TWM645220U - Shield structure for pvd - Google Patents
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- TWM645220U TWM645220U TW112200133U TW112200133U TWM645220U TW M645220 U TWM645220 U TW M645220U TW 112200133 U TW112200133 U TW 112200133U TW 112200133 U TW112200133 U TW 112200133U TW M645220 U TWM645220 U TW M645220U
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- 238000003466 welding Methods 0.000 claims abstract description 45
- 238000005240 physical vapour deposition Methods 0.000 claims abstract description 32
- 238000010894 electron beam technology Methods 0.000 claims description 53
- 239000000463 material Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 description 18
- 238000005520 cutting process Methods 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- 238000004140 cleaning Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000008439 repair process Effects 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000011324 bead Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
Description
本新型係關於一種遮蔽結構,特別關於用於半導體之物理氣相沈積之遮蔽結構。The present invention relates to a shielding structure, particularly to a shielding structure used for physical vapor deposition of semiconductors.
對於半導體製造或LCD、OLED、LED等光電元件製造等而言,物理氣相沈積(physical vapor deposition,PVD)皆是常用之製程,該物理氣相沈積主要是用於在晶圓(基板)上沈積一層材料薄膜,以製造出半導體裝置。物理氣相沈積需在高真空之腔室中進行,將基板放置於腔室中,而腔室中還具有待沈積於基板上之材料的固體靶材。氣體離子撞擊該靶材以使靶材材料濺射出,該靶材的材料然後轉移至基板而沈積為材料薄膜。For semiconductor manufacturing or optoelectronic component manufacturing such as LCD, OLED, LED, etc., physical vapor deposition (PVD) is a commonly used process. This physical vapor deposition is mainly used on wafers (substrates). A thin film of material is deposited to create a semiconductor device. Physical vapor deposition needs to be performed in a high vacuum chamber. The substrate is placed in the chamber, and the chamber also contains a solid target of the material to be deposited on the substrate. Gas ions strike the target to sputter target material, which is then transferred to the substrate where it is deposited as a thin film of material.
此外,腔室中還放置有遮蔽結構,其圍繞基板,以定義出製程區域,並且可避免濺射出的靶材材料沈積於腔室之內壁上或腔室內之其他元件上而造成內壁或元件污染。在製程結束後,遮蔽結構需進行清潔或清洗,以去除表面之沈積物,而通常是利用噴砂等方式來為之。在此清潔或清洗過程中,清潔或清洗之媒介可能會使遮蔽結構變形,導致其尺寸或精度(如真圓度)漸漸地偏離預期值。此外,在物理氣相沈積之製程中,基板被加熱時也會一併使遮蔽結構加熱,此加熱循環也會使遮蔽結構漸漸地變形。此外,在遮蔽結構的厚度較薄的情況下,遮蔽結構在清潔或清洗時可能或破裂。In addition, a shielding structure is placed in the chamber to surround the substrate to define the process area and prevent the sputtered target material from depositing on the inner wall of the chamber or other components in the chamber, causing the inner wall or Component contamination. After the manufacturing process, the shielding structure needs to be cleaned or cleaned to remove surface deposits, usually by sandblasting or other methods. During this cleaning or cleaning process, the cleaning or cleaning media may deform the shielding structure, causing its size or accuracy (such as true roundness) to gradually deviate from expected values. In addition, during the physical vapor deposition process, when the substrate is heated, the shielding structure will also be heated. This heating cycle will also gradually deform the shielding structure. Furthermore, in the case where the thickness of the shielding structure is thin, the shielding structure may break during cleaning or cleaning.
因此,一旦遮蔽結構變形或破裂至不符所需時,就必須要更換新品,以確保其性能。若不慎延誤遮蔽結構之更換時間,可能會影響到物理氣相沈積之良率或產能。Therefore, once the shielding structure is deformed or cracked to the point that it does not meet the requirements, it must be replaced with a new one to ensure its performance. If the replacement time of the shielding structure is inadvertently delayed, the yield or throughput of physical vapor deposition may be affected.
然而,遮蔽結構之售價不斐,且當尺寸越大時,售價亦越高,故更換新的遮蔽結構對於半導體製造廠亦是一筆不小的負擔。However, the price of the shielding structure is high, and the larger the size, the higher the price. Therefore, replacing a new shielding structure is also a considerable burden for the semiconductor manufacturer.
綜上,如何降低遮蔽結構之更換成本,是相關技術領域的從業人員的目標。In summary, how to reduce the replacement cost of shielding structures is the goal of practitioners in related technical fields.
本新型之目的在於提供用物理氣相沈積之遮蔽結構,以使得遮蔽結構能較容易地被製作及維修,降低更換成本,且對於製程之量率或產能亦有幫助。The purpose of the present invention is to provide a shielding structure using physical vapor deposition, so that the shielding structure can be more easily manufactured and repaired, reducing replacement costs, and is also helpful for the production rate or productivity of the process.
為達上述目的,在本新型的第一方面中,提出一種用於物理氣相沈積之遮蔽結構,可包含:管狀遮蔽體,包含第一直立部及外延部,該外延部從該第一直立部向外延伸出;環狀連結體,包含第二直立部及內延部,該第二直立部設置於該第一直立部之下,而該內延部從該第二直立部向內延伸出,其中,該第二直立部之高度係小於該第一直立部之高度;環狀支撐體,包含橫向部及上延部,該橫向部設置於該環狀連結體之內延部之內,而該上延部從該橫向部向上延伸出;以及電子束焊接層,其中,該第一直立部與該第二直立部之間、及/或該內延部與該橫向部之間,係藉由該電子束焊接層來密封地接合。In order to achieve the above purpose, in the first aspect of the present invention, a shielding structure for physical vapor deposition is proposed, which may include: a tubular shielding body, including a first upright part and an extension part, and the extension part extends from the first upright part. part extends outward; the annular connection body includes a second upright part and an inward extension part, the second upright part is provided under the first upright part, and the inward extension part extends inwardly from the second upright part Out, wherein the height of the second upright part is less than the height of the first upright part; the annular support body includes a transverse part and an upward extension part, and the transverse part is arranged within the inner extension part of the annular connecting body , and the extended portion extends upward from the lateral portion; and the electron beam welding layer, wherein between the first upright portion and the second upright portion, and/or between the inward portion and the lateral portion, It is hermetically joined by this electron beam welding layer.
在本新型的第二方面中,該第一直立部與該第二直立部之間可藉由電子束焊接層來密封地接合,而該內延部與該橫向部之間可為一體成形。In the second aspect of the present invention, the first upright portion and the second upright portion can be hermetically joined by an electron beam welding layer, and the inward portion and the transverse portion can be integrally formed.
在本新型的第三方面中,該內延部與該橫向部之間可藉由電子束焊接層來密封地接合,而該第一直立部與該第二直立部之間可為一體成形。In a third aspect of the present invention, the inward portion and the transverse portion can be hermetically joined by an electron beam welding layer, and the first upright portion and the second upright portion can be integrally formed.
在本新型的第四方面中,該管狀遮蔽體、該環狀連結體及該環狀支撐體之其中兩者能以不同材料製成。In the fourth aspect of the present invention, two of the tubular shielding body, the annular connecting body and the annular supporting body can be made of different materials.
在本新型的第五方面中,提出一種用於物理氣相沈積之遮蔽結構,可包含:已使用之管狀遮蔽體、已使用之環狀連結體、替換之環狀支撐體及電子束焊接層,其中,該替換之環狀支撐體與該已使用之環狀連結體相抵靠,且電子束於該替換之環狀支撐體與該已使用之環狀連結體之間形成該電子束焊接層,以使兩者相密封地接合。In the fifth aspect of the present invention, a shielding structure for physical vapor deposition is proposed, which may include: a used tubular shield, a used annular connector, a replacement annular support and an electron beam welding layer , wherein the replacement annular support body abuts the used annular connector, and the electron beam forms the electron beam welding layer between the replacement annular support body and the used annular connector , so that the two are sealingly joined.
在本新型的第六方面中,該替換之環狀支撐體之厚度可大於該已使用之環狀連結體之厚度。In the sixth aspect of the present invention, the thickness of the replacement annular support body may be greater than the thickness of the used annular connecting body.
在本新型的第七方面中,在形成該電子束焊接層後,該替換之環狀支撐體可被進一步研磨以變薄。In the seventh aspect of the present invention, after the electron beam welding layer is formed, the replacement annular support body can be further ground to become thinner.
在本新型的第八方面中,該替換之環狀支撐體與該已使用之環狀連結體能以不同材料製成。In the eighth aspect of the present invention, the replacement annular support body and the used annular connecting body can be made of different materials.
在本新型的第九方面中,提出一種用於物理氣相沈積之遮蔽結構,可包含已使用之管狀遮蔽體、替換之環狀連結體、替換之環狀支撐體及電子束焊接層,其中,該替換之環狀連結體與該已使用之管狀遮蔽體相抵靠,且電子束於該替換之環狀連結體與該已使用之管狀遮蔽體之間形成該電子束焊接層,以使兩者相密封地接合。In the ninth aspect of the present invention, a shielding structure for physical vapor deposition is proposed, which may include a used tubular shield, a replacement annular connector, a replacement annular support and an electron beam welding layer, wherein , the replacement annular connector abuts the used tubular shield, and the electron beam forms the electron beam welding layer between the replacement annular connector and the used tubular shield, so that the two The two are sealingly joined.
在本新型的第十方面中,該替換之環狀支撐體及環狀連結體可為一體成形。In the tenth aspect of the present invention, the replacement annular support body and annular connecting body can be integrally formed.
在本新型的第十一方面中,該替換之環狀支撐體及環狀連結體之厚度可大於該已使用之管狀遮蔽體之厚度。In the eleventh aspect of the present invention, the thickness of the replacement annular support body and the annular connecting body may be greater than the thickness of the used tubular shielding body.
在本新型的第十二方面中,在形成該電子束焊接層後,該替換之環狀支撐體及環狀連結體可被進一步研磨以變薄。In the twelfth aspect of the present invention, after the electron beam welding layer is formed, the replacement annular support body and annular connecting body can be further ground to become thinner.
在本新型的第十三方面中,該替換之環狀支撐體及環狀連結體能以不同於該已使用之管狀遮蔽體的材料來製成。In the thirteenth aspect of the present invention, the replacement annular support body and annular connecting body can be made of materials different from the used tubular shielding body.
在此所揭示的的目的、特徵及優點將根據以下實施例的說明並參照圖式而對於本技術領域中具有通常知識者變得更為清楚。The objects, features and advantages disclosed herein will become more apparent to those of ordinary skill in the art from the description of the following embodiments and with reference to the drawings.
以下說明結合圖式,對本新型的實施方式作詳細敘示。除非上下文中清楚地另外指明,所述實施例之 技術特徵不應理解為對本新型的限制,且在不衝突的情況下,下述的各實施例及各實施例中的各技術特徵可以相互組合。此外,除非清楚指明,否則本文所用之單數形式「一」亦包括複數形式(且具體數量不限制),而所述之方位(如前、後、上、下、一側、兩側等)係為相對方位,可依據本新型的使用狀態而定義,並非明示或暗示本新型需有特定方向之構造或操作,亦不能理解為對本新型的限制。此外,術語「第一」及「第二」等類似語主要是被用來區別一個特徵(元件、結構、面等)與另一個特徵,並非暗示其優先或優劣性。 The following description is combined with the drawings to describe the embodiments of the present invention in detail. Unless the context clearly indicates otherwise, the embodiments described The technical features should not be understood as limitations of the present invention, and the following embodiments and the technical features in each embodiment can be combined with each other as long as there is no conflict. In addition, unless clearly stated otherwise, the singular form "a" used herein also includes the plural form (and the specific number is not limited), and the described orientation (such as front, back, up, down, one side, both sides, etc.) means It is a relative orientation, which can be defined according to the usage status of the present invention. It does not expressly or imply that the present invention requires a structure or operation in a specific direction, nor can it be understood as a restriction on the present invention. In addition, the terms "first", "second" and similar terms are mainly used to distinguish one feature (component, structure, surface, etc.) from another feature and do not imply priority or superiority.
請參閱圖1所示,根據本新型之較佳實施例,一用於物理氣相沈積之遮蔽結構(shield structure)10被提出,其設置於一物理氣相沈積裝置20中。該物理氣相沈積裝置20可為各類型或各種商用之物理氣相沈積裝置或設備,並不限定。物理氣相沈積裝置20除了包含遮蔽結構10外,亦可包含腔室21、基座22、蓋環(cover ring)23及靶材24等。遮蔽結構10、基座22、蓋環23及靶材24皆設置於腔室21中,遮蔽結構10設置於基座22上以被基座22支撐,遮蔽結構10還位於靶材24之下方,而蓋環23設置於遮蔽結構10內、且可接觸後述的遮蔽結構10所包含的環狀結構體12。可選地,基座22為可垂直移動之升降基座、且還可包含加熱元件。
Please refer to FIG. 1 . According to a preferred embodiment of the present invention, a
物理氣相沈積裝置20還能包含一內遮蔽結構(圖未式),內遮蔽結構設置於遮蔽結構10之內,故遮蔽結
構10此時亦可稱為外遮蔽結構(outer shield structure,or outer shield)。
The physical
將進行物理氣相沈積製程的基板30(晶圓)可設置於物理氣相沈積裝置20的腔室21內,且設置於蓋環23下。從靶材24來的材料可沈積於基板30上,且視情況,基板30還可被基座22加熱。遮蔽結構10可定義出基板30之沈積區域,且可以保護腔室21不被靶材24之材料影響。
The substrate 30 (wafer) to be subjected to the physical vapor deposition process may be placed in the
請參閱圖2至圖4所示,關於遮蔽結構10本身,其主要是圍繞一軸線10A、以圓對稱地形成,且根據結構或外型,遮蔽結構10可包含(區分為):一管狀遮蔽體11、一環狀連結體12及一環狀支撐體13,依序說明如後。
Please refer to FIGS. 2 to 4 . As for the
管狀遮蔽體11主要用於遮蔽、阻擋來自靶材24的材料,其體積相對地大於環狀連結體12及環狀支撐體13。管狀遮蔽體11可包含一第一直立部111及一外延部112,外延部112從第一直立部111向外延伸出(一體成形),即從第一直立部111之上緣111A向外一體地延伸出。更具體而言,第一直立部111並不需完全地垂直(即與軸線10A相平行),可有些許地傾斜,但與軸線10A之夾角不超過例如5度、10度、15度等。外延部112相對於軸線10A向外地延伸,且可為水平、亦可相對水平面些許地傾斜。可選地,管狀遮蔽體11還可包含一或複數個貫穿孔113及/或貫穿部114,以供其他元件安置用或供抽氣用。
The
環狀連結體12主要用以連結其上的管狀遮蔽體11及其內的環狀支撐體13,環狀連結體12可包含一第二
直立部121及一內延部122,第二直立部121設置於第一直立部111之下(即設置於第一直立部111之下緣111B),而內延部122從第二直立部121向內延伸出(一體成形),即從第二直立部121之下緣121B向內一體地延伸出。更具體而言,第二直立部121之上緣121A與第一直立部111之下緣111B相接合(圖4中所示之水平虛線,係表示第二直立部121與與第一直立部111之分界,即上緣121A及下緣111B之所在),且於本實施例中,環狀連結體12(第二直立部121)與管狀遮蔽體11(第一直立部111)之間可為一體成形(由同一個金屬材料來製成),故第二直立部121之上緣121A與第一直立部111之下緣111B係為相連續。此外,第二直立部121之高度(上緣121A至下緣121B之尺寸)係小於第一直立部111之高度(上緣111A至下緣111B之尺寸)。
The
內延部122相對於軸線10A向內地延伸,且可為水平、亦可相對水平面些許地傾斜。再者,內延部122在接近第二直立部121處可包含圓角段。
The
環狀支撐體13主要用以支撐蓋環23或基板30,亦可用於遮蔽、阻擋來自靶材24的材料。環狀支撐體13可包含一橫向部131及一上延部132,而橫向部131設置於環狀連結體12之內延部122之內(即設置於內延部122之內緣122A),且上延部132從向上延伸出(一體成形),即從橫向部131之內緣131A向上一體地延伸出。更具體而言,與內延部122相同的延伸方式,橫向部131亦相對於軸線10A向內地延伸(水平或些許傾斜),且其外緣131B與內延部122之內緣122A相接合。上延部132相對於軸線10A向上延伸,且可為垂直、亦可相對軸線10A傾斜。The ring-shaped
於本實施例中,橫向部131與內延部122並非一體成形,而是分別地被製作出,也就是,管狀遮蔽體11及環狀連結體12為一體成形,但環狀支撐體13是另外地製作成形出。因此,管狀遮蔽體11及環狀連結體12可採用同樣材料(例如鋁),而環狀支撐體13可採用不同材料(例如強度、抗腐蝕性更好之不銹鋼);當然,環狀支撐體13亦可採用同樣材料(例如鋁)。In this embodiment, the
然後,環狀連結體12之內延部122與環狀支撐體13之橫向部131之間係藉由一電子束焊接層14來密封地接合。具體而言,請參閱圖5所述,電子束焊接層14係由電子束焊接(E-beam welding)機來形成。內延部122之內緣122A與橫向部131之外緣131B相抵靠(藉由夾治具來使兩者維持抵靠),然後兩者放置於電子束焊接機之真空腔(圖未式)內。真空腔內會產生之電子束EB,使電子束EB對準內緣122A與外緣131B之間的介面,以高溫融化內緣122A與外緣131B,進而在內緣122A與外緣131B之間形成銲珠(bead)。並且,使內延部122與橫向部131一起旋轉360度(繞著軸線10A),使得銲珠連續地形成為一圈。如此,內延部122的內緣122A與橫向部131的外緣131B之間會形成電子束焊接層14(或簡稱焊接層),以使內延部122與橫向部131相密封地接合。此外,電子束焊接層14為可垂直地形成/或傾斜地形成,因為內緣122A與外緣131B可能為垂直面或是傾斜面。Then, the
藉此,內延部122與橫向部131之間的密封性就實質地如同一體成形所得者,故靶材24之材料難以從內延部122與橫向部131之間通過而洩漏。此外,藉由電子束焊接除了可快速地形成電子束焊接層14,所形成之電子束焊接層14係細又深,表示電子束焊接層14對於內延部122與橫向部131之熱影響小(如歪曲變形少)且接合強度高。Thereby, the sealing performance between the
由於環狀支撐體13不用與管狀遮蔽體11及環狀連結體12一起從同一個、單一個金屬塊製作出,故遮蔽結構10整體之製造工序較容易,製造成本也相應較少,且製造品質也較好(例如環狀支撐體13之真圓度佳)等。Since the
請參閱圖6所示,根據本新型之較佳實施例,另一用於物理氣相沈積之遮蔽結構10’被提出,其於前述實施例的遮蔽結構10的技術內容可互相參考,故相同的部分將省略或簡化描述,且兩實施例之技術內容亦可彼此組合或替換來應用。Please refer to Figure 6. According to a preferred embodiment of the present invention, another shielding structure 10' for physical vapor deposition is proposed. The technical contents of the shielding
遮蔽結構10’與遮蔽結構10主要不同在於,環狀連結體12(內延部122)及環狀支撐體13(橫向部131)為一體成形,但管狀遮蔽體11是另外地製作成形出。具體而言,環狀連結體12及環狀支撐體13可採用同樣材料(例如強度、抗腐蝕性更好之不銹鋼),而管狀遮蔽體11可採用不同材料(例如重量較輕之鋁)。然後,管狀遮蔽體11之第一直立部111與環狀連結體12之第二直立部121之間係藉由一電子束焊接層14來密封地接合。The main difference between the shielding structure 10' and the shielding
更具體而言,請參閱圖7所述,第一直立部111之下緣111B與第二直立部121之上緣121A相抵靠,然後兩者放置於電子束焊接機之真空腔(圖未式)內。此時,第一直立部111與第二直立部121可為橫放狀態,俾以電子束EB對準下緣111B與上緣121A之間的介面,以融化下緣111B與上緣121A。如此,第一直立部111之下緣111B與第二直立部121之上緣121A之間將形成一圈之銲珠而構成電子束焊接層14,使得兩者可互相密封地接合。More specifically, please refer to FIG. 7 . The
藉此,遮蔽結構10’整體之製造工序亦可較容易,製造成本也相應較少,且製造品質也較好(例如環狀支撐體13之真圓度佳)等。Thereby, the entire manufacturing process of the shielding structure 10' can be easier, the manufacturing cost is correspondingly lower, and the manufacturing quality is also better (for example, the roundness of the
接著將說明依據本新型較佳實施例的用於物理氣相沈積之遮蔽結構之維修方法,該維修方法可將損耗之遮蔽結構修復成相同或類似於上述實施例的遮蔽結構10、10’,故維修方法的技術內容與遮蔽結構10、10’的技術內容可相互參考、應用,相同的部份將省略或簡化。Next, a method for repairing a shielding structure for physical vapor deposition according to a preferred embodiment of the present invention will be described. This repair method can repair a damaged shielding structure into the same or
當遮蔽結構10、10’因使用或清潔而有所耗損時,通常環狀支撐體13之耗損程度會較嚴重(傳統遮蔽結構中,對應或類似於環狀支撐體13之部分,也是最容易被損耗)。此損耗會影響到環狀支撐體13之真圓度等精度,進而影響到物理氣相沈積之製程結果。When the shielding
因此,比起將遮蔽結構整個報廢、捨棄不用而直接購買新品而言,本新型僅針對損耗之環狀支撐體13維修,而保留遮蔽結構10、10’之其他大部分,可減少成本,更對環境保護有所助益。Therefore, compared with scrapping the entire shielding structure, discarding it and directly purchasing a new product, this new model only repairs the lost
具體而言,請先參閱圖8所示的遮蔽結構之維修方法之流程圖(所示步驟之順序並非限定,除非有明言或實質影含),於步驟S21中,先提供一已於物理氣相沈積中使用過的遮蔽結構,遮蔽結構可以是傳統的遮蔽結構,而以下說明係以遮蔽結構10為例(如圖2所示)。該遮蔽結構10包含已使用之管狀遮蔽體11、環狀連結體12及環狀支撐體13,其某些尺寸或精度已變異或變差。已使用之管狀遮蔽體11及環狀連結體及12為一體成形而接合,而已使用之環狀連結體12及環狀支撐體13係藉由電子束焊接層14(或一體成形)來接合。Specifically, please first refer to the flow chart of the shielding structure maintenance method shown in Figure 8 (the order of the steps shown is not limiting unless explicitly stated or implicitly implied). In step S21, first provide a physical gas The shielding structure used in phase deposition can be a traditional shielding structure, and the following description takes the shielding
接著進行步驟S23,將已使用過之環狀支撐體13從已使用之環狀連結體12切割分離(如圖4所示),例如可藉由銑床、車床或線切割等來達成,可使切割移除量較少、或使切割面較為平坦。切割分離時,可沿著原本的環狀支撐體13之橫向部131之外緣131B與環狀連結體12之內延部122之內緣122A之間的介面來為切割之。或可說,切割分離所致的環狀支撐體13的切割面及環狀連結體12之切割面即分別定義為外緣131B及內緣122A。Next, step S23 is performed to cut and separate the used
切割所致的環狀連結體12之內延部122的內緣122A可能不平坦(些微傾斜或粗糙),因此可選擇地,藉由磨平、銑平或車床加工等方式來使其變平坦,以益於後續電子束焊接的進行。The
爾後進行步驟S25,提供替換用之環狀支撐體13N。此替換用之環狀支撐體13N係預先製作好且尺寸及精度符合要求。通常而言,替換用之環狀支撐體13N並未於半導體製程中使用過(全新品),或雖使用過但經整修者(整新品)。此外,所提供之替換之環狀支撐體13N能以不同材料(例如不銹鋼)製成,以使得環狀支撐體13更為耐用。且,此步驟S25可在步驟S23之前進行,即事先準備好。Then step S25 is performed to provide a replacement
然後進行步驟S27,併參圖4,將已使用之環狀連結體12與替換用之環狀支撐體13N相抵靠,也就是,使環狀連結體12之內延部122的內緣122A(切割面)與替換用之環狀支撐體13N之橫向部131的外緣131B相抵靠,可藉由夾治具來使兩者維持抵靠。Then proceed to step S27, and refer to Figure 4, the used annular connecting
最後進行步驟S29,併參圖5,以電子束EB於已使用之環狀連結體12與替換用之環狀支撐體13N之間形成電子束焊接層14,以使環狀連結體12與環狀支撐體13N相密封地接合。在兩者相密封地接合後,若電子束焊接層14有外露部分,則可選擇地將該外露部分加工研磨或拋光。Finally, step S29 is performed, and referring to FIG. 5 , the electron beam EB is used to form the electron
此外,較佳地,替換用之環狀支撐體13N之厚度可大於已使用之環狀連結體12之厚度,以增加環狀支撐體13N之結構強度,更為耐用。並且,於形成電子束焊接層14後,若有需要時,環狀支撐體13N可被進一步研磨以變薄,使得環狀支撐體13N之表面與環狀連結體12之表面能連續而無斷差。In addition, preferably, the thickness of the replacement
圖8所示的遮蔽結構之維修方法之流程圖亦能以遮蔽結構10’為例(如圖6所示)來進行,如下所述(相同或相似的部份將省略或簡化)。The flow chart of the method for repairing the shielding structure shown in Figure 8 can also be performed by taking the shielding structure 10' (shown in Figure 6) as an example, as described below (the same or similar parts will be omitted or simplified).
於步驟S23中,將已使用之環狀支撐體13及環狀連結體12從已使用之管狀遮蔽體11切割分離開。切割分離時,可沿著原本的管狀遮蔽體11之第一直立部111之下緣111B與環狀連結體12之第二直立部121之上緣121A之間的介面來為之。或可說,切割分離所致的管狀遮蔽體11的切割面及環狀連結體12之切割面即分別定義為下緣111B及上緣121A。可選地,切割所致的管狀遮蔽體11之第一直立部111的下緣111B可藉由磨平、銑平或車床加工等方式來使其變平坦。In step S23, the used
於步驟S25中,提供替換用之環狀支撐體13N及環狀連結體12N,兩者可為一體成形。此一體成形之環狀支撐體13N及環狀連結體12N係預先製作或準備好且尺寸及精度符合要求,且可為全新品或整新品。此外,環狀支撐體13N及環狀連結體12N能以不同材料製成,且其厚度可大於已使用之管狀遮蔽體11之厚度。In step S25, a replacement
於步驟S27,併參圖7,將已使用之管狀遮蔽體11與替換用之環狀連結體12N相抵靠,也就是,使管狀遮蔽體11之第一直立部111之下緣111B與環狀連結體12N之第二直立部121之上緣121A之間相抵靠。In step S27, and referring to Figure 7, the used
於步驟S29,續參圖7,以電子束EB於已使用之管狀遮蔽體11與替換用之環狀連結體12N之間形成電子束焊接層14,以使管狀遮蔽體11與環狀連結體12N相密封地接合。此外,環狀連結體12N及環狀支撐體13N可被進一步研磨以變薄,使得環狀連結體12N及環狀支撐體13N之表面與管狀遮蔽體11之表面能連續而無斷差。
In step S29, with continued reference to Figure 7, the electron beam EB is used to form the electron
經上述維修方法所得之遮蔽結構10、10’可如新品般具有符合規格之尺寸,但所費成本可低於新品之價格。維修者可選擇要替換遮蔽結構之何部分(例如僅環狀支撐體,或者,環狀連結體及環狀支撐體兩者)。此外,維修後之遮蔽結構使用數次後,可再次進行執行上述維修方法,以替換已使用過之環狀支撐體(或環狀連結體及環狀支撐體)。因此,相較於傳統之更換全新遮蔽結構之作法,將更為節省花費,此外,由於維修之成本相對地較便宜,半導體製造廠可考慮提高遮蔽結構之維修頻率,使遮蔽結構常保持較佳狀態。
The shielding
綜上所述,本新型所提供的遮蔽結構可使得遮蔽結構較容易地被製作及維修,降低使用者成本上的負擔,且對於製程之良率或產能亦有幫助。 To sum up, the shielding structure provided by the present invention can make the shielding structure easier to manufacture and maintain, reducing the user's cost burden, and is also helpful for the yield or production capacity of the process.
雖然本新型僅就上述所選擇的實施例來描繪,在沒有背離如隨附申請專利範圍所界定的本新型的範疇的情況下,有可能對本案進行各種改變、修改或替換,只要不實質地影響預期的操作或功能。因此,前述實施例說明僅作為例示性用途而不在於對本新型進行限制,本申請案所請求的範疇因就申請專利範圍及其均等物來界定。Although the present invention has been described only with respect to the selected embodiments above, various changes, modifications or substitutions are possible without departing from the scope of the invention as defined in the appended patent application, as long as they do not substantially Affects intended operation or functionality. Therefore, the foregoing embodiments are only for illustrative purposes and are not intended to limit the invention. The scope claimed in this application is defined by the patent scope and its equivalents.
10,10’:遮蔽結構 10,10’: shielding structure
10A:軸線 10A:Axis
11:管狀遮蔽體 11: Tubular shielding body
111:第一直立部 111:First upright part
111A:上緣 111A:Shangyuan
111B:下緣 111B: Lower edge
112:外延部 112:Extension Department
113:貫穿孔 113:Through hole
114:貫穿部 114: Penetration Department
12、12N:環狀連結體 12. 12N: cyclic connector
121:第二直立部 121:Second upright part
121A:上緣 121A: Upper edge
121B:下緣 121B: Lower edge
122:內延部 122: Inner extension
122A:內緣 122A:Inner edge
13,13N:環狀支撐體 13,13N: Annular support
131:橫向部 131: Transverse part
131A:內緣 131A:Inner edge
131B:外緣 131B:Outer edge
132:上延部 132:Shangyan Department
14:電子束焊接層 14: Electron beam welding layer
EB:電子束 EB: electron beam
20:物理氣相沈積裝置20:Physical vapor deposition device
21:腔室21: Chamber
22:基座22: base
23:蓋環23: cover ring
24:靶材24:Target
30:基板30:Substrate
[圖1]為根據本新型之較佳實施例之物理氣相沈積裝置之示意圖。 [Fig. 1] is a schematic diagram of a physical vapor deposition device according to a preferred embodiment of the present invention.
[圖2]為根據本新型之較佳實施例之用於物理氣相沈積之遮蔽結構之立體圖。 [Fig. 2] is a perspective view of a shielding structure for physical vapor deposition according to a preferred embodiment of the present invention.
[圖3]為圖2所示之遮蔽結構之前視圖。 [Fig. 3] is a front view of the shielding structure shown in Fig. 2.
[圖4]為圖2所示之遮蔽結構之剖視圖(分解狀態或切割示意)。 [Fig. 4] is a cross-sectional view of the shielding structure shown in Fig. 2 (in an exploded state or as a cutting diagram).
[圖5]為圖4所示之遮蔽結構被施加電子束之示意圖。 [Fig. 5] is a schematic diagram of an electron beam being applied to the shielding structure shown in Fig. 4.
[圖6]為根據本新型之另一較佳實施例之用於物理氣相沈積之遮蔽結構之剖視圖(分解狀態或切割示意)。 [Fig. 6] is a cross-sectional view (exploded state or cutting diagram) of a shielding structure for physical vapor deposition according to another preferred embodiment of the present invention.
[圖7]為圖6所示之遮蔽結構被施加電子束之示意圖。 [Fig. 7] is a schematic diagram showing an electron beam being applied to the shielding structure shown in Fig. 6.
[圖8]為根據本新型之較佳實施例之用於物理氣相沈積之遮蔽結構之維修方法之流程圖。 [Fig. 8] is a flow chart of a method for repairing a shielding structure for physical vapor deposition according to a preferred embodiment of the present invention.
10:遮蔽結構 10:Shading structure
10A:軸線 10A:Axis
11:管狀遮蔽體 11: Tubular shielding body
12:環狀連結體 12: cyclic connector
13,13N:環狀支撐體 13,13N: Annular support
14:電子束焊接層 14: Electron beam welding layer
111:第一直立部 111:First upright part
112:外延部 112:Extension Department
121:第二直立部 121:Second upright part
122:內延部 122: Inner extension
131:橫向部 131: Transverse part
132:上延部 132:Shangyan Department
EB:電子束 EB: electron beam
Claims (13)
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