TWM646393U - Printed circuit board assembly - Google Patents
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- TWM646393U TWM646393U TW112204871U TW112204871U TWM646393U TW M646393 U TWM646393 U TW M646393U TW 112204871 U TW112204871 U TW 112204871U TW 112204871 U TW112204871 U TW 112204871U TW M646393 U TWM646393 U TW M646393U
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- circuit board
- hard disk
- memory slots
- connector
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- 230000015654 memory Effects 0.000 claims abstract description 72
- 238000009434 installation Methods 0.000 claims description 10
- 238000001816 cooling Methods 0.000 abstract description 6
- 230000000903 blocking effect Effects 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
本新型提供一種電路板組件,包含一電路板、一處理器插座以及多個記憶體插槽。處理器插座傾斜地設置於電路板。記憶體插槽傾斜地設置於電路板,並電性連接於處理器插座。因此,更多的記憶體插槽能設置於電路板上。並且,得以使用較短的佈線來電性連接記憶體插槽及處理器插座。此外,插接於記憶體插槽的記憶體也不會擋住流向處理器插座的散熱氣流。如此一來,更多的記憶體插槽便能在符合規範且不擋住散熱氣流的前提下,擺放於電路板有限的空間中。 The invention provides a circuit board assembly, which includes a circuit board, a processor socket and a plurality of memory slots. The processor socket is arranged obliquely on the circuit board. The memory slot is arranged obliquely on the circuit board and is electrically connected to the processor socket. Therefore, more memory slots can be provided on the circuit board. Furthermore, shorter wiring can be used to electrically connect the memory slots and processor sockets. In addition, the memory plugged into the memory slot will not block the cooling airflow to the processor socket. In this way, more memory slots can be placed in the limited space of the circuit board without blocking the cooling airflow.
Description
本新型關於一種電路板組件,特別係一種包含記憶體插槽的電路板組件。 The present invention relates to a circuit board assembly, particularly a circuit board assembly including a memory slot.
隨著半導體製程技術的進步,中央處理器能支援越來越多的記憶體插槽。然而,因為機殼尺寸規範等因素,主機板上的空間往往會受到限制。此外,在擺放記憶體插槽時,也會需要考量處理器的規範以及散熱需求。因此,即使中央處理器能支援更多的記憶體插槽,這些記憶體插槽仍難以在滿足規範及散熱需求之前提下,擺放於主機板有限的空間中。 With the advancement of semiconductor process technology, central processing units can support more and more memory slots. However, due to factors such as case size specifications, the space on the motherboard is often limited. In addition, when placing memory slots, you also need to consider the processor specifications and cooling requirements. Therefore, even if the CPU can support more memory slots, it is still difficult for these memory slots to be placed in the limited space of the motherboard while meeting specifications and cooling requirements.
詳細來說,記憶體插槽通常係沿電路板的短邊水平地擺放或沿長邊垂直地擺放。若記憶體插槽沿電路板的短邊水平地擺放,則電路板上能擺放的記憶體插槽之數量會降低。若記憶體插槽沿電路板的長邊垂直地擺放,則電性連接記憶體插槽及處理器插座的佈線可能會因長度過長而不符合處理器的規範。此外,插接於記憶體插槽的記憶體還可能會擋住流向處理器的散熱氣流,而降低處理器的散熱效率。 Specifically, memory slots are usually placed horizontally along the short side of the circuit board or vertically along the long side. If the memory slots are placed horizontally along the short side of the circuit board, the number of memory slots that can be placed on the circuit board will be reduced. If the memory slots are placed vertically along the long edge of the circuit board, the wiring electrically connecting the memory slots to the processor socket may be too long and fail to comply with the processor specifications. In addition, the memory plugged into the memory slot may block the heat dissipation airflow to the processor, thereby reducing the heat dissipation efficiency of the processor.
本新型在於提供一種電路板組件,以使更多的記憶體插槽能在符合規範且不擋住散熱氣流的前提下,擺放於主機板 有限的空間中。 The invention provides a circuit board assembly so that more memory slots can be placed on the motherboard while complying with specifications and not blocking the heat dissipation airflow. in limited space.
本新型一實施例揭露之電路板組件包含一電路板、一處理器插座以及多個記憶體插槽。處理器插座傾斜地設置於電路板。記憶體插槽傾斜地設置於電路板,並電性連接於處理器插座。 A circuit board assembly disclosed in an embodiment of the present invention includes a circuit board, a processor socket and a plurality of memory slots. The processor socket is arranged obliquely on the circuit board. The memory slot is arranged obliquely on the circuit board and is electrically connected to the processor socket.
根據上述實施例揭露之電路板組件,處理器插座及記憶體插槽傾斜地設置於電路板。因此,更多的記憶體插槽能設置於電路板上。並且,得以使用較短的佈線來電性連接記憶體插槽及處理器插座。此外,插接於記憶體插槽的記憶體也不會擋住流向處理器插座的散熱氣流。如此一來,更多的記憶體插槽便能在符合規範且不擋住散熱氣流的前提下,擺放於電路板有限的空間中。 According to the circuit board assembly disclosed in the above embodiment, the processor socket and the memory slot are arranged on the circuit board obliquely. Therefore, more memory slots can be provided on the circuit board. Furthermore, shorter wiring can be used to electrically connect the memory slots and processor sockets. In addition, the memory plugged into the memory slot will not block the cooling airflow to the processor socket. In this way, more memory slots can be placed in the limited space of the circuit board without blocking the cooling airflow.
10:電路板組件 10:Circuit board components
100:電路板 100:Circuit board
101:安裝面 101:Mounting surface
102:第一安裝孔 102:First mounting hole
103:第二安裝孔 103:Second mounting hole
104,105,106:邊緣 104,105,106: Edge
200:處理器插座 200:Processor socket
201:邊緣 201: Edge
300:記憶體插槽 300:Memory slot
301:長邊 301: long side
302:短邊 302:Short side
310:基座 310:Pedestal
320:卡扣件 320: fasteners
400:佈線 400:Wiring
500,550:連接器 500,550: Connector
610:第一電壓調節器 610: First voltage regulator
620:第二電壓調節器 620: Second voltage regulator
630:第三電壓調節器 630:Third voltage regulator
700:第一硬碟連接器 700: First hard drive connector
800:第二硬碟連接器 800: Second hard drive connector
900:固定座 900: Fixed seat
901:固定穿孔 901: Fixed perforation
15,16:固定柱 15,16: Fixed column
20:記憶體 20:Memory
θ1,θ2,θ3,θ4:角度 θ1, θ2, θ3, θ4: angle
A1:第一排列方向 A1: first arrangement direction
A2:第二排列方向 A2: Second arrangement direction
L1,L2:長度 L1, L2: length
H1:第一高度 H1: first height
H2:第二高度 H2: second height
R1:第一安裝範圍 R1: first installation range
R2:第二安裝範圍 R2: Second installation range
M:活動方向 M: Activity direction
30,35:硬碟 30,35:hard drive
圖1為記憶卡、硬碟及根據本新型一實施例的電路板組件之立體圖。 Figure 1 is a perspective view of a memory card, a hard disk and a circuit board assembly according to an embodiment of the present invention.
圖2為圖1中的記憶卡、硬碟及電路板組件的上視圖。 FIG. 2 is a top view of the memory card, hard disk and circuit board assembly in FIG. 1 .
圖3為圖1中的電路板組件於另一視角的立體圖之局部放大圖。 FIG. 3 is a partially enlarged perspective view of the circuit board assembly in FIG. 1 from another perspective.
圖4為呈現圖1中的電路板組件之固定座及處於關閉狀態的記憶體插槽的立體圖之局部放大圖。 FIG. 4 is a partial enlarged view of a perspective view showing the fixing seat of the circuit board assembly and the memory slot in a closed state in FIG. 1 .
圖5為呈現圖1中的電路板組件之固定座及處於開啟狀態的 記憶體插槽的立體圖之局部放大圖。 Figure 5 shows the fixing base of the circuit board assembly in Figure 1 and its open state. A partial enlargement of the 3D view of the memory slot.
以下在實施方式中詳細敘述本新型之實施例之詳細特徵以及優點,其內容足以使任何本領域中具通常知識者了解本新型之實施例之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何本領域中具通常知識者可輕易地理解本新型相關之目的及優點。以下之實施例係進一步詳細說明本新型之觀點,但非以任何觀點限制本新型之範疇。 The detailed features and advantages of the embodiments of the present invention are described in detail below in the implementation mode. The content is sufficient to enable anyone with ordinary knowledge in the art to understand the technical content of the embodiments of the present invention and implement them accordingly, and based on the disclosure in this specification With the content, patent scope and drawings, anyone with ordinary knowledge in the art can easily understand the relevant purposes and advantages of the present invention. The following examples are intended to further illustrate the concepts of the present invention in detail, but are not intended to limit the scope of the present invention in any way.
請參閱圖1及圖2,圖1為記憶卡、硬碟及根據本新型一實施例的電路板組件之立體圖。圖2為圖1中的記憶卡、硬碟及電路板組件的上視圖。於本實施例中,電路板組件10包含一電路板100、一處理器插座200、多個記憶體插槽300、多個佈線400、一連接器500、一連接器550、多個第一電壓調節器610、多個第二電壓調節器620、多個第三電壓調節器630、一第一硬碟連接器700、一第二硬碟連接器800及一固定座900。 Please refer to Figures 1 and 2. Figure 1 is a perspective view of a memory card, a hard disk and a circuit board assembly according to an embodiment of the present invention. FIG. 2 is a top view of the memory card, hard disk and circuit board assembly in FIG. 1 . In this embodiment, the circuit board assembly 10 includes a circuit board 100, a processor socket 200, a plurality of memory slots 300, a plurality of wirings 400, a connector 500, a connector 550, and a plurality of first voltages. regulator 610, a plurality of second voltage regulators 620, a plurality of third voltage regulators 630, a first hard disk connector 700, a second hard disk connector 800 and a mounting base 900.
於本實施例中,電路板100具有一安裝面101。處理器插座200傾斜地設置於電路板100的安裝面101,並用以供如中央處理器(CPU)或圖形處理器(GPU)之處理器插接。於本實施例中,處理器插座200的邊緣201與電路板100的安裝面101之相鄰二邊緣104、105不平行。進一步來說,處理器插座200的邊緣201與電路板100的安裝面101之相鄰二邊緣104、105之間的角度θ1、θ2例如實質上為45度。也就是說,角度θ1、θ2為45度 或因製造或組裝工差而為近似45度。 In this embodiment, the circuit board 100 has a mounting surface 101 . The processor socket 200 is disposed obliquely on the mounting surface 101 of the circuit board 100 and is used for connecting a processor such as a central processing unit (CPU) or a graphics processing unit (GPU). In this embodiment, the edge 201 of the processor socket 200 is not parallel to the two adjacent edges 104 and 105 of the mounting surface 101 of the circuit board 100 . Furthermore, the angles θ1 and θ2 between the edge 201 of the processor socket 200 and the two adjacent edges 104 and 105 of the mounting surface 101 of the circuit board 100 are, for example, substantially 45 degrees. In other words, the angles θ1 and θ2 are 45 degrees Or it may be approximately 45 degrees due to manufacturing or assembly differences.
每一記憶體插槽300包含一基座310及一卡扣件320。於每一記憶體插槽300中,卡扣件320可活動地設置於基座310。記憶體插槽300的基座310傾斜地設置於電路板100的安裝面101,並分別用以供多個記憶體20插接。這些記憶體插槽300的基座310透過這些佈線400電性連接於處理器插座200。 Each memory slot 300 includes a base 310 and a latch 320 . In each memory slot 300, the latch 320 is movably disposed on the base 310. The base 310 of the memory slot 300 is disposed obliquely on the mounting surface 101 of the circuit board 100, and is used for plugging in multiple memories 20 respectively. The bases 310 of the memory sockets 300 are electrically connected to the processor socket 200 through the wirings 400 .
於本實施例中,這些記憶體插槽300的基座310分別位於處理器插座200的相對兩側。並且,每一記憶體插槽300的基座310的一長邊301與電路板100的安裝面101之相鄰二邊緣104、105不平行。進一步來說,每一記憶體插槽300的基座310的長邊301與電路板100的相鄰二邊緣104、105之間的角度θ3、θ4例如實質上為45度。 In this embodiment, the bases 310 of the memory slots 300 are respectively located on opposite sides of the processor socket 200 . Furthermore, one long side 301 of the base 310 of each memory slot 300 is not parallel to two adjacent edges 104 and 105 of the mounting surface 101 of the circuit board 100 . Furthermore, the angles θ3 and θ4 between the long side 301 of the base 310 of each memory slot 300 and the two adjacent edges 104 and 105 of the circuit board 100 are, for example, substantially 45 degrees.
此外,於本實施例中,部分的記憶體插槽300的基座310沿一第一排列方向A1排列於安裝面101上,且其餘的記憶體插槽300的基座310沿一第二排列方向A2排列於安裝面101上。第一排列方向A1與第二排列方向A2不平行。也就是說,部分的記憶體插槽300的基座310中的短邊302彼此對齊,且其餘的記憶體插槽300的基座310中的短邊302彼此不對齊。須注意的是,於每一記憶體插槽300的基座310中,短邊302相鄰且垂直於長邊301。須注意的是,於其他實施例中,全部的記憶卡插槽亦可沿相同的排列方向排列。 In addition, in this embodiment, some of the bases 310 of the memory slots 300 are arranged on the mounting surface 101 along a first arrangement direction A1, and the remaining bases 310 of the memory slots 300 are arranged along a second arrangement. Direction A2 is arranged on the mounting surface 101 . The first arrangement direction A1 and the second arrangement direction A2 are not parallel. That is, the short sides 302 in the bases 310 of some of the memory sockets 300 are aligned with each other, and the short sides 302 in the bases 310 of the remaining memory sockets 300 are not aligned with each other. It should be noted that in the base 310 of each memory slot 300, the short side 302 is adjacent and perpendicular to the long side 301. It should be noted that in other embodiments, all memory card slots can also be arranged in the same arrangement direction.
於本實施例中,每一佈線400的總長度(長度L1與 長度L2之和)例如小於等於6000密耳(mil)。因此,透過佈線400在記憶體插槽300與處理器插座200之間傳遞的時脈訊號會符合規範。 In this embodiment, the total length of each wiring 400 (length L1 and The sum of the lengths L2) is, for example, less than or equal to 6000 mils (mil). Therefore, the clock signal transmitted between the memory socket 300 and the processor socket 200 through the wiring 400 will comply with the specification.
連接器500、550分別設置於電路板100的相對兩側。具體來說,連接器500例如設置於電路板100的安裝面101的邊緣106,且連接器550例如設置於電路板100的安裝面101的邊緣104。此外,連接器500、550電性連接於處理器插座200。第一電壓調節器610及第二電壓調節器620設置於電路板100的安裝面101,並介於處理器插座200及連接器500之間。第一電壓調節器610及第二電壓調節器620沿不同的方向排列,且彼此分離。此外,第二電壓調節器620係傾斜地設置於安裝面101。第一電壓調節器610及第二電壓調節器620電性連接於記憶體插槽300。 The connectors 500 and 550 are respectively disposed on opposite sides of the circuit board 100 . Specifically, the connector 500 is, for example, disposed on the edge 106 of the mounting surface 101 of the circuit board 100 , and the connector 550 is, for example, disposed on the edge 104 of the mounting surface 101 of the circuit board 100 . In addition, the connectors 500 and 550 are electrically connected to the processor socket 200 . The first voltage regulator 610 and the second voltage regulator 620 are disposed on the mounting surface 101 of the circuit board 100 and between the processor socket 200 and the connector 500 . The first voltage regulator 610 and the second voltage regulator 620 are arranged in different directions and separated from each other. In addition, the second voltage regulator 620 is disposed obliquely on the mounting surface 101 . The first voltage regulator 610 and the second voltage regulator 620 are electrically connected to the memory slot 300 .
若將第二電壓調節器620設置於第一電壓調節器610旁邊,則第二電壓調節器620會佔據處理器插座200與連接器500之間的佈線空間,而使得處理器插座200與連接器500之間難以實施最短的佈線。本實施例透過使第二電壓調節器620鄰近於記憶體插槽300且分離於第一電壓調節器610,而令處理器插座200與連接器500之間能實施最短的佈線。 If the second voltage regulator 620 is disposed next to the first voltage regulator 610, the second voltage regulator 620 will occupy the wiring space between the processor socket 200 and the connector 500, so that the processor socket 200 and the connector 500 are It is difficult to implement the shortest wiring between 500 and 500. This embodiment enables the shortest wiring between the processor socket 200 and the connector 500 by arranging the second voltage regulator 620 adjacent to the memory socket 300 and separated from the first voltage regulator 610 .
此外,第二電壓調節器620傾斜的設計是為了配合傾斜的記憶體插槽300,而更有效地利用安裝面101上的空間。 In addition, the tilted design of the second voltage regulator 620 is to cooperate with the tilted memory slot 300 and utilize the space on the mounting surface 101 more effectively.
第三電壓調節器630設置於電路板100的安裝面101。 第三電壓調節器630位於處理器插座200遠離第一電壓調節器610與第二電壓調節器620之一側。由於處理器插座200與連接器550之間的佈線空間足夠,因此第三電壓調節器630無須傾斜地設置於安裝面101。 The third voltage regulator 630 is disposed on the mounting surface 101 of the circuit board 100 . The third voltage regulator 630 is located on a side of the processor socket 200 away from the first voltage regulator 610 and the second voltage regulator 620 . Since the wiring space between the processor socket 200 and the connector 550 is sufficient, the third voltage regulator 630 does not need to be disposed at an angle on the mounting surface 101 .
請參閱圖2及圖3,圖3為圖1中的電路板組件於另一視角的立體圖之局部放大圖。於本實施例中,電路板100更具有一第一安裝孔102及一第二安裝孔103。第一安裝孔102及第二安裝孔103位於安裝面101,並分別用以供固定柱15、16插設。第一硬碟連接器700及第二硬碟連接器800設置於電路板100的安裝面101上,且沿不同的方向相對電路板100傾斜。如圖3所示,第一硬碟連接器700及第二硬碟連接器800分別鄰近於第一安裝孔102及第二安裝孔103。第一硬碟連接器700相對電路板100的安裝面101具有一第一高度H1。第二硬碟連接器800相對電路板100的安裝面101具有一第二高度H2。第一高度H1不同於第二高度H2。第一硬碟連接器700與第一安裝孔102於電路板100的安裝面101上界定出一第一安裝範圍R1。第二硬碟連接器800與第二安裝孔103於電路板100的安裝面101上界定出一第二安裝範圍R2。第一安裝範圍R1至少部分地重疊於第二安裝範圍R2。如此一來,安裝於第一硬碟連接器700及固定柱15之硬碟30,會位於安裝面101與安裝於第二硬碟連接器800及固定柱16之硬碟35之間。這樣的配置方式會提高電路板100的安裝面101上之空間利用率。此外,第一硬碟連接器700、第二硬碟 連接器800及硬碟30、35例如符合M.2規範。 Please refer to FIGS. 2 and 3 . FIG. 3 is a partial enlarged view of the circuit board assembly in FIG. 1 from another perspective. In this embodiment, the circuit board 100 further has a first mounting hole 102 and a second mounting hole 103 . The first mounting hole 102 and the second mounting hole 103 are located on the mounting surface 101 and are used for inserting the fixing posts 15 and 16 respectively. The first hard disk connector 700 and the second hard disk connector 800 are disposed on the mounting surface 101 of the circuit board 100 and are inclined relative to the circuit board 100 in different directions. As shown in FIG. 3 , the first hard disk connector 700 and the second hard disk connector 800 are respectively adjacent to the first mounting hole 102 and the second mounting hole 103 . The first hard disk connector 700 has a first height H1 relative to the mounting surface 101 of the circuit board 100 . The second hard disk connector 800 has a second height H2 relative to the mounting surface 101 of the circuit board 100 . The first height H1 is different from the second height H2. The first hard disk connector 700 and the first mounting hole 102 define a first mounting range R1 on the mounting surface 101 of the circuit board 100 . The second hard disk connector 800 and the second mounting hole 103 define a second mounting range R2 on the mounting surface 101 of the circuit board 100 . The first installation range R1 at least partially overlaps the second installation range R2. In this way, the hard disk 30 installed on the first hard disk connector 700 and the fixing post 15 will be located between the mounting surface 101 and the hard disk 35 installed on the second hard disk connector 800 and the fixing post 16 . Such a configuration will improve the space utilization on the mounting surface 101 of the circuit board 100 . In addition, the first hard disk connector 700, the second hard disk The connector 800 and the hard disks 30 and 35 comply with the M.2 specification, for example.
須注意的是,於其他實施例中,若電路板的安裝面有足夠的空間,則第一安裝範圍與第二安裝範圍亦可完全不重疊。或者,於再其他實施例中,若沒有設置硬碟的需求,電路板組件亦可無需包含第一硬碟連接器及第二硬碟連接器,且電路板亦可無需具有第一安裝孔及第二安裝孔。 It should be noted that in other embodiments, if the mounting surface of the circuit board has enough space, the first installation range and the second installation range may not overlap at all. Alternatively, in other embodiments, if there is no need to install a hard disk, the circuit board component does not need to include the first hard disk connector and the second hard disk connector, and the circuit board does not need to have a first mounting hole and a second hard disk connector. Second mounting hole.
請參閱圖4及圖5。圖4為呈現圖1中的電路板組件之固定座及處於關閉狀態的記憶體插槽的立體圖之局部放大圖。圖5為呈現圖1中的電路板組件之固定座及處於開啟狀態的記憶體插槽的立體圖之局部放大圖。固定座900設置於電路板100的一側,並具有一固定穿孔901。固定穿孔901例如用以供外部機殼(未繪示)上的卡扣彈片(未繪示)卡合。於本實施例中,卡扣件320可活動地設置於基座310,而使得記憶體插槽300具有一關閉狀態(如圖4所示)及一開啟狀態(如圖5所示)。如圖4所示,當記憶體插槽300處於關閉狀態時,卡扣件320遠離基座310的一側會收合於基座310中,而使得記憶體20能扣合於卡扣件320。此外,卡扣件320會分離於固定座900。當卡扣件320沿一活動方向M被扳動而相對基座310開啟時,記憶體插槽300會處於開啟狀態。當記憶體插槽300處於開啟狀態時,卡扣件320會分離於固定座900。也就是說,無論記憶體插槽300是處於開啟狀態或關閉狀態,卡扣件320皆會分離於固定座900而不會與固定座900干涉。須注意的是,當記憶體插槽300處於開啟狀態時,卡 扣件320例如無法再進一步沿活動方向M被扳動。也就是說,當記憶體插槽300處於開啟狀態時,卡扣件320是處於完全開啟狀態。 Please refer to Figure 4 and Figure 5. FIG. 4 is a partial enlarged view of a perspective view showing the fixing seat of the circuit board assembly and the memory slot in a closed state in FIG. 1 . FIG. 5 is a partial enlarged view showing a perspective view of the fixing seat of the circuit board assembly in FIG. 1 and the memory slot in an open state. The fixing base 900 is disposed on one side of the circuit board 100 and has a fixing through hole 901 . The fixing through hole 901 is, for example, used for engaging with a buckle elastic piece (not shown) on the outer casing (not shown). In this embodiment, the buckle 320 is movably disposed on the base 310 so that the memory slot 300 has a closed state (as shown in FIG. 4 ) and an open state (as shown in FIG. 5 ). As shown in FIG. 4 , when the memory slot 300 is in a closed state, the side of the buckle 320 away from the base 310 will be folded into the base 310 so that the memory 20 can be buckled with the buckle 320 . In addition, the buckle 320 will be separated from the fixing base 900 . When the latch 320 is pulled along a movement direction M to open relative to the base 310, the memory slot 300 will be in an open state. When the memory slot 300 is in the open state, the buckle 320 will be separated from the fixing base 900 . That is to say, no matter whether the memory slot 300 is in an open state or a closed state, the buckle 320 will be separated from the fixing base 900 and will not interfere with the fixing base 900 . It should be noted that when the memory slot 300 is open, the card For example, the fastener 320 cannot be pulled further in the movement direction M. That is to say, when the memory slot 300 is in the open state, the latch 320 is in the fully open state.
雖然本新型以前述之諸項實施例揭露如上,然其並非用以限定本新型,任何熟習相像技藝者,在不脫離本新型之精神和範圍內,當可作些許之更動與潤飾,因此本新型之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the foregoing embodiments, they are not intended to limit the present invention. Anyone skilled in the art of modeling can make some modifications and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention is The scope of patent protection for a new model shall be determined by the scope of the patent application attached to this specification.
10:電路板組件 10:Circuit board components
100:電路板 100:Circuit board
101:安裝面 101:Mounting surface
104,105,106:邊緣 104,105,106: Edge
200:處理器插座 200:Processor socket
201:邊緣 201: Edge
300:記憶體插槽 300:Memory slot
301:長邊 301: long side
302:短邊 302:Short side
310:基座 310:Pedestal
320:卡扣件 320: fasteners
400:佈線 400:Wiring
500,550:連接器 500,550: Connector
610:第一電壓調節器 610: First voltage regulator
620:第二電壓調節器 620: Second voltage regulator
630:第三電壓調節器 630:Third voltage regulator
700:第一硬碟連接器 700: First hard drive connector
800:第二硬碟連接器 800: Second hard drive connector
900:固定座 900: Fixed seat
15,16:固定柱 15,16: Fixed column
θ1,θ2,θ3,θ4:角度 θ1, θ2, θ3, θ4: angle
A1:第一排列方向 A1: first arrangement direction
A2:第二排列方向 A2: Second arrangement direction
L1,L2:長度 L1, L2: length
30,35:硬碟 30,35:hard drive
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW112204871U TWM646393U (en) | 2023-05-17 | 2023-05-17 | Printed circuit board assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW112204871U TWM646393U (en) | 2023-05-17 | 2023-05-17 | Printed circuit board assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM646393U true TWM646393U (en) | 2023-09-21 |
Family
ID=88926938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW112204871U TWM646393U (en) | 2023-05-17 | 2023-05-17 | Printed circuit board assembly |
Country Status (1)
Country | Link |
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TW (1) | TWM646393U (en) |
-
2023
- 2023-05-17 TW TW112204871U patent/TWM646393U/en unknown
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