TWM647399U - Electronic device - Google Patents

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Publication number
TWM647399U
TWM647399U TW112202744U TW112202744U TWM647399U TW M647399 U TWM647399 U TW M647399U TW 112202744 U TW112202744 U TW 112202744U TW 112202744 U TW112202744 U TW 112202744U TW M647399 U TWM647399 U TW M647399U
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TW
Taiwan
Prior art keywords
electronic device
bottom cover
airbag
air pump
internal space
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TW112202744U
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Chinese (zh)
Inventor
林世偉
黃瑞賢
林秉厚
劉紹白
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廣達電腦股份有限公司
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Application filed by 廣達電腦股份有限公司 filed Critical 廣達電腦股份有限公司
Priority to TW112202744U priority Critical patent/TWM647399U/en
Publication of TWM647399U publication Critical patent/TWM647399U/en

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Abstract

An electronic device is provided, including a main body, an airbag, and an air pump communicated with the airbag. The main body has an upper housing, a lower housing affixed to the upper housing for defining an interior area, and a bottom cover movably connected to the lower housing. The airbag and the air pump are disposed in the interior area. When the airbag is inflated by the air pump, the airbag expands and forces the bottom cover to descend relative to the lower housing.

Description

電子裝置 electronic device

本新型是有關於一種電子裝置,特別是有關於一種具有活動式底蓋的電子裝置。 The present invention relates to an electronic device, in particular to an electronic device with a movable bottom cover.

近年來筆記型電腦的外型一直朝著輕薄短小的趨勢發展,然而薄型的機種因厚度空間受到極端的壓縮,因此其散熱機構的設計已遭遇極大的挑戰。 In recent years, the appearance of notebook computers has been trending toward thinner, lighter and shorter designs. However, thin models are subject to extreme compression due to their thickness, so the design of their heat dissipation mechanisms has encountered great challenges.

有鑒於此,如何提供一種體積小且可具有高散熱效能的電子裝置,始成為此技術領域研發人員之一重要挑戰。 In view of this, how to provide an electronic device that is small in size and has high heat dissipation efficiency has become an important challenge for researchers in this technical field.

有鑑於前述習知問題點,本新型之一實施例提供一種電子裝置,包括一本體、一氣囊以及一空氣幫浦。前述本體具有一上殼體、一下殼體以及一底蓋,其中前述上殼體與前述下殼體彼此固定以形成一內部空間,且前述底蓋活動地連接前述下殼體。前述氣囊設置於前述內部空間,前述空氣幫浦設置於前述內部空間,並且連接前述氣囊,其中當前述空氣幫浦對前述氣囊充氣時,前述氣囊膨脹並將前述底蓋由一第一位置相對於前述下殼體沉降到一第二位置。 In view of the aforementioned conventional problems, one embodiment of the present invention provides an electronic device, which includes a body, an air bag and an air pump. The aforementioned body has an upper shell, a lower shell and a bottom cover, wherein the upper shell and the lower shell are fixed to each other to form an internal space, and the bottom cover is movably connected to the lower shell. The airbag is disposed in the internal space, and the air pump is disposed in the internal space and connected to the airbag. When the air pump inflates the airbag, the airbag expands and moves the bottom cover from a first position relative to the airbag. The aforementioned lower shell sinks to a second position.

於一實施例中,前述下殼體形成有一凸柱,且前述底蓋形成有一穿孔,其中前述凸柱穿過前述穿孔。 In one embodiment, the lower housing is formed with a protruding post, and the bottom cover is formed with a through hole, wherein the protruding post passes through the through hole.

於一實施例中,前述電子裝置更包括一彈性元件,夾設於前述下殼體以及前述底蓋之間。 In one embodiment, the electronic device further includes an elastic element sandwiched between the lower case and the bottom cover.

於一實施例中,前述彈性元件為一壓縮彈簧。 In one embodiment, the elastic element is a compression spring.

於一實施例中,前述底蓋具有一容置結構以及一邊框,且前述邊框圍繞前述容置結構。 In one embodiment, the bottom cover has a receiving structure and a frame, and the frame surrounds the receiving structure.

於一實施例中,前述穿孔形成於前述邊框上。 In one embodiment, the perforation is formed on the frame.

於一實施例中,前述凸柱具有一香菇狀結構。 In one embodiment, the protruding pillar has a mushroom-shaped structure.

於一實施例中,前述電子裝置更包括一風扇,設置於前述內部空間,用以將前述本體外部的空氣吸入前述本體內。 In one embodiment, the electronic device further includes a fan disposed in the internal space for sucking air from outside the body into the body.

於一實施例中,前述電子裝置更包括一顯示單元,且前述顯示單元樞接前述本體。 In one embodiment, the electronic device further includes a display unit, and the display unit is pivotally connected to the body.

於一實施例中,前述電子裝置更包括一腳墊,凸出於前述下殼體之一底側。 In one embodiment, the electronic device further includes a foot pad protruding from a bottom side of the lower housing.

100:電子裝置 100: Electronic devices

10:本體 10:Ontology

101:內部空間 101:Internal space

11:上殼體 11: Upper shell

12:下殼體 12:Lower shell

120:開孔 120:Opening

13:底蓋 13: Bottom cover

130:容置結構 130: Containment structure

131:邊框 131:Border

14:腳墊 14: Foot pads

20:顯示單元 20:Display unit

21:顯示螢幕 21:Display screen

30:樞軸 30:Pivot

40:氣囊 40:Air bag

50:空氣幫浦 50:Air pump

B1:電路板 B1: Circuit board

B2:電路板 B2: Circuit board

B3:電路板 B3: Circuit board

C:管路 C:Pipeline

F:風扇 F:Fan

h:穿孔 h: perforation

K:輸入鍵盤 K: input keyboard

P:凸柱 P:Protruding pillar

S:彈性元件 S: elastic element

T:觸控板 T: Touchpad

第1圖表示本新型一實施例之電子裝置100的立體圖。 Figure 1 shows a perspective view of an electronic device 100 according to an embodiment of the present invention.

第2圖表示第1圖所示之電子裝置100的本體10之爆炸圖。 FIG. 2 shows an exploded view of the main body 10 of the electronic device 100 shown in FIG. 1 .

第3圖表示第2圖所示之本體10於組合後的立體圖。 Figure 3 shows an assembled perspective view of the main body 10 shown in Figure 2 .

第4圖表示第3圖所示之本體10的仰視圖。 Figure 4 shows a bottom view of the body 10 shown in Figure 3 .

第5圖表示下殼體12、底蓋13和彈性元件S於組合前的爆炸圖。 Figure 5 shows an exploded view of the lower case 12, the bottom cover 13 and the elastic element S before assembly.

第6圖表示凸柱P穿過底蓋13上之穿孔h的立體圖。 FIG. 6 shows a perspective view of the protruding pillar P passing through the hole h on the bottom cover 13 .

第7圖表示下殼體12、底蓋13和彈性元件S於組合後的局部放大示意圖。 Figure 7 shows a partially enlarged schematic view of the lower case 12, the bottom cover 13 and the elastic element S after assembly.

第8圖表示氣流從下殼體12的左、右兩側進風,並且由下殼體12的頂側出風之示意圖。 FIG. 8 shows a schematic diagram in which the airflow enters from the left and right sides of the lower casing 12 and exits from the top side of the lower casing 12 .

第9圖表示電子裝置100之本體10的局部剖視圖。 FIG. 9 shows a partial cross-sectional view of the main body 10 of the electronic device 100 .

第10圖表示第9圖中之本體10的局部放大圖。 Figure 10 shows a partial enlarged view of the main body 10 in Figure 9 .

第11圖表示當底蓋13從第9、10圖所示之第一高度相對於下殼體12沉降到一第二高度的示意圖。 FIG. 11 shows a schematic diagram when the bottom cover 13 sinks from the first height shown in FIGS. 9 and 10 to a second height relative to the lower case 12 .

第12圖表示第11圖中之本體10的局部放大圖。 Figure 12 shows a partial enlarged view of the main body 10 in Figure 11 .

以下說明本新型實施例之電子裝置。然而,可輕易了解本新型實施例提供許多合適的新型概念而可實施於廣泛的各種特定背景。所揭示的特定實施例僅僅用於說明以特定方法使用本新型,並非用以侷限本新型的範圍。 The following describes the electronic device of the novel embodiment. However, it can be readily appreciated that the novel embodiments provide many suitable novel concepts that can be embodied in a wide variety of specific contexts. The specific embodiments disclosed are merely illustrative of specific methods of using the invention and are not intended to limit the scope of the invention.

除非另外定義,在此使用的全部用語(包括技術及科學用語)具有與此篇揭露所屬之一般技藝者所通常理解的相同涵義。能理解的是這些用語,例如在通常使用的字典中定義的用語,應被解讀成具有一與相關技術及本揭露的背景或上下文一致的意思,而不應以一理想化或過度正式的方式解讀,除非在此特別定義。 Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It is understood that these terms, such as terms defined in commonly used dictionaries, should be interpreted to have a meaning consistent with the relevant technology and the background or context of the present disclosure, and should not be interpreted in an idealized or overly formal manner. Interpretation, unless specifically defined herein.

有關本新型之前述及其他技術內容、特點與功效,在以下配合參考圖式之一較佳實施例的詳細說明中,將可清楚的呈現。以下各實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加 圖式的方向。因此,實施方式中所使用的方向用語是用來說明並非用來限制本新型。 The previously mentioned technical contents, features and functions of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. The direction terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only for reference. The direction of the schema. Therefore, the directional terms used in the embodiments are used to illustrate but not to limit the present invention.

首先請一併參閱第1、2圖,其中第1圖表示本新型一實施例之電子裝置100的立體圖,第2圖表示第1圖所示之電子裝置100的本體10之爆炸圖。 First, please refer to Figures 1 and 2 together. Figure 1 shows a perspective view of an electronic device 100 according to an embodiment of the present invention, and Figure 2 shows an exploded view of the body 10 of the electronic device 100 shown in Figure 1 .

如第1、2圖所示,本新型一實施例之電子裝置100例如為一筆記型電腦,其主要包括可相互轉動之本體10以及顯示單元20。在本實施例中,前述本體10以及顯示單元20係透過樞軸30相互連接。 As shown in FIGS. 1 and 2 , the electronic device 100 according to an embodiment of the present invention is, for example, a notebook computer, which mainly includes a body 10 and a display unit 20 that can rotate with each other. In this embodiment, the main body 10 and the display unit 20 are connected to each other through the pivot 30 .

舉例而言,前述顯示單元20具有一顯示螢幕21,其中前述顯示螢幕21可以是LCD、OLED或觸控螢幕,但不以本新型實施例所揭露者為限。 For example, the aforementioned display unit 20 has a display screen 21, wherein the aforementioned display screen 21 may be an LCD, an OLED or a touch screen, but is not limited to those disclosed in the embodiment of the present invention.

另一方面,在前述本體10的正面設有一輸入鍵盤K(例如QWERTY鍵盤)以及一觸控板T,以方便使用者操作此電子裝置100。應了解的是,前述輸入鍵盤K及/或觸控板T可作為一使用者輸入介面(user input interface),當使用者欲開啟並操作電子裝置100時,可先將顯示單元20相對於本體10掀開,然後再利用輸入鍵盤K或者觸控板T輸入指令或控制顯示螢幕21上的游標。 On the other hand, an input keyboard K (such as a QWERTY keyboard) and a touch panel T are provided on the front of the main body 10 to facilitate the user to operate the electronic device 100 . It should be understood that the aforementioned input keyboard K and/or touch panel T can be used as a user input interface. When the user wants to open and operate the electronic device 100, he or she can first move the display unit 20 relative to the main body. 10, and then use the input keyboard K or the touchpad T to input commands or control the cursor on the display screen 21.

此外,從第1、2圖中可以看出,前述本體10含有一上殼體11、一下殼體12以及一底蓋13,其中上殼體11與下殼體12彼此固定,輸入鍵盤K以及觸控板T設置在上殼體11之頂面,底蓋13則是活動地連接下殼體12,並可相對於下殼體12沿Z軸方向上升或下降。 In addition, as can be seen from Figures 1 and 2, the aforementioned body 10 includes an upper housing 11, a lower housing 12 and a bottom cover 13. The upper housing 11 and the lower housing 12 are fixed to each other. The input keyboard K and The touch panel T is disposed on the top surface of the upper housing 11 , and the bottom cover 13 is movably connected to the lower housing 12 and can rise or fall in the Z-axis direction relative to the lower housing 12 .

另一方面,在上殼體11與下殼體12之間另設有氣囊40、風扇F、空氣幫浦50、管路C以及電路板B1、B2、B3,其中前述空氣幫浦50透 過管路C連接氣囊40。於一實施例中,前述電路板B1位在兩個風扇F之間,前述電路板B2、B3則分別鄰近於下殼體12的邊緣。 On the other hand, an airbag 40, a fan F, an air pump 50, a pipeline C and circuit boards B1, B2 and B3 are provided between the upper casing 11 and the lower casing 12. The air pump 50 is transparent The air bag 40 is connected through pipeline C. In one embodiment, the circuit board B1 is located between the two fans F, and the circuit boards B2 and B3 are respectively adjacent to the edges of the lower case 12 .

應了解的是,在本實施例的本體10內部可另設有中央處理器、主機板、記憶體以及電源模組等電子元件,惟為方便理解本新型之技術特徵,前述元件係省略於圖式中,合先敘明。 It should be understood that the main body 10 of this embodiment may be further equipped with electronic components such as a central processing unit, a motherboard, a memory, and a power module. However, in order to facilitate understanding of the technical features of the present invention, the aforementioned components are omitted from the drawings. In the formula, the combination is stated first.

接著請一併參閱第3、4、5、6、7圖,其中第3圖表示第2圖所示之本體10於組合後的立體圖,第4圖表示第3圖所示之本體10的仰視圖,第5圖表示下殼體12、底蓋13和彈性元件S於組合前的爆炸圖,第6圖表示凸柱P穿過底蓋13上之穿孔h的立體圖,第7圖表示下殼體12、底蓋13和彈性元件S於組合後的局部放大示意圖。 Next, please refer to Figures 3, 4, 5, 6, and 7 together. Figure 3 shows a perspective view of the main body 10 shown in Figure 2 after assembly, and Figure 4 shows a bottom view of the main body 10 shown in Figure 3. Figure 5 shows an exploded view of the lower case 12, bottom cover 13 and elastic element S before assembly, Figure 6 shows a perspective view of the protruding post P passing through the hole h on the bottom cover 13, Figure 7 shows the lower case A partially enlarged schematic diagram of the assembly of the body 12, the bottom cover 13 and the elastic element S.

如第3、4圖所示,在本實施例之下殼體12底側形成有兩個長條形的腳墊14,且前述底蓋13係位在兩個腳墊14之間。另一方面,從第5、6、7圖中可以看出在下殼體12上形成有複數個具有香菇狀結構之凸柱P,組裝時可使前述凸柱P依序穿過彈性元件S以及底蓋13上對應之穿孔h,並使彈性元件S夾設在下殼體12以及底蓋13之間(第7圖)。 As shown in Figures 3 and 4, in this embodiment, two elongated foot pads 14 are formed on the bottom side of the housing 12, and the aforementioned bottom cover 13 is located between the two foot pads 14. On the other hand, it can be seen from Figures 5, 6 and 7 that a plurality of protrusions P with mushroom-like structures are formed on the lower housing 12. During assembly, the protrusions P can pass through the elastic elements S and S in sequence. Corresponding holes h are formed on the bottom cover 13, and the elastic element S is sandwiched between the lower case 12 and the bottom cover 13 (Fig. 7).

具體而言,前述底蓋13係由一矩形之容置結構130以及一矩形之邊框131所組成,其中前述容置結構130穿過下殼體12中央之開孔120(第5、7圖),前述邊框131圍繞前述容置結構130,且前述穿孔h係形成於邊框131上。 Specifically, the aforementioned bottom cover 13 is composed of a rectangular receiving structure 130 and a rectangular frame 131, wherein the aforementioned receiving structure 130 passes through the opening 120 in the center of the lower case 12 (Figs. 5 and 7). , the aforementioned frame 131 surrounds the aforementioned accommodating structure 130, and the aforementioned perforation h is formed on the frame 131.

再請參閱第8圖,其中第8圖表示氣流從下殼體12的左、右兩側進風,並且由下殼體12的頂側出風之示意圖。 Please refer to Figure 8 again. Figure 8 shows a schematic diagram in which the airflow enters from the left and right sides of the lower housing 12 and exits from the top side of the lower housing 12 .

如第8圖中箭頭方向所示,當電子裝置100之本體10於組裝完成後,可透過電路板B1兩側的風扇F將外部空氣經由下殼體12的左、右兩 側吸入本體10內,然後再將本體10內部的空氣由下殼體12的頂側排出,藉以達到對本體10內部電子元件散熱降溫之目的。 As shown in the direction of the arrow in Figure 8, after the body 10 of the electronic device 100 is assembled, the fans F on both sides of the circuit board B1 can be used to pass the external air through the left and right sides of the lower case 12. The air inside the main body 10 is sucked into the main body 10 from the side, and then the air inside the main body 10 is discharged from the top side of the lower case 12, so as to achieve the purpose of dissipating and cooling the electronic components inside the main body 10.

於一實施例中,前述風扇F也可以將外部空氣經由下殼體12的頂側吸入本體10內,然後再將本體10內部的空氣由下殼體12的左、右兩側排出,其同樣可達到對本體10內部電子元件散熱降溫之目的,而並不以本新型實施例所揭露者為限。 In one embodiment, the aforementioned fan F can also suck outside air into the main body 10 through the top side of the lower casing 12, and then discharge the air inside the main body 10 from the left and right sides of the lower casing 12. The same is true for The purpose of dissipating and cooling the electronic components inside the body 10 can be achieved, and is not limited to those disclosed in the embodiments of the present invention.

接著請一併參閱第9、10圖,其中第9圖表示電子裝置100之本體10的局部剖視圖,第10圖表示第9圖中之本體10的局部放大圖。 Next, please refer to Figures 9 and 10 together. Figure 9 shows a partial cross-sectional view of the main body 10 of the electronic device 100, and Figure 10 shows a partial enlarged view of the main body 10 in Figure 9.

從第9、10圖中可以看出,當例如電子裝置100處於關機狀態時或不需強化散熱效能時,本體10內部的空氣幫浦50尚未或無須對氣囊40充氣,此時位在電子裝置100之本體10下方的底蓋13相對於下殼體12位在第一高度,而腳墊14則是凸出於底蓋13和下殼體12之底側,用以接觸桌面。 As can be seen from Figures 9 and 10, for example, when the electronic device 100 is turned off or does not need to enhance the heat dissipation performance, the air pump 50 inside the body 10 has not yet or does not need to inflate the airbag 40. At this time, the electronic device The bottom cover 13 below the main body 10 of 100 is located at a first height relative to the lower case 12, and the foot pads 14 protrude from the bottom sides of the bottom cover 13 and the lower case 12 to contact the desktop.

需特別說明的是,由於在下殼體12以及底蓋13之間設有彈性元件S(例如壓縮彈簧),因此可透過前述彈性元件S產生一彈力,使底蓋13能夠相對下殼體12維持在前述第一高度(如第9、10圖所示)。 It should be noted that since an elastic element S (such as a compression spring) is provided between the lower case 12 and the bottom cover 13 , an elastic force can be generated through the elastic element S so that the bottom cover 13 can maintain its position relative to the lower case 12 At the aforementioned first height (as shown in Figures 9 and 10).

再請一併參閱第11、12圖,其中第11圖表示當底蓋13從第9、10圖所示之第一高度相對於下殼體12沉降到一第二高度的示意圖,第12圖表示第11圖中之本體10的局部放大圖。 Please refer to Figures 11 and 12 together. Figure 11 shows a schematic diagram when the bottom cover 13 sinks to a second height relative to the lower case 12 from the first height shown in Figures 9 and 10. Figure 12 This shows a partial enlarged view of the main body 10 in Figure 11 .

從第11、12圖中可以看出,當電子裝置100處於開機狀態或因溫度過高而需要強化散熱效能時,則可啟動本體10內部之空氣幫浦50,其中空氣幫浦50可透過管路C對氣囊40充氣,此時氣囊40即會膨脹並朝下方推動底蓋13,使得底蓋13可從第9、10圖所示之第一高度相對於下殼體12沿-Z軸方向沉降到一第二高度(如第11、12圖所示)。 As can be seen from Figures 11 and 12, when the electronic device 100 is powered on or needs to enhance the heat dissipation performance due to excessive temperature, the air pump 50 inside the body 10 can be activated, and the air pump 50 can pass through the tube. Road C inflates the air bag 40. At this time, the air bag 40 will expand and push the bottom cover 13 downward, so that the bottom cover 13 can move along the -Z axis relative to the lower housing 12 from the first height shown in Figures 9 and 10. Settled to a second height (as shown in Figures 11 and 12).

在此狀態下,底蓋13的容置結構130會朝-Z軸方向凸出於下殼體12的底側,並使本體10的內部空間101(形成於上殼體11與下殼體12之間)增加,從而能夠有助於提升風扇F的進氣量,並可大幅提升電子裝置100的散熱效能。 In this state, the accommodation structure 130 of the bottom cover 13 will protrude from the bottom side of the lower case 12 in the -Z-axis direction, and the internal space 101 of the body 10 (formed between the upper case 11 and the lower case 12 ) increases, thereby helping to increase the air intake volume of the fan F, and greatly improving the heat dissipation performance of the electronic device 100 .

需特別說明的是,當底蓋13從第9、10圖所示之第一高度相對於下殼體12沿-Z軸方向沉降到第二高度時(如第11、12圖所示),位在下殼體12以及底蓋13之間的彈性元件S會受到進一步壓縮。 It should be noted that when the bottom cover 13 sinks from the first height shown in Figures 9 and 10 to the second height along the -Z axis relative to the lower housing 12 (as shown in Figures 11 and 12), The elastic element S located between the lower case 12 and the bottom cover 13 will be further compressed.

另一方面,在電子裝置100由前述第二高度(例如開機狀態下)切換回復到第一高度(例如關機狀態下)的過程中,則可透過空氣幫浦50和管路C對對氣囊40洩氣,同時可利用彈性元件S本身所產生的彈力朝上方推動底蓋13,從而使底蓋13自動回復到如第9、10圖所示之第一高度,以大幅縮減本體10的體積,並可方便使用者收納電子裝置100。 On the other hand, during the process of the electronic device 100 switching from the aforementioned second height (for example, in the powered-on state) to the first height (for example, in the powered-off state), the airbag 40 can be aligned through the air pump 50 and the pipeline C. deflate, and at the same time, the elastic force generated by the elastic element S itself can be used to push the bottom cover 13 upward, so that the bottom cover 13 automatically returns to the first height as shown in Figures 9 and 10, thereby greatly reducing the volume of the body 10, and The electronic device 100 can be conveniently stored by the user.

綜上所述,本新型提供一種電子裝置100,其中當前述電子裝置100處於關機模式時,底蓋13相對下殼體12位在第一高度,而當電子裝置100切換到開機狀態或需強化散熱效能時,則可啟動本體10內部之空氣幫浦50,藉以對氣囊40充氣,此時氣囊40會膨脹並朝下方推動底蓋13,使得底蓋13從第9、10圖所示之第一高度相對於下殼體12沿-Z軸方向沉降到第二高度(如第11、12圖所示),以大幅提升電子裝置100的散熱效能。 To sum up, the present invention provides an electronic device 100. When the electronic device 100 is in the shutdown mode, the bottom cover 13 is at the first height relative to the lower case 12. When the electronic device 100 is switched to the powered-on state or needs to be strengthened, When the heat dissipation efficiency is high, the air pump 50 inside the body 10 can be activated to inflate the air bag 40. At this time, the air bag 40 will expand and push the bottom cover 13 downward, so that the bottom cover 13 moves from the position shown in Figures 9 and 10. The first height sinks to the second height along the -Z axis direction relative to the lower case 12 (as shown in FIGS. 11 and 12 ), so as to greatly improve the heat dissipation performance of the electronic device 100 .

此外,本新型在切換的過程中,使用者不需改變使用鍵盤的習慣,且不會有切換時電子裝置100起伏的不適感。 In addition, during the switching process of the present invention, the user does not need to change the habit of using the keyboard, and there is no discomfort caused by the ups and downs of the electronic device 100 during switching.

雖然本新型的實施例及其優點已揭露如上,但應該瞭解的是,任何所屬技術領域中具有通常知識者,在不脫離本新型之精神和範圍內,當可作更動、替代與潤飾。此外,本新型之保護範圍並未侷限於說明書內所述特定實施例中的製程、機器、製造、物質組成、裝置、方法及步 驟,任何所屬技術領域中具有通常知識者可從本新型揭示內容中理解現行或未來所發展出的製程、機器、製造、物質組成、裝置、方法及步驟,只要可以在此處所述實施例中實施大抵相同功能或獲得大抵相同結果皆可根據本新型使用。因此,本新型之保護範圍包括上述製程、機器、製造、物質組成、裝置、方法及步驟。另外,每一申請專利範圍構成個別的實施例,且本新型之保護範圍也包括各個申請專利範圍及實施例的組合。 Although the embodiments and advantages of the present invention have been disclosed above, it should be understood that any modification, substitution and modification can be made by anyone with ordinary skill in the art without departing from the spirit and scope of the present invention. In addition, the scope of protection of the present invention is not limited to the processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any person with ordinary skill in the art can understand from the disclosure of this invention the processes, machines, manufacturing, material compositions, devices, methods and steps currently or developed in the future, as long as the embodiments described herein can be Implementing substantially the same functions or obtaining substantially the same results can be used according to the present invention. Therefore, the scope of protection of the present invention includes the above-mentioned processes, machines, manufacturing, material compositions, devices, methods and steps. In addition, each patent application scope constitutes an individual embodiment, and the protection scope of the present invention also includes the combination of each patent application scope and embodiments.

雖然本新型已以較佳實施例揭露於上,然其並非用以限定本新型,任何熟習此項工藝者,在不脫離本新型之精神和範圍內,當可作些許之更動與潤飾,因此本新型之保護範圍當視後附之申請專利範圍所界定者為準。 Although the preferred embodiments of the present invention have been disclosed above, they are not intended to limit the present invention. Anyone familiar with this technology can make some modifications and modifications without departing from the spirit and scope of the present invention. Therefore, The scope of protection of the present invention shall be determined by the appended patent application scope.

10:本體 10:Ontology

101:內部空間 101:Internal space

11:上殼體 11: Upper shell

12:下殼體 12:Lower shell

13:底蓋 13: Bottom cover

130:容置結構 130: Containment structure

131:邊框 131:Border

14:腳墊 14: Foot pads

40:氣囊 40:Air bag

50:空氣幫浦 50:Air pump

B1:電路板 B1: Circuit board

C:管路 C:Pipeline

F:風扇 F:Fan

P:凸柱 P:Protruding pillar

S:彈性元件 S: elastic element

Claims (10)

一種電子裝置,包括:一本體,具有一上殼體、一下殼體以及一底蓋,其中該上殼體與該下殼體彼此固定以形成一內部空間,該底蓋活動地連接該下殼體;一氣囊,設置於該內部空間;以及一空氣幫浦,設置於該內部空間,並且連接該氣囊,其中當該空氣幫浦對該氣囊充氣時,該氣囊膨脹並將該底蓋由一第一位置相對於該下殼體沉降到一第二位置。 An electronic device includes: a body with an upper shell, a lower shell and a bottom cover, wherein the upper shell and the lower shell are fixed to each other to form an internal space, and the bottom cover is movably connected to the lower shell body; an airbag, disposed in the internal space; and an air pump, disposed in the internal space, and connected to the airbag, wherein when the air pump inflates the airbag, the airbag expands and the bottom cover is formed by a The first position sinks to a second position relative to the lower housing. 如請求項1之電子裝置,其中該下殼體形成有一凸柱,且該底蓋形成有一穿孔,其中該凸柱穿過該穿孔。 The electronic device of claim 1, wherein the lower housing is formed with a protruding pillar, and the bottom cover is formed with a perforation, wherein the protruding pillar passes through the perforation. 如請求項2之電子裝置,其中該電子裝置更包括一彈性元件,夾設於該下殼體以及該底蓋之間。 The electronic device of claim 2, wherein the electronic device further includes an elastic element sandwiched between the lower case and the bottom cover. 如請求項3之電子裝置,其中該彈性元件為一壓縮彈簧。 The electronic device of claim 3, wherein the elastic element is a compression spring. 如請求項2之電子裝置,其中該底蓋具有一容置結構以及一邊框,且該邊框圍繞該容置結構。 The electronic device of claim 2, wherein the bottom cover has a receiving structure and a frame, and the frame surrounds the receiving structure. 如請求項5之電子裝置,其中該穿孔形成於該邊框上。 The electronic device of claim 5, wherein the through hole is formed on the frame. 如請求項5之電子裝置,其中該凸柱具有一香菇狀結構。 The electronic device of claim 5, wherein the protruding pillar has a mushroom-shaped structure. 如請求項1之電子裝置,其中該電子裝置更包括一風扇,設置於該內部空間,用以將該本體外部的空氣吸入該本體內。 The electronic device of claim 1, wherein the electronic device further includes a fan disposed in the internal space for sucking air outside the body into the body. 如請求項1之電子裝置,其中該電子裝置更包括一顯示單元,且該顯示單元樞接該本體。 The electronic device of claim 1, wherein the electronic device further includes a display unit, and the display unit is pivotally connected to the body. 如請求項1之電子裝置,其中該電子裝置更包括一腳墊,凸出於該下殼體之一底側。 The electronic device of claim 1, wherein the electronic device further includes a foot pad protruding from a bottom side of the lower housing.
TW112202744U 2023-03-25 2023-03-25 Electronic device TWM647399U (en)

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