall of the tubular chamber 114 has a third capillary structure 115. The third capillary structure 115 inside the tube body 11 and the first capillary structure 125 provided on the inner surface of the upper plate 121 of the temperature equalizing plate 12 can be connected or not connected.

When the condensed working liquid in the tube body 11 flows back from the closed end to the evaporation area inside the vapor chamber 12, there are two ways. One way is that the condensed working liquid in the tube body 11 flows back from the open end 112 of the heat pipe 11. After reaching the first capillary structure 125 near the opening 123 of the upper plate 121, it forms a collection at this location. When the working liquid is collected to a certain amount, it drops to the evaporation area due to the influence of gravity. Another way is to flow back to the opening 123. Nearby diffuses and spreads in the horizontal direction through the first capillary structure 125, diffuses to the support structure 127, and then flows back downward along the outer surface of the support structure 127 to the second capillary structure 126, and then flows back to the second capillary structure 126 through the second capillary structure 126. The evaporation area of the vapor chamber 12, but since the support structures 127 are disposed far away from the opening 123, the return distance of the working liquid is too long, causing the return efficiency to be slow. This is easy when the return time is too long or the return path is too long. As a result, the working liquid inside the vapor chamber 12 has no time to flow back to the evaporation area, and it is easy for the evaporation area to have no working liquid and cause dry burning.

Furthermore, the heat pipe 11 and the vapor chamber 12 are only fixed through partial one-way (horizontal direction) welding of the ring neck 123 a and the open end 112 of the heat pipe 11 , and only have a line contact area, and for the heat pipe 11 does not have any support or fixed structure after extending into the plate-shaped chamber 124 of the vapor chamber 12 (in the vertical direction). Therefore, when the heat pipe 11 is hit in the vertical direction or when the heat pipe 11 is installed with heat dissipation fins at the closed end due to excessive weight, etc. In any case, it may cause falling off or bending and breaking, resulting in problems such as deflation. Therefore, the above-mentioned common knowledge deficiencies are actually the primary problem to be solved in this case.

Therefore, in order to effectively solve the above-mentioned problems, the main purpose of this invention is to provide a method that can improve and speed up the water return efficiency inside the vapor chamber and increase the structural strength of the combination of the heat pipe and the vapor chamber.

In order to achieve the above purpose, the present invention provides a composite heat dissipation structure, which includes: a vapor chamber and at least one heat pipe; the vapor chamber has an airtight chamber inside and is filled with a working liquid. The vapor chamber has An upper plate body and a lower plate body, and the upper and lower plate bodies are correspondingly covered and defined to form the aforementioned airtight chamber. The upper and lower plate bodies are respectively provided with a first capillary structure and a first capillary structure relative to the inner surface of the airtight chamber. Second capillary structure.

At least one through hole penetrates the upper plate body of the vapor chamber and communicates with the airtight chamber; at least one ring body is provided in the airtight chamber, and the ring system is a porous structure. The two ends are respectively connected to the first and second capillary structures, and the ring body is arranged corresponding to the aforementioned through hole.

The two ends of the heat pipe have a closed end and an open end respectively. There is a heat pipe chamber inside the heat pipe, which is connected with the airtight chamber of the vapor chamber. The heat pipe penetrates the open end through the open end. The through hole of the vapor chamber enters the airtight chamber of the vapor chamber, is connected to the first capillary structure, and is axially supported and positioned by the ring body located below the first capillary structure.

This invention provides a vapor chamber with a ring corresponding to the through hole, which can be used to provide axial support and positioning for the heat pipe after it extends into the airtight chamber, and also allows the working liquid condensed and refluxed in the heat pipe chamber to pass through This ring body directly and quickly guides the return flow to the evaporation area in the vapor chamber, thereby solving the conventional problems of dry burning and insufficient structural strength caused by too far a return flow path.

3: Uniform temperature plate

31: Upper plate body

311: First capillary structure

312:Through hole

313:Flange

32:Lower plate body

321: Second capillary structure

322:Support column

33: Airtight chamber

4:Heat pipe

41: closed end

42:Open end

43:Heat pipe chamber

44: The third capillary structure

6: Ring body

61: Upper end surface

62: Lower end face

63: Shaft hole

Figure 1 is a cross-sectional view of a conventional vapor chamber structure; Figure 2 is a perspective exploded view of the first embodiment of the composite heat dissipation element assembly structure of this invention; Figure 3 is a cross-sectional view of the first embodiment of the composite heat dissipation element assembly structure of this invention; Figure 4a is a top view of the composite heat dissipation element assembly structure of this invention; Figure 4b is a composite heat dissipation element assembly of this invention Structural top view; Figure 4c is a top view of the composite heat dissipation element assembly structure of the present invention; Figure 5 is a cross-sectional view of the second embodiment of the composite heat dissipation element assembly structure of the present invention;

The above-mentioned purpose of this invention and its structural and functional characteristics will be explained based on the preferred embodiments of the attached drawings.

Please refer to Figures 2, 3, 4a, 4b, and 4c, which are three-dimensional exploded and assembled cross-sectional and top views of the first embodiment of the composite heat dissipation structure of this invention. As shown in the figures, the composite heat dissipation structure of this invention is It includes: a uniform temperature plate 3 and at least one heat pipe 4; the uniform temperature plate 3 is composed of an upper plate body 31 and a lower plate body 32 covering each other, and is jointly defined by the upper and lower plate bodies 31 and 32. An airtight chamber 33 is filled with a working liquid (not shown in the figure). The inner side of the vapor chamber 3 is respectively provided with a first wall on both sides of the upper and lower sides of the airtight chamber 33. A capillary structure 311 and a second capillary structure 321. The upper plate body is provided with at least one through hole 312 penetrating the upper plate body 31, and the outer peripheral edge of each through hole 312 is outward and upward (outer). A protruding flange 313 is formed, and the first capillary structure 311 is disposed adjacent to the through hole 312 .

The through hole 312 allows the airtight chamber 33 to communicate with the outside of the temperature equalizing plate 3 , and the through hole 312 is mainly used for inserting the heat pipe 4 so that the heat pipe 4 is combined with the equalizing plate 3 It is used that the inner surface of the lower plate body 32 of the vapor chamber 3 is the evaporation area of the vapor chamber 3 and is provided with the aforementioned second capillary structure 321 and the plurality of rings 6 .

The ring body 6 is a porous structure that can provide capillary force for the reflux of the working fluid. The ring body 6 has an upper end face 61 and a lower end face 62 and an axial hole 63 . The axial hole 63 extends along the ring body 6 The axial opening forms a hollow structure, and penetrates (through) the upper and lower end surfaces 61 and 62 of the two ends of the ring body 6. The upper and lower end surfaces 61 and 62 of the ring body 6 are respectively connected to the first and second capillary structures. 311, 321.

Referring to Figure 4a, when a single ring body 6 is used to correspond to the through hole 312, the shaft hole 63 of the ring body 6 and the through hole 312 can be concentric or eccentric, and the shaft hole 63 of the ring body 6 Its aperture is equal to or smaller than the aperture of the through hole 312, and the peripheral diameter of the ring body 6 is larger than the aperture of the through hole 312, so that the upper end surface 61 of the ring body 6 extends outward from the edge of the shaft hole 63 to the through hole 312. The intersecting parts or areas can be used to provide support for the heat pipe 4 .

Referring to Figure 4b, when two or more ring bodies 6 are used to correspond to the through holes 312, the ring bodies 6 can be adjacent to each other or the outer edges of the ring bodies 6 can be tangent to each other (as shown in Figure 4c (as shown), the upper end surface 61 of the ring body 6 intersects with the through hole 312 at a position or area that can be used to support the heat pipe 4 .

The two ends of the heat pipe 4 have a closed end 41 and an open end 42 respectively. The heat pipe 4 has a heat pipe chamber 43 inside, and a third capillary structure 44 is provided on the wall of the heat pipe chamber 43. The heat pipe 4 passes through the opening end 42 correspondingly through the through hole 312 of the temperature equalizing plate 3 and extends into the airtight chamber 33 of the equalizing plate 3 to be combined with the equalizing plate 3 and assembled. The heat pipe chamber 43 and the airtight chamber 33 are connected.

The open end 42 of the heat pipe 4 is in contact with one side (upper side) of the first capillary structure 311 in the airtight chamber 33 of the vapor chamber 3, and the other side (lower side) of the first capillary structure 311 is It is connected to the upper end surface 61 of the ring body 6, so after the open end 42 of the heat pipe 4 extends into the airtight chamber 33, the axial direction of the heat pipe 4 is supported by the upper end surface 61 of the ring body 6, so that The open end 42 of the heat pipe 4 forms an axial interference, forcing the heat pipe 4 to axially No longer going deep into the airtight chamber 33 of the vapor chamber 3 , the ring body 6 provides axial support, fixation and support for the heat pipe 4 , increasing the combination of the heat pipe 4 and the vapor chamber 3 structural strength.

The working liquid evaporated in the airtight chamber 33 of the vapor chamber 3 can directly diffuse toward the heat pipe chamber 43 of the heat pipe 4 for remote heat dissipation, because the ring body 6 is arranged corresponding to the open end 42 of the heat pipe 4 , the working liquid condensed in the heat pipe chamber 43 can directly and quickly flow back through the second capillary structure 321 provided in the evaporation area through the guidance of the ring 6, greatly reducing the return path and time, and allowing the two-phase flow heat exchange The work cycle is sustainable and stable, preventing dry burning.

The above-mentioned first, second, and third capillary structures 311, 321, and 44 are any one of sintered powder, woven mesh, grid body, and fiber body, and the above-mentioned first, second, and third capillary structures 311, 321, and 44 can be the same. Or capillary structures with different properties.

Please refer to Figure 5, which is an assembled cross-sectional view of the second embodiment of the composite heat dissipation structure of the present invention. As shown in the figure, some technical features of this embodiment are the same as those of the first embodiment, so they will not be described again here. However, the difference between this embodiment and the first embodiment is that a plurality of support pillars 322 are protruded or provided at the bottom surface 321 of the surface of the plate body 32 under the temperature equalizing plate 3, and these support pillars 322 The ring bodies 6 of this embodiment are disposed offset from the through holes 312 , and are sleeved on the outside of the support columns 322 . At the same time, the ring bodies 6 are still arranged to intersect with the through holes 321 .

The establishment of the ring body 6 can not only control the axial depth limit of the heat pipe 4 inserted from the outside of the vapor chamber 3 into the internal airtight chamber 33 of the vapor chamber 3, but also provide axial support and positioning of the heat pipe 4. The structural strength of the combination between the heat pipe 4 and the vapor chamber 3 is increased.

Furthermore, this creation uses the ring body 6 to connect the first, second, and third capillary structures 311, 321, and 44 inside the heat pipe 4 and the vapor chamber 3 in series, which are used for water storage and return. The working liquid reflux path, reflux time and reflux speed condense the working liquid condensed in the heat pipe chamber 43 The backflow can then be quickly transferred through the ring 6 to the second capillary structure 321 located in the evaporation area, so that the two-phase flow heat conduction between the heat pipe 4 and the vapor chamber 3 can continue uninterrupted, and the vapor chamber can also be prevented. Dry burning occurs in the evaporation area, thereby improving the heat exchange efficiency.

3: Uniform temperature plate

31: Upper plate body

312:Through hole

313:Flange

32:Lower plate body

321: Second capillary structure

4:Heat pipe

41: closed end

42:Open end

6: Ring body

61: Upper end surface

62: Lower end face

63: Shaft hole

Claims (9)

A composite heat dissipation structure includes: a uniform temperature plate with an upper plate body and a lower plate body. The upper and lower plate bodies are correspondingly covered and jointly define an airtight chamber filled with working liquid. A first capillary structure and a second capillary structure are respectively provided on the inner surface of the plate body relative to the airtight chamber. At least one through hole penetrates the upper plate body and is connected with the airtight chamber; at least one heat pipe, inside There is a heat pipe chamber connected with the aforementioned airtight chamber. Both ends of the heat pipe have a closed end and an open end respectively. The heat pipe penetrates the through hole correspondingly through the open end and enters the vapor chamber. The airtight chamber is connected to the first capillary structure; at least one ring body is provided in the airtight chamber and corresponding to the through hole, and the two ends of the ring body are connected to the first and second capillary structures respectively. Structural connection, through the arrangement of the ring body, can provide axial support and positioning and support for the open end of the heat pipe to be inserted into the airtight chamber, strengthen the overall structural strength, and can directly and quickly remove the condensed and refluxed working liquid in the heat pipe. Guided to the second capillary structure, the reflux path, reflux time and reflux speed are greatly shortened, and the efficiency of the overall vapor-liquid circulation is improved. In the composite heat dissipation structure described in Item 1 of the patent application, a flange is formed at the periphery of each through hole of the vapor chamber and extends outward and upward. In the composite heat dissipation structure described in item 1 of the patent application, the inner wall surface of the heat pipe chamber has a third capillary structure. The composite heat dissipation structure as described in item 3 of the patent application, wherein the first, second, and third capillary structures are any one of sintered powder, woven mesh, grid body, and fiber body, and the first, second, and second capillary structures are The three capillary structures may be of the same or different nature. For example, in the composite heat dissipation structure described in item 1 of the patent application, a support pillar protrudes from the lower plate body, and the sintered body can optionally be sleeved on the outside of the support pillar. For example, in the composite heat dissipation structure described in item 1 of the patent application, the ring body has an upper end face, a lower end face and an axial hole, and the axial hole penetrates and connects the upper and lower sides of the ring body along the axial direction of the ring body. The end face forms a hollow structure. For example, in the composite heat dissipation structure described in item 6 of the patent application, the ring body is arranged corresponding to the through hole, the ring body and the through hole are arranged concentrically or eccentrically, and the diameter of the shaft hole of the ring body is smaller than that of the through hole. The diameter of the hole, and the peripheral diameter of the ring body is larger than the diameter of the through hole. For example, in the composite heat dissipation structure described in Item 6 of the patent application, when a plurality of ring bodies are arranged corresponding to the through hole, the outer edges of the rings are adjacent to or tangent to each other, and the upper edges of each of the ring bodies are The end surfaces are arranged correspondingly to intersect with the through holes. For the composite heat dissipation structure described in Item 1, 6, 7 or 8 of the patent application, the ring system is a porous structure.

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