TWM645165U - Improved Structure of Flexible Circuit Board - Google Patents
Improved Structure of Flexible Circuit Board Download PDFInfo
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- TWM645165U TWM645165U TW112205712U TW112205712U TWM645165U TW M645165 U TWM645165 U TW M645165U TW 112205712 U TW112205712 U TW 112205712U TW 112205712 U TW112205712 U TW 112205712U TW M645165 U TWM645165 U TW M645165U
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- 239000003973 paint Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
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- 230000037431 insertion Effects 0.000 description 1
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Abstract
本新型提供一種軟性電路板的改良結構,其包括一本體,該本體的前端設有一第一卡固部,且該第一卡固部之寬度方向的相對兩側分別設有一定位部,該等定位部具有靠近該第一卡固部的前端的一定位面,當該第一卡固部插設在一接頭內的正確位置時,該等定位部的該定位面將與該接頭的後表面齊平。透過在一般軟性電路板的卡固部兩側分別進一步設置一定位部,當此軟性電路板藉由該第一卡固部插入對應的接頭時,即可根據該等定位部的定位面與該接頭的後表面是否齊平,快速判斷該第一卡固部與該接頭的連接狀態,有效提升軟性電路板與接頭的裝配效率。The present invention provides an improved structure of a flexible circuit board, which includes a body. The front end of the body is provided with a first clamping part, and the opposite sides of the first clamping part in the width direction are respectively provided with a positioning part. The positioning part has a positioning surface close to the front end of the first clamping part. When the first clamping part is inserted into a correct position in a joint, the positioning surfaces of the positioning parts will be in contact with the rear surface of the joint. Flush. By further providing a positioning part on both sides of the clamping part of the general flexible circuit board, when the flexible circuit board is inserted into the corresponding connector through the first clamping part, the positioning surfaces of the positioning parts can be aligned with the Whether the rear surface of the connector is flush, the connection status of the first clamping part and the connector can be quickly determined, effectively improving the assembly efficiency of the flexible circuit board and the connector.
Description
本新型係關於一種軟性電路板,尤指一種軟性電路板的改良結構。The invention relates to a flexible circuit board, in particular to an improved structure of the flexible circuit board.
有一種習知的傳統軟性電路板(Flexible Printed Circuit,FPC),如圖10所示,該傳統軟性電路板包含一主體31,該主體31的前端設置有一卡固部32,該卡固部32的一面上間隔設置有複數個導電接墊33,當該卡固部32插設在一印刷電路板上的一接頭內時(圖中未示),該等導電接墊33將與該接頭中的複數個導電端子接觸而達到導通。此外,該卡固部32的相對兩側邊上分別設置有一矩形的凹部,當該卡固部32插設在該接頭內的正確位置時,該等凹部可與該接頭內的複數個凸部進行卡固,鎖定該卡固部32與該接頭的連接狀態。There is a known traditional flexible circuit board (Flexible Printed Circuit, FPC). As shown in Figure 10, the traditional flexible circuit board includes a
為了便於判斷該卡固部32是否插設在該接頭內的正確位置,傳統的判斷方式係透過在該主體31上印刷一條白漆線34作為判斷標準,當該卡固部32插入該接頭內時,若該主體31上的白漆線34與該接頭的邊緣之間具有間隙,表示該卡固部32與該接頭未連接到位;若該主體31上的白漆線34與該接頭的邊緣齊平時,該等凹部將與該接頭中的該等凸部進行卡固,係表示該卡固部32與該接頭連接到位。In order to facilitate the judgment of whether the
但是,過往判斷該主體31上的白漆線34是否與該接頭的邊緣齊平係透過人眼觀察,因此容易產生誤判,製造業者在進行組裝時,無法快速確認該卡固部32與該接頭是否連接到位,使判斷插入位置是否正確的工作時間延長。However, in the past, judging whether the
隨者科技進步,透過自動化設備(例如:影像辨識)可取代使用人眼進行判斷的方法,有效地減少人力成本並提升裝配效率。但是,由於在該主體31上印刷該白漆線34的製程精度仍然存在較大公差(±0.2至0.3mm)的問題,導致傳統軟性電路板無法滿足高精度對位公差(≦0.05mm)的產品需求,因此依舊時常產生誤判,對於裝配效率的提升仍然有限。With the advancement of technology, automated equipment (such as image recognition) can replace the use of human eyes for judgment, effectively reducing labor costs and improving assembly efficiency. However, because the process accuracy of printing the
因此,如何提供一種解決上述裝配效率受限的方案,確實是有需要提出較佳解決方案的必要性。Therefore, how to provide a solution to the above-mentioned limited assembly efficiency is indeed necessary to propose a better solution.
有鑑於上述現有技術的不足,本新型的主要目的在於提供一種軟性電路板的改良結構,其謹改良基礎元件,就能有效解決上述裝配效率受限的問題。In view of the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide an improved structure of a flexible circuit board, which can effectively solve the above-mentioned problem of limited assembly efficiency by simply improving the basic components.
為達成上述目的,本新型所採取的主要技術手段係令前述軟性電路板的改良結構包括: 一本體,具有一前端與一後端; 一第一卡固部,係設在該本體的前端; 二個以上的定位部,係分設在該第一卡固部之寬度方向的相對兩側; 其中,該等定位部分別具有靠近該第一卡固部的前端的一定位面,當該第一卡固部插設在一接頭內的正確位置時,該等定位部的該定位面與該接頭的後表面齊平。 In order to achieve the above purpose, the main technical means adopted by this new model are that the improved structure of the aforementioned flexible circuit board includes: A body has a front end and a back end; A first clamping part is located at the front end of the body; Two or more positioning parts are provided on opposite sides of the first clamping part in the width direction; Wherein, each of the positioning parts has a positioning surface close to the front end of the first clamping part. When the first clamping part is inserted into a correct position in a joint, the positioning surfaces of the positioning parts are in contact with the front end of the first clamping part. The rear surface of the joint is flush.
本新型透過上述結構,在該第一卡固部之寬度方向的相對兩側分別設有該等定位部,使製造業者在進行組裝時,當該第一卡固部插入對應的該接頭時,即可根據該等定位部的定位面與該接頭的後表面是否齊平,快速判斷該第一卡固部與該接頭的連接狀態,從而取代現有技術中使用白漆線的工序,有效提升軟性電路板與接頭的裝配效率。Through the above structure, the present invention provides positioning parts on opposite sides of the first clamping part in the width direction, so that when the first clamping part is inserted into the corresponding connector during assembly, the manufacturer can The connection status of the first clamping part and the joint can be quickly determined based on whether the positioning surfaces of the positioning parts are flush with the rear surface of the joint, thereby replacing the process of using white paint lines in the prior art, and effectively improving the softness Assembly efficiency of circuit boards and connectors.
關於本新型的軟性電路板的改良結構之實施例,請同時參閱圖1及圖2,其包括一本體11、一第一卡固部12及兩個以上的定位部13,該本體11係呈板狀,並具有一前端與一後端,該本體11的前端設有該第一卡固部12,且該等定位部13係分別設在該第一卡固部12之寬度方向W的左右相對兩側,其中,該等定位部13分別具有靠近該第一卡固部12的前端的一定位面,當該第一卡固部12插設在一接頭21內的正確位置時,該等定位部13的定位面與該接頭21的後表面2111齊平。Regarding the embodiment of the improved structure of the new flexible circuit board, please refer to Figures 1 and 2 at the same time. It includes a
透過在該第一卡固部12之寬度方向W的左右相對兩側分別設有該等定位部13,使製造業者在進行組裝時,當該第一卡固部12插入對應的該接頭21時,即可根據該等定位部13的定位面與該接頭21的後表面2111是否齊平,快速判斷該第一卡固部12與該接頭21的連接狀態,從而取代現有技術中使用白漆線的工序,有效提升軟性電路板與該接頭21的裝配效率。By providing the positioning
在本實施例中,該第一卡固部12之寬度方向W的左右相對的兩側分別形成一卡固結構14,該等卡固結構14與該等定位部13相鄰,且相較於該等定位部13靠近該第一卡固部12的前端,該等卡固結構14係用以與該接頭21進行卡固。在本實施例中,該等卡固結構14可分別為一矩形的缺口、一矩形的凸部或多邊形等可以提升與該接頭21之卡固效果的形狀。In this embodiment, a
如圖2所示,在本實施例中,該第一卡固部12的上表面及/或下表面設置有複數個導電接墊15,該等導電接墊15鄰近該第一卡固部12的前端,該等導電接墊15間隔設置。As shown in FIG. 2 , in this embodiment, a plurality of
請同時參閱圖1至圖4,在本實施例中,該接頭21包括一定位組件211及一連接組件212,該定位組件211設置在該連接組件212上,該定位組件211及該連接組件212之間形成一插槽213(如圖1及圖2所示),該插槽213的開口靠近該第一卡固部12的前端,該第一卡固部12透過該插槽213的開口插設在該插槽213內。該連接組件212設置有複數個導電端子16(如圖4所示),該接頭21透過該連接組件212的該等導電端子16與一印刷電路板(Printed circuit board,PCB)(圖中未示)連接,使軟性電路板藉由該接頭21與該印刷電路板連接。Please refer to Figures 1 to 4 at the same time. In this embodiment, the
請參閱圖5,在本實施例中,該連接組件212設有複數個第二卡固部214,該等第二卡固部214的形狀對應於該等卡固結構14的形狀,該等第二卡固部214分別呈一凸塊結構,該等第二卡固部214係用於與該第一卡固部12的該等卡固結構14進行卡固;該連接組件212的該等導電端子16的設置位置對應於該第一卡固部12的該等導電接墊15,在本實施例中,該等導電端子16間隔設置。Please refer to FIG. 5 . In this embodiment, the connecting
請同時參閱圖1、圖3及圖4,在本實施例中,該接頭21的該定位組件211具有該後表面2111,該後表面2111靠近該第一卡固部12的前端。軟性電路板的該等定位部13與該第一卡固部12為一體成形,且該等定位部13分別呈一矩形的凸出結構。該等定位部13分別具有靠近該第一卡固部12的前端的一定位面(第一定位面131),當該第一卡固部12透過該插槽213的開口插設在該插槽213內時,即可根據該等定位部13的定位面(第一定位面131)與該定位組件211的後表面2111是否齊平,作為判斷該第一卡固部12與該接頭21的連接狀態的標準。若軟性電路板的該等定位部13的定位面(第一定位面131)與該接頭21的該定位組件211的後表面2111齊平,軟性電路板的該第一卡固部12的該等卡固結構14將與該接頭21的該連接組件212的該等第二卡固部214進行卡固,以鎖定該第一卡固部12與該接頭21的連接狀態,且該第一卡固部12的該等導電接墊15則與該連接組件212的該等導電端子16接觸而達到導通,以表示該第一卡固部12插設在該接頭21內的正確位置。Please refer to FIGS. 1 , 3 and 4 at the same time. In this embodiment, the
此外,請同時參閱圖1及圖5,軟性電路板的該等定位部13的定位面(第一定位面131)與該第一卡固部12的前端之間具有一對位深度(第一對位深度D1),該對位深度(第一對位深度D1)對應該接頭21的該插槽213的深度,使該等定位部13的定位面(第一定位面131)與該定位組件211的後表面2111齊平時,該第一卡固部12的前端與該插槽213抵觸。在本實施例中,由於該等定位部13係藉由直接對該第一卡固部12進行外型裁切所形成,相比於現有技術中印刷白漆線的製程精度,該等定位部13具有較高的製程精度,使該第一卡固部12在插入該接頭21的插槽213時能滿足高精度的定位需求。製造業者在進行組裝時,僅需判斷該等定位部13的定位面(第一定位面131)是否齊平該定位組件211的後表面2111,即可快速確認該第一卡固部12與該接頭21的連接狀態,有效提升軟性電路板與該接頭21的裝配效率。In addition, please refer to Figures 1 and 5 at the same time. There is a positioning depth (first positioning surface 131) between the positioning surfaces (first positioning surfaces 131) of the
請同時參閱圖6至圖9,在本新型另一實施例中,軟性電路板的該等定位部13與該第一卡固部12為一體成形,且該等定位部13分別呈一矩形的凹陷結構。該等定位部13分別具有靠近該第一卡固部12的前端的一定位面(第二定位面132),當該第一卡固部12透過該插槽213的開口插設在該插槽213內時,即可根據該等定位部13的定位面(第二定位面132)與該定位組件211的後表面2111是否齊平,作為判斷該第一卡固部12與該接頭21的連接狀態的標準。若軟性電路板的該等定位部13的定位面(第二定位面132)與該接頭21的該定位組件211的後表面2111齊平(如圖8所示),軟性電路板的該第一卡固部12的該等卡固結構14將與該接頭21的該連接組件212的該等第二卡固部214進行卡固,以鎖定該第一卡固部12與該接頭21的連接狀態,且該第一卡固部12的該等導電接墊15則與該連接組件212的該等導電端子16接觸而達到導通,以表示該第一卡固部12插設在該接頭21內的正確位置。Please refer to FIGS. 6 to 9 at the same time. In another embodiment of the present invention, the
此外,請同時參閱圖6及圖9,軟性電路板的該等定位部13的定位面(第二定位面132)與該第一卡固部12的前端之間具有一對位深度(第二對位深度D2),該對位深度(第二對位深度D2)對應該接頭21的該插槽213的深度,使該等定位部13的定位面(第二定位面132)與該定位組件211的後表面2111齊平時,該第一卡固部12的前端與該插槽213抵觸。在本實施例中,由於該等定位部13係藉由直接對該第一卡固部12進行外型裁切所形成,相比於現有技術中印刷白漆線的製程精度,該等定位部13具有較高的製程精度,使該第一卡固部12在插入該接頭21的插槽213能滿足高精度的定位需求。製造業者在進行組裝時,僅需判斷該等定位部13的定位面(第二定位面132)是否齊平於該定位組件211的後表面2111,即可快速確認該第一卡固部12與該接頭21的連接狀態,有效提升軟性電路板與該接頭21的裝配效率。In addition, please refer to Figure 6 and Figure 9 at the same time. There is a positioning depth (second positioning surface 132) between the positioning surfaces (second positioning surfaces 132) of the
11:本體 12:第一卡固部 13:定位部 131:第一定位面 132:第二定位面 14:卡固結構 15:導電接墊 16:導電端子 21:接頭 211:定位組件 2111:後表面 212:連接組件 213:插槽 214:第二卡固部 31:主體 32:卡固部 33:導電接墊 34:白漆線 W:寬度方向 D1:第一對位深度 D2:第二對位深度 11:Ontology 12: The first fastening part 13: Positioning Department 131: First positioning surface 132: Second positioning surface 14: Clamping structure 15:Conductive pad 16:Conductive terminal 21:Connector 211: Positioning component 2111:Rear surface 212:Connection components 213:Slot 214: The second fastening part 31:Subject 32: Clamping part 33:Conductive pad 34:White paint line W: Width direction D1: First matchup depth D2: Second matchup depth
圖1係本新型一實施例軟性電路板的改良結構的第一立體圖; 圖2係本新型一實施例軟性電路板的改良結構的第二立體圖; 圖3係本新型一實施例軟性電路板的改良結構的側視圖; 圖4係本新型一實施例軟性電路板的改良結構的俯視圖; 圖5係本新型一實施例圖3的A-A’剖面圖; 圖6係本新型另一實施例軟性電路板的改良結構的立體圖; 圖7係本新型另一實施例軟性電路板的改良結構的側視圖; 圖8係本新型另一實施例軟性電路板的改良結構的俯視圖; 圖9係本新型另一實施例圖7的B-B’剖面圖;以及 圖10係現有技術中傳統軟性電路板的俯視圖。 Figure 1 is a first perspective view of an improved structure of a flexible circuit board according to an embodiment of the present invention; Figure 2 is a second perspective view of the improved structure of a flexible circuit board according to an embodiment of the present invention; Figure 3 is a side view of the improved structure of a flexible circuit board according to an embodiment of the present invention; Figure 4 is a top view of the improved structure of the flexible circuit board according to one embodiment of the present invention; Figure 5 is a cross-sectional view of A-A' in Figure 3 according to an embodiment of the present invention; Figure 6 is a perspective view of an improved structure of a flexible circuit board according to another embodiment of the present invention; Figure 7 is a side view of an improved structure of a flexible circuit board according to another embodiment of the present invention; Figure 8 is a top view of the improved structure of a flexible circuit board according to another embodiment of the present invention; Figure 9 is a B-B’ cross-sectional view of Figure 7 according to another embodiment of the present invention; and Figure 10 is a top view of a traditional flexible circuit board in the prior art.
11:本體 11:Ontology
12:第一卡固部 12: The first fastening part
13:定位部 13: Positioning Department
131:第一定位面 131: First positioning surface
14:卡固結構 14: Clamping structure
21:接頭 21:Connector
211:定位組件 211: Positioning component
2111:後表面 2111:Rear surface
212:連接組件 212:Connection components
213:插槽 213:Slot
W:寬度方向 W: Width direction
D1:第一對位深度 D1: First matchup depth
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TW112205712U TWM645165U (en) | 2023-06-06 | 2023-06-06 | Improved Structure of Flexible Circuit Board |
CN202321992473.5U CN220628294U (en) | 2023-06-06 | 2023-07-27 | Improved structure of flexible circuit board |
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TW112205712U TWM645165U (en) | 2023-06-06 | 2023-06-06 | Improved Structure of Flexible Circuit Board |
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