TWM647399U - Electronic device - Google Patents
Electronic device Download PDFInfo
- Publication number
- TWM647399U TWM647399U TW112202744U TW112202744U TWM647399U TW M647399 U TWM647399 U TW M647399U TW 112202744 U TW112202744 U TW 112202744U TW 112202744 U TW112202744 U TW 112202744U TW M647399 U TWM647399 U TW M647399U
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic device
- bottom cover
- airbag
- air pump
- internal space
- Prior art date
Links
- 230000006835 compression Effects 0.000 claims description 4
- 238000007906 compression Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 9
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Abstract
Description
本新型是有關於一種電子裝置,特別是有關於一種具有活動式底蓋的電子裝置。 The present invention relates to an electronic device, in particular to an electronic device with a movable bottom cover.
近年來筆記型電腦的外型一直朝著輕薄短小的趨勢發展,然而薄型的機種因厚度空間受到極端的壓縮,因此其散熱機構的設計已遭遇極大的挑戰。 In recent years, the appearance of notebook computers has been trending toward thinner, lighter and shorter designs. However, thin models are subject to extreme compression due to their thickness, so the design of their heat dissipation mechanisms has encountered great challenges.
有鑒於此,如何提供一種體積小且可具有高散熱效能的電子裝置,始成為此技術領域研發人員之一重要挑戰。 In view of this, how to provide an electronic device that is small in size and has high heat dissipation efficiency has become an important challenge for researchers in this technical field.
有鑑於前述習知問題點,本新型之一實施例提供一種電子裝置,包括一本體、一氣囊以及一空氣幫浦。前述本體具有一上殼體、一下殼體以及一底蓋,其中前述上殼體與前述下殼體彼此固定以形成一內部空間,且前述底蓋活動地連接前述下殼體。前述氣囊設置於前述內部空間,前述空氣幫浦設置於前述內部空間,並且連接前述氣囊,其中當前述空氣幫浦對前述氣囊充氣時,前述氣囊膨脹並將前述底蓋由一第一位置相對於前述下殼體沉降到一第二位置。 In view of the aforementioned conventional problems, one embodiment of the present invention provides an electronic device, which includes a body, an air bag and an air pump. The aforementioned body has an upper shell, a lower shell and a bottom cover, wherein the upper shell and the lower shell are fixed to each other to form an internal space, and the bottom cover is movably connected to the lower shell. The airbag is disposed in the internal space, and the air pump is disposed in the internal space and connected to the airbag. When the air pump inflates the airbag, the airbag expands and moves the bottom cover from a first position relative to the airbag. The aforementioned lower shell sinks to a second position.
於一實施例中,前述下殼體形成有一凸柱,且前述底蓋形成有一穿孔,其中前述凸柱穿過前述穿孔。 In one embodiment, the lower housing is formed with a protruding post, and the bottom cover is formed with a through hole, wherein the protruding post passes through the through hole.
於一實施例中,前述電子裝置更包括一彈性元件,夾設於前述下殼體以及前述底蓋之間。 In one embodiment, the electronic device further includes an elastic element sandwiched between the lower case and the bottom cover.
於一實施例中,前述彈性元件為一壓縮彈簧。 In one embodiment, the elastic element is a compression spring.
於一實施例中,前述底蓋具有一容置結構以及一邊框,且前述邊框圍繞前述容置結構。 In one embodiment, the bottom cover has a receiving structure and a frame, and the frame surrounds the receiving structure.
於一實施例中,前述穿孔形成於前述邊框上。 In one embodiment, the perforation is formed on the frame.
於一實施例中,前述凸柱具有一香菇狀結構。 In one embodiment, the protruding pillar has a mushroom-shaped structure.
於一實施例中,前述電子裝置更包括一風扇,設置於前述內部空間,用以將前述本體外部的空氣吸入前述本體內。 In one embodiment, the electronic device further includes a fan disposed in the internal space for sucking air from outside the body into the body.
於一實施例中,前述電子裝置更包括一顯示單元,且前述顯示單元樞接前述本體。 In one embodiment, the electronic device further includes a display unit, and the display unit is pivotally connected to the body.
於一實施例中,前述電子裝置更包括一腳墊,凸出於前述下殼體之一底側。 In one embodiment, the electronic device further includes a foot pad protruding from a bottom side of the lower housing.
100:電子裝置 100: Electronic devices
10:本體 10:Ontology
101:內部空間 101:Internal space
11:上殼體 11: Upper shell
12:下殼體 12:Lower shell
120:開孔 120:Opening
13:底蓋 13: Bottom cover
130:容置結構 130: Containment structure
131:邊框 131:Border
14:腳墊 14: Foot pads
20:顯示單元 20:Display unit
21:顯示螢幕 21:Display screen
30:樞軸 30:Pivot
40:氣囊 40:Air bag
50:空氣幫浦 50:Air pump
B1:電路板 B1: Circuit board
B2:電路板 B2: Circuit board
B3:電路板 B3: Circuit board
C:管路 C:Pipeline
F:風扇 F:Fan
h:穿孔 h: perforation
K:輸入鍵盤 K: input keyboard
P:凸柱 P:Protruding pillar
S:彈性元件 S: elastic element
T:觸控板 T: Touchpad
第1圖表示本新型一實施例之電子裝置100的立體圖。
Figure 1 shows a perspective view of an
第2圖表示第1圖所示之電子裝置100的本體10之爆炸圖。
FIG. 2 shows an exploded view of the
第3圖表示第2圖所示之本體10於組合後的立體圖。
Figure 3 shows an assembled perspective view of the
第4圖表示第3圖所示之本體10的仰視圖。
Figure 4 shows a bottom view of the
第5圖表示下殼體12、底蓋13和彈性元件S於組合前的爆炸圖。
Figure 5 shows an exploded view of the
第6圖表示凸柱P穿過底蓋13上之穿孔h的立體圖。
FIG. 6 shows a perspective view of the protruding pillar P passing through the hole h on the
第7圖表示下殼體12、底蓋13和彈性元件S於組合後的局部放大示意圖。
Figure 7 shows a partially enlarged schematic view of the
第8圖表示氣流從下殼體12的左、右兩側進風,並且由下殼體12的頂側出風之示意圖。
FIG. 8 shows a schematic diagram in which the airflow enters from the left and right sides of the
第9圖表示電子裝置100之本體10的局部剖視圖。
FIG. 9 shows a partial cross-sectional view of the
第10圖表示第9圖中之本體10的局部放大圖。
Figure 10 shows a partial enlarged view of the
第11圖表示當底蓋13從第9、10圖所示之第一高度相對於下殼體12沉降到一第二高度的示意圖。
FIG. 11 shows a schematic diagram when the
第12圖表示第11圖中之本體10的局部放大圖。
Figure 12 shows a partial enlarged view of the
以下說明本新型實施例之電子裝置。然而,可輕易了解本新型實施例提供許多合適的新型概念而可實施於廣泛的各種特定背景。所揭示的特定實施例僅僅用於說明以特定方法使用本新型,並非用以侷限本新型的範圍。 The following describes the electronic device of the novel embodiment. However, it can be readily appreciated that the novel embodiments provide many suitable novel concepts that can be embodied in a wide variety of specific contexts. The specific embodiments disclosed are merely illustrative of specific methods of using the invention and are not intended to limit the scope of the invention.
除非另外定義,在此使用的全部用語(包括技術及科學用語)具有與此篇揭露所屬之一般技藝者所通常理解的相同涵義。能理解的是這些用語,例如在通常使用的字典中定義的用語,應被解讀成具有一與相關技術及本揭露的背景或上下文一致的意思,而不應以一理想化或過度正式的方式解讀,除非在此特別定義。 Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It is understood that these terms, such as terms defined in commonly used dictionaries, should be interpreted to have a meaning consistent with the relevant technology and the background or context of the present disclosure, and should not be interpreted in an idealized or overly formal manner. Interpretation, unless specifically defined herein.
有關本新型之前述及其他技術內容、特點與功效,在以下配合參考圖式之一較佳實施例的詳細說明中,將可清楚的呈現。以下各實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加 圖式的方向。因此,實施方式中所使用的方向用語是用來說明並非用來限制本新型。 The previously mentioned technical contents, features and functions of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. The direction terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only for reference. The direction of the schema. Therefore, the directional terms used in the embodiments are used to illustrate but not to limit the present invention.
首先請一併參閱第1、2圖,其中第1圖表示本新型一實施例之電子裝置100的立體圖,第2圖表示第1圖所示之電子裝置100的本體10之爆炸圖。
First, please refer to Figures 1 and 2 together. Figure 1 shows a perspective view of an
如第1、2圖所示,本新型一實施例之電子裝置100例如為一筆記型電腦,其主要包括可相互轉動之本體10以及顯示單元20。在本實施例中,前述本體10以及顯示單元20係透過樞軸30相互連接。
As shown in FIGS. 1 and 2 , the
舉例而言,前述顯示單元20具有一顯示螢幕21,其中前述顯示螢幕21可以是LCD、OLED或觸控螢幕,但不以本新型實施例所揭露者為限。
For example, the
另一方面,在前述本體10的正面設有一輸入鍵盤K(例如QWERTY鍵盤)以及一觸控板T,以方便使用者操作此電子裝置100。應了解的是,前述輸入鍵盤K及/或觸控板T可作為一使用者輸入介面(user input interface),當使用者欲開啟並操作電子裝置100時,可先將顯示單元20相對於本體10掀開,然後再利用輸入鍵盤K或者觸控板T輸入指令或控制顯示螢幕21上的游標。
On the other hand, an input keyboard K (such as a QWERTY keyboard) and a touch panel T are provided on the front of the
此外,從第1、2圖中可以看出,前述本體10含有一上殼體11、一下殼體12以及一底蓋13,其中上殼體11與下殼體12彼此固定,輸入鍵盤K以及觸控板T設置在上殼體11之頂面,底蓋13則是活動地連接下殼體12,並可相對於下殼體12沿Z軸方向上升或下降。
In addition, as can be seen from Figures 1 and 2, the
另一方面,在上殼體11與下殼體12之間另設有氣囊40、風扇F、空氣幫浦50、管路C以及電路板B1、B2、B3,其中前述空氣幫浦50透
過管路C連接氣囊40。於一實施例中,前述電路板B1位在兩個風扇F之間,前述電路板B2、B3則分別鄰近於下殼體12的邊緣。
On the other hand, an
應了解的是,在本實施例的本體10內部可另設有中央處理器、主機板、記憶體以及電源模組等電子元件,惟為方便理解本新型之技術特徵,前述元件係省略於圖式中,合先敘明。
It should be understood that the
接著請一併參閱第3、4、5、6、7圖,其中第3圖表示第2圖所示之本體10於組合後的立體圖,第4圖表示第3圖所示之本體10的仰視圖,第5圖表示下殼體12、底蓋13和彈性元件S於組合前的爆炸圖,第6圖表示凸柱P穿過底蓋13上之穿孔h的立體圖,第7圖表示下殼體12、底蓋13和彈性元件S於組合後的局部放大示意圖。
Next, please refer to Figures 3, 4, 5, 6, and 7 together. Figure 3 shows a perspective view of the
如第3、4圖所示,在本實施例之下殼體12底側形成有兩個長條形的腳墊14,且前述底蓋13係位在兩個腳墊14之間。另一方面,從第5、6、7圖中可以看出在下殼體12上形成有複數個具有香菇狀結構之凸柱P,組裝時可使前述凸柱P依序穿過彈性元件S以及底蓋13上對應之穿孔h,並使彈性元件S夾設在下殼體12以及底蓋13之間(第7圖)。
As shown in Figures 3 and 4, in this embodiment, two
具體而言,前述底蓋13係由一矩形之容置結構130以及一矩形之邊框131所組成,其中前述容置結構130穿過下殼體12中央之開孔120(第5、7圖),前述邊框131圍繞前述容置結構130,且前述穿孔h係形成於邊框131上。
Specifically, the
再請參閱第8圖,其中第8圖表示氣流從下殼體12的左、右兩側進風,並且由下殼體12的頂側出風之示意圖。
Please refer to Figure 8 again. Figure 8 shows a schematic diagram in which the airflow enters from the left and right sides of the
如第8圖中箭頭方向所示,當電子裝置100之本體10於組裝完成後,可透過電路板B1兩側的風扇F將外部空氣經由下殼體12的左、右兩
側吸入本體10內,然後再將本體10內部的空氣由下殼體12的頂側排出,藉以達到對本體10內部電子元件散熱降溫之目的。
As shown in the direction of the arrow in Figure 8, after the
於一實施例中,前述風扇F也可以將外部空氣經由下殼體12的頂側吸入本體10內,然後再將本體10內部的空氣由下殼體12的左、右兩側排出,其同樣可達到對本體10內部電子元件散熱降溫之目的,而並不以本新型實施例所揭露者為限。
In one embodiment, the aforementioned fan F can also suck outside air into the
接著請一併參閱第9、10圖,其中第9圖表示電子裝置100之本體10的局部剖視圖,第10圖表示第9圖中之本體10的局部放大圖。
Next, please refer to Figures 9 and 10 together. Figure 9 shows a partial cross-sectional view of the
從第9、10圖中可以看出,當例如電子裝置100處於關機狀態時或不需強化散熱效能時,本體10內部的空氣幫浦50尚未或無須對氣囊40充氣,此時位在電子裝置100之本體10下方的底蓋13相對於下殼體12位在第一高度,而腳墊14則是凸出於底蓋13和下殼體12之底側,用以接觸桌面。
As can be seen from Figures 9 and 10, for example, when the
需特別說明的是,由於在下殼體12以及底蓋13之間設有彈性元件S(例如壓縮彈簧),因此可透過前述彈性元件S產生一彈力,使底蓋13能夠相對下殼體12維持在前述第一高度(如第9、10圖所示)。
It should be noted that since an elastic element S (such as a compression spring) is provided between the
再請一併參閱第11、12圖,其中第11圖表示當底蓋13從第9、10圖所示之第一高度相對於下殼體12沉降到一第二高度的示意圖,第12圖表示第11圖中之本體10的局部放大圖。
Please refer to Figures 11 and 12 together. Figure 11 shows a schematic diagram when the
從第11、12圖中可以看出,當電子裝置100處於開機狀態或因溫度過高而需要強化散熱效能時,則可啟動本體10內部之空氣幫浦50,其中空氣幫浦50可透過管路C對氣囊40充氣,此時氣囊40即會膨脹並朝下方推動底蓋13,使得底蓋13可從第9、10圖所示之第一高度相對於下殼體12沿-Z軸方向沉降到一第二高度(如第11、12圖所示)。
As can be seen from Figures 11 and 12, when the
在此狀態下,底蓋13的容置結構130會朝-Z軸方向凸出於下殼體12的底側,並使本體10的內部空間101(形成於上殼體11與下殼體12之間)增加,從而能夠有助於提升風扇F的進氣量,並可大幅提升電子裝置100的散熱效能。
In this state, the
需特別說明的是,當底蓋13從第9、10圖所示之第一高度相對於下殼體12沿-Z軸方向沉降到第二高度時(如第11、12圖所示),位在下殼體12以及底蓋13之間的彈性元件S會受到進一步壓縮。
It should be noted that when the
另一方面,在電子裝置100由前述第二高度(例如開機狀態下)切換回復到第一高度(例如關機狀態下)的過程中,則可透過空氣幫浦50和管路C對對氣囊40洩氣,同時可利用彈性元件S本身所產生的彈力朝上方推動底蓋13,從而使底蓋13自動回復到如第9、10圖所示之第一高度,以大幅縮減本體10的體積,並可方便使用者收納電子裝置100。
On the other hand, during the process of the
綜上所述,本新型提供一種電子裝置100,其中當前述電子裝置100處於關機模式時,底蓋13相對下殼體12位在第一高度,而當電子裝置100切換到開機狀態或需強化散熱效能時,則可啟動本體10內部之空氣幫浦50,藉以對氣囊40充氣,此時氣囊40會膨脹並朝下方推動底蓋13,使得底蓋13從第9、10圖所示之第一高度相對於下殼體12沿-Z軸方向沉降到第二高度(如第11、12圖所示),以大幅提升電子裝置100的散熱效能。
To sum up, the present invention provides an
此外,本新型在切換的過程中,使用者不需改變使用鍵盤的習慣,且不會有切換時電子裝置100起伏的不適感。
In addition, during the switching process of the present invention, the user does not need to change the habit of using the keyboard, and there is no discomfort caused by the ups and downs of the
雖然本新型的實施例及其優點已揭露如上,但應該瞭解的是,任何所屬技術領域中具有通常知識者,在不脫離本新型之精神和範圍內,當可作更動、替代與潤飾。此外,本新型之保護範圍並未侷限於說明書內所述特定實施例中的製程、機器、製造、物質組成、裝置、方法及步 驟,任何所屬技術領域中具有通常知識者可從本新型揭示內容中理解現行或未來所發展出的製程、機器、製造、物質組成、裝置、方法及步驟,只要可以在此處所述實施例中實施大抵相同功能或獲得大抵相同結果皆可根據本新型使用。因此,本新型之保護範圍包括上述製程、機器、製造、物質組成、裝置、方法及步驟。另外,每一申請專利範圍構成個別的實施例,且本新型之保護範圍也包括各個申請專利範圍及實施例的組合。 Although the embodiments and advantages of the present invention have been disclosed above, it should be understood that any modification, substitution and modification can be made by anyone with ordinary skill in the art without departing from the spirit and scope of the present invention. In addition, the scope of protection of the present invention is not limited to the processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any person with ordinary skill in the art can understand from the disclosure of this invention the processes, machines, manufacturing, material compositions, devices, methods and steps currently or developed in the future, as long as the embodiments described herein can be Implementing substantially the same functions or obtaining substantially the same results can be used according to the present invention. Therefore, the scope of protection of the present invention includes the above-mentioned processes, machines, manufacturing, material compositions, devices, methods and steps. In addition, each patent application scope constitutes an individual embodiment, and the protection scope of the present invention also includes the combination of each patent application scope and embodiments.
雖然本新型已以較佳實施例揭露於上,然其並非用以限定本新型,任何熟習此項工藝者,在不脫離本新型之精神和範圍內,當可作些許之更動與潤飾,因此本新型之保護範圍當視後附之申請專利範圍所界定者為準。 Although the preferred embodiments of the present invention have been disclosed above, they are not intended to limit the present invention. Anyone familiar with this technology can make some modifications and modifications without departing from the spirit and scope of the present invention. Therefore, The scope of protection of the present invention shall be determined by the appended patent application scope.
10:本體 10:Ontology
101:內部空間 101:Internal space
11:上殼體 11: Upper shell
12:下殼體 12:Lower shell
13:底蓋 13: Bottom cover
130:容置結構 130: Containment structure
131:邊框 131:Border
14:腳墊 14: Foot pads
40:氣囊 40:Air bag
50:空氣幫浦 50:Air pump
B1:電路板 B1: Circuit board
C:管路 C:Pipeline
F:風扇 F:Fan
P:凸柱 P:Protruding pillar
S:彈性元件 S: elastic element
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW112202744U TWM647399U (en) | 2023-03-25 | 2023-03-25 | Electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW112202744U TWM647399U (en) | 2023-03-25 | 2023-03-25 | Electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM647399U true TWM647399U (en) | 2023-10-21 |
Family
ID=89857050
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW112202744U TWM647399U (en) | 2023-03-25 | 2023-03-25 | Electronic device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM647399U (en) |
-
2023
- 2023-03-25 TW TW112202744U patent/TWM647399U/en unknown
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8542486B2 (en) | Electronic apparatus with improved heat dissipation | |
TWI385505B (en) | Portable electronic device | |
US9104374B2 (en) | Electronic device | |
US8248780B2 (en) | All-in-one computer | |
US20110254786A1 (en) | Movable touch module and electronic device using the same | |
TWI469716B (en) | Electronic device | |
TWI708029B (en) | Lifting mechanisms and electronic device housing | |
TW201032700A (en) | Portable electronic device | |
KR101175507B1 (en) | Movable touch module and electronic device using the same | |
US20140133095A1 (en) | Electronic device | |
TWI771947B (en) | Touch pad module and computer using the same | |
WO2021237850A1 (en) | Foldable display apparatus | |
US7447003B2 (en) | Electronic device with a moveable case | |
TWM604418U (en) | Foldable electronic device | |
TW202246956A (en) | Touch pad module and computer using the same | |
TWM647399U (en) | Electronic device | |
TWM281224U (en) | Waterproof and dust-proof input apparatus for notebook computer | |
TWM615481U (en) | Portable electronic device | |
TW201628036A (en) | Keyboard module and notebook computer with keyboard module | |
US20230146797A1 (en) | Portable electronic device | |
TWI821927B (en) | Portable electronic device | |
TW202024872A (en) | Touch pad module and computer using the same | |
TWI804317B (en) | Electronic device | |
TW201737015A (en) | A portable electronic device | |
TW200846890A (en) | Heat radiator and electronic apparatus |