TWM644176U - Touch pad module and computer using the same - Google Patents

Abstract

The present utility model discloses a touchpad module including a substrate, a touch plate assembly and at least one pressure sensing module. The touch plate assembly is disposed above the substrate, and the touch plate assembly includes a touch plate and a touch sensing circuit board. The pressure sensing module is disposed between the substrate and the touch plate assembly. The pressure sensing module includes a pressure sensing element and a micro support board. The pressure sensing element is disposed on the micro support board, and the pressure sensing element is electrically connected to the touch sensing circuit board through the micro support board. When the touch plate assembly is pressed by an external force, the pressure sensing module senses the touch force exerted on the touch plate assembly and outputs a pressure sensing signal.

Description

Touch panel module and electronic computer with touch panel module

The invention relates to the field of an input device, in particular to an input device with a touch function.

With the rapid development of science and technology, the vigorous development of electronic equipment has brought a lot of convenience to human life, so how to make the operation of electronic equipment more humanized is an important issue. For example, common electronic devices in daily life are notebook computers, mobile phones, satellite navigation devices, etc. Due to the dramatic increase in storage capacity and processor computing performance of these electronic devices, their functions have become increasingly powerful and complex. In order to efficiently operate these electronic devices, manufacturers of electronic devices use touchpads as input devices to control these electronic devices. For example, users can touch the touchpad with their fingers and slide on the touchpad to move the screen. The cursor on the touchpad can also make the electronic device perform specific functions by pressing the touchpad. Therefore, the touchpad can replace the function of the mouse, so that the user does not need to carry or install the mouse to cause inconvenience .

Furthermore, more and more touchpads have pressure sensors. When the user touches the touchpad, the pressure sensor senses the touch pressure applied by the user on the touchpad and outputs a pressure sensing signal. , and the pressure sensor output by the pressure sensor is transmitted to the The main circuit board of the touch panel, the main circuit board transmits the pressure sensing signal to the electronic device, and then makes the touch panel control the electronic device to perform corresponding functions according to the pressure sensing signal.

However, in the production process of the conventional touch panel, the production step of assembling the pressure sensor on the flexible circuit board (FPC) needs to be completed by the manufacturer, and then the manufacturer transports the assembled finished product to the factory for further processing. Assembling the touch panel, but during the transportation process, the pressure sensor is often damaged due to collision, which leads to a decline in the yield of the final assembled touch panel, and because it is impossible to complete all the production processes in the factory , so that the overall production process steps are complicated and the production cost is greatly increased.

Therefore, how to improve the above-mentioned problems is actually the focus of attention of relevant people in the field.

One of the purposes of this invention is to provide a touch panel module, which has a simple structural design and is easy to assemble, thereby simplifying the production process and greatly reducing the production cost.

Other purposes and advantages of this creation can be further understood from the technical characteristics disclosed in this creation.

In order to achieve one or part or all of the above purposes or other purposes, this invention provides a touch panel module, which is applied to an electronic computer, and the touch panel module is configured in the frame of the electronic computer. The touch panel module includes a substrate, a touch panel assembly and at least one pressure sensing module. The touch panel assembly is disposed above the substrate. The touch panel assembly includes a touch panel and a touch sensing circuit board. The pressure sensing module is disposed between the substrate and the touch panel assembly. The pressure sensing module includes a pressure sensing element and a micro load board. The pressure sensing element is arranged on the micro-carrier body, and the pressure-sensing element is electrically connected to the touch sensing circuit via the micro-carrier body. road board. When the touch panel assembly is pressed by an external force, the pressure sensing module is used to sense the touch force applied to the touch panel assembly and then output a pressure sensing signal.

In an embodiment of the present invention, the above-mentioned pressure sensing module is disposed on the touch sensing circuit board of the touch panel assembly, and the micro carrier body is located between the touch sensing circuit board and the pressure sensing element, When the touch panel assembly is pressed by an external force, the touch panel assembly is deformed and has a deformation amount. The pressure sensing module senses the touch force applied to the touch panel assembly according to the deformation amount and then outputs a pressure sensing signal.

In an embodiment of the present invention, the above-mentioned pressure-sensing module is arranged on the substrate, and the micro-carrier body is located between the pressure-sensing element and the substrate. The substrate is deformed to have a deformation amount, and the pressure sensing module senses the touch force exerted on the touch plate assembly according to the deformation amount, and then outputs a pressure sensing signal.

In an embodiment of the present invention, the above-mentioned touch panel module further includes at least one cantilever structure. The cantilever structure is arranged between the substrate and the touch panel assembly, and the pressure sensing module is arranged on the cantilever structure. When the touch panel assembly is pressed by an external force, the touch panel assembly squeezes the cantilever structure, causing the cantilever structure to deform and have a deformation amount , the pressure sensing module senses the touch force exerted on the touch plate assembly according to the deformation amount and then outputs a pressure sensing signal.

In an embodiment of the present invention, the above-mentioned cantilever structure includes a first connection part, a second connection part and an elastic plate body part. The elastic plate body is connected between the first connection portion and the second connection portion, the first connection portion is connected to the touch panel assembly, the second connection portion is connected to the substrate, and the pressure sensing module is disposed on the elastic plate body.

In an embodiment of the present invention, there are multiple cantilever structures, and these cantilever structures include a first cantilever structure and a second cantilever structure, and the elastic plate body of the first cantilever structure includes a first surface and a The second surface, the elastic plate of the second cantilever structure The body includes a third surface and a fourth surface opposite to each other, and the second surface is opposite to the fourth surface.

In an embodiment of the present invention, there are multiple pressure sensing modules, and these pressure sensing modules include a first pressure sensing module and a second pressure sensing module, the first pressure sensing The module is arranged on the first surface of the elastic plate body of the first cantilever structure, and the second pressure sensing module is arranged on the third surface of the elastic plate body of the second cantilever structure.

In an embodiment of the present invention, there are multiple pressure sensing modules, and these pressure sensing modules include a first pressure sensing module and a second pressure sensing module, the first pressure sensing The module is arranged on the second surface of the elastic plate body of the first cantilever structure, and the second pressure sensing module is arranged on the fourth surface of the elastic plate body of the second cantilever structure.

In an embodiment of the present invention, the above-mentioned touch panel module further includes an electrical connector, and the micro carrier body of the pressure sensing module is electrically connected to the touch sensing circuit of the touch panel assembly through the electrical connector. plate.

The invention additionally provides an electronic computer, including a casing, a processor and a touch panel module. The housing has an inwardly recessed frame. The processor is configured in the casing. The touch panel module is arranged in the frame and electrically connected with the processor. The touch panel module includes a substrate, a touch panel assembly and at least one pressure sensing module. The touch panel assembly is disposed above the substrate. The touch panel assembly includes a touch panel and a touch sensing circuit board. The pressure sensing module is disposed between the substrate and the touch panel assembly. The pressure sensing module includes a pressure sensing element and a micro load board. The pressure sensing element is arranged on the micro-carrier body, and the pressure-sensing element is electrically connected to the touch sensing circuit board through the micro-carrier body. When the touch panel assembly is pressed by an external force, the pressure sensing module is used to sense the touch force applied to the touch panel assembly and then output a pressure sensing signal.

In the touch panel module of the present invention, the pressure sensing element is directly arranged on the micro-carrier body to form a pressure sensing module, which replaces the step of arranging the pressure sensing element on the flexible circuit board in the prior art. Simplify the structural design of the touch panel module. In addition, the pressure sensing module of the present invention can be applied to the production process of touch panel modules of different sizes, and only the pressure sensing module needs to be arranged at the corresponding position, such as the touch sensing circuit board of the touch panel assembly. , substrate or cantilever structure. The structure design of the touch panel module in this creative embodiment is simple and easy to assemble, and the whole production process can be directly produced at the factory, thereby simplifying the production process and greatly reducing the production cost.

In order to make the above and other purposes, features and advantages of the invention more comprehensible, preferred embodiments are specifically cited below, together with the attached drawings, and described in detail as follows.

1: Computer

2, 2a, 2b, 2c: touch panel module

11: shell

12: screen

13: Cursor

14: frame

15: Processor

20: Substrate

21: Touch plate assembly

22:Pressure sensing module

23: Cantilever structure

211: Touchpad

212: Touch sensing circuit board

221: Pressure sensing element

222: miniature bearing plate body

231: The first connecting part

232: the second connecting part

233: Elastic plate body

F1: first surface

F2: second surface

F3: third surface

F4: fourth surface

AR1: The first cantilever structure

AR2: Second cantilever structure

PS1: The first pressure sensing module

PS2: The second pressure sensing module

FIG. 1 is a schematic diagram of the appearance structure of an electronic computer and its touch panel module described in an embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view of the structure of the touch panel module shown in FIG. 1 .

FIG. 3 is a schematic cross-sectional view of a touch panel module according to another embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view of a touch panel module according to another embodiment of the present invention.

FIG. 5 is a schematic cross-sectional view of a touch panel module according to another embodiment of the present invention.

Please refer to FIG. 1 , which is a schematic diagram of an appearance structure of an electronic computer and its touch panel module described in an embodiment of the present invention. The electronic computer 1 is, for example, a notebook computer, but not limited thereto, and includes a casing 11, a screen 12, a processor 15 and a touch panel module 2, and The processor 15 is arranged in the casing 11 and is used to process the electronic signals of the electronic computer 1, and the casing 11 has a frame 14 sunken inward; wherein, the touch panel module 2 can be configured in the frame 14 and electrically connected to the processor 15. connected, and at least part of the touchpad module 2 is exposed outside for the user to touch and operate the computer 1, for example, the user can touch the touchpad module 2 with a finger Slide the module 2 to move the cursor 13 on the screen 12 , and the electronic computer 1 can execute specific functions by pressing the touch panel module 2 .

Further description will be given below for other detailed structures of the touch panel module 2 of the present invention.

Please refer to FIG. 2 , which is a schematic cross-sectional view of the structure of the touch panel module shown in FIG. 1 . As shown in FIG. 2 , the touch panel module 2 of this embodiment includes a substrate 20 , a touch panel assembly 21 and at least one pressure sensing module 22 . The touch panel assembly 21 is disposed above the substrate 20 , and the touch panel assembly 21 includes a touch panel 211 and a touch sensing circuit board 212 . The pressure sensing module 22 is disposed between the substrate 20 and the touch panel assembly 21 . The pressure sensing module 22 includes a pressure sensing element 221 and a micro load board body 222 . The pressure sensing element 221 is disposed on the micro carrier body 222 , and the pressure sensing element 221 is electrically connected to the touch sensing circuit board 212 of the touch panel assembly 21 through the micro carrier body 222 . In this embodiment, when the touch pad assembly 21 is pressed by an external force, the pressure sensing module 22 is used to sense the touch pressure applied to the touch pad assembly 21 and then output a pressure sensing signal.

As shown in FIG. 2 , the pressure sensing module 22 of this embodiment is disposed on the touch sensing circuit board 212 of the touch panel assembly 21 , and the micro carrier board 222 of the pressure sensing module 22 is located on the pressure sensing element 221 between the touch sensing circuit board 212 . When the touch pad assembly 21 is pressed by an external force, the touch pad assembly 21 is deformed and has a deformation amount. At this time, the pressure sensing element 221 senses the pressure applied to the touch pad assembly 21 according to the deformation amount of the touch pad assembly 21. Touch pressure, and then output pressure sensing signal.

For example, the touch panel assembly 21 of this embodiment can be supported on the frame 14 of the electronic computer 1 (as shown in FIG. When pressing, the touch panel assembly 21 is dented downward with the supporting point between the peripheral end of the touch panel 211 and the frame 14 as a fulcrum, and has a deformation amount. The amount of deformation generated by the depression is used to sense the touch force applied to the touch plate assembly 21 and output a pressure sensing signal. It should be noted that the above-mentioned structural design in which the touch panel assembly 21 is recessed and deformed by the peripheral end of the touch panel 211 abutting against the frame 14 of the computer 1 is only one of the embodiments of the present invention. On the premise that the touch panel assembly 21 can be deformed after being pressed, the present invention does not limit the structural design of the touch panel module 2 .

It should be noted that the micro-carrier body 222 of the pressure sensing module 22 of this embodiment is electrically connected to the touch sensing circuit board 212 of the touch panel assembly 21 through an electrical connector (not shown). . In this embodiment, the electrical connector is, for example, a flexible flat cable connector (Flexible Flat Cable) or a flexible flat cable is soldered to the micro-carrier body 222 by means of hot bar welding. This invention creates and limits the appearance of the electrical connector.

It should be noted that, in this embodiment, the material of the touch panel 211 is, for example, glass, but the present invention is not limited thereto, and the material of the touch panel 211 can be replaced with the required one according to the needs of the actual situation. material. In this embodiment, the touch sensing circuit board 212 is bonded to the touch panel 211 by, for example, pressure sensitive adhesive (PSA), but the present invention is not limited thereto. In this embodiment, the substrate 20 is made of metal material, but this invention is not limited thereto. In this embodiment, the number of pressure sensing modules 22 is, for example, two, but this invention does not To limit the number of pressure sensing modules 22 The number of pressure sensing modules 22 can be increased to more than two according to actual needs.

Please refer to FIG. 3 , which is a schematic cross-sectional view of a touch panel module according to another embodiment of the present invention. As shown in Figure 3, the touch panel module 2a of this embodiment is similar to the touch panel module 2 shown in Figure 2, the difference lies in the pressure sensing module of the touch panel module 2a of this embodiment 22 is disposed on the substrate 20 .

As shown in FIG. 3 , the pressure sensing module 22 of this embodiment is disposed on the substrate 20 , and the micro-carrier board 222 of the pressure sensing module 22 is located between the pressure sensing element 221 and the substrate 20 . When the touch pad assembly 21 is pressed by an external force, the touch pad assembly 21 drives the substrate 20 to deform and have a deformation amount. At this time, the pressure sensing element 221 senses the force exerted on the touch pad assembly 21 according to the deformation amount of the substrate 20 The touch pressure, and then output the pressure sensing signal.

For example, the touch panel module 2a of this embodiment fixes the peripheral end of the substrate 20 on the frame 14 of the electronic computer 1 (as shown in FIG. 1 ), and between the touch panel assembly 21 and the substrate 20 A plurality of support elements (not shown) are configured. When the touch panel assembly 21 is pressed by an external force, the touch panel assembly 21 moves toward the direction close to the substrate 20, and at the same time drives these support elements to press the substrate 20, so that the substrate 20 The downward recess has a deformation amount. At this time, the pressure sensing module 22 senses the touch force applied on the touch panel assembly 21 according to the deformation amount generated by the downward recess of the substrate 20 and outputs a pressure sensing signal. It should be noted that the above-mentioned structural design of the base plate 20 being recessed and deformed by fixing the peripheral end of the base plate 20 on the frame 14 of the computer 1 is only one of the implementations of the present invention. In the touch panel assembly Under the premise that the substrate 20 can be deformed after being touched, the invention does not limit the structural design of the touch panel module 2 .

Please refer to FIG. 4 , which is a schematic cross-sectional view of the structure of the touch panel module described in another embodiment of the present invention. As shown in Figure 4, the touch panel module 2b of this embodiment is similar to the touch panel module 2 shown in Figure 2, the difference is that the touch panel module 2b of this embodiment further includes at least one cantilever structure 23 , and the pressure sensing module 22 is disposed on the cantilever structure 23 .

As shown in FIG. 4 , the cantilever structure 23 of this embodiment is disposed between the touch plate assembly 21 and the substrate 20 , and the miniature carrier body 222 of the pressure sensing module 22 is located between the pressure sensing element 221 and the cantilever structure 23 . When the touch pad assembly 21 is pressed by an external force, the touch pad assembly 21 presses the cantilever structure 23, causing the cantilever structure 23 to deform and have a deformation amount. At this time, the pressure sensing element 221 senses the The touch force applied to the touch plate assembly 21 is output, and then the pressure sensing signal is output.

As shown in FIG. 4 , the cantilever structure 23 of this embodiment includes a first connecting portion 231 , a second connecting portion 232 and an elastic plate body portion 233 . The elastic plate body 233 of the cantilever structure 23 is connected between the first connecting portion 231 and the second connecting portion 232 , and the first connecting portion 231 is connected to the touch panel assembly 21 , and the second connecting portion 232 is connected to the substrate 20 . In this embodiment, the pressure sensing module 22 is disposed on the elastic board 233 of the cantilever structure 23 .

As shown in FIG. 4 , there are multiple cantilever structures 23 in this embodiment, and these cantilever structures 23 include a first cantilever structure AR1 and a second cantilever structure AR2 . The elastic plate body portion 233 of the first cantilever structure AR1 and the elastic plate body portion 233 of the second cantilever structure AR2 are inclined away from each other, and the elastic plate body portion 233 of the first cantilever structure AR1 includes a first surface F1 opposite to each other. With the second surface F2, the elastic plate body portion 233 of the second cantilever structure AR2 includes a third surface F3 and a fourth surface F4 opposite to each other, and the second surface F2 of the first cantilever structure AR1 is opposite to that of the second cantilever structure AR2. Fourth surface F4.

As shown in FIG. 4 , there are multiple pressure sensing modules 22 in this embodiment, and these pressure sensing modules 22 include a first pressure sensing module PS1 and a second pressure sensing module PS2. In this embodiment, the first pressure sensing module PS1 is disposed on the second surface F2 of the first cantilever structure AR1 , and the second pressure sensing module PS2 is disposed on the fourth surface F4 of the second cantilever structure AR2 .

It should be noted that the above-mentioned cantilever structures 23 including the first cantilever structure AR1 and the second cantilever structure AR2 together with the first pressure sensing module PS1 and the second pressure sensing module PS2 are only one of the implementations of this invention. In this way, the present invention does not limit the number of cantilever structures 23 and the number of pressure sensing modules 22 , and the number of cantilever structures 23 and the number of pressure sensing modules 22 can be increased or decreased according to actual needs.

Please refer to FIG. 5 , which is a schematic cross-sectional view of the structure of the touch panel module described in another embodiment of the present invention. As shown in FIG. 5, the touch panel module 2c of this embodiment is similar to the touch panel module 2b shown in FIG. The elastic board parts 233 of the second cantilever structure AR2 are inclined towards each other, and the first pressure sensing module PS1 is disposed on the first surface F1 of the first cantilever structure AR1, and the second pressure sensing module PS2 is disposed on the first surface F1 of the first cantilever structure AR1. The third surface F3 of the second cantilever structure AR2.

To sum up, in the touch panel module of the present invention, the pressure sensing element is directly arranged on the micro-carrier body to form a pressure sensing module, which replaces the prior art where the pressure sensing element is arranged on the flexible circuit The steps on the board simplify the structural design of the touchpad module. In addition, the pressure sensing module of the present invention can be applied to the production process of touch panel modules of different sizes, and only the pressure sensing module needs to be arranged at the corresponding position, such as the touch sensing circuit board of the touch panel assembly. , substrate or cantilever structure. The structure design of the touch panel module in this creative embodiment is simple and easy to assemble, and the whole production process can be directly produced at the factory, thereby simplifying the production process and greatly reducing the production cost.

But the above-mentioned ones are only preferred embodiments of this creation, and should not limit the scope of implementation of this creation. The simple equivalent changes and modifications made by the content still belong to the scope covered by the patent for the present invention. In addition, any embodiment or patent scope of this creation does not need to achieve all the purposes or advantages or characteristics disclosed in this creation. In addition, the abstract part and the title are only used to assist in the search of patent documents, and are not used to limit the patent scope of this creation. In addition, terms such as "first" and "second" mentioned in this specification or the scope of the patent application are only used to name elements (elements) or to distinguish different embodiments or ranges, and are not used to limit the number of elements. upper or lower limit.

2: Touchpad module

20: Substrate

21: Touch plate assembly

22:Pressure sensing module

211: Touchpad

212: Touch sensing circuit board

221: Pressure sensing element

222: miniature bearing plate body

Claims (10)

A touch panel module is applied to an electronic computer, the touch panel module is configured in a frame of the electronic computer, and the touch panel module includes: a substrate; A touch panel assembly, configured above the substrate, the touch panel assembly includes a touch panel and a touch sensing circuit board; and At least one pressure sensing module is arranged between the base plate and the touch plate assembly, the at least one pressure sensing module includes a pressure sensing element and a micro carrier board body, the pressure sensing element is arranged on the micro on the carrier board body, and the pressure sensing element is electrically connected to the touch sensing circuit board through the micro carrier board body; Wherein, when the touch panel assembly is pressed by an external force, the at least one pressure sensing module is used to sense the touch force exerted on the touch panel assembly and then output a pressure sensing signal. The touch panel module as described in claim 1, wherein the at least one pressure sensing module is configured on the touch sensing circuit board of the touch panel assembly, and the micro-carrier body is located on the touch sensing circuit board Between the circuit board and the pressure sensing element, when the touch panel assembly is pressed by an external force, the touch panel assembly is deformed and has a deformation amount, and the at least one pressure sensing module senses a value according to the deformation amount. The touch force exerted on the touch plate assembly and then output the pressure sensing signal. The touch panel module according to claim 1, wherein the at least one pressure sensing module is disposed on the substrate, and the micro-carrier body is located between the pressure sensing element and the substrate, when the touch panel When the component is touched by an external force, the touch plate component drives the substrate to deform to have a deformation amount, and the at least one pressure sensing module senses the touch force applied to the touch plate assembly according to the deformation amount, and then Output the pressure sensing signal. The touch panel module according to claim 1, further comprising at least one cantilever structure, the at least one cantilever structure is arranged between the substrate and the touch panel assembly, and the at least one pressure sensing module is arranged on the at least one On the cantilever structure, when the touch panel assembly is pressed by an external force, the touch panel assembly presses the at least one cantilever structure, so that the at least one cantilever structure is deformed to have a deformation amount, and the at least one pressure sensing module according to The deformation senses the touch force exerted on the touch plate assembly and then outputs the pressure sensing signal. The touch panel module as claimed in item 4, wherein the at least one cantilever structure includes a first connection part, a second connection part and an elastic plate body part, and the elastic plate body part is connected to the first connection part Between the second connecting portion, the first connecting portion is connected to the touch panel assembly, the second connecting portion is connected to the substrate, and the at least one pressure sensing module is disposed on the elastic plate body. The touch panel module as described in claim 5, wherein the number of the at least one cantilever structure is multiple, and the cantilever structures include a first cantilever structure and a second cantilever structure, and the elasticity of the first cantilever structure The plate body portion includes a first surface and a second surface opposite to each other, the elastic plate body portion of the second cantilever structure includes a third surface and a fourth surface opposite to each other, and the second surface is opposite to the fourth surface. The touch panel module as described in claim 6, wherein the number of the at least one pressure sensing module is multiple, and the pressure sensing modules include a first pressure sensing module and a second pressure sensing module A measuring module, the first pressure sensing module is arranged on the first surface of the elastic plate body of the first cantilever structure, and the second pressure sensing module is arranged on the elastic plate of the second cantilever structure The third surface of the body. The touch panel module as described in claim 6, wherein the number of the at least one pressure sensing module is multiple, and the pressure sensing modules include a first pressure sensing module and a second pressure sensing module A measuring module, the first pressure sensing module is arranged on the second surface of the elastic plate body of the first cantilever structure, and the second pressure sensing module is arranged on the elastic plate of the second cantilever structure The fourth surface of the body. The touch panel module as described in claim 1 further includes an electrical connector, and the micro-carrier body of the at least one pressure sensing module is electrically connected to the touch panel assembly through the electrical connector. Touch sensing circuit board. An electronic computer comprising: a shell with a frame sunken inward; a processor configured in the housing; and A touch panel module, configured in the frame and electrically connected to the processor, the touch panel module includes: a substrate; A touch panel assembly, configured above the substrate, the touch panel assembly includes a touch panel and a touch sensing circuit board; and At least one pressure sensing module is arranged between the base plate and the touch plate assembly, the at least one pressure sensing module includes a pressure sensing element and a micro carrier board body, the pressure sensing element is arranged on the micro on the carrier board body, and the pressure sensing element is electrically connected to the touch sensing circuit board through the micro carrier board body; Wherein, when the touch panel assembly is pressed by an external force, the at least one pressure sensing module is used to sense the touch force exerted on the touch panel assembly and then output a pressure sensing signal.